CN105744758A - Power semiconductor control - Google Patents
Power semiconductor control Download PDFInfo
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- CN105744758A CN105744758A CN201511002184.6A CN201511002184A CN105744758A CN 105744758 A CN105744758 A CN 105744758A CN 201511002184 A CN201511002184 A CN 201511002184A CN 105744758 A CN105744758 A CN 105744758A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
- H01L23/49844—Geometry or layout for devices being provided for in H01L29/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10575—Insulating foil under component
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1147—Sealing or impregnating, e.g. of pores
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
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- Generation Of Surge Voltage And Current (AREA)
- Power Conversion In General (AREA)
Abstract
The invention relates to a power component for controlling high current, specifically to a smart power component with mutually parallel plates 1, 2 which are connected to the current input end and current output end of a power semiconductor 8. This allows high current 16, for example, for resistance welding, to be controlled without an excessive amount of heat loss.
Description
Technical field
The present invention relates to a kind of power component with power semiconductor, this power component can run by the control of intelligence.Power component is used to control the electric current in big electric current, particularly kA scope, as described electric current in industrial process, efficient machine and electric vehicle or in resistance melting welding required.
Background technology
The starting point of the present invention is a kind of such as the device as shown in EP1921908B1.Fig. 1 schematically illustrates the circuit arrangement with such power model roughly at this with side view.Power model and circuit board are disposed between cooling body and extrusion equipment.There is following hope, such power model is commonly used in extremely different applications as far as possible.To this, power model should be compact, can be readily replaceable and for especially application be configurable.
The task of the present invention is therefore that realize a kind of power component, and this power component constructs and easily configurable for extremely different application, particularly application more recited above at large and can transform as far as possible compactly.
Summary of the invention
The starting point of the present invention is a kind of power component for controlling heavy current.
Heavy current is interpreted as such as it such as electric current in resistance melting welding, for driving servomotor or use during for the machine of effective operation rate or for running vehicle.The usually electric current in next figure place of situation more than 50 volts of voltage or double figures kiloampere scope in preferred triple-phase electrical network.First can consider following application, must provide for the rectification of intermediate circuit voltage or electric current in the application and become required, for instance for service meter, also or the inverter of motor of vehicle and current transformer.
Power component includes at least one power semiconductor with current input terminal, current output terminal and control terminal.Power component also includes electric current tablet and the electric current output board of conduction of conduction, and wherein the current input terminal of power semiconductor is connected with electric current tablet and the current output terminal of power semiconductor is connected with electric current output board.Copper or molybdenum such as can be considered as panel material.Electric current tablet and/or electric current output board can monolithic or multi-disc ground construct.The control terminal of power semiconductor is disposed between two plates being preferably parallel to each other orientation.Additionally, power component includes, for the connection scheme controlling equipment, to control control terminal by this control equipment.
Connection scheme can be realized by the bindiny mechanism for controlling equipment.Bindiny mechanism can be realized as so that control equipment becomes passable to the integrated and/or such as external control devices in power component to the connection on power component.
For integrated-control apparatus, it is possible to such as arranging storing apparatus between insulated two plates between the plates, preferably substantially and on the first component carrier that is arranged in parallel of plate for control equipment.Storing apparatus can be the pedestal on parts carrier or leave a blank, and can arrange by this pedestal or leave a blank by this and connect required parts to realize control equipment/control equipment on parts carrier.At this advantageously, power component can realize particularly compactly and protect control equipment in order to avoid mechanical failure by plate.Control equipment can also easily be transformed or install.Control equipment can also have been integrated in this parts carrier when manufacturing parts carrier.
But, also should it is contemplated that and control equipment is arranged on power component or parts carrier so that control equipment is arranged in outside plate or only partially arranges between the plates.At this advantageously, control equipment can provide easy access to.But, must take preventive measures in order to mechanical protection controls equipment.Such as can also arranging discerptible socket connection, controlling equipment by this socket connection can be connected with power component.Or can being arranged in by control equipment on second component carrier, this second component carrier be connected with first component carrier.
Bindiny mechanism can also be implemented as industrial field bus interface (such as SERCOS(series real-time communication agreement), Process FieldbusROFIBUS with similar) so that outside and/or inside control equipment is capable of to the connection on power component by fieldbus.This control equipment then must have the industrial field bus interface of compatibility, the such as Ethernet interface in corresponding fieldbus equally.
