CN105716039B - Light conversion device and its preparation method and application - Google Patents

Light conversion device and its preparation method and application Download PDF

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CN105716039B
CN105716039B CN201610225349.4A CN201610225349A CN105716039B CN 105716039 B CN105716039 B CN 105716039B CN 201610225349 A CN201610225349 A CN 201610225349A CN 105716039 B CN105716039 B CN 105716039B
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green body
layer
heat
body layer
conducting substrate
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CN105716039A (en
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杨阳
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/40—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters with provision for controlling spectral properties, e.g. colour, or intensity

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
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  • Optical Elements Other Than Lenses (AREA)

Abstract

The present invention relates to a kind of light conversion devices and its preparation method and application.The light conversion device includes heat-conducting substrate, the fine and close reflecting layer being laminated on heat-conducting substrate and the fluorescence coating being laminated on reflecting layer, reflecting layer is obtained by reflective metals slurry through sintering, reflective metals slurry includes reflective metals powder, the first glass dust and the first organic carrier, and the mass ratio of reflective metals powder and the first glass dust is 1:1~19.9:0.1；Reflective metals powder is selected from least one of silver powder and aluminium powder.The reflecting layer of above-mentioned light conversion device has higher reflecting properties, higher thermal conductivity and relatively low thermal resistance.

Description

Light conversion device and its preparation method and application
Technical field
The present invention relates to illumination or field of display, more particularly to a kind of light conversion device and preparation method thereof and answer With.
Background technology
Solid State Laser light source of new generation becomes the desired light of substitution high-pressure sodium lamp since its high brightness, stability are high Source.At present, the high-speed rotating colour wheel of blue laser excitation can effectively solve the problem that the fever of high power density laser excitated fluorescent powder Quenching problem, and the laser display of high efficiency, low cost is become a reality, and be developing progressively the mainstream technology for laser light source One of.
Current more common colour wheel is reflective colour wheel, however the reflecting layer of existing light reflection formula colour wheel is porous knot Structure, thermal resistance is higher, and heat conductivity is bad, is unfavorable for the heat dissipation of power light source, directly affects brightness and the reliability of colour wheel.Though So it can solve the problems, such as that its thermal resistance is higher by plating metallic reflective coating, but it is plated that the colour wheel for plating metallic reflective coating is used to be related to Multiple techniques such as film, metallic reflective coating, metal protective film, soldering pad layer and soldering layer are crossed, process is complicated, of high cost, and The larger colour wheel of area prepares difficulty bigger, it is difficult to realize mass production.
Invention content
Based on this, it is necessary to provide a kind of high brightness and the light conversion device of high reliability.
In addition, also provide a kind of preparation method of above-mentioned light conversion device and its application.
A kind of light conversion device, including heat-conducting substrate, the fine and close reflecting layer and the layer that are laminated on the heat-conducting substrate The fluorescence coating being laminated on the reflecting layer, the reflecting layer are obtained by reflective metals slurry through sintering, the reflective metals slurry Including reflective metals powder, the first glass dust and the first organic carrier, the quality of the reflective metals powder and first glass dust Than being 1:1~19.9:0.1；The reflective metals powder is selected from least one of silver powder and aluminium powder.
Further included in one of the embodiments, around the reflecting layer protective layer of one week, the protective layer with it is described Heat-conducting substrate, the fluorescence coating are tightly connected, so that the protective layer, the heat-conducting substrate, the fluorescence coating coordinate jointly Seal the reflecting layer.
Protective layer, the protective layer are further included in one of the embodiments, and the protective layer is wrapped in the described of stacking On heat-conducting substrate, the reflecting layer and the fluorescence coating, and cover the heat-conducting substrate, the reflecting layer and the fluorescence coating.
A kind of preparation method of light conversion device, includes the following steps：
Heat-conducting substrate is provided；
It is formed and is stacked gradually in the fine and close reflecting layer on the heat-conducting substrate and fluorescence coating on the heat-conducting substrate, obtained To light conversion device；Wherein, the reflecting layer is obtained by reflective metals slurry through sintering, and the reflective metals slurry includes reflection The mass ratio of metal powder, the first glass dust and the first organic carrier, the reflective metals powder and first glass dust is 1:1~ 19.9:0.1；The reflective metals powder is selected from least one of silver powder and aluminium powder.
It is formed and stacked gradually in the densification on the heat-conducting substrate on the heat-conducting substrate in one of the embodiments, The reflecting layer and the step of fluorescence coating be specially：It is formed on the heat-conducting substrate using the reflective metals slurry Reflect green body layer；Fluorescence green body layer or the fluorescence coating are formed in the reflection green body layer, through sintering, in the heat-conducting substrate It is upper to form the fine and close reflecting layer.
In one of the embodiments, it is described reflection green body layer on form the fluorescence green body layer the step of be specially： Fluorescent slurry is coated in the reflection green body layer, through drying, forms the fluorescence green body layer；Wherein, the fluorescent slurry packet Include fluorescent powder, the second glass dust and the second organic carrier, the mass ratio of the fluorescent powder and second glass dust is 1:0.1~ 99, the softening point temperature of second glass dust and first glass dust is not much different in 400 DEG C.
In one of the embodiments, it is described reflection green body layer on form the fluorescence coating the step of be specially：It provides The fluorescence coating is laminated in the reflection green body layer by the fluorescence coating, wherein：
The fluorescence coating is made by the steps to obtain：Fluorescent powder is compressed into tablet form, through sintering, obtains the fluorescence Layer；
Alternatively, the fluorescence coating is made by the steps to obtain：Fluorescent powder is mixed with ceramic sintering aid, successively through into Type and sintering obtain the fluorescence diaphragm；
Alternatively, the fluorescence coating is made by the steps to obtain：By fluorescent powder, third glass dust and third organic carrier Mixing, successively through being molded and being sintered, obtains the fluorescence coating.
In one of the embodiments, before the step of forming the fluorescence coating in the reflection green body layer, further include The coating glass protective paste on the edge of the reflection green body layer, so that the glass protection slurry is around the reflection green body The edge of layer one week through drying, obtains protection green body layer；Wherein, after the step of sintering, the protection green body layer shape Into protective layer, the protective layer coordinates to seal the reflecting layer with the fluorescence coating, the heat-conducting substrate jointly；
Alternatively, before the step of forming the fluorescence green body layer in the reflection green body layer, it is additionally included in the reflection Coating glass protective paste on the edge of green body layer, so that the glass protection slurry is around the edge one of the reflection green body layer Through drying, obtain protection green body layer in week；Wherein, after the step of sintering, the protection green body layer forms protective layer, The fluorescence green body layer forms fluorescence coating, and the protective layer coordinates to seal jointly with the fluorescence coating, the heat-conducting substrate State reflecting layer；
Alternatively, after the step of forming the fluorescence coating in the reflection green body layer, before the step of sintering, The edge coating glass protection slurry of the reflection green body layer is additionally included in, so that the glass protection slurry is around the reflection The edge of green body layer one week through drying, obtains protection green body layer；Wherein, after the step of sintering, the protection green body Layer forms protective layer, and the protective layer coordinates to seal the reflecting layer with the fluorescence coating, the heat-conducting substrate jointly；
Alternatively, after the step of forming the fluorescence green body layer in the reflection green body layer, the sintering the step of Later, the edge coating glass protection slurry of the reflection green body layer is additionally included in, so that the glass protection slurry is around institute It states the edge of reflection green body layer one week, through drying, obtains protection green body layer；Wherein, after the step of sintering, the guarantor It protects green body layer and forms protective layer, the fluorescence green body layer forms fluorescence coating, the protective layer and the fluorescence coating, the heat conduction base Plate coordinates to seal the reflecting layer jointly.
It is formed and stacked gradually in the densification on the heat-conducting substrate on the heat-conducting substrate in one of the embodiments, The reflecting layer and the step of fluorescence coating be specially：It is formed on the heat-conducting substrate using the reflective metals slurry Green body layer is reflected, through sintering, the fine and close reflecting layer is formed on the heat-conducting substrate；Fluorescence is formed on the reflecting layer Green body layer through sintering, forms the fluorescence coating.
It is specially the fluorescence green body layer is formed on the reflecting layer the step of in one of the embodiments,：Institute It states and fluorescent slurry is coated on reflecting layer, through drying, form the fluorescence green body layer；Wherein, the fluorescent slurry include fluorescent powder, The mass ratio of second glass dust and the second organic carrier, the fluorescent powder and second glass dust is 1:0.1~99, described The softening point temperature of two glass dust and first glass dust is not much different in 400 DEG C.
