CN105716039A - Light conversion device and preparation method and application thereof - Google Patents

Light conversion device and preparation method and application thereof Download PDF

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CN105716039A
CN105716039A CN201610225349.4A CN201610225349A CN105716039A CN 105716039 A CN105716039 A CN 105716039A CN 201610225349 A CN201610225349 A CN 201610225349A CN 105716039 A CN105716039 A CN 105716039A
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green body
body layer
conducting substrate
layer
heat
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CN105716039B (en
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杨阳
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
    • F21V9/40—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters with provision for controlling spectral properties, e.g. colour, or intensity

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Projection Apparatus (AREA)
  • Optical Elements Other Than Lenses (AREA)

Abstract

The invention relates to a light conversion device and a preparation method and application thereof. The light conversion device comprises a heat conduction substrate, a dense reflection layer overlapped on the heat conduction substrate, and a fluorescence layer overlapped on the reflection layer. The reflection layer is obtained by sintering reflective metal slurry, the reflective metal slurry comprises reflective metal powder, first glass powder and a first organic carrier, the mass ratio of the reflective metal powder to the first glass powder is 1:1-19.9:0.1, and the reflective metal powder is selected from at least one of silver powder and aluminum powder. The reflection layer of the light conversion device has high reflection performance, high heat conductivity and low thermal resistance.

Description

Light conversion device and its preparation method and application
Technical field
The present invention relates to illumination or field of display, particularly relate to a kind of light conversion device and its preparation method and application.
Background technology
A new generation's Solid State Laser light source is high due to its high brightness, stability, therefore becomes the perfect light source replacing high voltage mercury lamp.At present, blue laser excites the colour wheel of high speed rotating to can effectively solve the problem that the heating quencher problem of high power density laser excitated fluorescent powder, and the laser display of high efficiency, low cost is become a reality, and is developing progressively one of mainstream technology into LASER Light Source.
Colour wheel comparatively conventional at present is reflective colour wheel, but the reflecting layer of existing luminous reflectance formula colour wheel is loose structure, and thermal resistance is higher, and heat conductivity is bad, is unfavorable for the heat radiation of power light source, directly affects brightness and the reliability of colour wheel.Although the problem that its thermal resistance is higher can be solved by plating reflectance coating; but the colour wheel adopting plating reflectance coating relates to multiple techniques such as plating transition film, metallic reflective coating, metal protective film, soldering pad layer and soldering layer; process is complicated; cost is high; and the bigger colour wheel of area to prepare difficulty bigger, it is difficult to realize mass production.
Summary of the invention
Based on this, it is necessary to provide the light conversion device of a kind of high brightness and high reliability.
Additionally, also provide for preparation method and its application of a kind of above-mentioned light conversion device.
A kind of light conversion device, including heat-conducting substrate, the fine and close reflecting layer being laminated on described heat-conducting substrate and be laminated in the fluorescence coating on described reflecting layer, described reflecting layer is obtained by reflective metals slurry is sintered, it is 1:1～19.9:0.1 that described reflective metals slurry includes the mass ratio of reflective metals powder, the first glass dust and the first organic carrier, described reflective metals powder and described first glass dust；Described reflective metals powder at least one in argentum powder and aluminium powder.
Wherein in an embodiment; also include surrounding the described reflecting layer protective layer of a week; described protective layer and described heat-conducting substrate, described fluorescence coating are all tightly connected, so that reflecting layer described in described protective layer, described heat-conducting substrate, the common fitted seal of described fluorescence coating.
Wherein in an embodiment, also including protective layer, described protective layer, described protective layer is wrapped on the described heat-conducting substrate of stacking, described reflecting layer and described fluorescence coating, and covers described heat-conducting substrate, described reflecting layer and described fluorescence coating.
The preparation method of a kind of light conversion device, comprises the steps:
Heat-conducting substrate is provided；
Described heat-conducting substrate is formed the fine and close reflecting layer and fluorescence coating that stack gradually on described heat-conducting substrate, obtains light conversion device；Wherein, described reflecting layer is obtained by reflective metals slurry is sintered, and it is 1:1～19.9:0.1 that described reflective metals slurry includes the mass ratio of reflective metals powder, the first glass dust and the first organic carrier, described reflective metals powder and described first glass dust；Described reflective metals powder at least one in argentum powder and aluminium powder.
Wherein in an embodiment, described heat-conducting substrate forms the step of fine and close described reflecting layer and the described fluorescence coating stacking gradually on described heat-conducting substrate particularly as follows: use described reflective metals slurry to form reflection green body layer on described heat-conducting substrate；Described reflection green body layer is formed fluorescence green body layer or described fluorescence coating, sintered, described heat-conducting substrate is formed the described reflecting layer of densification.
Wherein in an embodiment, described reflection green body layer forms the step of described fluorescence green body layer particularly as follows: be coated with fluorescent slurry, drying in described reflection green body layer, form described fluorescence green body layer；Wherein, it is 1:0.1～99 that described fluorescent slurry includes the mass ratio of fluorescent material, the second glass dust and the second organic carrier, described fluorescent material and described second glass dust, and the softening point temperature of described second glass dust and described first glass dust is more or less the same in 400 DEG C.
Wherein in an embodiment, described reflection green body layer forms the step of described fluorescence coating particularly as follows: provide described fluorescence coating, described fluorescence coating is laminated in described reflection green body layer, wherein:
Described fluorescence coating prepares as follows: fluorescent material is pressed into lamellar, sintered, obtains described fluorescence coating；
Or, described fluorescence coating prepares as follows: is mixed with pottery sintering aid by fluorescent material, successively through molding and sintering, obtains described fluorescence diaphragm；
Or, described fluorescence coating prepares as follows: fluorescent material, the 3rd glass dust and the 3rd organic carrier is mixed, successively through molding and sintering, obtains described fluorescence coating.
Wherein in an embodiment; before described reflection green body layer is formed the step of described fluorescence coating, it is additionally included on the edge of described reflection green body layer coating glass protection slurry, so that described glass protection slurry was around the edge of described reflection green body layer one week; drying, obtains protection green body layer；Wherein, after the step of described sintering, described protection green body layer forms protective layer, and described protective layer coordinates to seal described reflecting layer with described fluorescence coating, described heat-conducting substrate jointly；
Or; before described reflection green body layer is formed the step of described fluorescence green body layer, it is additionally included on the edge of described reflection green body layer coating glass protection slurry, so that described glass protection slurry was around the edge of described reflection green body layer one week; drying, obtains protection green body layer；Wherein, after the step of described sintering, described protection green body layer forms protective layer, and described fluorescence green body layer forms fluorescence coating, and described protective layer coordinates to seal described reflecting layer with described fluorescence coating, described heat-conducting substrate jointly；
Or; after described reflection green body layer is formed the step of described fluorescence coating; before the step of described sintering; it is additionally included in the edge coating glass protection slurry of described reflection green body layer; so that described glass protection slurry is around the edge one week of described reflection green body layer; drying, obtains protection green body layer；Wherein, after the step of described sintering, described protection green body layer forms protective layer, and described protective layer coordinates to seal described reflecting layer with described fluorescence coating, described heat-conducting substrate jointly；
Or; after described reflection green body layer is formed the step of described fluorescence green body layer; after the step of described sintering; it is additionally included in the edge coating glass protection slurry of described reflection green body layer; so that described glass protection slurry is around the edge one week of described reflection green body layer; drying, obtains protection green body layer；Wherein, after the step of described sintering, described protection green body layer forms protective layer, and described fluorescence green body layer forms fluorescence coating, and described protective layer coordinates to seal described reflecting layer with described fluorescence coating, described heat-conducting substrate jointly.
Wherein in an embodiment, described heat-conducting substrate forms the step of fine and close described reflecting layer and the described fluorescence coating stacking gradually on described heat-conducting substrate particularly as follows: use described reflective metals slurry to form reflection green body layer on described heat-conducting substrate, sintered, described heat-conducting substrate is formed the described reflecting layer of densification；Described reflecting layer is formed fluorescence green body layer, sintered, form described fluorescence coating.
Wherein in an embodiment, described reflecting layer forms the step of described fluorescence green body layer particularly as follows: be coated with fluorescent slurry, drying on described reflecting layer, form described fluorescence green body layer；Wherein, it is 1:0.1～99 that described fluorescent slurry includes the mass ratio of fluorescent material, the second glass dust and the second organic carrier, described fluorescent material and described second glass dust, and the softening point temperature of described second glass dust and described first glass dust is more or less the same in 400 DEG C.
Wherein in an embodiment; before described reflecting layer is formed the step of fluorescence green body layer, it is additionally included on the edge in described reflecting layer coating glass protection slurry, so that described glass protection slurry is around the edge one week in described reflecting layer; drying, obtains protection green body layer；Wherein, after the step of described sintering, described protection green body layer forms protective layer, and described protective layer coordinates to seal described reflecting layer with described fluorescence coating, described heat-conducting substrate jointly；
Or, after described reflecting layer is formed the step of described fluorescence green body layer, it is additionally included in the edge coating glass protection slurry of described reflection green body layer, so that described glass protection slurry is around the edge one week in described reflecting layer, drying, obtains protecting green body layer；Wherein, after the step of described sintering, described protection green body layer forms protective layer, and described fluorescence green body layer forms fluorescence coating, and described protective layer coordinates to seal described reflecting layer with described fluorescence coating, described heat-conducting substrate jointly.