Power component can also include the combination of the connection scheme mentioned before so that not only integrated solution but also the connection of outside are capable of.Integrated control equipment can also control device by field-bus interface with outside (process) that control equipment and/or higher level and communicate.
Cement, described cement can be used to be conduction and be capable of the connection that material determines as the bridging agent between power semiconductor terminal and plate.Such as can consider soldering or sintering as engaging process, be also contemplated for melting welding if desired.Control terminal is arranged between two plates so that this control terminal does not have the electrical contact with plate and keeps come-at-able between the plates.
Power semiconductor can be that electric current controls or voltage-controlled quasiconductor, such as diode transistors, IGBT, FET or MOSFET or similar.The control of quasiconductor can be undertaken by gate source voltage.By meaning, being controlled in of the quasiconductor of other structure types is can to carry out according to its data page.As power semiconductor it is also contemplated that have the power semiconductor of smooth (metal) housing.Housing protects power semiconductor and owing to smooth shape makes the plane on plate connect easily.This improves the heat conductivity of overall apparatus and reduces loss.Control terminal is substantially parallel to plate within plate and arranges and independently can control with current input terminal or current output terminal.
Control equipment can be integrated circuit, and this integrated circuit preferably gets out enough calculating power and memorizer so that can also meet the task of other higher levels for running power component except pure control power semiconductor.External circuit additionally can be set, such as driver or field-bus interface.But, described external circuit can also be integrated included by circuit so that needs minimum external cabling or is even no longer necessary to external cabling.
Advantages of the present invention
In addition by being used for connecting and/or the bindiny mechanism of integrated-control apparatus ensures the realizability of power component that is compact and that can commonly use, this bindiny mechanism can the most autonomous operation and be therefore readily configurable for extremely different applications when using preferred programmable control equipment.Have the enough programmable control equipment calculating power and memorizer if used, then this control equipment can extend for special application easily reprogramming or in its envelop of function, and program module can be reloaded or change.This can also pass through Internet connection or computer network (such as cloud) carries out.
In resistance melting welding is applied, power component such as can utilize the first control program to control for resistance melting welding process optimization.Running in the application of battery-driven electric vehicle being used for, power component can utilize the second control program to control for this optimizing application.If power model is used in supply module, then corresponding 3rd control program can be set.All or each control program can be saved in the memorizer of control equipment or control equipment can be realized as by adjustable land used so that control program is such as that easily can reload or changeable by field-bus interface.The mechanical realization of power component is simplified to the assembling in the mechanical part support as such as used for disc type unit.This improves motility in commercial Application, because being can be readily replaceable or can easily transform according to the power component of the present invention.
Preferably, plate is connected with each other by nonconducting bridging agent in its marginal area, and wherein plate and bridging agent constitute housing.Resin such as can be considered as bridging agent.It is also contemplated that the material being made up of duroplasts or flexible plastic.The housing realized by plate and bridging agent surrounds and protects the assembly included by power component plate, particularly power semiconductor and also has control equipment in integrated scheme in order to avoid external action.Just when hostile environment (as its in industrial environment of being everlasting occur), this is particularly advantageous.Therefore water spray protection according to IP protection class also is able to be easily achieved.
If power semiconductor and/or control equipment are arranged on parts carrier, then this parts carrier can preferably substantially be arranged between two plates abreast, and wherein control terminal can be connected with the conductor line included by parts carrier.Parts carrier can be preferred that circuit board (PCB-" printed circuit board (PCB) ").The through hole that parts carrier can have to plate contacts (such as so-called VIA=" perpendicular interconnection access ").
Preferably implement and there is power component and control the device of equipment, wherein control equipment and be connected on power component by bindiny mechanism.When integrated solution, control equipment is by power component at least in part, preferably entirely include.When the solution of non-integration, with controlling plant machinery/be arranged on power component electricly or be connected on power component preferably by field-bus interface.
Control equipment preferably includes and controls pulse generator and preferably also include for controlling the power supply that pulse generator is powered.If power semiconductor and control equipment are disposed on common parts carrier, then the transmission controlling pulse can be undertaken by the conductor line being applied on parts carrier.
