CN107331624A - The encapsulating method of chip components and parts and the packaging apparatus of chip components and parts - Google Patents
The encapsulating method of chip components and parts and the packaging apparatus of chip components and parts Download PDFInfo
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- CN107331624A CN107331624A CN201710393591.7A CN201710393591A CN107331624A CN 107331624 A CN107331624 A CN 107331624A CN 201710393591 A CN201710393591 A CN 201710393591A CN 107331624 A CN107331624 A CN 107331624A
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- parts
- chip components
- support plate
- glass paste
- encapsulating method
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Links
- 238000000034 method Methods 0.000 title claims abstract description 70
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 14
- 239000011521 glass Substances 0.000 claims abstract description 83
- 230000008569 process Effects 0.000 claims abstract description 35
- 239000000463 material Substances 0.000 claims abstract description 18
- 238000005470 impregnation Methods 0.000 claims abstract description 7
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 6
- 230000007246 mechanism Effects 0.000 claims description 27
- 239000002390 adhesive tape Substances 0.000 claims description 20
- 239000003795 chemical substances by application Substances 0.000 claims description 17
- 238000002386 leaching Methods 0.000 claims description 16
- 238000005245 sintering Methods 0.000 claims description 16
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 15
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- 239000000428 dust Substances 0.000 claims description 13
- 239000002904 solvent Substances 0.000 claims description 12
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 10
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 7
- 239000002002 slurry Substances 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 125000003277 amino group Chemical group 0.000 claims description 3
- 238000002513 implantation Methods 0.000 claims description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims 1
- ULWHHBHJGPPBCO-UHFFFAOYSA-N propane-1,1-diol Chemical group CCC(O)O ULWHHBHJGPPBCO-UHFFFAOYSA-N 0.000 claims 1
- 238000007598 dipping method Methods 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000000227 grinding Methods 0.000 description 8
- 238000005507 spraying Methods 0.000 description 7
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 5
- 150000001412 amines Chemical class 0.000 description 4
- 235000019441 ethanol Nutrition 0.000 description 4
- 238000001914 filtration Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 238000012216 screening Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000000889 atomisation Methods 0.000 description 2
- 238000005119 centrifugation Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 229910052573 porcelain Inorganic materials 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 229910008434 Si—Bi Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 235000008429 bread Nutrition 0.000 description 1
- 235000013339 cereals Nutrition 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
- C04B41/5022—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials with vitreous materials
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The present invention relates to a kind of encapsulating method of chip components and parts and the packaging apparatus of chip components and parts.A kind of encapsulating method of chip components and parts, chip components and parts include side and two end faces positioned at side two ends, and the encapsulating method of chip components and parts comprises the following steps：One of end face of chip components and parts is fixed on into support plate makes chip components and parts upright；By the surface impregnation glass paste for the chip components and parts being fixed on support plate with side and another end face surface formation glass paste bed of material；Curing process is carried out to the glass paste bed of material；And be sintered.The encapsulating method of above-mentioned chip components and parts and the packaging apparatus of chip components and parts, by the way of dipping, remaining glass paste be may be reused after dipping, and the utilization rate of glass paste is greatly improved；And the encapsulating method of above-mentioned chip components and parts can be encapsulated to multiple chip components and parts simultaneously, and multiple sides of chip components and parts can be encapsulated simultaneously, production efficiency is significantly improved.
Description
Technical field
The present invention relates to the encapsulating method and chip of electronic component preparing technical field, more particularly to chip components and parts
The packaging apparatus of component.
Background technology
Chip components and parts have characteristic of semiconductor, and its surface resistivity is relatively low, and Direct Electroplating easily causes nickel, tin are climbed to be plated to
Porcelain body surface and there is galvano-cautery in electroplating process porcelain body and have impact on product stability.Therefore, need chip list before plating
Bread seals the glass material of floor height insulation to improve product surface resistance.Existing chip components and parts encapsulating process mainly has spraying
Technique and silk-screen printing technique.
Spraying typically uses aerial spraying, i.e., glass paste is atomized into tiny droplet using pressure-air and sprayed to
Element surface, the artistic face spraying effect is good, but is due to pressure-air atomization, and environmental pollution is larger, while coating
Utilization rate it is relatively low, on electronic component spraying using rate less than 10%, cause greatly waste.Silk-screen printing technique flow
Generally comprise：Screening → silk-screen → change face screening → silk-screen → sintering → draw bar → row's bar → silk-screen → change face row bar → silk-screen →
Draw grain.Product need encapsulating four faces and can only print every time one side, it is therefore desirable to repeatedly screening silk-screen, work flow length and it is numerous
Trivial, production efficiency is relatively low.