Wherein in an embodiment, use described reflective metals slurry to form the step of described reflection green body layer on described heat-conducting substrate particularly as follows: be coated with described reflective metals slurry, drying on described heat-conducting substrate, obtain reflection green body layer；
Or, use described reflective metals slurry to form the step of described reflection green body layer on described heat-conducting substrate particularly as follows: by described reflective metals sizing material forming and dry, obtain described reflection green body layer, described reflection green body layer be laminated on described heat-conducting substrate.
Wherein in an embodiment, the thermal conductivity of described heat-conducting substrate is more than 10W/mK.
Wherein in an embodiment, the thermal coefficient of expansion of described first glass dust differs 0～5 × 10 with the thermal coefficient of expansion of described heat-conducting substrate-6/K。
Wherein in an embodiment, the particle diameter of described reflective metals powder is 10 nanometers～10 microns.
Wherein in an embodiment, described reflective metals powder is sheet-like particle or spherical particle, or the mixture that described reflective metals powder is sheet-like particle and spherical particle.
Wherein in an embodiment; after described heat-conducting substrate is formed the step of fine and close described reflecting layer and the described fluorescence coating stacking gradually on described heat-conducting substrate; also include using encapsulant to form protective layer on described reflecting layer; and make described protective layer around described reflecting layer one week, or described protective layer is made to cover described heat-conducting substrate, described reflecting layer and described fluorescence coating；Wherein, described encapsulant is epoxy resin or Parylene.
The application in the light-source system of light fixture or display of the above-mentioned light conversion device.
Owing to the reflecting layer of above-mentioned light conversion device is obtained by reflective metals slurry is sintered.Reflective metals slurry includes reflective metals powder, first glass dust and the first organic carrier, the mass ratio of reflective metals powder and the first glass dust is 1:1～19.9:0.1, reflective metals powder at least one in argentum powder and aluminium powder, and reflecting layer is fine and close reflecting layer, the reflecting layer making above-mentioned light conversion device not only has higher reflecting properties, also there is higher thermal conductivity and relatively low thermal resistance, light conversion device prepared by said method is made to have higher brightness, and above-mentioned Wavelength converter and current Wavelength converter contrast, drive the test result under electric current relatively can release in same laser, the laser current that the Wavelength converter of the present invention bears is higher, reliability is higher.
Accompanying drawing explanation
Fig. 1 is the structural representation of the light conversion device of an embodiment；
Fig. 2 is the flow chart of the preparation method of the light conversion device of an embodiment；
Fig. 3 is the flow chart of the method realizing step S220 of the preparation method of the light conversion device of an embodiment；
Fig. 4 is the flow chart that the preparation method of the light conversion device of three embodiments forms the method for fine and close reflecting layer and the fluorescence coating stacking gradually on heat-conducting substrate on heat-conducting substrate；
Fig. 5 is the light conversion device of embodiment 1 and comparative example 1 luminous flux under the same blue laser light source variation relation curve chart with electric current.
Detailed description of the invention
For the ease of understanding the present invention, below with reference to relevant drawings, the present invention is described more fully.Accompanying drawing gives the preferred embodiment of the present invention.But, the present invention can realize in many different forms, however it is not limited to embodiment described herein.On the contrary, the purpose providing these embodiments is to make the understanding to the disclosure more thorough comprehensively.
Unless otherwise defined, all of technology used herein is identical with the implication that the those skilled in the art belonging to the present invention are generally understood that with scientific terminology.The term used in the description of the invention herein is intended merely to the purpose describing specific embodiment, it is not intended that in the restriction present invention.
As it is shown in figure 1, the light conversion device 100 of an embodiment, including heat-conducting substrate 110, reflecting layer 120 and fluorescence coating 130.
Wherein, the thermal conductivity of heat-conducting substrate 110 is more than 10W/mK.Concrete, heat-conducting substrate 110 can be aluminium nitride substrate, silicon carbide substrate, silicon nitride board, silicon chip, aluminum oxide substrate or boron nitride substrate.These heat-conducting substrates 110 are high temperature resistant, and have good heat conductivility.
Wherein, the thickness of heat-conducting substrate 110 is 0.1～5mm.
Wherein, reflecting layer 120 is fine and close reflecting layer.Reflecting layer 120 is obtained by reflective metals slurry is sintered.Wherein, reflective metals slurry includes reflective metals powder, the first glass dust and the first organic carrier.
Wherein, the mass ratio of reflective metals powder and the first glass dust is 1:1～19.9:0.1.
Wherein, reflective metals powder at least one in argentum powder and aluminium powder.Preferably, reflective metals powder is argentum powder, has higher reflectance and higher thermal conductivity due to argentum powder, it is possible to make the reflecting layer 120 of light conversion device 100 have higher reflectance and higher thermal conductivity.
Wherein, reflective metals powder can be spherical, strip, bar-shaped, lamellar or spherical；Preferably, reflective metals powder is sheet-like particle or spherical particle, or the mixture that reflective metals powder is sheet-like particle and spherical particle.The reflective metals powder of lamellar is conducive to mutually overlapping to form heat conduction network between the reflective metals powder after sintering, to improve the thermal conductivity in the reflecting layer 120 of light conversion device 100；Spherical reflective metals powder particles bulk density is high, and slurry fluidity is good, is conducive to improving the thermal conductivity in the reflecting layer 120 of light conversion device 100.
Further, the particle diameter of reflective metals powder is 10 nanometers～10 microns.Bigger granule not easily densified sintering product, less granule not easily disperses.
Wherein, the first glass dust coloured glass dust after can using sintering, it is possible to use do not have coloured glass dust after sintering；Preferably, the first glass dust is the glass dust more than 80% of the visible light transmissivity after water white transparency and sintering after being sintering.Such as, the first glass dust is silicate glass powder or borosilicic acid salt glass dust.
Wherein, the thermal coefficient of expansion of the first glass dust differs 0～5 × 10 with the thermal coefficient of expansion of heat-conducting substrate 110-6/ K, can be bonded together between reflecting layer 120 and the heat-conducting substrate 110 being subsequently formed reliably so that sintering.Further, the thermal coefficient of expansion of the first glass dust differs 0～3 × 10 with the thermal coefficient of expansion of heat-conducting substrate 110-6/ K；Further, the thermal coefficient of expansion of the first glass dust differs 0～1 × 10 with the thermal coefficient of expansion of heat-conducting substrate 110-6/K。
Wherein, the first organic carrier is made up of the organic solvent of bonding agent and different boiling.Wherein, bonding agent is ethyl cellulose；Solvent at least one in terpineol, butyl carbitol, butyl carbitol ester, tributyl citrate and tributyl 2-acetylcitrate.
Further, reflective metals slurry also includes assistant metal powder, assistant metal powder at least one in palladium powder and platinum powder.Wherein, palladium powder and platinum powder have the adverse effect of the silver migration reducing high temperature sintering, improve reflectance stability.Wherein, assistant metal powder is not higher than 1:1 with the mass ratio of reflective metals powder.
Wherein, fluorescence coating 130 can send fluorescence under the effect of exciting light.
In the present embodiment; light conversion device 100 also includes surrounding the reflecting layer protective layer of 120 1 weeks 140; protective layer 140 and heat-conducting substrate 110, fluorescence coating 130 are all tightly connected, so that protective layer 140, heat-conducting substrate 110, the common fitted seal reflecting layer 120 of fluorescence coating 130.
Being appreciated that in other embodiments, protective layer is wrapped on the heat-conducting substrate 110 of stacking, reflecting layer 120 and fluorescence coating 130, and covers heat-conducting substrate 110, reflecting layer 120 and fluorescence coating 130.Heat-conducting substrate 110, reflecting layer 120 and fluorescence coating 130 stratification laminates, namely protective layer is wrapped on laminates, and shielding layer overlapping piece.
Wherein, the material of protective layer 140 is epoxy resin or Parylene.Wherein, Parylene can be N-type Parylene, C type Parylene, D type Parylene or the HT type Parylene that specialcoatingsystems company of the U.S. produces, or is the dixC type of KISCO Co., Ltd. of Japan production, D type, N-type, SR type, NR type, HR type, CF type, SF type Parylene.Or, the material of protective layer 140 can also be the material that fluorescence coating 130 is identical；Or, the material of protective layer 140 can also be silicate glass, borosilicate glass or glass glaze.
