CN205723457U - A detection system for BGA chips - Google Patents

Abstract

The utility model discloses a BGA chip detection system, which comprises a frame, a BGA chip positioning mechanism, a pressing plate mechanism and a BGA chip detection mechanism; the rack comprises a bottom plate, four support columns and an air cylinder mounting plate; the bottom plate is a square plate; the supporting columns are vertically fixed on four corners of the bottom plate; the cylinder mounting plate is fixed on the upper end surfaces of the four support columns; the pressing plate mechanism comprises an air cylinder and a pressing plate; the cylinder is arranged vertically downwards; the cylinder is fixed in the center of the lower end face of the cylinder mounting plate; the BGA chip detection mechanism is arranged on the bottom plate of the rack; utility model's advantage lies in: the BGA chip is placed and extracted outside the rack and below the non-pressing plate mechanism, so that the operation of workers is facilitated, and the safety of the workers can be guaranteed.

Description

A detection system for BGA chips

technical field

The utility model relates to the field of BGA chips, in particular to a BGA chip detection system.

Background technique

Because the thickness of BGA-packaged chips (referred to as BGA chips) is more than 1/2 less than that of ordinary QFP, the weight is reduced by more than 3/4, and at the same time, it can improve the electrothermal performance, the parasitic parameters are small, the signal transmission delay is small, and it can adapt to a wide range of frequencies and can be assembled. Coplanar welding features high reliability, so it is widely used in high-density, high-performance, multi-pin integrated circuits such as CPU, motherboard south and north bridge chips, and portable mobile terminals that require high volume and quality, such as tablet computers and PADs Wait.

Existing BGA chips are soldered and inspected to avoid defective products caused by missing soldering and false soldering. At present, the BGA chip soldering inspection is mainly through manual hand pressure operation. Since the BGA chip is flat soldered, when the manual hand pressure inspection is performed, the force on the flat BGA chip is likely to be uneven, so that some solder joints cannot be in contact with the probe. Affect the detection effect and efficiency.

In order to solve the above-mentioned technical problems, the utility model patent application with the application number CN201420837741.0 discloses a BGA chip manual detection device, which includes a pressing rod with a rotating connection and a protrusion on the bracket, and the protrusion Cooperate with the connecting rod connecting the pressure block, the probe module set on the workbench is equipped with a plurality of retractable probes connected with the detection module signal, the protrusion on the pressure rod makes the pressure block connect the welding point of the BGA chip with the detection module The probes on the probe module are in tight contact. When working, put the BGA chip to be tested into the fixed groove of the workbench, and by turning the pressing rod, the protrusion on the pressing rod will move the pressing block down, and press the BGA chip downward, so that each solder joint It can be in contact with the probes on the probe module and form a signal connection with the detection module, so as to determine whether the BGA chip soldering spot welding meets the requirements. Since the pressing block can be used as a rigid material, when the pressing block makes the solder joints contact the probes, the force on the BGA chip is uniform everywhere.

In the prior art, in view of the above-mentioned technical solution, it is difficult for the operator to locate the BGA chip in the fixing slot conveniently and quickly. The probe module is designed to move up and down to lift the BGA chip and install a movable Telescopic positioning device, this improvement has obvious advantages, not only easy to operate, but also accurate positioning of BGA chips.

However, the above two solutions all have the following problems: after the detection is completed, the position for extracting the BGA chip is under the pressing plate, so there is a hidden danger of operation safety.

Utility model content

The purpose of the utility model is to provide a detection system for extracting BGA chips outside the range of the pressing plate for the deficiencies of the prior art.

