CN205723457U - A kind of detecting system of bga chip - Google Patents
A kind of detecting system of bga chip Download PDFInfo
- Publication number
- CN205723457U CN205723457U CN201620339587.3U CN201620339587U CN205723457U CN 205723457 U CN205723457 U CN 205723457U CN 201620339587 U CN201620339587 U CN 201620339587U CN 205723457 U CN205723457 U CN 205723457U
- Authority
- CN
- China
- Prior art keywords
- plate
- bga chip
- base plate
- cylinder
- positioning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses the detecting system of a kind of bga chip, including frame, bga chip detent mechanism, press plate mechanism and bga chip testing agency；Described frame includes base plate, four support columns and cylinder mounting plate；Described base plate is square plate；Described support column is vertically fixed on four angles of base plate；Described cylinder mounting plate is fixed on the upper surface of four support columns；Described press plate mechanism includes cylinder and pressing plate；Described cylinder is arranged straight down；Described cylinder is fixed on the center, lower surface of cylinder mounting plate；Described bga chip testing agency is arranged on described framework soleplate；The advantage of utility model is: the placement of bga chip and extraction, all outside frame, under non-press plate mechanism, so not only facilitate operated by personnel, and can ensure that the safety of staff.
Description
Technical field
The utility model relates to bga chip field, is especially a kind of bga chip detecting system.
Background technology
Owing to chip (referred to as bga chip) thickness of BGA package reduces than common QFP
More than 1/2, weight saving more than 3/4, electric heating property can be improved simultaneously, parasitic parameter is little,
Signal transmission delay is little, adapts to frequency extensive, assembles and can use coplanar soldering reliability high,
Therefore it is widely used in the high density such as CPU, mainboard south, north bridge chips, high-performance, many pins
Integrated circuit and the portable mobile termianl higher to volume and quality requirement, such as flat board electricity
Brain, PAD etc..
The welding of existing bga chip completes to detect it, it is to avoid the phenomenon such as solder skip, rosin joint occur
Cause product bad.At present to bga chip welding detection mainly by artificial hand press operation,
Owing to bga chip is plane-welding, during the detection of artificial hand pressure, the BGA core of plane easily occurs
Piece discontinuity, makes and occurs that part solder joint cannot contact with probe, affect Detection results and
Efficiency.
For solving above-mentioned technical problem, the utility model of Application No. CN201420837741.0
Patent application discloses a kind of bga chip manual detection device, including be provided with on the bracket
Rotating the depression bar connecting and being provided with projection, described projection coordinates with the connecting rod being connected briquetting, is located at
The probe module of workbench is provided with multiple extensible probe being connected with detection module signal, detection
When depression bar on projection make briquetting by tight with the probe on probe module for the pad of bga chip
Contiguity is touched.During work, bga chip to be detected is put into workbench and fixes groove, by turning
Dynamic pressure bar, is made briquetting move down by the projection on depression bar, compresses downwards bga chip so that it is every
Individual solder joint can contact with the probe on probe module and form signal with detection module and be connected, and enters
And determine whether the welding of bga chip solder joint meets the requirements.Owing to being rigidity material by briquetting
Material, when briquetting makes solder joint contact with probe, uniform force everywhere on bga chip.
In prior art, the operating personnel existing for technique scheme are difficult to simple and fast
Bga chip is positioned at the problem in fixing groove by ground, and probe module is designed as moving up and down
Lift bga chip and at fixing front of the slot, telescopic positioner, this improvement be installed
With the obvious advantage, not only easy and simple to handle, and, bga chip accurate positioning.
But after above-mentioned two schemes all there is problems in that detection completes, extract BGA core
All under pressing plate, thus there is the hidden danger of operation safety in the position of piece.
Utility model content
The purpose of this utility model is not enough for prior art, provides one to extract bga chip
All detecting systems outside the scope of pressing plate.
