CN105720042A - Anti-interference processing method for electronic parts and components - Google Patents
Anti-interference processing method for electronic parts and components Download PDFInfo
- Publication number
- CN105720042A CN105720042A CN201610074711.2A CN201610074711A CN105720042A CN 105720042 A CN105720042 A CN 105720042A CN 201610074711 A CN201610074711 A CN 201610074711A CN 105720042 A CN105720042 A CN 105720042A
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- components
- electronic devices
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- electromagnetic shielding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Abstract
The invention relates to an anti-interference processing method for electronic parts and components. The anti-interference processing method comprises the steps of preparing liquid state packaging materials, packaging the electronic parts and components by the liquid state packaging materials and performing subsequent processing on the packaged liquid state packaging materials. By adoption of the anti-interference processing method for packaging and processing the electronic parts and components, the interferences to the electronic parts and components in the packaging materials from external magnetic fields and irradiation can be lowered; the method is not limited to the appearances of the electronic parts and components and the types of the packaging materials; and the method is simple, flexible, low in cost, and wide in application range, so that that the anti-interference processing method can be used for performing electromagnetic shielding and irradiation resistance reinforcement on a CPU, a microprocessor and other logic devices, a Flash, an MRAM and other storage devices, a sensing device, a high-frequency device, a wire and other various electronic devices, and also can be used for performing overall electromagnetic shielding and irradiation resistance reinforcement on an integrated circuit.
Description
Technical field
The present invention relates to electromagnetic shielding and Flouride-resistani acid phesphatase field, particularly relate to a kind of method that electronic devices and components are carried out anti-interference process.
Background technology
Electronic devices and components are carried out electromagnetic shielding or Flouride-resistani acid phesphatase strengthening, job stability and the service life of electronic device and integrated circuit can be greatly enhanced, there is important industrial application value, numerous in this industry being closely related particularly in railway traffic, nuclear energy, Aero-Space, military project, geology detecting, medical treatment etc..Along with the development of magnetic rotation storage and senser element, the especially development of high frequency components and parts, electronic device is more and more higher to the requirement of electromagnetic shielding and Flouride-resistani acid phesphatase.The fast development of nuclear energy and space application has also promoted the demand to electromagnetic shielding and Flouride-resistani acid phesphatase.Traditional electromagnetic shielding and Flouride-resistani acid phesphatase method; utilizing the metal shell such as the thicker coat of metal or stereotype that electronic device is protected, its shortcoming is that complex process, preparation cost are high, and size is big, volume weight; it is unfavorable for the system integration and miniaturization, especially at space industry.Along with the development of science and technology, new material and new physical effect are constantly applied in electromagnetic shielding and Flouride-resistani acid phesphatase.Such as, light, high strength & high electric-conduction can Graphene and the amorphous nano powder of carbon fibre material, high magnetic permeability and the intensity of magnetization and amorphous wire material, radiation-resistant heavy metal nano-powder etc..By selecting suitable type of solvent, selecting different melting concns and different combinations of materials, it is possible to achieve have the colloidal materials of different magneto-electric behavior.Eventually through encapsulation and solidification process, prepare excellent electromagnetic shielding and Flouride-resistani acid phesphatase enhanced protection layer for electronic device.
Summary of the invention
The present invention overcomes above-mentioned weak point, purpose is in that to provide a kind of method that electronic devices and components are carried out anti-interference process, including the preparation of liquid encapsulating material, the curing molding of liquid encapsulating material is processed by liquid encapsulating material to the encapsulation of electronic devices and components and after having encapsulated；Due to the portability of liquid encapsulating material, doping property, easy mobility and abundant processability, this method for packing can not be subject to the restriction of material and electronic device shape and structure, has that technique is simple, an advantage that good reliability, motility are high.
The present invention reaches above-mentioned purpose by the following technical programs: a kind of method that electronic devices and components are carried out anti-interference process, utilize the liquid encapsulating material doped with electromagnetic shielding material or irradiation resistant material to be packaged the electronic devices and components being fixed on carrier processing, and the liquid encapsulating material being encapsulated in electronic devices and components surface is carried out curing molding process.