In order to achieve the above object, the utility model provides a detection system of a BGA chip, including a frame, a BGA chip positioning mechanism, a platen mechanism and a BGA chip detection mechanism; the frame includes a base plate, four support columns and a cylinder mounting plate The base plate is a square plate; the support column is vertically fixed on the four corners of the base plate; the cylinder mounting plate is fixed on the upper end faces of the four support columns; the pressing plate mechanism includes a cylinder and a pressing plate; The cylinder is arranged vertically downward; the cylinder is fixed at the center of the lower end face of the cylinder mounting plate; the piston rod of the cylinder is fixed with a pressing plate; the BGA chip positioning mechanism includes a positioning plate, a support frame and a positioning cylinder; the bottom plate The upper end surface is provided with a longitudinal positioning plate groove; the positioning plate is inserted into the positioning plate groove of the bottom plate; the rear end surface of the bottom plate is provided with a chute; the positioning cylinder is longitudinally fixed in the bottom plate; The initial position of the piston rod of the positioning cylinder is located at the front wall of the chute; the support frame is a pair of horizontally opposite angle steel; the support frame is fixed on the front end of the bottom plate; the positioning plate is inserted in the on the support frame; the lower end surface of the second half of the positioning plate is formed with a vertical push plate; the pushing plate is fixed on the piston rod of the positioning cylinder; the positioning plate is a cuboid with a positioning hole at one end; The BGA chip detection mechanism includes a reset mechanism and a probe; the reset mechanism includes a square frame and several pressure springs; the center of the bottom plate is provided with a BGA chip detection square hole; the BGA chip detection square hole is surrounded by a square frame groove; the probe is fixed on the bottom surface of the BGA chip detection square hole; the square frame is placed in the square frame groove of the bottom plate; a number of pressing holes are evenly arranged between the square frame and the bottom surface of the square frame groove. reed.

As a preference of the above technical solution, the size of the positioning hole of the positioning plate is the same as the BGA chip detection square hole of the base plate, and the positioning hole of the positioning plate corresponds to the size of the BGA chip.

As a preference of the above technical solution, guide rails are formed on the left and right sides of the positioning plate, and the guide rails are inserted into corresponding guide grooves of the bottom plate.

As a preference of the above technical solution, the pressure plate is a cuboid with four corners cut off, a pair of guide rods are fixed between the cylinder mounting plate and the bottom plate, and the guide rods pass through the pressure plate.

As a preference of the above technical solution, the highest position of the square frame under the action of the spring is that the upper end surface of the square frame is coplanar with the bottom surface of the positioning plate groove of the bottom plate.

The beneficial effect of the utility model is that: the BGA chips are placed and extracted outside the frame, not under the platen mechanism, which not only facilitates the operation of the staff, but also ensures the safety of the staff.

Description of drawings

Fig. 1 is the front structural schematic diagram of the utility model;

Fig. 2 is the side view structural representation of the utility model;

Fig. 3 is the A-A sectional structure schematic diagram of the initial position of Fig. 1 of the present utility model;

Fig. 4 is a schematic diagram of the A-A sectional structure of the detection position of Fig. 1 of the present invention;

Fig. 5 is the B-B sectional structure schematic diagram of Fig. 2 of the present utility model;

Fig. 6 is a schematic diagram of an enlarged structure of C in Fig. 5 of the present utility model;

Fig. 7 is the sectional structure schematic diagram of the BGA device support of the present invention;

Fig. 8 is a top view structural schematic diagram of the pressing plate 22 of the present invention;

In the figure, 10, frame; 11, base; 110, chute; 12, support column; 13, cylinder mounting plate; 20, pressure plate mechanism; 21, cylinder; 22, pressure plate; 23, guide rod; 30, BGA chip Detection mechanism; 31, support frame; 32, positioning plate; 321, positioning hole; 322, guide rail; 33, BGA chip; 34, push plate; 35, positioning cylinder; 40, BGA chip detection mechanism; 41, square frame; 42 , spring; 43, probe.

