CN105762095A - Reaction chamber and semiconductor processing apparatus - Google Patents
Reaction chamber and semiconductor processing apparatus Download PDFInfo
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- CN105762095A CN105762095A CN201410802473.3A CN201410802473A CN105762095A CN 105762095 A CN105762095 A CN 105762095A CN 201410802473 A CN201410802473 A CN 201410802473A CN 105762095 A CN105762095 A CN 105762095A
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- reaction chamber
- detent
- segmentation
- baffle ring
- connecting portion
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Abstract
The invention provides a reaction chamber and a semiconductor processing apparatus. A base used for bearing a processed workpiece is arranged in the reaction chamber; the base is located above the bottom board of the reaction chamber; a retaining ring located along the circumferential direction of the bottom board is arranged on the bottom board of the reaction chamber; the retaining ring is used for preventing the processed workpiece from sliding off so as to make the processed workpiece stay in a visible range on the bottom board of the reaction chamber; and the visible range is an observable range of an interval from the inner side wall of the reaction chamber to the outer circumferential wall of the base. With the reaction chamber provided by the invention adopted, the processed workpiece can be prevented from sliding to a position which cannot be seen and is located below the base, and therefore, an operator can directly remove the slide processed workpiece from the reaction chamber.
Description
Technical field
The present invention relates to microelectronics technology, in particular it relates to a kind of reaction chamber and semiconductor processing equipment.
Background technology
LEDPECVD (PlasmaEnhancedChemicalVaporDeposition, plasma enhanced chemical vapor deposition) equipment is mainly used at sapphire or silicon chip surface deposition plating (such as SiN/SiO etc.).At present, the commonly used manual manipulation sheet design of the reaction chamber of LEDPECVD equipment, i.e. rely on operator manually to place the wafer on the bottom electrode in reaction chamber, to be deposited technique.
Fig. 1 is the partial sectional view of existing reaction chamber.As it is shown in figure 1, be provided with the bottom electrode 11 for bearing wafer in reaction chamber 10, this bottom electrode 11 is supported by along its equally distributed three fixing posts 12 of circumference.And, the base plate 101 of reaction chamber 10 is provided with air vent, this air vent is connected with the adapter cavity 14 being arranged on bottom reaction chamber 10, in order to discharge reacted waste gas.
Above-mentioned reaction chamber 10 inevitably there is problems in that in actual applications
Owing to there is gap 102 between periphery wall and the sidewall of reaction chamber 10 of bottom electrode 11, pick and place in the process of sheet operator, very easily wafer 13 is dropped on the base plate 101 of reaction chamber 10 along gap 102, and, due to the angle between sidewall and the base plate of reaction chamber 10 be round-corner transition, this fillet radius is relatively big and smooth surface, therefore wafer 13 can take advantage of a situation landing on base plate 101, being positioned at the position below bottom electrode 11 along fillet cambered surface.Owing to this position exceedes the effective range of operator's range estimation, thus want to take out wafer and can only dismantle bottom electrode 11 or the base plate of adapter cavity 14, remove workload bigger.Continuing technique if not taking out wafer, wafer is likely under the effect of vacuum power, to being located proximate to of adapter cavity 14, and drops on the base plate of adapter cavity 14, causes needing when necessary to shut down and dismantle this base plate to carry out taking sheet, thus reducing process efficiency.
Summary of the invention
It is contemplated that at least solve one of technical problem of existence in prior art, propose a kind of reaction chamber and semiconductor processing equipment, it is possible to prevent workpiece to be machined landing to being positioned at the position cannot seen below pedestal, thus operator directly can take out the workpiece to be machined of landing from reaction chamber.
