CN102270565B - Substrate processing device - Google Patents
Substrate processing device Download PDFInfo
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- CN102270565B CN102270565B CN201110158579.0A CN201110158579A CN102270565B CN 102270565 B CN102270565 B CN 102270565B CN 201110158579 A CN201110158579 A CN 201110158579A CN 102270565 B CN102270565 B CN 102270565B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention provides a substrate processing device capable of inhibiting the macrotype of the device and the increasing of occupation area. A plurality of processing chambers (30) for the vacuum treatment of substrates are arranged at the periphery of a vacuum conveying chamber (13) maintained to be in a vacuum environment. The processing chamber (30) is configured to be capable of opening or closing the upper opening of a vessel main body (31) via a cover body (32). A cover body opening and closing mechanism (6) is arranged to be moved along the periphery of the vacuum conveying chamber (13). The cover body (32) is equipped with a holding part (5). The cover body (32) is lifted from the processing chamber (30) by enabling the cover body of the cover body opening and closing mechanism (6) to be lifted at the opening or closing position.
Description
Technical field
The present invention relates to a kind ofly at vacuum carrying room, connect the substrate board treatment for the treatment of a plurality of process chambers of substrate.
Background technology
For example be known to, in the manufacturing process of FPD (Flat Panel Display), surrounding at vacuum carrying room arranges a plurality of process chambers, by being arranged at the carrying arm in carrying room, the substrate board treatment that carries out the handing-over of the substrates such as glass substrate between vacuum carrying room and process chamber.As the processing of the substrate as handled object being carried out with above-mentioned process chamber, the processing such as the etching of can giving an example out, ashing (ashing), film forming.
For example, above-mentioned process chamber consists of the lid that loads the container body of substrate and upper opening and can open and close the peristome of this container body, in the maintenance of its maintenance in carrying out process chamber, lid, lid can be taken out from container body.Gas tip that supply with to process gas is set on lid, as the upkeep operation of lid one of, have the exchange etc. of the parts of gas tip.
On-off action about this lid in patent documentation 1 has proposed a kind of scheme.In this structure, the switching mechanism that is arranged at the lid of each process chamber in utilization makes lid from container body rises, and makes lid slide into deviation position from container body.Then, after making lid decline, make lid reversion.In this gimmick, by lid is slided along the direction of the conveyance direction quadrature of the substrate with towards process chamber, can reduce the area of the on-off action needs of lid.
Yet, because FPD substrate is large substrate, for example, therefore process chamber also forms the size on one side of plan view shape, is respectively the large-scale square tubular container of 3m, 3.5m.Therefore, for each process chamber, all need to open and close lid and make the mechanism of lid reversion and the structure in space in, if increase process chamber be difficult to guarantee the space of lid of reversing, if be intended to guarantee space, worry that device further maximizes.In addition, owing to being provided with the switching mechanism of lid for each process chamber, therefore if process chamber increases, can cause that the manufacturing cost of device goes up.
Patent documentation 1: TOHKEMY 2007-67218 communique (with reference to Fig. 1, Figure 19)
Summary of the invention
The thing of the present invention based on above-mentioned forms, and its object is to provide a kind of and connects in the substrate board treatment for the treatment of a plurality of process chambers of substrate at vacuum carrying room, the maximization of restraining device, suppresses the technology of the increase of floor space.
Thus, substrate board treatment of the present invention is characterised in that to possess: vacuum carrying room, and it is provided with substrate transferring mechanism, and is maintained vacuum environment; Preparatory vacuum chamber, it is connected with the side of this vacuum carrying room; For the treatment of a plurality of process chambers of substrate, they are to be connected with the side of above-mentioned vacuum carrying room and to be mutually disposed at circumferentially in circumferentially separated mode with above-mentioned preparatory vacuum chamber, and lid is set on each container body; Guide member, it is set to the circumferential extension along above-mentioned vacuum carrying room; Moving body, it is directed along this guide member; Lid maintaining body, its mode with the top that moves through above-mentioned process chamber by this moving body is arranged at this moving body, keeps lid and makes this lid lifting, so that with respect to said vesse main body mounting or dismounting lid; Drive division, it is for making above-mentioned moving body move along guide sections part.