Owing to the reflecting layer 120 of above-mentioned light conversion device 100 is obtained by reflective metals slurry is sintered.Reflective metals slurry includes reflective metals powder, the first glass dust and the first organic carrier, the mass ratio of reflective metals powder and the first glass dust is 1:1～19.9:0.1, reflective metals powder at least one in argentum powder and aluminium powder, and reflecting layer 120 is fine and close reflecting layer 120, the reflecting layer 120 making above-mentioned light conversion device 100 not only has higher reflecting properties, also there is higher thermal conductivity and relatively low thermal resistance, light conversion device 100 prepared by said method is made to have higher light efficiency, more reliably.
Above-mentioned light conversion device 100 can be applicable in the light-source system of light fixture or display.
As in figure 2 it is shown, the preparation method of the light conversion device of an embodiment, can be used for preparing above-mentioned light conversion device, the preparation method of this light conversion device comprises the steps:
Step S210: heat-conducting substrate is provided.
Wherein, the thermal conductivity of heat-conducting substrate is more than 10W/mK.Concrete, heat-conducting substrate can be aluminium nitride substrate, silicon carbide substrate, silicon nitride board, silicon chip, aluminum oxide substrate or boron nitride substrate.These heat-conducting substrates are high temperature resistant, and have good heat conductivility.
Wherein, the thickness of heat-conducting substrate is 0.1～5mm.
Step S220: form the fine and close reflecting layer and fluorescence coating that stack gradually on heat-conducting substrate on heat-conducting substrate, obtain light conversion device.
Wherein, reflecting layer is fine and close reflecting layer.Reflecting layer is obtained by reflective metals slurry is sintered.Wherein reflective metals slurry includes reflective metals powder, the first glass dust and the first organic carrier.
Wherein, the mass ratio of reflective metals powder and the first glass dust is 1:1～19.9:0.1.
Wherein, reflective metals powder at least one in argentum powder and aluminium powder.Preferably, reflective metals powder is argentum powder, has higher reflectance and higher thermal conductivity due to argentum powder, it is possible to make the reflecting layer of light conversion device have higher reflectance and higher thermal conductivity.
Wherein, reflective metals powder can be spherical, strip, bar-shaped, lamellar or spherical；Preferably, reflective metals powder is sheet-like particle or spherical particle, or the mixture that reflective metals powder is sheet-like particle and spherical particle.The reflective metals powder of lamellar is conducive to mutually overlapping to form heat conduction network between the reflective metals powder after sintering, to improve the thermal conductivity in the reflecting layer of light conversion device；Spherical reflective metals powder particles bulk density is high, and slurry fluidity is good, is conducive to improving the thermal conductivity in the reflecting layer of light conversion device.
Further, the particle diameter of reflective metals powder is 10 nanometers～10 microns.Bigger granule not easily densified sintering product, less granule not easily disperses.
Wherein, the first glass dust coloured glass dust after can using sintering, it is possible to use do not have coloured glass dust after sintering；Preferably, the first glass dust is the glass dust more than 80% of the visible light transmissivity after water white transparency and sintering after being sintering.Such as, the first glass dust is silicate glass powder or borosilicate glass powder.
Wherein, the thermal coefficient of expansion of the first glass dust differs 0～5 × 10 with the thermal coefficient of expansion of heat-conducting substrate-6/ K, can be bonded together between reflecting layer and the heat-conducting substrate being subsequently formed reliably so that sintering.Further, the thermal coefficient of expansion of the first glass dust differs 0～3 × 10 with the thermal coefficient of expansion of heat-conducting substrate-6/ K；Further, the thermal coefficient of expansion of the first glass dust differs 0～1 × 10 with the thermal coefficient of expansion of heat-conducting substrate-6/K。
First organic carrier is made up of the organic solvent of bonding agent and different boiling.Wherein, bonding agent is ethyl cellulose；Solvent at least one in terpineol, butyl carbitol, butyl carbitol ester, tributyl citrate and tributyl 2-acetylcitrate.
Further, reflective metals slurry also includes assistant metal powder, assistant metal powder at least one in palladium powder and platinum powder.Wherein, palladium powder and platinum powder have the adverse effect of the silver migration reducing high temperature sintering, improve reflectance stability.Wherein, assistant metal powder is not higher than 1:1 with the mass ratio of reflective metals powder.
In the present embodiment, heat-conducting substrate is formed the step of fine and close reflecting layer and the fluorescence coating stacking gradually on heat-conducting substrate particularly as follows:
Step S222: use reflective metals slurry to form reflection green body layer on heat-conducting substrate.
Wherein, the thickness reflecting green body layer is 0.001～1mm.
In the present embodiment, use reflective metals slurry to form the step of reflection green body layer on heat-conducting substrate particularly as follows: be coated with reflective metals slurry, drying on heat-conducting substrate, obtain reflection green body layer.
Wherein, the method being coated with reflective metals slurry on heat-conducting substrate can be brushing, blade coating, spraying or silk screen printing.
Further, after heat-conducting substrate is coated with the step of reflective metals slurry, also include being coated with the step that the heat-conducting substrate of reflective metals slurry at room temperature stands, so that reflective metals slurry levelling on heat-conducting substrate.
Wherein, the baking temperature being coated with the drying steps after reflective metals slurry on heat-conducting substrate is 100～200 DEG C.
It is appreciated that, the method being coated with reflective metals slurry on heat-conducting substrate can not also be adopted to form reflection green body layer, such as, in other embodiments, reflective metals slurry is used to form the step reflecting green body layer on heat-conducting substrate particularly as follows: by reflective metals sizing material forming and dry, obtain reflection green body layer, reflection green body layer is laminated on heat-conducting substrate.
Step S224: form fluorescence green body layer in reflection green body layer, sintered, heat-conducting substrate is formed the reflecting layer of densification.
In the present embodiment, reflection green body layer forms the step of fluorescence green body layer particularly as follows: be coated with fluorescent slurry, drying in reflection green body layer, form fluorescence green body layer.
Wherein, fluorescence green body layer sintering is subsequently formed fluorescence coating.
Wherein, fluorescent slurry includes fluorescent material, the second glass dust and the second organic carrier.
Wherein, in fluorescent slurry, the mass ratio of fluorescent material and the second glass dust is 1:0.1～99.
Wherein, the softening point temperature of the second glass dust and the first glass dust differs less than 400 DEG C, so that reflecting layer and fluorescence coating after sintering can be good at being bonded together.Such as, the first glass dust can be silicate glass powder, and the second glass dust can be borosilicate glass powder；Or, the first glass dust can be borosilicate glass powder, and the second glass dust can be silicate glass powder.
Wherein, the second organic carrier is that the first organic carrier is made up of the organic solvent of bonding agent and different boiling.Wherein, bonding agent is ethyl cellulose；Solvent at least one in terpineol, butyl carbitol, butyl carbitol ester, tributyl citrate and tributyl 2-acetylcitrate.
Now, the method being coated with fluorescent slurry in reflection green body layer can be brushing, blade coating, spraying or silk screen printing.
Wherein, the thickness of fluorescence green body layer is 0.01～1mm.
In order to better protect the reflecting layer of light conversion device; prevent reflecting layer oxidized or sulfuration; wherein in an embodiment; before the step forming fluorescence green body layer in reflection green body layer of step S224; it is additionally included on the edge of reflection green body layer and is coated with glass protection slurry; so that glass protection slurry is around the edge one week of reflection green body layer, drying, obtain protecting green body layer.Wherein, after the sintering step of step S224, protection green body layer forms protective layer.Protective layer coordinates to seal reflecting layer with fluorescence coating, heat-conducting substrate jointly.Further, in step S222, it is preferred to form reflection green body layer at the middle part of heat-conducting substrate, thus so that the protective layer after sintering is held between fluorescence coating and heat-conducting substrate.Now, in step S224, fluorescence green body layer is formed in protection green body layer and reflection green body layer.Wherein, glass protection slurry can be the glass protection slurry being added with fluorescent material, it is also possible to for not adding the glass protection slurry of fluorescent material.Wherein, the glass protection slurry adding fluorescent material can be the fluorescent slurry forming fluorescence green body layer；The glass protection slurry not adding fluorescent material can be silicate glass slurry or borosilicate glass slurry.
Or; in another embodiment; after reflection green body layer is formed the step of fluorescence green body layer; before the step of sintering; it is additionally included in the edge coating glass protection slurry of reflection green body layer; so that glass protection slurry is around the edge one week of reflection green body layer, drying, obtain protecting green body layer；Wherein, after the step of sintering, protection green body layer forms protective layer.Protective layer coordinates to seal reflecting layer with fluorescence coating, heat-conducting substrate jointly.Further, in step S222, it is preferred to form reflection green body layer at the middle part of heat-conducting substrate, so that the protective layer after sintering is held between fluorescence coating and heat-conducting substrate.
Or; glass protection slurry can not also be coated with before sintering; in other embodiments; after the step of sintering; namely after forming the step of fine and close reflecting layer and the fluorescence coating stacking gradually on heat-conducting substrate on heat-conducting substrate; use encapsulant to form protective layer on reflecting layer, and make protective layer around reflecting layer one week, or make protective layer cover heat-conducting substrate, reflecting layer and fluorescence coating.Wherein, encapsulant is epoxy resin or Parylene.Wherein, Parylene can be N-type Parylene, C type Parylene, D type Parylene or the HT type Parylene that specialcoatingsystems company of the U.S. produces, or is the dixC type of KISCO Co., Ltd. of Japan production, D type, N-type, SR type, NR type, HR type, CF type, SF type Parylene.Protective layer, fluorescence coating and heat-conducting substrate coordinate to seal reflecting layer jointly.
