CN105762239B - Light conversion device and its preparation method and application - Google Patents
Light conversion device and its preparation method and application Download PDFInfo
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- CN105762239B CN105762239B CN201610224386.3A CN201610224386A CN105762239B CN 105762239 B CN105762239 B CN 105762239B CN 201610224386 A CN201610224386 A CN 201610224386A CN 105762239 B CN105762239 B CN 105762239B
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- 238000006243 chemical reaction Methods 0.000 title claims abstract description 111
- 238000002360 preparation method Methods 0.000 title claims abstract description 52
- 239000000843 powder Substances 0.000 claims abstract description 327
- 229910052751 metal Inorganic materials 0.000 claims abstract description 264
- 239000002184 metal Substances 0.000 claims abstract description 264
- 150000002739 metals Chemical class 0.000 claims abstract description 148
- 239000011248 coating agent Substances 0.000 claims abstract description 143
- 238000000576 coating method Methods 0.000 claims abstract description 143
- 239000000758 substrate Substances 0.000 claims abstract description 130
- 239000011521 glass Substances 0.000 claims abstract description 124
- 239000002002 slurry Substances 0.000 claims abstract description 96
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 57
- 238000005245 sintering Methods 0.000 claims abstract description 57
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 25
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000004411 aluminium Substances 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims description 49
- 239000002245 particle Substances 0.000 claims description 39
- 229910052709 silver Inorganic materials 0.000 claims description 38
- 239000004332 silver Substances 0.000 claims description 38
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 32
- 229910052802 copper Inorganic materials 0.000 claims description 32
- 239000010949 copper Substances 0.000 claims description 32
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 26
- 238000001035 drying Methods 0.000 claims description 23
- 239000002131 composite material Substances 0.000 claims description 22
- 239000000853 adhesive Substances 0.000 claims description 21
- 230000001070 adhesive effect Effects 0.000 claims description 21
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 21
- 229910052737 gold Inorganic materials 0.000 claims description 21
- 239000010931 gold Substances 0.000 claims description 21
- 239000000203 mixture Substances 0.000 claims description 18
- 238000005498 polishing Methods 0.000 claims description 14
- 229910052759 nickel Inorganic materials 0.000 claims description 13
- 229910003460 diamond Inorganic materials 0.000 claims description 11
- 239000010432 diamond Substances 0.000 claims description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 10
- 229910002804 graphite Inorganic materials 0.000 claims description 9
- 239000010439 graphite Substances 0.000 claims description 9
- 229910000809 Alumel Inorganic materials 0.000 claims description 8
- 239000012798 spherical particle Substances 0.000 claims description 8
- 238000009766 low-temperature sintering Methods 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 6
- 241001465382 Physalis alkekengi Species 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 307
- 239000001856 Ethyl cellulose Substances 0.000 description 22
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical group CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 22
- ZFOZVQLOBQUTQQ-UHFFFAOYSA-N Tributyl citrate Chemical compound CCCCOC(=O)CC(O)(C(=O)OCCCC)CC(=O)OCCCC ZFOZVQLOBQUTQQ-UHFFFAOYSA-N 0.000 description 22
- 229920001249 ethyl cellulose Polymers 0.000 description 22
- 235000019325 ethyl cellulose Nutrition 0.000 description 22
- 239000007767 bonding agent Substances 0.000 description 20
- 239000003960 organic solvent Substances 0.000 description 20
- RBNWAMSGVWEHFP-UHFFFAOYSA-N trans-p-Menthane-1,8-diol Chemical compound CC(C)(O)C1CCC(C)(O)CC1 RBNWAMSGVWEHFP-UHFFFAOYSA-N 0.000 description 17
- 230000015572 biosynthetic process Effects 0.000 description 15
- -1 butyl carbitol ester Chemical class 0.000 description 15
- 239000005368 silicate glass Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 14
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 13
- 239000000919 ceramic Substances 0.000 description 13
- 239000005388 borosilicate glass Substances 0.000 description 12
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 11
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 10
- 238000005476 soldering Methods 0.000 description 10
- 206010013786 Dry skin Diseases 0.000 description 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 9
- 238000000926 separation method Methods 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 238000002310 reflectometry Methods 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- PESZCXUNMKAYME-UHFFFAOYSA-N Citroflex A-4 Chemical compound CCCCOC(=O)CC(O)(C(=O)OCCCC)C(C(C)=O)C(=O)OCCCC PESZCXUNMKAYME-UHFFFAOYSA-N 0.000 description 6
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 6
- 229910052738 indium Inorganic materials 0.000 description 6
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 6
- 238000007650 screen-printing Methods 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- 229910052797 bismuth Inorganic materials 0.000 description 4
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 4
- 230000001680 brushing effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- YIXJRHPUWRPCBB-UHFFFAOYSA-N magnesium nitrate Chemical compound [Mg+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O YIXJRHPUWRPCBB-UHFFFAOYSA-N 0.000 description 4
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- 229910052582 BN Inorganic materials 0.000 description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000006071 cream Substances 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 3
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 3
- 239000000347 magnesium hydroxide Substances 0.000 description 3
- 239000000395 magnesium oxide Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000005315 stained glass Substances 0.000 description 3
- NGDQQLAVJWUYSF-UHFFFAOYSA-N 4-methyl-2-phenyl-1,3-thiazole-5-sulfonyl chloride Chemical compound S1C(S(Cl)(=O)=O)=C(C)N=C1C1=CC=CC=C1 NGDQQLAVJWUYSF-UHFFFAOYSA-N 0.000 description 2
- 244000248349 Citrus limon Species 0.000 description 2
- 235000005979 Citrus limon Nutrition 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical group CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
- 125000000218 acetic acid group Chemical group C(C)(=O)* 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- ALSTYHKOOCGGFT-KTKRTIGZSA-N (9Z)-octadecen-1-ol Chemical compound CCCCCCCC\C=C/CCCCCCCCO ALSTYHKOOCGGFT-KTKRTIGZSA-N 0.000 description 1
- QZCLKYGREBVARF-UHFFFAOYSA-N Acetyl tributyl citrate Chemical compound CCCCOC(=O)CC(C(=O)OCCCC)(OC(C)=O)CC(=O)OCCCC QZCLKYGREBVARF-UHFFFAOYSA-N 0.000 description 1
- 229910017083 AlN Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical group [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 241000416536 Euproctis pseudoconspersa Species 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- NPXOKRUENSOPAO-UHFFFAOYSA-N Raney nickel Chemical compound [Al].[Ni] NPXOKRUENSOPAO-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229940055577 oleyl alcohol Drugs 0.000 description 1
- XMLQWXUVTXCDDL-UHFFFAOYSA-N oleyl alcohol Natural products CCCCCCC=CCCCCCCCCCCO XMLQWXUVTXCDDL-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000011297 pine tar Substances 0.000 description 1
- 229940068124 pine tar Drugs 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 125000005624 silicic acid group Chemical group 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Optical Elements Other Than Lenses (AREA)
- Led Device Packages (AREA)
Abstract
The present invention relates to a kind of light conversion devices and its preparation method and application.Soldering-tin layer, the fine and close reflecting layer being laminated on soldering-tin layer and the fluorescence coating being laminated on reflecting layer that the light conversion device includes heat-conducting substrate, is laminated on heat-conducting substrate, reflecting layer is obtained by reflective metals slurry through sintering, reflective metals slurry includes reflective metals powder, the first glass powder and the first organic carrier, the mass ratio 1 of reflective metals powder and the first glass powder:1~19.9:0.1；Reflective metals powder is selected from least one of silver powder and aluminium powder.The reflecting layer of above-mentioned light conversion device has higher reflecting properties, higher thermal conductivity and lower thermal resistance.
Description
Technical field
The present invention relates to illumination and display fields, more particularly to a kind of light conversion device and its preparation method and application.
Background technology
Solid State Laser light source of new generation becomes the desired light of substitution high-pressure sodium lamp since its high brightness, stability are high
Source.Currently, laser fluorescence powder light source technology therein due to blue laser excite the light converter device containing fluorescent powder, brightness compared with
LED improves an order of magnitude or more, it is thus achieved that the laser display and illumination of high brightness low cost become a reality, and gradually sends out
Transform into one of the mainstream technology for laser light source.
