CN105722336B - CPU presses detent mechanism - Google Patents
CPU presses detent mechanism Download PDFInfo
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- CN105722336B CN105722336B CN201610195742.3A CN201610195742A CN105722336B CN 105722336 B CN105722336 B CN 105722336B CN 201610195742 A CN201610195742 A CN 201610195742A CN 105722336 B CN105722336 B CN 105722336B
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- cpu
- fixed
- cooling fin
- fixed plates
- plate
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses CPU to press detent mechanism,It mainly includes air cylinder fixed plate,Cylinder is fixed in air cylinder fixed plate,Cooling fin is provided with below cylinder,CPU fixed plates are connected with below cooling fin,The bayonet coordinated with CPU sizes is provided in the CPU fixed plates,Guiding thimble is provided in the CPU fixed plates,The CPU of the present invention fixes laminating mechanism because being provided with guiding thimble in CPU fixed plates,So that CPU fixes laminating mechanism during pushing,Being oriented to thimble can move in pilot hole matched on pcb board,Realization is accurately positioned,The correct position that cpu chip is mounted on pcb board,When the pcb board for installing cpu chip works,CPU can send out amount of heat,Because the setting of cooling fin increases the heat dissipation area of CPU,So as to increase the service life of CPU.
Description
Technical field
The present invention relates to a kind of CPU erecting devices, more particularly to CPU pressing detent mechanisms.
Background technology
Acp chip on pcb board is cpu chip, therefore when making pcb board, need cpu chip being fixed on pcb board
On, at present in processing PCB plate, generally all cpu chip is placed on pcb board by being positioned manually, then is pressed through laminating mechanism,
But since cpu chip is small, artificial cpu chip of placing can cause positioning inaccurate so that pcb board can not work normally.
Invention content
The CPU with heat sinking function the technical problem to be solved by the present invention is to provide a kind of accurate positioning and when CPU works
Fixed laminating mechanism.
The technical solution adopted by the present invention to solve the technical problems is：CPU fixes laminating mechanism, is fixed including cylinder
Plate is fixed with cylinder in air cylinder fixed plate, and cooling fin is provided with below cylinder, CPU fixed plates are connected with below cooling fin, described
The bayonet coordinated with CPU sizes is provided in CPU fixed plates, guiding thimble is provided in the CPU fixed plates, further includes guiding
Axis and guide plate, the guiding axis pass through guide plate, and the lower end of the guide plate is connect with CPU fixed plates, the guide plate
Side is equipped with sliding block, is equipped with sliding rail in air cylinder fixed plate, and the sliding block is mounted on sliding rail, the output shaft of the cylinder with
Guide plate connects.
It is further:The riser for being fixed on air cylinder fixed plate both sides is further included, being provided with fan between two pieces of risers consolidates
Fixed board, further includes fan, and the fan is arranged in fan fixed plate.
It is further：The CPU fixed plates are red copper fixed plate, and the cooling fin is red copper cooling fin.
The beneficial effects of the invention are as follows：The CPU of the present invention fixes laminating mechanism because being provided with guiding in CPU fixed plates
Thimble so that CPU fixes laminating mechanism during pushing, and pilot hole matched on pcb board can be moved to by being oriented to thimble
In, realization is accurately positioned so that cpu chip can be mounted on the correct position on pcb board, when the pcb board work for installing cpu chip
When making, CPU can send out amount of heat, because the setting of cooling fin increases the heat dissipation area of CPU, so as to increase the use of CPU
Service life.
Description of the drawings
Fig. 1 fixes laminating mechanism schematic diagram for CPU.
Fig. 2 fixes laminating mechanism side view for CPU.
Fig. 3 fixes laminating mechanism stereogram for CPU.
In figure label for：Air cylinder fixed plate 1, cooling fin 3, CPU fixed plates 4, is oriented to thimble 5, riser 6, fan at cylinder 2
Fixed plate 7, fan 8, guiding axis 9, guide plate 10.
Specific embodiment
The present invention is further described with reference to the accompanying drawings and detailed description.
CPU pressing detent mechanisms as shown in Figure 1 to Figure 3, including air cylinder fixed plate 1, gas is fixed in air cylinder fixed plate 1
Cylinder 2,2 lower section of cylinder are provided with cooling fin 3, and 3 lower section of cooling fin is connected with CPU fixed plates 4, is provided in the CPU fixed plates 4
With the bayonet of CPU sizes cooperation, it is provided in the CPU fixed plates 4 and is oriented to thimble 5, further include guiding axis 9 and guide plate 10,
The guiding axis 9 passes through guide plate 10, and the lower end of the guide plate 10 is connect with CPU fixed plates 4, the side of the guide plate 10
Sliding block is installed, sliding rail is installed in air cylinder fixed plate 1, the sliding block is mounted on sliding rail, and the output shaft of the cylinder is with leading
It is connected to plate, during start-up operation, pcb board is located at CPU pressing detent mechanisms lower section, and cpu chip is caught in CPU fixed plates 4
In bayonet, controller control cylinder 2 pushes guide plate and guide plate is pushed with cooling fin 3 and CPU fixed plates 4 so that leads
It is moved downward to plate, cooling fin and CPU fixed plates with respect to air cylinder fixed plate, during pushing, being oriented to thimble 5 can move to
On pcb board in matched pilot hole, realization is accurately positioned, by cpu chip be fixed on the correct position of pcb board and by its
Pressing, pcb board start-up operation at this time, cpu chip starts to generate heat, since the setting of cooling fin 3 enables cpu chip preferably to dissipate
Calorific value, so as to increase the service life of cpu chip.
