A kind of load transmission apparatus and method
Technical field
The invention belongs to chemical vapour deposition technique fields, are related to one kind and are applied in chemical vapor deposition processes, are used for
The load transmission device and its load transmission method of transmission product or half product.
Background technology
Chemical vapor deposition (Chemical vapor deposition, abbreviation CVD) is reactive material under gaseous condition
It chemically reacts, generates the solid matrix surface that solid matter is deposited on heating, and then the technology of solid material is made,
It is achieved by chemical vapor deposition unit.Wherein, to being carried out by solid material made from chemical vapour deposition technique
The device of transmission is a very important part in chemical vapor deposition unit, because it is to be related to product quality and production
An important factor for efficiency, and one of an important factor for reduction enterprise's production cost.
Below with metal organic chemical vapor deposition in the prior art (Metal Oganic Chemical Vapor
Deposition, MOCVD) it illustrates for device.Fig. 1 is referred to, MOCVD devices 10 in the prior art include:Transmission
It is carried described in MOCVD devices described in chamber 12 and the load/unload chamber 13 being arranged around the transmission cavity and reaction chamber 14.
Chamber is separated from each other or is directly connected to the reaction chamber.It is provided with manipulator in the transmission cavity 12, passes through the manipulator
Chip (not shown) is transported to the reaction chamber 14 by 11 from bearing cavity, wait for chip in the reaction chamber after processing is completed, then
By chip of the manipulator after taking out processing in the reaction chamber.The transmission cavity 12 is provided with load/unload chamber 13
Valve.The load/unload chamber 13 is the mediation device for contacting transmission cavity and external device.When work, when the chip transmits
To after in the load/unload chamber, the load/unload chamber is closed, and be evacuated, then open the load/unload
The chip is transferred to the transmission cavity by the valve between chamber and the transmission cavity, then, then by the manipulator, by institute
Chip is stated to be transferred in the reaction chamber.Load/unload chamber 13 and reaction chamber 14 in the prior art are arranged in the transmission cavity
Around, therefore, it is impossible to avoid be the transmission cavity floor space it is very big, and volume is also very big, in maintenance process
In, the time of exhaust is also especially long, influences production efficiency.
Load transmission device smaller therefore, it is necessary to design a kind of working size, compact-sized, chemical deposition is improved with this
The space availability ratio of equipment improves efficiency of transmission, reduces usage amount of the enterprise to soil, reduces enterprise's production cost.
Invention content
The object of the present invention is to provide a kind of working size is smaller, compact-sized load transmission device effectively solves existing
Have and is taken up a large area present in technology, the problem of maintenance time is long, low production efficiency.
To solve the above problems, the present invention provides a kind of load transmission devices, including:
Reaction chamber is provided with pedestal;
Substrate, to be placed on the pedestal in the reaction chamber, to be handled;
Manipulator is located in transmission cavity, and the manipulator is provided with support portion, is used for the substrate in the transmission cavity
It is transmitted between the reaction chamber;
Transmission cavity is provided with the first supporting region, the second supporting region in the transmission cavity and positioned at first supporting region, the
Interlayer region between two supporting regions, at least one reaction chamber are connected to or are divided with the transmission cavity by a transmission gate
Every;
First supporting region is provided with first support, to the substrate that carries that described pending or treated;It is described
First supporting region includes first placing axis, the first grip axes and the first transmission axle, and described first places axis, the first grip axes and the
One transmission axle three is parallel to each other, and first transmission axle or the first grip axes are more than or equal to the first placement between centers vertical range
The minimum range that the manipulator load substrate is stretched or shunk in the first supporting region, is less than or equal to the manipulator and loads substrate
In the maximum distance that the first supporting region is stretched or shunk;
Second supporting region is provided with second support, described to the base that carries that pending or treated to carry
Plate;Second supporting region includes the second placement axis, the second grip axes and the second transmission axle, and the second placement axis, second grab
Take axis and the second transmission axle three parallel to each other, second transmission axle or the second grip axes place between centers vertical range with second
More than or equal to the minimum range that manipulator load substrate is stretched or shunk in the second supporting region, it is less than or equal to the manipulator
The maximum distance that load substrate is stretched or shunk in the second supporting region.
