CN105762239A - Light conversion device, manufacture method therefor and application thereof - Google Patents

Light conversion device, manufacture method therefor and application thereof Download PDF

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Publication number
CN105762239A
CN105762239A CN201610224386.3A CN201610224386A CN105762239A CN 105762239 A CN105762239 A CN 105762239A CN 201610224386 A CN201610224386 A CN 201610224386A CN 105762239 A CN105762239 A CN 105762239A
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layer
fluorescence coating
conversion device
light conversion
powder
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CN105762239B (en
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杨阳
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials

Abstract

The invention relates to a light conversion device, a manufacture method therefor and application thereof. The light conversion device comprises a heat conduction substrate, a tin-soldered layer laminated on the heat conduction substrate, a reflecting layer laminated on the tin-soldered layer and a fluorescent layer laminated on the reflecting layer, wherein the reflecting layer is obtained via reflecting metal slurry sintering operation; reflecting metal slurry comprises reflecting metal powder, first glass powder and a first organic carrier; the mass ratio between the reflecting metal powder and the first glass powder ranges from 1:1 to 19.9:0.1; the reflecting metal powder is at least one kind selected from silver powder and aluminium powder. The reflecting layer of the light conversion device is high in reflecting performance, high in thermal conductivity and low in thermal resistance.

Description

Light conversion device and its preparation method and application
Technical field
The present invention relates to illumination and display field, particularly relate to a kind of light conversion device and its preparation method and application.
Background technology
A new generation's Solid State Laser light source is high due to its high brightness, stability, therefore becomes the perfect light source replacing high voltage mercury lamp.At present, laser fluorescence powder light source technology therein excites the light converter device containing fluorescent material due to blue laser, brightness relatively LED improves more than an order of magnitude, it is thus achieved that the laser display of high brightness low cost and illumination become a reality, and is developing progressively one of mainstream technology into LASER Light Source.
Light converter device comparatively conventional at present is reflective structure, but the reflecting layer of existing reflective structure is loose structure, and thermal resistance is higher, and heat conductivity is bad, is unfavorable for the heat radiation of power light source, directly affects brightness and the reliability of colour wheel.Although the problem that its thermal resistance is higher can be solved by plating reflectance coating; but the colour wheel adopting plating reflectance coating relates to multiple techniques such as plating transition film, metallic reflective coating, metal protective film, soldering pad layer and soldering layer; process is complicated; cost is high; and the bigger colour wheel of area to prepare difficulty bigger, it is difficult to realize mass production.
Summary of the invention
Based on this, it is necessary to provide the light conversion device of a kind of high brightness and high reliability.
Additionally, also provide for a kind of by the preparation method of above-mentioned light conversion device and its application.
A kind of light conversion device, including heat-conducting substrate and stack gradually the metal adhesion layer on described heat-conducting substrate, fine and close reflecting layer and fluorescence coating, described reflecting layer is obtained by reflective metals slurry is sintered, described reflective metals slurry includes the mass ratio 1:1～19.9:0.1 of reflective metals powder, the first glass dust and the first organic carrier, described reflective metals powder and described first glass dust；Described reflective metals powder at least one in argentum powder and aluminium powder, described metal adhesion layer is soldering layer, alumel layer or low-temperature sintering silver layer.
Wherein in an embodiment, the material of described heat-conducting substrate is copper.
Wherein in an embodiment, the material of described heat-conducting substrate is the composite of the composite of aluminum, copper and diamond or copper and graphite, and described light conversion device also includes intermediate metal, and described intermediate metal is silver layer, wherein, described metal adhesion layer is laminated on described intermediate metal；Or, described intermediate metal includes stacking gradually the nickel dam on described heat-conducting substrate and layer gold, and described metal adhesion layer is laminated in described layer gold.
The preparation method of a kind of light conversion device, comprises the steps:
Form fine and close reflecting layer and the fluorescence coating of stacking, wherein, described reflecting layer is obtained by reflective metals slurry is sintered, and described reflective metals slurry includes the mass ratio 1:1～19.9:0.1 of reflective metals powder, the first glass dust and the first organic carrier, described reflective metals powder and described first glass dust；Described reflective metals powder at least one in argentum powder and aluminium powder；And
Thering is provided heat-conducting substrate, adhered to each other by metal adhesive material and described heat-conducting substrate away from the one side of described fluorescence coating in described reflecting layer, obtain light conversion device, wherein, described metal adhesive material is tinol, alumel or low-temperature sintering silver slurry.
Wherein in an embodiment, the material of described heat-conducting substrate is copper.
Wherein in an embodiment, the material of described heat-conducting substrate is the composite of the composite of aluminum, copper and diamond or copper and graphite；The step that described reflecting layer is adhered to each other by described metal adhesive material and described heat-conducting substrate away from the one side of described fluorescence coating is being formed intermediate metal particularly as follows: be coated with silver on described heat-conducting substrate, then, described reflecting layer is bonded together by described metal adhesive material and described intermediate metal away from the one side of described fluorescence coating；
Or, in the step that described reflecting layer is adhered to each other by described metal adhesive material and described heat-conducting substrate away from the one side of described fluorescence coating particularly as follows: on described heat-conducting substrate nickel plating form nickel dam, then gold-plated to form layer gold on nickel dam, obtain intermediate metal, then, described reflecting layer is bonded together by described metal adhesive material and described layer gold away from the one side of described fluorescence coating.
Wherein in an embodiment, form the reflecting layer of described stacking and the step of fluorescence coating particularly as follows: provide described fluorescence coating, described fluorescence coating is coated with described reflective metals slurry, drying, obtain described reflection green body layer, then through sintering, cambium layer is laminated on the described reflecting layer on described fluorescence coating.
Wherein in an embodiment, form the reflecting layer of described stacking and the step of fluorescence coating particularly as follows: provide and hold burning substrate, described holding, burning substrate is coated with described reflective metals slurry, drying, forms reflection green body layer；Described reflection green body layer is coated with fluorescent slurry, drying, forms fluorescence green body layer, then through sintering, formed and stack gradually in the described described reflecting layer and described fluorescence coating held and burn on substrate；Holding burning substrate described in removal, obtain reflecting layer and the fluorescence coating of described stacking, wherein, described fluorescent slurry includes the softening point temperature of fluorescent material, the second glass dust and the second organic carrier, described second glass dust and described first glass dust and is more or less the same in 400 DEG C.
Wherein in an embodiment, form the reflecting layer of described stacking and the step of fluorescence coating particularly as follows: provide and hold burning substrate, described holding, burning substrate is coated with described reflective metals slurry, drying, forms reflection green body layer；Described fluorescence coating is provided, described fluorescence coating is laminated in described reflection green body layer, sintered, formed and stack gradually in the described described reflecting layer and described fluorescence coating held and burn on substrate；Hold burning substrate described in removal, obtain reflecting layer and the fluorescence coating of described stacking.
Wherein in an embodiment, after holding the step burning substrate described in removing, it is also possible to include the described reflecting layer one side away from described fluorescence coating of polishing, so that the metal in described reflecting layer exposes.
Wherein in an embodiment, before the described step held and be coated with described reflective metals slurry on burning substrate, hold coating demoulding slurry, drying and sintering on burning substrate described in being additionally included in, form release layer；Wherein, described release layer is coated with described reflective metals slurry.
Wherein in an embodiment, also including the preparation process of described fluorescence coating, the preparation process of described fluorescence coating includes: fluorescent material is pressed into lamellar, sintered, obtains described fluorescence coating；
Or, the preparation process of described fluorescence coating includes: is mixed with pottery sintering aid by fluorescent material, successively through molding and sintering, obtains described fluorescence coating；
Or, the preparation process of described fluorescence coating includes: fluorescent material, the 3rd glass dust and the 3rd organic carrier is mixed, successively through molding and sintering, obtains described fluorescence coating.