In addition, further including the riser 6 for being fixed on 1 both sides of air cylinder fixed plate, being provided with fan 8 between two pieces of risers 6 fixes
Plate 7 further includes fan 8, and the fan 8 is arranged in 8 fixed plate 7 of fan, and after pcb board start-up operation, fan 8 starts, and blows
The heat on cooling fin 3 is dissipated, further functions as the effect that cpu chip is made to cool down, while extend the service life of cpu chip.
In addition, the CPU fixed plates 4 are red copper fixed plate, the cooling fin 3 is red copper cooling fin 3, it can be selected herein
His material, but red copper has better heat conduction effect, can the heat of cpu chip be transferred to cooling fin 3 faster and radiated, and enhances
The service life of cpu chip.
Particular embodiments described above has carried out the purpose of the present invention, technical solution and advantageous effect further in detail
It describes in detail bright, it should be understood that the above is only a specific embodiment of the present invention, is not intended to restrict the invention, it is all
Within the spirit and principles in the present invention, any modification, equivalent substitution, improvement and etc. done should be included in the guarantor of the present invention
Within the scope of shield.
Claims (3)
1.CPU presses detent mechanism, it is characterised in that：Including air cylinder fixed plate (1), air cylinder fixed plate is fixed with cylinder on (1)
(2), cooling fin (3) is provided with below cylinder (2), CPU fixed plates (4), the CPU fixed plates are connected with below cooling fin (3)
(4) bayonet coordinated with CPU sizes is provided on, is provided on the CPU fixed plates (4) and is oriented to thimble (5), further include guiding
Axis (9) and guide plate (10), the guiding axis (9) is across guide plate (10), lower end and the CPU fixed plates of the guide plate (10)
(4) it connects, the side of the guide plate (10) is equipped with sliding block, and sliding rail, the sliding block installation are equipped in air cylinder fixed plate (1)
On sliding rail, the output shaft of the cylinder is connect with guide plate.
2. CPU as described in claim 1 presses detent mechanism, it is characterised in that：It further includes and is fixed on air cylinder fixed plate (1) two
The riser (6) of side is provided with fan (8) fixed plate (7) between two pieces of risers (6), further includes fan (8), the fan (8) sets
It puts in fan (8) fixed plate (7).
3. CPU as described in claim 1 presses detent mechanism, it is characterised in that：The CPU fixed plates (4) are fixed for red copper
Plate, the cooling fin (3) are red copper cooling fin (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610195742.3A CN105722336B (en) | 2016-03-31 | 2016-03-31 | CPU presses detent mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610195742.3A CN105722336B (en) | 2016-03-31 | 2016-03-31 | CPU presses detent mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105722336A CN105722336A (en) | 2016-06-29 |
| CN105722336B true CN105722336B (en) | 2018-06-15 |
Family
ID=56159321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610195742.3A Active CN105722336B (en) | 2016-03-31 | 2016-03-31 | CPU presses detent mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105722336B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000315860A (en) * | 1999-04-30 | 2000-11-14 | Matsushita Electric Ind Co Ltd | Rework method of integrated circuit component, rework device, solder reflow method, solder reflow device, mounting method of the integrated circuit component and mounting apparatus |
| CN203520159U (en) * | 2013-10-28 | 2014-04-02 | 广东易事特电源股份有限公司 | UPS main control panel testing equipment |
| CN204241643U (en) * | 2014-11-18 | 2015-04-01 | 上海新世纪机器人有限公司 | A kind of PCB test tool |
| CN204257536U (en) * | 2014-10-21 | 2015-04-08 | 浙江正泰电器股份有限公司 | A kind of rivet pressing clamp |
| CN205648214U (en) * | 2016-03-31 | 2016-10-12 | 苏州精密达电子科技有限公司 | CPU pressfitting positioning mechanism |
-
2016
- 2016-03-31 CN CN201610195742.3A patent/CN105722336B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000315860A (en) * | 1999-04-30 | 2000-11-14 | Matsushita Electric Ind Co Ltd | Rework method of integrated circuit component, rework device, solder reflow method, solder reflow device, mounting method of the integrated circuit component and mounting apparatus |
| CN203520159U (en) * | 2013-10-28 | 2014-04-02 | 广东易事特电源股份有限公司 | UPS main control panel testing equipment |
| CN204257536U (en) * | 2014-10-21 | 2015-04-08 | 浙江正泰电器股份有限公司 | A kind of rivet pressing clamp |
| CN204241643U (en) * | 2014-11-18 | 2015-04-01 | 上海新世纪机器人有限公司 | A kind of PCB test tool |
| CN205648214U (en) * | 2016-03-31 | 2016-10-12 | 苏州精密达电子科技有限公司 | CPU pressfitting positioning mechanism |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105722336A (en) | 2016-06-29 |
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Effective date of registration: 20181008 Address after: 215200 No. 377, Chang Bang Road, Wujiang economic and Technological Development Zone, Suzhou, Jiangsu Patentee after: Jiangsu Jing Zheng Automation Technology Co., Ltd. Address before: 215000 No. 377, Chang Bang Road, Wujiang District, Suzhou, Jiangsu. Patentee before: SUZHOU JINGMIDA ELECTRONIC TECHNOLOGY CO., LTD. |