CN102820235A - Packaging device for coating glass on surface of chip component - Google Patents
Packaging device for coating glass on surface of chip component Download PDFInfo
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- CN102820235A CN102820235A CN2012102876213A CN201210287621A CN102820235A CN 102820235 A CN102820235 A CN 102820235A CN 2012102876213 A CN2012102876213 A CN 2012102876213A CN 201210287621 A CN201210287621 A CN 201210287621A CN 102820235 A CN102820235 A CN 102820235A
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Abstract
The invention belongs to the technical field of chip component products, in particular to packaging for coating glass on the surface of a chip component. The invention relates to a packaging device and method for coating glass on the surface of the chip component. The packaging device is simple in structure. A compact glass protective layer can be formed on the surface of the chip component through the packaging device so that the surface resistivity of the chip component is high without plating and climb plating; the mechanical strength of the chip component is greatly enhanced; the weldability and the welding resistance of the chip component are effectively improved; and the electrical performance of the chip component is stable. In addition, the moisture resistance, the reliability of high temperature aging resistance and the like, and the stability of the chip component are enhanced greatly.
Description
Patent application of the present invention is that number of patent application is 201110207500.9, and denomination of invention is chip component watch crystal method for packing and encapsulation spraying equipment thereof, and patent application day is dividing an application of on July 22nd, 2011.
Technical field
The invention belongs to the chip component product technical field.Be particularly related to a kind of sealed in unit at chip component surface spraying glass.
Background technology
Along with development of electronic technology, further multifunction of various electronic components and intellectuality.Simultaneously, the SMT technology requires the surface mountization of electronic devices and components day by day.The electronic component of chip type is because the design of no pin has incomparable superiority: efficient easy for installation is high, nothing lead-in wire-no stray inductance.
Various sensers (as: thermistor, the quick resistance of voltage or the like) the also chip trend along with element are making constant progress.
The chip component technical process is at present:
1. chip component porcelain powder preparing; 2. chip component moulding; 3. high temperature sintering; 4. upper end electrode; 5. resistivity measurement; 6. pack.
The chip senser element that prior art is made is owing to the semiconductive ceramic characteristic of self, and its resistivity is than the low several magnitude of other functional ceramic.In the above-mentioned technical process, the surface of chip component does not have the glass protecting layer, directly carries out upper end electrode, if there is not the protection of watch crystal encapsulated layer can cause following problem:
1. the inside chip surface of chip component senser is very easy to climb plating;
2. chip component senser porcelain body receives the lasting corrosion of acid electric liquid easily, can cause self mechanical strength of chip component seriously to reduce;
3. in order to reduce climbing plating and need shortening electroplating time with extent of corrosion and cause the minimizing of termination electrode electrodeposited coating thickness of senser porcelain body, thus the solderability of causing, soldering resistance reduction;
4. the electric property of chip senser element is owing to the erosion of electroplate liquid changes;
5. the reliability of chip senser element, stability are lower.
The unique channel that solves an above-mentioned technology difficult problem is to carry out glass encapsulating on the surface of chip component chip, promptly can address the above problem through before the chip component upper end electrode, increasing by one watch crystal packaging technology, and its concrete technological process is following:
1. chip component porcelain powder preparing; 2. chip component moulding; 3. high temperature sintering; 4. watch crystal encapsulation; 5. upper end electrode; 6. resistivity measurement; 7. pack.
In sum, develop a kind of can the end face ceramic body of the chip of chip component the reservation not by glass encapsulating, and that other surfaces can be by the chip component watch crystal packaging process of glass packaging is technological extremely urgent.
Summary of the invention
The objective of the invention is to overcome the deficiency of prior art; A kind of method for packing and equipment at chip component surface spraying glass is provided; Can form the fine and close glassivation of one deck on the surface of chip component through this method for packing; Make chip component chip surface resistivity high, the plating phenomenon is climbed in electroless plating; Strengthen self mechanical strength of chip component greatly; Effectively improve the solderability and the drought tolerance of chip component, the electric property of chip component is stable, and in addition, reliability, stability such as the moisture-resistance of chip component, high temperature ageing increase greatly.