detailed description

As shown in Figures 1 to 6, a detection system for a BGA chip includes a frame 10, a BGA chip positioning mechanism 30, a platen mechanism 20 and a BGA chip detection mechanism 40; it is characterized in that: the frame 10 includes a base plate 11 , four support columns 12 and cylinder mounting plates 13; the base plate 11 is a square plate; the support columns 12 are vertically fixed on the four corners of the base plate 11; the cylinder mounting plates 13 are fixed on the four support columns 12 The upper end surface of the upper end surface; the platen mechanism 20 includes a cylinder 21 and a platen 22; the cylinder 21 is vertically arranged downward; the cylinder 21 is fixed on the center of the lower end surface of the cylinder mounting plate 13; the piston rod of the cylinder 21 A pressing plate 22 is fixed; the BGA chip positioning mechanism 30 includes a positioning plate 32, a support frame 31 and a positioning cylinder 35; the upper end of the base plate 11 is provided with a longitudinal positioning plate groove; the positioning plate 32 is inserted into the base plate 11 in the positioning plate groove; the rear end of the base plate 11 is provided with a chute 110; the positioning cylinder 35 is longitudinally fixed in the base plate 11; the initial position of the piston rod of the positioning cylinder 35 is located on the front wall of the chute 110 The support frame 31 is a pair of horizontally opposite angle steels; the support frame 31 is fixed on the front end surface of the bottom plate 11; the positioning plate 32 is inserted on the support frame 31; the positioning A vertical push plate 34 is formed on the lower end surface of the rear half of the plate 32; the push plate 34 is fixed on the piston rod of the positioning cylinder 35; the positioning plate 32 is a cuboid with a positioning hole 321 at one end; the BGA The chip detection mechanism 40 comprises a reset mechanism and a probe 43; the reset mechanism comprises a square frame 41 and some stage clips 42; the center of the base plate 11 is provided with a BGA chip detection square hole; the BGA chip detection square hole is surrounded by a A square frame groove; the probe 43 is fixed on the bottom surface of the BGA chip detection square hole; the square frame 41 is placed in the square frame groove of the base plate 11; the square frame 41 and the bottom surface of the square frame groove Several compression springs 42 are uniformly arranged therebetween.

As shown in FIGS. 3 and 4 , the positioning hole 321 of the positioning plate 32 has the same size as the BGA chip detection square hole of the base plate 11 , and the positioning hole of the positioning plate 32 corresponds to the size of the BGA chip 33 .

As shown in FIG. 8 , guide rails 322 are formed on the left and right sides of the positioning plate 32 , and the guide rails 322 are inserted into corresponding guide grooves of the bottom plate 11 .

As shown in FIG. 5 and FIG. 7 , the pressing plate 22 is a cuboid with four corners cut off, and a pair of guide rods 23 are fixed between the cylinder mounting plate 13 and the bottom plate 11 , and the guide rods 23 pass through the pressing plate 22 .

As shown in FIG. 6 , the highest position of the square frame 41 under the action of the spring 42 is that the upper end surface of the square frame 41 is coplanar with the bottom surface of the positioning plate groove of the bottom plate 11 .

During specific operations, the workflow of the detection system of the BGA chip described in the utility model is as follows:

In the first step, the staff places the BGA chip 33 in the positioning hole 321 of the positioning plate 32, and the BGA chip 33 is supported by the support frame 31;

In the second step, start the positioning cylinder 35, the positioning cylinder 35 drives the positioning plate 32 to move through the push plate 34, the positioning cylinder 35 moves to the maximum stroke, the positioning hole 321 of the positioning plate 32 is just positioned on the BGA chip detection square hole of the base plate 11, BGA chip 33 is supported by square frame 41;

The third step is to start the cylinder 21, the cylinder 21 drives the pressure plate 22 to move downward, the pressure plate 22 presses the BGA chip 33 and moves downward to contact with the probe 43, and forms a signal connection with the detection module, so as to determine whether the solder joint of the BGA chip is soldered enough meet the requirements;

The fourth step is to start the cylinder 21 again, so that the cylinder 21 drives the pressure plate 22 to move upwards. Due to the existence of the spring 42, the BGA chip 33 will be pushed back into the positioning hole 321 of the positioning plate 32, and then the positioning cylinder 35 will be activated to make the cylinder 35 Drive the positioning plate 32 back to the initial position, and the staff takes out the BGA chip 33 from the positioning hole 321 of the positioning plate 32 and resets it (if the detection is OK, proceed to the next process; if the detection is NG, perform repair welding or scrap recycling).

