CN105762095B - Reaction chamber and semiconductor processing equipment - Google Patents
Reaction chamber and semiconductor processing equipment Download PDFInfo
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- CN105762095B CN105762095B CN201410802473.3A CN201410802473A CN105762095B CN 105762095 B CN105762095 B CN 105762095B CN 201410802473 A CN201410802473 A CN 201410802473A CN 105762095 B CN105762095 B CN 105762095B
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- reaction chamber
- baffle ring
- segmentation
- positioning groove
- positioning
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Abstract
A kind of reaction chamber of present invention offer and semiconductor processing equipment, the pedestal for carrying workpiece to be machined is provided in reaction chamber, the pedestal is located above the bottom plate of reaction chamber, its reaction chamber bottom plate upper edge its circumferentially around being provided with baffle ring, the baffle ring is used to stop the workpiece to be machined slid, so that it is rested in the visual range on the bottom plate of reaction chamber；The visual range range that gap is able to observe that between the madial wall and the periphery wall of pedestal of autoreaction chamber.Reaction chamber provided by the invention can prevent workpiece to be machined from sliding to the position that can not be seen below pedestal, to which operating personnel directly can take out the workpiece to be machined slid from reaction chamber.
Description
Technical field
The present invention relates to microelectronics technologies, and in particular, to a kind of reaction chamber and semiconductor processing equipment.
Background technology
LED PECVD (Plasma Enhanced Chemical Vapor Deposition, plasma enhanced chemical
Vapor deposition) equipment is mainly used in sapphire or silicon chip surface deposition plating (such as SiN/SiO etc.).Currently, LED PECVD
The reaction chamber of equipment generally uses manual manipulation piece to design, that is, places the wafer at reaction chamber manually by operating personnel
On interior lower electrode, to carry out depositing operation.
Fig. 1 is the partial sectional view of existing reaction chamber.As shown in Figure 1, being provided in reaction chamber 10 for holding
The lower electrode 11 of chip is carried, the lower electrode 11 along its circumferential equally distributed three fixed column 12 by supporting.Moreover, in reaction chamber
It is provided with exhaust outlet on the bottom plate 101 of room 10, which connect with the adapter cavity 14 for being arranged in 10 bottom of reaction chamber, to
Exhaust gas after discharge reaction.
Above-mentioned reaction chamber 10 inevitably has the following problems in practical applications：
Due to having gap 102 between the periphery wall and the side wall of reaction chamber 10 of lower electrode 11, picked and placeed in operating personnel
During piece, easily chip 13 is fallen to along gap 102 on the bottom plate 101 of reaction chamber 10, moreover, because reaction chamber
Angle between the side wall and bottom plate of room 10 is that round-corner transition, the radius of the fillet are larger and surface is smooth, therefore 13 meeting of chip
It takes advantage of a situation on landing to bottom plate 101 along fillet cambered surface, is located at the position of 11 lower section of lower electrode.Since this position is more than operating personnel's mesh
The effective range of survey, thus the bottom plate of lower electrode 11 or adapter cavity 14 can only be dismantled to take out chip, remove workload compared with
Greatly.Continue technique if not taking out chip, chip may under the action of vacuum power, to being located proximate to for adapter cavity 14, and
It falls on the bottom plate of adapter cavity 14, leads to need to shut down and dismantle the bottom plate if necessary carrying out taking piece, to reduce work
Skill efficiency.
Invention content
The present invention is directed at least solve one of the technical problems existing in the prior art, it is proposed that a kind of reaction chamber and half
Conductor process equipment can prevent workpiece to be machined from sliding to the position that can not be seen below pedestal, to operator
Member directly can take out the workpiece to be machined slid from reaction chamber.