For reaching above-mentioned purpose, the utility model provides the detecting system of a kind of bga chip,
Including frame, bga chip detent mechanism, press plate mechanism and bga chip testing agency；Described
Frame includes base plate, four support columns and cylinder mounting plate；Described base plate is square plate；Described
Support column is vertically fixed on four angles of base plate；Described cylinder mounting plate is fixed on four supports
On the upper surface of post；Described press plate mechanism includes cylinder and pressing plate；Described cylinder sets straight down
Put；Described cylinder is fixed on the center, lower surface of cylinder mounting plate；On the piston rod of described cylinder
It is fixed with pressing plate；Described bga chip detent mechanism includes location-plate, bracing frame and positioning cylinder；
Described base plate upper surface offers longitudinal positioning board slot；Described location-plate is plugged in described base plate
Positioning board slot in；Described base plate rear end face offers chute；Described positioning cylinder is longitudinally fixed
In described base plate；The piston rod initial position of described positioning cylinder is positioned at the front face of chute
Place；Support frame as described above is the angle steel of a pair level of relative setting；Support frame as described above is fixed on described
On the front end face of base plate；Described location-plate is plugged on support frame as described above；Described location-plate is later half
Subordinate's end face forms vertical push pedal；Described push pedal is fixed on the piston rod of described positioning cylinder
On；Described location-plate is the cuboid that one end offers positioning hole；Described bga chip detects machine
Structure includes resetting-mechanism and probe；Described resetting-mechanism includes square box and some stage clips；Described
Base plate centre offers bga chip detection square hole；Described bga chip detection square hole surrounding is opened
It is provided with a square box groove；Described probe is fixed on the bottom surface of described bga chip detection square hole
On；Described square box is placed in the square box groove of described base plate；Described square box and square box
It is evenly arranged with some stage clips between groove bottom.
Preferred as technique scheme, positioning hole and the described base plate of described location-plate
Bga chip detection square hole size is identical, the positioning hole of described location-plate and bga chip size phase
Should.
Preferred as technique scheme, the described location-plate left and right sides forms guide rail, institute
State guide rail to be plugged in the corresponding guide groove of described base plate.
Preferred as technique scheme, described pressing plate is cuboid and has excised four angles,
Being fixed with pair of guide rods between described cylinder mounting plate and base plate, described guide rod passes through pressing plate.
Preferred as technique scheme, described square box extreme higher position under the action of the spring
Coplanar with the bottom surface of the positioning board slot of base plate for square box upper surface.
The beneficial effects of the utility model are: the placement of bga chip and extraction are all outside frame
Side, under non-press plate mechanism, so not only facilitates operated by personnel, and can ensure that work
Make the safety of personnel.
Brief description
Fig. 1 is of the present utility model to face structural representation；
Fig. 2 is side-looking structural representation of the present utility model；
Fig. 3 is the A-A cross-sectional view of the initial position of Fig. 1 of the present utility model；
Fig. 4 is the A-A cross-sectional view of the detection position of Fig. 1 of the present utility model；
Fig. 5 is the B-B cross-sectional view of Fig. 2 of the present utility model；
Fig. 6 is the structure for amplifying schematic diagram of C in Fig. 5 of the present utility model；
Fig. 7 is the cross-sectional view of BGA device support of the present utility model；
Fig. 8 is the plan structure schematic diagram of pressing plate 22 of the present utility model；
In figure, the 10th, frame；11st, base；110th, chute；12nd, support column；13rd, gas
Cylinder installing plate；20th, press plate mechanism；21st, cylinder；22nd, pressing plate；23rd, guide rod；30、BGA
Chip detection mechanism；31st, bracing frame；32nd, location-plate；321st, hole is positioned；322nd, guide rail；
33rd, bga chip；34th, push pedal；35th, positioning cylinder；40th, bga chip testing agency；
41st, square box；42nd, spring；43rd, probe.