The content of the invention
Based on this, it is necessary to low and low production efficiency ask for current chip components and parts encapsulating method slurry utilization rate
There is provided a kind of encapsulating method of chip components and parts and the packaging apparatus of chip components and parts for topic.
A kind of encapsulating method of chip components and parts, the chip components and parts include side and two positioned at the side two ends
Individual end face, the encapsulating method of the chip components and parts comprises the following steps：
One of end face of the chip components and parts is fixed on into support plate makes the chip components and parts upright；
By the surface impregnation glass paste for the chip components and parts being fixed on the support plate with the side and separately
One end face surface formation glass paste bed of material；
Curing process is carried out to the glass paste bed of material of the chip components and parts；And
The chip components and parts are sintered.
In wherein one embodiment, the glass paste according to the mass fraction, including：10 parts of glass dust, 17 parts
~25 parts of solvent, 2 parts~5 parts of resin and 0.5 part~2 parts of curing agent.
In wherein one embodiment, the solvent is in propylene glycol methyl ether acetate, ethanol and butyl carbitol
At least one；
And/or, the resin is selected from least one of bisphenol A type epoxy resin and PVB resin；
And/or, the curing agent is amine curing agent.
In wherein one embodiment, the end face is fixed on into support plate using double faced adhesive tape makes the chip components and parts straight
It is vertical.
It is described one of end face of the chip components and parts is fixed on support plate to make institute in wherein one embodiment
The upright step of chip components and parts is stated to specifically include：
Double faced adhesive tape is adhered on the support plate；
Set on the double faced adhesive tape and through hole is opened up on guide plate, the guide plate, the through hole is used to make the chip member device
Part uprightly passes through；
Chip components and parts are placed on the guide plate, and shaking the guide plate and carrier stands on the chip components and parts
In the through hole；And
The chip components and parts are adhered to the guide plate is removed after the support plate.
In wherein one embodiment, the glass paste bed of material to the chip components and parts carries out the step of curing process
Also include step before rapid：The glass paste buildup on the chip components and parts surface is removed by centrifugal treating.
In wherein one embodiment, the temperature of the curing process is 140 DEG C~160 DEG C；The curing process
Time is 40min~60min.
In wherein one embodiment, the temperature of the sintering processes is 620 DEG C~750 DEG C；The sintering processes
Time is 10min~20min.
A kind of packaging apparatus of chip components and parts, for being encapsulated to chip components and parts, the chip components and parts include
Side and two end faces positioned at the side two ends, the packaging apparatus of the chip components and parts include：
Li Pian mechanisms, the Li Pian mechanisms include support plate, and the Li Pian mechanisms are used for the chip components and parts wherein
One end face, which is fixed on the support plate, makes the chip components and parts upright；
Soak sealing mechanism, for the chip components and parts that will be fixed on the support plate surface impregnation glass paste with
The side and another end face surface formation glass paste bed of material；
Curing mechanism, curing process is carried out for the glass paste bed of material to the chip components and parts；
Mechanism is sintered, for being sintered to the chip components and parts.
In wherein one embodiment, the Li Pian mechanisms include support plate, guide plate and can be attached on the support plate
Offered on double faced adhesive tape, the guide plate for the upright through hole passed through of the chip components and parts, the guide plate can be with the support plate
Cooperation makes the chip components and parts upright；
And/or, the leaching sealing mechanism includes leaching seal apparatus and the feeding device being connected with the leaching seal apparatus, the feed
Device is used for the implantation glass slurry into the leaching seal apparatus, and the leaching seal apparatus is used to house the glass paste and impregnates institute
State the surface of chip components and parts.
The encapsulating method of above-mentioned chip components and parts and the packaging apparatus of chip components and parts, the end face of chip components and parts is fixed
On support plate, then it is impregnated into glass paste, chip components and parts is then subjected to curing process and sintering processes again, using dipping
Mode, remaining glass paste be may be reused after dipping, and the utilization rate of glass paste is greatly improved；And above-mentioned chip member
The encapsulating method of device can be encapsulated to multiple chip components and parts simultaneously, and can be while to multiple sides of chip components and parts
Face is encapsulated, and production efficiency is significantly improved.