In one of the embodiments, before the step of fluorescence green body layer is formed on the reflecting layer, it is additionally included in institute Coating glass protective paste on the edge in reflecting layer is stated, so that the glass protection slurry is around the edge one in the reflecting layer Through drying, obtain protection green body layer in week；Wherein, after the step of sintering, the protection green body layer forms protective layer, The protective layer coordinates to seal the reflecting layer with the fluorescence coating, the heat-conducting substrate jointly；
Alternatively, after the step of fluorescence green body layer is formed on the reflecting layer, it is additionally included in the reflection green body The edge coating glass protection slurry of layer, so that the glass protection slurry is around the edge one week in the reflecting layer, through drying, Obtain protection green body layer；Wherein, after the step of sintering, the protection green body layer forms protective layer, the fluorescence base Body layer forms fluorescence coating, and the protective layer coordinates to seal the reflecting layer with the fluorescence coating, the heat-conducting substrate jointly.
The reflection base is formed on the heat-conducting substrate using the reflective metals slurry in one of the embodiments, The step of body layer be specially：The reflective metals slurry is coated on the heat-conducting substrate, through drying, obtains reflection green body layer；
Alternatively, using the reflective metals slurry formed on the heat-conducting substrate it is described reflection green body layer the step of it is specific For：By the reflective metals sizing material forming and drying, the reflection green body layer is obtained, the reflection green body layer is laminated in described On heat-conducting substrate.
The thermal conductivity of the heat-conducting substrate is more than 10W/mK in one of the embodiments,.
The thermal expansion system of the coefficient of thermal expansion of first glass dust and the heat-conducting substrate in one of the embodiments, Number difference 0~5 × 10-6/K。
The grain size of the reflective metals powder is 10 nanometers~10 microns in one of the embodiments,.
The reflective metals powder is sheet-like particle or spherical particle or the reflection gold in one of the embodiments, Belong to powder for sheet-like particle and the mixture of spherical particle.
It is formed and stacked gradually in the densification on the heat-conducting substrate on the heat-conducting substrate in one of the embodiments, The reflecting layer and the step of the fluorescence coating after, further include and form protection on the reflecting layer using sealing material Layer, and make the protective layer around the reflecting layer one week or make the protective layer masking heat-conducting substrate, the reflecting layer With the fluorescence coating；Wherein, the sealing material is epoxy resin or Parylene.
Application of the above-mentioned light conversion device in the light-source system of lamps and lanterns or display.
Since the reflecting layer of above-mentioned light conversion device is obtained by reflective metals slurry through sintering.Reflective metals slurry includes anti- Penetrate metal powder, the first glass dust and the first organic carrier, the mass ratio of reflective metals powder and the first glass dust is 1:1~19.9: 0.1, reflective metals powder is selected from least one of silver powder and aluminium powder, and reflecting layer is fine and close reflecting layer so that above-mentioned light turns The reflecting layer of changing device not only has higher reflecting properties, also has higher thermal conductivity and relatively low thermal resistance so that above-mentioned Light conversion device prepared by method has higher brightness, and above-mentioned Wavelength converter and current Wavelength converter pair Than the test result under same laser driving current can relatively be released, the laser that Wavelength converter of the invention is born Electric current higher, reliability higher.
Description of the drawings
Fig. 1 is the structure diagram of the light conversion device of an embodiment；
Fig. 2 is the flow chart of the preparation method of the light conversion device of an embodiment；
Fig. 3 is the flow chart of the method for the realization step S220 of the preparation method of the light conversion device of an embodiment；
Fig. 4 is formed on heat-conducting substrate for the preparation method of the light conversion device of three embodiments and is stacked gradually in heat conduction base The flow chart of the method in fine and close reflecting layer and fluorescence coating on plate；
Fig. 5 is luminous flux of the light conversion device of embodiment 1 and comparative example 1 under same blue laser light source with electric current Variation relation curve graph.
Specific embodiment
For the ease of understanding the present invention, the present invention is described more fully below with reference to relevant drawings.In attached drawing Give the preferred embodiment of the present invention.But the present invention can realize in many different forms, however it is not limited to herein Described embodiment.On the contrary, the purpose for providing these embodiments is to make the understanding to the disclosure more saturating It is thorough comprehensive.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention The normally understood meaning of technical staff is identical.Term used in the description of the invention herein is intended merely to description tool The purpose of the embodiment of body, it is not intended that in the limitation present invention.
As shown in Figure 1, the light conversion device 100 of an embodiment, including heat-conducting substrate 110, reflecting layer 120 and fluorescence coating 130。
Wherein, the thermal conductivity of heat-conducting substrate 110 is more than 10W/mK.Specifically, heat-conducting substrate 110 can be aluminum-nitride-based Plate, silicon carbide substrate, silicon nitride board, silicon chip, aluminum oxide substrate or boron nitride substrate.These 110 high temperature resistants of heat-conducting substrate, and With preferable heat conductivility.
Wherein, the thickness of heat-conducting substrate 110 is 0.1~5mm.
Wherein, reflecting layer 120 is fine and close reflecting layer.Reflecting layer 120 is obtained by reflective metals slurry through sintering.Wherein, Reflective metals slurry includes reflective metals powder, the first glass dust and the first organic carrier.
Wherein, the mass ratio of reflective metals powder and the first glass dust is 1:1~19.9:0.1.
Wherein, reflective metals powder is selected from least one of silver powder and aluminium powder.Preferably, reflective metals powder is silver powder, by There is higher reflectivity and higher thermal conductivity in silver powder, the reflecting layer 120 of light conversion device 100 can be made with higher Reflectivity and higher thermal conductivity.
Wherein, reflective metals powder can be spherical, strip, rodlike, sheet or spherical；Preferably, reflective metals powder is piece Shape particle or spherical particle or reflective metals powder are sheet-like particle and the mixture of spherical particle.The reflective metals powder of sheet Be conducive to the mutual overlap joint between sintered reflective metals powder to form heat conduction network, to improve the anti-of light conversion device 100 Penetrate the thermal conductivity of layer 120；Spherical reflective metals powder particles bulk density is high, and slurry fluidity is good, is conducive to improve light conversion The thermal conductivity in the reflecting layer 120 of device 100.
Further, the grain size of reflective metals powder is 10 nanometers~10 microns.Larger particle is not easy densified sintering product, smaller Particle be not easy to disperse.
Wherein, the first glass dust can use coloured glass dust after sintering, sintering can also be used not have later The glass dust of color；Preferably, the first glass dust is that visible light transmittance of the sintering later in water white transparency and after being sintered exists More than 80% glass dust.For example, the first glass dust is silicate glass powder or borosilicic acid salt glass dust.
Wherein, the coefficient of thermal expansion of the first glass dust differs 0~5 × 10 with the coefficient of thermal expansion of heat-conducting substrate 110-6/ K, So as to make can be reliably bonded together between the reflecting layer 120 formed after sintering and heat-conducting substrate 110.Further, The coefficient of thermal expansion of first glass dust differs 0~3 × 10 with the coefficient of thermal expansion of heat-conducting substrate 110-6/K；Further, The coefficient of thermal expansion of one glass dust differs 0~1 × 10 with the coefficient of thermal expansion of heat-conducting substrate 110-6/K。
Wherein, the first organic carrier is made of the organic solvent of bonding agent and different boiling.Wherein, bonding agent is fine for ethyl Dimension element；Solvent is in terpinol, butyl carbitol, butyl carbitol ester, tributyl citrate and tributyl 2-acetylcitrate At least one.
Further, reflective metals slurry further includes assistant metal powder, assistant metal powder in palladium powder and platinum powder extremely Few one kind.Wherein, palladium powder and platinum powder have the adverse effect for the silver migration for reducing high temperature sintering, improve reflectivity stability.Its In, the mass ratio of assistant metal powder and reflective metals powder is not higher than 1:1.
Wherein, fluorescence coating 130 can send out fluorescence under the action of exciting light.
In the present embodiment, light conversion device 100 is further included around the reflecting layer protective layer of 120 1 weeks 140, protective layer 140 are tightly connected with heat-conducting substrate 110, fluorescence coating 130, so that protective layer 140, heat-conducting substrate 110, fluorescence coating 130 are common Fitted seal reflecting layer 120.
It is appreciated that in other embodiments, protective layer is wrapped in heat-conducting substrate 110, reflecting layer 120 and the fluorescence of stacking On layer 130, and cover heat-conducting substrate 110, reflecting layer 120 and fluorescence coating 130.Heat-conducting substrate 110, reflecting layer 120 and fluorescence coating 130 stackings form laminates, i.e. protective layer is wrapped on laminates, and covers laminates.
Wherein, the material of protective layer 140 is epoxy resin or Parylene.Wherein, Parylene can be the U.S. Special coating systems companies production N-type Parylene, c-type Parylene, D types Parylene or HT types Parylene or the dix c-types for the production of KISCO Co., Ltd. of Japan, D types, N-type, SR types, NR types, HR types, CF Type, SF type Parylenes.Alternatively, the material of protective layer 140 may be the identical material of fluorescence coating 130；Alternatively, protective layer 140 material can also be silicate glass, borosilicate glass or glass glaze.