Wherein in an embodiment, described reflective metals slurry also includes assistant metal powder, described assistant metal powder at least one in palladium powder and platinum powder.
Wherein in an embodiment, described reflective metals powder is sheet-like particle or spherical particle, or the mixture that described reflective metals powder is sheet-like particle and spherical particle.
Wherein in an embodiment, the particle diameter of described reflective metals powder is 10 nanometers～10 microns.
The application in the light-source system or laser display field of scialyscope of the above-mentioned light conversion device.
Owing to the reflecting layer of above-mentioned light conversion device is obtained by reflective metals slurry is sintered, reflective metals slurry includes reflective metals powder, first glass dust and the first organic carrier, mass ratio 1:1～the 19.9:0.1 of reflective metals powder and the first glass dust, reflective metals powder at least one in argentum powder and aluminium powder, and reflecting layer is fine and close reflecting layer, reflecting layer is made to have higher reflecting properties, simultaneously, reflecting layer relative to traditional porous, fine and close reflecting layer also has higher thermal conductivity and relatively low thermal resistance, above-mentioned light conversion device is made to have higher brightness.And above-mentioned Wavelength converter and current Wavelength converter contrast, driving the test result under electric current relatively can release in same laser, the laser current that the Wavelength converter of the present invention bears is higher, and reliability is higher.
Accompanying drawing explanation
Fig. 1 is the structural representation of the light conversion device of an embodiment；
Fig. 2 is the flow chart of the preparation method of the light conversion device of an embodiment；
Fig. 3 is the light conversion device of embodiment 1 and comparative example 1 luminous flux under the same blue laser light source variation relation curve chart with electric current.
Detailed description of the invention
For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is described more fully.Accompanying drawing gives the preferred embodiment of the present invention.But, the present invention can realize in many different forms, however it is not limited to embodiment described herein.On the contrary, the purpose providing these embodiments is to make the understanding to the disclosure more thorough comprehensively.
Unless otherwise defined, all of technology used herein is identical with the implication that the those skilled in the art belonging to the present invention are generally understood that with scientific terminology.The term used in the description of the invention herein is intended merely to the purpose describing specific embodiment, it is not intended that in the restriction present invention.
As it is shown in figure 1, the light conversion device 100 of an embodiment, including heat-conducting substrate 110, metal adhesion layer 120, reflecting layer 130 and fluorescence coating 140.
Wherein, the material of heat-conducting substrate 110 is copper.Copper is highly heat-conductive material, has good heat conductivility and copper well can bond together with metal adhesion layer 120.
Wherein, the thickness of heat-conducting substrate 110 is 0.1～5mm.
Wherein, metal adhesion layer 120 is soldering layer, alumel layer or low-temperature sintering silver layer.Concrete, soldering-tin layer can be gold soldering layer, silver soldering layer, bismuth soldering layer or indium soldering layer.Wherein, low-temperature sintering silver layer refers to the silver layer of the silver slurry formation at 200～400 DEG C of sintering, for instance, nano silver particles and epoxy resin the silver slurry formed.
Wherein, reflecting layer 130 is fine and close reflecting layer.Reflecting layer 130 is obtained by reflective metals slurry is sintered.Wherein, reflective metals slurry includes reflective metals powder, the first glass dust and the first organic carrier.
Wherein, the mass ratio 1:1～19.9:0.1 of reflective metals powder and the first glass dust.
Wherein, reflective metals powder at least one in argentum powder and aluminium powder.Preferably, reflective metals powder is argentum powder, has higher reflectance and higher thermal conductivity due to argentum powder, it is possible to make the reflecting layer 130 of light conversion device 100 have higher reflectance and higher thermal conductivity.
Wherein, reflective metals powder can be spherical, strip, bar-shaped, lamellar or spherical；Preferably, reflective metals powder is sheet-like particle or spherical particle, or the mixture that reflective metals powder is sheet-like particle and spherical particle.The reflective metals powder of lamellar is conducive to mutually overlapping to form heat conduction network between the reflective metals powder after sintering, to improve the thermal conductivity in the reflecting layer 130 of light conversion device 100；Spherical reflective metals powder particles bulk density is high, and slurry fluidity is good, is conducive to improving the thermal conductivity in the reflecting layer 130 of light conversion device 100.
Further, the particle diameter of reflective metals powder is 10 nanometers～10 microns.Bigger granule not easily densified sintering product, less granule not easily disperses.
Wherein, the first glass dust coloured glass dust after can using sintering, it is possible to use do not have coloured glass dust after sintering；Preferably, the first glass dust is the glass dust more than 80% of the visible light transmissivity after water white transparency and sintering after being sintering.Such as, the first glass dust is silicate glass powder or borosilicate glass powder.
Wherein, the thermal coefficient of expansion of the first glass dust differs 0～5 × 10 with the thermal coefficient of expansion of heat-conducting substrate 110-6/ K, can be bonded together between reflecting layer 130 and the heat-conducting substrate 110 being subsequently formed reliably so that sintering.Further, the thermal coefficient of expansion of the first glass dust differs 0～3 × 10 with the thermal coefficient of expansion of heat-conducting substrate 110-6/K；Further, the thermal coefficient of expansion of the first glass dust differs 0～1 × 10 with the thermal coefficient of expansion of heat-conducting substrate 110-6/K。
Wherein, the first organic carrier is made up of the organic solvent of bonding agent and different boiling.Wherein, bonding agent is ethyl cellulose；Solvent at least one in terpineol, butyl carbitol, butyl carbitol ester, tributyl citrate and tributyl 2-acetylcitrate.
Further, reflective metals slurry also includes assistant metal powder, assistant metal powder at least one in palladium powder and platinum powder.Wherein, palladium powder and platinum powder have the adverse effect of the silver migration reducing high temperature sintering, improve reflectance stability.Wherein, assistant metal powder is not higher than 1:1 with the mass ratio of reflective metals powder.
Wherein, fluorescence coating 140 is main is formed by fluorescent material sintering.Fluorescence coating 140 can send fluorescence under the effect of exciting light.
Owing to the reflecting layer 130 of above-mentioned light conversion device 100 is obtained by reflective metals slurry is sintered.Reflective metals slurry includes reflective metals powder, the first glass dust and the first organic carrier, mass ratio 1:1～the 19.9:0.1 of reflective metals powder and the first glass dust, reflective metals powder at least one in argentum powder and aluminium powder, and reflecting layer 130 is fine and close reflecting layer 130, reflecting layer 130 is made to have higher reflecting properties, simultaneously, reflecting layer 130 relative to traditional porous, fine and close reflecting layer 130 also has higher thermal conductivity and relatively low thermal resistance, so that light conversion device 100 prepared by said method has higher light efficiency and brightness, more reliable.
Above-mentioned light conversion device 100 can be applicable in the light-source system of light fixture or display.
The light conversion device of two embodiments and the light conversion device of an embodiment are similar, differ only in, and the material of heat-conducting substrate is the composite of the composite of aluminum, copper and diamond or copper and graphite.Now, light conversion device also includes the intermediate metal that is laminated on heat-conducting substrate.
Wherein, intermediate metal is silver layer, and wherein, metal adhesion layer is laminated on intermediate metal.Wherein, intermediate metal is by being coated with formation.It is bonded together well with metal adhesion layer by arranging the heat-conducting substrate of the composite of composite that intermediate metal can make material be aluminum, copper and diamond or copper and graphite.