Brief description of the drawings
Fig. 1 is the flow chart of the encapsulating method of the chip components and parts of an embodiment；
Fig. 2 makes the specific stream of the upright step of chip components and parts for the end face of chip components and parts is fixed on into support plate in Fig. 1
Cheng Tu；
Fig. 3 is the appearance for the chip components and parts that embodiment 1 (A), embodiment 2 (B) and embodiment 3 (C) encapsulating are obtained
Figure.
Embodiment
Encapsulating below in conjunction with embodiment and accompanying drawing to the encapsulating method and chip components and parts of chip components and parts
Equipment, which is done, further to be described in detail.
Refer to Fig. 1 and Fig. 2, the encapsulating method of the chip components and parts of an embodiment, chip components and parts include side and
Two end faces positioned at the side two ends, the encapsulating method of above-mentioned chip components and parts comprises the following steps：
S110, one of end face of the chip components and parts is fixed on support plate makes chip components and parts upright.
In wherein one embodiment, chip components and parts are cuboid, and chip components and parts include two end faces and four
Individual side, the encapsulating method of chip components and parts is used to encapsulate four sides of chip components and parts.
In wherein one embodiment, one of end face of chip components and parts is fixed on support plate.
In wherein one embodiment, the first sticking two-faced adhesive tape on support plate, a then end face of chip components and parts is glued
It is attached on double faced adhesive tape, makes chip components and parts upright.
In wherein one embodiment, one of end face of chip components and parts is fixed on into support plate makes chip components and parts
Upright step is specifically included：
S111, double faced adhesive tape is adhered on support plate.
The one side of double faced adhesive tape is pasted on support plate, and takes the glossy paper in one side of the double faced adhesive tape away from support plate off.
S112, guide plate is placed on double faced adhesive tape.
In wherein one embodiment, several through holes are offered on guide plate, through hole is used to make chip components and parts upright
Pass through.It is preferred that, the quantity of through hole is 3000~5000.Further, the size of the cross section of through hole is slightly larger than chip member
The size of the end face of device so that chip components and parts can be stood in through hole, and end face is fixed on support plate by double faced adhesive tape.
S113, chip components and parts are placed on guide plate, and shaking guide plate and support plate makes chip components and parts stand on through hole
In.
Chip components and parts enter in the through hole of guide plate in the presence of vibrations.In wherein one embodiment, it will place
The guide plate and support plate for having several chip components and parts are put into the sieve box placed on a shaker.Vibration on Start-up device so that chip
Component is stood in through hole.
S114, chip components and parts are adhered to guide plate is removed after support plate.
S120, by the surface impregnation glass paste for the chip components and parts being fixed on support plate with side and another end face
Surface forms the glass paste bed of material.
By the way that chip components and parts are fixed on support plate, can by multiple chip components and parts simultaneously adhere to support plate on so as to
Encapsulated while realizing multiple chip components and parts.
In wherein one embodiment, the support plate for being stained with chip components and parts, which is inverted, makes chip components and parts down, soaks
Stain is in glass paste.
In wherein one embodiment, glass paste according to the mass fraction, including：10 parts of glass dust, 17 parts~25
The solvent, 2 parts~5 parts of resin and 0.5 part~2 parts of curing agent of part.
In wherein one embodiment, glass dust is low sintering Si-Bi glass frits, it is preferred that glass dust
Particle diameter is≤2.5 μm；The softening temperature of glass dust is 620 DEG C~750 DEG C.
In wherein one embodiment, solvent in propylene glycol methyl ether acetate, ethanol and butyl carbitol extremely
Few one kind.The addition of ethanol and butyl carbitol is primarily to improve the rate of volatilization of solvent.When temperature is high, volatilization is added
The slower butyl carbitol of speed；When temperature is relatively low, the faster ethanol of rate of volatilization is added.
In wherein one embodiment, resin is selected from least one of bisphenol A type epoxy resin and PVB resin.
In wherein one embodiment, curing agent is amine curing agent.Amine curing agent has reaction slow.Hot setting
The characteristics of.
It is first that solvent and mixed with resin is uniform in wherein one embodiment, with ball mill grinding 4h~6h；Again to it
Middle addition glass dust, continues with ball mill grinding 18h~22h；Again by adding curing agent thereto after the strainer filtering of 200 mesh
Continue to be uniformly mixing to obtain glass paste.
S130, the glass paste buildup by centrifugal treating removing chip components and parts surface.