Detailed description of the invention
As shown in Fig. 1～Fig. 6, the detecting system of a kind of bga chip, including frame the 10th, BGA
Chip positioning mechanism the 30th, press plate mechanism 20 and bga chip testing agency 40；It is characterized in that:
Described frame 10 includes base plate the 11st, four support columns 12 and cylinder mounting plate 13；The described end
Plate 11 is square plate；Described support column 12 is vertically fixed on four angles of base plate 11；Institute
State cylinder mounting plate 13 to be fixed on the upper surface of four support columns 12；Described press plate mechanism
20 include cylinder 21 and pressing plate 22；Described cylinder 21 is arranged straight down；Described cylinder 21
It is fixed on the center, lower surface of cylinder mounting plate 13；It is fixed with on the piston rod of described cylinder 21
Pressing plate 22；Described bga chip detent mechanism 30 includes location-plate the 32nd, bracing frame 31 and determines
Position cylinder 35；Described base plate 11 upper surface offers longitudinal positioning board slot；Described location-plate
In the 32 positioning board slots being plugged in described base plate 11；Described base plate 11 rear end face offers cunning
Groove 110；Described positioning cylinder 35 is vertically fixed in described base plate 11；Described positioning cylinder
The piston rod initial position of 35 is positioned at the front face of chute 110；Support frame as described above 31 is one
The angle steel that level of relative is arranged；Support frame as described above 31 is fixed on the front end face of described base plate 11
On；Described location-plate 32 is plugged on support frame as described above 31；Described location-plate 32 is latter half of
Lower surface forms vertical push pedal 34；Described push pedal 34 is fixed on described positioning cylinder 35
Piston rod on；Described location-plate 32 offers the cuboid in positioning hole 321 for one end；Institute
State bga chip testing agency 40 and include resetting-mechanism and probe 43；Described resetting-mechanism includes
Square box 41 and some stage clips 42；Described base plate 11 centre offers bga chip detection
Square hole；Described bga chip detection square hole surrounding offers a square box groove；Described probe
On 43 bottom surfaces being fixed on described bga chip detection square hole；Described square box 41 is placed on institute
State in the square box groove of base plate 11；Uniformly set between described square box 41 and square box groove bottom
It is equipped with some stage clips 42.
As shown in Figure 3, Figure 4, the positioning hole 321 of described location-plate 32 and described base plate 11
Bga chip detection square hole size identical, the positioning hole of described location-plate 32 and bga chip
33 sizes are corresponding.
As shown in Figure 8, described location-plate 32 left and right sides forms guide rail 322, described leads
Rail 322 is plugged in the corresponding guide groove of described base plate 11.
As shown in Figure 5, Figure 7, described pressing plate 22 is cuboid and has excised four angles, institute
Stating and being fixed with pair of guide rods 23 between cylinder mounting plate 13 and base plate 11, described guide rod 23 is worn
Cross pressing plate 22.
As shown in Figure 6, extreme higher position under spring 42 effect for the described square box 41 is square
Frame 41 upper surface is coplanar with the bottom surface of the positioning board slot of base plate 11.
During concrete operations, the workflow of the detecting system of bga chip described in the utility model is such as
Under:
The first step, staff is placed on the positioning hole 321 of location-plate 32 bga chip 33
In, bga chip 33 is support by bracing frame 31；
Second step, starts positioning cylinder 35, and positioning cylinder 35 drives positioning by push pedal 34
Plate 32 moves, and positioning cylinder 35 moves to the stroke of maximum, the positioning hole 321 of location-plate 32
Being placed exactly on the bga chip detection square hole of base plate 11, bga chip 33 is by square box 41
Support；
3rd step, starts cylinder 21, and cylinder 21 carries dynamic pressure plate 22 to move downward, pressing plate 22
Press against bga chip 33 to move downward and contact with probe 43, and form signal even with detection module
Connect, and then determination bga chip solder joint welds, and foot is no to meet the requirements；
4th step, is again started up cylinder 21, makes cylinder 21 carry dynamic pressure plate 22 upwards to move,
Due to the existence of spring 42, bga chip 33 can be pushed to return to the positioning hole 321 of location-plate 32
In, then start positioning cylinder 35, make cylinder 35 drive location-plate 32 to return to initial position,
Staff takes out bga chip 33 and carries out putting in order (detection from the positioning hole 321 of location-plate 32
OK's, carry out next process；Detection NG's, carry out repair welding or scrap recycling).
Above content is only better embodiment of the present utility model, for the common skill of this area
Art personnel, according to thought of the present utility model, all can in specific embodiments and applications
Change part, and this specification content should not be construed as to restriction of the present utility model.