Or, it is in embodiment at other, intermediate metal includes the nickel dam and the layer gold that stack gradually on heat-conducting substrate, and now, gold tack coat is laminated in layer gold.The heat-conducting substrate of the composite that this intermediate metal also is able to realize composite that material is aluminum, copper and diamond or copper and graphite is bonded together well with metal adhesion layer.
As in figure 2 it is shown, the preparation method of the light conversion device of an embodiment, can be used for preparing the light conversion device of an embodiment, the preparation method of this light conversion device comprises the steps:
Step S210: forming fine and close reflecting layer and the fluorescence coating of stacking, wherein, reflecting layer is obtained by reflective metals slurry is sintered.
In the present embodiment, form the reflecting layer of stacking and the step of fluorescence coating particularly as follows: provide and hold burning substrate, holding coating reflective metals slurry, drying on burning substrate, form reflection green body layer；Coating fluorescent slurry in reflection green body layer, drying forms fluorescence green body layer, then through sintering, is formed and stacks gradually in holding the reflecting layer and fluorescence coating burnt on substrate；Burning substrate is held in removal, obtains reflecting layer and the fluorescence coating of stacking.
Wherein, to burn the method for coating reflective metals slurry on substrate can be brushing, blade coating, spraying or silk screen printing holding.And be 100～200 DEG C holding the baking temperature burning on substrate the drying steps after coating reflective metals slurry.
Wherein, reflective metals slurry includes reflective metals powder, the first glass dust and the first organic carrier.
Wherein, the mass ratio 1:1～19.9:0.1 of reflective metals powder and the first glass dust.
Wherein, reflective metals powder at least one in argentum powder and aluminium powder.Preferably, reflective metals powder is argentum powder, has higher reflectance and higher thermal conductivity due to argentum powder, it is possible to make the reflecting layer of light conversion device have higher reflectance and higher thermal conductivity.
Wherein, reflective metals powder can be spherical, strip, bar-shaped or lamellar, it is preferred to sheet-like particle.Preferably, reflective metals powder is sheet-like particle or spherical particle, or the mixture that reflective metals powder is sheet-like particle and spherical particle.The reflective metals powder of lamellar is conducive to mutually overlapping to form heat conduction network between the reflective metals powder after sintering, to improve the thermal conductivity in the reflecting layer of light conversion device；Spherical reflective metals powder particles bulk density is high, and slurry fluidity is good, is conducive to improving the thermal conductivity in the reflecting layer of light conversion device.
Further, the particle diameter of reflective metals powder is 10 nanometers～10 microns.Bigger granule not easily densified sintering product, less granule not easily disperses.
First glass dust is coloured glass dust after can using sintering, it is possible to use does not have coloured glass dust after sintering；Preferably, the first glass dust is the glass dust more than 80% of the visible light transmissivity after water white transparency and sintering after being sintering.Such as, the first glass dust is silicate glass powder or borosilicate glass powder.
First organic carrier is made up of bonding agent and organic solvent.Wherein, bonding agent is ethyl cellulose；Solvent at least one in terpineol, butyl carbitol, butyl carbitol ester, tributyl citrate and tributyl 2-acetylcitrate.
Further, reflective metals slurry also includes assistant metal powder, assistant metal powder at least one in palladium powder and platinum powder.Wherein, palladium powder and platinum powder have the adverse effect of the silver migration reducing high temperature sintering, improve reflectance stability.Wherein, assistant metal powder is not higher than 1:1 with the mass ratio of reflective metals powder.
Further, after holding the step being coated with reflective metals slurry on burning substrate, also include being coated with holding of reflective metals slurry and burn the step that substrate at room temperature stands, so that reflective metals slurry is holding levelling on burning substrate.
Wherein, the thickness reflecting green body layer is 0.001～1mm.
Wherein, in fluorescent slurry, the mass ratio of fluorescent material and the second glass dust is 1:0.1～99.
Wherein, the softening point temperature of the second glass dust and the first glass dust differs less than 400 DEG C, so that reflecting layer and fluorescence coating after sintering can be good at being bonded together.Such as, the first glass dust can be silicate glass powder, and the second glass dust can be borosilicate glass powder；Or, the first glass dust can be borosilicate glass powder, and the second glass dust can be silicate glass powder.
Wherein, the second organic carrier is made up of bonding agent and organic solvent.Wherein, bonding agent is ethyl cellulose；Solvent at least one in terpineol, butyl carbitol, butyl carbitol ester, tributyl citrate and tributyl 2-acetylcitrate.
Wherein, the method being coated with fluorescent slurry in reflection green body layer can be brushing, blade coating, spraying or silk screen printing.And the baking temperature being coated with the drying steps after fluorescent slurry in reflection green body layer is 100～200 DEG C；Sintering temperature is 300～960 DEG C.
Wherein, the thickness of fluorescence green body layer is 0.01～1mm.
Further, before holding the step being coated with reflective metals slurry on burning substrate, it is additionally included in and holds coating demoulding slurry, drying and sintering on burning substrate, form release layer；Wherein, release layer is coated with reflective metals slurry.And remove the step holding burning substrate particularly as follows: separated with release layer in reflecting layer.Wherein, after reflecting layer separates with release layer, release layer sticks to holds on burning substrate.Wherein, after reflecting layer separates with release layer, a small amount of release layer that reflecting layer adheres to is ground off by polishing.
Wherein, demoulding slurry includes white particles and organic carrier.Wherein, white particles is the one in boron nitride, aluminium oxide, titanium oxide, yittrium oxide and barium sulfate；Organic carrier is made up of bonding agent and organic solvent.Wherein, bonding agent is ethyl cellulose；Organic solvent at least one in terpineol, butyl carbitol, butyl carbitol ester, tributyl citrate and tributyl 2-acetylcitrate.Wherein, being 80～200 DEG C holding the baking temperature burning the drying steps after being coated with demoulding slurry on substrate, sintering temperature is 400～900 DEG C.
Further, after removing the step holding burning substrate, also include the polishing reflecting layer one side away from fluorescence coating, so that the metal in reflecting layer exposes.By reflecting layer of polishing, so that removing reflecting layer and to hold the glass part burning the low thermal resistance formed between substrate in sintering process, so that the luminescence of light conversion device is more stable.
Step S220: provide heat-conducting substrate, is adhered to each other reflecting layer by metal adhesive material and heat-conducting substrate away from the one side of fluorescence coating, obtains light conversion device.
Wherein, metal adhesive material is tinol, alumel or low-temperature sintering silver slurry.Wherein, solder(ing) paste can be gold tinol, silver tinol, bismuth tinol or indium tinol.
Wherein, low-temperature sintering silver slurry refers to and can starch at the silver of 200～400 DEG C of sintering, for instance, the silver slurry that nano silver particles and epoxy resin are formed.
Wherein, the material of heat-conducting substrate one in the composite and copper of aluminum, copper and the composite of diamond, copper and graphite.These materials are highly heat-conductive material, have good heat conductivility.
Wherein, the thickness of heat-conducting substrate is 0.1～5mm.
Wherein, when the composite of the composite that the material of heat-conducting substrate is aluminum, copper and diamond or copper and graphite；In the step that reflecting layer is adhered to each other by metal adhesive material and heat-conducting substrate away from the one side of fluorescence coating particularly as follows: on heat-conducting substrate silver-plated formation intermediate metal, then, reflecting layer is bonded together by metal adhesive material and intermediate metal away from the one side of fluorescence coating.
Or, when the composite of the composite that material is aluminum, copper and diamond of heat-conducting substrate or copper and graphite, in the step that reflecting layer is adhered to each other by metal adhesive material and heat-conducting substrate away from the one side of fluorescence coating particularly as follows: on heat-conducting substrate nickel plating form nickel dam, then gold-plated to form layer gold on nickel dam, obtain intermediate metal, then, reflecting layer is bonded together by metal adhesive material and layer gold away from the one side of fluorescence coating.