In addition, also can be configured to: on above-mentioned lid, be provided with in horizontal expansion, be formed with the maintained portion of the locking part in space below being included in, on above-mentioned lid maintaining body, be provided with maintaining part, this maintaining part moves the space of the lower side that enters above-mentioned locking part on one side on one side along guide sections part, rise afterwards and from lower side, above-mentioned locking part pushed away to lift lid.
Further, guide sections part also can be configured to and possess: inner side guide member, and it is arranged on above-mentioned vacuum carrying room or is arranged between above-mentioned vacuum carrying room and process chamber; Guided outside parts, it is arranged on respect to above-mentioned process chamber and a side contrary with above-mentioned vacuum carrying room.
Further, also can be configured to: the plan view shape of above-mentioned vacuum carrying room forms polygon, in the middle of the side of above-mentioned vacuum carrying room, except the foreign side's side at above-mentioned vacuum carrying room is for guaranteeing other sides the side of maintenance area, connect respectively above-mentioned preparatory vacuum chamber and process chamber.Now, in above-mentioned maintenance area, also can be provided with and keep the lid coming from above-mentioned lid maintaining body handing-over the lid reversing device that makes this lid reversion.Further, also can be configured to: above-mentioned vacuum carrying room has six sides, in above-mentioned side, connect an above-mentioned preparatory vacuum chamber and four process chambers.
According to the present invention, a plurality of process chambers with respect to the surrounding's configuration along vacuum carrying room, keep the lid maintaining body of lid mounting or dismounting (switching) jointly to change thereby be used in.And, because the mode this lid maintaining body can be moved along the upper area that is arranged in process chamber of process chamber forms, therefore do not need the horizontal space of vacuum processing chamber when the mounting or dismounting of lid.Therefore, maximization that can restraining device, the increase of restraint measure area (floor space).
Accompanying drawing explanation
Fig. 1 means the stereogram of the execution mode of substrate board treatment involved in the present invention.
Fig. 2 means the cross-sectional vertical view of the inside of aforesaid substrate processing unit.
Fig. 3 means the profile of an example of the process chamber that is arranged at aforesaid substrate processing unit.
Fig. 4 means the vertical view of a part for aforesaid substrate processing unit.
Fig. 5 means the end view of a part for aforesaid substrate processing unit.
Fig. 6 means the end view of a part for aforesaid substrate processing unit.
Fig. 7 is for the end view of the effect of aforesaid substrate processing unit is described.
Fig. 8 is for the end view of the effect of aforesaid substrate processing unit is described.
Fig. 9 means the vertical view of other execution modes of aforesaid substrate processing unit.
Figure 10 means the end view of other execution modes of aforesaid substrate processing unit.
Figure 11 means the end view of further other execution modes of aforesaid substrate processing unit.
Description of reference numerals: S:FPD substrate; 13: carrying room; 30: process chamber; 31: container body; 32: lid; 4: lid reversing device; 5: maintained portion; 50: lock part; 6: cover body opening/closing mechanism; 62,91: inner track; 63,92: outer side track; 67A, 67B: wheel; 68A, 68B: mobile motor; 7: lid maintaining part; 70: horizontal component.
Embodiment
Below, in an execution mode for substrate board treatment of the present invention, the situation that FPD substrate is processed is described.For example, as the processing of carrying out, etch processes.Fig. 1 means the stereogram of the general survey of this substrate board treatment 1, and Fig. 2 means the cross-sectional vertical view of the inside of this substrate board treatment 1.In figure, 1A, 1B take in the bracket mounting portion of bracket C1, the C2 of a plurality of FPD substrates (hereinafter referred to as " substrate ") S from outside for mounting.For example, these bracket mounting portions 1A, 1B are configured to and utilize elevating mechanism 11 shears C1, C2, can take in untreatment base S1 at a side bracket C1, at the opposing party's bracket C2, take in processed substrate S2.