In order to reach above-mentioned technical purpose, the present invention realizes by following technical scheme:
Chip component watch crystal method for packing according to the invention, its making step is:
⑴ prepare to be used to install the support plate of chip element chip;
⑵ be mounted to the chip component chip on the mount pad;
⑶ coat an end of chip component chip and intercept the protection slurry that glass combines with the ceramic body of chip when the sintering;
⑷ with the four sides spraying glass of chip component chip;
⑸ with the glassy layer oven dry of spraying;
⑹ take off the chip component chip;
⑺ sintered glass;
⑻ remove the protection slurry;
⑼ upper end electrode.
As the further improvement of above-mentioned technology, the support plate among the above-mentioned steps ⑴ comprises stacked successively support plate, stickiness offset plate and guide plate, and correspondence is provided with the installing hole that at least one is used to place the chip component chip on the said guide plate.
In the present invention, the protection slurry of the protection slurry of above-mentioned steps ⑶ for when sintering, stoping glass to combine with ceramic body.
Among the present invention, can adopt following two kinds of spraying methods that glass-coating is carried out on the surface of chip component:
First method is a four sides order glass-coating method, and this spraying method can be achieved through following two kinds of spraying equipments:
1, four sides, single shower nozzle chip surface order spraying equipment; This equipment comprises bracing frame, is installed on the sprocket chain strip transmission mechanism that is used to transmit support plate on bracing frame surface; Support frame as described above is provided with the spraying case corresponding to the top of sprocket chain strip transmission mechanism, and the inwall of spraying case is equipped with spray gun; Also be provided with the deep bead that is used to keep out the wind in the said spraying case.
2, four shower nozzles turn round continuous chip element surface glass-coating equipment; This equipment comprises tetragonal brace table; The corresponding conveyer belt that transmits support plate that is provided with on every limit of said quadrangle brace table; And all corresponding spraying case that spray gun is installed that is provided with in the top of each conveyer belt, the corner location correspondence of said quadrangle brace table is provided with 90 ° of rotating platforms of rotation support plate.
Second method is the rotary glass spraying process; What this method adopted is the rotary chip component equipment for spraying of single shower nozzle microscope carrier; This equipment comprises support platform, and said support platform is provided with 360 ° of rotation microscope carriers, and the top corresponding to 360 ° of rotation microscope carriers on the said support platform is provided with the spraying case; Spraying chamber interior wall top is provided with spray gun, and the sidewall of said spraying case also is equipped with extractor fan.
Compared with prior art, the invention has the beneficial effects as follows:
The present invention adopts the watch crystal packaging technology to form the fine and close glassivation of one deck on the chip component surface can reach following effect:
(1) chip chip surface insulation resistivity is high, and the plating phenomenon is climbed in electroless plating;
(2) self mechanical strength of chip component obviously strengthens;
(3) do not climb plating and extent of corrosion phenomenon because the chip component chip has the surface, electroplating time can increase greatly, and the termination electrode electrodeposited coating can obtain satisfied thickness, thereby forms solderability, soldering resistance preferably;
(4) electric property of chip component can not change owing to the erosion of electroplate liquid, and its electric property is stable;
(5) reliability, stability such as the moisture-resistance of chip component, high temperature ageing increase greatly.
(6) method for packing at chip component surface spraying glass of the present invention not only can be used for the watch crystal encapsulation of chip sensitive components, can also be used for all chip components such as sheet capacitor, chip inductor, plate resistor, and is applied widely.
