CN205643399U - PCB mainboard test equipment - Google Patents
PCB mainboard test equipment Download PDFInfo
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- CN205643399U CN205643399U CN201620261652.5U CN201620261652U CN205643399U CN 205643399 U CN205643399 U CN 205643399U CN 201620261652 U CN201620261652 U CN 201620261652U CN 205643399 U CN205643399 U CN 205643399U
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Abstract
The utility model discloses a PCB mainboard test equipment, it mainly includes mould and lower mould, and upward one side of mould and lower mould hinges, and the corresponding position of going up mould and lower mould is provided with the fixed trip of pressfitting respectively and colludes with lower pressfitting fixing clip, is provided with the support plate in the lower mould, is provided with the drive arrangement of drive support plate upward movement below the support plate, go up in the mould and to be provided with the needle piece module of being connected with the controller with the support plate department of correspondence, CPU location pressing mechanism and core interface module, at lower mould rebound in -process, core interface module can contact with the interface of the PCB board that awaits measuring, it still is provided with lower mould positioning mechanism all around to go up the mould, this disposition of equipment is simple, the await measuring automatic plug of the core interface module of interface and last mould on the PCB board of needle piece module contact on await measuring PCB board and the last mould of lower mould on the in -process that rises makes the lower mould and realizing, the realization is to the all -round detection of PCB board, the time measuring detection is being examined simply to the feasible PCB board that awaits measuring, practice thrift test time, the testing efficiency is improved.
Description
Technical field
This utility model relates to electronic product detection field, tests equipment particularly to PCB main board.
Background technology
PCB main board is also known as printed circuit board (PCB), PCB main board has become a most important module in current electronic product, therefore in the production process of PCB main board, need PCB main board is carried out various test, prior art is that test wire rod is manually inserted in the corresponding joints on PCB main board by personnel to the method for testing of PCB main board, but this method, not only lose time, improve human cost, and big by artificial disturbance factor, owing to cpu chip volume is the least, manually it is difficult to be installed on PCB main board, needs take considerable time, the most very inconvenient.
Utility model content
This utility model solves the technical problem that being to provide a kind of PCB main board of being easy to carries out the PCB main board test equipment of various functions test.
nullThis utility model solves its technical problem the technical scheme is that PCB main board test equipment，Including upper die and lower die，The side of upper die and lower die is hinged，The correspondence position of upper die and lower die is respectively arranged with pressing and fixes snap fit and snap fit is fixed in lower pressing，Support plate it is provided with in lower mold，The driving means driving support plate to move upward it is provided with below support plate，Described upper mold is provided with the pin block module being connected with controller with support plate corresponding position，CPU location laminating mechanism and core interface module，During lower mold moves up，Core interface module can be with the interface contact of pcb board to be measured，Upper mold surrounding is additionally provided with upper and lower mould detent mechanism，Described CPU location laminating mechanism includes air cylinder fixed plate，Cylinder it is fixed with in air cylinder fixed plate，Fin it is provided with below cylinder，Connect below fin and have CPU fixed plate，It is provided with, in described CPU fixed plate, the bayonet socket coordinated with CPU size，It is provided with guiding thimble in described CPU fixed plate，Also include the axis of guide and guide plate，The described axis of guide passes guide plate，The lower end of described guide plate is connected with CPU fixed plate，The side of described guide plate is provided with slide block，Slide rail is installed in air cylinder fixed plate，Described slide block is arranged on slide rail，The output shaft of described cylinder is connected with guide plate.
Further: also include the riser being fixed on air cylinder fixed plate both sides, between two pieces of risers, be provided with fan fixed plate, also include that fan, described fan are arranged in fan fixed plate.
Further: described CPU fixed plate and fin are red copper structure.
Further: described lower mold side be provided with for support open after upper mold open supporting mechanism.
Further: described upper mold top is provided with product supporting mechanism to be measured.
Further: being provided with multiple second fan in described upper mold, the wind direction mouth of described second fan is towards lower mold.
nullThe beneficial effects of the utility model are: PCB main board of the present utility model test equipment uses simple，After upper mould cover is above lower mold，Lower mold makes the pcb board to be measured in lower mold and the pin block module contact in upper mold and the interface that can realize on pcb board to be measured and the power interface module in upper mold in uphill process、The automatic plug of the core interface modules such as network card interface module and video card interface module，Realize the comprehensive detection to pcb board，Make pcb board to be measured detection when detection simple，Save the testing time，Improve the work efficiency of test，And need cpu chip is installed on PCB main board，CPU location laminating mechanism is because be provided with guiding thimble in CPU fixed plate，Make CPU location laminating mechanism during pressure down，Guide thimble can move in hole, location corresponding on pcb board，Realize accurately guiding，Cpu chip can be arranged on the tram of pcb board，Not only install and can save a large amount of manpower the most simultaneously，Improve work efficiency，When pcb board is started working，Cpu chip can send amount of heat，Thus the setting of fin increases the area of dissipation of CPU，Thus add the service life of CPU.