The glass paste buildup on chip components and parts surface is removed by way of centrifugal treating, can obtain thickness it is uniform,
The good encapsulated layer of outward appearance.In wherein one embodiment, centrifugal treating is carried out in centrifuge, and specifically, support plate is put
Put on the neck of centrifuge, start centrifuge, be dehydrated by centrifugal force remote by the blocked up glass paste in chip components and parts surface
Material is got rid of, so that encapsulated layer thickness is uniform.
In wherein one embodiment, the power of centrifugal treating is 0.75KW~1.5KW；The rotating speed of centrifugal treating is
75rad/min~200rad/min.
S140, the glass paste for removing an end face of the chip components and parts away from support plate.
In wherein one embodiment, using speckling with the dust-free paper or cotton of solvent to chip components and parts away from support plate
End face cleaned to remove the glass paste of an end face of the chip components and parts away from support plate, to the end face of chip components and parts
Expose.
S150, the glass paste bed of material to chip components and parts carry out curing process.
In wherein one embodiment, the temperature that chip components and parts are carried out with curing process is 140 DEG C~160 DEG C, Gu
The time for changing processing is 40min~60min.After curing process, the surface of chip components and parts is formed with certain attachment
Power, without departing from glassy layer.
S160, chip components and parts are sintered.
It is sintered after chip components and parts are removed from support plate.In wherein one embodiment, to chip member
The temperature that device is sintered is 620 DEG C~750 DEG C, and the time of sintering processes is 10min~20min.
The end face of chip components and parts is fixed on support plate by the encapsulating method of above-mentioned chip components and parts, then is impregnated into glass paste
In material, chip components and parts are then subjected to curing process and sintering processes, by the way of dipping, remaining glass after dipping again
Slurry be may be reused, and the utilization rate of glass paste is greatly improved；And the encapsulating method of above-mentioned chip components and parts can be simultaneously
Multiple chip components and parts are encapsulated, and multiple sides of chip components and parts can be encapsulated simultaneously, production efficiency is bright
It is aobvious to improve.
It should be noted that in other embodiments, step S130 and S140 can be omitted, as omission step S140
When, cutting process can be carried out to the chip components and parts after encapsulating, to remove an end face of the chip components and parts away from support plate
Glassy layer so that the end face of chip components and parts exposes.When omitting above-mentioned steps, next step is directly carried out.
The packaging apparatus of the chip components and parts of one embodiment, including Li Pian mechanisms, leaching sealing mechanism, curing mechanism and sintering
Mechanism.
In wherein one embodiment, Li Pian mechanisms include support plate, double faced adhesive tape and guide plate on support plate.Vertical piece machine
Structure makes chip components and parts upright for one of end face of chip components and parts to be fixed on into support plate.Several are offered on guide plate
Through hole, guide plate can coordinate with the support plate makes the chip components and parts upright.Specifically, several chip components and parts are placed
On guide plate, vibration guide plate makes chip components and parts enter in the presence of vibrations in the through hole of guide plate.
Sealing mechanism is soaked, the surface impregnation glass paste for the chip components and parts that will be fixed on support plate is with side and separately
One end face surface formation glass paste bed of material.In wherein one embodiment, leaching sealing mechanism includes leaching seal apparatus and sealed with leaching
The feeding device of device connection, feeding device is used for the implantation glass slurry into leaching seal apparatus, and leaching seal apparatus is used to house glass
Slurry and the surface for impregnating chip components and parts.
Curing mechanism, for carrying out curing process to chip components and parts.In wherein one embodiment, curing mechanism can
To be vacuum drying oven or convection oven.
Mechanism is sintered, for being sintered to chip components and parts.In wherein one embodiment, sintering mechanism can
To be sintering furnace or batch-type furnace.
The packaging apparatus of above-mentioned chip components and parts is simple in construction, it is easy to operate；And be fixed on the end face of chip components and parts
On support plate, then it is impregnated into glass paste, chip components and parts is then subjected to curing process and sintering processes again, using dipping
Remaining glass paste be may be reused after mode, dipping, and the utilization rate of glass paste is greatly improved；And above-mentioned chip member device
The encapsulating method of part can be encapsulated to multiple chip components and parts simultaneously, and can be while to multiple sides of chip components and parts
Encapsulated, production efficiency is significantly improved.
Here is the explanation of specific embodiment, and following examples are not contained except inevitably miscellaneous unless otherwise specified, then
The component pointed out is not known in other beyond matter.