The preparation method of above-mentioned light conversion device is simple to operate, it is prone to industrialized production, and the preparation method of above-mentioned light conversion device is when preparing reflecting layer, by using the reflective metals slurry sintering containing reflective metals powder and the first glass dust to form fine and close reflecting layer, and at least one that reflective metals powder is in argentum powder and aluminium powder, obtain and there is irreflexive reflecting layer, reflecting layer is made to have higher reflecting properties, simultaneously, reflecting layer relative to traditional porous, fine and close reflecting layer also has higher thermal conductivity and relatively low thermal resistance, so that light conversion device prepared by said method has higher light efficiency, more reliable.
The light conversion device of one embodiment is prepared by the preparation method of above-mentioned light conversion device.Owing to this light conversion device is prepared by the preparation method of above-mentioned light conversion device, above-mentioned reflecting layer is made not only to have higher reflecting properties, also there is higher thermal conductivity and relatively low thermal resistance so that light conversion device prepared by said method has higher light efficiency, more reliably.
The preparation method of the light conversion device of two embodiments can be used for preparing above-mentioned light conversion device, and the preparation method of the light conversion device of two embodiments is similar with the step of the preparation method of the light conversion device of an embodiment, differs only in:
In the present embodiment, heat-conducting substrate is formed in the step of fine and close reflecting layer and the fluorescence coating stacking gradually on heat-conducting substrate, after using reflective metals slurry to form reflection green body layer on heat-conducting substrate, reflection green body layer forms fluorescence coating, and two form the step of fluorescence coating particularly as follows: provide fluorescence coating in embodiment in reflection green body layer, fluorescence coating is laminated in reflection green body layer.The method can be used for softening point temperature and the preparation of the first glass dust bigger fluorescence coating of difference.
Wherein, fluorescence coating prepares as follows: fluorescent material is pressed into lamellar, sintered, obtains fluorescence coating.
Or, fluorescence coating can also prepare as follows: is mixed with pottery sintering aid by fluorescent material, successively through molding and sintering, obtains fluorescence coating.Now, fluorescent material is 100:0.01～100:10 with the mass ratio of pottery sintering aid；Pottery sintering aid can be tetraethyl orthosilicate, magnesium oxide, magnesium nitrate, magnesium hydroxide, yittrium oxide, Yttrium trinitrate etc..
Or, fluorescence coating can also prepare as follows: fluorescent material, the 3rd glass dust and the 3rd organic carrier is mixed, successively through molding and sintering, obtains fluorescence coating.Now, the mass ratio of fluorescent material and the 3rd glass dust is 0.01～99:1；3rd glass dust can be glass dust commonly used in the art, for instance, borosilicate glass powder, silicate glass powder etc..3rd organic carrier can be organic carrier commonly used in the art, for instance the 3rd organic carrier is made up of the organic solvent of bonding agent and different boiling.Wherein, bonding agent is ethyl cellulose；Solvent at least one in terpineol, butyl carbitol, butyl carbitol ester, tributyl citrate and tributyl 2-acetylcitrate.Wherein, the 3rd glass dust and the second glass dust can be identical, it is also possible to different；3rd organic carrier and the second organic solvent can be identical, it is also possible to different.
Preferably, the thermal coefficient of expansion of the fluorescence coating that above-mentioned three kinds of methods are prepared and the thermal coefficient of expansion of the first glass dust differ less than 10 × 10-6/ K, so that together with reflecting layer can be securely bonded to after the sintering with fluorescence coating.
Now; in order to protect the reflecting layer of light conversion device better; prevent reflecting layer oxidized or sulfuration; wherein in an embodiment; before the step forming fluorescence coating in reflection green body layer, it is additionally included on the edge of reflection green body layer coating glass protection slurry, so that glass protection slurry was around the edge of reflection green body layer one week; drying, obtains protection green body layer.Wherein, after the step of sintering, protection green body layer forms protective layer.Protective layer coordinates to seal reflecting layer with fluorescence coating, heat-conducting substrate jointly.Further, it is preferred to form reflection green body layer at the middle part of heat-conducting substrate, thus so that the protective layer after sintering is held between fluorescence coating and heat-conducting substrate.Now, fluorescence coating is laminated in protection green body layer and reflection green body layer.Wherein, glass protection slurry can be the glass protection slurry being added with fluorescent material, it is also possible to for not adding the glass protection slurry of fluorescent material.Wherein, the glass protection slurry adding fluorescent material can be the fluorescent slurry forming fluorescence green body layer；The glass protection slurry not adding fluorescent material can be silicate glass slurry, borosilicate glass powder slurry etc..
Or, in another embodiment, after reflection green body layer is formed the step of fluorescence coating; before the step of sintering, it is additionally included in the edge coating glass protection slurry of reflection green body layer, so that glass protection slurry is around the edge one week of reflection green body layer; drying, obtains protection green body layer；Wherein, after the step of sintering, protection green body layer forms protective layer.Protective layer coordinates to seal reflecting layer with fluorescence coating, heat-conducting substrate jointly.Further, it is preferred to form reflection green body layer at the middle part of heat-conducting substrate, so that the protective layer after sintering is held between fluorescence coating and heat-conducting substrate.
Or; glass protection slurry can not also be coated with before sintering; in other embodiments; after the step of sintering; namely, after forming the step of fine and close reflecting layer and the fluorescence coating stacking gradually on heat-conducting substrate on heat-conducting substrate, reflecting layer is coated with organosilicon, and makes organosilicon surround reflecting layer one week; cured, form protective layer.Protective layer, fluorescence coating and heat-conducting substrate coordinate to seal reflecting layer jointly.
Owing to the preparation method of the light conversion device of two embodiments is roughly the same with the preparation method of the light conversion device of an embodiment, therefore there is the advantage that the preparation method of the light conversion device of an embodiment is similar.
And two the light conversion device of embodiment prepared by the preparation method of above-mentioned light conversion device.Owing to this light conversion device is prepared by the preparation method of above-mentioned light conversion device so that the light conversion device of two embodiments has the advantage that the light conversion device of an embodiment is similar.The light conversion device of two embodiments can be applicable in the light-source system of scialyscope.
The preparation method of the light conversion device of three embodiments can also be used for the light conversion device of preparation one embodiment, and the preparation method of the light conversion device of three embodiments is roughly the same with the preparation method of the light conversion device of an embodiment, differs only in:
The preparation method of the light conversion device of three embodiments formed on heat-conducting substrate fine and close reflecting layer and the fluorescence coating stacking gradually on heat-conducting substrate step particularly as follows:
Step S310: use reflective metals slurry to form reflection green body layer on heat-conducting substrate, sintered, heat-conducting substrate is formed the reflecting layer of densification.
Wherein, the use reflective metals slurry of step S310 formed on heat-conducting substrate reflection green body layer step formed on heat-conducting substrate with the use reflective metals slurry of the step S222 of an embodiment reflect green body layer step identical.
Step S320: form fluorescence green body layer on reflecting layer, sintered, form fluorescence coating.
Wherein, the step forming fluorescence green body layer on reflecting layer of step S320 is roughly the same with the step forming fluorescence green body layer in reflection green body layer of the step S224 of the preparation method of the light conversion device of an embodiment, difference only the preparation method with the light conversion device of an embodiment be reflection green body layer on formed fluorescence green body layer, and the preparation method of the light conversion device of three embodiments be on reflecting layer formation fluorescence green body layer.
In order to better protect the reflecting layer of light conversion device in three embodiments; prevent reflecting layer oxidized or the way of sulfuration is also roughly the same with an embodiment; differ only in; the present embodiment is after forming the step in reflecting layer; before forming the step of fluorescence green body layer, at the edge coating glass protection slurry in reflecting layer.Or, after the step forming fluorescence green body layer on reflecting layer of step S320, before the step of sintering, at the edge coating glass protection slurry in reflecting layer；Or be use encapsulant to form protective layer on reflecting layer after step S320.Protective layer, fluorescence coating and heat-conducting substrate coordinate to seal reflecting layer jointly.
Owing to the preparation method of the light conversion device of three embodiments is roughly the same with the preparation method of the light conversion device of an embodiment, therefore there is the advantage that the preparation method of the light conversion device of an embodiment is similar.
And three the light conversion device of embodiment prepared by the preparation method of above-mentioned light conversion device.Owing to this light conversion device is prepared by the preparation method of above-mentioned light conversion device so that the light conversion device of three embodiments has the advantage that the light conversion device of an embodiment is similar.The light conversion device of three embodiments can be applicable in the light-source system of scialyscope.