Current more common light converter device is reflective structure, however the reflecting layer of existing reflective structure is more
Pore structure, thermal resistance is higher, and heat conductivity is bad, is unfavorable for the heat dissipation of power light source, directly affects the brightness of colour wheel and reliable
Property.Although can solve the problems, such as that its thermal resistance is higher by plating metallic reflective coating, related to using the colour wheel of plating metallic reflective coating
And multiple techniques such as plating transition film, metallic reflective coating, metal protective film, soldering pad layer and soldering layer, process is complicated, cost
Height, and the colour wheel preparation difficulty bigger that area is larger, it is difficult to realize mass production.
Invention content
Based on this, it is necessary to provide a kind of high brightness and the light conversion device of high reliability.
In addition, also providing a kind of preparation method by above-mentioned light conversion device and its application.
A kind of light conversion device, including heat-conducting substrate and stack gradually on the heat-conducting substrate metal adhesion layer,
Fine and close reflecting layer and fluorescence coating, the reflecting layer are obtained by reflective metals slurry through sintering, and the reflective metals slurry includes
Reflective metals powder, the first glass powder and the first organic carrier, the mass ratio 1 of the reflective metals powder and first glass powder:1
~19.9:0.1；The reflective metals powder is selected from least one of silver powder and aluminium powder, and the metal adhesion layer is soldering layer, aluminium
Nickel alloy layer either low-temperature sintering silver layer.
The material of the heat-conducting substrate is copper in one of the embodiments,.
The material of the heat-conducting substrate is the composite material or copper of aluminium, copper and diamond in one of the embodiments,
With the composite material of graphite, the light conversion device further includes intermediate metal, and the intermediate metal is silver layer, wherein institute
Metal adhesion layer is stated to be laminated on the intermediate metal；Alternatively, the intermediate metal includes stacking gradually in the heat conduction
Nickel layer on substrate and layer gold, the metal adhesion layer are laminated in the layer gold.
A kind of preparation method of light conversion device, includes the following steps：
Form the fine and close reflecting layer and fluorescence coating of stacking, wherein the reflecting layer is by reflective metals slurry through being sintered
It arrives, the reflective metals slurry includes reflective metals powder, the first glass powder and the first organic carrier, the reflective metals powder and institute
State the mass ratio 1 of the first glass powder:1~19.9:0.1；The reflective metals powder is selected from least one of silver powder and aluminium powder；And
Heat-conducting substrate is provided, one side of the reflecting layer far from the fluorescence coating is led by metal adhesive material with described
Hot substrate is adhered to each other, and obtains light conversion device, wherein the metal adhesive material is tinol, alumel or low temperature
It is sintered silver paste.
The material of the heat-conducting substrate is copper in one of the embodiments,.
In one of the embodiments, the material of the heat-conducting substrate be aluminium, the composite material of copper and diamond or copper and
The composite material of graphite；One side of the reflecting layer far from the fluorescence coating is being led by the metal adhesive material with described
The step of hot substrate is adhered to each other be specially：It is coated with silver on the heat-conducting substrate and forms intermediate metal, it then, will be described
One side of the reflecting layer far from the fluorescence coating is bonded together by the metal adhesive material with the intermediate metal；
Alternatively, one side of the reflecting layer far from the fluorescence coating is passed through the metal adhesive material and the heat conduction
The step of substrate is adhered to each other be specially：Nickel plating forms nickel layer on the heat-conducting substrate, then gold-plated with shape on nickel layer
At layer gold, intermediate metal is obtained, then, one side of the reflecting layer far from the fluorescence coating is passed through into the metal adhesive material
Material is bonded together with the layer gold.
The step of reflecting layer and fluorescence coating for forming the stacking in one of the embodiments, is specially：Described in offer
Fluorescence coating coats the reflective metals slurry on the fluorescence coating, through drying, obtains the reflection green body layer, then through being sintered,
Form the reflecting layer being laminated on the fluorescence coating.
The step of reflecting layer and fluorescence coating for forming the stacking in one of the embodiments, is specially：Burning is held in offer
Substrate coats the reflective metals slurry on burning substrate in described hold, through drying, forms reflection green body layer；In the reflection base
Fluorescent slurry is coated on body layer, through drying, forms fluorescence green body layer, then through sintering, formation is stacked gradually holds burning substrate in described
On the reflecting layer and the fluorescence coating；Burning substrate is held described in removal, obtains reflecting layer and the fluorescence coating of the stacking,
In, the fluorescent slurry includes fluorescent powder, the second glass powder and the second organic carrier, second glass powder and first glass
The softening point temperature of glass powder is not much different in 400 DEG C.
The step of reflecting layer and fluorescence coating for forming the stacking in one of the embodiments, is specially：Burning is held in offer
Substrate coats the reflective metals slurry on burning substrate in described hold, through drying, forms reflection green body layer；The fluorescence is provided
Layer, the fluorescence coating is laminated in the reflection green body layer, through sintering, is formed and is stacked gradually in the institute held and burnt on substrate
State reflecting layer and the fluorescence coating；Burning substrate is held described in removal, obtains reflecting layer and the fluorescence coating of the stacking.
Can also include that polishing is described anti-after holding the step of burning substrate described in removal in one of the embodiments,
One side of the layer far from the fluorescence coating is penetrated, so that the metal in the reflecting layer exposes.
In one of the embodiments, it is described hold burn substrate on coat the reflective metals slurry the step of before, also
Including burning coating demoulding slurry on substrate in described hold, through drying and it is sintered, forms release layer；Wherein, on the release layer
Coat the reflective metals slurry.
Further include the preparation process of the fluorescence coating, the preparation process packet of the fluorescence coating in one of the embodiments,
It includes：Fluorescent powder is compressed into tablet form, through sintering, obtains the fluorescence coating；
Alternatively, the preparation process of the fluorescence coating includes：Fluorescent powder is mixed with ceramic sintering aid, successively through being molded and burning
Knot, obtains the fluorescence coating；
Alternatively, the preparation process of the fluorescence coating includes：Fluorescent powder, third glass powder and third organic carrier are mixed,
Successively through being molded and being sintered, the fluorescence coating is obtained.
The reflective metals slurry further includes assistant metal powder in one of the embodiments, the assistant metal powder choosing
From at least one of palladium powder and platinum powder.
The reflective metals powder is sheet-like particle or spherical particle or reflection gold in one of the embodiments,
Belong to the mixture that powder is sheet-like particle and spherical particle.
The grain size of the reflective metals powder is 10 nanometers~10 microns in one of the embodiments,.
Application of the above-mentioned light conversion device in the light-source system of projector or laser display field.
Since the reflecting layer of above-mentioned light conversion device is obtained by reflective metals slurry through sintering, reflective metals slurry includes anti-
Penetrate metal powder, the first glass powder and the first organic carrier, the mass ratio 1 of reflective metals powder and the first glass powder:1~19.9:
0.1, reflective metals powder is selected from least one of silver powder and aluminium powder, and reflecting layer is fine and close reflecting layer so that reflecting layer has
There are higher reflecting properties, meanwhile, relative to traditional porous reflecting layer, fine and close reflecting layer also has higher thermal conductivity
With lower thermal resistance so that above-mentioned light conversion device has higher brightness.And above-mentioned Wavelength converter and current wavelength
Conversion equipment compares, and the test result under same laser driving current can relatively be released, Wavelength converter of the invention
The laser current higher born, reliability higher.
Description of the drawings
Fig. 1 is the structural schematic diagram of the light conversion device of an embodiment；
Fig. 2 is the flow chart of the preparation method of the light conversion device of an embodiment；
Fig. 3 is luminous flux of the light conversion device of embodiment 1 and comparative example 1 under same blue laser light source with electric current
Variation relation curve graph.
Specific implementation mode
To facilitate the understanding of the present invention, below with reference to relevant drawings to invention is more fully described.In attached drawing
Give the preferred embodiment of the present invention.But the present invention can realize in many different forms, however it is not limited to herein
Described embodiment.Keep the understanding to the disclosure more saturating on the contrary, purpose of providing these embodiments is
It is thorough comprehensive.
Unless otherwise defined, all of technologies and scientific terms used here by the article and belong to the technical field of the present invention
The normally understood meaning of technical staff is identical.Used term is intended merely to description tool in the description of the invention herein
The purpose of the embodiment of body, it is not intended that in the limitation present invention.
As shown in Figure 1, the light conversion device 100 of an embodiment, including it is heat-conducting substrate 110, metal adhesion layer 120, anti-
Penetrate layer 130 and fluorescence coating 140.
Wherein, the material of heat-conducting substrate 110 is copper.Copper is highly heat-conductive material, has preferable heat conductivility and copper can
It bonds together well with metal adhesion layer 120.
Wherein, the thickness of heat-conducting substrate 110 is 0.1~5mm.