A kind of reaction chamber is provided to achieve the purpose of the present invention, is provided in the reaction chamber for carrying quilt
The pedestal of workpieces processing, the pedestal are located above the bottom plate of the reaction chamber, the reaction chamber bottom plate upper edge its
Circumferentially around baffle ring is provided with, the baffle ring is used to stop the workpiece to be machined slid, so that it rests on the reaction chamber
Bottom plate on visual range in；The visual range be from the periphery wall of the madial wall of the reaction chamber and the pedestal it
Between the range that is able to observe that of gap.
Preferably, equally distributed at least three support of circumferential direction along the pedestal is additionally provided in the reaction chamber
Column, to support the pedestal；Also, the lower end of the support column is fixed on the bottom plate of the reaction chamber, and described
The lower end of support column is formed with positioning region, to limit position of the baffle ring on the bottom plate.
Preferably, be provided with multiple positioning grooves on the bottom surface of the baffle ring, the quantity of the multiple positioning groove with
The quantity of the positioning region is corresponding, and each positioning groove is matched with each positioning region correspondingly.
Preferably, multiple positioning grooves are provided on the bottom surface of the baffle ring, the quantity of the multiple positioning groove is
The integral multiple of the quantity of the positioning region, and a portion positioning groove is matched with each positioning region correspondingly；
It wherein is provided with block piece in another part positioning groove, to make the workpiece to be machined of the landing can not be fixed by the part
Position groove.
Preferably, the block piece includes one or multiple screws for being intervally arranged, and the screw is recessed from the positioning
The bottom surface of slot is threadedly coupled with the baffle ring, and the nut of the screw is located in the positioning groove, to stop the landing
Workpiece to be machined.
Preferably, on the baffle ring, and the gap location between per two adjacent positioning grooves is uniformly placed with
Through multiple ventholes of the radial thickness of the baffle ring；The venthole is dimensioned to：Make being added for the landing
Work workpiece can not pass through.
Preferably, the baffle ring uses integral structure；Alternatively, the baffle ring is split type using being made of multiple segmentations
Structure is connected between each segmentation using dismountable mode；Also, in axial direction of the multiple segmentation relative to the baffle ring
Heart line is symmetrical, and the structure snd size of each segmentation are identical.
Preferably, the quantity of the segmentation is equal with the quantity of the positioning groove；Each positioning groove is correspondingly
Positioned at the center of each segmentation；All ventholes are averaged distribution in each segmentation, and in each segmentation
Venthole is symmetrical and is evenly spaced in the both sides of the positioning groove.
Preferably, the both ends being each segmented are respectively arranged with interconnecting piece and lower interconnecting piece, wherein in the upper interconnecting piece
On be provided with counterbore；It is provided with threaded hole on the lower interconnecting piece；In the multiple segmentation, the upper company of any one segmentation
Socket part and the lower interconnecting piece of adjacent thereto segmentation are stacked on top of each other, and the counterbore is corresponding with the threaded hole；Pass through
Screw is mounted in the counterbore and the threaded hole, and the upper interconnecting piece is made to be fixedly connected with lower interconnecting piece.
It is described anti-the present invention also provides a kind of semiconductor processing equipment, including reaction chamber as another technical solution
It is above-mentioned reaction chamber provided by the invention to answer chamber.
The invention has the advantages that：
Reaction chamber provided by the invention, by the inner wall of reaction chamber be arranged along its circumferentially around baffle ring,
The workpiece to be machined that can stop landing makes it rest in the visual range on the inner wall of reaction chamber, to operating personnel
Under conditions of can see the workpiece to be machined of landing, the workpiece to be machined can be taken out directly from reaction chamber, this with it is existing
There is technology to compare, without carrying out any dismounting work, so as to reduce the workload of operating personnel.
Semiconductor processing equipment provided by the invention can be hindered by using above-mentioned reaction chamber provided by the invention
The workpiece to be machined slid is kept off, it is made to rest in the visual range on the inner wall of reaction chamber, to which operating personnel are can be with
Under conditions of seeing the workpiece to be machined of landing, the workpiece to be machined can be taken out directly from reaction chamber, this and the prior art
It compares, without carrying out any dismounting work, so as to reduce the workload of operating personnel.
