CN105763165A - Quartz oscillator vacuum sputtering coating device - Google Patents
Quartz oscillator vacuum sputtering coating device Download PDFInfo
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- CN105763165A CN105763165A CN201410804202.1A CN201410804202A CN105763165A CN 105763165 A CN105763165 A CN 105763165A CN 201410804202 A CN201410804202 A CN 201410804202A CN 105763165 A CN105763165 A CN 105763165A
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- mask plate
- sputtering
- quartz oscillator
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Abstract
The invention relates to a quartz oscillator vacuum sputtering coating device. The quartz oscillator vacuum sputtering coating device comprises a bottom plate, a sputtering clamp and a plurality of mask plates; the sputtering clamp is installed on the bottom; the sputtering clamp includes unilateral clamping slots and a bilateral clamping slot; the bilateral clamping slot is arranged between the two unilateral clamping slots; two mask plates are embedded between the bilateral clamping slot and the two unilateral clamping slots; each mask plates comprise an upper frame, a lower frame, an upper mask plate and a lower mask plate, wherein the upper mask plate is fixed by the upper frame, and the lower mask plate is fixed by the lower frame; and quartz wafers are arranged between the upper mask plate and the lower mask plate. According to the quartz oscillator vacuum sputtering coating device of the invention, the two mask plates are inserted for sputtering, and the thickness of a film obtained by adopting film coating performed on the same mask plate can be more uniform, and a material utilization rate can be improved, production cost can be reduced, and the quartz oscillator vacuum sputtering coating device has a popularization value.
Description
Technical field
The present invention relates to a kind of quartz oscillator coating apparatus, particularly relate to a kind of quartz oscillator vacuum sputtering coating device.
Background technology
Quartz oscillator is the agitator of a kind of high accuracy and high stability, it is widely used in all kinds of oscillating circuits such as colour TV, computer, remote controller, and in a communications system for frequency generator, produce clock signal for data handling equipment and particular system provides reference signal.
In recent years, highly integrated, multifunction along with the mobile terminal of smart mobile phone and flat board etc., in order to develop the integrated chip group realizing high-density packages more, adapt with this, the lift-launch device on chip be required smaller, thickness is thinner and power consumption is lower.The practical problem producing quartz oscillator is also more obvious, how to reduce production cost while producing the quartz oscillator of miniaturization in enormous quantities and increase produces production capacity, become the task of top priority of numerous enterprises.
Produce quartz oscillator and can use sputtering mask clamping fixture, in current sputtering mask clamping fixture, every plate clamp can carry 185 wafer, always there are 5 can sputter simultaneously, therefore always total 185*5=925 wafer can carry out a sputter coating, owing to vacuum sputtering principle determines, target is that gapless is omnibearing to be sputtered towards mask plate, therefore much do not have the vacant locations of wafer to have metal deposit yet, cause target utilization not high, and the production capacity of wafer is relatively low.
Summary of the invention
The purpose of the present invention is that provides a kind of quartz oscillator vacuum sputtering coating device to solve the problems referred to above.
In order to achieve the above object, present invention employs techniques below scheme:
A kind of quartz oscillator vacuum sputtering coating device, including base plate, sputtering fixture and polylith mask plate, described sputtering fixture is arranged on described base plate, described sputtering fixture includes monolateral draw-in groove and bilateral draw-in groove, described bilateral draw-in groove is arranged between two described monolateral draw-in grooves, and two described mask plates are respectively embedded between described bilateral draw-in groove and two described monolateral draw-in grooves.
Two panels mask plate is adopted to insert sputtering, more uniform with coating film thickness on a piece of mask plate, and stock utilization can be improved.
Specifically, described mask plate includes upper frame, underframe, upper mask plate and lower mask plate, and described upper mask plate is fixed by described upper frame, and described lower mask plate is fixed by described underframe, and quartz wafer is placed between described upper mask plate and described lower mask plate.
Specifically, the through hole on described mask plate is 876.
Mask plate adds electrode mask quantity, and every plate clamp can carry 768 bauerite wafers, can put into 2 mask plates when sputtering equipment works and sputter, by the number of wafers of equipment be once: 768*2=1536 wafer, substantially increase yield.