Concrete, when the material of heat-conducting substrate is copper, it may not be necessary to intermediate metal, now, directly reflecting layer is adhered to each other by metal adhesive material and heat-conducting substrate away from the one side of fluorescence coating.
Wherein, the thickness of intermediate metal is 0.01～10um.Wherein, on heat-conducting substrate be coated with metal adhesive material or on intermediate metal be coated with metal adhesive material thickness be 1～100um.
The preparation method of above-mentioned light conversion device is simple to operate, it is prone to industrialized production, and the preparation method of above-mentioned light conversion device is when preparing reflecting layer, by using the reflective metals slurry sintering containing reflective metals powder and the first glass dust to form fine and close reflecting layer, and at least one that reflective metals powder is in argentum powder and aluminium powder, obtain and there is irreflexive reflecting layer, reflecting layer is made to have higher reflecting properties, simultaneously, reflecting layer relative to traditional porous, fine and close reflecting layer also has higher thermal conductivity and relatively low thermal resistance, so that light conversion device prepared by said method has higher brightness, more reliable.
The light conversion device that the preparation method of the light conversion device of one embodiment prepares.Owing to this light conversion device is prepared by the preparation method of above-mentioned light conversion device, above-mentioned light conversion layer is made not only to have higher reflecting properties, also there is higher thermal conductivity and relatively low thermal resistance so that light conversion device prepared by said method has higher brightness, more reliably.
The preparation method of the light conversion device of two embodiments is roughly the same with the step of the preparation method of the light conversion device of an embodiment, differing only in, the reflecting layer forming stacking of the preparation method of the light conversion device of two embodiments is different from the preparation method of the light conversion device of an embodiment with the step of fluorescence coating.
The preparation method of the light conversion device of two embodiments does not use when forming reflecting layer and the fluorescence coating of stacking and holds burning substrate, but on fluorescence coating, directly form reflecting layer, therefore, the reflecting layer forming stacking of two embodiments and the step of fluorescence coating are particularly as follows: provide fluorescence coating, fluorescence coating is coated with reflective metals slurry, drying, forms reflection green body layer, then through sintering, cambium layer is laminated on the reflecting layer on fluorescence coating.
Wherein, fluorescence coating can prepare as follows: fluorescent material is pressed into lamellar, sintered, obtains fluorescence coating.
Or, fluorescence coating can also prepare as follows: is mixed with pottery sintering aid by fluorescent material, successively through molding and sintering, obtains described fluorescence coating.Now, fluorescent material is 100:0.01～100:10 with the mass ratio of pottery sintering aid；Pottery sintering aid can be tetraethyl orthosilicate, magnesium oxide, magnesium nitrate, magnesium hydroxide, yittrium oxide, Yttrium trinitrate etc..
Or, fluorescence coating can also prepare as follows: fluorescent material, the 3rd glass dust and the 3rd organic carrier is mixed, successively through molding and sintering, obtains fluorescence coating.Now, the mass ratio of fluorescent material and the 3rd glass dust is 0.01～99:1；3rd glass dust can be glass dust commonly used in the art, for instance, borosilicate glass powder, silicate glass powder etc..3rd organic carrier can be organic carrier commonly used in the art, and organic carrier is made up of bonding agent and organic solvent.Wherein, bonding agent is ethyl cellulose；Solvent at least one in terpineol, butyl carbitol, butyl carbitol ester, tributyl citrate and tributyl 2-acetylcitrate.Wherein, the 3rd glass dust and the second glass dust can be identical, it is also possible to different；3rd organic carrier and the second organic solvent can be identical, it is also possible to different.
Preferably, the thermal coefficient of expansion of the fluorescence coating that above-mentioned three kinds of methods prepare and the similar thermal expansion coefficient of the first glass dust, so that together with fluorescence coating can be securely bonded to after sintering with reflecting layer.
Wherein, the method being coated with reflective metals slurry on fluorescence coating can be brushing, blade coating, spraying or silk screen printing.
Further, after fluorescence coating is coated with the step of reflective metals slurry, also include being coated with the step that the fluorescence coating of reflective metals slurry at room temperature stands, so that reflective metals slurry levelling on fluorescence coating.
The preparation method of the light conversion device of two embodiments is similar to the preparation method of the light conversion device of an embodiment, therefore, it may have the effect of the light conversion device of an embodiment.
The light conversion device that the preparation method of the light conversion device of two embodiments prepares.Owing to this light conversion device is prepared by the preparation method of above-mentioned light conversion device, above-mentioned light conversion layer is made not only to have higher reflecting properties, also there is higher thermal conductivity and relatively low thermal resistance, light conversion device prepared by said method is made to have higher light efficiency and brightness, more reliably.
The preparation method of the light conversion device of three embodiments is roughly the same with the step of the preparation method of the light conversion device of an embodiment, differing only in, the reflecting layer forming stacking of the preparation method of the light conversion device of three embodiments and the step of fluorescence coating are slightly different with the step in the reflecting layer forming stacking of the preparation method of the light conversion device of an embodiment and fluorescence coating.
In the reflecting layer forming stacking of the preparation method of the light conversion device of three embodiments and the step of fluorescence coating, holding the step burnt after forming reflection green body layer on substrate it is: fluorescence coating is provided, fluorescence coating is laminated in reflection green body layer, sintered, formed and stack gradually in holding the reflecting layer and fluorescence coating burnt on substrate；Burning substrate is held in removal, obtains reflecting layer and the fluorescence coating of stacking.
Wherein, fluorescence coating can prepare as follows: fluorescent material is pressed into lamellar, sintered, obtains fluorescence coating.
Or, fluorescence coating can also prepare as follows: is mixed with pottery sintering aid by fluorescent material, successively through molding and sintering, obtains fluorescence coating.Now, fluorescent material is 100:0.01～100:10 with the mass ratio of pottery sintering aid；Pottery sintering aid can be tetraethyl orthosilicate, magnesium oxide, magnesium nitrate, magnesium hydroxide, yittrium oxide, Yttrium trinitrate etc..
Or, fluorescence coating can also prepare as follows: fluorescent material, the 3rd glass dust and the 3rd organic carrier is mixed, successively through molding and sintering, obtains fluorescence coating.Now, the mass ratio of fluorescent material and the 3rd glass dust is 0.01～99:1；3rd glass dust can be glass dust commonly used in the art, for instance, borosilicate glass powder, silicate glass powder etc..3rd organic carrier can be organic carrier commonly used in the art, and organic carrier is made up of bonding agent and organic solvent.Wherein, bonding agent is ethyl cellulose；Solvent at least one in terpineol, butyl carbitol, butyl carbitol ester, tributyl citrate and tributyl 2-acetylcitrate.Wherein, the 3rd glass dust and the second glass dust can be identical, it is also possible to different；3rd organic carrier and the second organic solvent can be identical, it is also possible to different.
Preferably, the thermal coefficient of expansion of the fluorescence coating that above-mentioned three kinds of methods prepare and the similar thermal expansion coefficient of the first glass dust, so that together with fluorescence coating can be securely bonded to after sintering with reflecting layer.
Wherein, the method being coated with reflective metals slurry on fluorescence coating can be brushing, blade coating, spraying or silk screen printing.
The preparation method of the light conversion device of three embodiments is similar to the preparation method of the light conversion device of an embodiment, therefore, it may have the effect of the light conversion device of an embodiment.