As preferably, the described liquid encapsulating material doped with electromagnetic shielding material or irradiation resistant material is prepared with electromagnetic shielding or irradiation resistant material mixing and doping by fluid binder, electromagnetic shielding material or irradiation resistant material are dispersed in fluid binder, and doping content is adjusted depending on concrete application scenarios.
As preferably, described fluid binder is any one in organic solvent, resin, plastics, rubber, glass.
As preferably, described electromagnetic shielding material is any one or a few combination in magnetic powder, non-crystalline flour, amorphous wire, metal powder, metal wire, graphite, CNT；Described irradiation resistant material is any one or a few combination in heavy metal compound, fibre reinforced materials, rare-earth oxide, ceramic powders, resin.
As preferably, described carrier is any one in pcb board, suspension arrangement, line.
As preferably, described encapsulation process is any one or a few combination in perfusion, spin coating, plastic packaging.
As preferably, described in be attached on carrier electronic devices and components number be one or more.
As preferably, described curing molding processes and includes baking, ultraviolet lighting, oxidation, crosslinking, hot pressing.
As preferably, described electronic devices and components also can not depend on carrier and be packaged processing, and forming processes to be solidified is fixed on carrier after completing.
As preferably, described electronic devices and components are any one in central processing unit, internal memory, buffer, MRAM, Flash, SSD, hard disk, sensor, high-frequency element, wire, integrated circuit.
The beneficial effects of the present invention is: after electronic devices and components are processed by (1) the inventive method, the interference to electronic devices and components of external magnetic field and irradiation can be reduced, this method is not only restricted to electronic devices and components profile and encapsulating material kind, and simple and flexible, cost are low, widely applicable；(2) have that technique is simple, advantage that good reliability, motility are high, have a good application prospect.
Accompanying drawing explanation
Fig. 1 is the embodiment of the present invention 1 anti-interference processing method schematic diagram；
Fig. 2 is the embodiment of the present invention 2 anti-interference processing method schematic diagram.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention is described further, but protection scope of the present invention is not limited to that:
Embodiment 1: as it is shown in figure 1, a kind of method that electronic devices and components are carried out anti-interference process, comprise the steps:
(1) prepare the liquid encapsulating material 1 doped with electromagnetic shielding material or irradiation resistant material, and liquid encapsulating material 1 is contained in container 4；
Described liquid encapsulating material is prepared with electromagnetic shielding material or irradiation resistant material mixing and doping by fluid binder, and electromagnetic shielding material or irradiation resistant material are homogeneously dispersed in fluid binder；During preparation, electromagnetic shielding material or irradiation resistant material are blended in fluid binder and obtain liquid encapsulating material；Described fluid binder is any one in organic solvent, resin, plastics, rubber, glass；Described electromagnetic shielding material is any one or a few combination in magnetic powder, non-crystalline flour, amorphous wire, metal powder, metal wire, graphite, CNT, and described irradiation resistant material is any one or a few combination in heavy metal compound, fibre reinforced materials, rare-earth oxide, ceramic powders, resin.
(2) being fixed on carrier 3 by electronic devices and components 2, wherein, the number of electronic devices and components is one in the present embodiment；Electronic devices and components include but not limited to central processing unit, internal memory, buffer memory, MRAM, Flash, SSD, hard disk, sensor, high-frequency element, wire, integrated circuit etc..Carrier 3 can be various pcb board, suspension arrangement, line etc..
(3) liquid encapsulating material 1 prepared is utilized to be packaged electronic devices and components 2 processing so that liquid encapsulating material 1 is coated on electronic devices and components 2；Described encapsulation process includes but not limited to perfusion, spin coating, plastic packaging etc..
(4) liquid encapsulating material after encapsulation is carried out subsequent cure process, complete the electromagnetic shielding to electronic devices and components and Flouride-resistani acid phesphatase strengthening.Described subsequent treatment process includes but not limited to baking, ultraviolet, oxidation, crosslinking, the various techniques such as hot-forming.