Description of the drawings
Fig. 1 is the partial sectional view of existing reaction chamber；
Fig. 2A is the partial sectional view of reaction chamber provided in an embodiment of the present invention；
Fig. 2 B are the enlarged drawing in the regions I in Fig. 2A；
Fig. 2 C are the sectional view along line A-A in Fig. 2A；
Fig. 3 A are the stereogram of the baffle ring of reaction chamber provided in an embodiment of the present invention；
Fig. 3 B are the perspective view that one of baffle ring is seperated in Fig. 3 A；And
Fig. 3 C are the sectional view of the cross section of baffle ring in Fig. 3 A.
Specific implementation mode
To make those skilled in the art more fully understand technical scheme of the present invention, come below in conjunction with the accompanying drawings to the present invention
The reaction chamber and semiconductor processing equipment of offer are described in detail.
Fig. 2A is the partial sectional view of reaction chamber provided in an embodiment of the present invention.Fig. 2 B are the amplification in the regions I in Fig. 2A
Figure.Fig. 2 C are the sectional view along line A-A in Fig. 2A.Also referring to Fig. 2A~Fig. 2 C, it is provided with and is used in reaction chamber 20
The pedestal 21 of workpiece to be machined is carried, which can be used as lower electrode and/or heater according to different applications.In this reality
It applies in example, reaction chamber 20 is PECVD chambers, and pedestal 21 is used as lower electrode, is supported by three support columns 23, three support columns
23 are uniformly distributed along the circumferential direction of pedestal 21, to ensure the uniformity of the indoor air flow method of reaction chamber.Moreover, each support column 23
Lower end be fixed on bottom plate 201 so that pedestal 21 is located at the top of bottom plate 201；Meanwhile the center position of bottom plate 201 also
It is provided with exhaust outlet 203, which connect with adapter cavity 24, the exhaust gas after reaction is discharged.In practical applications,
According to different applications, the structure of pedestal and reaction chamber can be different.
In addition, reaction chamber 20 201 upper edge of bottom plate its circumferentially around baffle ring 25 is provided with, baffle ring 25 is for stopping cunning
The workpiece to be machined 22 fallen, so that it is rested in the visual range on the bottom plate 201 of reaction chamber, as shown in Figure 2 A.This can
Depending on the range that ranging from gap 202 is able to observe that between the madial wall of autoreaction chamber 20 and the periphery wall of pedestal 21, thus
Operating personnel can take out this directly from reaction chamber 20 and be processed work under conditions of can see the workpiece to be machined of landing
Part, this compared with prior art, without carrying out any dismounting work, so as to reduce the workload of operating personnel.
The concrete structure of baffle ring 25 is described in detail below.Fig. 3 A are reaction chamber provided in an embodiment of the present invention
The stereogram of baffle ring.Fig. 3 B are the perspective view that one of baffle ring is seperated in Fig. 3 A.Fig. 3 C are the cross section of baffle ring in Fig. 3 A
Sectional view.Also referring to Fig. 3 A~Fig. 3 C, it is formed with positioning region 231 in the lower end of support column 23, to limit baffle ring 25
Position on bottom plate 201, as shown in Figure 2 B.Positioning region 231 and the connection type of baffle ring 25 are specially：In the bottom surface of baffle ring 25
There are six positioning grooves for upper setting, wherein three positioning grooves 251 are matched with each positioning region 231 correspondingly；At it
Block piece 31 is provided in excess-three positioning groove 252, to make the workpiece to be machined of landing can not be by positioning groove 252.
It should be noted that the structure snd size of each positioning groove are identical, and it is only arranged at the difference of the component inside it, that is,
It is plugged with positioning region 231 in positioning groove 251, and is provided with block piece 31 in positioning groove 252.By the way that positioning region 231 is inserted
It is connected in positioning groove 251, the restriction to 25 position of baffle ring may be implemented.