A kind of reaction chamber is provided for realizing the purpose of the present invention, the pedestal for carrying workpiece to be machined it is provided with in described reaction chamber, described pedestal is positioned at above the base plate of described reaction chamber, along it circumferentially around being provided with baffle ring on the base plate of described reaction chamber, described baffle ring is for stopping the workpiece to be machined of landing, so that it rests in the visual range on the base plate of described reaction chamber；Described visual range is the scope that the gap between the periphery wall of the medial wall of described reaction chamber and described pedestal is able to observe that.
Preferably, in described reaction chamber, the equally distributed at least three support column of circumference along described pedestal it is additionally provided with, in order to support described pedestal；Further, the lower end of described support column is fixed on the base plate of described reaction chamber, and is formed with location division in the lower end of described support column, in order to limit described baffle ring position on described base plate.
Preferably, being provided with multiple detent on the bottom surface of described baffle ring, the quantity of the plurality of detent is corresponding with the quantity of described location division, and each detent matches with each location division correspondingly.
Preferably, being provided with multiple detent on the bottom surface of described baffle ring, the quantity of the plurality of detent is the integral multiple of the quantity of described location division, and a portion detent matches with each location division correspondingly；It is provided with block piece wherein, in order to make the workpiece to be machined of described landing cannot pass through this part detent in another part detent.
Preferably, described block piece includes one or the multiple screws being intervally arranged, and described screw is threadeded with described baffle ring from the bottom surface of described detent, and the nut of described screw is positioned at described detent, in order to stop the workpiece to be machined of described landing.
Preferably, on described baffle ring, and the gap location between two often adjacent detents is uniformly placed with multiple passages of the radial thickness running through described baffle ring；Being dimensioned to of described passage: make the workpiece to be machined of described landing to pass through.
Preferably, described baffle ring adopts integral structure；Or, described baffle ring adopts the split-type structural being made up of multiple segmentations, adopts dismountable mode to connect between each segmentation；Further, the plurality of segmentation is symmetrical relative to the longitudinal center line of described baffle ring, and the structure of each segmentation and equivalently-sized.
Preferably, the quantity of described segmentation is equal with the quantity of described detent；Each detent is positioned at the center of each segmentation correspondingly；All of described passage is averaged distribution in each segmentation, and passage in each segmentation is symmetrical and is evenly spaced in the both sides of described detent.
Preferably, the two ends of each segmentation are respectively arranged with connecting portion and lower connecting portion, wherein, are provided with counterbore on described on connecting portion；Described lower connecting portion is provided with screwed hole；In the plurality of segmentation, the lower connecting portion of the upper connecting portion of any one segmentation and adjacent thereto segmentation is superposed, and described counterbore is corresponding with described screwed hole；By being arranged on by screw in described counterbore and described screwed hole, and make described upper connecting portion and the fixing connection of lower connecting portion.
As another technical scheme, the present invention also provides for a kind of semiconductor processing equipment, and including reaction chamber, described reaction chamber is above-mentioned reaction chamber provided by the invention.
The method have the advantages that
Reaction chamber provided by the invention, its by arrange on the inwall of reaction chamber along its circumferentially around baffle ring, the workpiece to be machined of landing can be stopped, make in its visual range resting on the inwall of reaction chamber, thus operator are it can be seen that when the workpiece to be machined of landing, it is possible to taking out this workpiece to be machined directly from reaction chamber, this is compared with prior art, without carrying out any dismounting work, such that it is able to reduce the workload of operator.
Semiconductor processing equipment provided by the invention, it is by adopting above-mentioned reaction chamber provided by the invention, the workpiece to be machined of landing can be stopped, make in its visual range resting on the inwall of reaction chamber, thus operator are it can be seen that when the workpiece to be machined of landing, it is possible to taking out this workpiece to be machined directly from reaction chamber, this is compared with prior art, without carrying out any dismounting work, such that it is able to reduce the workload of operator.