Description of drawings
Below in conjunction with accompanying drawing and specific embodiment the present invention is done detailed explanation:
Fig. 1 a, Fig. 1 b are centering guide of the present invention, stickiness offset plate and carrying board structure sketch map;
Fig. 2 a, Fig. 2 b are the combination sketch mapes of above-mentioned Fig. 1;
Fig. 3 a-Fig. 3 f is mounted to the structural representation on the support plate with the chip component chip;
Fig. 4 is a four sides order glass-coating method sketch map among the present invention;
Fig. 5 is a rotary glass spraying process sketch map;
Fig. 6 is a chip component chip structure sketch map behind the sintered glass;
Fig. 7 a, Fig. 7 b are the chip component structural representations that forms after the upper end electrode;
Fig. 8 a, Fig. 8 b are four sides, single shower nozzle chip surface order spraying equipment structural representations among the present invention;
Fig. 9 is that four shower nozzles turn round continuous chip element surface spraying equipment structural representation among the present invention;
Figure 10 is the rotary chip component equipment for spraying of a single shower nozzle microscope carrier structural representation among the present invention.
Embodiment
Chip component watch crystal method for packing according to the invention, its making step is:
⑴ prepare to be used to install the support plate of chip element chip 101: like Fig. 1 a, Fig. 1 b; Said support plate is support plate 20, stickiness offset plate 30 and a guide plate 40 bonding each other and that lamination is provided with, and correspondence is provided with the installing hole 401 that at least one is used to place chip component chip 101 on the said guide plate 40.
⑵ be mounted to chip component chip 101 in the installing hole 401 shown in Fig. 2 a, Fig. 2 b, and an end of chip component chip 101 is embedded in the installing hole 401, and chip component chip 101 1 ends cling on stickiness offset plate 30, and the other end is exposed to outside the installing hole 401;
⑶ coat an end of chip component chip 101 and intercept the protection slurry 50 that glass combines with ceramic body when the sintering: shown in Fig. 3 a to Fig. 3 f; To protect slurry 50 drawout on board face 70 through scraper 60; Be positioned on the protection slurry 50 after support plate 20, stickiness offset plate 30 and guide plate 40 and the 101 whole upsets of chip component chip then; Thereby will protect slurry 50 to be bonded in the end of chip component chip 101 equably; In addition, the side of said board face 70 also is provided with thickness sliver 71, can be used to adjust the thickness of protection slurry 50;
⑷ with the four sides spraying glass of chip component chip 101, and the glass paste of spraying is formed by following material mixing: glass dust, organic carrier (resin), organic solvent, dispersant, plasticizer etc.In the process of spraying, adopt the finer atomization spray gun with the glass paste uniform atomizing ejection that mixes, make glass paste evenly be coated in four surfaces of chip component.The present invention adopts following two kinds of spraying methods that glass-coating is carried out on the surface of chip component:
First method is four sides order glass-coating method, and is as shown in Figure 4, the vaporific glass-coating liquid of spray gun 80 ejections, and through the relative motion of support plate 20 and spray gun 80, A, B, C, the D four sides to chip component chip 101 sprays successively respectively.
Second method is the rotary glass spraying process, and is as shown in Figure 5, and the vaporific glass-coating liquid of spray gun 80 ejections drives support plate 20 rotations through rotary table 90, and A, B, C, the D four sides to chip component chip 101 sprays successively respectively.
⑸ sprayed coating oven dry: the support plate 20 after will spray places baking oven together with chip component chip 101, (50-100) ℃/(1-3) hour dries, and makes glass paste bone dry and close attachment after the spraying in the surface of chip component chip 101.
⑹ take off the chip component chip: the chip component chip 101 after will drying takes off, and evenly is arranged on the ceramic loading plate (alms bowl).
⑺ sintered glass: the chip component chip 101 that will apply glass paste adopts net belt type sintering furnace or box type furnace sintered glass, makes the side glass layer form fine and close glassivation, and the THICKNESS CONTROL of glass packaging layer is in the 10-30 micron thick.All formed the fine and close glassivation 9 (as shown in Figure 6) of one deck like this in four sides of chip component chip 101 except that two end faces.At this moment, because an end of chip component chip 101 has protection slurry 50, the protection slurry has been avoided the combination of glass and termination behind sintering.And the other end does not have glass paste to be sprayed on this end face owing to stick on the stickiness offset plate, and there is fine and close glass packaging layer 102 four sides that so just formed glass, and two end faces have no glass.