It is preferably set up fast driving level, this fast driving level be arranged on control pulse generator outfan and the control terminal of power semiconductor between, in order to by control pulse generator from uncoupling the control terminal of power semiconductor and therefore this power semiconductor can control according to power within the shortest time.Driving stage can also include or such as be arranged in discretely on common parts carrier with control equipment by controlled device.The most self-centered operation by these device guaranteed output parts.
In control integration of equipments to power component, this power component can use when not having the measure of additional higher level, only have to ensure voltage supply.This can be realized by direct voltage source or the rectification of voltage that tapped by tap and this of transformer coil according to applicable cases.Finally, for instance if power component is used together with transformator, be then significant.
Preferably, control equipment and/or power component are configured for the status signal of the running status of output quasiconductor, power component or control equipment.Therefore can the process control report of superior for the special running status of power component.Mode according to running status, this process control then can introduce suitable measure, such as, intercept and capture mistake, introduce cooling provision when overheated with similar.Status signal can transmit by special purpose interface or by standard interface (such as field-bus interface).
Control equipment preferably includes the computing equipment for processing logical signal, described logical signal perhaps to run power semiconductor and/or in order to implement for running the suitable program of power component, the realization of such as adaptive life monitor becomes required.At this, it is possible to consider voltage, such as forward voltage and electric current based on the temperature occurred in power semiconductor during operation power semiconductor and compare with reference value.The value reference value that is prespecified or that determine on new power semiconductor with tolerance range such as can be considered as reference value.
The result of the described method of operation can be continued with by process control equally by the status signal mentioned before.The measure for ensureing continuation and safe operation device can be early introduced especially by adaptive life monitor.
Preferably, particularly also for the adaptive life monitor mentioned before realizing, control equipment and/or power component include for detecting and/or the testing agency of control survey value, particularly relevant with conductor temperature and/or quasiconductor electric current and/or quasiconductor forward voltage and/or quasiconductor input voltage value.
Addedly, the measure before mentioned extends preferably by the following manner, namely by control equipment and/or power component include short circuit monitor and/or for voltage supply under voltage monitoring and/or control pulse generator.Can also arrange, additionally monitor and/or analyze external voltage, such as transformer voltage and/or rectifier voltage and/or intermediate circuit voltage according to applicable cases.Except monitoring power semiconductor or power component itself, therefore should also and be additionally easily monitored applications assembly about power component by control equipment.Application component is interpreted as the assembly of application specific, the such as welding transformer in resistance melting welding is applied.
Monitor it is particularly preferred that also included snowslide by control equipment.This snowslide monitors and may be used for connection power semiconductor before avalanche energy exceedes previously given standard value.Power semiconductor can be protected in order to avoid the breaking-up that causes due to overvoltage, especially when big electric current and short transit time by the snowslide behavior so controlled.
All these measures for or by the process monitoring of higher level or itself ensure the operation smoothly of the power component according to the present invention by control equipment.
It is further preferred that included for connecting identical field-bus interface to industrial field bus or control equipment or power component is suitable for setting up the communication connection of other equipment (such as process control equipment) with higher level by fieldbus by control equipment or power component.
Therefore the status signal before mentioned and comparative result and monitoring result can also be passed to external equipment by fieldbus.The connection to control equipment of the assembly that additionally to monitor can also be realized.By field-bus interface, it is also possible to such as read and process actual value substantially in real time by the equipment (regulating device, process control equipment with similar) of higher level, such as voltage, electric current, temperature and the every other value that measurement technically can detect in power component or on power semiconductor.Industrial field bus is interpreted as following all devices, and being such as also based on ethernet standard by described all devices can in real time at the swapping data of multiple bus participants.It is also contemplated that wireless connections.
It is particularly preferred that control equipment is configured for controlling multiple power semiconductor independently of each other, particularly independently controls the first power semiconductor with the second power semiconductor or independently control the second power semiconductor with the first power semiconductor.Simply by the presence of multiple power semiconductors, then can also read by the field-bus interface mentioned before, process and control each independent power semiconductor consider about other power semiconductors when controlling input before the measured value mentioned, be for each power semiconductor and carry out individually and independently of each other.