Preferably, support portion described in the mechanical hand-motion enters institute along first grip axes or first transmission axle
State the first supporting region.
Preferably, support portion described in the mechanical hand-motion enters institute along second grip axes or second transmission axle
State the second supporting region.
Further, support portion described in the mechanical hand-motion places axis axial movement along described first and realizes the substrate
Contact or be detached from the first support.
Further, support portion described in the mechanical hand-motion places axis axial movement along described second and realizes the substrate
Contact or be detached from the second support.
Preferably, when reaction chamber and transmission cavity are under vacuum state, reaction chamber and transmission cavity are connected to.
Preferably, first supporting region is located at the upper end of the interlayer region, second supporting region be located at it is described in
The lower end in interbed area.
Preferably, second supporting region is located at the upper end of the interlayer region, first supporting region be located at it is described in
The lower end in interbed area.
Further, the manipulator rotation or the flexible drive support portion place axis, the first crawl described first
Axis, the first transmission axle, second place axis, the second grip axes, the second transmission between centers movement.
Preferably, the substrate shape can be circular plate type, square plate shape, ellipse shape, preferably circular plate type, the substrate
To carry an at least blade technolgy substrate.
Preferably, the substrate is provided with annular groove on the downside of excircle.
Preferably, the robot support portion is semicircular arc, and the end of the support portion is fastened in the ring of the substrate
In connected in star, the substrate is clamped.
Preferably, the first support is set on the side wall of the transmission cavity, and the shape of the first support includes " L "
Shape, inclined " I " shape, Y-shaped, " C " type, " D " at least one of type or semicircle, it is preferred that the first support
Shape be " C " type.
Preferably, the second support is set on the side wall of the transmission cavity, and the shape of the first support includes " L "
Shape, inclined " I " shape, Y-shaped, " C " type, " D " at least one of type or semicircle, it is preferred that the first support
Shape be " C " type.
Preferably, the first support or second support can also be the support element for being set to transmission cavity bottom.
Preferably, the first placement axis, the first grip axes and the axial direction of the first transmission axle vertically extend.
Preferably, the second placement axis, the second grip axes and the axial direction of the second transmission axle vertically extend.
Preferably, first grip axes and the first transmission overlapping of axles.
Preferably, first grip axes and the first transmission axle are misaligned.
Preferably, second grip axes and the second transmission overlapping of axles.
Preferably, second grip axes and the second transmission axle are misaligned.
Preferably, the first placement axis and second places overlapping of axles.
Preferably, the first placement axis and the second placement axis are misaligned.
Preferably, when the substrate is contacted with the first support, the central point of the substrate places axis along described first
Axial movement to first support.
Preferably, when the substrate is contacted with the second support, the central point of the substrate places axis along described second
Axial movement to second support.
Preferably, manipulator load substrate is not more than described in the minimum range that the first supporting region stretches or shrinks
The half of substrate minimum length.
The method for carrying out load transmission using above-mentioned load transmission device, includes the following steps:
Step 1:Interlayer region in the support pretreated substrate to transmission cavity of section load of the manipulator, by middle layer
Area is transmitted to the first supporting region or the second supporting region, and is positioned in first support or second support;
Step 2:Interlayer region in the support pretreated substrate to transmission cavity of section load of the manipulator, by middle layer
Area is transmitted to by transmission gate on the pedestal of reaction chamber;
Step 3:Closing transmission chamber;
Step 4:Substrate in reaction chamber is handled;
Step 5:The support section load of the manipulator treated substrate is transmitted to interlayer region by interlayer region
Two supporting regions or the first supporting region, and be positioned in second support or first support;
Step 6:The manipulator is moved to interlayer region by the second supporting region or the first supporting region, then by interlayer region
It moves up or moves down, and level goes to the first supporting region or the second supporting region;
Step 7:Pretreated substrate on one supporting region of support portion load regulation of the manipulator or the second supporting region
To interlayer region, reaction chamber is transmitted to by interlayer region;
Step 8:By manipulator will treated board transport to interlayer region, transmission cavity is transmitted out by interlayer region.