Accompanying drawing explanation
Fig. 1 is the partial sectional view of existing reaction chamber；
The partial sectional view of the reaction chamber that Fig. 2 A provides for the embodiment of the present invention；
Fig. 2 B is the enlarged drawing in I region in Fig. 2 A；
Fig. 2 C is the sectional view in Fig. 2 A along line A-A；
The axonometric chart of the baffle ring of the reaction chamber that Fig. 3 A provides for the embodiment of the present invention；
Fig. 3 B is the perspective view of one of them split of baffle ring in Fig. 3 A；And
Fig. 3 C is the sectional view of the cross section of baffle ring in Fig. 3 A.
Detailed description of the invention
For making those skilled in the art be more fully understood that technical scheme, below in conjunction with accompanying drawing, reaction chamber provided by the invention and semiconductor processing equipment are described in detail.
The partial sectional view of the reaction chamber that Fig. 2 A provides for the embodiment of the present invention.Fig. 2 B is the enlarged drawing in I region in Fig. 2 A.Fig. 2 C is the sectional view in Fig. 2 A along line A-A.Seeing also Fig. 2 A～Fig. 2 C, be provided with the pedestal 21 for carrying workpiece to be machined in reaction chamber 20, this pedestal 21 can according to different application as bottom electrode and/or heater.In the present embodiment, reaction chamber 20 is PECVD chamber, and pedestal 21 is used as bottom electrode, and it is supported by three support columns 23, and three support columns 23 are uniformly distributed along the circumference of pedestal 21, to ensure the uniformity of the air flow method in reaction chamber.And, the lower end of each support column 23 is fixed on base plate 201, so that pedestal 21 is positioned at above base plate 201；Meanwhile, the center position at base plate 201 is additionally provided with air vent 203, and this air vent 203 is connected with adapter cavity 24, in order to discharge reacted waste gas.In actual applications, can be different according to the structure of different application, pedestal and reaction chamber.
Additionally, along it circumferentially around being provided with baffle ring 25 on the base plate 201 of reaction chamber 20, baffle ring 25 is for stopping the workpiece to be machined 22 of landing, so that it rests in the visual range on the base plate 201 of reaction chamber, as shown in Figure 2 A.This visual range is the scope that between the medial wall of autoreaction chamber 20 and the periphery wall of pedestal 21, gap 202 is able to observe that, thus operator are it can be seen that when the workpiece to be machined of landing, this workpiece to be machined can be taken out directly from reaction chamber 20, this is compared with prior art, without carrying out any dismounting work, such that it is able to reduce the workload of operator.
Below the concrete structure of baffle ring 25 is described in detail.The axonometric chart of the baffle ring of the reaction chamber that Fig. 3 A provides for the embodiment of the present invention.Fig. 3 B is the perspective view of one of them split of baffle ring in Fig. 3 A.Fig. 3 C is the sectional view of the cross section of baffle ring in Fig. 3 A.See also Fig. 3 A～Fig. 3 C, be formed with location division 231 in the lower end of support column 23, in order to limit the baffle ring 25 position on base plate 201, as shown in Figure 2 B.The connected mode of location division 231 and baffle ring 25 particularly as follows: be provided with six detents on the bottom surface of baffle ring 25, and wherein three detents 251 match with each location division 231 correspondingly；It is provided with block piece 31, in order to make the workpiece to be machined of landing cannot pass through detent 252 in its excess-three detent 252.It should be noted that the structure of each detent and equivalently-sized, and it is different to be only arranged at the parts inside it, i.e. it is plugged with location division 231 in detent 251, and in detent 252, is provided with block piece 31.By location division 231 is plugged in detent 251, it is possible to achieve the restriction to baffle ring 25 position.
Certainly, in actual applications, the quantity of this detent can also is that the integral multiple of the location division quantity of nine, 12 etc..Or, the quantity of detent can also be corresponding with the quantity of location division, in this case, owing to not having unnecessary detent 252, thus can save above-mentioned block piece 31, and each first detent matches with each location division correspondingly.