Therefore control equipment and can also be configured for considering the running status of the second power semiconductor during producing the control pulse for controlling the first power semiconductor.
Should also realizing when not having higher level to control running by these measures, this higher level controls the operation of usual coordinating power quasiconductor.In this case, control equipment undertakes now the running status of the power semiconductor of the existence other according at least one and coordinates the control pulse controlling input for the first power semiconductor.Therefore, the entirely self-contained operation of power component can also be realized now when not having higher level to control.
Especially in commutator is applied, control equipment can include for realize transformer voltage and/or rectifier voltage or blanking voltage such as with reference voltage or with the mechanism of voltage to each other or the comparison with the additional voltage derived by described voltage.
Therefore transformator place or commutator branch in short circuit can particularly easily and quickly be identified and such as connect superior device report by the State-output mentioned before and/or fieldbus.Alternatively, control equipment itself can introduce the cut-out of suitable measure, such as defective power semiconductor or commutator branch.
For application, resistance melting welding, it is possible to the forward voltage of detection power semiconductor (such as MOSFET) or turn-on time.Therefore about the deduction of the state of soldering turret should be whenever can (pincers: open/close or contact: Yes/No).
Advantageously, it is also possible to by controlling equipment or the memorizer included by power component preserve exclusive data.In the application mentioned before, for instance can preserve in memory or adjustable land used gets out the data of the data important for fusion process or soldering turret.Also should consider to be saved in integrated memorizer by the data of power component itself so that power component can be easily identified by reading data by the equipment of higher level.Therefore electronic type nameplate should be also attainable for this device.
Preferably, matched transformer is for commutator as previously described, and wherein commutator is connected on the secondary windings of transformator and included by transformator or be arranged on the transformer.
This device such as provides the advantage that in resistance melting welding is applied, and the melting welding transformator for resistance melting welding has included the commutator of intelligence and can provide as the installation kit of resistance melting welding facility.The supply module of other applications, such as servomotor or electric vehicle it is suitable for and without the similar installation kit of transformator.
Supply module works as inverter or current transformer and can include the power component for producing intermediate loop DC voltage according to Patent right requirement, and this intermediate loop DC voltage subsequently can by inversion.
The complete driving device of adjustment equipment and supply module can also be had by the solution realization according to the present invention.Solution according to the present invention for run for manufacture or the machine of converted products be equally it is contemplated that.
Accompanying drawing explanation
Fig. 1 schematically shows first embodiment.
Fig. 2 schematically shows another embodiment.
Fig. 3 illustrates the functional device of the first control equipment.
Fig. 4 illustrates the functional device of the second control equipment.
Fig. 5 illustrates that supply module is applied.
Fig. 6 illustrates that resistance melting welding is applied.
Detailed description of the invention
Fig. 1 illustrates the resistance melting welding diode with multiple quasiconductor 8.Aforesaid resistance melting welding diode includes the parts carrier 9 of circuit board form between two plates 1,2.Quasiconductor 8 is respectively provided with metal shell 7, and this metal shell is connected with the current input terminal of quasiconductor 8.It is preferably used the housing 7 of at least side protection quasiconductor 8.The relative current output terminal 14 of quasiconductor 8 does not have housing 7 freely closely to implement.Control terminal 6 is illustrated equally.But also contemplated that quasiconductor 8 does not have the housing 7 of self.It is essential that these quasiconductors 8 have large-area current input terminal and/or current output terminal, in order to reduce loss and power density.Additionally, these quasiconductors 8 must adapted to the big electric current within the scope of transmission kA.Electric current tablet 1 as conduction arranges copper coin 1 and the electric current output board 2 as conduction arranges copper coin 2 equally.Alternatively, it is also possible to consider molybdenum.Electric conductivity that selected material should have and heat conductivity and the thermal expansion similar to silicon.The thickness of plate 1,2 such as may be located at millimeter within the scope of (such as 2mm).In embodiment shown here, the current input terminal of multiple MOSFET parts 8 is connected with electric current tablet 1 and the current output terminal of parts 8 is connected with electric current output board 2.Two copper coins 1,2 in parallel to each other and align with little spacing.Therefore this device becomes very compact.Current input terminal is connected by soldering or sintering direct conduction with electric current tablet 1.For this, on the current input terminal of quasiconductor housing 7, plane earth applies solder 15 or sintered paste 15.The inner face in the outside towards quasiconductor housing 7 of electric current tablet 1 except for the contact position of quasiconductor housing 7 to be externally provided with paint 10, this paint repels solder 15 or sintered material 15.Current output terminal and electric current output board 2 contact through the vertical through hole of circuit board 9 by electrical connection agent 14(VIAS-indirectly) it is conductively connected by soldering and/or sintering and/or copper projection (not shown), described copper projection can be the ingredient of electric current output board 2.At this, paint 10 can also be set.The grid 6 of parts 8 are come-at-able between plate 1,2 so that these grid can control by control equipment.Bindiny mechanism's (not shown) for controlling equipment can be arranged on parts carrier 9 and completely or partially be surrounded by plate 1,2.Bindiny mechanism is capable of integrated in power component of control equipment.Alternatively or additionally, bindiny mechanism is such as by the connection scheme controlling equipment that fieldbus can also provide non-integration on power component or only part is integrated.