The beneficial effects of the present invention is:
The present invention is a kind of quartz oscillator vacuum sputtering coating device, adopts two panels mask plate to insert sputtering, more uniform with coating film thickness on a piece of mask plate, and can improve stock utilization, reduces production cost, has the value promoted the use of.
Accompanying drawing explanation
Fig. 1 is the structural representation of heretofore described sputtering fixture；
Fig. 2 is the structural representation of heretofore described mask plate；
Fig. 3 is the hierarchy schematic diagram of heretofore described mask plate.
In figure: the monolateral draw-in groove of 1-, the bilateral draw-in groove of 2-, 3-base plate, 4-mask plate, the upper mask plate of 5-, 6-upper frame, 7-underframe, mask plate under 8-.
Detailed description of the invention
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail.It should be appreciated that accompanying drawing as referenced herein is only used for aiding in illustrating and explain the specific embodiment of the invention, the accompanying drawing of the present invention is not limited to above-mentioned provided accompanying drawing.In the present invention, when not making contrary explanation, the noun of locality of use as " up, down, left, right, before and after " and other position relationships be according to Figure of description describe.
As depicted in figs. 1 and 2, the present invention is a kind of quartz oscillator vacuum sputtering coating device, including base plate 3, sputtering fixture and polylith mask plate 4, sputtering fixture is arranged on base plate 3, sputtering fixture includes monolateral draw-in groove 1 and bilateral draw-in groove 2, bilateral draw-in groove 2 is arranged between two monolateral draw-in grooves 1, and two mask plates 4 are respectively embedded between bilateral draw-in groove 2 and two monolateral draw-in grooves 1.
As it is shown on figure 3, mask plate includes upper frame 6, underframe 7, upper mask plate 5 and lower mask plate 8, upper mask plate 5 is fixed by upper frame 6, and lower mask plate 8 is fixed by underframe 7, and quartz wafer is placed between mask plate 5 and lower mask plate 8.Through hole on mask plate 4 is 876.
The present invention reaches to improve the purpose of target as sputter utilization rate by increasing the quantity of unit are mask plate 4.Mask plate 4 is applicable to the crystal oscillator sputter coating of the models (3225 refer to the long 3.2mm of product size, wide 2.5mm) such as 3225,2520,2016,1612 and uses.It is the quartz oscillator of 15MHz---60MHz that mask plate 4 is applicable to frequency range.
In the present invention, sputtering coating target material is typically chosen Aurum metallicum, argent, metallic nickel.The thickness of mask plate 4, length, width etc., can determine according to the crystal oscillator size of actual production.
The present invention is by the arrangement of sputter coating mask plate 4 and the improvement sputtering fixture, having improved utilization rate and the equipment capacity of sputtering target material.By to the improvement of sputtering mask plate 4 can the consumption about 40% of effectively save target gold, improve equipment capacity 66% when not changing equipment simultaneously,
nullThe present invention adopts the configuration of electrodes of tight type，The sputtering mode of mask plate 4 changes 2 chips into and inserts sputtering，This is conducive to more uniform with coating film thickness on a piece of mask plate，And sputtering target material utilization rate can be improved，And in the present invention，Mask plate 4 adds the quantity of electrode mask，Every plate clamp can carry 768 bauerite wafers，2 mask plates can be put into sputter when sputtering equipment works，Therefore by the number of wafers of equipment be once: 768*2=1536 wafer，Compare the sputtering mode adopting 5 mask plates，Once sputter 925 wafers obtained，Totally have more (1536-925)/925=66%，Namely under not changing equipment and other input，The mask plate 4 using the present invention just has the yield of 66% to promote，The target gold weight simultaneously once sputtering use is certain，The covert consumption saving gold，Improve the utilization rate of target gold.
The preferred embodiment of the present invention is described in detail above in association with accompanying drawing; but; the present invention is not limited to the detail in above-mentioned embodiment; in the technology concept of the present invention; technical scheme can being carried out multiple simple variant, these simple variant belong to protection scope of the present invention.
