CN105722336A - CPU laminating and positioning mechanism - Google Patents
CPU laminating and positioning mechanism Download PDFInfo
- Publication number
- CN105722336A CN105722336A CN201610195742.3A CN201610195742A CN105722336A CN 105722336 A CN105722336 A CN 105722336A CN 201610195742 A CN201610195742 A CN 201610195742A CN 105722336 A CN105722336 A CN 105722336A
- Authority
- CN
- China
- Prior art keywords
- cpu
- plate
- fixing plate
- air cylinder
- guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a CPU laminating and positioning mechanism, which mainly comprises an air cylinder fixing plate, wherein an air cylinder is fixed on the air cylinder fixing plate; a cooling fin is arranged at the lower part of the air cylinder; the lower part of the cooling fin is connected with a CPU fixing plate; a bayonet matched with a CPU in size is arranged on the CPU fixing plate; and a guide thimble is arranged on the CPU fixing plate. According to the CPU laminating and positioning mechanism, the guide thimble is arranged on the CPU fixing plate, so that the guide thimble moves into a matched guide hole in a PCB in the pressing process of the CPU laminating and positioning mechanism; accurate positioning is achieved; a CPU chip can be arranged at a correct position on the PCB; and when the PCB provided with the CPU chip works, the CPU emits a lot of heat. The heat radiating area of the CPU is increased due to the arranged cooling fin, so that the service lifetime of the CPU is prolonged.
Description
Technical field
The present invention relates to a kind of CPU erecting device, particularly to CPU pressing detent mechanism.
Background technology
Acp chip on pcb board is cpu chip, therefore when making pcb board, need to be fixed on pcb board by cpu chip, at present when processing PCB plate, general all cpu chip is placed on pcb board by manually positioning, then through laminating mechanism pressing, but owing to cpu chip volume is little, artificial cpu chip of placing can cause that location is forbidden so that pcb board cannot normal operation.
Summary of the invention
Present invention solves the technical problem that and be to provide a kind of accurate positioning and there is when CPU works the fixing laminating mechanism of CPU of heat sinking function.
The technical solution adopted for the present invention to solve the technical problems is: CPU fixes laminating mechanism, including air cylinder fixed plate, air cylinder fixed plate is fixed with cylinder, cylinder is arranged below fin, fin has been connected below the fixing plate of CPU, the fixing plate of described CPU is provided with the bayonet socket coordinated with CPU size, the fixing plate of described CPU is provided with guiding thimble, also include the axis of guide and guide plate, described axis of guide traverse guide plate, the lower end of described guide plate is connected with the fixing plate of CPU, the side of described guide plate is provided with slide block, air cylinder fixed plate is provided with slide rail, described slide block is arranged on slide rail, the output shaft of described cylinder is connected with guide plate.
Further: also include the riser being fixed on air cylinder fixed plate both sides, being provided with the fixing plate of fan, also include fan between two pieces of risers, described fan is arranged on the fixing plate of fan.
Further: the fixing plate of described CPU is the fixing plate of red copper, and described fin is red copper fin.
The invention has the beneficial effects as follows: the fixing laminating mechanism of the CPU of the present invention because being provided with guiding thimble on the fixing plate of CPU, make the fixing laminating mechanism of CPU under press through in journey, guiding thimble can move in pilot hole matched on pcb board, realization is accurately positioned, make the tram that cpu chip can be arranged on pcb board, when the pcb board installing cpu chip works, CPU can send amount of heat, because the setting of fin increases the area of dissipation of CPU, thus adding the service life of CPU.
Accompanying drawing explanation
Fig. 1 is the fixing laminating mechanism schematic diagram of CPU.
Fig. 2 is the fixing laminating mechanism side view of CPU.
Fig. 3 is the fixing laminating mechanism axonometric chart of CPU.
Figure is labeled as: air cylinder fixed plate 1, cylinder 2, fin 3, CPU fix plate 4, guiding thimble 5, riser 6, fan fixing plate 7, fan 8, the axis of guide 9, guide plate 10.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the present invention is further described.
CPU pressing detent mechanism as shown in Figure 1 to Figure 3, including air cylinder fixed plate 1, air cylinder fixed plate 1 is fixed with cylinder 2, cylinder 2 is arranged below fin 3, fin 3 has been connected below the fixing plate 4 of CPU, the fixing plate 4 of described CPU is provided with the bayonet socket coordinated with CPU size, the fixing plate 4 of described CPU is provided with guiding thimble 5, also include the axis of guide 9 and guide plate 10, the described axis of guide 9 traverse guide plate 10, the lower end of described guide plate 10 is connected with the fixing plate 4 of CPU, the side of described guide plate 10 is provided with slide block, air cylinder fixed plate 1 is provided with slide rail, described slide block is arranged on slide rail, the output shaft of described cylinder is connected with guide plate, when starting working, pcb board is positioned at below CPU pressing detent mechanism, cpu chip is snapped in the bayonet socket on the fixing plate 4 of CPU, controller controls 2 times pressure guide plates of cylinder and guide plate is pressed for 4 times with the fixing plate of fin 3 and CPU, make guide plate, fin air cylinder fixed plate relative to the fixing plate of CPU moves downward, under press through in journey, guiding thimble 5 can move in pilot hole matched on pcb board, realization is accurately positioned, cpu chip is fixed on the tram of pcb board and by its pressing, now pcb board is started working, cpu chip starts heating, owing to the setting of fin 3 makes cpu chip can better distribute heat, thus adding the service life of cpu chip.