Accompanying drawing explanation
Fig. 1 is that PCB main board tests equipment schematic diagram.
Fig. 2 is that PCB main board tests equipment side view.
Fig. 3 is that CPU fixes laminating mechanism schematic diagram.
Fig. 4 is that CPU fixes laminating mechanism side view.
Fig. 5 is that CPU fixes laminating mechanism axonometric chart.
Figure is labeled as: upper mold 1, lower mold 2, snap fit 3 is fixed in upper pressing, snap fit 4 is fixed in lower pressing, pin block module 5, upper and lower mould detent mechanism 6, CPU location laminating mechanism 7, open supporting mechanism 8, product supporting mechanism 9 to be measured, air cylinder fixed plate 10, cylinder 11, fin 12, CPU fixed plate 13, guide thimble 14, riser 15, fan fixed plate 16, fan 17, the axis of guide 18, guide plate 19.
Detailed description of the invention
With detailed description of the invention, this utility model is further illustrated below in conjunction with the accompanying drawings.
nullPCB main board test equipment as shown in Figures 1 to 5，Including upper mold 1 and lower mold 2，The side of upper mold 1 and lower mold 2 is hinged，The correspondence position of upper mold 1 and lower mold 2 is respectively arranged with pressing and fixes snap fit 3 and snap fit 4 is fixed in lower pressing，It is provided with support plate in lower mold 2，The driving means driving support plate to move upward it is provided with below support plate，Described upper mold 1 is provided with the pin block module 5 being connected with controller with support plate corresponding position，CPU location laminating mechanism 7 and core interface module，During lower mold 2 moves up，Core interface module can be with the interface contact of pcb board to be measured，Upper mold 1 surrounding is additionally provided with upper and lower mould detent mechanism 6，Described upper and lower mould detent mechanism 6 includes the hole, location on positioning needle that surrounding arranges and pcb board to be measured，Match and realize location in positioning needle and hole, location，Described CPU location laminating mechanism 7 includes air cylinder fixed plate 10，Cylinder 11 it is fixed with in air cylinder fixed plate 10，Fin 12 it is provided with below cylinder 11，Connect below fin 12 and have CPU fixed plate 13，It is provided with, in described CPU fixed plate 13, the bayonet socket coordinated with CPU size，Guiding thimble 14 it is provided with in described CPU fixed plate 13，When needs are tested，Pcb board to be measured is fixed on support plate，Cpu chip is snapped in the bayonet socket of CPU fixed plate 13，Then upper mold 1 is turned to above lower mold 2，Upper pressing is fixed snap fit 3 snap in lower pressing and fix snap fit 4 realizes the fixing of upper mold 1 and lower mold 2，Then controller control cylinder moves upward，Support plate is by upwards jack-up，Pcb board to be measured on support plate is contacted with the pin block module 5 of upper mold 1，Power interface module simultaneously、The core interface modules such as network card interface module and video card interface module can insert in the corresponding socket of pcb board to be measured，Guide plate is pressed under the driving of cylinder 11，Make CPU fixed plate 13 carry cpu chip to be moved downward to pcb board to be measured and move down on the correspondence position that cpu chip embeds pcb board to be measured，Owing to being provided with the pilot hole corresponding with guiding thimble 14 on PCB to be measured，The upper section area of described pilot hole is more than lower section area，During 13 times pressures of CPU fixed plate，Even if there are some deviations position，Pilot hole also can guide guiding thimble 14 to move and press under tram，Cpu chip is embedded on the tram of pcb board to be measured，Fix PCB main board simultaneously，Then pcb board to be measured is tested by controller control pin block module 5 with core interface module，In test process，Cpu chip can generate heat，Heat on cpu chip can conduct to fin 12 through CPU fixed plate 13，The setting of fin 12 adds area of dissipation，Cpu chip can preferably be dispelled the heat，Prevent cpu chip from damaging because of chip overheating in test process，Enhance the service life of cpu chip，PCB main board of the present utility model test equipment uses simple，Only pcb board to be measured need to be bred on support plate，Cpu chip is snapped in CPU fixed plate 13，Upper mold 1 is overturn and can realize the test to pcb board to be measured above lower mold 2，And in test process without artificial by network interface card、Video card、The interface of power supply inserts in PCB to be measured，Due to network interface card、The core interface modules such as video card are fixed in upper mold 1，Therefore during support plate jack-up declines，Core interface module can be corresponding with on PCB to be measured interface realize automatic plug，Further reduce the labor intensity of workman，Improve testing efficiency simultaneously.