Wherein, metal adhesion layer 120 is soldering layer, alumel layer or low-temperature sintering silver layer.Specifically, soldering-tin layer can
Think golden soldering layer, silver-colored soldering layer, bismuth soldering layer or indium soldering layer.Wherein, low-temperature sintering silver layer is referred at 200~400 DEG C
The silver layer that the silver paste of sintering is formed, for example, the silver paste formed by nano silver particles and epoxy resin.
Wherein, reflecting layer 130 is fine and close reflecting layer.Reflecting layer 130 is obtained by reflective metals slurry through sintering.Wherein,
Reflective metals slurry includes reflective metals powder, the first glass powder and the first organic carrier.
Wherein, the mass ratio 1 of reflective metals powder and the first glass powder:1~19.9:0.1.
Wherein, reflective metals powder is selected from least one of silver powder and aluminium powder.Preferably, reflective metals powder is silver powder, by
There is higher reflectivity and higher thermal conductivity in silver powder, the reflecting layer 130 of light conversion device 100 can be made to have higher
Reflectivity and higher thermal conductivity.
Wherein, reflective metals powder can be spherical, strip, rodlike, sheet or spherical；Preferably, reflective metals powder is piece
Shape particle or spherical particle or the mixture that reflective metals powder is sheet-like particle and spherical particle.The reflective metals powder of sheet
Be conducive to the mutual overlap joint between sintered reflective metals powder to form heat conduction network, to improve the anti-of light conversion device 100
Penetrate the thermal conductivity of layer 130；Spherical reflective metals powder particles bulk density is high, and slurry fluidity is good, is conducive to improve light conversion
The thermal conductivity in the reflecting layer 130 of device 100.
Further, the grain size of reflective metals powder is 10 nanometers~10 microns.Larger particle is not easy densified sintering product, smaller
Particle be not easy to disperse.
Wherein, the first glass powder can use coloured glass powder after sintering, sintering can also be used not have later
The glass powder of color；Preferably, the first glass powder is that visible light transmittance of the sintering later in water white transparency and after being sintered exists
80% or more glass powder.For example, the first glass powder is silicate glass powder or borosilicate glass powder.
Wherein, the coefficient of thermal expansion of the first glass powder differs 0~5 × 10 with the coefficient of thermal expansion of heat-conducting substrate 110-6/ K,
To make can be reliably bonded together between the reflecting layer 130 formed and heat-conducting substrate 110 after sintering.Further,
The coefficient of thermal expansion of first glass powder differs 0~3 × 10 with the coefficient of thermal expansion of heat-conducting substrate 110-6/K；Further,
The coefficient of thermal expansion of one glass powder differs 0~1 × 10 with the coefficient of thermal expansion of heat-conducting substrate 110-6/K。
Wherein, the first organic carrier is made of the organic solvent of bonding agent and different boiling.Wherein, bonding agent is that ethyl is fine
Dimension element；Solvent is in terpinol, butyl carbitol, butyl carbitol ester, tributyl citrate and tributyl 2-acetylcitrate
At least one.
Further, reflective metals slurry further includes assistant metal powder, assistant metal powder in palladium powder and platinum powder extremely
Few one kind.Wherein, palladium powder and platinum powder have the adverse effect for the silver migration for reducing high temperature sintering, improve reflectivity stability.Its
In, the mass ratio of assistant metal powder and reflective metals powder is not higher than 1:1.
Wherein, fluorescence coating 140 is mainly formed by fluorescence powder sintering.Fluorescence coating 140 can send out glimmering under the action of exciting light
Light.
Since the reflecting layer 130 of above-mentioned light conversion device 100 is obtained by reflective metals slurry through sintering.Reflective metals slurry
Including reflective metals powder, the first glass powder and the first organic carrier, the mass ratio 1 of reflective metals powder and the first glass powder:1~
19.9:0.1, reflective metals powder is selected from least one of silver powder and aluminium powder, and reflecting layer 130 is fine and close reflecting layer 130, is made
Obtaining reflecting layer 130 has higher reflecting properties, meanwhile, relative to traditional porous reflecting layer 130, fine and close reflecting layer
130 also have higher thermal conductivity and lower thermal resistance, so that light conversion device 100 prepared by the above method is with higher
Light efficiency and brightness, it is more reliable.
Above-mentioned light conversion device 100 can be applied in the light-source system of lamps and lanterns or display.
The light conversion device of two embodiments is similar with the light conversion device of an embodiment, differs only in, heat conduction base
The material of plate is the composite material of aluminium, the composite material of copper and diamond or copper and graphite.At this point, light conversion device further includes
The intermediate metal being laminated on heat-conducting substrate.
Wherein, intermediate metal is silver layer, wherein metal adhesion layer is laminated on intermediate metal.Wherein, metal transfer
Layer to be formed by being coated with.Material can be made to be aluminium, the composite material of copper and diamond or copper and stone by the way that intermediate metal is arranged
The heat-conducting substrate of the composite material of ink is bonded together well with metal adhesion layer.
Alternatively, be embodiment other, intermediate metal includes stacking gradually in nickel layer and layer gold on heat-conducting substrate,
At this point, golden adhesive layer is laminated in layer gold.The intermediate metal can also realize that material is the composite wood of aluminium, copper and diamond
The heat-conducting substrate of material or the composite material of copper and graphite is bonded together well with metal adhesion layer.
As shown in Fig. 2, the preparation method of the light conversion device of an embodiment, the light that can be used for preparing an embodiment turns
The preparation method of changing device, the light conversion device includes the following steps：
Step S210：Form the fine and close reflecting layer and fluorescence coating of stacking, wherein reflecting layer is by reflective metals slurry through burning
Knot obtains.
In the present embodiment, the step of reflecting layer and fluorescence coating for forming stacking is specially：Burning substrate is held in offer, is burnt holding
Reflective metals slurry is coated on substrate, through drying, forms reflection green body layer；Fluorescent slurry is coated in reflection green body layer, through dry
Dry formation fluorescence green body layer, then through sintering, formed stack gradually in hold burn substrate on reflecting layer and fluorescence coating；Burning base is held in removal
Plate, the reflecting layer being laminated and fluorescence coating.
Wherein, can be brushing, blade coating, spraying or screen printing holding the method for burning coating reflective metals slurry on substrate
Brush.And the drying temperature of the drying steps on holding burning substrate after coating reflective metals slurry is 100~200 DEG C.
Wherein, reflective metals slurry includes reflective metals powder, the first glass powder and the first organic carrier.
Wherein, the mass ratio 1 of reflective metals powder and the first glass powder:1~19.9:0.1.
Wherein, reflective metals powder is selected from least one of silver powder and aluminium powder.Preferably, reflective metals powder is silver powder, by
There is higher reflectivity and higher thermal conductivity in silver powder, can make the reflecting layer of light conversion device that there is higher reflectivity
With higher thermal conductivity.
Wherein, reflective metals powder can be spherical, strip, rodlike or sheet, preferably sheet-like particle.Preferably, it reflects
Metal powder is sheet-like particle or spherical particle or the mixture that reflective metals powder is sheet-like particle and spherical particle.Sheet
Reflective metals powder is conducive to the mutual overlap joint between sintered reflective metals powder to form heat conduction network, to improve light converting means
The thermal conductivity in the reflecting layer set；Spherical reflective metals powder particles bulk density is high, and slurry fluidity is good, is conducive to improve light turn
The thermal conductivity in the reflecting layer of changing device.
Further, the grain size of reflective metals powder is 10 nanometers~10 microns.Larger particle is not easy densified sintering product, smaller
Particle be not easy to disperse.
First glass powder can use coloured glass powder after sintering, sintering can also be used not have later coloured
Glass powder；Preferably, the first glass powder be sintering after in water white transparency and be sintered after visible light transmittance 80% with
On glass powder.For example, the first glass powder is silicate glass powder or borosilicate glass powder.
First organic carrier is made of bonding agent and organic solvent.Wherein, bonding agent is ethyl cellulose；Solvent is selected from pine
At least one of oleyl alcohol, butyl carbitol, butyl carbitol ester, tributyl citrate and tributyl 2-acetylcitrate.
Further, reflective metals slurry further includes assistant metal powder, assistant metal powder in palladium powder and platinum powder extremely
Few one kind.Wherein, palladium powder and platinum powder have the adverse effect for the silver migration for reducing high temperature sintering, improve reflectivity stability.Its
In, the mass ratio of assistant metal powder and reflective metals powder is not higher than 1:1.