Control equipment can jointly or discretely control the control input of all quasiconductors 8 preferably by driver (not shown).Control equipment also is able to the state according to other quasiconductor 8 and controls each quasiconductor 8.
Copper coin 1,2 that is parallel and that arrange flushing with each other at its marginal area is at least connected with each other by nonconducting plate bridging agent 3 in its marginal area so that copper coin 1,2 and bridging agent 3 constitute the housing of the assembly 6,7,8,9 being arranged between plate 1,2.Bridging agent 3 can be water casting material, but this bridging agent can also alternatively realize by plastics (such as duroplasts or flexible plastic).Advantage is the better protection of the mechanical strength being achieved in of this device when the heat conduction improved under the thermal expansion reduced and thus caused link position 14,15 and quasiconductor 8.
Can realizing following device by bridging agent 3, this device also meets for applying required IP protected mode according to application.Details section (referring to lower-left) according to Fig. 1, in the edge of copper coin 1,2 and can be provided with, at bridging agent 3 place, the contact position being shape-ordinatedly engaged, described contact position ensures the firmly contact between bridging agent 3 and plate 1,2.The large-area casting of two plates become unnecessary and manufacture be simplified by few installation steps.
Can control by control terminal 6 and by the previously given direction from electric current tablet 1 to electric current output board 2 running the electric current 16 occurred during this device.And can in the two directions from electric current tablet 1 and electric current output board 2 and therefore itself be carried away from quasiconductor 8 at heat produced by run duration 5 by quasiconductor 6.The behavior should show by the arrow 5 illustrated in the drawings.The behavior is particularly advantageous in resistance melting welding, uses significantly high electric current there and correspondingly must how to distribute loss heat.
Four quasiconductors 8 are shown in the drawings.The current input terminal of these quasiconductors is connected with each other by copper coin 1.Equally, current output terminal by VIAS14 and/or by the copper projection (not shown) included by copper coin 2 when use copper coin 2 be connected with each other.
Fig. 2 discloses and the similar device that figure 1 illustrates.Identical accompanying drawing labelling represents identical feature, drawing from description and/or accompanying drawing as long as no other.And copper coin 1,2 direct by soldering or sintering with differring primarily in that of Fig. 1, current input terminal (upside of such as quasiconductor 8 or downside) and current output terminal (upside of such as quasiconductor 8 or downside) is directly connected to (not having VIAS, housing or the like at this).Control terminal 6 is arranged accessibly by the conductor line on such as thin film or hard carrier 9 and can control by control equipment 17.With another difference is that of Fig. 1, two copper coins 1,2 are connected with the additional copper coin 11 utilizing cooling pipe 18 to run through respectively.These copper coins 11 can also be used in by scheme known for Fig. 1.Can also be arranged on electric current tablet 1 or on electric current output board 2 by only one copper coin 11.Electric current tablet 1 and/or the electric current output board 2 with integrated cooling pipe 18 can also be used in principle so that omit the additional coldplate 11 separated in two schemes (Fig. 1 and Fig. 2).First described possible scheme depends on the power demand of applicable cases.