Certainly, in practical applications, the quantity of the positioning groove can also be nine, 12 etc. positioning region quantity
Integral multiple.Alternatively, the quantity of positioning groove can also be corresponding with the quantity of positioning region, in this case, due to not more
Remaining positioning groove 252, thus above-mentioned block piece 31 can be saved, and each first positioning groove correspondingly with it is each fixed
Position portion matches.
In the present embodiment, block piece 31 includes multiple screws for being intervally arranged, the bottom surface of the self-positioning groove of the screw 252
It is threadedly coupled with baffle ring 25, as shown in figs. 3 b and 3 c, threaded hole 253, above-mentioned screw is provided on the bottom surface of positioning groove 252
In the threaded hole 253, and the nut of the screw is located in positioning groove 252, to stop the workpiece to be machined of landing.
Preferably, screw uses BIG SIZE NUTS.
In the present embodiment, on baffle ring 25, and the gap location between per two adjacent positioning grooves is uniformly arranged
Be furnished with through baffle ring 25 radial thickness multiple ventholes 32, pass through to supply stream, so as to avoid air-flow because by
The blocking of baffle ring 25 and the distribution for changing script；The venthole 32 is dimensioned to：Make the workpiece to be machined of landing
It can not pass through.In practical applications, the cross-sectional shape of venthole can be the arbitrary shape of circle, rectangle etc..
Preferably, baffle ring 25 is using the split structure being made of multiple segmentations (showing six segmentations in Fig. 3 A), respectively
It is connected using dismountable mode between a segmentation, so as to the installation and removal convenient for baffle ring 25.Moreover, multiple segmentation phases
It is symmetrical for the longitudinal center line of baffle ring 25, and the structure snd size of each segmentation are identical, thereby may be ensured that reaction chamber
The uniformity of air flow method in room 20, and then be conducive to improve process uniformity.
A specific embodiment of the split structure is described in detail below.Specifically, the quantity of segmentation with it is fixed
The quantity of position groove is equal, for example, as shown in Figure 3A, baffle ring 25 is made of six segmentations, and accordingly, the quantity of positioning groove
It is six；Also, each positioning groove is located at the center of each segmentation correspondingly.In addition, all ventholes 32
Distribution is averaged in each segmentation, and the venthole in each segmentation is symmetrical and is evenly spaced in the both sides of positioning groove.Example
Such as, Fig. 3 B are shown in which that the center position in segmentation 25a is arranged in a segmentation 25a, one of positioning groove 252；
The sum of venthole 32 is 36, and is averaged distribution in each segmentation, and each be segmented has 6 ventholes 32, this 6
Venthole 32 is symmetrical and is evenly spaced in the both sides of positioning groove.Thus, it is possible to realize the structure snd size phase of each segmentation
Together.In practical applications, the quantity and structure of each segmentation can also be designed using other modes, as long as can ensure each point
The structure snd size of section are identical.
In the present embodiment, the connection type between each segmentation is specially：As shown in Figure 3B, the both ends being each segmented point
It is not provided with interconnecting piece and lower interconnecting piece, wherein be provided with counterbore 255 on interconnecting piece on this；It is set on the lower interconnecting piece
It is equipped with threaded hole 254；In multiple segmentations, the lower connection of the upper interconnecting piece of any one segmentation and adjacent thereto segmentation
Portion is stacked on top of each other, and counterbore 255 is corresponding with threaded hole 254, as shown in Figure 3A, when each upper interconnecting piece and it is adjacent thereto under
When interconnecting piece is stacked on top of each other, each piecewise combination forms a complete ring body；Then, by the way that screw is mounted on counterbore 255
In threaded hole 254, interconnecting piece can be made to be fixedly connected with lower interconnecting piece, it is removable between each segmentation so as to realize
Unload connection.
It should be noted that in practical applications, baffle ring can also use integral structure.Moreover, baffle ring can be single
An only component；Alternatively, can also be made of integrally formed mode with the bottom plate of reaction chamber.