Further, further include being coated with reflection gold after holding the step of burning coating reflective metals slurry on substrate
Belong to holding for slurry and burn the step of substrate is stood at room temperature, so that reflective metals slurry levelling on holding burning substrate.
Wherein, the thickness for reflecting green body layer is 0.001~1mm.
Wherein, in fluorescent slurry, the mass ratio of fluorescent powder and the second glass powder is 1:0.1~99.
Wherein, the second glass powder is differed with the softening point temperature of the first glass powder is no more than 400 DEG C, so that sintered anti-
It penetrates layer and fluorescence coating can be good at being bonded together.For example, the first glass powder can be silicate glass powder, the second glass powder
It can be borosilicate glass powder；Alternatively, the first glass powder can be borosilicate glass powder, the second glass powder can be silicic acid
Salt glass powder.
Wherein, the second organic carrier is made of bonding agent and organic solvent.Wherein, bonding agent is ethyl cellulose；Solvent
At least one in terpinol, butyl carbitol, butyl carbitol ester, tributyl citrate and tributyl 2-acetylcitrate
Kind.
Wherein, the method for coating fluorescent slurry can be brushing, blade coating, spraying or screen printing in reflection green body layer
Brush.And the drying temperature of the drying steps in reflection green body layer after coating fluorescent slurry is 100~200 DEG C；Sintering temperature
It is 300~960 DEG C.
Wherein, the thickness of fluorescence green body layer is 0.01~1mm.
Further, further include being applied on holding burning substrate before holding the step of burning coating reflective metals slurry on substrate
Demoulding slurry is covered, through dry and sintering, forms release layer；Wherein, reflective metals slurry is coated on release layer.And burning is held in removal
The step of substrate is specially：By reflecting layer and demoulding layer separation.Wherein, with after demoulding layer separation, release layer is adhered in reflecting layer
It holds and burns on substrate.Wherein, reflecting layer is with after demoulding layer separation, and a small amount of release layer adhered on reflecting layer is by grinding off.
Wherein, demoulding slurry includes white particles and organic carrier.Wherein, white particles are boron nitride, aluminium oxide, oxidation
One kind in titanium, yttrium oxide and barium sulfate；Organic carrier is made of bonding agent and organic solvent.Wherein, bonding agent is that ethyl is fine
Dimension element；Organic solvent is selected from terpinol, butyl carbitol, three fourth of butyl carbitol ester, tributyl citrate and acetyl tributyl citrate
At least one of ester.Wherein, it is 80~200 holding the drying temperature for burning the drying steps on substrate after coating demoulding slurry
DEG C, sintering temperature is 400~900 DEG C.
Further, further include polishing one side of the reflecting layer far from fluorescence coating after the step of burning substrate is held in removal, with
The metal in reflecting layer is set to expose.By polish reflecting layer so that removal reflecting layer in sintering process with hold burning substrate between
The glass part of the low thermal resistance of formation, to make the luminous of light conversion device more stablize.
Step S220：Heat-conducting substrate is provided, one side of the reflecting layer far from fluorescence coating is passed through into metal adhesive material and heat conduction
Substrate is adhered to each other, and obtains light conversion device.
Wherein, metal adhesive material is tinol, alumel or low-temperature sintering silver paste.Wherein, solder(ing) paste can be gold
Tinol, silver-colored tinol, bismuth tinol or indium tinol.
Wherein, low-temperature sintering silver paste refers to the silver paste that can be sintered at 200~400 DEG C, for example, nano silver particles and ring
The silver paste that oxygen resin is formed.
Wherein, the material of heat-conducting substrate is selected from the composite material and copper of aluminium, the composite material of copper and diamond, copper and graphite
In one kind.These materials are highly heat-conductive material, have preferable heat conductivility.
Wherein, the thickness of heat-conducting substrate is 0.1~5mm.
Wherein, when the composite material that the material of heat-conducting substrate is aluminium, the composite material of copper and diamond or copper and graphite
When；It is specific in the step of being adhered to each other one side of the reflecting layer far from fluorescence coating with heat-conducting substrate by metal adhesive material
For：One side of the reflecting layer far from fluorescence coating is then passed through metal adhesive material by the silver-plated formation intermediate metal on heat-conducting substrate
Material is bonded together with intermediate metal.
Alternatively, when the composite material that the material of heat-conducting substrate is aluminium, the composite material of copper and diamond or copper and graphite
When, it is specific in the step of being adhered to each other one side of the reflecting layer far from fluorescence coating with heat-conducting substrate by metal adhesive material
For：Nickel plating forms nickel layer on heat-conducting substrate, then gold-plated to form layer gold on nickel layer, obtains intermediate metal, then, will
One side of the reflecting layer far from fluorescence coating is bonded together by metal adhesive material with layer gold.
Specifically, when the material of heat-conducting substrate is copper, it may not be necessary to intermediate metal, at this point, directly by reflecting layer
One side far from fluorescence coating is adhered to each other by metal adhesive material and heat-conducting substrate.
Wherein, the thickness of intermediate metal is 0.01~10um.Wherein, on heat-conducting substrate coat metal adhesive material or
The thickness that person coats metal adhesive material on intermediate metal is 1~100um.
The preparation method of above-mentioned light conversion device is easy to operate, is easy to industrialized production, and the system of above-mentioned light conversion device
Preparation Method is sintered to be formed by using the reflective metals slurry containing reflective metals powder and the first glass powder when preparing reflecting layer
Fine and close reflecting layer, and reflective metals powder is selected from least one of silver powder and aluminium powder, has obtained having irreflexive reflecting layer,
So that reflecting layer has higher reflecting properties, meanwhile, relative to traditional porous reflecting layer, fine and close reflecting layer also has
Higher thermal conductivity and lower thermal resistance, so that light conversion device prepared by the above method has higher brightness, more
Ground is reliable.
The light conversion device that the preparation method of the light conversion device of one embodiment is prepared.Due to the light conversion device
It is prepared by the preparation method of above-mentioned light conversion device so that above-mentioned light conversion layer not only has higher reflecting properties, also
With higher thermal conductivity and lower thermal resistance so that light conversion device prepared by the above method has higher brightness, more
It is reliable.
The preparation method of the light conversion device of two embodiments and the preparation method of the light conversion device of an embodiment
Step is roughly the same, differs only in, the preparation method of the light conversion device of two embodiments formation stacking reflecting layer and
The step of fluorescence coating, is different from the preparation method of the light conversion device of an embodiment.
The preparation method of the light conversion device of two embodiments is not used in reflecting layer and the fluorescence coating for forming stacking and is held
Substrate is burnt, but directly forms reflecting layer on fluorescence coating, therefore, the reflecting layer of the formation stacking of two embodiments and fluorescence coating
The step of be specially：Fluorescence coating is provided, reflective metals slurry is coated on fluorescence coating, through drying, forms reflection green body layer, then pass through
Sintering forms the reflecting layer being laminated on fluorescence coating.
Wherein, fluorescence coating can be made by the steps to obtain：Fluorescent powder is compressed into tablet form, through sintering, obtains fluorescence
Layer.
Alternatively, fluorescence coating can also be made by the steps to obtain：Fluorescent powder is mixed with ceramic sintering aid, is passed through successively
Molding and sintering, obtain the fluorescence coating.At this point, fluorescent powder and the mass ratio of ceramic sintering aid are 100:0.01~100:10；
Ceramic sintering aid can be ethyl orthosilicate, magnesia, magnesium nitrate, magnesium hydroxide, yttrium oxide, yttrium nitrate etc..
Or fluorescence coating can also be made by the steps to obtain：Fluorescent powder, third glass powder and third is organic
Carrier mixes, and successively through being molded and being sintered, obtains fluorescence coating.At this point, the mass ratio of fluorescent powder and third glass powder be 0.01~
99:1；Third glass powder can be glass powder commonly used in the art, for example, borosilicate glass powder, silicate glass powder etc..The
Three organic carriers can be organic carrier commonly used in the art, and organic carrier is made of bonding agent and organic solvent.Wherein, it is bonded
Agent is ethyl cellulose；Solvent is selected from terpinol, butyl carbitol, butyl carbitol ester, tributyl citrate and acetyl lemon
At least one of sour tributyl.Wherein, third glass powder may be the same or different with the second glass powder；Third is organic
Carrier may be the same or different with the second organic solvent.
Preferably, the thermal expansion system of the coefficient of thermal expansion and the first glass powder of the fluorescence coating that above-mentioned three kinds of methods are prepared
Number is close, so as to can be securely bonded to together after fluorescence coating and reflecting layer sintering.