In the present embodiment, block piece 31 includes the multiple screws being intervally arranged, threaded with baffle ring 25 in the bottom surface of the self-align groove 252 of this screw, as shown in figs. 3 b and 3 c, the bottom surface of detent 252 is provided with screwed hole 253, above-mentioned screw is arranged in this screwed hole 253, and the nut of this screw is positioned at detent 252, in order to stop the workpiece to be machined of landing.Preferably, screw adopts BIG SIZE NUTS.
In the present embodiment, on baffle ring 25, and the gap location between two often adjacent detents is uniformly placed with multiple passages 32 of the radial thickness running through baffle ring 25, pass through in order to supply stream, such that it is able to avoid air-flow to change distribution originally because being subject to the stop of baffle ring 25；Being dimensioned to of this passage 32: make the workpiece to be machined of landing to pass through.In actual applications, the shape of cross section of passage can be the arbitrary shape of such as circle, rectangle etc..
Preferably, baffle ring 25 adopts the split-type structural being made up of multiple segmentations (having illustrated six segmentations in Fig. 3 A), adopts dismountable mode to connect, such that it is able to be easy to the installation and removal of baffle ring 25 between each segmentation.And, multiple segmentations are symmetrical relative to the longitudinal center line of baffle ring 25, and the structure of each segmentation and equivalently-sized, thereby may be ensured that the uniformity of air flow method in reaction chamber 20, and then are conducive to improving process uniformity.
Below a specific embodiment of this split-type structural is described in detail.Specifically, the quantity of segmentation and the quantity of detent are equal, for instance, as shown in Figure 3A, baffle ring 25 is made up of six segmentations, and accordingly, the quantity of detent is six；Further, each detent is positioned at the center of each segmentation correspondingly.Additionally, all of passage 32 is averaged distribution in each segmentation, and passage in each segmentation is symmetrical and is evenly spaced in the both sides of detent.Such as, Fig. 3 B is shown in which a segmentation 25a, and one of them detent 252 is arranged on the center position of this segmentation 25a；Passage 32 add up to 36, and be averaged distribution in each segmentation, each segmentation have 6 passages 32, these 6 passages 32 are symmetrical and are evenly spaced in the both sides of detent.Thus, it is possible to realize the structure of each segmentation and equivalently-sized.In actual applications, it is also possible to adopt other modes to design quantity and the structure of each segmentation, as long as ensure that the structure of each segmentation and equivalently-sized.
In the present embodiment, particularly as follows: as shown in Figure 3 B, the two ends of each segmentation are respectively arranged with connecting portion and lower connecting portion to the connected mode between each segmentation, wherein, are provided with counterbore 255 on this on connecting portion；This lower connecting portion is provided with screwed hole 254；In multiple segmentations, the lower connecting portion of the upper connecting portion of any one segmentation and adjacent thereto segmentation is superposed, and counterbore 255 is corresponding with screwed hole 254, as shown in Figure 3A, when each upper connecting portion and lower connecting portion adjacent thereto are superposed, each piecewise combination forms a complete ring body；Then, by screw being arranged in counterbore 255 and screwed hole 254, it is possible to make connecting portion and the fixing connection of lower connecting portion, such that it is able to realize removably connecting between each segmentation.
It should be noted that in actual applications, baffle ring can also adopt integral structure.And, baffle ring can be independent parts；Or, it is also possible to adopt integrated mode to make with the base plate of reaction chamber.
In sum, the reaction chamber that the embodiment of the present invention provides, its by arrange on the inwall of reaction chamber along its circumferentially around baffle ring, the workpiece to be machined of landing can be stopped so that it is rest in the visual range on the inwall of reaction chamber, thus operator are it can be seen that when the workpiece to be machined of landing, this workpiece to be machined can be taken out directly from reaction chamber, this is compared with prior art, it is not necessary to carry out any dismounting work, such that it is able to reduce the workload of operator.