Preferably, the operating process of the step 1 further includes:The pretreated substrate of support section load of the manipulator is extremely
Behind interlayer region in transmission cavity, the central point of the substrate moves up along the axial direction of the first transmission axle or along the second transmission axle axial direction
It moves down, then rotates horizontally the position to the central point of substrate and the first grip axes or the second crawl overlapping of axles, then level moves to
First supporting region or the second supporting region, the robot support portion move down along the first placement axis in the first supporting region or are held second
Load area moves down along the second placement axis and the substrate is placed in first support or in second support.
Preferably, the operating process of the step 5 further includes:The support section load of the manipulator treated substrate is extremely
Behind interlayer region in transmission cavity, the central point of the substrate moved down along the axial direction of the second transmission axle or along the first transmission axle axis
To moving up, the position to the central point of substrate and the second grip axes or the first crawl overlapping of axles, then horizontal shifting are then rotated horizontally
To the second supporting region or the first supporting region, the robot support portion moves down or along the second placement axis first in the second supporting region
Supporting region moves down along the first placement axis and places the substrate on the secondary support bracket or in first support.
Preferably, the operating process of the step 7 further includes:The support portion of the manipulator is moved to the first supporting region
Or the underface of the second pretreated substrate on supporting region, the support portion place axis along first or second place the axial direction of axis
It moves up, you can the load pretreated substrate, the support portion load substrate are moved to institute in the horizontal direction
The position of the central point for the substrate stated and the first grip axes or the second crawl overlapping of axles, then the horizontal central point for going to substrate and the
The position of one transmission axle or the second transmission overlapping of axles, the support section load substrate of manipulator is axially moved down along the first transmission axle or edge
Second transmission axle axis moves upwardly into interlayer region, and the support portion of manipulator is moved horizontally the board transport extremely along interlayer region
Reaction chamber.
Compared with prior art, the present invention has advantageous effect below:The transmission cavity of the load transmission device of the present invention
It is inside provided with the first supporting region, the second supporting region and the interlayer region between the first supporting region and the second supporting region, it is described
The first supporting region be provided with the first support for placing the substrate, second supporting region, which is provided with, places the substrate
Space in transmission cavity has been carried out classifying rationally with this, has taken full advantage of the inner space of transmission cavity, reduce by second support
Equipment size has saved occupation area of equipment.Further, after equipment size is reduced, when reducing ventilation when plant maintenance
Between, it improves work efficiency.
First supporting region of the present invention is provided with the first placement axis, the first grip axes and the first transmission axle, and described second
Supporting region is provided with the second placement axis, the second grip axes and the second transmission axle, and axis, the first crawl are placed by described first
Axis, the first transmission axle, second place the transmission path of axis, the second grip axes with the second transmission axle to heretofore described substrate
It is limited, optimizes the process of board transport, reduced substrate and collide in transmission process and lead to damaged machine
Rate.
Further, heretofore described substrate is provided with annular groove on the downside of excircle.Heretofore described machinery
The support portion of hand can be designed as semicircular arc, and the end of the support portion is fastened in the annular groove, described in clamping
Substrate.Robot support portion in the present invention is reasonable in design, tight with the annular groove of setting on the downside of the substrate excircle
Close fit, when transmission, support portion described in the machinery hand-motion places axis along described first or second places the axial movement of axis
It realizes the substrate contact or is detached from the first support or second support.Substrate is easy to loading and unloading, easy to operate, saves dress
The time of substrate is unloaded, and ensure that the accuracy in loading process and safety.
Further, multiple reaction chambers can also be arranged in load transmission device of the invention, to realize batch of substrate
Quantification treatment further improves utilization rate of equipment and installations and the efficiency of load transmission, saves production cost.
