CN105719985A - Detection system of BGA chip - Google Patents
Detection system of BGA chip Download PDFInfo
- Publication number
- CN105719985A CN105719985A CN201610250896.8A CN201610250896A CN105719985A CN 105719985 A CN105719985 A CN 105719985A CN 201610250896 A CN201610250896 A CN 201610250896A CN 105719985 A CN105719985 A CN 105719985A
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- China
- Prior art keywords
- plate
- bga chip
- location
- base plate
- cylinder
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
Abstract
The invention discloses a detection system of a BGA chip. The system comprises a rack, a BGA chip positioning mechanism, a pressing plate mechanism and a BGA chip detection mechanism. The rack comprises a base plate, four support posts and a cylinder mounting plate. The base plate is a square plate. The support posts are vertically fixed at four corners of the base plate. The cylinder mounting plate is fixed on the upper end faces of the four support posts; the pressing plate mechanism comprises a cylinder and a pressing plate. The cylinder is arranged vertically downward; the cylinder is fixed at the center of the lower end face of the cylinder mounting plate; and the BGA chip detection mechanism is arranged on the base plate of the rack. The system has the advantages that the BGA chip is placed and extracted at the outer side of the rack, rather than under the pressing plate mechanism, in this way, it is convenient for a worker to operate, and the security of the worker can be ensured.
Description
Technical field
The present invention relates to bga chip field, be especially a kind of bga chip detection system.
Background technology
Owing to chip (referred to as the bga chip) thickness of BGA package reduces more than 1/2 than common QFP, weight saving more than 3/4, electric heating property can be improved simultaneously, parasitic parameter is little, signal transmission delay is little, adapts to frequency extensive, assembles available coplanar soldering reliability high, therefore the high density such as CPU, mainboard south, north bridge chips, high-performance, the integrated circuit of many pins and the portable mobile termianl that volume and prescription is higher it are widely used in, such as panel computer, PAD etc..
Existing bga chip has welded its detection, it is to avoid occur that the phenomenon such as solder skip, rosin joint causes product bad.At present to bga chip welding detection mainly by artificial hand press operation, owing to bga chip is plane-welding, during artificial hand pressure detection, it is easy to the bga chip discontinuity of plane occurs, make and occur that part solder joint cannot contact with probe, affect Detection results and efficiency.
For solving above-mentioned technical problem, the application for a patent for invention that application number is CN201420837741.0 discloses a kind of bga chip manual detection device, including being provided with the depression bar being rotationally connected and being provided with projection on the bracket, described projection coordinates with the connecting rod being connected briquetting, the probe module being located at workbench is provided with multiple extensible probe being connected with detection module signal, and during detection, the projection on depression bar makes briquetting by the pad of bga chip and the probe close contact on probe module.During work, bga chip to be detected is put into the fixing groove of workbench, by rotating depression bar, briquetting is made to move down by the projection on depression bar, bga chip is compressed downwards, make each of which solder joint can contact with the probe on probe module and form signal with detection module to be connected, and then determine whether the welding of bga chip solder joint meets the requirements.Owing to being rigid material by briquetting, when briquetting makes solder joint contact with probe, uniform force everywhere on bga chip.
In prior art, for the problem that the operator of technique scheme existence are difficult to be positioned at by bga chip in fixing groove easily and quickly, probe module is designed as can move up and down lifts bga chip and is provided with telescopic positioner at fixing front of the slot, this improvement is with the obvious advantage, not only easy and simple to handle, and, bga chip accurate positioning.
After but above-mentioned two schemes all there is problems in that detection completes, extract the position of bga chip all under pressing plate, thus there is the hidden danger of operation safety.
Summary of the invention
It is an object of the invention to for prior art not enough, it is provided that a kind of extract bga chip all detection system outside the scope of pressing plate.