It is below specific embodiment part:
Embodiment 1
The preparation process of the light conversion device of the present embodiment is as follows:
(1) provide heat-conducting substrate, heat-conducting substrate is brushed reflective metals slurry, at room temperature stands 10min, in 100 DEG C of dry 20min after levelling, form the reflection green body layer that thickness is 0.002mm.Wherein, heat-conducting substrate is aluminium nitride substrate, the thickness 1mm of heat-conducting substrate；Reflective metals slurry includes reflective metals powder, the first glass dust and the first organic carrier, the mass ratio of reflective metals powder and the first glass dust is 9.5:0.5, reflective metals powder is particle diameter is the lamellar Argent grain of 10 nanometers～10 microns, first glass dust is silicate glass powder, first organic carrier is the mixture of ethyl cellulose and terpineol, and the mass ratio of the quality of the first organic carrier and reflective metals powder is 1:0.5.The thermal coefficient of expansion of the first glass dust differs 2 × 10 with the thermal coefficient of expansion of heat-conducting substrate-6/K。
(2) in reflection green body layer, fluorescent slurry is brushed, dry 0.5 hour in 100 DEG C, form the fluorescence green body layer that thickness is 0.1mm, sinter 10min in 900 DEG C, between heat-conducting substrate and fluorescence coating, form the reflecting layer of densification, obtain the light conversion device of the present embodiment.Wherein, fluorescent slurry includes fluorescent material, the second glass dust and the second organic carrier, the mass ratio of fluorescent material and the second glass dust is 1:1, second glass dust can be silicate glass powder, the softening point temperature of the second glass dust and the first glass dust is equal, and second the mass ratio of quality and fluorescent material of organic carrier be 1:1, the second organic carrier is the mixture of ethyl cellulose, terpineol and butyl carbitol.
Embodiment 2
The preparation process of the light conversion device of the present embodiment is as follows:
(1) provide heat-conducting substrate, blade coating reflective metals slurry on the middle part of heat-conducting substrate, at room temperature stand 12min, in 200 DEG C of dry 30min after levelling, form the reflection green body layer that thickness is 1mm.Wherein, heat-conducting substrate is silicon carbide substrate, and the thickness of heat-conducting substrate is 5mm；Reflective metals slurry includes reflective metals powder, assistant metal powder, the first glass dust and the first organic carrier, the mass ratio of reflective metals powder and the first glass dust is 19.5:1, reflective metals powder is particle diameter is the flake aluminum particles of 1 micron～10 microns, first glass dust is borosilicate glass powder, first organic carrier is the mixture of ethyl cellulose and terpineol and butyl carbitol ester, and the mass ratio of the quality of the first organic carrier and reflective metals powder is 1:0.5.The thermal coefficient of expansion of the first glass dust differs 3 × 10 with the thermal coefficient of expansion of heat-conducting substrate-6/ K；The mass ratio of assistant metal powder and reflective metals powder is 1:1, and assistant metal powder is palladium powder.
(2) coating glass protection slurry on the edge of reflection green body layer, so that glass protection slurry is around the edge one week of reflection green body layer, drying, formed and protect green body layer.Wherein, glass protection slurry is fluorescent slurry; wherein; fluorescent slurry includes fluorescent material, the second glass dust and the second organic carrier; the mass ratio of fluorescent material and the second glass dust is 1:99, and the second glass dust can be silicate glass powder, and the softening point temperature of the first glass dust and the second glass dust differs 400 DEG C; and second the mass ratio of quality and fluorescent material of organic carrier be 1:0.01, the second organic carrier is the mixture of ethyl cellulose, terpineol and butyl carbitol.
(3) fluorescent slurry of blade coating step (2) in reflection green body layer and protection green body layer; in 200 DEG C of dry 20min; form the fluorescence green body layer that thickness is 1mm; sinter 0.5 hour in 850 DEG C; form fluorescence coating, reflecting layer and protective layer; reflecting layer is between fluorescence coating and heat-conducting substrate; protective layer surrounds reflecting layer one week; and protective layer and fluorescence coating, heat-conducting substrate is fixing is connected, and fluorescence coating, heat-conducting substrate and protective layer jointly coordinate to seal reflecting layer and obtain the light conversion device of the present embodiment.Wherein, the fluorescent slurry that the glass protection slurry that the fluorescent slurry in step (3) is in step (2) uses.
Embodiment 3
The preparation process of the light conversion device of the present embodiment is as follows:
(1) provide heat-conducting substrate, spray reflective metals slurry at the middle part of heat-conducting substrate, at room temperature stand 15min, in 150 DEG C of dry 30min after levelling, form the reflection green body layer that thickness is 0.01mm.Wherein, heat-conducting substrate is silicon nitride board, and the thickness of heat-conducting substrate is 1mm；Reflective metals slurry includes reflective metals powder, assistant metal powder, the first glass dust and the first organic carrier, the mass ratio of reflective metals powder and the first glass dust is 10:1, reflective metals powder is particle diameter is the mixture of the Argent grain of lamellar of 100 nanometers～10 microns and spherical alumina particles, first glass dust is silicate glass powder, first organic carrier is the mixture of ethyl cellulose, terpineol, butyl carbitol and butyl carbitol ester, and the mass ratio of the quality of the first organic carrier and reflective metals powder is 1:0.5.The thermal coefficient of expansion of the first glass dust differs 1 × 10 with the thermal coefficient of expansion of heat-conducting substrate-6/ K；The mass ratio of assistant metal powder and reflective metals powder is 0.8:1, and assistant metal powder is platinum powder.
(2) spraying fluorescent slurry in reflection green body layer, dry 0.1 hour in 150 DEG C, form the fluorescence green body layer that thickness is 0.01mm, then at the edge coating glass protection slurry of reflection green body layer, so that glass protection slurry is around the edge one week of reflection green body layer, drying, form protection green body layer, sinter 0.2 hour then at 800 DEG C, form fluorescence coating, fine and close reflecting layer and protective layer, reflecting layer is between fluorescence coating and heat-conducting substrate, protective layer surrounds reflecting layer one week, and protective layer and fluorescence coating, heat-conducting substrate is fixing to be connected, and fluorescence coating, heat-conducting substrate and the common fitted seal reflecting layer of protective layer, obtain the light conversion device of the present embodiment.Wherein, fluorescent slurry includes fluorescent material, the second glass dust and the second organic carrier, the mass ratio of fluorescent material and the second glass dust is 1:0.1, second glass dust can be borosilicate glass powder, the softening point temperature of the second glass dust and the first glass dust differs 200 DEG C, and second the mass ratio of quality and fluorescent material of organic carrier be 1:0.01, the second organic carrier is the mixture of ethyl cellulose, terpineol and butyl carbitol ester.Glass protection slurry is the fluorescent slurry that fluorescence coating uses.
Embodiment 4
The preparation process of the light conversion device of the present embodiment is as follows:
(1) provide heat-conducting substrate, at the middle part silk screen printing reflective metals slurry of heat-conducting substrate, at room temperature stand 30min, in 150 DEG C of dry 15min after levelling, form the reflection green body layer that thickness is 0.5mm.Wherein, heat-conducting substrate is silicon chip, and the thickness of heat-conducting substrate is 2mm；Reflective metals slurry includes reflective metals powder, assistant metal powder, the first glass dust and the first organic carrier, the mass ratio of reflective metals powder and the first glass dust is 5:1, reflective metals powder is particle diameter is the spherical Argent grain of 100 nanometers～500 nanometers, first glass dust is borosilicate glass powder, first organic carrier is the mixture of ethyl cellulose and butyl carbitol, and the mass ratio of the quality of the first organic carrier and reflective metals powder is 1:0.5.The thermal coefficient of expansion of the first glass dust is equal with the thermal coefficient of expansion of heat-conducting substrate；The mass ratio of assistant metal powder and reflective metals powder is 0.5:1, and assistant metal powder is palladium powder and platinum powder.
(2) silk screen printing fluorescent slurry in reflection green body layer; dry 0.6 hour in 150 DEG C; form fluorescence green body layer; sinter 1 hour then at 700 DEG C; form fluorescence coating and fine and close reflecting layer; reflecting layer is between fluorescence coating and heat-conducting substrate; then on reflecting layer, it is coated with epoxy resin; and make epoxy resin surround reflecting layer one week; cured, it is formed with protective layer, protective layer is fixed with fluorescence coating, heat-conducting substrate and is connected; and fluorescence coating, heat-conducting substrate and protective layer coordinate to seal reflecting layer jointly, obtain the light conversion device of the present embodiment.Wherein, fluorescent slurry includes fluorescent material, the second glass dust and the second organic carrier, the mass ratio of fluorescent material and the second glass dust is 1:50, second glass dust can be borosilicate glass powder, the softening point temperature of the second glass dust and the first glass dust differs 100 DEG C, and the mass ratio of the quality of the second organic carrier and fluorescent material is 1:0.01.