Description of the drawings
Fig. 1 is the structural schematic diagram of chemical deposition device in the prior art;
Fig. 2 is the structural schematic diagram of the CVD device of the embodiment of the present invention one;
Fig. 3 is the signal that substrate or substrate are limited in the first supporting region or the movement of the second supporting region in the embodiment of the present invention one
Figure;
Fig. 4 is that substrate or substrate are limited in the first supporting region or the movement of the second supporting region in another embodiment of the invention
Schematic diagram;
Fig. 5 is the first supporting region, the second supporting region and the position view of interlayer region of the present invention;
Fig. 6 A are the vertical views for the process that manipulator captures the substrate handled well in the reactor chamber in embodiment one;
Fig. 6 B are the side views for the process that manipulator captures the substrate handled well in the reactor chamber in embodiment one;
Fig. 7 A are the vertical views that manipulator load substrate reaches interlayer region position in embodiment one;
Fig. 7 B are the side views that manipulator load substrate reaches interlayer region position in embodiment one;
Fig. 8 A are vertical view of the manipulator by board transport to the second supporting region in embodiment one;
Fig. 8 B are side view of the manipulator by board transport to the second supporting region in embodiment one;
Fig. 9 A are that manipulator is moved to the first supporting region vertical view in embodiment one;
Fig. 9 B are the side views that manipulator is moved to the first supporting region in embodiment one;
Fig. 9 C are the side views that manipulator loads substrate in the first supporting region in embodiment one;
Figure 10 A are the vertical views that manipulator load substrate reaches interlayer region in embodiment one;
Figure 10 B are the side views that manipulator load substrate reaches interlayer region in embodiment one;
Figure 11 A be in embodiment one manipulator by the vertical view of board transport to reaction chamber;
Figure 11 A be in embodiment one manipulator by the side view of board transport to reaction chamber;
Figure 12 A are the vertical views that manipulator loads substrate in the second supporting region in embodiment one;
Figure 12 B are the side views that manipulator loads substrate in the second supporting region in embodiment one;
Figure 13 A are the vertical views that manipulator load substrate reaches interlayer region in embodiment one;
Figure 13 B are the side views that manipulator load substrate reaches interlayer region in embodiment one;
Figure 14 A be in embodiment one manipulator by the vertical view outside board transport to transmission cavity;
Figure 14 B be in embodiment one manipulator by the side view outside board transport to transmission cavity;
Figure 15 A are the vertical views that manipulator loads new substrate outside transmission cavity in embodiment one;
Figure 15 B are vertical view of the manipulator by new board transport to the first supporting region in embodiment one;
Figure 15 C are the vertical views that manipulator is moved to interlayer region in embodiment one;
Figure 16 is the structural schematic diagram of embodiment two.
Specific implementation mode
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, below in conjunction with the accompanying drawings to the present invention
Specific implementation mode be described in detail.
Many details are elaborated in the following description to facilitate a thorough understanding of the present invention, still the present invention can be with
Implemented different from other manner described here using other, therefore the present invention is not limited by following public specific embodiment
System.
Embodiment one
Fig. 2 is the structural schematic diagram of the present embodiment load transmission device, which includes:Reaction chamber 200 passes
Defeated chamber 100, substrate 400, manipulator 110.It is provided with pedestal 210 in the reaction chamber 200;The substrate 400 is being placed in
On pedestal 210 in the reaction chamber 200, to be handled;The manipulator 110 is located in transmission cavity 100, the manipulator
110 are provided with support portion 111, for transmitting the substrate 400 between the transmission cavity 100 and the reaction chamber 200.
In the present embodiment, the first supporting region b, the second supporting region c are provided in the transmission cavity 100 and positioned at described first
Interlayer region a between supporting region b, the second supporting region c, the reaction chamber 200 pass through a transmission gate 300 and transmission cavity 100
Connection separates, reference can be made to Fig. 2.