Wherein, step (2) can also be placed on and finally carry out.
When electronic devices and components after process use; encapsulating material that have cured, doped with electromagnetic shielding material or irradiation resistant material is that electronic devices and components are protected; external magnetic field and irradiation actinism are on protection packaging material; encapsulating material absorbing, reflecting or conduct away external magnetic field and radiation, thus protecting electronic devices and components not disturbed by external magnetic field and irradiation.
Embodiment 2: as in figure 2 it is shown, a kind of method that electronic devices and components are carried out anti-interference process, comprise the steps:
(1) prepare liquid encapsulating material 1, and liquid encapsulating material 1 is contained in container 4；
Described liquid encapsulating material is prepared with electromagnetic shielding material or irradiation resistant material mixing and doping by fluid binder, and electromagnetic shielding material or irradiation resistant material are homogeneously dispersed in fluid binder；During preparation, electromagnetic shielding material or irradiation resistant material are blended in fluid binder and obtain liquid encapsulating material；Described fluid binder is any one in organic solvent, resin, plastics, rubber, glass；Described electromagnetic shielding material is any one or a few combination in magnetic powder, non-crystalline flour, amorphous wire, metal powder, metal wire, graphite, CNT, and described irradiation resistant material is any one or a few combination in heavy metal compound, fibre reinforced materials, rare-earth oxide, ceramic powders, resin.
(2) being fixed on carrier 3 by electronic devices and components 2, wherein, the number of electronic devices and components is multiple in the present embodiment, the old integrated circuit of common group；Electronic devices and components include but not limited to central processing unit, internal memory, buffer memory, MRAM, Flash, SSD, hard disk, sensor, high-frequency element, wire, integrated circuit etc..Carrier 3 can be various pcb board, suspension arrangement, line etc..
(3) liquid encapsulating material 1 prepared is utilized to be packaged electronic devices and components 2 processing so that liquid encapsulating material 1 is coated on electronic devices and components 2；Described encapsulation process includes but not limited to perfusion, spin coating, plastic packaging etc..
(4) liquid encapsulating material after encapsulation is carried out subsequent cure process, complete the electromagnetic shielding to electronic devices and components or Flouride-resistani acid phesphatase strengthening.Described subsequent treatment process includes but not limited to baking, ultraviolet, oxidation, crosslinking, the various techniques such as hot-forming.
Wherein, step (2) can also be placed on and finally carry out.
When electronic devices and components after process use; encapsulating material that have cured, doped with electromagnetic shielding material or irradiation resistant material is that electronic devices and components are protected; external magnetic field and irradiation actinism are on protection packaging material; encapsulating material absorbing, reflecting or conduct away external magnetic field and radiation, thus protecting electronic devices and components not disturbed by external magnetic field and irradiation.
Be specific embodiments of the invention and the know-why used described in above, if the change that conception under this invention is made, function produced by it still without departing from description and accompanying drawing contain spiritual time, protection scope of the present invention must be belonged to.
Claims (10)
1. the method that electronic devices and components are carried out anti-interference process, it is characterized in that, utilize the liquid encapsulating material doped with electromagnetic shielding material or irradiation resistant material to be packaged the electronic devices and components being fixed on carrier processing, and the liquid encapsulating material being encapsulated in electronic devices and components surface is carried out curing molding process.
2. a kind of method that electronic devices and components are carried out anti-interference process according to claim 1, it is characterized in that: the described liquid encapsulating material doped with electromagnetic shielding material or irradiation resistant material is prepared with electromagnetic shielding material or irradiation resistant material mixing and doping by fluid binder, being dispersed in fluid binder by electromagnetic shielding material or irradiation resistant material during preparation, doping content is not limit.
3. a kind of method that electronic devices and components are carried out anti-interference process according to claim 2, it is characterised in that: described fluid binder is any one in organic solvent, resin, plastics, rubber, glass.