In the drawings in the marginal area on right side, not shown by bridging agent 3(in this circuit board section 12) in leave a blank from device prominent.Circuit board section 12 can also realize (not shown) by second circuit board, this second circuit board can by socket connection 13 mechanical and/or electric with first circuit board 9 be connected.Circuit board 12 that should be prominent from device includes the control equipment 17 for quasiconductor 8 in parallel between panel 1,2.Bridging agent 3 surrounding closes whole device at least in part.Cast in the region left a blank this device so that water the casting material closing preventing outside adverse effect together with the bridging agent constituent apparatus surrounded.Control equipment 17 can also be assembled on first circuit board 9 so that this control equipment is also surrounded completely by plate 1,2 and bridging agent 3 when using suitable small parts.The program is recommended when the batch production of device.Alternatively or additionally, for instance suitable machinery and/or electrical interface can be assembled for fieldbus imagination.
Also circuit board 9 thin as far as possible is recommended so that just also enough for bearing semiconductor and the mechanical property for making device stable, the mechanical stress that heat radiation is in best and plate 9 minimally occurs when heating at this.
Fig. 3 is shown schematically for the functional device of the control equipment (the accompanying drawing labelling 17 in such as Fig. 2) according to the present invention of rectifier circuit roughly.This control equipment self can include voltage supply 313.Voltage supply 313 is such as by being used for producing the DC/DC transducer 316 of the DC voltage that current potential separates for the function of power semiconductor and/or assisting winding 315 by transformator and/or be can ensure that the power supply of all of power component or each assembly by bootstrap circuit 314 by transformer voltage.
Control equipment includes controlling pulse generator 319 as central functionality unit, and wherein this control pulse generator can be powered by the voltage supply 313 set forth before.Controlling pulse and can preferably be forwarded to drive unit 32, this drive unit can control the control input of power semiconductor 31a, the 31b at this merely illustrative half-bridge illustrated.This device is not limited to control only two power semiconductors 31a, 31b.
Control equipment can also be configured for the status signal of the running status by state notifying equipment 318 output quasiconductor.Additionally can include for processing logical signal and/or for realizing the computing equipment 33 of the adaptive life monitor of power semiconductor.
Equally possible include for detect and/or for control survey value, temperature especially on detection part, transformator and/or commutator and/or quasiconductor, voltage or for detect on constructed assembly or in the testing agency 36 of electric current.Sum it up, testing agency 36 should be ensured that all it is contemplated that and the detection of measuring the actual value that technically can detect, described actual value can appearance during operation power component.Additionally, it is possible to be arranged to voltage supply 313 and/or control short circuit supervision and/or the under voltage monitoring 38 of pulse generator 319.Equally possible snowslide is set monitors 39 and the second additional temperature monitoring 310.
The supervision of the strengthening of the internal operations of power component it is capable of by these measures.The running status of himself such as can be passed to the position of higher level in the scope of the Stateful Inspection exclusively implemented in real time or be ready to for calling by power component by control equipment.The functional device 317 producing or producing rub-out signal for mistake can meaningfully supplement the supervision mentioned before.Cooling medium can be monitored and the function of temperature switch can realize based on this supervision.
In addition illustrate the ability to realize the functional device 37 of the identification of power component and for providing or preserve the functional device 312 of exclusive data, such as soldering turret data, and for providing or preserve exclusive data, such as melting welding data, functional device 311 such as fusion process data.The function realizing the autotelic inquiry of such data can also be included.
Monitoring result becomes easy by the communication of that separate or included by power component or control equipment the field-bus interface 34 for control equipment or power component being connected on industrial field bus.Preferably, this field-bus interface 34 is based on ethernet standard, such as SERCOS fieldbus or based on wireless field bus standard.By connecting 35, power component or control equipment can be connected to higher level by field-bus interface 34 and control on device.Process data (identification data, temperature, current actual value, voltage actual value are with similar) or the data of set and/or the data of multiple power semiconductor mentioned before can be transmitted when not having high wiring costs or call.
Control equipment can also be configured for considering alternatively the running status of other power semiconductors 321 when controlling the first power semiconductor 31a and/or 31b.Control equipment can be configured for controlling independently of each other multiple power semiconductor 321, the control terminal of 31a, 31b and be preferably introduced the switching process of 320 temperature correlations.Control equipment is especially suitable for realizing all types of current transformer, is based particularly on full-bridge circuit at this, the current transformer of half-bridge circuit or intermediate point circuit.