The light conversion device that the preparation method of the light conversion device of three embodiments prepares.Owing to this light conversion device is prepared by the preparation method of above-mentioned light conversion device, above-mentioned light conversion layer is made not only to have higher reflecting properties, also there is higher thermal conductivity and relatively low thermal resistance, light conversion device prepared by said method is made to have higher light efficiency and brightness, more reliably.
It is below specific embodiment part:
Embodiment 1
The preparation process of the light conversion device of the present embodiment is as follows:
(1) burning substrate is held in offer, holding coating demoulding slurry on burning substrate, dry through 80 DEG C, then through 400 DEG C of sintering, form the release layer that thickness is 10 microns, wherein, demoulding slurry includes boron nitride and organic carrier, organic carrier includes organic solvent, and organic carrier is ethyl cellulose, and organic solvent is the mixture of terpineol and butyl carbitol.
(2) on release layer, reflective metals slurry is brushed, at room temperature stand 10 minutes, dry 20 minutes in 100 DEG C after levelling, form the reflection green body layer that thickness is 0.005mm, wherein, reflective metals slurry includes reflective metals powder, the first glass dust and the first organic carrier, and the mass ratio of reflective metals powder and the first glass dust is 1:1, reflective metals powder is particle diameter is the lamellar Argent grain of 100 nanometers～1 micron, and the first glass dust is silicate glass powder.First organic carrier is the mixture of ethyl cellulose and terpineol, and the mass ratio of the first organic carrier and reflective metals powder is 0.5:1.
(3) in reflection green body layer, brush fluorescent slurry, dry 0.1 hour in 100 DEG C, form the fluorescence green body layer that thickness is 0.05mm, sinter 0.5 hour then through 800 DEG C, form the reflecting layer and fluorescence coating that stack gradually on release layer；Reflecting layer is separated with release layer, so that reflecting layer departs from holds burning substrate, and by the remaining release layer removed on reflecting layer of polishing, obtains reflecting layer and the fluorescence coating of stacking.Wherein, fluorescent slurry includes fluorescent material, the second glass dust and the second organic carrier, and the mass ratio of fluorescent material and the second glass dust is 1:0.1, and the second glass dust is borosilicate glass powder, and the softening point temperature of the second glass dust and the first glass dust is equal；The quality of the second organic carrier and the mass ratio of fluorescent material are 0.01:1.
(4) polishing reflecting layer is away from the one side of fluorescence coating, so that the metal in reflecting layer exposes.
(5) heat-conducting substrate providing thickness to be 5 millimeters, heat-conducting substrate is coated with the layer gold of nickel dam that thickness is 3 microns and 0.05 micron successively, coating gold tinol in layer gold, reflective layer is laminated on gold tinol, heated, form intermediate metal, and reflecting layer and layer gold are bonded together by intermediate metal, obtain the light conversion device of the present embodiment.Wherein, the material of heat-conducting substrate is the composite of copper and diamond；The thickness of solder(ing) paste is 20 microns.
Embodiment 2
The preparation process of the light conversion device of the present embodiment is as follows:
(1) burning substrate is held in offer, holding coating demoulding slurry on burning substrate, dries through 200 DEG C, then through 900 DEG C of sintering, forms the release layer that thickness is 10 microns, and wherein, demoulding slurry includes white particles and organic carrier, and white particles is aluminium oxide；Organic carrier is made up of bonding agent and organic solvent.Wherein, bonding agent is ethyl cellulose；Organic solvent is selected from terpineol, butyl carbitol and butyl carbitol ester.
(2) blade coating reflective metals slurry on release layer, at room temperature stand 12 minutes, dry 30 minutes in 200 DEG C after levelling, form the reflection green body layer that thickness is 1mm, wherein, reflective metals slurry includes reflective metals powder, assistant metal powder, the first glass dust and the first organic carrier, and the mass ratio of reflective metals powder and the first glass dust is 19.5:1, reflective metals powder is particle diameter is the flake aluminum particles of 1 micron～10 microns, and the first glass dust is borosilicate glass powder.First organic carrier is the mixture of ethyl cellulose and terpineol and butyl carbitol ester, and the mass ratio of the first organic carrier and reflective metals powder is 0.5:1.The mass ratio of assistant metal powder and reflective metals powder is 1:1, and assistant metal powder is palladium powder.
(3) blade coating fluorescent slurry in reflection green body layer, dries 30 minutes in 200 DEG C, and the thickness of formation is the fluorescence green body layer of 1mm, sinters 10 minutes then through 900 DEG C, forms the reflecting layer and fluorescence coating that stack gradually on release layer；Reflecting layer is separated with release layer, so that reflecting layer departs from holds burning substrate, and by the remaining release layer removed on reflecting layer of polishing, obtains reflecting layer and the fluorescence coating of stacking.Wherein, fluorescent slurry includes fluorescent material, the second glass dust and the second organic carrier, and the mass ratio of fluorescent material and the second glass dust is 1:99, and the second glass dust is silicate glass powder, and the softening point temperature of the second glass dust and the first glass dust differs 400 DEG C；.And second the mass ratio of quality and fluorescent material of organic carrier be 0.01:1.
(4) polishing reflecting layer is away from the one side of fluorescence coating, so that the metal in reflecting layer exposes.
(5) heat-conducting substrate providing thickness to be 0.1 micron, heat-conducting substrate is coated with layer gold that thickness is 10 meters of nickel dams and 0.03 micron successively, in layer gold, coating thickness is the golden tinol of 10 microns, reflective layer is laminated on gold tinol, heated, form metal adhesion layer, and reflecting layer and layer gold are bonded together by metal adhesion layer, obtain the light conversion device of the present embodiment.Wherein, the material of heat-conducting substrate is the composite of copper and diamond；The thickness of solder(ing) paste is 5 microns.
Embodiment 3
The preparation process of the light conversion device of the present embodiment is as follows:
(1) fluorescent material is pressed into lamellar, sintered, obtain fluorescence coating.
(2) spraying reflective metals slurry on fluorescence coating, at room temperature stand levelling, then dry through 80 DEG C, form the reflection green body layer that thickness is 0.5mm, sinter 0.5 hour then at 850 DEG C, cambium layer is laminated on the reflecting layer on fluorescence coating.Wherein, reflective metals slurry includes reflective metals powder, assistant metal powder, the first glass dust and the first organic carrier, the mass ratio of reflective metals powder and the first glass dust is 10:1, reflective metals powder is particle diameter is the mixture of the Argent grain of lamellar of 100 nanometers～10 microns and alumina particles, and the first glass dust is the first glass dust is silicate glass powder.First organic carrier is the mixture of ethyl cellulose, terpineol, butyl carbitol and butyl carbitol ester, and the mass ratio of the first organic carrier and reflective metals powder is 0.5:1.The mass ratio of assistant metal powder and reflective metals powder is 0.8:1, and assistant metal powder is platinum powder.
(3) on the heat-conducting substrate that thickness is 2mm, the silver layer that thickness is 5 microns it is coated with, on silver layer, coating thickness is the bismuth tinol of 50 microns, reflective layer is laminated on bismuth tinol, heated, form metal adhesion layer, and reflecting layer and silver layer are bonded together by metal adhesion layer, obtain the light conversion device of the present embodiment.Wherein, the material of heat-conducting substrate is aluminum；The thickness of solder(ing) paste is 25 microns.
Embodiment 4
The preparation process of the light conversion device of the present embodiment is as follows:
(1) fluorescent material is mixed with pottery sintering aid, successively through molding and sintering, obtain fluorescence diaphragm.Wherein, fluorescent material is 100:0.01 with the mass ratio of pottery sintering aid；Pottery sintering aid is magnesium oxide.