Wherein, the method that reflective metals slurry is coated on fluorescence coating can be brushing, blade coating, spraying or screen printing
Brush.
Further, further include being coated with reflective metals after the step of coating reflective metals slurry on fluorescence coating
The step of fluorescence coating of slurry is stood at room temperature, so that reflective metals slurry levelling on fluorescence coating.
The preparation method phase of the preparation method of the light conversion device of two embodiments and the light conversion device of an embodiment
Seemingly, therefore, it may have the effect of the light conversion device of an embodiment.
The light conversion device that the preparation method of the light conversion device of two embodiments is prepared.Due to the light conversion device
It is prepared by the preparation method of above-mentioned light conversion device so that above-mentioned light conversion layer not only has higher reflecting properties, also
With higher thermal conductivity and lower thermal resistance so that light conversion device prepared by the above method has higher light efficiency and bright
Degree, more reliably.
The preparation method of the light conversion device of three embodiments and the preparation method of the light conversion device of an embodiment
Step is roughly the same, differs only in, the preparation method of the light conversion device of three embodiments formation stacking reflecting layer and
The step of the step of fluorescence coating and the reflecting layer and fluorescence coating of the formation stacking of the preparation method of the light conversion device of an embodiment
It is rapid slightly different.
In the step of reflecting layer of the formation stacking of the preparation method of the light conversion device of three embodiments and fluorescence coating,
Holding the step of burning on substrate after formation reflection green body layer is：Fluorescence coating is provided, fluorescence coating is laminated in reflection green body layer, warp
Sintering, formed stack gradually in hold burn substrate on reflecting layer and fluorescence coating；Removal hold burning substrate, the reflecting layer being laminated and
Fluorescence coating.
Wherein, fluorescence coating can be made by the steps to obtain：Fluorescent powder is compressed into tablet form, through sintering, obtains fluorescence
Layer.
Alternatively, fluorescence coating can also be made by the steps to obtain：Fluorescent powder is mixed with ceramic sintering aid, is passed through successively
Molding and sintering, obtain fluorescence coating.At this point, fluorescent powder and the mass ratio of ceramic sintering aid are 100:0.01~100:10；Ceramics
Sintering aid can be ethyl orthosilicate, magnesia, magnesium nitrate, magnesium hydroxide, yttrium oxide, yttrium nitrate etc..
Or fluorescence coating can also be made by the steps to obtain：Fluorescent powder, third glass powder and third is organic
Carrier mixes, and successively through being molded and being sintered, obtains fluorescence coating.At this point, the mass ratio of fluorescent powder and third glass powder be 0.01~
99:1；Third glass powder can be glass powder commonly used in the art, for example, borosilicate glass powder, silicate glass powder etc..The
Three organic carriers can be organic carrier commonly used in the art, and organic carrier is made of bonding agent and organic solvent.Wherein, it is bonded
Agent is ethyl cellulose；Solvent is selected from terpinol, butyl carbitol, butyl carbitol ester, tributyl citrate and acetyl lemon
At least one of sour tributyl.Wherein, third glass powder may be the same or different with the second glass powder；Third is organic
Carrier may be the same or different with the second organic solvent.
Preferably, the thermal expansion system of the coefficient of thermal expansion and the first glass powder of the fluorescence coating that above-mentioned three kinds of methods are prepared
Number is close, so as to can be securely bonded to together after fluorescence coating and reflecting layer sintering.
Wherein, the method that reflective metals slurry is coated on fluorescence coating can be brushing, blade coating, spraying or screen printing
Brush.
The preparation method phase of the preparation method of the light conversion device of three embodiments and the light conversion device of an embodiment
Seemingly, therefore, it may have the effect of the light conversion device of an embodiment.
The light conversion device that the preparation method of the light conversion device of three embodiments is prepared.Due to the light conversion device
It is prepared by the preparation method of above-mentioned light conversion device so that above-mentioned light conversion layer not only has higher reflecting properties, also
With higher thermal conductivity and lower thermal resistance so that light conversion device prepared by the above method has higher light efficiency and bright
Degree, more reliably.
It is specific embodiment part below：
Embodiment 1
The preparation process of the light conversion device of the present embodiment is as follows：
(1) it provides and holds burning substrate, burn coating demoulding slurry on substrate holding, be sintered through 80 DEG C of dryings, then through 400 DEG C, shape
The release layer for being 10 microns at thickness, wherein demoulding slurry includes boron nitride and organic carrier, and organic carrier includes organic molten
Agent, organic carrier are ethyl cellulose, and organic solvent is the mixture of terpinol and butyl carbitol.
(2) reflective metals slurry is brushed on release layer, stands 10 minutes at room temperature, in 100 DEG C dry 20 after levelling
Minute, form the reflection green body layer that thickness is 0.005mm, wherein reflective metals slurry includes reflective metals powder, the first glass powder
With the first organic carrier, the mass ratio of reflective metals powder and the first glass powder is 1:1, reflective metals powder is that grain size is 100 nanometers
~1 micron of sheet Argent grain, the first glass powder are silicate glass powder.First organic carrier is ethyl cellulose and terpinol
Mixture, and the mass ratio of the first organic carrier and reflective metals powder is 0.5:1.
(3) fluorescent slurry is brushed in reflection green body layer, 0.1 hour dry in 100 DEG C, it is the glimmering of 0.05mm to form thickness
Light green body layer, then through 800 DEG C be sintered 0.5 hour, formed stack gradually on release layer reflecting layer and fluorescence coating；By reflecting layer
It is obtained with demoulding layer separation so that reflecting layer, which is detached from, holds burning substrate, and removes the remaining release layer on reflecting layer by polishing
The reflecting layer of stacking and fluorescence coating.Wherein, fluorescent slurry includes fluorescent powder, the second glass powder and the second organic carrier, fluorescent powder
Mass ratio with the second glass powder is 1:0.1, the second glass powder is borosilicate glass powder, and the second glass powder and the first glass
The softening point temperature of powder is equal；The quality of second organic carrier and the mass ratio of fluorescent powder are 0.01:1.
(4) polishing one side of the reflecting layer far from fluorescence coating, so that the metal in reflecting layer exposes.
(5) it is 5 millimeters of heat-conducting substrate to provide thickness, be coated with successively on heat-conducting substrate nickel layer that thickness is 3 microns and
0.05 micron of layer gold coats golden tinol in layer gold, reflective layer is laminated on golden tinol, heated, forms metal
Transition zone, and reflecting layer and layer gold are bonded together by intermediate metal, obtain the light conversion device of the present embodiment.Wherein, it leads
The material of hot substrate is the composite material of copper and diamond；The thickness of solder(ing) paste is 20 microns.
Embodiment 2
The preparation process of the light conversion device of the present embodiment is as follows：
(1) it provides and holds burning substrate, burn coating demoulding slurry on substrate holding, be sintered through 200 DEG C of dryings, then through 900 DEG C, shape
The release layer for being 10 microns at thickness, wherein demoulding slurry includes white particles and organic carrier, and white particles are aluminium oxide；
Organic carrier is made of bonding agent and organic solvent.Wherein, bonding agent is ethyl cellulose；Organic solvent is selected from terpinol, fourth
Base carbitol and butyl carbitol ester.
(2) reflective metals slurry is scratched on release layer, stands 12 minutes at room temperature, in 200 DEG C dry 30 after levelling
Minute, forms thickness as the reflection green body layer of 1mm, wherein reflective metals slurry includes reflective metals powder, assistant metal powder, the
The mass ratio of one glass powder and the first organic carrier, reflective metals powder and the first glass powder is 19.5:1, reflective metals powder is grain
The flake aluminum particles that diameter is 1 micron~10 microns, the first glass powder are borosilicate glass powder.First organic carrier is that ethyl is fine
Dimension element and terpinol and the mixture of butyl carbitol ester, and the mass ratio of the first organic carrier and reflective metals powder is 0.5:1.
The mass ratio of assistant metal powder and reflective metals powder is 1:1, assistant metal powder is palladium powder.
(3) fluorescent slurry is scratched in reflection green body layer, 30 minutes dry in 200 DEG C, the thickness of formation is the fluorescence of 1mm
Green body layer, then through 900 DEG C be sintered 10 minutes, formed stack gradually on release layer reflecting layer and fluorescence coating；By reflecting layer with
Layer separation is demoulded, so that reflecting layer, which is detached from, holds burning substrate, and removes the remaining release layer on reflecting layer by polishing, obtains layer
Folded reflecting layer and fluorescence coating.Wherein, fluorescent slurry includes fluorescent powder, the second glass powder and the second organic carrier, fluorescent powder with
The mass ratio of second glass powder is 1:99, the second glass powder is silicate glass powder, and the second glass powder and the first glass powder
Softening point temperature differs 400 DEG C；.And second organic carrier quality and fluorescent powder mass ratio be 0.01:1.