It is further to note that, each concrete technical characteristic described in above-mentioned detailed description of the invention, in reconcilable situation, it is possible to be combined by any suitable mode, in order to avoid unnecessary repetition, various possible compound modes are no longer illustrated by the present invention separately.
Additionally, can also carry out combination in any between the various different embodiment of the present invention, as long as it is without prejudice to the thought of the present invention, it should be considered as content disclosed in this invention equally.
Claims (4)
1. a quartz oscillator vacuum sputtering coating device, including base plate, sputtering fixture and polylith mask plate, described sputtering fixture is arranged on described base plate, it is characterized in that: described sputtering fixture includes monolateral draw-in groove and bilateral draw-in groove, described bilateral draw-in groove is arranged between two described monolateral draw-in grooves, and two described mask plates are respectively embedded between described bilateral draw-in groove and two described monolateral draw-in grooves.
2. quartz oscillator vacuum sputtering coating device according to claim 1, it is characterized in that: described mask plate includes upper frame, underframe, upper mask plate and lower mask plate, described upper mask plate is fixed by described upper frame, described lower mask plate is fixed by described underframe, and quartz wafer is placed between described upper mask plate and described lower mask plate.
3. quartz oscillator vacuum sputtering coating device according to claim 1, it is characterised in that: the through hole on described mask plate is 876.
4. quartz oscillator vacuum sputtering coating device according to claim 1, it is characterised in that: the distance between described bilateral draw-in groove and two described monolateral draw-in grooves is not more than 5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410804202.1A CN105763165A (en) | 2014-12-20 | 2014-12-20 | Quartz oscillator vacuum sputtering coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410804202.1A CN105763165A (en) | 2014-12-20 | 2014-12-20 | Quartz oscillator vacuum sputtering coating device |
Publications (1)
| Publication Number | Publication Date |
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| CN105763165A true CN105763165A (en) | 2016-07-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201410804202.1A Pending CN105763165A (en) | 2014-12-20 | 2014-12-20 | Quartz oscillator vacuum sputtering coating device |
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| CN (1) | CN105763165A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109280897A (en) * | 2018-11-30 | 2019-01-29 | 广州晶优电子科技有限公司 | Quartz wafer film coating jig |
| CN109692828A (en) * | 2019-02-18 | 2019-04-30 | 成都泰美克晶体技术有限公司 | A kind of wafer selecting jig suitable for 1210 package dimensions |
| CN109701911A (en) * | 2019-02-18 | 2019-05-03 | 成都泰美克晶体技术有限公司 | A kind of wafer selecting jig suitable for 1612,2016 and 3225 package dimensions |
| CN111254389A (en) * | 2020-04-13 | 2020-06-09 | 柯学 | Calibration device for vacuum sputtering coating mask plate of quartz crystal oscillator |
-
2014
- 2014-12-20 CN CN201410804202.1A patent/CN105763165A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109280897A (en) * | 2018-11-30 | 2019-01-29 | 广州晶优电子科技有限公司 | Quartz wafer film coating jig |
| CN109692828A (en) * | 2019-02-18 | 2019-04-30 | 成都泰美克晶体技术有限公司 | A kind of wafer selecting jig suitable for 1210 package dimensions |
| CN109701911A (en) * | 2019-02-18 | 2019-05-03 | 成都泰美克晶体技术有限公司 | A kind of wafer selecting jig suitable for 1612,2016 and 3225 package dimensions |
| CN109701911B (en) * | 2019-02-18 | 2024-01-23 | 成都泰美克晶体技术有限公司 | Wafer selection jig suitable for 1612, 2016 and 3225 packaging sizes |
| CN109692828B (en) * | 2019-02-18 | 2024-01-23 | 成都泰美克晶体技术有限公司 | Wafer selection jig suitable for 1210 encapsulation size |
| CN111254389A (en) * | 2020-04-13 | 2020-06-09 | 柯学 | Calibration device for vacuum sputtering coating mask plate of quartz crystal oscillator |
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| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160713 |
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| WD01 | Invention patent application deemed withdrawn after publication |