Since the reflecting layer 120 of above-mentioned light conversion device 100 is obtained by reflective metals slurry through sintering.Reflective metals slurry Including reflective metals powder, the first glass dust and the first organic carrier, the mass ratio of reflective metals powder and the first glass dust is 1:1~ 19.9:0.1, reflective metals powder is selected from least one of silver powder and aluminium powder, and reflecting layer 120 is fine and close reflecting layer 120, is made The reflecting layer 120 of above-mentioned light conversion device 100 not only has higher reflecting properties, also there is higher thermal conductivity and relatively low Thermal resistance so that the above method prepare light conversion device 100 have higher light efficiency, more reliably.
Above-mentioned light conversion device 100 can be applied in the light-source system of lamps and lanterns or display.
As shown in Fig. 2, the preparation method of the light conversion device of an embodiment, available for preparing above-mentioned light conversion device, The preparation method of the light conversion device includes the following steps：
Step S210：Heat-conducting substrate is provided.
Wherein, the thermal conductivity of heat-conducting substrate is more than 10W/mK.Specifically, heat-conducting substrate can be aluminium nitride substrate, carbonization Silicon substrate, silicon nitride board, silicon chip, aluminum oxide substrate or boron nitride substrate.These heat-conducting substrate high temperature resistants, and with preferable Heat conductivility.
Wherein, the thickness of heat-conducting substrate is 0.1~5mm.
Step S220：It is formed and is stacked gradually in the fine and close reflecting layer on heat-conducting substrate and fluorescence coating on heat-conducting substrate, Obtain light conversion device.
Wherein, reflecting layer is fine and close reflecting layer.Reflecting layer is obtained by reflective metals slurry through sintering.Wherein reflective metals Slurry includes reflective metals powder, the first glass dust and the first organic carrier.
Wherein, the mass ratio of reflective metals powder and the first glass dust is 1:1~19.9:0.1.
Wherein, reflective metals powder is selected from least one of silver powder and aluminium powder.Preferably, reflective metals powder is silver powder, by There is higher reflectivity and higher thermal conductivity in silver powder, the reflecting layer of light conversion device can be made there is higher reflectivity Higher thermal conductivity.
Wherein, reflective metals powder can be spherical, strip, rodlike, sheet or spherical；Preferably, reflective metals powder is piece Shape particle or spherical particle or reflective metals powder are sheet-like particle and the mixture of spherical particle.The reflective metals powder of sheet Be conducive to the mutual overlap joint between sintered reflective metals powder to form heat conduction network, to improve the reflecting layer of light conversion device Thermal conductivity；Spherical reflective metals powder particles bulk density is high, and slurry fluidity is good, is conducive to improve the anti-of light conversion device Penetrate the thermal conductivity of layer.
Further, the grain size of reflective metals powder is 10 nanometers~10 microns.Larger particle is not easy densified sintering product, smaller Particle be not easy to disperse.
Wherein, the first glass dust can use coloured glass dust after sintering, sintering can also be used not have later The glass dust of color；Preferably, the first glass dust is that visible light transmittance of the sintering later in water white transparency and after being sintered exists More than 80% glass dust.For example, the first glass dust is silicate glass powder or borosilicate glass powder.
Wherein, the coefficient of thermal expansion of the first glass dust differs 0~5 × 10 with the coefficient of thermal expansion of heat-conducting substrate-6/ K, so as to Make reliably be bonded together between the reflecting layer formed after sintering and heat-conducting substrate.Further, the first glass dust Coefficient of thermal expansion differ 0~3 × 10 with the coefficient of thermal expansion of heat-conducting substrate-6/K；Further, the heat of the first glass dust is swollen Swollen coefficient differs 0~1 × 10 with the coefficient of thermal expansion of heat-conducting substrate-6/K。
First organic carrier is made of the organic solvent of bonding agent and different boiling.Wherein, bonding agent is ethyl cellulose； Solvent in terpinol, butyl carbitol, butyl carbitol ester, tributyl citrate and tributyl 2-acetylcitrate at least It is a kind of.
Further, reflective metals slurry further includes assistant metal powder, assistant metal powder in palladium powder and platinum powder extremely Few one kind.Wherein, palladium powder and platinum powder have the adverse effect for the silver migration for reducing high temperature sintering, improve reflectivity stability.Its In, the mass ratio of assistant metal powder and reflective metals powder is not higher than 1:1.
In the present embodiment, it is formed and is stacked gradually in the fine and close reflecting layer on heat-conducting substrate and fluorescence on heat-conducting substrate Layer the step of be specially：
Step S222：Reflection green body layer is formed on heat-conducting substrate using reflective metals slurry.
Wherein, the thickness for reflecting green body layer is 0.001~1mm.
In the present embodiment, it is specially in the step of formation reflection green body layer on heat-conducting substrate using reflective metals slurry： Reflective metals slurry is coated on heat-conducting substrate, through drying, obtains reflection green body layer.
Wherein, the method that reflective metals slurry is coated on heat-conducting substrate can be brushing, blade coating, spraying or screen printing Brush.
Further, it after the step of reflective metals slurry is coated on heat-conducting substrate, further includes and is coated with reflection gold The step of heat-conducting substrate of category slurry is stood at room temperature, so that reflective metals slurry levelling on heat-conducting substrate.
Wherein, the drying temperature of the drying steps on heat-conducting substrate after coating reflective metals slurry is 100~200 ℃。
It is appreciated that the method for coating reflective metals slurry on heat-conducting substrate can not also be used to form reflection green body Layer, it is specific reflection green body layer is formed on heat-conducting substrate the step of using reflective metals slurry for example, in other embodiments For：By reflective metals sizing material forming and drying, reflection green body layer is obtained, reflection green body layer is laminated on heat-conducting substrate.
Step S224：Fluorescence green body layer is formed in reflection green body layer, through sintering, the anti-of densification is formed on heat-conducting substrate Penetrate layer.
In the present embodiment, it is specially in the step of formation fluorescence green body layer on reflecting green body layer：In reflection green body layer Fluorescent slurry is coated, through drying, forms fluorescence green body layer.
Wherein, fluorescence coating is formed after the sintering of fluorescence green body layer.
Wherein, fluorescent slurry includes fluorescent powder, the second glass dust and the second organic carrier.
Wherein, in fluorescent slurry, the mass ratio of fluorescent powder and the second glass dust is 1:0.1~99.
Wherein, the second glass dust is differed with the softening point temperature of the first glass dust no more than 400 DEG C, so that sintered anti- It penetrates layer and fluorescence coating can be good at being bonded together.For example, the first glass dust can be silicate glass powder, the second glass dust It can be borosilicate glass powder；Alternatively, the first glass dust can be borosilicate glass powder, the second glass dust can be silicic acid Salt glass dust.
Wherein, the second organic carrier is made of for the first organic carrier the organic solvent of bonding agent and different boiling.Wherein, Bonding agent is ethyl cellulose；Solvent is selected from terpinol, butyl carbitol, butyl carbitol ester, tributyl citrate and acetyl At least one of tributyl citrate.
At this point, the method for coating fluorescent slurry can be brushing, blade coating, spraying or screen printing in reflection green body layer Brush.
Wherein, the thickness of fluorescence green body layer is 0.01~1mm.
In order to preferably protect the reflecting layer of light conversion device, prevent reflecting layer from being aoxidized or vulcanized, wherein a reality Apply in example, step S224 before the step of fluorescence green body layer is formed on reflecting green body layer, be additionally included in reflection green body layer Coating glass protective paste on edge, so that glass protection slurry, through drying, is protected around the edge one week of reflection green body layer Protect green body layer.Wherein, after the sintering step of step S224, protection green body layer forms protective layer.Protective layer and fluorescence coating are led Hot substrate coordinates to seal reflecting layer jointly.Further, it in step S222, is preferably formed and reflected at the middle part of heat-conducting substrate Green body layer, so as to so that sintered protective layer is held between fluorescence coating and heat-conducting substrate.At this point, in step S224, fluorescence Green body layer is formed in protection green body layer and reflection green body layer.Wherein, glass protection slurry can be the glass added with fluorescent powder Glass protective paste, or do not add the glass protection slurry of fluorescent powder.Wherein, the glass protection slurry of fluorescent powder is added It can be the fluorescent slurry to form fluorescence green body layer；The glass protection slurry for not adding fluorescent powder can be that silicate glass is starched Material or borosilicate glass slurry.
Alternatively, in another embodiment, after the step of fluorescence green body layer is formed on reflecting green body layer, in sintering Before step, the edge coating glass protection slurry of reflection green body layer is additionally included in, so that glass protection slurry is around reflection base The edge of body layer one week through drying, obtains protection green body layer；Wherein, after the step of sintering, protection green body layer forms protection Layer.Protective layer coordinates to seal reflecting layer with fluorescence coating, heat-conducting substrate jointly.Further, it in step S222, is preferably leading The middle part of hot substrate forms reflection green body layer, so as to which sintered protective layer be made to be held between fluorescence coating and heat-conducting substrate.