As another technical scheme, the present invention also provides for a kind of semiconductor processing equipment, and it includes reaction chamber, and this reaction chamber adopts the above-mentioned reaction chamber that the embodiment of the present invention provides.
Semiconductor processing equipment provided by the invention, it is by adopting above-mentioned reaction chamber provided by the invention, the workpiece to be machined of landing can be stopped, make in its visual range resting on the inwall of reaction chamber, thus operator are it can be seen that when the workpiece to be machined of landing, it is possible to taking out this workpiece to be machined directly from reaction chamber, this is compared with prior art, without carrying out any dismounting work, such that it is able to reduce the workload of operator.
It is understood that the principle that is intended to be merely illustrative of the present of embodiment of above and the illustrative embodiments that adopts, but the invention is not limited in this.For those skilled in the art, without departing from the spirit and substance in the present invention, it is possible to make various modification and improvement, these modification and improvement are also considered as protection scope of the present invention.
Claims (10)
1. a reaction chamber, the pedestal for carrying workpiece to be machined it is provided with in described reaction chamber, described pedestal is positioned at above the base plate of described reaction chamber, it is characterized in that, along it circumferentially around being provided with baffle ring on the base plate of described reaction chamber, described baffle ring is for stopping the workpiece to be machined of landing, so that it rests in the visual range on the base plate of described reaction chamber；Described visual range is the scope that the gap between the periphery wall of the medial wall of described reaction chamber and described pedestal is able to observe that.
2. reaction chamber according to claim 1, it is characterised in that be additionally provided with the equally distributed at least three support column of circumference along described pedestal in described reaction chamber, in order to support described pedestal；Further,
The lower end of described support column is fixed on the base plate of described reaction chamber, and is formed with location division in the lower end of described support column, in order to limit described baffle ring position on described base plate.
3. reaction chamber according to claim 2, it is characterized in that, being provided with multiple detent on the bottom surface of described baffle ring, the quantity of the plurality of detent is corresponding with the quantity of described location division, and each detent matches with each location division correspondingly.
4. reaction chamber according to claim 2, it is characterized in that, being provided with multiple detent on the bottom surface of described baffle ring, the quantity of the plurality of detent is the integral multiple of the quantity of described location division, and a portion detent matches with each location division correspondingly；It is provided with block piece wherein, in order to make the workpiece to be machined of described landing cannot pass through this part detent in another part detent.
5. reaction chamber according to claim 4, it is characterised in that described block piece includes or the multiple screws being intervally arranged,
Described screw is threadeded with described baffle ring from the bottom surface of described detent, and the nut of described screw is positioned at described detent, in order to stop the workpiece to be machined of described landing.
6. the reaction chamber according to claim 3 or 4, it is characterised in that on described baffle ring, and the gap location between two often adjacent detents is uniformly placed with multiple passages of the radial thickness running through described baffle ring；
Being dimensioned to of described passage: make the workpiece to be machined of described landing to pass through.
7. reaction chamber according to claim 6, it is characterised in that described baffle ring adopts integral structure；Or,
Described baffle ring adopts the split-type structural being made up of multiple segmentations, adopts dismountable mode to connect between each segmentation；Further, the plurality of segmentation is symmetrical relative to the longitudinal center line of described baffle ring, and the structure of each segmentation and equivalently-sized.
8. reaction chamber according to claim 7, it is characterised in that the quantity of described segmentation is equal with the quantity of described detent；
Each detent is positioned at the center of each segmentation correspondingly；
All of described passage is averaged distribution in each segmentation, and passage in each segmentation is symmetrical and is evenly spaced in the both sides of described detent.
9. reaction chamber according to claim 7, it is characterised in that the two ends of each segmentation are respectively arranged with connecting portion and lower connecting portion, wherein, is provided with counterbore on connecting portion on described；Described lower connecting portion is provided with screwed hole；
In the plurality of segmentation, the lower connecting portion of the upper connecting portion of any one segmentation and adjacent thereto segmentation is superposed, and described counterbore is corresponding with described screwed hole；By being arranged on by screw in described counterbore and described screwed hole, and make described upper connecting portion and the fixing connection of lower connecting portion.