In addition, in the inboard of bracket mounting portion 1A, 1B, be provided with load lock (the load lock chamber) 12 and the vacuum carrying room 13 that form preparatory vacuum chamber.In addition, between bracket mounting portion 1A, 1B, for carry out the substrate transferring unit 21 of the handing-over of substrate S between above-mentioned 2 bracket C1, C2 and load lock 12, be arranged at supporting station 14.For example, this substrate transferring unit 21 possesses: 2 arms 22 setting up and down and advance and retreat freely and rotation freely support the base station 23 of these arms 22.Above-mentioned load lock 12 is configured to its environment can be switched between vacuum environment and atmospheric pressure environment, and as shown in Figure 2, the inside of load lock 12 is equipped with the buffer frame 15 for supporting substrates S.In accompanying drawing, 16 is locator (positioner).
The plan view shape of above-mentioned vacuum carrying room 13 is configured to polygon-shaped, regular hexagon shape for example, in the side of vacuum carrying room 13, be equipped with a plurality of process chambers 30, a plurality of process chambers 30 are to be connected to the side of vacuum carrying room 13 and to be mutually disposed at circumferentially in circumferentially separated mode with above-mentioned load lock 12.In this embodiment, in side corresponding to 4 limits with in vacuum carrying room 13, be connected with airtightly respectively 4 process chambers 30.
In addition, side corresponding to a side on all the other 2 limits with vacuum carrying room 13, is connected with above-mentioned load lock 12 airtightly, and foreign side's side of the side corresponding with the opposing party guarantees to have maintenance area M, and in this maintenance area, M is provided with lid reversing device 4.In this embodiment, load lock 12 is set up in mutual opposed mode with lid reversing device 4.
Above-mentioned vacuum carrying room 13 is configured to and is maintained vacuum environment, as shown in Figure 2, in the inside of vacuum carrying room 13, is equipped with substrate transferring mechanism 25.And, utilize this substrate transferring mechanism 25, can be between above-mentioned load lock 12 and 4 process chambers 30 conveyance substrate S.
And, seal airtightly between above-mentioned load lock 12 and vacuum carrying room 13, between vacuum carrying room 13 and process chamber 30 and the peristome that is communicated with load lock 12 and the atmospheric environment in outside, and be situated between to be inserted with respectively and be configured to gate valve to be opened/closed (gate valve) GV.
Then,, with reference to Fig. 3, above-mentioned process chamber 30 is carried out to simple explanation.For example, this process chamber 30 possesses: plan view shape is configured to quadrangle shape, and at the container body 31 of top plate portion opening; And the top board peristome lid 32 of being arranged to open and close this container body 31.Above-mentioned lid 32 is configured to and utilizes cover body opening/closing mechanism 6 described later with respect to container body 31 mounting or dismounting freely.For example, aforesaid substrate S is for 2.2m, another side, to be on one side the big or small square substrate of 2.5m left and right, one side above-mentioned process chamber 30 is set to horizontal profile, is that 3m, another side are the size of 3.5m left and right.
In the inside of said vesse main body 31, on the bottom surface of container body 31, via insulating element 33a, dispose for loading the mounting table 33 of substrate S.And container body 31, via exhaust line 34a, is connected with the vacuum exhaust unit for example being formed by vacuum pump 34.In addition, in process chamber 30 above, with the opposed mode of mounting table 33, the mode being supported with the outstanding support 36a in the inside by lid 32 as the gas supply part 35 that forms the shower nozzle of upper electrode is set up.In figure, 36b is insulating element, and 35a is gas squit hole, and 37a is gas supply pipe, and 37 is gas supply system, and 38a is feeder rod used therein, and 38b is integrator (matching box), and 38 is high frequency electric source.
In such process chamber 30, by applying High frequency power from high frequency voltage 38 to gas supply part 35, in the space of the upper side of substrate S, be formed with the plasma of processing gas, carry out thus the etch processes to substrate S.In addition, in the figure beyond Fig. 3, for the ease of diagram, integrator 38b, high frequency electric source 38 and gas supply system 37 etc. are omitted.