4. a kind of method that electronic devices and components are carried out anti-interference process according to claim 2, it is characterised in that: described electromagnetic shielding material is any one or a few combination in magnetic powder, non-crystalline flour, amorphous wire, metal powder, metal wire, graphite, CNT；Described irradiation resistant material is any one or a few combination in heavy metal compound, fibre reinforced materials, rare-earth oxide, ceramic powders, resin.
5. a kind of method that electronic devices and components are carried out anti-interference process according to claim 1, it is characterised in that: described carrier is any one in pcb board, suspension arrangement, line.
6. a kind of method that electronic devices and components are carried out anti-interference process according to claim 1, it is characterised in that: described in be attached on carrier electronic devices and components number be one or more.
7. a kind of method that electronic devices and components are carried out anti-interference process according to claim 1, it is characterised in that: described encapsulation process is any one or a few combination in perfusion, spin coating, plastic packaging.
8. a kind of method that electronic devices and components are carried out anti-interference process according to claim 1, it is characterised in that: described curing molding processes and includes baking, ultraviolet lighting, oxidation, crosslinking, hot pressing.
9. a kind of method that electronic devices and components are carried out anti-interference process according to claim 1, it is characterised in that: described electronic devices and components also can not depend on carrier and be packaged processing, and forming processes to be solidified is fixed on carrier after completing.
10. a kind of method that electronic devices and components are carried out anti-interference process according to claim 1, it is characterised in that: described electronic devices and components are any one in central processing unit, internal memory, buffer, MRAM, Flash, SSD, hard disk, sensor, high-frequency element, wire, integrated circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610074711.2A CN105720042A (en) | 2016-02-03 | 2016-02-03 | Anti-interference processing method for electronic parts and components |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610074711.2A CN105720042A (en) | 2016-02-03 | 2016-02-03 | Anti-interference processing method for electronic parts and components |
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| Publication Number | Publication Date |
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| CN105720042A true CN105720042A (en) | 2016-06-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610074711.2A Pending CN105720042A (en) | 2016-02-03 | 2016-02-03 | Anti-interference processing method for electronic parts and components |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107331624A (en) * | 2017-05-27 | 2017-11-07 | 广东风华高新科技股份有限公司 | The encapsulating method of chip components and parts and the packaging apparatus of chip components and parts |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2278838A1 (en) * | 1997-01-30 | 1998-08-06 | Phillip J. Layton | Methods and compositions for ionizing radiation shielding |
| JPH10214923A (en) * | 1997-01-28 | 1998-08-11 | Fujitsu Denso Ltd | Chip-on-board shielding structure and its manufacture |
| CN1324904A (en) * | 2000-05-19 | 2001-12-05 | 弗朗茨·科珀 | Isolator or filler having electromagnetic shielding characteristic for producing electronic device |
| JP2006504272A (en) * | 2002-10-21 | 2006-02-02 | レアード テクノロジーズ，インコーポレーテッド | Thermally conductive EMI shield |
| CN104465541A (en) * | 2013-09-17 | 2015-03-25 | 南茂科技股份有限公司 | Chip packaging structure and manufacturing method thereof |
-
2016
- 2016-02-03 CN CN201610074711.2A patent/CN105720042A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10214923A (en) * | 1997-01-28 | 1998-08-11 | Fujitsu Denso Ltd | Chip-on-board shielding structure and its manufacture |
| CA2278838A1 (en) * | 1997-01-30 | 1998-08-06 | Phillip J. Layton | Methods and compositions for ionizing radiation shielding |
| CN1324904A (en) * | 2000-05-19 | 2001-12-05 | 弗朗茨·科珀 | Isolator or filler having electromagnetic shielding characteristic for producing electronic device |
| JP2006504272A (en) * | 2002-10-21 | 2006-02-02 | レアード テクノロジーズ，インコーポレーテッド | Thermally conductive EMI shield |
| CN104465541A (en) * | 2013-09-17 | 2015-03-25 | 南茂科技股份有限公司 | Chip packaging structure and manufacturing method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107331624A (en) * | 2017-05-27 | 2017-11-07 | 广东风华高新科技股份有限公司 | The encapsulating method of chip components and parts and the packaging apparatus of chip components and parts |
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Application publication date: 20160629 |
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