Alternatively, can not also coating glass protective paste before sintering, in other embodiments, the sintering the step of it Afterwards, i.e., it stacks gradually after the step of fine and close reflecting layer on heat-conducting substrate and fluorescence coating, makes in formation on heat-conducting substrate Protective layer is formed on reflecting layer with sealing material, and makes protective layer around reflecting layer one week or protective layer is made to cover heat conduction base Plate, reflecting layer and fluorescence coating.Wherein, sealing material is epoxy resin or Parylene.Wherein, Parylene can be U.S. N-type Parylene, c-type Parylene, the D type Parylenes of special coating systems companies of state production Or HT types Parylene or for KISCO Co., Ltd. of Japan produce dix c-types, D types, N-type, SR types, NR types, HR types, CF types, SF type Parylenes.Protective layer, fluorescence coating and heat-conducting substrate coordinate to seal reflecting layer jointly.
The preparation method of above-mentioned light conversion device is easy to operate, is easy to industrialized production, and the system of above-mentioned light conversion device Preparation Method is sintered to be formed by using the reflective metals slurry containing reflective metals powder and the first glass dust when preparing reflecting layer Fine and close reflecting layer, and reflective metals powder is selected from least one of silver powder and aluminium powder, has obtained having irreflexive reflecting layer, So that reflecting layer has higher reflecting properties, meanwhile, relative to traditional porous reflecting layer, fine and close reflecting layer also has Higher thermal conductivity and relatively low thermal resistance, so that light conversion device prepared by the above method has higher light efficiency, more Ground is reliable.
The light conversion device of one embodiment is prepared by the preparation method of above-mentioned light conversion device.Since the light is converted Device is prepared by the preparation method of above-mentioned light conversion device so that and above-mentioned reflecting layer not only has higher reflecting properties, Also there is higher thermal conductivity and relatively low thermal resistance so that light conversion device prepared by the above method has higher light efficiency, more What is added is reliable.
The preparation method of the light conversion device of two embodiments can be used for preparing above-mentioned light conversion device, and two implement The step of preparation method of the light conversion device of mode and the preparation method of the light conversion device of an embodiment, is similar, difference It is only that：
In the present embodiment, it is formed and is stacked gradually in the fine and close reflecting layer on heat-conducting substrate and fluorescence on heat-conducting substrate In the step of layer, formed after reflection green body layer on heat-conducting substrate using reflective metals slurry, formed in reflection green body layer Fluorescence coating, and be specially in the step of formation fluorescence coating on reflecting green body layer in two embodiments：Fluorescence coating is provided, by fluorescence It is laminated on layer by layer in reflection green body layer.The method differs the system of larger fluorescence coating available for softening point temperature with the first glass dust It is standby.
Wherein, fluorescence coating is made by the steps to obtain：Fluorescent powder is compressed into tablet form, through sintering, obtains fluorescence coating.
Alternatively, fluorescence coating can also be made by the steps to obtain：Fluorescent powder with ceramic sintering aid is mixed, is passed through successively Molding and sintering, obtain fluorescence coating.At this point, fluorescent powder and the mass ratio of ceramic sintering aid are 100:0.01~100:10；Ceramics Sintering aid can be ethyl orthosilicate, magnesia, magnesium nitrate, magnesium hydroxide, yttrium oxide, yttrium nitrate etc..
Or fluorescence coating can also be made by the steps to obtain：Fluorescent powder, third glass dust and third is organic Carrier mixes, and successively through being molded and being sintered, obtains fluorescence coating.At this point, the mass ratio of fluorescent powder and third glass dust for 0.01~ 99:1；Third glass dust can be glass dust commonly used in the art, for example, borosilicate glass powder, silicate glass powder etc..The Three organic carriers can be organic carrier commonly used in the art, such as third organic carrier is by the organic of bonding agent and different boiling Solvent forms.Wherein, bonding agent is ethyl cellulose；Solvent is selected from terpinol, butyl carbitol, butyl carbitol ester, lemon At least one of sour tributyl and tributyl 2-acetylcitrate.Wherein, third glass dust can be identical with the second glass dust, It can be different；Third organic carrier may be the same or different with the second organic solvent.
Preferably, the coefficient of thermal expansion of fluorescence coating and the coefficient of thermal expansion of the first glass dust that above-mentioned three kinds of methods are prepared Difference is no more than 10 × 10-6/ K, so that reflecting layer and fluorescence coating can be securely bonded to together after the sintering.
At this point, in order to preferably protect the reflecting layer of light conversion device, prevent reflecting layer from being aoxidized or vulcanized, wherein one In a embodiment, before the step of fluorescence coating is formed on reflecting green body layer, in addition to coated on the edge of reflection green body layer Glass protection slurry, so that glass protection slurry, through drying, obtains protecting green body layer around the edge one week of reflection green body layer. Wherein, after the step of sintering, protection green body layer forms protective layer.Protective layer and fluorescence coating, heat-conducting substrate jointly cooperation with Seal reflecting layer.Further, reflection green body layer is preferably formed at the middle part of heat-conducting substrate, so as to so that sintered protection Layer is held between fluorescence coating and heat-conducting substrate.At this point, fluorescence coating is laminated in protection green body layer and reflection green body layer.Wherein, Glass protection slurry can be the glass protection slurry added with fluorescent powder, or not add the glass protection of fluorescent powder Slurry.Wherein, the glass protection slurry for adding fluorescent powder can be the fluorescent slurry to form fluorescence green body layer；Do not add fluorescence The glass protection slurry of powder can be silicate glass slurry, borosilicate glass slurry material etc..
Alternatively, in another embodiment, after the step of fluorescence coating is formed on reflecting green body layer, the sintering the step of Before, the edge coating glass protection slurry of reflection green body layer is additionally included in, so that glass protection slurry is around reflection green body layer Edge one week, through drying, obtain protection green body layer；Wherein, after the step of sintering, protection green body layer forms protective layer. Protective layer coordinates to seal reflecting layer with fluorescence coating, heat-conducting substrate jointly.Further, preferably in the middle part shape of heat-conducting substrate Into reflection green body layer, so as to which sintered protective layer be made to be held between fluorescence coating and heat-conducting substrate.
Alternatively, can not also coating glass protective paste before sintering, in other embodiments, the sintering the step of it Afterwards, i.e., it is stacked gradually after the step of fine and close reflecting layer on heat-conducting substrate and fluorescence coating in formation on heat-conducting substrate, Organosilicon is coated on reflecting layer, and organosilicon is made to surround reflecting layer one week, it is cured, form protective layer.Protective layer, fluorescence coating and Heat-conducting substrate coordinates to seal reflecting layer jointly.
Due to the preparation method of the light conversion device of two embodiments and the preparation side of the light conversion device of an embodiment Method is roughly the same, therefore has the advantages that the preparation method of the light conversion device of an embodiment is similar.
And two the light conversion device of embodiment be prepared by the preparation method of above-mentioned light conversion device.Since the light turns Changing device is prepared by the preparation method of above-mentioned light conversion device so that the light conversion device of two embodiments has one to implement The advantages of light conversion device of mode is similar.The light conversion device of two embodiments can be applied to the light-source system of projector In.
The preparation method of the light conversion device of three embodiments can also be used for preparing the light conversion device of an embodiment, and The preparation method of the light conversion device of three embodiments is roughly the same with the preparation method of the light conversion device of an embodiment, area It is not only that：
The preparation method of the light conversion device of three embodiments is formed on heat-conducting substrate and is stacked gradually on heat-conducting substrate Fine and close reflecting layer and the step of fluorescence coating be specially：
Step S310：Reflection green body layer is formed on heat-conducting substrate using reflective metals slurry, through sintering, in heat-conducting substrate It is upper to form fine and close reflecting layer.
Wherein, the use reflective metals slurry of step S310 is forming the step of reflecting green body layer and one in fact on heat-conducting substrate It is identical reflection green body layer is formed on heat-conducting substrate the step of to apply the use reflective metals slurry of the step S222 of mode.
Step S320：Fluorescence green body layer is formed on reflecting layer, through sintering, forms fluorescence coating.
Wherein, step S320 fluorescence green body layer is formed on reflecting layer the step of with the light conversion device of an embodiment Preparation method step S224 it is roughly the same fluorescence green body layer is formed on reflecting green body layer the step of, difference is only with one The preparation method of the light conversion device of embodiment is that fluorescence green body layer is formed in reflection green body layer, and the light of three embodiments The preparation method of conversion equipment is the formation fluorescence green body layer on reflecting layer.
In three embodiments in order to preferably protect the reflecting layer of light conversion device, prevent reflecting layer from being aoxidized or vulcanized Way with it is also roughly the same in an embodiment, differ only in, be in the present embodiment after the step of forming reflecting layer, Before the step of forming fluorescence green body layer, the edge coating glass protection slurry in reflecting layer.Alternatively, in step S320 anti- Penetrate on layer after the step of forming fluorescence green body layer, the step of sintering before, the edge coating glass protection slurry in reflecting layer； Or it is that protective layer is formed on reflecting layer using sealing material after step S320.Protective layer, fluorescence coating and heat conduction base Plate coordinates to seal reflecting layer jointly.
Due to the preparation method of the light conversion device of three embodiments and the preparation side of the light conversion device of an embodiment Method is roughly the same, therefore has the advantages that the preparation method of the light conversion device of an embodiment is similar.