Embodiment 5
The preparation process of the light conversion device of the present embodiment is as follows:
(1) provide heat-conducting substrate, at the middle part blade coating reflective metals slurry of heat-conducting substrate, at room temperature stand 25min, in 150 DEG C of dry 45min after levelling, form the reflection green body layer that thickness is 0.15mm.Wherein, heat-conducting substrate is aluminum oxide substrate, and the thickness of heat-conducting substrate is 4mm；Reflective metals slurry includes reflective metals powder, assistant metal powder, the first glass dust and the first organic carrier, the mass ratio of reflective metals powder and the first glass dust is 15:1, reflective metals powder is particle diameter is the lamellar of 500 nanometers～800 nanometers and the spherical Argent grain mixed, first glass dust is silicate glass powder, first organic carrier is the mixture of ethyl cellulose and butyl carbitol ester, and the mass ratio of the quality of the first organic carrier and reflective metals powder is 1:0.5.The thermal coefficient of expansion of the first glass dust is equal with the thermal coefficient of expansion of heat-conducting substrate；The mass ratio of assistant metal powder and reflective metals powder is 0.1:1, and assistant metal powder is palladium powder.
(2) fluorescent material is pressed into lamellar, sintered, obtain fluorescence coating.
(3) stacking fluorescence coating in reflection green body layer; sinter 10min hour then at 830 DEG C; the reflecting layer of densification is formed between heat-conducting substrate and fluorescence coating; then on reflecting layer, it is deposited with Parylene N-type (ParyleneN); and make Parylene N-type (ParyleneN) around reflecting layer one week; it is formed with protective layer; matcoveredn surrounds reflecting layer one week; and matcoveredn and fluorescence coating, heat-conducting substrate is fixing is connected; and the common fitted seal reflecting layer of fluorescence coating, heat-conducting substrate and matcoveredn, obtain the light conversion device of the present embodiment.
Embodiment 6
The preparation process of the light conversion device of the present embodiment is as follows:
(1) provide heat-conducting substrate, brush reflective metals slurry at the middle part of heat-conducting substrate, at room temperature stand 15min, in 150 DEG C of dry 45min after levelling, form the reflection green body layer that thickness is 1mm.Wherein, heat-conducting substrate is boron nitride substrate, and the thickness of heat-conducting substrate is 2.5mm；Reflective metals slurry includes reflective metals powder, assistant metal powder, the first glass dust and the first organic carrier, the mass ratio of reflective metals powder and the first glass dust is 8:1, reflective metals powder is particle diameter is the lamellar Argent grain of 500 nanometers～800 nanometers, first glass dust is silicate glass powder, and the first organic carrier is the mixture of ethyl cellulose and tributyl citrate and tributyl 2-acetylcitrate.The thermal coefficient of expansion of the first glass dust differs 2.5 × 10 with the thermal coefficient of expansion of heat-conducting substrate-6/ K；The mass ratio of assistant metal powder and reflective metals powder is 0.2:1, and assistant metal powder is platinum powder.
(2) fluorescent material is mixed with pottery sintering aid, successively through molding and sintering, obtain fluorescence coating.Wherein, fluorescent material is 100:0.01 with the mass ratio of pottery sintering aid；Pottery sintering aid is magnesium oxide.
(3) stacking fluorescence coating in reflection green body layer; sinter 1 hour then at 600 DEG C; the reflecting layer of densification is formed between heat-conducting substrate and fluorescence coating; then on reflecting layer, it is deposited with Parylene C type (ParyleneC); and make Parylene C type (ParyleneC) around reflecting layer one week; it is formed with protective layer; matcoveredn surrounds reflecting layer one week; and matcoveredn and fluorescence coating, heat-conducting substrate is fixing is connected; and the common fitted seal reflecting layer of fluorescence coating, heat-conducting substrate and matcoveredn, obtain the light conversion device of the present embodiment.
Embodiment 7
The preparation process of the light conversion device of the present embodiment is as follows:
(1) provide heat-conducting substrate, brush reflective metals slurry at the middle part of heat-conducting substrate, at room temperature stand 14min, dry 60min hour in 150 DEG C after levelling, form the reflection green body layer that thickness is 1mm.Wherein, heat-conducting substrate is boron nitride substrate, and the thickness of heat-conducting substrate is 3.5mm；Reflective metals slurry includes reflective metals powder, assistant metal powder, the first glass dust and the first organic carrier, the mass ratio of reflective metals powder and the first glass dust is 12:1, reflective metals powder is particle diameter is the lamellar Argent grain of 500 nanometers～800 nanometers, first glass dust is borosilicate glass powder, and the first organic carrier is the mixture of ethyl cellulose and terpineol, butyl carbitol and butyl carbitol ester.The thermal coefficient of expansion of the first glass dust differs 3 × 10 with the thermal coefficient of expansion of heat-conducting substrate-6/ K；The mass ratio of assistant metal powder and reflective metals powder is 0.2:1, and assistant metal powder is platinum powder.
(2) fluorescent material is mixed with pottery sintering aid, successively through molding and sintering, obtain fluorescence coating.Wherein, fluorescent material is 100:10 with the mass ratio of pottery sintering aid；Pottery sintering aid is magnesium oxide.
(3) stacking fluorescence coating in reflection green body layer; sinter 0.5 hour then at 700 DEG C; the reflecting layer of densification is formed between heat-conducting substrate and fluorescence coating; then on reflecting layer, it is deposited with Parylene D type (ParyleneD); and make Parylene D type (ParyleneD) around reflecting layer one week; it is formed with protective layer; matcoveredn surrounds reflecting layer one week; and matcoveredn and fluorescence coating, heat-conducting substrate is fixing is connected; and the common fitted seal reflecting layer of fluorescence coating, heat-conducting substrate and matcoveredn, obtain the light conversion device of the present embodiment.
Embodiment 8
The preparation process of the light conversion device of the present embodiment is as follows:
(1) provide heat-conducting substrate, at the middle part silk screen printing reflective metals slurry of heat-conducting substrate, at room temperature stand 10min, in 200 DEG C of dry 30min after levelling, form the reflection green body layer that thickness is 0.08mm.Wherein, heat-conducting substrate is semiconductor substrate, and the thickness of heat-conducting substrate is 0.8mm；Reflective metals slurry includes reflective metals powder, assistant metal powder, the first glass dust and the first organic carrier, the mass ratio of reflective metals powder and the first glass dust is 18:1, reflective metals powder is particle diameter is the lamellar of 10 nanometers～50 nanometers and spherical combined silver granule, first glass dust is borosilicate glass powder, first organic carrier is the mixture of ethyl cellulose and terpineol and butyl carbitol, and the mass ratio of the quality of the first organic carrier and reflective metals powder is 1:0.5.The thermal coefficient of expansion of the first glass dust differs 5 × 10 with the thermal coefficient of expansion of heat-conducting substrate-6/ K；The mass ratio of assistant metal powder and reflective metals powder is 0.6:1, and assistant metal powder is platinum powder.
(2) fluorescent material, the 3rd glass dust and the 3rd organic carrier are mixed, successively through molding and sintering, obtain fluorescence diaphragm.Now, the mass ratio of fluorescent material and the 3rd glass dust is 0.01:2；3rd glass dust is silicate glass powder；3rd organic carrier is the mixture of ethyl cellulose, terpineol, butyl carbitol and butyl carbitol ester.
(3) stacking fluorescent film sheet in reflection green body layer; obtain fluorescence coating; sinter 1 hour then at 500 DEG C; the reflecting layer of densification is formed between heat-conducting substrate and fluorescence coating; then on reflecting layer, it is deposited with Parylene HT type (ParyleneHT); and make Parylene HT type surround reflecting layer one week; it is formed with protective layer; matcoveredn surrounds reflecting layer one week; and matcoveredn and fluorescence coating, heat-conducting substrate is fixing is connected; and the common fitted seal reflecting layer of fluorescence coating, heat-conducting substrate and matcoveredn, obtain the light conversion device of the present embodiment.
Embodiment 9
The preparation process of the light conversion device of the present embodiment is as follows:
(1) provide heat-conducting substrate, at the middle part silk screen printing reflective metals slurry of heat-conducting substrate, at room temperature stand 60min, in 200 DEG C of dry 60min after levelling, form the reflection green body layer that thickness is 0.01mm, by 920 DEG C of heat preservation sintering 10min, heat-conducting substrate forms the reflecting layer of densification.Wherein, heat-conducting substrate is semiconductor substrate, and the thickness of heat-conducting substrate is 2mm；Reflective metals slurry includes reflective metals powder, assistant metal powder, the first glass dust and the first organic carrier, the mass ratio of reflective metals powder and the first glass dust is 19.9:0.1, reflective metals powder is particle diameter is the spherical alumina particles of 10 nanometers～10 microns, first glass dust is borosilicate glass powder, first organic carrier is the mixture of ethyl cellulose and butyl carbitol ester and tributyl citrate, and the mass ratio of the quality of the first organic carrier and reflective metals powder is 1:0.5.The thermal coefficient of expansion of the first glass dust differs 1 × 10 with the thermal coefficient of expansion of heat-conducting substrate-6/ K；The mass ratio of assistant metal powder and reflective metals powder is 0.4:1, and assistant metal powder is platinum powder.