Functional device shown in this figure can according to applicable cases completely or partially or in any combination included by power component and/or control equipment, for instance also the form of the program running on the computing device is included.Some functional devices, can also realize as the additional external module being used for controlling equipment such as driver 32 and/or voltage supply 313 or field-bus interface 34.Preferably, however all assemblies described here represented included by the integrated circuit of control equipment.
Have the integrated circuit with/without external cabling to be preferably arranged on the parts carrier 9 shown in Fig. 1 and 2 and be preferably disposed between plate 1,2.
Fig. 4 schematically shows the functional device controlling equipment according to the present invention roughly, and this control equipment is modified to control inverter.Affiliated inverter figure 5 illustrates.The functional device being shown in which has identical accompanying drawing labelling corresponding to the functional device set forth in figure 3.With reference to its description in the scope of Fig. 3.Accompanying drawing labelling 51a to 51f sets forth in Figure 5.
Fig. 5 illustrates the section in the supply module of the three-phase current servomotor 524 preferably with position detection (not shown).The power semiconductor used in three shown half-bridge 51a, d and 51b, e and 51c, f can realize with corresponding description by the power component according to the present invention according to Fig. 1 and 2.Half-bridge may be connected in intermediate DC circuit (+/-).
Fig. 6 illustrates the resistance melting welding facility as application examples, and it includes melting welding and controls device 60, has the soldering turret 61 of melting welding transformator 62 and commutator 63.Commutator 63 and transformator 62 constitute unit that are compact and that separate with pincers 61, have been arranged at transformator 62 or commutator 63 on transformator 62 and include the solution according to the present invention because commutator 63 is likely to before being arranged on pincers 61 as required and connect 64 at this by the Ethernet that line connects and be connected with melting welding control device 60 by SERCOSIII agreement.Wireless solution should equally it is contemplated that.
All can also be comprehensive by professional institute for realizing the variations of alternative embodiment at Fig. 1 to the feature shown in 6.Alternative embodiment can also include the feature mentioned in the description added, and described feature is not illustrated in figure describes or mentions.The application examples being shown in which should in no way limit by the attainable applicable cases of the present invention.Such as it is desirably integrated in extremely different commutator application and electronic circuit (half-bridge, full-bridge, intermediate point circuit) according to the power component of the present invention.
Claims (13)
1. it is used for controlling the power component of heavy current (16), including: there is current input terminal, the power semiconductor (8) of current output terminal and control terminal (6), the electric current tablet (1) of conduction and the electric current output board (2) of conduction, wherein the current input terminal of power semiconductor (8) is connected with electric current tablet (1) and the current output terminal of power semiconductor (8) is connected with electric current output board (2), wherein control terminal (6) is disposed in plate (1, 2) between and including being used for controlling the bindiny mechanism of equipment (17), control terminal (6) can be controlled by described control equipment, wherein bindiny mechanism realize control equipment to the integrated and/or control equipment (17) in power component to power component on connection.
2. power component according to claim 1, wherein connect control equipment (17) by bindiny mechanism, described control equipment includes controlling pulse generator (319) and preferably including voltage supply (313,314,315,316) or be connected with such voltage supply, and wherein said voltage supply (313,314,315,316) is also configured for controlling pulse generator (319) power supply.
3. power component according to claim 2, wherein controls equipment (17) or power component is configured for output parts or power semiconductor (8) or controls the status signal of running status of equipment (17).
4., according to the power component one of the claims 2 or 3 Suo Shu, wherein control equipment (17) and include for processing logical signal and/or the computing equipment (33) of Stateful Inspection or adaptive life monitor for running program, such as power semiconductor.
5. according to the power component one of the claims 2 to 4 Suo Shu, wherein include for detecting and/or the testing agency (36) of control survey value by controlling equipment (17), described measured value especially with regard on power semiconductor (8) or power component or in or temperature on other assemblies included by power component and/or electric current and/or voltage.
6., according to the power component one of the claims 2 to 5 Suo Shu, wherein control equipment (17) and include short circuit supervision and/or under voltage monitoring (38).
7., according to the power component one of the claims 2 to 6 Suo Shu, wherein control equipment (17) and include snowslide supervision (39).