And three the light conversion device of embodiment be prepared by the preparation method of above-mentioned light conversion device.Since the light turns Changing device is prepared by the preparation method of above-mentioned light conversion device so that the light conversion device of three embodiments has one to implement The advantages of light conversion device of mode is similar.The light conversion device of three embodiments can be applied to the light-source system of projector In.
It is specific embodiment part below：
Embodiment 1
The preparation process of the light conversion device of the present embodiment is as follows：
(1) heat-conducting substrate is provided, reflective metals slurry is brushed on heat-conducting substrate, stands 10min at room temperature, after levelling In 100 DEG C of dry 20min, the reflection green body layer that thickness is 0.002mm is formed.Wherein, heat-conducting substrate is aluminium nitride substrate, heat conduction The thickness 1mm of substrate；Reflective metals slurry includes reflective metals powder, the first glass dust and the first organic carrier, reflective metals powder Mass ratio with the first glass dust is 9.5:0.5, reflective metals powder is the sheet Argent grain that grain size is 10 nanometers~10 microns, the One glass dust is silicate glass powder, mixture of first organic carrier for ethyl cellulose and terpinol, and first have it is airborne The quality of body is 1 with the mass ratio of reflective metals powder:0.5.The thermal expansion of the coefficient of thermal expansion and heat-conducting substrate of first glass dust Coefficient difference 2 × 10-6/K。
(2) fluorescent slurry is brushed in reflection green body layer, 0.5 hour dry in 100 DEG C, it is the glimmering of 0.1mm to form thickness Light green body layer is sintered 10min in 900 DEG C, fine and close reflecting layer is formed between heat-conducting substrate and fluorescence coating, obtains the present embodiment Light conversion device.Wherein, fluorescent slurry includes fluorescent powder, the second glass dust and the second organic carrier, fluorescent powder and the second glass The mass ratio of glass powder is 1:1, the second glass dust can be the softening point of silicate glass powder, the second glass dust and the first glass dust Temperature is equal, and the mass ratio of the quality of the second organic carrier and fluorescent powder is 1:1, the second organic carrier for ethyl cellulose, The mixture of terpinol and butyl carbitol.
Embodiment 2
The preparation process of the light conversion device of the present embodiment is as follows：
(1) heat-conducting substrate is provided, reflective metals slurry is scratched on the middle part of heat-conducting substrate, stands 12min at room temperature, Levelling forms the reflection green body layer that thickness is 1mm after 200 DEG C of dry 30min.Wherein, heat-conducting substrate is silicon carbide substrate, is led The thickness of hot substrate is 5mm；It is organic that reflective metals slurry includes reflective metals powder, assistant metal powder, the first glass dust and first The mass ratio of carrier, reflective metals powder and the first glass dust is 19.5:1, reflective metals powder is that grain size is 1 micron~10 microns Flake aluminum particles, the first glass dust are borosilicate glass powder, and the first organic carrier is ethyl cellulose and terpinol and butyl The mixture of carbitol ester, and the mass ratio of the quality of the first organic carrier and reflective metals powder is 1:0.5.First glass dust Coefficient of thermal expansion differs 3 × 10 with the coefficient of thermal expansion of heat-conducting substrate-6/K；Assistant metal powder and the mass ratio of reflective metals powder are 1:1, assistant metal powder is palladium powder.
(2) the coating glass protective paste on the edge of reflection green body layer, so that glass protection slurry is around reflection green body The edge of layer one week through drying, forms protection green body layer.Wherein, glass protection slurry is fluorescent slurry, wherein, fluorescent slurry Including fluorescent powder, the second glass dust and the second organic carrier, the mass ratio of fluorescent powder and the second glass dust is 1:99, the second glass Powder can be silicate glass powder, and the first glass dust differs 400 DEG C with the softening point temperature of the second glass dust, and second have it is airborne The quality of body and the mass ratio of fluorescent powder are 1:0.01, the second organic carrier is ethyl cellulose, terpinol and butyl carbitol Mixture.
(3) in reflection green body layer and the fluorescent slurry of blade coating step (2) in green body layer is protected, in 200 DEG C of dry 20min, The fluorescence green body layer that thickness is 1mm is formed, is sintered 0.5 hour in 850 DEG C, forms fluorescence coating, reflecting layer and protective layer, reflecting layer Between fluorescence coating and heat-conducting substrate, protective layer surround reflecting layer one week, and protective layer is fixed with fluorescence coating, heat-conducting substrate and connected It connects, and cooperation obtains the light conversion device of the present embodiment to seal reflecting layer jointly for fluorescence coating, heat-conducting substrate and protective layer.Its In, the fluorescent slurry in step (3) is fluorescent slurry used in glass protection slurry in step (2).
Embodiment 3
The preparation process of the light conversion device of the present embodiment is as follows：
(1) heat-conducting substrate is provided, reflective metals slurry is sprayed at the middle part of heat-conducting substrate, stands 15min at room temperature, flow Equal the reflection green body layer for after 150 DEG C of dry 30min, forming that thickness is 0.01mm.Wherein, heat-conducting substrate is silicon nitride board, The thickness of heat-conducting substrate is 1mm；Reflective metals slurry, which includes reflective metals powder, assistant metal powder, the first glass dust and first, to be had The mass ratio of airborne body, reflective metals powder and the first glass dust is 10:1, reflective metals powder is that grain size is 100 nanometers~10 microns The Argent grain of sheet and the mixture of spherical alumina particles, the first glass dust be silicate glass powder, the first organic carrier is Ethyl cellulose, terpinol, butyl carbitol and butyl carbitol ester mixture, and the quality of the first organic carrier and reflection The mass ratio of metal powder is 1:0.5.The coefficient of thermal expansion of first glass dust differs 1 × 10 with the coefficient of thermal expansion of heat-conducting substrate-6/ K；The mass ratio of assistant metal powder and reflective metals powder is 0.8:1, assistant metal powder is platinum powder.
(2) fluorescent slurry is sprayed in reflection green body layer, 0.1 hour dry in 150 DEG C, it is the glimmering of 0.01mm to form thickness Light green body layer, then in the edge coating glass protection slurry of reflection green body layer, so that glass protection slurry is around reflection green body The edge of layer one week through drying, forms protection green body layer, is sintered 0.2 hour then at 800 DEG C, forms fluorescence coating, fine and close reflection Layer and protective layer, reflecting layer is between fluorescence coating and heat-conducting substrate, and protective layer surround reflecting layer one week, and protective layer and fluorescence Layer, heat-conducting substrate are fixedly connected, and fluorescence coating, heat-conducting substrate and the common fitted seal reflecting layer of protective layer, obtain the present embodiment Light conversion device.Wherein, fluorescent slurry includes fluorescent powder, the second glass dust and the second organic carrier, fluorescent powder and the second glass The mass ratio of glass powder is 1:0.1, the second glass dust can be borosilicate glass powder, and the second glass dust is soft with the first glass dust Change 200 DEG C of temperature difference of point, and the mass ratio of the quality of the second organic carrier and fluorescent powder is 1:0.01, the second organic carrier is The mixture of ethyl cellulose, terpinol and butyl carbitol ester.Glass protection slurry is the fluorescent slurry that fluorescence coating uses.
Embodiment 4
The preparation process of the light conversion device of the present embodiment is as follows：
(1) heat-conducting substrate is provided, in the middle part silk-screen printing reflective metals slurry of heat-conducting substrate, is stood at room temperature 30min, levelling form the reflection green body layer that thickness is 0.5mm after 150 DEG C of dry 15min.Wherein, heat-conducting substrate is silicon chip, The thickness of heat-conducting substrate is 2mm；Reflective metals slurry, which includes reflective metals powder, assistant metal powder, the first glass dust and first, to be had The mass ratio of airborne body, reflective metals powder and the first glass dust is 5:1, reflective metals powder is that grain size is 100 nanometers~500 nanometers Spherical Argent grain, the first glass dust is borosilicate glass powder, and the first organic carrier must for ethyl cellulose and butyl card The mixture of alcohol, and the mass ratio of the quality of the first organic carrier and reflective metals powder is 1:0.5.The thermal expansion of first glass dust Coefficient is equal with the coefficient of thermal expansion of heat-conducting substrate；The mass ratio of assistant metal powder and reflective metals powder is 0.5:1, assistant metal Powder is palladium powder and platinum powder.
(2) the silk-screen printing fluorescent slurry in reflection green body layer, it is 0.6 hour dry in 150 DEG C, fluorescence green body layer is formed, It is sintered 1 hour then at 700 DEG C, forms fluorescence coating and fine and close reflecting layer, reflecting layer is between fluorescence coating and heat-conducting substrate, then Epoxy resin is coated on reflecting layer, and epoxy resin is made to surround reflecting layer one week, it is cured, form matcoveredn, protective layer It is fixedly connected with fluorescence coating, heat-conducting substrate, and cooperation to seal reflecting layer, obtains jointly for fluorescence coating, heat-conducting substrate and protective layer The light conversion device of the present embodiment.Wherein, fluorescent slurry includes fluorescent powder, the second glass dust and the second organic carrier, fluorescent powder Mass ratio with the second glass dust is 1:50, the second glass dust can be borosilicate glass powder, the second glass dust and the first glass The softening point temperature of glass powder differs 100 DEG C, and the mass ratio of the quality of the second organic carrier and fluorescent powder is 1:0.01.