The above content is only the preferred implementation mode of the present utility model. For those of ordinary skill in the art, according to the idea of the present utility model, there will be changes in the specific implementation mode and application scope. The content of this specification should not be understood as Limitations on the Invention.

Claims (5)

1. a detection system of BGA chip, comprises frame (10), BGA chip (33) positioning mechanism (30), platen mechanism (20) and BGA chip detection mechanism (40); It is characterized in that: described frame (10) comprise base plate (11), four support columns (12) and cylinder mounting plate (13); Described base plate (11) is a square plate; Described support column (12) is vertically fixed on base plate (11) On the four corners; the cylinder mounting plate (13) is fixed on the upper end faces of the four supporting columns (12); the plate pressing mechanism (20) includes a cylinder (21) and a plate (22); the cylinder (21 ) is arranged vertically downward; the cylinder (21) is fixed on the lower end face center of the cylinder mounting plate (13); the piston rod of the cylinder (21) is fixed with a pressing plate (22); the BGA chip positioning mechanism ( 30) including a positioning plate (32), a support frame (31) and a positioning cylinder (35); the upper end surface of the base plate (11) is provided with a longitudinal positioning plate groove; the positioning plate (32) is inserted into the base plate (11) in the positioning plate groove; the base plate (11) rear end surface is provided with a chute (110); the positioning cylinder (35) is longitudinally fixed in the base plate (11); the positioning cylinder (35) The initial position of the piston rod is at the front wall of the chute (110); the support frame (31) is a pair of horizontally opposite angle steels; the support frame (31) is fixed on the front end surface of the base plate (11) above; the positioning plate (32) is inserted on the support frame (31); the lower end surface of the rear half of the positioning plate (32) is formed with a vertical push plate (34); the push plate (34) be fixed on the piston rod of the positioning cylinder (35); the positioning plate (32) is a cuboid with a positioning hole (321) at one end; the BGA chip detection mechanism (40) includes a reset mechanism and a probe (43 ); the reset mechanism includes a square frame (41) and some stage clips (42); the center of the base plate (11) is provided with a BGA chip detection square hole; the BGA chip detection square hole is provided with a square frame groove around the ; the probe (43) is fixed on the bottom surface of the BGA chip detection square hole; the square frame (41) is placed in the square frame groove of the base plate (11); the square frame (41) and Several pressure springs (42) are evenly arranged between the bottom surfaces of the square frame grooves. 2. the detection system of a kind of BGA chip according to claim 1 is characterized in that: the positioning hole (321) of described positioning plate (32) is identical with the BGA chip detection square hole size of described base plate (11), The positioning hole of the positioning plate (32) corresponds to the size of the BGA chip (33). 3. The detection system of a kind of BGA chip according to claim 1, is characterized in that: described positioning board (32) left and right sides are formed with guide rail (322), and described guide rail (322) is inserted in described base plate (11) In the corresponding guide groove. 4. The detection system of a kind of BGA chip according to claim 1, it is characterized in that: described pressing plate (22) is cuboid and cuts off four angles, and between described cylinder mounting plate (13) and base plate (11) A pair of guide rods (23) are fixed between them, and the guide rods (23) pass through the pressing plate (22). 5. The detection system of a kind of BGA chip according to claim 1, is characterized in that: the highest position of described square frame (41) under the action of spring (42) is square frame (41) upper end surface and bottom plate (11) ) The bottom surface of the positioning plate slot is coplanar.