8. according to the power component one of the claims 2 to 7 Suo Shu, wherein control equipment (17) or power component is provided with for control equipment (17) or power component are connected to industrial field bus, is based preferably on the fieldbus of ethernet standard, such as the field-bus interface (34) on SERCOS fieldbus or wireless fieldbus.
9., according to the power component one of the claims Suo Shu, wherein control equipment (17) and be configured for controlling independently of each other the control terminal of multiple power semiconductor (8).
10., according to the power component one of the claims Suo Shu, wherein control equipment (17) and be configured for considering when controlling the first power semiconductor (8) running status of the second power semiconductor (8).
11. current transformer, particularly commutator, including according to the power component one of the claims Suo Shu.
12. transformator, melting welding transformator especially for resistance melting welding, having current transformer according to claim 11, wherein said current transformer is connected on the secondary windings of transformator.
13. device, particularly equipment, automation component, machine or vehicle, particularly electric vehicle, melting resistance welder, supply module for servomotor, including transformator according to claim 12 and/or current transformer according to claim 11.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102014227027.8 | 2014-12-30 | ||
| DE102014227027.8A DE102014227027A1 (en) | 2014-12-30 | 2014-12-30 | Power semiconductor drive |
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| CN105744758A true CN105744758A (en) | 2016-07-06 |
| CN105744758B CN105744758B (en) | 2021-01-01 |
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| CN201511002184.6A Active CN105744758B (en) | 2014-12-30 | 2015-12-29 | Power semiconductor control |
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| DE102019205046A1 (en) * | 2019-04-09 | 2020-10-15 | Robert Bosch Gmbh | Power component and transformer device for resistance welding |
| DE102020211631A1 (en) | 2020-09-17 | 2022-03-17 | Robert Bosch Gesellschaft mit beschränkter Haftung | SEMICONDUCTOR MODULE FOR A WELDING TRANSFORMER AND METHOD FOR MANUFACTURING SUCH SEMICONDUCTOR MODULE |
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| CN101599484A (en) * | 2008-06-05 | 2009-12-09 | 三菱电机株式会社 | Resin molded semiconductor device and manufacture method thereof |
| CN102097427A (en) * | 2009-11-10 | 2011-06-15 | 英飞凌科技股份有限公司 | Laminated electronic component |
| CN103137573A (en) * | 2011-11-28 | 2013-06-05 | 三星电机株式会社 | Power module package |
| CN103199069A (en) * | 2011-12-08 | 2013-07-10 | 英飞凌科技股份有限公司 | Device including two power semiconductor chips and manufacturing thereof |
| CN103460825A (en) * | 2011-03-28 | 2013-12-18 | 索尤若驱动有限及两合公司 | Converter assembly, method for producing a converter assembly and method for operating a converter assembly |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| DE19828664C2 (en) * | 1998-06-26 | 2003-02-27 | Infineon Technologies Ag | Space-saving semiconductor arrangement with at least two semiconductor chips particularly suitable for temperature monitoring and method for producing such a semiconductor arrangement |
| DE102006052619B4 (en) | 2006-11-08 | 2009-07-30 | Semikron Elektronik Gmbh & Co. Kg | Circuit arrangement with a power module that is combined with a printed circuit board |
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2014
- 2014-12-30 DE DE102014227027.8A patent/DE102014227027A1/en active Pending
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101599484A (en) * | 2008-06-05 | 2009-12-09 | 三菱电机株式会社 | Resin molded semiconductor device and manufacture method thereof |
| CN102097427A (en) * | 2009-11-10 | 2011-06-15 | 英飞凌科技股份有限公司 | Laminated electronic component |
| CN103460825A (en) * | 2011-03-28 | 2013-12-18 | 索尤若驱动有限及两合公司 | Converter assembly, method for producing a converter assembly and method for operating a converter assembly |
| CN103137573A (en) * | 2011-11-28 | 2013-06-05 | 三星电机株式会社 | Power module package |
| CN103199069A (en) * | 2011-12-08 | 2013-07-10 | 英飞凌科技股份有限公司 | Device including two power semiconductor chips and manufacturing thereof |
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| CN105744758B (en) | 2021-01-01 |
| DE102014227027A1 (en) | 2016-06-30 |
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