For reaching above-mentioned purpose, the invention provides the detection system of a kind of bga chip, including frame, bga chip detent mechanism, press plate mechanism and bga chip testing agency；Described frame includes base plate, four support columns and cylinder mounting plate；Described base plate is square plate；Described support column is vertically fixed on four angles of base plate；Described cylinder mounting plate is fixed on the upper surface of four support columns；Described press plate mechanism includes cylinder and pressing plate；Described cylinder is arranged straight down；Described cylinder is fixed on the center, lower surface of cylinder mounting plate；The piston rod of described cylinder is fixed with pressing plate；Described bga chip detent mechanism includes location-plate, bracing frame and positioning cylinder；Described base plate upper surface offers longitudinal location board slot；Described location-plate is plugged in the location board slot of described base plate；Described base plate rear end face offers chute；Described positioning cylinder is vertically fixed in described base plate；The piston rod initial position of described positioning cylinder is positioned at the front face place of chute；Support frame as described above is the angle steel of a pair level of relative setting；Support frame as described above is fixed on the front end face of described base plate；Described location-plate is plugged on support frame as described above；The latter half of lower surface of described location-plate forms vertical push pedal；Described push pedal is fixed on the piston rod of described positioning cylinder；Described location-plate is the cuboid that one end offers hole, location；Described bga chip testing agency includes resetting-mechanism and probe；Described resetting-mechanism includes square box and some stage clips；Described base plate centre offers bga chip detection square hole；Described bga chip detection square hole surrounding offers a square box groove；Described probe is fixed on the bottom surface of described bga chip detection square hole；Described square box is placed in the square box groove of described base plate；Some stage clips it are evenly arranged with between described square box and square box groove bottom.
Preferred as technique scheme, the hole, location of described location-plate is identical with the bga chip of described base plate detection square hole size, and the hole, location of described location-plate is corresponding to bga chip size.
Preferred as technique scheme, the described location-plate left and right sides forms guide rail, and described guide rail is plugged in the corresponding guide groove of described base plate.
Preferred as technique scheme, described pressing plate is cuboid and has excised four angles, is fixed with pair of guide rods between described cylinder mounting plate and base plate, and described guide rod is through pressing plate.
Preferred as technique scheme, described square box extreme higher position under the action of the spring is that square box upper surface is coplanar with the bottom surface of the location board slot of base plate.
The beneficial effects of the present invention is: the placement of bga chip and extraction, all outside frame, under non-press plate mechanism, so not only facilitate operated by personnel, and can ensure that the safety of staff.
Accompanying drawing explanation
Fig. 1 be the present invention face structural representation；
Fig. 2 is the side-looking structural representation of the present invention；
Fig. 3 is the A-A cross-sectional view of the initial position of Fig. 1 of the present invention；
Fig. 4 is the A-A cross-sectional view of the detection position of Fig. 1 of the present invention；
Fig. 5 is the B-B cross-sectional view of Fig. 2 of the present invention；
Fig. 6 be the present invention Fig. 5 in the structure for amplifying schematic diagram of C；
Fig. 7 is the cross-sectional view of the BGA device support of the present invention；
Fig. 8 is the plan structure schematic diagram of the pressing plate 22 of the present invention；
In figure, 10, frame；11, base；110, chute；12, support column；13, cylinder mounting plate；20, press plate mechanism；21, cylinder；22, pressing plate；23, guide rod；30, bga chip testing agency；31, bracing frame；32, location-plate；321, hole, location；322, guide rail；33, bga chip；34, push pedal；35, positioning cylinder；40, bga chip testing agency；41, square box；42, spring；43, probe.
Detailed description of the invention
As shown in Fig. 1～Fig. 6, the detection system of a kind of bga chip, including frame 10, bga chip detent mechanism 30, press plate mechanism 20 and bga chip testing agency 40；It is characterized in that: described frame 10 includes 11, four support columns 12 of base plate and cylinder mounting plate 13；Described base plate 11 is square plate；Described support column 12 is vertically fixed on four angles of base plate 11；Described cylinder mounting plate 13 is fixed on the upper surface of four support columns 12；Described press plate mechanism 20 includes cylinder 21 and pressing plate 22；Described cylinder 21 is arranged straight down；Described cylinder 21 is fixed on the center, lower surface of cylinder mounting plate 13；The piston rod of described cylinder 21 is fixed with pressing plate 22；Described bga chip detent mechanism 30 includes location-plate 32, bracing frame 31 and positioning cylinder 35；Described base plate 11 upper surface offers longitudinal location board slot；Described location-plate 32 is plugged in the location board slot of described base plate 11；Described base plate 11 rear end face offers chute 110；Described positioning cylinder 35 is vertically fixed in described base plate 11；The piston rod initial position of described positioning cylinder 35 is positioned at the front face place of chute 110；Support frame as described above 31 is the angle steel of a pair level of relative setting；Support frame as described above 31 is fixed on the front end face of described base plate 11；Described location-plate 32 is plugged on support frame as described above 31；The described latter half of lower surface of location-plate 32 forms vertical push pedal 34；Described push pedal 34 is fixed on the piston rod of described positioning cylinder 35；Described location-plate 32 offers the cuboid in hole 321, location for one end；Described bga chip testing agency 40 includes resetting-mechanism and probe 43；Described resetting-mechanism includes square box 41 and some stage clips 42；Described base plate 11 centre offers bga chip detection square hole；Described bga chip detection square hole surrounding offers a square box groove；Described probe 43 is fixed on the bottom surface of described bga chip detection square hole；Described square box 41 is placed in the square box groove of described base plate 11；Some stage clips 42 it are evenly arranged with between described square box 41 and square box groove bottom.