In addition, also include the riser 15 being fixed on air cylinder fixed plate 10 both sides, it is provided with fan 17 fixed plate 16 between two pieces of risers 15, also includes that the first fan 17, described first fan 17 are arranged in fan fixed plate 16, owing to CPU can send amount of heat in operation process, and heat conduction is on fin 12, the arranging of fan 17 can be accelerated the heat of fin 12 and be distributed, thus accelerates the cooling of cpu chip, cpu chip can preferably be worked, extend the service life of cpu chip simultaneously.
Additionally, described CPU fixed plate 13 and fin 12 are red copper structure, CPU fixed plate 13 and fin 12 can be other structures, such as aluminum matter structure, copper structure etc., selecting red copper structure, red copper structure has more preferable heat conductivility so that cpu chip can preferably dispel the heat herein.
In addition, described lower mold 2 side be provided with for support open after upper mold 1 open supporting mechanism 8, before test, need pcb board to be measured is put support plate, cpu chip is snapped in CPU fixed plate 13, it is therefore desirable to upper mold 1 is opened, supporting mechanism now can be used upper mold 1 to be supported, avoid and also need manually upper mold 1 to be propped up so that this equipment is more convenient when using.
Additionally, described upper mold 1 top is provided with product supporting mechanism 9 to be measured, for the auxiliary PCB main board fixed position when test.
In addition, described upper mold 1 is provided with multiple second fan 17, the wind direction mouth of described second fan 17 is towards lower mold 2, owing to PCB main board all parts in the course of the work all can heat production, the setting of the most multiple second fans 17, the all parts of PCB main board and PCB main board can be tested equipment to dispel the heat, strengthen the service life of PCB main board and this equipment.
Particular embodiments described above; the purpose of this utility model, technical scheme and beneficial effect are further described; it is it should be understood that; the foregoing is only specific embodiment of the utility model; it is not limited to this utility model; all within spirit of the present utility model and principle, any modification, equivalent substitution and improvement etc. done, within should be included in protection domain of the present utility model.
Claims (6)
- nullThe main board test apparatus of 1.PCB，It is characterized in that: include upper mold (1) and lower mold (2)，The side of upper mold (1) and lower mold (2) is hinged，The correspondence position of upper mold (1) and lower mold (2) is respectively arranged with pressing and fixes snap fit (3) and snap fit (4) is fixed in lower pressing，Lower mold is provided with support plate in (2)，The driving means driving support plate to move upward it is provided with below support plate，Described upper mold (1) is provided with pin block module (5) being connected with controller with support plate corresponding position，CPU location laminating mechanism (7) and core interface module，During lower mold (2) moves up，Core interface module can be with the interface contact of pcb board to be measured，Upper mold (1) surrounding is additionally provided with upper and lower mould detent mechanism (6)，Described CPU location laminating mechanism (7) includes air cylinder fixed plate (10)，Cylinder (11) it is fixed with in air cylinder fixed plate (10)，Cylinder (11) lower section is provided with fin (12)，Fin (12) lower section connects CPU fixed plate (13)，It is provided with, on described CPU fixed plate (13), the bayonet socket coordinated with cpu chip size，Guiding thimble (14) it is provided with on described CPU fixed plate (13)，Also include the axis of guide (18) and guide plate (19)，The described axis of guide (18) passes guide plate (19)，The lower end of described guide plate (19) is connected with CPU fixed plate (13)，The side of described guide plate (19) is provided with slide block，Air cylinder fixed plate is provided with slide rail on (10)，Described slide block is arranged on slide rail，The output shaft of described cylinder is connected with guide plate.
- 2. PCB main board test equipment as claimed in claim 1, it is characterized in that: also include being fixed on the riser (15) of cylinder (11) fixed plate (10) both sides, it is provided with fan fixed plate (16) between two pieces of risers (15), also include that the first fan (17), described first fan (17) are arranged in fan fixed plate (16).
- 3. PCB main board test equipment as claimed in claim 1, it is characterised in that: described CPU fixed plate (13) and fin (12) they are red copper structure.
- 4. PCB main board test equipment as claimed in claim 1, it is characterised in that: described lower mold (2) side is provided with and opens supporting mechanism (8) for support the upper mold (1) after opening.