(2) on the edge in reflecting layer, glass protection slurry it is coated with, so that glass protection slurry is around the edge one week in reflecting layer, drying, formed and protect green body layer.Wherein, glass protection slurry is fluorescent slurry; wherein; fluorescent slurry includes fluorescent material, the second glass dust and the second organic carrier; the mass ratio of fluorescent material and the second glass dust is 1:30; second glass dust is borosilicate glass powder, and the mass ratio of the quality of the second organic carrier and fluorescent material is 1:0.01, and the second organic carrier is the mixture of ethyl cellulose, butyl carbitol and butyl carbitol ester.
(3) on reflecting layer and protection green body layer, fluorescent slurry is brushed; dry 1 hour in 100 DEG C; form the fluorescence green body layer that thickness is 1mm; sinter 1 hour in 800 DEG C; forming fluorescence coating, reflecting layer and protective layer, reflecting layer is between fluorescence coating and heat-conducting substrate, and protective layer surrounds reflecting layer one week; and protective layer and fluorescence coating, heat-conducting substrate is fixing is connected, and fluorescence coating, heat-conducting substrate and protective layer jointly coordinate to seal reflecting layer and obtain the light conversion device of the present embodiment.Wherein, the fluorescent slurry that the glass protection slurry that the fluorescent slurry in step (3) is in step (2) uses.
Embodiment 10
The preparation process of the light conversion device of the present embodiment is as follows:
(1) provide heat-conducting substrate, spray reflective metals slurry at the middle part of heat-conducting substrate, at room temperature stand 1 hour, dry 0.5 hour in 200 DEG C after levelling, form the reflection green body layer that thickness is 0.5mm, by 850 DEG C of heat preservation sintering 20min, heat-conducting substrate forms the reflecting layer of densification.Wherein, heat-conducting substrate is semiconductor substrate, and the thickness of heat-conducting substrate is 5mm；Reflective metals slurry includes reflective metals powder, assistant metal powder, the first glass dust and the first organic carrier, the mass ratio of reflective metals powder and the first glass dust is 16:1, reflective metals powder is particle diameter is the spherical alumina particles of 10 nanometers～10 microns, first glass dust is silicate glass powder, first organic carrier is the mixture of ethyl cellulose and terpineol, butyl carbitol ester, tributyl citrate and tributyl 2-acetylcitrate, and the mass ratio of the quality of the first organic carrier and reflective metals powder is 1:0.5.The thermal coefficient of expansion of the first glass dust is equal with the thermal coefficient of expansion of heat-conducting substrate；The mass ratio of assistant metal powder and reflective metals powder is 0.7:1, and assistant metal powder is platinum powder.
(2) on reflecting layer, fluorescent slurry is sprayed, dry 0.2 hour in 150 DEG C, form the fluorescence green body layer that thickness is 0.05mm, then at the edge coating glass protection slurry of reflection green body layer, so that glass protection slurry is around the edge one week of reflection green body layer, drying, form protection green body layer, 10min is sintered then at 800 DEG C, form fluorescence coating and protective layer, protective layer surrounds reflecting layer one week, and protective layer and fluorescence coating, heat-conducting substrate is fixing to be connected, and fluorescence coating, heat-conducting substrate and the common fitted seal reflecting layer of protective layer, obtain the light conversion device of the present embodiment.Wherein, fluorescent slurry includes fluorescent material, the second glass dust and the second organic carrier, the mass ratio of fluorescent material and the second glass dust is 1:90, second glass dust can be silicate glass powder, and second the mass ratio of quality and fluorescent material of organic carrier be 1:0.01, the second organic carrier is the mixture of ethyl cellulose, terpineol, butyl carbitol and tributyl citrate；Glass protection slurry is made up of glass glaze powder and the 3rd organic carrier, and the mass ratio of glass glaze powder and the 3rd organic carrier is 1:0.3, and glass glaze mainly has SiO2-B2O3-Bi2O3Class glass, the 3rd organic carrier is the mixture of ethyl cellulose, terpineol, butyl carbitol and citric acid three ester.
Embodiment 11
The preparation process of the light conversion device of the present embodiment is as follows:
(1) provide heat-conducting substrate, blade coating reflective metals slurry on heat-conducting substrate, at room temperature stand 5min, in 200 DEG C of dry 15min after levelling, form the reflection green body layer that thickness is 0.05mm, by 900 DEG C of heat preservation sintering 30min, heat-conducting substrate forms the reflecting layer of densification.Wherein, heat-conducting substrate is semiconductor substrate, and the thickness of heat-conducting substrate is 1.5mm；Reflective metals slurry includes reflective metals powder, assistant metal powder, the first glass dust and the first organic carrier, the mass ratio of reflective metals powder and the first glass dust is 1:1, reflective metals powder is particle diameter is the spherical alumina particles of 10 nanometers～10 microns, first glass dust is borosilicate glass powder, first organic carrier is the mixture of ethyl cellulose and terpineol, and the mass ratio of the quality of the first organic carrier and reflective metals powder is 1:0.5.The thermal coefficient of expansion of the first glass dust differs 4 × 10 with the thermal coefficient of expansion of heat-conducting substrate-6/ K；The mass ratio of assistant metal powder and reflective metals powder is 0.8:1, and assistant metal powder is platinum powder.
(2) silk screen printing fluorescent slurry on reflecting layer; dry 1 hour in 150 DEG C; form fluorescence green body layer; sinter 1 hour then at 800 DEG C; form fluorescence coating, on the reflecting layer of stacking, fluorescence coating and heat-conducting substrate, be then deposited with Parylene dixSF type, be formed with protective layer; protective layer covers fluorescence coating, heat-conducting substrate and reflecting layer, obtains the light conversion device of the present embodiment.Wherein, fluorescent slurry includes fluorescent material, the second glass dust and the second organic carrier, and the mass ratio of fluorescent material and the second glass dust is 1:0.5, and the second glass dust is silicate glass powder, and the mass ratio of the quality of the second organic carrier and fluorescent material is 1:0.01.
Comparative example 1
The preparation process of the light conversion device of comparative example 1 is as follows:
(1) providing heat-conducting substrate, on heat-conducting substrate, blade coating reflection slurry, at room temperature stands 10min, in 100 DEG C of dry 20min after levelling, form the reflection green body layer that thickness is 0.002mm, wherein, heat-conducting substrate is aluminium nitride substrate, and the thickness of heat-conducting substrate is 1mm；Reflection slurry includes white reflective particle, aluminium oxide, the first glass dust and the first organic carrier；The mass ratio of white reflective particle alumina and the first glass dust is 1:1, white reflective particle is particle diameter is the spherical particle of 10 nanometers～10 microns, first glass dust is silicate glass powder, first organic carrier is the mixture of ethyl cellulose and terpineol, and the mass ratio of the quality of the first organic carrier and white reflective particle is 1:0.5.
(2) in reflection green body layer, brush fluorescent slurry, dry 0.5 hour in 100 DEG C, form the fluorescence green body layer that thickness is 0.1mm, sinter 10min in 900 DEG C, heat-conducting substrate is formed reflecting layer and the fluorescence coating of porous.Wherein, fluorescent slurry includes fluorescent material, the second glass dust and the second organic carrier, the mass ratio of fluorescent material and the second glass dust is 1:1, second glass dust can be silicate glass powder, and second the mass ratio of quality and fluorescent material of organic carrier be 1:1, the second organic carrier is the mixture of ethyl cellulose, terpineol and butyl carbitol.
The light conversion device of the light conversion device of embodiment 1 and comparative example 1 use same blue laser as excitation source, obtain the light conversion device of embodiment 1 luminous intensity with the light conversion device of comparative example 1 along with the change curve driving electric current of blue light source, see Fig. 5, as we can see from the figure, when initial less driving electric current, the luminous intensity of the light conversion device of embodiment 1 and comparative example 1 is close, but along with driving the raising of electric current, the luminous intensity of the light conversion device of embodiment 1 is substantially high than the luminous flux of the light conversion device of comparative example 1, and when laser drive current brings up to 0.8A, the luminous intensity dramatic drop-off of the light conversion device of comparative example 1, increase further and drive electric current, due to the heat effect that it is higher, fluorescence coating can not bear high power laser light and excite and quencher, and the light conversion device of embodiment 1 still shows stable high light flux light output driving of 1.1A under electric current, illustrate that it has relatively low thermal resistance and the stronger capacity of heat transmission.It can thus be seen that light conversion device provided by the invention still has better brightness and reliability when higher source luminance.And the light conversion device of embodiment 2～11 has the intensity profile of light emission similar with the light conversion device of embodiment 1, its performance is similar to the light conversion device of embodiment 1, does not repeat them here.
Each technical characteristic of embodiment described above can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics is absent from contradiction, all it is considered to be the scope that this specification is recorded.
Embodiment described above only have expressed the several embodiments of the present invention, and it describes comparatively concrete and detailed, but can not therefore be construed as limiting the scope of the patent.It should be pointed out that, for the person of ordinary skill of the art, without departing from the inventive concept of the premise, it is also possible to make some deformation and improvement, these are all protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.