(2) spraying reflective metals slurry on fluorescence coating, at room temperature stand levelling, then dry through 150 DEG C, form the reflection green body layer that thickness is 1mm, sinter 1 hour then at 600 DEG C, cambium layer is laminated on the reflecting layer on fluorescence coating.Wherein, reflective metals slurry includes reflective metals powder, assistant metal powder, the first glass dust and the first organic carrier, the mass ratio of reflective metals powder and the first glass dust is 19.9:0.1, reflective metals powder is particle diameter is the Argent grain of the lamellar of 100 nanometers～500 nanometers and spherical mixing, and the first glass dust is the first glass dust is borosilicate glass powder.First organic carrier is the mixture of ethyl cellulose and butyl carbitol, and the mass ratio of the first organic carrier and reflective metals powder is 0.5:1.The mass ratio of assistant metal powder and reflective metals powder is 0.5:1, and assistant metal powder is the mixture of palladium powder and platinum powder.
(3) providing heat-conducting substrate, on heat-conducting substrate, coating thickness is the indium tinol of 50 microns, reflective layer is laminated on indium tinol, heated, form metal adhesion layer, and reflecting layer and heat-conducting substrate are bonded together by metal adhesion layer, obtain the light conversion device of the present embodiment.Wherein, the material of heat-conducting substrate is copper；The thickness of solder(ing) paste is 25 microns.
Embodiment 5
The preparation process of the light conversion device of the present embodiment is as follows:
(1) fluorescent material, the 3rd glass dust and the 3rd organic carrier are mixed, successively through molding and sintering, obtain fluorescence diaphragm.Now, the mass ratio of fluorescent material and the 3rd glass dust is 0.01:1；3rd glass dust is silicate glass powder；3rd organic carrier is the mixture of ethyl cellulose, terpineol, butyl carbitol and butyl carbitol ester.
(2) silk screen printing reflective metals slurry on fluorescence coating, at room temperature stands levelling, then dries through 100 DEG C, forms the reflection green body layer that thickness is 0.1mm, sinters 1 hour then at 700 DEG C, and cambium layer is laminated on the reflecting layer on fluorescence coating.Wherein, reflective metals slurry includes reflective metals powder, assistant metal powder, the first glass dust and the first organic carrier, the mass ratio of reflective metals powder and the first glass dust is 15:1, reflective metals powder is particle diameter is the spherical silver particles of 500 nanometers～800 nanometers, and the first glass dust is the first glass dust is borosilicate glass powder.First organic carrier is the mixture of ethyl cellulose and butyl carbitol ester, and the mass ratio of the first organic carrier and reflective metals powder is 0.5:1.The mass ratio of assistant metal powder and reflective metals powder is 0.2:1, and assistant metal powder is palladium powder.
(3) on the heat-conducting substrate that thickness is 3mm, the silver layer that thickness is 50 microns it is coated with, silver layer is placed the alumel paillon foil that thickness is 100 microns, reflective layer is laminated on alumel paillon foil, 12V voltage is added at alumel paillon foil, alumel is melted forms metal adhesion layer, and reflecting layer and silver layer are bonded together by metal adhesion layer, obtain the light conversion device of the present embodiment.Wherein, the material of heat-conducting substrate is aluminum；The thickness of alumel layer is 100 microns.
Embodiment 6
The preparation process of the light conversion device of the present embodiment is as follows:
(1) burning substrate is held in offer, holding coating demoulding slurry on burning substrate, dries through 100 DEG C, 500 DEG C of sintering, forms the release layer that thickness is 10 microns, and wherein, demoulding slurry includes white particles and organic carrier, and white particles is titanium oxide；Organic carrier is made up of bonding agent and organic solvent.Wherein, bonding agent is ethyl cellulose；Organic solvent is terpineol.
(2) on release layer, reflective metals slurry is brushed, at room temperature stand 20 hours, dry 15 minutes in 100 DEG C after levelling, form the reflection green body layer that thickness is 0.001mm, wherein, reflective metals slurry includes reflective metals powder, assistant metal powder, the first glass dust and the first organic carrier, and the mass ratio of reflective metals powder and the first glass dust is 8:1, reflective metals powder is particle diameter is the spherical aluminium particles of 100 nanometers～10 microns, and the first glass dust is the first glass dust is borosilicate glass powder.First organic carrier is the mixture of ethyl cellulose and tributyl citrate and tributyl 2-acetylcitrate.And first the mass ratio of organic carrier and reflective metals powder be 0.5:1.The mass ratio of assistant metal powder and reflective metals powder is 0.6:1, and assistant metal powder is platinum powder.
(3) fluorescent material is pressed into lamellar, sintered, obtain fluorescence coating.
(4) fluorescence coating is laminated in reflection green body layer, sinters 0.5 hour through 800 DEG C, formed and stack gradually in holding the reflecting layer and fluorescence coating burnt on substrate；Reflecting layer is separated with release layer, so that reflecting layer departs from holds burning substrate, and by the remaining release layer removed on reflecting layer of polishing, obtains reflecting layer and the fluorescence coating of stacking.
(5) on the heat-conducting substrate that thickness is 4mm, the layer gold that thickness is 80 microns it is coated with, in layer gold, coating thickness is 1um silver slurry, reflective layer is laminated on silver slurry, heated, obtain metal adhesion layer, and reflecting layer and silver layer are bonded together by metal adhesion layer, obtain the light conversion device of the present embodiment.Wherein, the material of heat-conducting substrate is the composite of copper and Graphene；The thickness of silver layer is 0.8 micron.
Embodiment 7
The preparation process of the light conversion device of the present embodiment is as follows:
(1) burning substrate is held in offer, holding coating demoulding slurry on burning substrate, dries through 150 DEG C, 600 DEG C of sintering, forms the release layer that thickness is 10 microns, and wherein, demoulding slurry includes white particles and organic carrier, and white particles is in yittrium oxide；Organic carrier is made up of bonding agent and organic solvent.Wherein, bonding agent is ethyl cellulose；Organic solvent is terpineol, tributyl citrate and tributyl 2-acetylcitrate.
(2) on release layer, reflective metals slurry is brushed, at room temperature stand 20 minutes, dry 20 minutes in 100 DEG C after levelling, form the reflection green body layer that thickness is 0.9mm, wherein, reflective metals slurry includes reflective metals powder, assistant metal powder, the first glass dust and the first organic carrier, and the mass ratio of reflective metals powder and the first glass dust is 9:1, reflective metals powder is particle diameter is the lamellar Argent grain of 500 nanometers～800 nanometers, and the first glass dust is the first glass dust is borosilicate glass powder.First organic carrier is the mixture of ethyl cellulose and terpineol, butyl carbitol and butyl carbitol ester.And first the mass ratio of organic carrier and reflective metals powder be 0.5:1.The mass ratio of assistant metal powder and reflective metals powder is 0.7:1, and assistant metal powder is platinum powder.
(3) fluorescent material is mixed with pottery sintering aid, successively through molding and sintering, obtain fluorescence diaphragm.Wherein, fluorescent material is 100:10 with the mass ratio of pottery sintering aid；Pottery sintering aid is magnesium hydroxide.
(4) fluorescence coating is laminated in reflection green body layer, sinters 0.5 hour through 800 DEG C, formed and stack gradually in holding the reflecting layer and fluorescence coating burnt on substrate；Reflecting layer is separated with release layer, so that reflecting layer departs from holds burning substrate, and by the remaining release layer removed on reflecting layer of polishing, obtains reflecting layer and the fluorescence coating of stacking.
(5) polishing reflecting layer is away from the one side of fluorescence coating, so that the metal in reflecting layer exposes.