Claims (5)
1. a detecting system for bga chip, including frame (10), bga chip (33)
Detent mechanism (30), press plate mechanism (20) and bga chip testing agency (40)；Its feature
It is: described frame (10) includes base plate (11), four support columns (12) and cylinder peace
Dress plate (13)；Described base plate (11) is square plate；Described support column (12) is vertically fixed
On four angles of base plate (11)；Described cylinder mounting plate (13) is fixed on four support columns
(12) on upper surface；Described press plate mechanism (20) includes cylinder (21) and pressing plate (22)；
Described cylinder (21) is arranged straight down；Described cylinder (21) is fixed on cylinder mounting plate (13)
Center, lower surface；It is fixed with pressing plate (22) on the piston rod of described cylinder (21)；Described
Bga chip detent mechanism (30) includes location-plate (32), bracing frame (31) and positioning gas
Cylinder (35)；Described base plate (11) upper surface offers longitudinal positioning board slot；Described positioning
Plate (32) is plugged in the positioning board slot of described base plate (11)；Described base plate (11) rear end
Face offers chute (110)；Described positioning cylinder (35) is vertically fixed in described base plate (11)
In；The piston rod initial position of described positioning cylinder (35) is positioned at the antetheca of chute (110)
At face；Support frame as described above (31) is the angle steel of a pair level of relative setting；Support frame as described above (31)
It is fixed on the front end face of described base plate (11)；Described location-plate (32) is plugged in described
On support (31)；The latter half of lower surface of described location-plate (32) forms vertical push pedal (34)；
Described push pedal (34) is fixed on the piston rod of described positioning cylinder (35)；Described location-plate
(32) it is the cuboid that one end offers positioning hole (321)；Described bga chip detects machine
Structure (40) includes resetting-mechanism and probe (43)；Described resetting-mechanism includes square box (41)
With some stage clips (42)；Described base plate (11) centre offers bga chip detection square hole；
Described bga chip detection square hole surrounding offers a square box groove；Described probe (43) is solid
It is scheduled on the bottom surface of described bga chip detection square hole；Described square box (41) is placed on described
In the square box groove of base plate (11)；Between described square box (41) and square box groove bottom all
It even is provided with some stage clips (42).
2. the detecting system of a kind of bga chip according to claim 1, its feature exists
In: the positioning hole (321) of described location-plate (32) and the BGA core of described base plate (11)
Piece detection square hole size is identical, the positioning hole of described location-plate (32) and bga chip (33)
Size is corresponding.
3. the detecting system of a kind of bga chip according to claim 1, its feature exists
In: described location-plate (32) left and right sides forms guide rail (322), described guide rail (322)
It is plugged in the corresponding guide groove of described base plate (11).
4. the detecting system of a kind of bga chip according to claim 1, its feature exists
In: described pressing plate (22) is cuboid and has excised four angles, described cylinder mounting plate (13)
And it between base plate (11), is fixed with pair of guide rods (23), described guide rod (23) passes through pressing plate
(22)。
5. the detecting system of a kind of bga chip according to claim 1, its feature exists
In: extreme higher position under spring (42) effect for the described square box (41) is square box (41)
Upper surface is coplanar with the bottom surface of the positioning board slot of base plate (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620339587.3U CN205723457U (en) | 2016-04-20 | 2016-04-20 | A kind of detecting system of bga chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620339587.3U CN205723457U (en) | 2016-04-20 | 2016-04-20 | A kind of detecting system of bga chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205723457U true CN205723457U (en) | 2016-11-23 |
Family
ID=57294858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620339587.3U Expired - Fee Related CN205723457U (en) | 2016-04-20 | 2016-04-20 | A kind of detecting system of bga chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205723457U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106707346A (en) * | 2016-12-26 | 2017-05-24 | 安徽智森电子科技有限公司 | Cover plate shaping automatic screw thread measuring mechanism |
-
2016
- 2016-04-20 CN CN201620339587.3U patent/CN205723457U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106707346A (en) * | 2016-12-26 | 2017-05-24 | 安徽智森电子科技有限公司 | Cover plate shaping automatic screw thread measuring mechanism |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Tan Haiping Inventor before: Dong Fenfang |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170720 Address after: 528400, Zhongshan, Guangdong Province, Longjing South Road, No. 3, set up Yin pioneering creative technology building, room 902 Patentee after: Zhongshan Cheng Jun Technology Co., Ltd. Address before: 313000 Zhejiang Province, Huzhou District of Wuxing City, adjacent to mountain road Patentee before: HUZHOU GUOXIN MATERIALS CO., LTD. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161123 Termination date: 20200420 |