Claims (18)

1. a light conversion device, it is characterized in that, including heat-conducting substrate, the fine and close reflecting layer being laminated on described heat-conducting substrate and be laminated in the fluorescence coating on described reflecting layer, described reflecting layer is obtained by reflective metals slurry is sintered, it is 1:1～19.9:0.1 that described reflective metals slurry includes the mass ratio of reflective metals powder, the first glass dust and the first organic carrier, described reflective metals powder and described first glass dust；Described reflective metals powder at least one in argentum powder and aluminium powder.
2. light conversion device according to claim 1; it is characterized in that; also include surrounding the described reflecting layer protective layer of a week; described protective layer and described heat-conducting substrate, described fluorescence coating are all tightly connected, so that reflecting layer described in described protective layer, described heat-conducting substrate, the common fitted seal of described fluorescence coating.
3. light conversion device according to claim 1, it is characterised in that also include protective layer, described protective layer is wrapped on the described heat-conducting substrate of stacking, described reflecting layer and described fluorescence coating, and covers described heat-conducting substrate, described reflecting layer and described fluorescence coating.
4. the preparation method of a light conversion device, it is characterised in that comprise the steps:
Heat-conducting substrate is provided；
Described heat-conducting substrate is formed the fine and close reflecting layer and fluorescence coating that stack gradually on described heat-conducting substrate, obtains light conversion device；Wherein, described reflecting layer is obtained by reflective metals slurry is sintered, and it is 1:1～19.9:0.1 that described reflective metals slurry includes the mass ratio of reflective metals powder, the first glass dust and the first organic carrier, described reflective metals powder and described first glass dust；Described reflective metals powder at least one in argentum powder and aluminium powder.
5. the preparation method of light conversion device according to claim 4, it is characterized in that, described heat-conducting substrate forms the step of fine and close described reflecting layer and the described fluorescence coating stacking gradually on described heat-conducting substrate particularly as follows: use described reflective metals slurry to form reflection green body layer on described heat-conducting substrate；Described reflection green body layer is formed fluorescence green body layer or described fluorescence coating, sintered, described heat-conducting substrate is formed the described reflecting layer of densification.
6. the preparation method of light conversion device according to claim 5, it is characterised in that form the step of described fluorescence green body layer in described reflection green body layer particularly as follows: be coated with fluorescent slurry, drying in described reflection green body layer, form described fluorescence green body layer；Wherein, it is 1:0.1～99 that described fluorescent slurry includes the mass ratio of fluorescent material, the second glass dust and the second organic carrier, described fluorescent material and described second glass dust, and the softening point temperature of described second glass dust and described first glass dust is more or less the same in 400 DEG C.
7. the preparation method of light conversion device according to claim 5, it is characterised in that form the step of described fluorescence coating in described reflection green body layer particularly as follows: provide described fluorescence coating, is laminated in described fluorescence coating in described reflection green body layer, wherein:
Described fluorescence coating prepares as follows: fluorescent material is pressed into lamellar, sintered, obtains described fluorescence coating；
Or, described fluorescence coating prepares as follows: is mixed with pottery sintering aid by fluorescent material, successively through molding and sintering, obtains described fluorescence diaphragm；
Or, described fluorescence coating prepares as follows: fluorescent material, the 3rd glass dust and the 3rd organic carrier is mixed, successively through molding and sintering, obtains described fluorescence coating.
8. the preparation method of light conversion device according to claim 5; it is characterized in that; before described reflection green body layer is formed the step of described fluorescence coating; it is additionally included on the edge of described reflection green body layer and is coated with glass protection slurry; so that described glass protection slurry is around the edge one week of described reflection green body layer; drying, obtains protection green body layer；Wherein, after the step of described sintering, described protection green body layer forms protective layer, and described protective layer coordinates to seal described reflecting layer with described fluorescence coating, described heat-conducting substrate jointly；
Or; before described reflection green body layer is formed the step of described fluorescence green body layer, it is additionally included on the edge of described reflection green body layer coating glass protection slurry, so that described glass protection slurry was around the edge of described reflection green body layer one week; drying, obtains protection green body layer；Wherein, after the step of described sintering, described protection green body layer forms protective layer, and described fluorescence green body layer forms fluorescence coating, and described protective layer coordinates to seal described reflecting layer with described fluorescence coating, described heat-conducting substrate jointly；
Or; after described reflection green body layer is formed the step of described fluorescence coating; before the step of described sintering; it is additionally included in the edge coating glass protection slurry of described reflection green body layer; so that described glass protection slurry is around the edge one week of described reflection green body layer; drying, obtains protection green body layer；Wherein, after the step of described sintering, described protection green body layer forms protective layer, and described protective layer coordinates to seal described reflecting layer with described fluorescence coating, described heat-conducting substrate jointly；
Or; after described reflection green body layer is formed the step of described fluorescence green body layer; after the step of described sintering; it is additionally included in the edge coating glass protection slurry of described reflection green body layer; so that described glass protection slurry is around the edge one week of described reflection green body layer; drying, obtains protection green body layer；Wherein, after the step of described sintering, described protection green body layer forms protective layer, and described fluorescence green body layer forms fluorescence coating, and described protective layer coordinates to seal described reflecting layer with described fluorescence coating, described heat-conducting substrate jointly.
9. the preparation method of light conversion device according to claim 4, it is characterized in that, described heat-conducting substrate forms the step of fine and close described reflecting layer and the described fluorescence coating stacking gradually on described heat-conducting substrate particularly as follows: use described reflective metals slurry to form reflection green body layer on described heat-conducting substrate, sintered, described heat-conducting substrate is formed the described reflecting layer of densification；Described reflecting layer is formed fluorescence green body layer, sintered, form described fluorescence coating.
10. the preparation method of light conversion device according to claim 9, it is characterised in that form the step of described fluorescence green body layer on described reflecting layer particularly as follows: be coated with fluorescent slurry, drying on described reflecting layer, form described fluorescence green body layer；Wherein, it is 1:0.1～99 that described fluorescent slurry includes the mass ratio of fluorescent material, the second glass dust and the second organic carrier, described fluorescent material and described second glass dust, and the softening point temperature of described second glass dust and described first glass dust is more or less the same in 400 DEG C.
11. the preparation method of light conversion device according to claim 9; it is characterized in that; before described reflecting layer is formed the step of fluorescence green body layer; it is additionally included on the edge in described reflecting layer and is coated with glass protection slurry; so that described glass protection slurry is around the edge one week in described reflecting layer; drying, obtains protection green body layer；Wherein, after the step of described sintering, described protection green body layer forms protective layer, and described protective layer coordinates to seal described reflecting layer with described fluorescence coating, described heat-conducting substrate jointly；
Or, after described reflecting layer is formed the step of described fluorescence green body layer, it is additionally included in the edge coating glass protection slurry of described reflection green body layer, so that described glass protection slurry is around the edge one week in described reflecting layer, drying, obtains protecting green body layer；Wherein, after the step of described sintering, described protection green body layer forms protective layer, and described fluorescence green body layer forms fluorescence coating, and described protective layer coordinates to seal described reflecting layer with described fluorescence coating, described heat-conducting substrate jointly.
12. the preparation method of the light conversion device according to claim 5 or 9, it is characterized in that, described reflective metals slurry is used to form the step of described reflection green body layer on described heat-conducting substrate particularly as follows: be coated with described reflective metals slurry on described heat-conducting substrate, drying, obtains reflection green body layer；
Or, use described reflective metals slurry to form the step of described reflection green body layer on described heat-conducting substrate particularly as follows: by described reflective metals sizing material forming and dry, obtain described reflection green body layer, described reflection green body layer be laminated on described heat-conducting substrate.
13. the preparation method of light conversion device according to claim 4, it is characterised in that the thermal conductivity of described heat-conducting substrate is more than 10W/mK.
14. the preparation method of light conversion device according to claim 4, it is characterised in that the thermal coefficient of expansion of described first glass dust differs 0～5 × 10 with the thermal coefficient of expansion of described heat-conducting substrate-6/K。
15. the preparation method of light conversion device according to claim 4, it is characterised in that the particle diameter of described reflective metals powder is 10 nanometers～10 microns.
16. the preparation method of light conversion device according to claim 4, it is characterised in that described reflective metals powder is sheet-like particle or spherical particle, or the mixture that described reflective metals powder is sheet-like particle and spherical particle.
17. the preparation method of light conversion device according to claim 4; it is characterized in that; after described heat-conducting substrate is formed the step of fine and close described reflecting layer and the described fluorescence coating stacking gradually on described heat-conducting substrate; also include using encapsulant to form protective layer on described reflecting layer; and make described protective layer around described reflecting layer one week, or described protective layer is made to cover described heat-conducting substrate, described reflecting layer and described fluorescence coating；Wherein, described encapsulant is epoxy resin or Parylene.
18. the application that the light conversion device as described in claims 1 to 3 any one is in the light-source system of light fixture or display.
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