⑻ remove the protection slurry, the protection slurry 50 of chip component chip 101 ends removed exposed chip element chip 101 ends through chamfering or barreling operation;
⑼ upper end electrode 103 adopts chip component chip 101 method of dip-coating; Shown in Fig. 7 a, 7b; Evenly be coated with the slurry of upper end electrode 103 at the two ends of chip component chip 101 and adopt resistance furnace, thereby make chip component 10 silver electrode and the tight burning infiltration of semiconductive ceramic.
Below specify used chip component watch crystal spraying equipment among the present invention through three embodiment:
Embodiment one:
Shown in Fig. 8 a, Fig. 8 b; What present embodiment was explained is four sides, single shower nozzle chip surface order spraying equipment; This equipment comprises bracing frame 1a, is installed on the sprocket chain strip transmission mechanism 2a that is used to transmit support plate on bracing frame surface; Support frame as described above 1a is provided with spraying case 3a corresponding to the top of sprocket chain strip transmission mechanism, and the inwall of spraying case 3a is equipped with spray gun 80; Also be provided with the deep bead 4a that is used to keep out the wind in the said spraying case 3a, and also be provided with a glass observation door 6a who reserves suction opeing 5a and be convenient to observe.This equipment sprays A, B, C, four faces of D respectively through the relative motion through support plate 20 and spray gun 80.
Embodiment two:
As shown in Figure 9; Present embodiment is that four shower nozzles turn round continuous chip element surface glass-coating equipment; This equipment comprises quadrangle brace table 1b; The corresponding conveyer belt 2b that is provided with transmission support plate 20 on every limit of said quadrangle brace table 1b, and all corresponding spraying case 3b that spray gun 80 is installed that is provided with in the top of each conveyer belt 2b, the corner location correspondence of said quadrangle brace table 1b is provided with 90 ° of rotating platform 4b of rotation support plate.
Embodiment three:
Shown in figure 10; What present embodiment was explained is the rotary chip component equipment for spraying of single shower nozzle microscope carrier; This equipment comprises support platform 1c, and said support platform 1c is provided with 360 ° of rotation microscope carrier 2c, and the top that said support platform 1c goes up corresponding to 360 ° of rotation microscope carriers is provided with spraying case 3c; Spraying case 3c inwall top is provided with spray gun 80, and the sidewall of said spraying case also is equipped with extractor fan 4c.It drives the support plate rotation through 360 ° of rotation microscope carrier 2c, and four faces of A, B, C, D to chip component chip 101 spray respectively.
The present invention is not limited to above-mentioned execution mode; Every various changes of the present invention or modification are not broken away from the spirit and scope of the present invention; If these are changed and modification belongs within claim of the present invention and the equivalent technologies scope, then the present invention also means and comprises these changes and modification.
Claims (4)
1. sealed in unit at chip component surface spraying glass is characterized in that:
Comprise bracing frame, be installed on the surperficial sprocket chain strip transmission mechanism that is used to transmit support plate of bracing frame, support frame as described above is provided with the spraying case corresponding to the top of sprocket chain strip transmission mechanism, and the inwall of spraying case is equipped with spray gun.
2. the sealed in unit at chip component surface spraying glass according to claim 1 is characterized in that: also be provided with the deep bead that is used to keep out the wind in the said spraying case.
3. sealed in unit at chip component surface spraying glass; It is characterized in that: comprise tetragonal brace table; The corresponding conveyer belt that transmits support plate that is provided with on every limit of said quadrangle brace table; And all corresponding spraying case that spray gun is installed that is provided with in the top of each conveyer belt, the corner location correspondence of said quadrangle brace table is provided with 90 ° of rotating platforms of rotation support plate.