In conclusion reaction chamber provided in an embodiment of the present invention, by being arranged along it on the inner wall of reaction chamber
Circumferentially around baffle ring, can stop the workpiece to be machined of landing, it is made to rest on the visual range on the inner wall of reaction chamber
It is interior, to which operating personnel are under conditions of can see the workpiece to be machined of landing, the quilt can be taken out directly from reaction chamber
Workpieces processing, this compared with prior art, without carrying out any dismounting work, so as to reduce the workload of operating personnel.
As another technical solution, the present invention also provides a kind of semiconductor processing equipments comprising reaction chamber, this is anti-
Chamber is answered to use above-mentioned reaction chamber provided in an embodiment of the present invention.
Semiconductor processing equipment provided by the invention can be hindered by using above-mentioned reaction chamber provided by the invention
The workpiece to be machined slid is kept off, it is made to rest in the visual range on the inner wall of reaction chamber, to which operating personnel are can be with
Under conditions of seeing the workpiece to be machined of landing, the workpiece to be machined can be taken out directly from reaction chamber, this and the prior art
It compares, without carrying out any dismounting work, so as to reduce the workload of operating personnel.
It is understood that the principle that embodiment of above is intended to be merely illustrative of the present and the exemplary implementation that uses
Mode, however the present invention is not limited thereto.For those skilled in the art, in the essence for not departing from the present invention
In the case of refreshing and essence, various changes and modifications can be made therein, these variations and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a kind of reaction chamber is provided with the pedestal for carrying workpiece to be machined, the pedestal position in the reaction chamber
Above the bottom plate of the reaction chamber, which is characterized in that the reaction chamber bottom plate upper edge its circumferentially around being provided with
Baffle ring, the baffle ring be used for stop landing workpiece to be machined so that its rest on it is visual on the bottom plate of the reaction chamber
In range；The visual range is that can be seen from the gap between the madial wall and the periphery wall of the pedestal of the reaction chamber
The range observed.
2. reaction chamber according to claim 1, which is characterized in that be additionally provided in the reaction chamber along the base
Equally distributed at least three support column of circumferential direction of seat, to support the pedestal；Also,
The lower end of the support column is fixed on the bottom plate of the reaction chamber, and is formed with positioning in the lower end of the support column
Portion, to limit position of the baffle ring on the bottom plate.
3. reaction chamber according to claim 2, which is characterized in that be provided with multiple positioning on the bottom surface of the baffle ring
Groove, the quantity of the multiple positioning groove is corresponding with the quantity of the positioning region, and each positioning groove is correspondingly
It is matched with each positioning region.
4. reaction chamber according to claim 2, which is characterized in that be provided with multiple positioning on the bottom surface of the baffle ring
Groove, the quantity of the multiple positioning groove are the integral multiples of the quantity of the positioning region, and a portion positioning groove one
One accordingly matches with each positioning region；It is provided with block piece in wherein another part positioning groove, to make the cunning
The workpiece to be machined fallen can not pass through the part positioning groove.
5. reaction chamber according to claim 4, which is characterized in that the block piece includes one or is intervally arranged
Multiple screws,
The screw is threadedly coupled from the bottom surface of the positioning groove with the baffle ring, and the nut of the screw is located at the positioning
In groove, to stop the workpiece to be machined of the landing.
6. reaction chamber according to claim 3 or 4, which is characterized in that on the baffle ring, and positioned at per adjacent two
Gap location between a positioning groove is uniformly placed with multiple ventholes of the radial thickness through the baffle ring；
The venthole is dimensioned to：Make the workpiece to be machined of the landing that can not pass through.
7. reaction chamber according to claim 6, which is characterized in that the baffle ring uses integral structure；Alternatively,
The baffle ring is used is segmented the split structure formed by multiple, is connected using dismountable mode between each segmentation；
Also, the multiple segmentation is symmetrical relative to the longitudinal center line of the baffle ring, and the structure snd size phase of each segmentation
Together.