The first supporting region b of the present embodiment is provided with first support 130, and to carry, described pending or treated
Substrate 400.As shown in figure 5, first supporting region further includes the first placement axis f, the first grip axes g and the first transmission axle e, institute
It is parallel to each other to state the first placement axis f, the first grip axes g and the first transmission axle e three, the crawls of the first transmission axle e or first
Axis g and first place vertical range between axis f be more than or equal to the manipulator 110 load substrate 400 in the first supporting region b stretching, extensions or
The minimum range of contraction is less than or equal to the manipulator 110 and loads substrate 400 in the maximum that the first supporting region stretching, extensions at b or is shunk
Distance;
The second supporting region c of the present embodiment is provided with second support 120, to carry it is described to carry it is pending or
Treated substrate 400.It is passed as shown in fig. 6, the second supporting region c includes the second placement axis f, the second grip axes g and second
Defeated axis e, described second to place axis f, the second grip axes g and the second transmission axle e three parallel to each other, the second transmission axle e or
Vertical range is more than or equal to the load substrate 400 of the manipulator 110 in the second carrying between second grip axes g and second places axis f
The minimum range that area c is stretched or shunk is less than or equal to the manipulator 110 and loads substrate 400 in the second supporting region c stretching, extensions or receive
The maximum distance of contracting.
In the present embodiment, the manipulator 110 loads substrate 400 in the most narrow spacing that the first supporting region stretching, extensions at b or is shunk
From the half no more than 400 minimum length of the substrate.The manipulator 110 loads substrate 400 in the second supporting region c stretching, extensions
Or the minimum range shunk is not more than the half of 400 minimum length of the substrate.
As seen in figures 3-5, manipulator 110 is represented as the circle in the center of circle using point A and loads substrate 400 in the first supporting region b or the
The position that two supporting region c are shunk represents manipulator 110 as the circle in the center of circle using point B and loads substrate 400 in the first supporting region b stretching, extensions
Position, manipulator 110 is represented as the circle in the center of circle using point C and loads substrate in the position of the second supporting region c stretching, extension.Line segment AB is machine
Tool hand 110 loads substrate in the maximum distance that the first supporting region stretching, extensions at b or is retracted, and line segment AC is that the load substrate of manipulator 110 exists
Second supporting region c stretching, extension or the maximum distance retracted, and AO is that manipulator 110 loads substrate or substrate in the first supporting region b or the
Two supporting regions c stretch or the minimum range of contraction, and vertical range is L, the second crawl between the second placement axis f and the second transmission axle e
Vertical range is L ' between axis g and the second transmission axle e, and the L and L ' meet the following conditions:
AO≤L≤AB;
AO≤L’≤AC。
The first transmission axle e of the present embodiment or the second transmission axle e meet two conditions:(1) when manipulator 110 loads substrate
400 or substrate 104 when being moved up and down along transmission axle e, substrate 400 or substrate 410 will not encounter vacant first support 130 or the
Two holders 120, (2) when 110 zero load of manipulator is moved up and down along transmission axle e, manipulator 110 will not encounter first support 130
Or existing substrate 400 in second support 120.
In the present embodiment, the manipulator 110 drives the support portion 111 along the first grip axes g or described first
Transmission axle e enters the first supporting region b;The manipulator 110 drives the support portion along the second grip axes g or described
Second transmission axle e enters the second supporting region c.Further, the manipulator 110 drives the support portion 111 along described
First placement axis f axial movements realize the contact of substrate 400 or are detached from the first support 130;The manipulator 110 drives
The support portion 111 realizes the contact of substrate 400 along the second placement axis f axial movements or is detached from the first support
120。
In the present embodiment, when reaction chamber 200 and transmission cavity 100 are under vacuum state, it are connected to reaction chamber 200 and pass
Defeated chamber 100.
In the present embodiment, the first supporting region b is located at the upper end of the interlayer region a, and the second supporting region c is located at
The lower end of the interlayer region a.The second supporting region c is located at the upper end of the interlayer region a, first supporting region b
In the lower end of the interlayer region a.