Embodiment 5
The preparation process of the light conversion device of the present embodiment is as follows：
(1) heat-conducting substrate is provided, reflective metals slurry is scratched at the middle part of heat-conducting substrate, stands 25min at room temperature, flow Equal the reflection green body layer for after 150 DEG C of dry 45min, forming that thickness is 0.15mm.Wherein, heat-conducting substrate is aluminum oxide substrate, The thickness of heat-conducting substrate is 4mm；Reflective metals slurry, which includes reflective metals powder, assistant metal powder, the first glass dust and first, to be had The mass ratio of airborne body, reflective metals powder and the first glass dust is 15:1, reflective metals powder is that grain size is 500 nanometers~800 to receive The sheet of rice and the spherical Argent grain mixed, the first glass dust are silicate glass powder, and the first organic carrier is ethyl cellulose With the mixture of butyl carbitol ester, and the mass ratio of the quality of the first organic carrier and reflective metals powder is 1:0.5.First glass The coefficient of thermal expansion of glass powder is equal with the coefficient of thermal expansion of heat-conducting substrate；Assistant metal powder and the mass ratio of reflective metals powder are 0.1:1, assistant metal powder is palladium powder.
(2) fluorescent powder is compressed into tablet form, through sintering, obtains fluorescence coating.
(3) fluorescence coating is laminated in reflection green body layer, is sintered 10min hours then at 830 DEG C, in heat-conducting substrate and fluorescence coating Between form fine and close reflecting layer, Parylene N-type (Parylene N) is then deposited on reflecting layer, and make poly- to diformazan Benzene N-type (Parylene N) surround reflecting layer one week, forms matcoveredn, and matcoveredn surround reflecting layer one week, and has protection Layer is fixedly connected, and fluorescence coating, heat-conducting substrate and the common fitted seal reflecting layer of matcoveredn with fluorescence coating, heat-conducting substrate, is obtained To the light conversion device of the present embodiment.
Embodiment 6
The preparation process of the light conversion device of the present embodiment is as follows：
(1) heat-conducting substrate is provided, reflective metals slurry is brushed at the middle part of heat-conducting substrate, stands 15min at room temperature, flow Equal the reflection green body layer for after 150 DEG C of dry 45min, forming that thickness is 1mm.Wherein, heat-conducting substrate be boron nitride substrate, heat conduction The thickness of substrate is 2.5mm；It is organic that reflective metals slurry includes reflective metals powder, assistant metal powder, the first glass dust and first The mass ratio of carrier, reflective metals powder and the first glass dust is 8:1, reflective metals powder is that grain size is 500 nanometers~800 nanometers Sheet Argent grain, the first glass dust are silicate glass powder, the first organic carrier for ethyl cellulose and tributyl citrate and The mixture of tributyl 2-acetylcitrate.The coefficient of thermal expansion of first glass dust differs 2.5 with the coefficient of thermal expansion of heat-conducting substrate ×10-6/K；The mass ratio of assistant metal powder and reflective metals powder is 0.2:1, assistant metal powder is platinum powder.
(2) fluorescent powder with ceramic sintering aid is mixed, successively through being molded and being sintered, obtains fluorescence coating.Wherein, fluorescent powder with The mass ratio of ceramic sintering aid is 100:0.01；Ceramic sintering aid is magnesia.
(3) fluorescence coating is laminated in reflection green body layer, is sintered 1 hour then at 600 DEG C, between heat-conducting substrate and fluorescence coating Fine and close reflecting layer is formed, Parylene c-type (Parylene C) is then deposited on reflecting layer, and make Parylene C Type (Parylene C) forms matcoveredn around reflecting layer one week, matcoveredn around reflecting layer one week, and matcoveredn with Fluorescence coating, heat-conducting substrate are fixedly connected, and fluorescence coating, heat-conducting substrate and the common fitted seal reflecting layer of matcoveredn, obtain this The light conversion device of embodiment.
Embodiment 7
The preparation process of the light conversion device of the present embodiment is as follows：
(1) heat-conducting substrate is provided, reflective metals slurry is brushed at the middle part of heat-conducting substrate, stands 14min at room temperature, flow It is flat 60min hours dry after 150 DEG C, form the reflection green body layer that thickness is 1mm.Wherein, heat-conducting substrate is boron nitride substrate, The thickness of heat-conducting substrate is 3.5mm；Reflective metals slurry includes reflective metals powder, assistant metal powder, the first glass dust and first The mass ratio of organic carrier, reflective metals powder and the first glass dust is 12:1, reflective metals powder is that grain size is 500 nanometers~800 The sheet Argent grain of nanometer, the first glass dust are borosilicate glass powder, the first organic carrier is ethyl cellulose and terpinol, The mixture of butyl carbitol and butyl carbitol ester.The coefficient of thermal expansion of first glass dust and the coefficient of thermal expansion of heat-conducting substrate Difference 3 × 10-6/K；The mass ratio of assistant metal powder and reflective metals powder is 0.2:1, assistant metal powder is platinum powder.
(2) fluorescent powder with ceramic sintering aid is mixed, successively through being molded and being sintered, obtains fluorescence coating.Wherein, fluorescent powder with The mass ratio of ceramic sintering aid is 100:10；Ceramic sintering aid is magnesia.
(3) fluorescence coating is laminated in reflection green body layer, is sintered 0.5 hour then at 700 DEG C, heat-conducting substrate and fluorescence coating it Between form fine and close reflecting layer, Parylene D types (Parylene D) are then deposited on reflecting layer, and make Parylene D types (Parylene D) surround reflecting layer one week, form matcoveredn, and matcoveredn surround reflecting layer one week, and matcoveredn It is fixedly connected, and fluorescence coating, heat-conducting substrate and the common fitted seal reflecting layer of matcoveredn, obtains with fluorescence coating, heat-conducting substrate The light conversion device of the present embodiment.
Embodiment 8
The preparation process of the light conversion device of the present embodiment is as follows：
(1) heat-conducting substrate is provided, in the middle part silk-screen printing reflective metals slurry of heat-conducting substrate, is stood at room temperature 10min, levelling form the reflection green body layer that thickness is 0.08mm after 200 DEG C of dry 30min.Wherein, heat-conducting substrate is partly leads Structure base board, the thickness of heat-conducting substrate is 0.8mm；Reflective metals slurry includes reflective metals powder, assistant metal powder, the first glass dust With the first organic carrier, the mass ratio of reflective metals powder and the first glass dust is 18:1, reflective metals powder is that grain size is 10 nanometers ~50 nanometers of sheet and spherical mixing Argent grain, the first glass dust are borosilicate glass powder, and the first organic carrier is ethyl Cellulose and terpinol and the mixture of butyl carbitol, and the quality of the first organic carrier and the mass ratio of reflective metals powder are 1:0.5.The coefficient of thermal expansion of first glass dust differs 5 × 10 with the coefficient of thermal expansion of heat-conducting substrate-6/K；Assistant metal powder with it is anti- The mass ratio for penetrating metal powder is 0.6:1, assistant metal powder is platinum powder.
(2) fluorescent powder, third glass dust and third organic carrier are mixed, successively through being molded and being sintered, obtains fluorescent film Piece.At this point, the mass ratio of fluorescent powder and third glass dust is 0.01:2；Third glass dust is silicate glass powder；Third is organic Carrier is the mixture of ethyl cellulose, terpinol, butyl carbitol and butyl carbitol ester.
(3) fluorescent film piece is laminated in reflection green body layer, obtains fluorescence coating, be sintered 1 hour then at 500 DEG C, in heat conduction base Fine and close reflecting layer is formed between plate and fluorescence coating, Parylene HT types (Parylene HT) are then deposited on reflecting layer, And make Parylene HT type rings around reflecting layer one week, form matcoveredn, matcoveredn had protection around reflecting layer one week Layer is fixedly connected, and fluorescence coating, heat-conducting substrate and the common fitted seal reflecting layer of matcoveredn with fluorescence coating, heat-conducting substrate, is obtained To the light conversion device of the present embodiment.