8. reaction chamber according to claim 7, which is characterized in that the number of the quantity of the segmentation and the positioning groove
It measures equal；
Each positioning groove is located at the center of each segmentation correspondingly；
All ventholes, which are averaged, to be distributed in each segmentation, and the venthole in each segmentation is symmetrical and uniformly arranges
Cloth is in the both sides of the positioning groove.
9. reaction chamber according to claim 7, which is characterized in that the both ends being each segmented are respectively arranged with interconnecting piece
With lower interconnecting piece, wherein be provided with counterbore on the upper interconnecting piece；It is provided with threaded hole on the lower interconnecting piece；
In the multiple segmentation, the lower interconnecting piece of the upper interconnecting piece of any one segmentation and adjacent thereto segmentation is mutual
It is stacked, and the counterbore is corresponding with the threaded hole；By the way that screw to be mounted in the counterbore and the threaded hole, and make
The upper interconnecting piece is fixedly connected with lower interconnecting piece.
10. a kind of semiconductor processing equipment, including reaction chamber, which is characterized in that the reaction chamber is that claim 1-9 appoints
Reaction chamber described in one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410802473.3A CN105762095B (en) | 2014-12-18 | 2014-12-18 | Reaction chamber and semiconductor processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410802473.3A CN105762095B (en) | 2014-12-18 | 2014-12-18 | Reaction chamber and semiconductor processing equipment |
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| Publication Number | Publication Date |
|---|---|
| CN105762095A CN105762095A (en) | 2016-07-13 |
| CN105762095B true CN105762095B (en) | 2018-08-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410802473.3A Active CN105762095B (en) | 2014-12-18 | 2014-12-18 | Reaction chamber and semiconductor processing equipment |
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| Country | Link |
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| CN (1) | CN105762095B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI649446B (en) * | 2017-03-15 | 2019-02-01 | 漢民科技股份有限公司 | Detachable gas injectorused for semiconductor equipment |
| CN111326438B (en) * | 2018-12-14 | 2021-12-17 | 北京北方华创微电子装备有限公司 | Leveling device and reaction chamber |
| CN114156211B (en) * | 2021-11-25 | 2023-06-16 | 北京北方华创微电子装备有限公司 | Semiconductor chamber |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5527393A (en) * | 1990-03-19 | 1996-06-18 | Kabushiki Kaisha Toshiba | Vapor-phase deposition apparatus and vapor-phase deposition method |
| CN102117726A (en) * | 2009-12-30 | 2011-07-06 | 塔工程有限公司 | Focusing ring of plasma processing apparatus and plasma processing apparatus equipped with focusing ring |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20050074760A (en) * | 2004-01-14 | 2005-07-19 | 주식회사 하이닉스반도체 | Semiconductor processing chamber |
| GB0504182D0 (en) * | 2005-03-01 | 2005-04-06 | Lingvitae As | Method |
-
2014
- 2014-12-18 CN CN201410802473.3A patent/CN105762095B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5527393A (en) * | 1990-03-19 | 1996-06-18 | Kabushiki Kaisha Toshiba | Vapor-phase deposition apparatus and vapor-phase deposition method |
| CN102117726A (en) * | 2009-12-30 | 2011-07-06 | 塔工程有限公司 | Focusing ring of plasma processing apparatus and plasma processing apparatus equipped with focusing ring |
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| Publication number | Publication date |
|---|---|
| CN105762095A (en) | 2016-07-13 |
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Address after: 100176 Beijing economic and Technological Development Zone, Wenchang Road, No. 8, No. Applicant after: Beijing North China microelectronics equipment Co Ltd Address before: 100176 Beijing economic and Technological Development Zone, Wenchang Road, No. 8, No. Applicant before: Beifang Microelectronic Base Equipment Proces Research Center Co., Ltd., Beijing |
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