4. sealed in unit at chip component surface spraying glass; It is characterized in that: comprise support platform; Said support platform is provided with 360 ° of rotation microscope carriers; Top corresponding to 360 ° of rotation microscope carriers on the said support platform is provided with the spraying case, and spraying chamber interior wall top is provided with spray gun, and the sidewall of said spraying case also is equipped with extractor fan.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210287621.3A CN102820235B (en) | 2011-07-22 | 2011-07-22 | A kind of sealed in unit at chip component surface spraying glass |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210287621.3A CN102820235B (en) | 2011-07-22 | 2011-07-22 | A kind of sealed in unit at chip component surface spraying glass |
| CN 201110207500 CN102244017B (en) | 2011-07-22 | 2011-07-22 | Encapsulation method for encapsulating surface glass of flake component |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110207500 Division CN102244017B (en) | 2011-07-22 | 2011-07-22 | Encapsulation method for encapsulating surface glass of flake component |
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| Publication Number | Publication Date |
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| CN102820235A true CN102820235A (en) | 2012-12-12 |
| CN102820235B CN102820235B (en) | 2016-04-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210287621.3A Active CN102820235B (en) | 2011-07-22 | 2011-07-22 | A kind of sealed in unit at chip component surface spraying glass |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107331624A (en) * | 2017-05-27 | 2017-11-07 | 广东风华高新科技股份有限公司 | The encapsulating method of chip components and parts and the packaging apparatus of chip components and parts |
| TWI728548B (en) * | 2015-08-12 | 2021-05-21 | 德商Ｉｃｔ積體電路測試股份有限公司 | Charged particle beam device and method for inspecting and/or imaging a sample |
| CN113334172A (en) * | 2021-07-06 | 2021-09-03 | 无锡市苏良精密机械有限公司 | Numerical control double-sided grinding machine |
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| JP2009101256A (en) * | 2007-10-19 | 2009-05-14 | Nikken Sangyo Kk | Apparatus and method for coating long material |
| CN201801573U (en) * | 2010-07-13 | 2011-04-20 | 上海沪能防腐隔热工程技术有限公司 | Multi-dimensional automatic thermal metal spraying device |
| CN102039633A (en) * | 2009-10-15 | 2011-05-04 | 岳喜荣 | Multifunctional coating machine |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN2584293Y (en) * | 2002-09-23 | 2003-11-05 | 沈隆秋 | Rotary type pain applying equipment |
| JP2009101256A (en) * | 2007-10-19 | 2009-05-14 | Nikken Sangyo Kk | Apparatus and method for coating long material |
| CN102039633A (en) * | 2009-10-15 | 2011-05-04 | 岳喜荣 | Multifunctional coating machine |
| CN201801573U (en) * | 2010-07-13 | 2011-04-20 | 上海沪能防腐隔热工程技术有限公司 | Multi-dimensional automatic thermal metal spraying device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI728548B (en) * | 2015-08-12 | 2021-05-21 | 德商Ｉｃｔ積體電路測試股份有限公司 | Charged particle beam device and method for inspecting and/or imaging a sample |
| CN107331624A (en) * | 2017-05-27 | 2017-11-07 | 广东风华高新科技股份有限公司 | The encapsulating method of chip components and parts and the packaging apparatus of chip components and parts |
| CN113334172A (en) * | 2021-07-06 | 2021-09-03 | 无锡市苏良精密机械有限公司 | Numerical control double-sided grinding machine |
| CN113334172B (en) * | 2021-07-06 | 2022-02-22 | 无锡市苏良精密机械有限公司 | Numerical control double-sided grinding machine |
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| CN102820235B (en) | 2016-04-20 |
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Effective date of registration: 20230522 Address after: 526070 Floors 1-4, Building 1, No. 201 Shunjing Road, No. 1 Community, Guicheng Street, Dinghu District, Zhaoqing City, Guangdong Province Patentee after: EXSENSE ELECTRONICS TECHNOLOGY Co.,Ltd. Address before: Room 201, Block F, Lvjingxuan, No. 19 Lvjingyi Road, Chancheng District, Foshan City, Guangdong Province, 528000 Patentee before: Yu Wu |