Embodiment 9
The preparation process of the light conversion device of the present embodiment is as follows：
(1) heat-conducting substrate is provided, in the middle part silk-screen printing reflective metals slurry of heat-conducting substrate, is stood at room temperature 60min, levelling form the reflection green body layer that thickness is 0.01mm, by 920 DEG C of heat preservation sinterings after 200 DEG C of dry 60min 10min forms fine and close reflecting layer on heat-conducting substrate.Wherein, heat-conducting substrate is semiconductor substrate, and the thickness of heat-conducting substrate is 2mm；Reflective metals slurry includes reflective metals powder, assistant metal powder, the first glass dust and the first organic carrier, reflective metals powder Mass ratio with the first glass dust is 19.9:0.1, reflective metals powder is the spherical aluminium that grain size is 10 nanometers~10 microns Grain, the first glass dust are borosilicate glass powder, and the first organic carrier is ethyl cellulose and butyl carbitol ester and citric acid The mixture of tributyl, and the mass ratio of the quality of the first organic carrier and reflective metals powder is 1:0.5.The heat of first glass dust The coefficient of expansion differs 1 × 10 with the coefficient of thermal expansion of heat-conducting substrate-6/K；Assistant metal powder and the mass ratio of reflective metals powder are 0.4:1, assistant metal powder is platinum powder.
(2) the coating glass protective paste on the edge in reflecting layer, so that glass protection slurry is around the edge in reflecting layer One week, through drying, form protection green body layer.Wherein, glass protection slurry is fluorescent slurry, wherein, fluorescent slurry includes fluorescence The mass ratio of powder, the second glass dust and the second organic carrier, fluorescent powder and the second glass dust is 1:30, the second glass dust is borosilicate Silicate glass powder, and the mass ratio of the quality of the second organic carrier and fluorescent powder is 1:0.01, the second organic carrier is fine for ethyl The mixture of dimension element, butyl carbitol and butyl carbitol ester.
(3) fluorescent slurry is brushed on reflecting layer and protection green body layer, it is 1 hour dry in 100 DEG C, thickness is formed as 1mm Fluorescence green body layer, be sintered 1 hour in 800 DEG C, form fluorescence coating, reflecting layer and protective layer, reflecting layer is located at fluorescence coating and leads Between hot substrate, protective layer was around reflecting layer one week, and protective layer is fixedly connected with fluorescence coating, heat-conducting substrate, and fluorescence coating, led Cooperation obtains the light conversion device of the present embodiment to seal reflecting layer jointly for hot substrate and protective layer.Wherein, it is glimmering in step (3) Light slurry is fluorescent slurry used in glass protection slurry in step (2).
Embodiment 10
The preparation process of the light conversion device of the present embodiment is as follows：
(1) heat-conducting substrate is provided, reflective metals slurry is sprayed at the middle part of heat-conducting substrate, stands 1 hour at room temperature, stream It is flat 0.5 hour dry after 200 DEG C, the reflection green body layer that thickness is 0.5mm is formed, 850 DEG C of heat preservation sintering 20min are being led Fine and close reflecting layer is formed on hot substrate.Wherein, heat-conducting substrate is semiconductor substrate, and the thickness of heat-conducting substrate is 5mm；Reflection gold Belong to slurry and include reflective metals powder, assistant metal powder, the first glass dust and the first organic carrier, reflective metals powder and the first glass The mass ratio of powder is 16:1, reflective metals powder is the spherical alumina particles that grain size is 10 nanometers~10 microns, and the first glass dust is Silicate glass powder, the first organic carrier are ethyl cellulose and terpinol, butyl carbitol ester, tributyl citrate and acetyl The mixture of tributyl citrate, and the mass ratio of the quality of the first organic carrier and reflective metals powder is 1:0.5.First glass The coefficient of thermal expansion of powder is equal with the coefficient of thermal expansion of heat-conducting substrate；The mass ratio of assistant metal powder and reflective metals powder is 0.7: 1, assistant metal powder is platinum powder.
(2) fluorescent slurry is sprayed on reflecting layer, it is 0.2 hour dry in 150 DEG C, form the fluorescence base that thickness is 0.05mm Body layer, then in the edge coating glass protection slurry of reflection green body layer, so that glass protection slurry is around reflection green body layer Edge one week through drying, forms protection green body layer, then at 800 DEG C of sintering 10min, forms fluorescence coating and protective layer, protective layer ring Around reflecting layer one week, and protective layer was fixedly connected with fluorescence coating, heat-conducting substrate, and fluorescence coating, heat-conducting substrate and protective layer are common Fitted seal reflecting layer obtains the light conversion device of the present embodiment.Wherein, fluorescent slurry include fluorescent powder, the second glass dust and The mass ratio of second organic carrier, fluorescent powder and the second glass dust is 1:90, the second glass dust can be silicate glass powder, and The quality of second organic carrier and the mass ratio of fluorescent powder are 1:0.01, the second organic carrier is ethyl cellulose, terpinol, fourth The mixture of base carbitol and tributyl citrate；Glass protection slurry is made of glass glaze powder and third organic carrier, glass The mass ratio of glass glaze powder and third organic carrier is 1:0.3, glass glaze mainly has SiO2-B2O3-Bi2O3Class glass, third Organic carrier is the mixture of ethyl cellulose, terpinol, butyl carbitol and citric acid three ester.
Embodiment 11
The preparation process of the light conversion device of the present embodiment is as follows：
(1) heat-conducting substrate is provided, reflective metals slurry is scratched on heat-conducting substrate, stands 5min at room temperature, after levelling In 200 DEG C of dry 15min, the reflection green body layer that thickness is 0.05mm is formed, by 900 DEG C of heat preservation sintering 30min, in heat-conducting substrate It is upper to form fine and close reflecting layer.Wherein, heat-conducting substrate is semiconductor substrate, and the thickness of heat-conducting substrate is 1.5mm；Reflective metals are starched Material includes reflective metals powder, assistant metal powder, the first glass dust and the first organic carrier, reflective metals powder and the first glass dust Mass ratio is 1:1, reflective metals powder is the spherical alumina particles that grain size is 10 nanometers~10 microns, and the first glass dust is borosilicic acid Salt glass dust, mixture of first organic carrier for ethyl cellulose and terpinol, and the quality of the first organic carrier and reflection The mass ratio of metal powder is 1:0.5.The coefficient of thermal expansion of first glass dust differs 4 × 10 with the coefficient of thermal expansion of heat-conducting substrate-6/ K；The mass ratio of assistant metal powder and reflective metals powder is 0.8:1, assistant metal powder is platinum powder.
(2) the silk-screen printing fluorescent slurry on reflecting layer, it is 1 hour dry in 150 DEG C, fluorescence green body layer is formed, then at 800 DEG C sintering 1 hour, forms fluorescence coating, Parylene dix is then deposited on the reflecting layer of stacking, fluorescence coating and heat-conducting substrate SF types, form matcoveredn, and protective layer masking fluorescence coating, heat-conducting substrate and reflecting layer obtain the light conversion device of the present embodiment. Wherein, fluorescent slurry includes fluorescent powder, the second glass dust and the second organic carrier, and the mass ratio of fluorescent powder and the second glass dust is 1:0.5, the second glass dust is silicate glass powder, and the mass ratio of the quality of the second organic carrier and fluorescent powder is 1:0.01.
Comparative example 1
The preparation process of the light conversion device of comparative example 1 is as follows：
(1) heat-conducting substrate is provided, blade coating reflection slurry, stands 10min at room temperature on heat-conducting substrate, levelling after 100 DEG C of dry 20min form the reflection green body layer that thickness is 0.002mm, wherein, heat-conducting substrate is aluminium nitride substrate, heat conduction base The thickness of plate is 1mm；It reflects slurry and includes white reflective particle, aluminium oxide, the first glass dust and the first organic carrier；It is white anti- The mass ratio for penetrating particle alumina and the first glass dust is 1:1, white reflective particle is the ball that grain size is 10 nanometers~10 microns Shape particle, the first glass dust are silicate glass powder, and the first organic carrier is the mixture of ethyl cellulose and terpinol, and the The quality of one organic carrier is 1 with the mass ratio of white reflective particle:0.5.
(2) fluorescent slurry is brushed in reflection green body layer, 0.5 hour dry in 100 DEG C, it is the glimmering of 0.1mm to form thickness Light green body layer is sintered 10min in 900 DEG C, porous reflecting layer and fluorescence coating is formed on heat-conducting substrate.Wherein, fluorescent slurry Including fluorescent powder, the second glass dust and the second organic carrier, the mass ratio of fluorescent powder and the second glass dust is 1:1, the second glass Powder can be silicate glass powder, and the mass ratio of the quality of the second organic carrier and fluorescent powder is 1:1, the second organic carrier is The mixture of ethyl cellulose, terpinol and butyl carbitol.
The light conversion device of the light conversion device of embodiment 1 and comparative example 1 is used into same blue laser as exciting light Source obtains the luminous intensity of the light conversion device of embodiment 1 and the light conversion device of comparative example 1 with the driving electricity of blue light source The change curve of stream, is shown in Fig. 5, from the figure, it can be seen that when originating smaller driving current, the light of embodiment 1 and comparative example 1 turns The luminous intensity of changing device is close, but with the raising of driving current, and the luminous intensity of the light conversion device of embodiment 1 significantly compares The luminous flux of the light conversion device of comparative example 1 is high, and when laser drive current is increased to 0.8A, the light converting means of comparative example 1 The luminous intensity put drastically reduces, and further increases driving current, and due to its higher fuel factor, fluorescence coating cannot be born High power laser light is excited and is quenched, and the light conversion device of embodiment 1 still shows stable bloom under the driving current of 1.1A Flux light output illustrates it with relatively low thermal resistance and the stronger capacity of heat transmission.It can thus be seen that light provided by the invention turns Changing device still has better brightness and reliability under the conditions of higher source luminance.And the light conversion device of embodiment 2~11 With the intensity profile of light emission similar with the light conversion device of embodiment 1, the light conversion device phase of performance and embodiment 1 Seemingly, details are not described herein.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited In contradiction, it is all considered to be the range of this specification record.