As shown in Figure 3, Figure 4, it is identical that square hole size is detected with the bga chip of described base plate 11 in the hole 321, location of described location-plate 32, and the hole, location of described location-plate 32 is corresponding to bga chip 33 size.
As shown in Figure 8, described location-plate 32 left and right sides forms guide rail 322, and described guide rail 322 is plugged in the described corresponding guide groove of base plate 11.
As shown in Figure 5, Figure 7, described pressing plate 22 for cuboid and has excised four angles, is fixed with pair of guide rods 23 between described cylinder mounting plate 13 and base plate 11, described guide rod 23 traverse pressing plate 22.
As shown in Figure 6, the described square box 41 extreme higher position under spring 42 acts on is that square box 41 upper surface is coplanar with the bottom surface of the location board slot of base plate 11.
During concrete operations, the workflow of the detection system of bga chip of the present invention is as follows:
The first step, staff is placed on bga chip 33 in the hole, location 321 of location-plate 32, and bga chip 33 is support by bracing frame 31；
Second step, starting positioning cylinder 35, positioning cylinder 35 drives location-plate 32 to move by push pedal 34, and positioning cylinder 35 moves to maximum stroke, the hole 321, location of location-plate 32 is placed exactly on the bga chip detection square hole of base plate 11, and bga chip 33 is supported by square box 41；
3rd step, starts cylinder 21, and cylinder 21 band dynamic pressure plate 22 moves downward, and pressing plate 22 press against bga chip 33 and moves downward and contact with probe 43, and forms signal with detection module and is connected, and then determines that the welding of bga chip solder joint is no enough and meet the requirements；
4th step, it is again started up cylinder 21, cylinder 21 band dynamic pressure plate 22 is made to move upward, existence due to spring 42, can, in bga chip 33 fight back to the hole, location 321 of location-plate 32, then starting positioning cylinder 35, make cylinder 35 drive location-plate 32 to return to initial position, staff take out from the hole, location 321 of location-plate 32 bga chip 33 carry out putting in order (detection OK's, carry out next process；Detection NG's, carry out repair welding or scrap recycling).
Above content is only the better embodiment of the present invention, for those of ordinary skill in the art, according to the thought of the present invention, all will change in specific embodiments and applications, and this specification content should not be construed as limitation of the present invention.
Claims (5)
1. a detection system for bga chip, including frame (10), bga chip (33) detent mechanism (30), press plate mechanism (20) and bga chip testing agency (40)；It is characterized in that: described frame (10) includes base plate (11), four support columns (12) and cylinder mounting plate (13)；Described base plate (11) is square plate；Described support column (12) is vertically fixed on four angles of base plate (11)；Described cylinder mounting plate (13) is fixed on the upper surface of four support columns (12)；Described press plate mechanism (20) includes cylinder (21) and pressing plate (22)；Described cylinder (21) is arranged straight down；Described cylinder (21) is fixed on the center, lower surface of cylinder mounting plate (13)；The piston rod of described cylinder (21) is fixed with pressing plate (22)；Described bga chip detent mechanism (30) includes location-plate (32), bracing frame (31) and positioning cylinder (35)；Described base plate (11) upper surface offers longitudinal location board slot；Described location-plate (32) is plugged in the location board slot of described base plate (11)；Described base plate (11) rear end face offers chute (110)；Described positioning cylinder (35) is vertically fixed in described base plate (11)；The piston rod initial position of described positioning cylinder (35) is positioned at the front face place of chute (110)；Support frame as described above (31) is the angle steel of a pair level of relative setting；Support frame as described above (31) is fixed on the front end face of described base plate (11)；Described location-plate (32) is plugged on support frame as described above (31)；Described location-plate (32) latter half of lower surface forms vertical push pedal (34)；Described push pedal (34) is fixed on the piston rod of described positioning cylinder (35)；Described location-plate (32) offers the cuboid of hole, location (321) for one end；Described bga chip testing agency (40) includes resetting-mechanism and probe (43)；Described resetting-mechanism includes square box (41) and some stage clips (42)；Described base plate (11) centre offers bga chip detection square hole；Described bga chip detection square hole surrounding offers a square box groove；Described probe (43) is fixed on the bottom surface of described bga chip detection square hole；Described square box (41) is placed in the square box groove of described base plate (11)；Some stage clips (42) it are evenly arranged with between described square box (41) and square box groove bottom.