Embodiment 1
The one side of double faced adhesive tape is pasted on support plate, and takes the glossy paper in one side of the double faced adhesive tape away from support plate off.Double
Guide plate is placed on the glue of face.3000 through holes are offered on guide plate, through hole is used to make chip components and parts uprightly pass through.Put on guide plate
Several chip components and parts are put, and shake guide plate to chip components and parts and are stood in through hole.Chip components and parts are adhered into load
Guide plate is removed after plate.
Prepare glass paste.Glass paste according to the mass fraction, including：10 parts of glass dust, 16 parts of propylene glycol monomethyl ether
Acetate, 1 part of absolute ethyl alcohol, 2 parts of PVB resin and 0.5 part of amine curing agent；It is first that solvent and mixed with resin is uniform,
Ball mill grinding 4h is used, then adds glass dust thereto, ball mill grinding 18h is used in continuation；Again by the strainer filtering of 200 mesh after
Curing agent is added thereto to continue to be uniformly mixing to obtain glass paste.
Chip components and parts are immersed in glass paste；The glass paste on chip components and parts is removed by centrifugal treating again
Buildup, the power of centrifugal treating is 0.75KW, and the rotating speed of centrifugation is 75rad/min；It is remote to chip components and parts using dust-free paper
The end face of support plate carries out cleaning and end face is exposed；Chip components and parts are placed in curing process 60min at 140 DEG C again；Will solidification
Chip components and parts after processing are removed from support plate；Chip components and parts are placed in sintering processes 20min at 620 DEG C again and obtain side
The chip components and parts encapsulated.
Embodiment 2
The one side of double faced adhesive tape is pasted on support plate, and takes the glossy paper in one side of the double faced adhesive tape away from support plate off.Double
Guide plate is placed on the glue of face.5000 through holes are offered on guide plate, through hole is used to make chip components and parts uprightly pass through.Put on guide plate
Several chip components and parts are put, and shake guide plate to chip components and parts and are stood in through hole.Chip components and parts are adhered into load
Guide plate is removed after plate.
Prepare glass paste.Glass paste according to the mass fraction, including：10 parts of glass dust, 23 parts of propylene glycol monomethyl ether
Acetate, 2 parts of butyl carbitol, 5 parts of bisphenol A type epoxy resin and 2 parts of amine curing agent；First solvent and resin are mixed
Close uniform, use ball mill grinding 6h, then add glass dust thereto, ball mill grinding 22h is used in continuation；Pass through the filter of 200 mesh again
Curing agent is added after net filtration thereto to continue to be uniformly mixing to obtain glass paste.
Chip components and parts are immersed in glass paste；The glass paste on chip components and parts is removed by centrifugal treating again
Buildup, the power of centrifugal treating is 1.5KW, and the rotating speed of centrifugation is 200rad/min；It is remote to chip components and parts using dust-free paper
The end face of support plate carries out cleaning and end face is exposed；Chip components and parts are placed in curing process 40min at 160 DEG C again；Will solidification
Chip components and parts after processing are removed from support plate；Chip components and parts are placed in sintering processes 10min at 750 DEG C again and obtain side
The chip components and parts encapsulated.
Embodiment 3
Prepare glass paste.Glass paste according to the mass fraction, including：10 parts of glass dust, 23 parts of propylene glycol monomethyl ether
Acetate, 2 parts of butyl carbitol, 5 parts of bisphenol A type epoxy resin and 2 parts of amine curing agent；First solvent and resin are mixed
Close uniform, use ball mill grinding 6h, then add glass dust thereto, ball mill grinding 22h is used in continuation；Pass through the filter of 200 mesh again
Curing agent is added after net filtration thereto to continue to be uniformly mixing to obtain glass paste.
Glass paste is sprayed to the side of chip components and parts by the way of spraying；Chip components and parts are placed in 160 again
Curing process 40min at DEG C；Chip components and parts after curing process are removed from support plate；Chip components and parts are placed in 750 again
Sintering processes 10min obtains the chip components and parts that side has been encapsulated at DEG C.
The appearance figure for the chip components and parts that embodiment 1 (A), embodiment 2 (B) and embodiment 3 (C) encapsulating are obtained is as schemed
Shown in 3, it can be seen that chip components and parts surface in embodiment 1 and embodiment 2 prepared by the encapsulating method of chip components and parts
Glassy layer is smooth and uniform, and the effect of the chip components and parts obtained by the way of spraying can be reached substantially.However, using spray
The mode of painting generally requires pressure-air atomization, and environmental pollution is larger, while the utilization rate of glass paste is relatively low, utilization rate
Less than 10%, the waste of glass paste is caused.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope of this specification record is all considered to be.