(6) providing thickness is the heat-conducting substrate of 0.5mm, and on heat-conducting substrate, coating thickness is the silver slurry of 20 microns, reflective layer is laminated on silver slurry, heated, form metal adhesion layer, and reflecting layer and heat-conducting substrate are bonded together by metal adhesion layer, obtain the light conversion device of the present embodiment.Wherein, the material of heat-conducting substrate is copper；The thickness of solder(ing) paste is 20 microns.
Embodiment 8
The preparation process of the light conversion device of the present embodiment is as follows:
(1) burning substrate is held in offer, holding coating demoulding slurry on burning substrate, dries through 100 DEG C, 700 DEG C of sintering, forms the release layer that thickness is 10 microns, and wherein, demoulding slurry includes white particles and organic carrier, and white particles is barium sulfate；Organic carrier is made up of bonding agent and organic solvent.Wherein, bonding agent is ethyl cellulose；Organic solvent is in tributyl citrate and tributyl 2-acetylcitrate.
(2) on release layer, reflective metals slurry is brushed, at room temperature stand 30 minutes, dry 30 minutes in 100 DEG C after levelling, form the reflection green body layer that thickness is 0.6mm, wherein, reflective metals slurry includes reflective metals powder, assistant metal powder, the first glass dust and the first organic carrier, and the mass ratio of reflective metals powder and the first glass dust is 12:1, reflective metals powder is particle diameter is the lamellar Argent grain of 10 nanometers～800 nanometers, and the first glass dust is the first glass dust is silicate glass powder.First organic carrier is the mixture of ethyl cellulose and terpineol and butyl carbitol, and the mass ratio of the first organic carrier and reflective metals powder is 0.5:1.The mass ratio of assistant metal powder and reflective metals powder is 0.9:1, and assistant metal powder is platinum powder.
(3) fluorescent material, the 3rd glass dust and the 3rd organic carrier are mixed, successively through molding and sintering, obtain fluorescence diaphragm.Wherein, the mass ratio of fluorescent material and the 3rd glass dust is 0.01:99；3rd glass dust is silicate glass powder, and the 3rd organic carrier is ethyl cellulose type carrier.
(4) fluorescence coating is laminated in reflection green body layer, sinters 10 minutes through 900 DEG C, formed and stack gradually in holding the reflecting layer and fluorescence coating burnt on substrate；Reflecting layer is separated with release layer, so that reflecting layer departs from holds burning substrate, and by the remaining release layer removed on reflecting layer of polishing, obtains reflecting layer and the fluorescence coating of stacking.
(5) polishing reflecting layer is away from the one side of fluorescence coating, so that the metal in reflecting layer exposes.
(6) on the heat-conducting substrate that thickness is 1.5mm, the silver layer that thickness is 1 micron it is coated with, coating gold tinol on silver layer, reflective layer is laminated on gold tinol, heated, form metal adhesion layer, and reflecting layer and silver layer are bonded together by metal adhesion layer, obtain the light conversion device of the present embodiment.Wherein, the material of heat-conducting substrate is aluminum；The thickness of solder(ing) paste is 100 microns.
Embodiment 9
The preparation process of the light conversion device of the present embodiment is as follows:
(1) burning substrate is held in offer, holding coating demoulding slurry on burning substrate, dries through 200 DEG C, 800 DEG C of sintering, forms the release layer that thickness is 10 microns, and wherein, demoulding slurry includes white particles and organic carrier, and white particles is boron nitride；Organic carrier is made up of bonding agent and organic solvent.Wherein, bonding agent is ethyl cellulose；Organic solvent is the mixture of terpineol, butyl carbitol, butyl carbitol ester, tributyl citrate and tributyl 2-acetylcitrate.
(2) blade coating reflective metals slurry on release layer, at room temperature stand 18 minutes, dry 12 minutes in 100 DEG C after levelling, forming thickness is that 1mm reflects green body layer, wherein, reflective metals slurry includes reflective metals powder, assistant metal powder, the first glass dust and the first organic carrier, and the mass ratio of reflective metals powder and the first glass dust is 3:1, reflective metals powder is particle diameter is the flake aluminum particles of 1 micron～10 microns, and the first glass dust is the first glass dust is silicate glass powder.First organic carrier is the mixture of ethyl cellulose and butyl carbitol ester and tributyl citrate, and the mass ratio of the first organic carrier and reflective metals powder is 0.5:1.The mass ratio of assistant metal powder and reflective metals powder is 1:1, and assistant metal powder is palladium powder.
(3) blade coating fluorescent slurry in reflection green body layer, dries 0.2 hour in 200 DEG C, and the thickness of formation is the fluorescence green body layer of 0.5mm, sinters 15 minutes hours then through 900 DEG C, forms the reflecting layer and fluorescence coating that stack gradually on release layer；Reflecting layer is separated with release layer, so that reflecting layer departs from holds burning substrate, and by the remaining release layer removed on reflecting layer of polishing, obtains reflecting layer and the fluorescence coating of stacking.Wherein, fluorescent slurry includes fluorescent material, the second glass dust and the second organic carrier, and the mass ratio of fluorescent material and the second glass dust is 1:99, and the second glass dust is silicate glass powder, and the softening point temperature of the second glass dust and the first glass dust differs 200 DEG C；The quality of the second organic carrier and the mass ratio of fluorescent material are 0.01:1.
(4) polishing reflecting layer is away from the one side of fluorescence coating, so that the metal in reflecting layer exposes.
(5) on the heat-conducting substrate that thickness is 2.5mm, the silver layer that thickness is 1 micron it is coated with, coated with indium tinol on silver layer, reflective layer is laminated on indium tinol, heated, form metal adhesion layer, and reflecting layer and silver layer are bonded together by metal adhesion layer, obtain the light conversion device of the present embodiment.Wherein, the material of heat-conducting substrate is the composite of copper and graphite；The thickness of solder(ing) paste is 50 microns.
Comparative example 1
The preparation process of the light conversion device of comparative example 1 is as follows:
(1) providing heat-conducting substrate, on heat-conducting substrate, blade coating reflection slurry, at room temperature stands 10min, in 100 DEG C of dry 20min after levelling, form the reflection green body layer that thickness is 0.005mm, wherein, heat-conducting substrate is aluminium nitride substrate, and the thickness of heat-conducting substrate is 5mm；Reflection slurry includes white reflective particle (aluminium oxide), the first glass dust and the first organic carrier；The mass ratio of white reflective particle (aluminium oxide) and the first glass dust is 1:1, white reflective particle is particle diameter is the spherical particle of 100 nanometers～1 micron, first glass dust is silicate glass powder, first organic carrier is the mixture of ethyl cellulose and terpineol, and the mass ratio of the quality of the first organic carrier and white reflective particle is 0.5:1.
(2) in reflection green body layer, brush fluorescent slurry, dry 0.5 hour in 100 DEG C, form the fluorescence green body layer that thickness is 0.1mm, sinter 10min in 900 DEG C, heat-conducting substrate is formed reflecting layer and the fluorescence coating of porous.Wherein, fluorescent slurry includes fluorescent material, the second glass dust and the second organic carrier, and the mass ratio of fluorescent material and the second glass dust is 1:1, and the second glass dust can be silicate glass powder, and the softening point temperature of the second glass dust and the first glass dust is equal；The quality of the second organic carrier and the mass ratio of fluorescent material are 1:1, and the second organic carrier is the mixture of ethyl cellulose, terpineol and butyl carbitol.
nullThe light conversion device of the light conversion device of embodiment 1 and comparative example 1 use same blue laser as excitation source，Obtain the light conversion device of embodiment 1 luminous intensity with the light conversion device of comparative example 1 along with the change curve driving electric current of blue light source，As shown in Figure 3，As can see from Figure 3，When initial less driving electric current，The luminous intensity of the light conversion device of embodiment 1 and comparative example 1 is close，But along with driving the raising of electric current，The luminous intensity of the light conversion device of embodiment 1 is substantially high than the luminous flux of the light conversion device of comparative example 1，And when laser drive current brings up to 0.8A，The luminous intensity dramatic drop-off of the light conversion device of comparative example 1，Increase further and drive electric current，Due to the heat effect that it is higher，Fluorescence coating can not bear high power laser light and excite and quencher，And the light conversion device of embodiment 1 still shows stable high light flux light output driving of 1.5A under electric current，Illustrate that it has relatively low thermal resistance and the stronger capacity of heat transmission.It can thus be seen that light conversion device provided by the invention still has better light efficiency and reliability when higher source luminance.And the light conversion device of embodiment 2～9 has the intensity profile of light emission similar with the light conversion device of embodiment 1, its performance is similar to the light conversion device of embodiment 1, does not repeat them here.