10. a semiconductor processing equipment, including reaction chamber, it is characterised in that described reaction chamber is the reaction chamber described in any one of claim 1-9.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410802473.3A CN105762095B (en) | 2014-12-18 | 2014-12-18 | Reaction chamber and semiconductor processing equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410802473.3A CN105762095B (en) | 2014-12-18 | 2014-12-18 | Reaction chamber and semiconductor processing equipment |
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| CN105762095A true CN105762095A (en) | 2016-07-13 |
| CN105762095B CN105762095B (en) | 2018-08-24 |
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| CN201410802473.3A Active CN105762095B (en) | 2014-12-18 | 2014-12-18 | Reaction chamber and semiconductor processing equipment |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108624865A (en) * | 2017-03-15 | 2018-10-09 | 汉民科技股份有限公司 | Detachable air injection device applied to semiconductor equipment |
| CN111326438A (en) * | 2018-12-14 | 2020-06-23 | 北京北方华创微电子装备有限公司 | Leveling device and reaction chamber |
| CN114156211A (en) * | 2021-11-25 | 2022-03-08 | 北京北方华创微电子装备有限公司 | Semiconductor chamber |
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| US5527393A (en) * | 1990-03-19 | 1996-06-18 | Kabushiki Kaisha Toshiba | Vapor-phase deposition apparatus and vapor-phase deposition method |
| KR20050074760A (en) * | 2004-01-14 | 2005-07-19 | 주식회사 하이닉스반도체 | Semiconductor processing chamber |
| WO2006092588A1 (en) * | 2005-03-01 | 2006-09-08 | Lingvitae As | Method for improving the characterisation of a polynucleotide sequence |
| CN102117726A (en) * | 2009-12-30 | 2011-07-06 | 塔工程有限公司 | Focusing ring of plasma processing apparatus and plasma processing apparatus equipped with focusing ring |
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2014
- 2014-12-18 CN CN201410802473.3A patent/CN105762095B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5527393A (en) * | 1990-03-19 | 1996-06-18 | Kabushiki Kaisha Toshiba | Vapor-phase deposition apparatus and vapor-phase deposition method |
| KR20050074760A (en) * | 2004-01-14 | 2005-07-19 | 주식회사 하이닉스반도체 | Semiconductor processing chamber |
| WO2006092588A1 (en) * | 2005-03-01 | 2006-09-08 | Lingvitae As | Method for improving the characterisation of a polynucleotide sequence |
| CN102117726A (en) * | 2009-12-30 | 2011-07-06 | 塔工程有限公司 | Focusing ring of plasma processing apparatus and plasma processing apparatus equipped with focusing ring |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108624865A (en) * | 2017-03-15 | 2018-10-09 | 汉民科技股份有限公司 | Detachable air injection device applied to semiconductor equipment |
| CN108624865B (en) * | 2017-03-15 | 2020-06-23 | 汉民科技股份有限公司 | Detachable air injection device applied to semiconductor equipment |
| CN111326438A (en) * | 2018-12-14 | 2020-06-23 | 北京北方华创微电子装备有限公司 | Leveling device and reaction chamber |
| CN114156211A (en) * | 2021-11-25 | 2022-03-08 | 北京北方华创微电子装备有限公司 | Semiconductor chamber |
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| CN105762095B (en) | 2018-08-24 |
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Address after: 100176 Beijing economic and Technological Development Zone, Wenchang Road, No. 8, No. Applicant after: Beijing North China microelectronics equipment Co Ltd Address before: 100176 Beijing economic and Technological Development Zone, Wenchang Road, No. 8, No. Applicant before: Beifang Microelectronic Base Equipment Proces Research Center Co., Ltd., Beijing |
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