Embodiment described above only expresses the several embodiments of the present invention, and description is more specific and detailed, but simultaneously It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that those of ordinary skill in the art are come It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these are all the protection models of the present invention It encloses.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.

Claims (9)

1. a kind of preparation method of light conversion device, which is characterized in that include the following steps：
Heat-conducting substrate is provided；
It is formed and is stacked gradually in the fine and close reflecting layer on the heat-conducting substrate and fluorescence coating on the heat-conducting substrate, obtain light Conversion equipment；Wherein, the reflecting layer is obtained by reflective metals slurry through sintering, and the reflective metals slurry includes reflective metals The mass ratio of powder, the first glass dust and the first organic carrier, the reflective metals powder and first glass dust is 1:1~ 19.9:0.1；The reflective metals powder is selected from least one of silver powder and aluminium powder, and the coefficient of thermal expansion of the first glass dust is with leading The coefficient of thermal expansion difference 0~5 × 10 of hot substrate-6/ K, so as to which the reflecting layer formed after sintering be made to be bonded in heat-conducting substrate Together；The mixing that reflective metals powder is sheet-like particle or spherical particle or reflective metals powder is sheet-like particle and spherical particle Object, the grain size of reflective metals powder is 10 nanometers~10 microns；
Wherein, it is formed and is stacked gradually in the fine and close reflecting layer on the heat-conducting substrate and described on the heat-conducting substrate The step of fluorescence coating is specially：Reflection green body layer is formed on the heat-conducting substrate using the reflective metals slurry, described It reflects and fluorescence green body layer is formed in green body layer, through sintering, the fine and close reflecting layer is formed on the heat-conducting substrate；Described Reflecting the step of forming the fluorescence green body layer in green body layer is specially：Fluorescent slurry is coated in the reflection green body layer, is passed through It is dry, form the fluorescence green body layer；Wherein, the fluorescent slurry includes fluorescent powder, the second glass dust and the second organic carrier, The mass ratio of the fluorescent powder and second glass dust is 1:0.1~99, second glass dust and first glass dust Softening point temperature be not much different in 400 DEG C；
It is stacked gradually alternatively, being formed on the heat-conducting substrate in the fine and close reflecting layer on the heat-conducting substrate and described The step of fluorescence coating is specially：Reflection green body layer is formed on the heat-conducting substrate using the reflective metals slurry, described The fluorescence coating is formed in reflection green body layer, through sintering, the fine and close reflecting layer, fluorescence coating are formed on the heat-conducting substrate Coefficient of thermal expansion differed with the coefficient of thermal expansion of the first glass dust no more than 10 × 10-6/K；
It is stacked gradually alternatively, being formed on the heat-conducting substrate in the fine and close reflecting layer on the heat-conducting substrate and described The step of fluorescence coating is specially：Reflection green body layer is formed on the heat-conducting substrate using the reflective metals slurry, through being sintered, The fine and close reflecting layer is formed on the heat-conducting substrate；Fluorescence green body layer is formed on the reflecting layer, through sintering, is formed The fluorescence coating；It is specially the fluorescence green body layer is formed on the reflecting layer the step of：It is coated on the reflecting layer glimmering Light slurry through drying, forms the fluorescence green body layer；Wherein, the fluorescent slurry includes fluorescent powder, the second glass dust and second The mass ratio of organic carrier, the fluorescent powder and second glass dust is 1:0.1~99, second glass dust and described the The softening point temperature of one glass dust is not much different in 400 DEG C.
2. the preparation method of light conversion device according to claim 1, which is characterized in that the shape in the reflection green body layer It is specially into the step of fluorescence coating：The fluorescence coating is provided, the fluorescence coating is laminated in the reflection green body layer, In：
The fluorescence coating is made by the steps to obtain：Fluorescent powder is compressed into tablet form, through sintering, obtains the fluorescence coating；
Alternatively, the fluorescence coating is made by the steps to obtain：Fluorescent powder mix with ceramic sintering aid, successively through molding with Sintering, obtains the fluorescence diaphragm；
Alternatively, the fluorescence coating is made by the steps to obtain：Fluorescent powder, third glass dust and third organic carrier are mixed It closes, successively through being molded and being sintered, obtains the fluorescence coating.
3. the preparation method of light conversion device according to claim 1, which is characterized in that the shape in the reflection green body layer The step of fluorescence coating before, in addition to the coating glass protective paste on the edge of the reflection green body layer, so that institute It states glass protection slurry and surround the edge for reflecting green body layer one week, through drying, obtain protection green body layer；Wherein, described After the step of sintering, the protection green body layer forms protective layer, and the protective layer is total to the fluorescence coating, the heat-conducting substrate It is same to coordinate to seal the reflecting layer；
Alternatively, before the step of forming the fluorescence green body layer in the reflection green body layer, it is additionally included in the reflection green body Coating glass protective paste on the edge of layer, so that the glass protection slurry surround the edge for reflecting green body layer one week, Through drying, protection green body layer is obtained；Wherein, after the step of sintering, the protection green body layer forms protective layer, described Fluorescence green body layer forms fluorescence coating, and cooperation is described anti-to seal jointly with the fluorescence coating, the heat-conducting substrate for the protective layer Penetrate layer；
Alternatively, after the step of forming the fluorescence coating in the reflection green body layer, before the step of sintering, also wrap The edge coating glass protection slurry in the reflection green body layer is included, so that the glass protection slurry is around the reflection green body The edge of layer one week through drying, obtains protection green body layer；Wherein, after the step of sintering, the protection green body layer shape Into protective layer, the protective layer coordinates to seal the reflecting layer with the fluorescence coating, the heat-conducting substrate jointly；
Alternatively, after the step of forming the fluorescence green body layer in the reflection green body layer, after the step of sintering, The edge coating glass protection slurry of the reflection green body layer is additionally included in, so that the glass protection slurry is around the reflection The edge of green body layer one week through drying, obtains protection green body layer；Wherein, after the step of sintering, the protection green body Layer forms protective layer, and the fluorescence green body layer forms fluorescence coating, and the protective layer and the fluorescence coating, the heat-conducting substrate are common Coordinate to seal the reflecting layer.
4. the preparation method of light conversion device according to claim 1, which is characterized in that formed on the reflecting layer glimmering Before the step of light green body layer, in addition to the coating glass protective paste on the edge in the reflecting layer, so that the glass is protected It protects the edge in the circular reflecting layer of slurry one week, through drying, obtains protection green body layer；Wherein, the sintering the step of it Afterwards, the protection green body layer forms protective layer, and the protective layer coordinates to seal jointly with the fluorescence coating, the heat-conducting substrate The reflecting layer；
Alternatively, after the step of fluorescence green body layer is formed on the reflecting layer, it is additionally included in the reflection green body layer Edge coating glass protection slurry, so that the glass protection slurry, through drying, is obtained around the edge one week in the reflecting layer Protect green body layer；Wherein, after the step of sintering, the protection green body layer forms protective layer, the fluorescence green body layer Fluorescence coating is formed, the protective layer coordinates to seal the reflecting layer with the fluorescence coating, the heat-conducting substrate jointly.
5. the preparation method of the light conversion device according to claim 1 or 4, which is characterized in that use the reflective metals Slurry formed on the heat-conducting substrate it is described reflection green body layer the step of be specially：It is coated on the heat-conducting substrate described anti- Metal paste is penetrated, through drying, obtains reflection green body layer；
Alternatively, using the reflective metals slurry formed on the heat-conducting substrate it is described reflection green body layer the step of be specially： By the reflective metals sizing material forming and drying, the reflection green body layer is obtained, the reflection green body layer is laminated in described lead On hot substrate.
6. the preparation method of light conversion device according to claim 1, which is characterized in that the thermal conductivity of the heat-conducting substrate More than 10W/mK.
7. the preparation method of light conversion device according to claim 1, which is characterized in that formed on the heat-conducting substrate It stacks gradually after the step of fine and close reflecting layer on the heat-conducting substrate and the fluorescence coating, further includes using close Closure material forms protective layer on the reflecting layer, and makes the protective layer around the reflecting layer one week or make the protection Layer covers the heat-conducting substrate, the reflecting layer and the fluorescence coating；Wherein, the sealing material for epoxy resin or gathers to two Toluene.
8. the light conversion device that the preparation method of light conversion device as described in claim 1 is prepared.
9. application of the light conversion device as claimed in claim 8 in the light-source system of lamps and lanterns or display.
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