(4) polishing one side of the reflecting layer far from fluorescence coating, so that the metal in reflecting layer exposes.
(5) it is 0.1 micron of heat-conducting substrate to provide thickness, be coated with successively on heat-conducting substrate thickness be 10 meters of nickel layers and
0.03 micron of layer gold, the golden tinol that coating thickness is 10 microns in layer gold, reflective layer is laminated on golden tinol, is passed through
Heating forms metal adhesion layer, and reflecting layer and layer gold are bonded together by metal adhesion layer, obtains the light conversion of the present embodiment
Device.Wherein, the material of heat-conducting substrate is the composite material of copper and diamond；The thickness of solder(ing) paste is 5 microns.
Embodiment 3
The preparation process of the light conversion device of the present embodiment is as follows：
(1) fluorescent powder is compressed into tablet form, through sintering, obtains fluorescence coating.
(2) reflective metals slurry is sprayed on fluorescence coating, stands levelling at room temperature, then through 80 DEG C of dryings, is formed thick
Degree is the reflection green body layer of 0.5mm, is sintered 0.5 hour then at 850 DEG C, and the reflecting layer being laminated on fluorescence coating is formed.Wherein, instead
It includes reflective metals powder, assistant metal powder, the first glass powder and the first organic carrier, reflective metals powder and first to penetrate metal paste
The mass ratio of glass powder is 10:1, reflective metals powder is the Argent grain and alumina particles for the sheet that grain size is 100 nanometers~10 microns
Mixture, the first glass powder is that the first glass powder is silicate glass powder.First organic carrier is ethyl cellulose, pine tar
The mixture of alcohol, butyl carbitol and butyl carbitol ester, and the mass ratio of the first organic carrier and reflective metals powder is 0.5:
1.The mass ratio of assistant metal powder and reflective metals powder is 0.8:1, assistant metal powder is platinum powder.
(3) it is the silver layer for being coated with thickness on the heat-conducting substrate of 2mm and being 5 microns in thickness, coating thickness is 50 on silver layer
The bismuth tinol of micron, reflective layer is laminated on bismuth tinol, heated, forms metal adhesion layer, and metal adhesion layer will
Reflecting layer is bonded together with silver layer, obtains the light conversion device of the present embodiment.Wherein, the material of heat-conducting substrate is aluminium；Scolding tin
The thickness of cream is 25 microns.
Embodiment 4
The preparation process of the light conversion device of the present embodiment is as follows：
(1) fluorescent powder is mixed with ceramic sintering aid, successively through being molded and being sintered, obtains fluorescence diaphragm.Wherein, fluorescent powder
Mass ratio with ceramic sintering aid is 100:0.01；Ceramic sintering aid is magnesia.
(2) reflective metals slurry is sprayed on fluorescence coating, stands levelling at room temperature, then through 150 DEG C of dryings, is formed thick
Degree is the reflection green body layer of 1mm, is sintered 1 hour then at 600 DEG C, and the reflecting layer being laminated on fluorescence coating is formed.Wherein, reflection gold
It includes reflective metals powder, assistant metal powder, the first glass powder and the first organic carrier to belong to slurry, reflective metals powder and the first glass
The mass ratio of powder is 19.9:0.1, reflective metals powder is the silver of the sheet that grain size is 100 nanometers~500 nanometers and spherical mixing
Grain, the first glass powder is that the first glass powder is borosilicate glass powder.First organic carrier is that ethyl cellulose must with butyl card
The mixture of alcohol, and the mass ratio of the first organic carrier and reflective metals powder is 0.5:1.Assistant metal powder and reflective metals powder
Mass ratio is 0.5:1, assistant metal powder is the mixture of palladium powder and platinum powder.
(3) heat-conducting substrate is provided, reflective layer is laminated on by the indium tinol that coating thickness is 50 microns on heat-conducting substrate
It is heated on indium tinol, metal adhesion layer is formed, and reflecting layer and heat-conducting substrate are bonded together by metal adhesion layer, are obtained
To the light conversion device of the present embodiment.Wherein, the material of heat-conducting substrate is copper；The thickness of solder(ing) paste is 25 microns.
Embodiment 5
The preparation process of the light conversion device of the present embodiment is as follows：
(1) fluorescent powder, third glass powder and third organic carrier are mixed, successively through being molded and being sintered, obtains fluorescent film
Piece.At this point, the mass ratio of fluorescent powder and third glass powder is 0.01:1；Third glass powder is silicate glass powder；Third is organic
Carrier is the mixture of ethyl cellulose, terpinol, butyl carbitol and butyl carbitol ester.
(2) the silk-screen printing reflective metals slurry on fluorescence coating, stands levelling at room temperature, then through 100 DEG C of dryings, shape
It at the reflection green body layer that thickness is 0.1mm, is sintered 1 hour then at 700 DEG C, forms the reflecting layer being laminated on fluorescence coating.Wherein,
Reflective metals slurry includes reflective metals powder, assistant metal powder, the first glass powder and the first organic carrier, reflective metals powder and
The mass ratio of one glass powder is 15:1, reflective metals powder is the spherical silver particles that grain size is 500 nanometers~800 nanometers, the first glass
Glass powder is that the first glass powder is borosilicate glass powder.First organic carrier is the mixing of ethyl cellulose and butyl carbitol ester
Object, and the mass ratio of the first organic carrier and reflective metals powder is 0.5:1.Assistant metal powder and the mass ratio of reflective metals powder are
0.2:1, assistant metal powder is palladium powder.
(3) it is the silver layer for being coated with thickness on the heat-conducting substrate of 3mm and being 50 microns in thickness, thickness is placed on silver layer is
100 microns of alumel paillon, reflective layer is laminated on alumel paillon, adds 12V voltages, aluminium in alumel paillon
Nickel alloy melts to form metal adhesion layer, and reflecting layer and silver layer are bonded together by metal adhesion layer, obtains the present embodiment
Light conversion device.Wherein, the material of heat-conducting substrate is aluminium；The thickness of alumel layer is 100 microns.
Embodiment 6
The preparation process of the light conversion device of the present embodiment is as follows：
(1) it provides and holds burning substrate, burn coating demoulding slurry on substrate holding, through 100 DEG C of dryings, 500 DEG C of sintering are formed thick
The release layer that degree is 10 microns, wherein demoulding slurry includes white particles and organic carrier, and white particles are titanium oxide；It is organic
Carrier is made of bonding agent and organic solvent.Wherein, bonding agent is ethyl cellulose；Organic solvent is terpinol.
(2) reflective metals slurry is brushed on release layer, stands 20 hours at room temperature, in 100 DEG C dry 15 after levelling
Minute, form the reflection green body layer that thickness is 0.001mm, wherein reflective metals slurry includes reflective metals powder, assistant metal
The mass ratio of powder, the first glass powder and the first organic carrier, reflective metals powder and the first glass powder is 8:1, reflective metals powder is
The spherical aluminium particles that grain size is 100 nanometers~10 microns, the first glass powder is that the first glass powder is borosilicate glass powder.First
Organic carrier is ethyl cellulose and tributyl citrate and the mixture of tributyl 2-acetylcitrate.And first organic carrier with
The mass ratio of reflective metals powder is 0.5:1.The mass ratio of assistant metal powder and reflective metals powder is 0.6:1, assistant metal powder is
Platinum powder.
(3) fluorescent powder is compressed into tablet form, through sintering, obtains fluorescence coating.
(4) fluorescence coating is laminated in reflection green body layer, is sintered 0.5 hour through 800 DEG C, formation is stacked gradually in holding burning base
Reflecting layer on plate and fluorescence coating；By reflecting layer and demoulding layer separation, so that reflecting layer, which is detached from, holds burning substrate, and gone by polishing
Except the remaining release layer on reflecting layer, the reflecting layer being laminated and fluorescence coating.
(5) it is the layer gold for being coated with thickness on the heat-conducting substrate of 4mm and being 80 microns in thickness, coating thickness is in layer gold
1um silver pastes, reflective layer is laminated in silver paste, heated, obtains metal adhesion layer, and metal adhesion layer is by reflecting layer and silver layer
It is bonded together, obtains the light conversion device of the present embodiment.Wherein, the material of heat-conducting substrate is the composite wood of copper and graphene
Material；The thickness of silver layer is 0.8 micron.