In the present embodiment, the rotation of the manipulator 110 or it is flexible drive the support portion 111 described first place axis f,
It is moved between first grip axes g and the first transmission axle e, the second placement axis f, the second grip axes g and the second transmission axle e.
In the present embodiment, 400 shape of the substrate is circular plate type, and the substrate 400 serves as a contrast to carry an at least blade technolgy
Bottom.The substrate 400 is provided with annular groove on the downside of excircle.
In the present embodiment, the support portion 111 of the manipulator 110 is semicircular arc, the end clamping of the support portion 111
In the annular groove, the circular slab is clamped.
In certain examples of the present invention, the first support is set on the side wall of the transmission cavity, the first support
Shape include " L " shape, " I " shape being tilted a certain angle, Y-shaped, " C " type, " D " at least one of type or semicircle,
Preferably, the shape of the first support is " C " type.The second support 120 is set on the side wall of the transmission cavity, institute
The shape for stating first support includes in " L " shape, " I " shape being tilted a certain angle, Y-shaped, " C " type, " D " type or semicircle
It is at least one, it is preferred that the shape of the second support is " C " type.It is described in certain other embodiments of the present invention
First support or second support can also be the support element for being set to transmission cavity bottom.
In the present embodiment, the first support 130 is set on the side wall of the transmission cavity 100, and the first support is
The support element of " C " type.Second support 120 is disposed on the support element of 100 bottom of transmission cavity in the present embodiment.
In the present embodiment, described first places axis f, the axial direction of the first grip axes g and the first transmission axle e is vertically prolonged
It stretches.Described second places axis f, the axial direction of the second grip axes g and the second transmission axle e vertically extends.
In the present embodiment, the first grip axes g is overlapped with the first transmission axle e.In the present invention certain, other are specific
Embodiment in, the first grip axes g and the first transmission axle e are misaligned.In the present embodiment, the second grip axes g
It is overlapped with the second transmission axle e.In other certain specific embodiments of the present invention, the second grip axes g and second is passed
Defeated axis e is misaligned.
In the present embodiment, the described first placement axis f is overlapped with the second placement axis f.In the present invention certain, other are specific
Embodiment in, described first places axis f and the second placement axis f is misaligned.
In the present embodiment, when the substrate 400 is contacted with the first support 130, the central point of the substrate 400 is along institute
The axial movement of the first placement axis f is stated to first support 130.
In the present embodiment, when the substrate 400 is contacted with the second support 120, the central point of the substrate 400 is along institute
The axial movement of the second placement axis f is stated to second support 120.
The method for carrying out load transmission using above-mentioned load transmission device, refer to the attached drawing 6A~15C include the following steps:
Step 1:The support portion 111 of the manipulator 110 loads the centre in pretreated substrate 400 to transmission cavity 100
Floor area a is transmitted to the first supporting region b or the second supporting region c by interlayer region a, and is positioned over first support 130 or second support
Upper 120;
Step 2:The support portion 111 of the manipulator 110 loads the centre in pretreated substrate 400 to transmission cavity 100
Floor area a is transmitted to by transmission gate on the pedestal 210 of reaction chamber 200 by interlayer region a;
Step 3:Closing transmission chamber 100;
Step 4:Substrate 400 in reaction chamber 200 is handled;
Step 5:With reference to shown in figure 6A~Fig. 8 B, the support portion 111 of the manipulator 110 load treated substrate 400
To interlayer region a, the second supporting region c or the first supporting region b are transmitted to by interlayer region a, and be positioned over second support 120 or the
On one holder 130;
Step 6:With reference to shown in figure 9A~Fig. 9 C, the manipulator 110 is moved by the second supporting region c or the first supporting region b
It moves to interlayer region a, then is moved up or moved down by interlayer region a, and level goes to the first supporting region b or the second supporting region c.
Step 7:With reference to shown in figure 10A~Figure 11 B, 111 load regulation of support portion, the one supporting region b of the manipulator 110
Or the second pretreated substrate 400 on supporting region c is transmitted to reaction chamber 200 to interlayer region a by interlayer region a.