Embodiment described above only expresses the several embodiments of the present invention, and it describes more specific and detailed, but simultaneously
Can not therefore it be construed as limiting the scope of the patent.It should be pointed out that coming for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of encapsulating method of chip components and parts, the chip components and parts include side and two positioned at the side two ends
End face, it is characterised in that the encapsulating method of the chip components and parts comprises the following steps：
One of end face of the chip components and parts is fixed on into support plate makes the chip components and parts upright；
By the surface impregnation glass paste for the chip components and parts being fixed on the support plate with the side and another
The end face surface formation glass paste bed of material；
Curing process is carried out to the glass paste bed of material of the chip components and parts；And
The chip components and parts are sintered.
2. the encapsulating method of chip components and parts according to claim 1, it is characterised in that the glass paste presses mass parts
Number meter, including：10 parts of glass dust, 17 parts~25 parts of solvent, 2 parts~5 parts of resin and 0.5 part~2 parts of curing agent.
3. the encapsulating method of chip components and parts according to claim 2, it is characterised in that the solvent is selected from propane diols first
At least one of ether acetate, ethanol and butyl carbitol；
And/or, the resin is selected from least one of bisphenol A type epoxy resin and PVB resin；
And/or, the curing agent is amine curing agent.
4. the encapsulating method of chip components and parts according to claim 1, it is characterised in that use double faced adhesive tape by the end face
Being fixed on support plate makes the chip components and parts upright.
5. the encapsulating method of chip components and parts according to claim 1, it is characterised in that described by the chip components and parts
One of end face step for being fixed on support plate and making the chip components and parts upright specifically include：
Double faced adhesive tape is adhered on the support plate；
Set on the double faced adhesive tape and through hole is opened up on guide plate, the guide plate, the through hole is used to make the chip components and parts straight
It is vertical to pass through；
Place chip components and parts on the guide plate, and shake the guide plate and carrier to stand on the chip components and parts described
In through hole；And
The chip components and parts are adhered to the guide plate is removed after the support plate.
6. the encapsulating method of chip components and parts according to claim 1, it is characterised in that described to the chip components and parts
Also include step before the step of glass paste bed of material carries out curing process：The chip components and parts surface is removed by centrifugal treating
Glass paste buildup.
7. the encapsulating method of chip components and parts according to claim 1, it is characterised in that the temperature of the curing process is
140 DEG C~160 DEG C；The time of the curing process is 40min~60min.
8. the encapsulating method of chip components and parts according to claim 1, it is characterised in that the temperature of the sintering processes is
620 DEG C~750 DEG C；The time of the sintering processes is 10min~20min.
9. a kind of packaging apparatus of chip components and parts, for being encapsulated to chip components and parts, the chip components and parts include side
Face and two end faces positioned at the side two ends, it is characterised in that the packaging apparatus of the chip components and parts includes：
Li Pian mechanisms, the Li Pian mechanisms include support plate, and the Li Pian mechanisms are used for one of them by the chip components and parts
End face, which is fixed on the support plate, makes the chip components and parts upright；
Sealing mechanism is soaked, for the surface impregnation glass paste of the chip components and parts that will be fixed on the support plate with described
Side and another end face surface formation glass paste bed of material；
Curing mechanism, curing process is carried out for the glass paste bed of material to the chip components and parts；
Mechanism is sintered, for being sintered to the chip components and parts.
10. the packaging apparatus of chip components and parts according to claim 9, it is characterised in that the Li Pian mechanisms include carrying
Offer and uprightly pass through for the chip components and parts on plate, guide plate and the double faced adhesive tape that can be attached on the support plate, the guide plate
Through hole, the guide plate can with the support plate coordinate make the chip components and parts upright；
And/or, the leaching sealing mechanism includes leaching seal apparatus and the feeding device being connected with the leaching seal apparatus, the feeding device
For the implantation glass slurry into the leaching seal apparatus, the leaching seal apparatus is used to house the glass paste and impregnates described
The surface of formula component.
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| CN201710393591.7A CN107331624B (en) | 2017-05-27 | 2017-05-27 | Packaging method and packaging equipment for chip component |
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| CN201710393591.7A CN107331624B (en) | 2017-05-27 | 2017-05-27 | Packaging method and packaging equipment for chip component |
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| CN108735487A (en) * | 2018-04-27 | 2018-11-02 | 广东光驰电子有限公司 | A kind of method and support plate for chip electronic component production |
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| CN107331624B (en) | 2021-01-22 |
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