Embodiment 7
The preparation process of the light conversion device of the present embodiment is as follows：
(1) it provides and holds burning substrate, burn coating demoulding slurry on substrate holding, through 150 DEG C of dryings, 600 DEG C of sintering are formed thick
The release layer that degree is 10 microns, wherein demoulding slurry includes white particles and organic carrier, and white particles are in yttrium oxide；Have
Airborne body is made of bonding agent and organic solvent.Wherein, bonding agent is ethyl cellulose；Organic solvent is terpinol, citric acid
Tributyl and tributyl 2-acetylcitrate.
(2) reflective metals slurry is brushed on release layer, stands 20 minutes at room temperature, in 100 DEG C dry 20 after levelling
Minute, is formed thickness for 0.9mm reflection green body layer, wherein reflective metals slurry include reflective metals powder, assistant metal powder,
The mass ratio of first glass powder and the first organic carrier, reflective metals powder and the first glass powder is 9:1, reflective metals powder is grain size
For 500 nanometers~800 nanometers of sheet Argent grain, the first glass powder is that the first glass powder is borosilicate glass powder.First has
Airborne body is ethyl cellulose and terpinol, the mixture of butyl carbitol and butyl carbitol ester.And first organic carrier with
The mass ratio of reflective metals powder is 0.5:1.The mass ratio of assistant metal powder and reflective metals powder is 0.7:1, assistant metal powder is
Platinum powder.
(3) fluorescent powder is mixed with ceramic sintering aid, successively through being molded and being sintered, obtains fluorescence diaphragm.Wherein, fluorescent powder
Mass ratio with ceramic sintering aid is 100:10；Ceramic sintering aid is magnesium hydroxide.
(4) fluorescence coating is laminated in reflection green body layer, is sintered 0.5 hour through 800 DEG C, formation is stacked gradually in holding burning base
Reflecting layer on plate and fluorescence coating；By reflecting layer and demoulding layer separation, so that reflecting layer, which is detached from, holds burning substrate, and pass through polishing
Remove the remaining release layer on reflecting layer, the reflecting layer being laminated and fluorescence coating.
(5) polishing one side of the reflecting layer far from fluorescence coating, so that the metal in reflecting layer exposes.
(6) heat-conducting substrate that thickness is 0.5mm is provided, the silver paste that coating thickness is 20 microns on heat-conducting substrate will be anti-
It penetrates and is laminated in silver paste layer by layer, it is heated, metal adhesion layer is formed, and reflecting layer and heat-conducting substrate are bonded in one by metal adhesion layer
It rises, obtains the light conversion device of the present embodiment.Wherein, the material of heat-conducting substrate is copper；The thickness of solder(ing) paste is 20 microns.
Embodiment 8
The preparation process of the light conversion device of the present embodiment is as follows：
(1) it provides and holds burning substrate, burn coating demoulding slurry on substrate holding, through 100 DEG C of dryings, 700 DEG C of sintering are formed thick
The release layer that degree is 10 microns, wherein demoulding slurry includes white particles and organic carrier, and white particles are barium sulfate；It is organic
Carrier is made of bonding agent and organic solvent.Wherein, bonding agent is ethyl cellulose；Organic solvent is tributyl citrate and second
In acyl tributyl citrate.
(2) reflective metals slurry is brushed on release layer, is allowed to stand at room temperature for 30 minutes, in 100 DEG C dry 30 after levelling
Minute, is formed thickness for 0.6mm reflection green body layer, wherein reflective metals slurry include reflective metals powder, assistant metal powder,
The mass ratio of first glass powder and the first organic carrier, reflective metals powder and the first glass powder is 12:1, reflective metals powder is grain
The sheet Argent grain that diameter is 10 nanometers~800 nanometers, the first glass powder is that the first glass powder is silicate glass powder.First is organic
Carrier is the mixture of ethyl cellulose and terpinol and butyl carbitol, and the quality of the first organic carrier and reflective metals powder
Than being 0.5:1.The mass ratio of assistant metal powder and reflective metals powder is 0.9:1, assistant metal powder is platinum powder.
(3) fluorescent powder, third glass powder and third organic carrier are mixed, successively through being molded and being sintered, obtains fluorescent film
Piece.Wherein, the mass ratio of fluorescent powder and third glass powder is 0.01:99；Third glass powder is silicate glass powder, and third is organic
Carrier is ethyl cellulose type carrier.
(4) fluorescence coating is laminated in reflection green body layer, is sintered 10 minutes through 900 DEG C, formation is stacked gradually in holding burning base
Reflecting layer on plate and fluorescence coating；By reflecting layer and demoulding layer separation, so that reflecting layer, which is detached from, holds burning substrate, and gone by polishing
Except the remaining release layer on reflecting layer, the reflecting layer being laminated and fluorescence coating.
(5) polishing one side of the reflecting layer far from fluorescence coating, so that the metal in reflecting layer exposes.
(6) it is the silver layer for being coated with thickness on the heat-conducting substrate of 1.5mm and being 1 micron in thickness, golden soldering is coated on silver layer
Reflective layer is laminated on golden tinol by cream, heated, forms metal adhesion layer, and metal adhesion layer is by reflecting layer and silver layer
It is bonded together, obtains the light conversion device of the present embodiment.Wherein, the material of heat-conducting substrate is aluminium；The thickness of solder(ing) paste is 100
Micron.
Embodiment 9
The preparation process of the light conversion device of the present embodiment is as follows：
(1) it provides and holds burning substrate, burn coating demoulding slurry on substrate holding, through 200 DEG C of dryings, 800 DEG C of sintering are formed thick
The release layer that degree is 10 microns, wherein demoulding slurry includes white particles and organic carrier, and white particles are boron nitride；It is organic
Carrier is made of bonding agent and organic solvent.Wherein, bonding agent is ethyl cellulose；Organic solvent is that terpinol, butyl card must
The mixture of alcohol, butyl carbitol ester, tributyl citrate and tributyl 2-acetylcitrate.
(2) reflective metals slurry is scratched on release layer, stands 18 minutes at room temperature, in 100 DEG C dry 12 after levelling
Minute, it is that 1mm reflects green body layer to form thickness, wherein reflective metals slurry includes reflective metals powder, assistant metal powder, first
The mass ratio of glass powder and the first organic carrier, reflective metals powder and the first glass powder is 3:1, reflective metals powder is that grain size is 1
Micron~10 microns of flake aluminum particles, the first glass powder is that the first glass powder is silicate glass powder.First organic carrier is
The mixture of ethyl cellulose and butyl carbitol ester and tributyl citrate, and the matter of the first organic carrier and reflective metals powder
Amount is than being 0.5:1.The mass ratio of assistant metal powder and reflective metals powder is 1:1, assistant metal powder is palladium powder.
(3) fluorescent slurry is scratched in reflection green body layer, 0.2 hour dry in 200 DEG C, the thickness of formation is 0.5mm's
Fluorescence green body layer, then through 900 DEG C sintering 15 minute hour, formed stack gradually on release layer reflecting layer and fluorescence coating；It will
Reflecting layer and demoulding layer separation, so that reflecting layer, which is detached from, holds burning substrate, and remove the remaining demoulding on reflecting layer by polishing
Layer, the reflecting layer being laminated and fluorescence coating.Wherein, fluorescent slurry includes fluorescent powder, the second glass powder and the second organic carrier,
The mass ratio of fluorescent powder and the second glass powder is 1:99, the second glass powder is silicate glass powder, and the second glass powder and first
The softening point temperature of glass powder differs 200 DEG C；The quality of second organic carrier and the mass ratio of fluorescent powder are 0.01:1.
(4) polishing one side of the reflecting layer far from fluorescence coating, so that the metal in reflecting layer exposes.
(5) it is the silver layer for being coated with thickness on the heat-conducting substrate of 2.5mm and being 1 micron, the coated with indium soldering on silver layer in thickness
Reflective layer is laminated on indium tinol by cream, heated, forms metal adhesion layer, and metal adhesion layer is by reflecting layer and silver layer
It is bonded together, obtains the light conversion device of the present embodiment.Wherein, the material of heat-conducting substrate is the composite material of copper and graphite；
The thickness of solder(ing) paste is 50 microns.