Obviously, the light conversion device of embodiment 1～9 has higher thermal conductivity, also has higher reflectance and relatively low thermal resistance simultaneously.
Each technical characteristic of embodiment described above can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics is absent from contradiction, all it is considered to be the scope that this specification is recorded.
Embodiment described above only have expressed the several embodiments of the present invention, and it describes comparatively concrete and detailed, but can not therefore be construed as limiting the scope of the patent.It should be pointed out that, for the person of ordinary skill of the art, without departing from the inventive concept of the premise, it is also possible to making some deformation and improvement, these broadly fall into protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.

Claims (15)

1. a light conversion device, it is characterized in that, including heat-conducting substrate and stack gradually the metal adhesion layer on described heat-conducting substrate, fine and close reflecting layer and fluorescence coating, described reflecting layer is obtained by reflective metals slurry is sintered, it is 1:1～19.9:0.1 that described reflective metals slurry includes the mass ratio of reflective metals powder, the first glass dust and the first organic carrier, described reflective metals powder and described first glass dust；Described reflective metals powder at least one in argentum powder and aluminium powder, described metal adhesion layer is soldering layer, alumel layer or low-temperature sintering silver layer.
2. light conversion device according to claim 1, it is characterised in that the material of described heat-conducting substrate is copper.
3. light conversion device according to claim 1, it is characterized in that, the material of described heat-conducting substrate is the composite of the composite of aluminum, copper and diamond or copper and graphite, described light conversion device also includes the intermediate metal being laminated on described heat-conducting substrate, described intermediate metal is silver layer, wherein, described metal adhesion layer is laminated on described intermediate metal；Or, described intermediate metal includes stacking gradually the nickel dam on described heat-conducting substrate and layer gold, and described metal adhesion layer is laminated in described layer gold.
4. the preparation method of a light conversion device, it is characterised in that comprise the steps:
Form fine and close reflecting layer and the fluorescence coating of stacking, wherein, described reflecting layer is obtained by reflective metals slurry is sintered, and described reflective metals slurry includes the mass ratio 1:1～19.9:0.1 of reflective metals powder, the first glass dust and the first organic carrier, described reflective metals powder and described first glass dust；Described reflective metals powder at least one in argentum powder and aluminium powder；And
Thering is provided heat-conducting substrate, adhered to each other by metal adhesive material and described heat-conducting substrate away from the one side of described fluorescence coating in described reflecting layer, obtain light conversion device, wherein, described metal adhesive material is tinol, alumel or low-temperature sintering silver slurry.
5. the preparation method of light conversion device according to claim 4, it is characterised in that the material of described heat-conducting substrate is copper.
6. the preparation method of light conversion device according to claim 4, it is characterised in that the material of described heat-conducting substrate is the composite of the composite of aluminum, copper and diamond or copper and graphite；In the step that described reflecting layer is adhered to each other by described metal adhesive material and described heat-conducting substrate away from the one side of described fluorescence coating particularly as follows: on described heat-conducting substrate silver-plated formation intermediate metal, then, described reflecting layer is bonded together by described metal adhesive material and described intermediate metal away from the one side of described fluorescence coating；
Or, in the step that described reflecting layer is adhered to each other by described metal adhesive material and described heat-conducting substrate away from the one side of described fluorescence coating particularly as follows: on described heat-conducting substrate nickel plating form nickel dam, then gold-plated to form layer gold on nickel dam, obtain intermediate metal, then, described reflecting layer is bonded together by described metal adhesive material and described layer gold away from the one side of described fluorescence coating.
7. the preparation method of light conversion device according to claim 4, it is characterized in that, form the reflecting layer of described stacking and the step of fluorescence coating particularly as follows: provide described fluorescence coating, described fluorescence coating is coated with described reflective metals slurry, drying, obtaining described reflection green body layer, then through sintering, cambium layer is laminated on the described reflecting layer on described fluorescence coating.
8. the preparation method of light conversion device according to claim 4, it is characterized in that, form the reflecting layer of described stacking and the step of fluorescence coating particularly as follows: provide and hold burning substrate, described holding, burning substrate is coated with described reflective metals slurry, drying, forms reflection green body layer；Described reflection green body layer is coated with fluorescent slurry, drying, forms fluorescence green body layer, then through sintering, formed and stack gradually in the described described reflecting layer and described fluorescence coating held and burn on substrate；Hold burning substrate described in removal, obtain reflecting layer and the fluorescence coating of described stacking；Wherein, described fluorescent slurry includes fluorescent material, the second glass dust and the second organic carrier, and the softening point temperature of described second glass dust and described first glass dust is more or less the same in 400 DEG C.
9. the preparation method of light conversion device according to claim 4, it is characterized in that, form the reflecting layer of described stacking and the step of fluorescence coating particularly as follows: provide and hold burning substrate, described holding, burning substrate is coated with described reflective metals slurry, drying, forms reflection green body layer；Described fluorescence coating is provided, described fluorescence coating is laminated in described reflection green body layer, sintered, formed and stack gradually in the described described reflecting layer and described fluorescence coating held and burn on substrate；Hold burning substrate described in removal, obtain reflecting layer and the fluorescence coating of described stacking.
10. the preparation method of light conversion device according to claim 8 or claim 9, it is characterised in that after holding the step burning substrate described in removing, also include the described reflecting layer one side away from described fluorescence coating of polishing, so that the metal in described reflecting layer exposes.
11. the preparation method of light conversion device according to claim 8 or claim 9, it is characterized in that, before the described step held and be coated with described reflective metals slurry on burning substrate, described in being additionally included in, hold coating demoulding slurry on burning substrate, drying and sintering, form release layer；Wherein, described release layer is coated with described reflective metals slurry.
12. the preparation method of the light conversion device according to claim 7 or 9, it is characterised in that also including the preparation process of described fluorescence coating, the preparation process of described fluorescence coating includes: fluorescent material is pressed into lamellar, sintered, obtain described fluorescence coating；
Or, the preparation process of described fluorescence coating includes: is mixed with pottery sintering aid by fluorescent material, successively through molding and sintering, obtains described fluorescence coating；
Or, the preparation process of described fluorescence coating includes: fluorescent material, the 3rd glass dust and the 3rd organic carrier is mixed, successively through molding and sintering, obtains described fluorescence coating.
13. the preparation method of light conversion device according to claim 4, it is characterised in that described reflective metals powder is sheet-like particle or spherical particle, or the mixture that described reflective metals powder is sheet-like particle and spherical particle.
14. the preparation method of light conversion device according to claim 4, it is characterised in that the particle diameter of described reflective metals powder is 10 nanometers～10 microns.
15. the application that the light conversion device described in claims 1 to 3 any one is in the light-source system of light fixture or display.
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