- 5. PCB main board test equipment as claimed in claim 1, it is characterised in that: described upper mold (1) top is provided with product supporting mechanism (9) to be measured.
- 6. PCB main board test equipment as claimed in claim 1, it is characterised in that: being provided with multiple second fan (17) in described upper mold (1), the wind direction mouth of described second fan (17) is towards lower mold (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620261652.5U CN205643399U (en) | 2016-03-31 | 2016-03-31 | PCB mainboard test equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620261652.5U CN205643399U (en) | 2016-03-31 | 2016-03-31 | PCB mainboard test equipment |
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| Publication Number | Publication Date |
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| CN205643399U true CN205643399U (en) | 2016-10-12 |
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| CN201620261652.5U Active CN205643399U (en) | 2016-03-31 | 2016-03-31 | PCB mainboard test equipment |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107423175A (en) * | 2017-06-29 | 2017-12-01 | 郑州云海信息技术有限公司 | Server test mounting seat and the measurement jig that server CPU module can be replaced |
| CN107621603A (en) * | 2017-11-08 | 2018-01-23 | 深圳市强瑞电子有限公司 | A kind of mainboard MMI tests automechanism |
| CN107727891A (en) * | 2017-08-25 | 2018-02-23 | 郑州云海信息技术有限公司 | A kind of general mainboard testboard |
| CN108458736A (en) * | 2018-02-10 | 2018-08-28 | 浙江达美智能技术有限公司 | A kind of detent mechanism of on-line measuring device |
| CN108761256A (en) * | 2018-07-27 | 2018-11-06 | 南斗六星系统集成有限公司 | A kind of test cabinet |
| CN108957295A (en) * | 2018-07-27 | 2018-12-07 | 深圳市仕科达精密设备技术有限公司 | Pcb board tests mould group |
| CN111090018A (en) * | 2019-12-27 | 2020-05-01 | 苏州浪潮智能科技有限公司 | Testing device for server fan board |
| CN112180237A (en) * | 2020-09-24 | 2021-01-05 | 珠海市精实测控技术有限公司 | Pressing plate heat dissipation structure of test fixture |
-
2016
- 2016-03-31 CN CN201620261652.5U patent/CN205643399U/en active Active
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107423175A (en) * | 2017-06-29 | 2017-12-01 | 郑州云海信息技术有限公司 | Server test mounting seat and the measurement jig that server CPU module can be replaced |
| CN107423175B (en) * | 2017-06-29 | 2021-02-02 | 苏州浪潮智能科技有限公司 | Mounting base for server test and test fixture capable of replacing server GPU module |
| CN107727891A (en) * | 2017-08-25 | 2018-02-23 | 郑州云海信息技术有限公司 | A kind of general mainboard testboard |
| CN107621603A (en) * | 2017-11-08 | 2018-01-23 | 深圳市强瑞电子有限公司 | A kind of mainboard MMI tests automechanism |
| CN107621603B (en) * | 2017-11-08 | 2023-09-29 | 深圳市强瑞精密技术股份有限公司 | Automatic test mechanism for MMI (man-machine interface) of main board |
| CN108458736A (en) * | 2018-02-10 | 2018-08-28 | 浙江达美智能技术有限公司 | A kind of detent mechanism of on-line measuring device |
| CN108761256A (en) * | 2018-07-27 | 2018-11-06 | 南斗六星系统集成有限公司 | A kind of test cabinet |
| CN108957295A (en) * | 2018-07-27 | 2018-12-07 | 深圳市仕科达精密设备技术有限公司 | Pcb board tests mould group |
| CN111090018A (en) * | 2019-12-27 | 2020-05-01 | 苏州浪潮智能科技有限公司 | Testing device for server fan board |
| CN112180237A (en) * | 2020-09-24 | 2021-01-05 | 珠海市精实测控技术有限公司 | Pressing plate heat dissipation structure of test fixture |
| CN112180237B (en) * | 2020-09-24 | 2022-03-18 | 珠海市精实测控技术有限公司 | Pressing plate heat dissipation structure of test fixture |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20181016 Address after: 215200 No. 377, Chang Bang Road, Wujiang economic and Technological Development Zone, Suzhou, Jiangsu Patentee after: Jiangsu Jing Zheng Automation Technology Co., Ltd. Address before: 215000 No. 377, Chang Bang Road, Wujiang District, Suzhou, Jiangsu. Patentee before: SUZHOU JINGMIDA ELECTRONIC TECHNOLOGY CO., LTD. |
|
| TR01 | Transfer of patent right |