Comparative example 1
The preparation process of the light conversion device of comparative example 1 is as follows：
(1) heat-conducting substrate is provided, blade coating reflection slurry, stands 10min at room temperature on heat-conducting substrate, after levelling in
100 DEG C of dry 20min form the reflection green body layer that thickness is 0.005mm, wherein heat-conducting substrate is aluminium nitride substrate, heat conduction base
The thickness of plate is 5mm；It includes white reflective particle (aluminium oxide), the first glass powder and the first organic carrier to reflect slurry；White
The mass ratio of reflective particle (aluminium oxide) and the first glass powder is 1:1, white reflective particle is that grain size is 100 nanometers~1 micron
Spherical particle, the first glass powder be silicate glass powder, the first organic carrier be ethyl cellulose and terpinol mixture,
And first the mass ratio of quality and white reflective particle of organic carrier be 0.5:1.
(2) fluorescent slurry is brushed in reflection green body layer, 0.5 hour dry in 100 DEG C, it is the glimmering of 0.1mm to form thickness
Light green body layer is sintered 10min in 900 DEG C, forms porous reflecting layer and fluorescence coating on heat-conducting substrate.Wherein, fluorescent slurry
Including fluorescent powder, the second glass powder and the second organic carrier, the mass ratio of fluorescent powder and the second glass powder is 1:1, the second glass
Powder can be silicate glass powder, and the second glass powder is equal with the softening point temperature of the first glass powder；Second organic carrier
The mass ratio of quality and fluorescent powder is 1:1, the second organic carrier is the mixing of ethyl cellulose, terpinol and butyl carbitol
Object.
Use same blue laser as exciting light the light conversion device of the light conversion device of embodiment 1 and comparative example 1
Source, the luminous intensity for obtaining the light conversion device of embodiment 1 and the light conversion device of comparative example 1 are electric with the driving of blue light source
The change curve of stream, as shown in figure 3, it can be seen in figure 3 that when originating smaller driving current, embodiment 1 and comparative example 1
Light conversion device luminous intensity it is close, but with the raising of driving current, the luminous intensity of the light conversion device of embodiment 1
Luminous flux obviously than the light conversion device of comparative example 1 is high, and when laser drive current is increased to 0.8A, the light of comparative example 1
The luminous intensity of conversion equipment drastically reduces, and further increases driving current, and due to its higher fuel factor, fluorescence coating is
It cannot bear high power laser light excitation and quench, and the light conversion device of embodiment 1 is still shown surely under the driving current of 1.5A
Fixed high light flux light output illustrates it with lower thermal resistance and the stronger capacity of heat transmission.It can thus be seen that the present invention carries
The light conversion device of confession still has better light efficiency and reliability under the conditions of higher source luminance.And the light of embodiment 2~9 turns
Changing device has the intensity profile of light emission similar with the light conversion device of embodiment 1, the light converting means of performance and embodiment 1
Set similar, details are not described herein.
Obviously, the light conversion device of Examples 1 to 9 have higher thermal conductivity, while also have higher reflectivity and
Lower thermal resistance.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (7)
1. a kind of preparation method of light conversion device, which is characterized in that include the following steps：
Form the fine and close reflecting layer and fluorescence coating of stacking, wherein the reflecting layer is obtained by reflective metals slurry through sintering, institute
It includes reflective metals powder, the first glass powder and the first organic carrier to state reflective metals slurry, the reflective metals powder and described the
The mass ratio 1 of one glass powder:1~19.9:0.1；The reflective metals powder is selected from least one of silver powder and aluminium powder；And
Heat-conducting substrate is provided, one side of the reflecting layer far from the fluorescence coating is passed through into metal adhesive material and the heat conduction base
Plate is adhered to each other, and obtains light conversion device, wherein the metal adhesive material is tinol, alumel or low-temperature sintering
Silver paste；
Wherein, the reflective metals powder is sheet-like particle or spherical particle or the reflective metals powder is sheet-like particle and ball
The mixture of shape particle；
The step of reflecting layer and fluorescence coating for forming the stacking is specially：Burning substrate is held in offer, is applied on burning substrate in described hold
The reflective metals slurry is covered, through drying, forms reflection green body layer；Fluorescent slurry is coated in the reflection green body layer, through dry
It is dry, fluorescence green body layer is formed, then through sintering, is formed and stacked gradually in the reflecting layer and the fluorescence for holding and burning on substrate
Layer；Burning substrate is held described in removal, obtains reflecting layer and the fluorescence coating of the stacking；Wherein, the fluorescent slurry include fluorescent powder,
Second glass powder and the second organic carrier, the softening point temperature of second glass powder and first glass powder be not much different in
400 DEG C, and further include one of the polishing reflecting layer far from the fluorescence coating after holding described in removal the step of burning substrate
Face, so that the metal in the reflecting layer exposes.
2. the preparation method of light conversion device according to claim 1, which is characterized in that the material of the heat-conducting substrate is
Copper.
3. the preparation method of light conversion device according to claim 1, which is characterized in that the material of the heat-conducting substrate is
The composite material of aluminium, the composite material of copper and diamond or copper and graphite；By one of the reflecting layer far from the fluorescence coating
The step of face is adhered to each other by the metal adhesive material with the heat-conducting substrate be specially：It is plated on the heat-conducting substrate
Silver formed intermediate metal, then, by one side of the reflecting layer far from the fluorescence coating by the metal adhesive material with
The intermediate metal is bonded together；
Alternatively, one side of the reflecting layer far from the fluorescence coating is passed through the metal adhesive material and the heat-conducting substrate
The step of being adhered to each other be specially：Nickel plating forms nickel layer on the heat-conducting substrate, then gold-plated to form gold on nickel layer
Layer, obtain intermediate metal, then, by one side of the reflecting layer far from the fluorescence coating by the metal adhesive material with
The layer gold is bonded together.
4. the preparation method of light conversion device according to claim 1, which is characterized in that coated on burning substrate in described hold
Further include burning coating demoulding slurry on substrate in described hold, through dry and sintering, shape before the step of reflective metals slurry
At release layer；Wherein, the reflective metals slurry is coated on the release layer.
5. the preparation method of light conversion device according to claim 1, which is characterized in that the grain size of the reflective metals powder
It is 10 nanometers~10 microns.
6. obtained light conversion device prepared by the preparation method of light conversion device according to claim 1.
7. a kind of application of light conversion device by described in claim 6 in the light-source system of lamps and lanterns or display.
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| CN108069710A (en) | 2016-11-15 | 2018-05-25 | 深圳市光峰光电技术有限公司 | A kind of luminescent ceramic and light-emitting device |
| EP3610325A4 (en) * | 2017-04-10 | 2021-02-17 | Materion Precision Optics (Shanghai) Limited | Combination wheel for light conversion |
| CN110520767B (en) * | 2017-04-21 | 2022-06-21 | 亮锐控股有限公司 | Reliable light conversion device for laser-based light sources |
| CN108930919B (en) * | 2017-05-19 | 2022-08-12 | 深圳光峰科技股份有限公司 | Wavelength conversion device, preparation method thereof and light source |
| CN109424944A (en) * | 2017-07-13 | 2019-03-05 | 深圳光峰科技股份有限公司 | A kind of Wavelength converter and light source |
| CN109388002B (en) * | 2017-08-03 | 2020-12-08 | 深圳光峰科技股份有限公司 | Fluorescent chip, method for manufacturing same, and light-emitting device |
| CN109681846B (en) * | 2017-10-18 | 2021-01-05 | 深圳光峰科技股份有限公司 | Wavelength conversion device and preparation method thereof |
| CN109696792B (en) * | 2017-10-24 | 2022-03-29 | 中强光电股份有限公司 | Projector and wavelength conversion device |
| CN109755355B (en) * | 2017-11-02 | 2021-12-07 | 深圳光峰科技股份有限公司 | Wavelength conversion element and method for manufacturing same |
| CN111063810B (en) * | 2018-10-16 | 2021-11-12 | 深圳光峰科技股份有限公司 | Light emitting device and method for manufacturing the same |
| CN111380037A (en) * | 2018-12-27 | 2020-07-07 | 深圳光峰科技股份有限公司 | Wavelength conversion device and method for manufacturing same |
| CN113671780A (en) * | 2021-08-31 | 2021-11-19 | 青岛海信激光显示股份有限公司 | Light emitting unit, light source system, and laser projection apparatus |
| CN113671781B (en) * | 2021-08-31 | 2023-03-14 | 青岛海信激光显示股份有限公司 | Light emitting unit, light source system, and laser projection apparatus |
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| CN204829755U (en) * | 2015-06-02 | 2015-12-02 | 深圳市光峰光电技术有限公司 | Wavelength conversion equipment , relevant illuminator and projecting system |
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