In addition, also include the riser 6 being fixed on air cylinder fixed plate 1 both sides, it is provided with fan 8 between two pieces of risers 6 and fixes plate 7, also including fan 8, described fan 8 is arranged on fan 8 and fixes on plate 7, after pcb board is started working, fan 8 starts, dispel the heat on fin 3, further function as the effect making cpu chip lower the temperature, extend the service life of cpu chip simultaneously.
Additionally, the fixing plate 4 of described CPU is the fixing plate of red copper, described fin 3 is red copper fin 3, can be selected for other materials herein, but red copper has better heat conduction effect, the heat of cpu chip can be transferred to fin 3 faster and dispel the heat, enhance the service life of cpu chip.
Particular embodiments described above; the purpose of the present invention, technical scheme and beneficial effect have been further described; it is it should be understood that; the foregoing is only specific embodiments of the invention; it is not limited to the present invention; all within the spirit and principles in the present invention, any amendment of making, equivalent replacement, improvement etc., should be included within protection scope of the present invention.
Claims (3)
1.CPU pressing detent mechanism, it is characterized in that: include air cylinder fixed plate (1), air cylinder fixed plate (1) is fixed with cylinder (2), cylinder (2) is arranged below fin (3), fin (3) has been connected below the fixing plate (4) of CPU, described CPU fixes and is provided with the bayonet socket coordinated with CPU size on plate (4), described CPU fixes and is provided with guiding thimble (5) on plate (4), also include the axis of guide (9) and guide plate (10), the described axis of guide (9) traverse guide plate (10), the lower end of described guide plate (10) is connected with the fixing plate (4) of CPU, the side of described guide plate (10) is provided with slide block, air cylinder fixed plate is provided with slide rail on (1), described slide block is arranged on slide rail, the output shaft of described cylinder is connected with guide plate.
2. CPU pressing detent mechanism as claimed in claim 1, it is characterized in that: also include being fixed on the riser (6) of air cylinder fixed plate (1) both sides, the fixing plate (7) of fan (8) it is provided with between two pieces of risers (6), also including fan (8), described fan (8) is arranged on the fixing plate (7) of fan (8).
3. CPU pressing detent mechanism as claimed in claim 1, it is characterised in that: described CPU fixes plate (4) for the fixing plate of red copper, and described fin (3) is red copper fin (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610195742.3A CN105722336B (en) | 2016-03-31 | 2016-03-31 | CPU presses detent mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610195742.3A CN105722336B (en) | 2016-03-31 | 2016-03-31 | CPU presses detent mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105722336A true CN105722336A (en) | 2016-06-29 |
| CN105722336B CN105722336B (en) | 2018-06-15 |
Family
ID=56159321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610195742.3A Active CN105722336B (en) | 2016-03-31 | 2016-03-31 | CPU presses detent mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105722336B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000315860A (en) * | 1999-04-30 | 2000-11-14 | Matsushita Electric Ind Co Ltd | Rework method of integrated circuit component, rework device, solder reflow method, solder reflow device, mounting method of the integrated circuit component and mounting apparatus |
| CN203520159U (en) * | 2013-10-28 | 2014-04-02 | 广东易事特电源股份有限公司 | UPS main control panel testing equipment |
| CN204241643U (en) * | 2014-11-18 | 2015-04-01 | 上海新世纪机器人有限公司 | A kind of PCB test tool |
| CN204257536U (en) * | 2014-10-21 | 2015-04-08 | 浙江正泰电器股份有限公司 | A kind of rivet pressing clamp |
| CN205648214U (en) * | 2016-03-31 | 2016-10-12 | 苏州精密达电子科技有限公司 | CPU pressfitting positioning mechanism |
-
2016
- 2016-03-31 CN CN201610195742.3A patent/CN105722336B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000315860A (en) * | 1999-04-30 | 2000-11-14 | Matsushita Electric Ind Co Ltd | Rework method of integrated circuit component, rework device, solder reflow method, solder reflow device, mounting method of the integrated circuit component and mounting apparatus |
| CN203520159U (en) * | 2013-10-28 | 2014-04-02 | 广东易事特电源股份有限公司 | UPS main control panel testing equipment |
| CN204257536U (en) * | 2014-10-21 | 2015-04-08 | 浙江正泰电器股份有限公司 | A kind of rivet pressing clamp |
| CN204241643U (en) * | 2014-11-18 | 2015-04-01 | 上海新世纪机器人有限公司 | A kind of PCB test tool |
| CN205648214U (en) * | 2016-03-31 | 2016-10-12 | 苏州精密达电子科技有限公司 | CPU pressfitting positioning mechanism |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105722336B (en) | 2018-06-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20181008 Address after: 215200 No. 377, Chang Bang Road, Wujiang economic and Technological Development Zone, Suzhou, Jiangsu Patentee after: Jiangsu Jing Zheng Automation Technology Co., Ltd. Address before: 215000 No. 377, Chang Bang Road, Wujiang District, Suzhou, Jiangsu. Patentee before: SUZHOU JINGMIDA ELECTRONIC TECHNOLOGY CO., LTD. |
|
| TR01 | Transfer of patent right |