2. the detection system of a kind of bga chip according to claim 1, it is characterized in that: it is identical that square hole size is detected with the bga chip of described base plate (11) in the hole, location (321) of described location-plate (32), and the hole, location of described location-plate (32) is corresponding to bga chip (33) size.
3. the detection system of a kind of bga chip according to claim 1, it is characterized in that: described location-plate (32) left and right sides forms guide rail (322), described guide rail (322) is plugged in the corresponding guide groove of described base plate (11).
4. the detection system of a kind of bga chip according to claim 1, it is characterized in that: described pressing plate (22) is for cuboid and has excised four angles, pair of guide rods (23) it is fixed with, described guide rod (23) traverse pressing plate (22) between described cylinder mounting plate (13) and base plate (11).
5. the detection system of a kind of bga chip according to claim 1, it is characterised in that: the described square box (41) extreme higher position under spring (42) acts on is that square box (41) upper surface is coplanar with the bottom surface of the location board slot of base plate (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610250896.8A CN105719985B (en) | 2016-04-20 | 2016-04-20 | A kind of detecting system of bga chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610250896.8A CN105719985B (en) | 2016-04-20 | 2016-04-20 | A kind of detecting system of bga chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105719985A true CN105719985A (en) | 2016-06-29 |
| CN105719985B CN105719985B (en) | 2018-06-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610250896.8A Active CN105719985B (en) | 2016-04-20 | 2016-04-20 | A kind of detecting system of bga chip |
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| Country | Link |
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| CN (1) | CN105719985B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110907805A (en) * | 2019-12-11 | 2020-03-24 | 杭州易正科技有限公司 | Integrated circuit packaging testing device of portable categorised ejection of compact |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203519778U (en) * | 2013-09-10 | 2014-04-02 | 嘉兴景焱智能装备技术有限公司 | Chip finished product testing machine |
| CN204289401U (en) * | 2014-12-16 | 2015-04-22 | 深圳市慧为智能科技有限公司 | A kind of bga chip manual detection device |
| CN105334444A (en) * | 2015-11-14 | 2016-02-17 | 苏州光韵达光电科技有限公司 | Detection system of BGA chip |
-
2016
- 2016-04-20 CN CN201610250896.8A patent/CN105719985B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203519778U (en) * | 2013-09-10 | 2014-04-02 | 嘉兴景焱智能装备技术有限公司 | Chip finished product testing machine |
| CN204289401U (en) * | 2014-12-16 | 2015-04-22 | 深圳市慧为智能科技有限公司 | A kind of bga chip manual detection device |
| CN105334444A (en) * | 2015-11-14 | 2016-02-17 | 苏州光韵达光电科技有限公司 | Detection system of BGA chip |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110907805A (en) * | 2019-12-11 | 2020-03-24 | 杭州易正科技有限公司 | Integrated circuit packaging testing device of portable categorised ejection of compact |
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| Publication number | Publication date |
|---|---|
| CN105719985B (en) | 2018-06-26 |
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Effective date of registration: 20180523 Address after: 518000 2 building, B building, Xing Hui science and Technology Industrial Park, Hua Long West Road, Longhua New District, Shenzhen, Guangdong. Applicant after: Shenzhen Yatai Technology Co., Ltd. Address before: 313000 Wuxing District, Huzhou City, Zhejiang Applicant before: HUZHOU GUOXIN MATERIALS CO., LTD. |
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