Step 8:With reference to shown in figure 12A~Figure 14 B, by manipulator 110, by treated, substrate 400 is transmitted to middle layer
Area a transmits out transmission cavity 100 by interlayer region a.
More specifically, the operating process of the step 1 further includes:The load pretreatment of support portion 111 of the manipulator 110
Substrate 400 to transmission cavity 100 in interlayer region a after, the central point of the substrate 400 is in the axial direction of the first transmission axle e
It moves or is moved down along the axial direction of the second transmission axle e, then rotate horizontally the central point and the first grip axes g or second to substrate 400
The position that grip axes g is overlapped, then level moves to the first supporting region b or the second supporting region c, the support portion 111 of the manipulator exist
First supporting region b is moved down along the first placement axis f or is moved down along the second placement axis f in the second supporting region c and places the substrate 400
In first support 130 or in second support 120.
More specifically, the operating process of the step 5 further includes:Treated for the load of support portion 111 of the manipulator
After interlayer region a in substrate 400 to transmission cavity 100, the central point of the substrate 400 is moved down along the axial direction of the second transmission axle e
Or moved up along the axial direction of the first transmission axle e, the central point then rotated horizontally to substrate 400 is grabbed with the second grip axes g or first
The position for taking axis g to overlap, then level move to the second supporting region c or the first supporting region b, and the support portion 111 of the manipulator is the
Two supporting region c are moved down along the second placement axis f or are moved down along the first placement axis f in the first supporting region b and are placed on the substrate 400
In second support 120 or in first support 130.
More specifically, the operating process of the step 7 further includes:The support portion 111 of the manipulator is moved to first
The underface of supporting region b or the pretreated substrate 400 on the second supporting region c, the support portion 111 along first place axis f or
Second placement axis f's moves axially upwards, you can the load pretreated substrate 400, the support portion 111 load described
Substrate 400 is moved to what the central point of the substrate 400 was overlapped with the first grip axes g or the second grip axes g in the horizontal direction
Position, then level go to the position that the central point of substrate 400 is overlapped with the first transmission axle e or the second transmission axle e, the branch of manipulator
Support part 111 loads substrate 400 and is axially moved down along the first transmission axle e or move upwardly into interlayer region a, machine along the second transmission axle e axis
The support portion 111 of tool hand is moved horizontally along interlayer region a is transmitted to reaction chamber 200 by the substrate 400.
Embodiment two
Figure 16 is the structural schematic diagram of two load transmission device of the embodiment of the present invention.The embodiment of the present invention is second is that implementing
The optimization design carried out on the basis of example one, can be seen that from Fig. 2 and Figure 16 the difference between this embodiment and the first embodiment lies in:
Three sides of the transmission cavity 100 are connected separately with the first reaction chamber 201, the second reaction chamber 202 and third reaction chamber
203, the transmission cavity 100 is passed with the first reaction chamber 201, the second reaction chamber 202 and third reaction chamber 203 by first respectively
Defeated door 301, the second transmission gate 302, the connection of third transmission gate 303 separate.
Further include third holder and the 4th holder in the present embodiment, in the transmission cavity 100, the third holder is set to
First supporting region b, the 4th holder are set to the second supporting region c.In the present embodiment, the first support 130 and third branch
Frame is the holder that side wall extends, and the second support 120 and the 4th holder are disposed on the support element of 100 bottom of transmission cavity.
The load transmission device of the present embodiment increases the second reaction chamber and third reaction chamber on the basis of embodiment one,
The mass processing for realizing substrate 400, improves utilization rate of equipment and installations and the efficiency of load transmission, saves production cost.This
The method that the load transmission device of embodiment carries out load transmission can refer to
Embodiment one, details are not described herein again.
Although the present invention has been disclosed in the preferred embodiments as above, present invention is not limited to this.Any art technology
Personnel can make various variations and modification, therefore protection scope of the present invention is answered without departing from the spirit and scope of the present invention
When being subject to claim limited range.