The processing action of substrate S is carried out to simple explanation herein.First, utilize substrate transferring unit 21, substrate S1 is moved into load lock 12 from taking in a side's of untreatment base S1 bracket C1.In load lock 12, utilize buffer frame 15 to keep substrate S1, after the arm 22 of substrate transferring unit 21 is kept out of the way, discharge the gas in load lock 12, till the vacuum degree that inner pressure relief is extremely stipulated.After vacuum attraction finishes, utilize locator 16 to carry out the contraposition of substrate S1.
Afterwards, open the gate valve GV between load lock 12 and vacuum carrying room 13, utilize substrate transferring mechanism 25 to collect substrate S1, close above-mentioned gate valve GV.Then, open the gate valve GV between vacuum carrying room 13 and the process chamber 30 of regulation, utilize substrate transferring mechanism 25 that aforesaid substrate S1 is moved into this process chamber 30, close above-mentioned gate valve GV.
And, in process chamber 30, as mentioned above, by the space on substrate S1, form plasma, carry out the etch processes to this substrate S1.After this etch processes finishes, utilize substrate transferring mechanism 25 to collect processed substrate S2, conveyance is to load lock 12, and then, aforesaid substrate S2 is by conveyance unit 21, the bracket C2 being used to processed substrate by conveyance.Thus, the processing of one piece of substrate is through with, and to being equipped on all substrate S1 of the bracket C1 that untreatment base uses, carries out this processing.
Then, process chamber 30 is further detailed.As shown in Fig. 1～5, in the upper face center of above-mentioned lid 32, be provided with maintained portion 5.Fig. 5 is the end view of observing from the A-A line side of Fig. 2.Above-mentioned maintained portion 5 consists of a pair of hook parts 51,51 that mutually configure back to ground.Each vertical component of these hook parts 51,51 is parallel to one side of the vacuum carrying room 13 that connects this process chamber 30, with respect to the central portion of the lid 32 of the direction with above-mentioned one side quadrature, in mode symmetrical and that be separated from each other, is configured.Each horizontal component of hook parts 51,51 stretches out mutually on the contrary, forms the locking part 50 being kept by aftermentioned lid maintaining body 7.4 process chambers 30 are configured to identical shape mutually in this embodiment, manage throughout the upper surface of the lid 32 of chamber 30, mutually in identical position, are formed with respectively identical shaped maintained portion 5.
Further, in this substrate board treatment, engage with above-mentioned maintained portion 5 and for opening and closing the cover body opening/closing mechanism 6 of lid 32, the mode moving with the periphery along above-mentioned vacuum carrying room 13 is set up.This cover body opening/closing apparatus 6 possesses a moving body for type shape 61.And this substrate board treatment possesses the guide member that the mode with the circumferential extension along above-mentioned vacuum carrying room 13 arranges, above-mentioned moving body 61 is constituted as directed along this guide member on one side, on one side mobile.In this embodiment, at the upper surface of vacuum carrying room 13, be provided with the inner track 62 of formation inner side guide member, according to be provided with the outer side track 63 that forms guided outside parts across the opposed at certain intervals mode of chambers 30 with this inner track 62.Herein, as shown in Figure 5, process chamber 30, vacuum carrying room 13 are supported by supporting station 30a, 13a respectively, and the pillar 63a that guided outside track 63 is arranged by the surrounding's devices spaced apart at vacuum carrying room 13 supports.
In this embodiment, because the plan view shape of vacuum carrying room 13 is regular hexagon shape, therefore above-mentioned inner track 62 and outer side track 63 are set to respectively: with respect to vacuum carrying room 13 center, remove the concentric circles in the region that faces load lock 12.Thus, the process chamber 30 that above-mentioned cover body opening/closing mechanism 6 arranges with respect to 4 sides at vacuum carrying room 13, moves with identical position relationship mutually.
Above-mentioned inner track 62 is arranged at the periphery near zone of the upper surface of vacuum carrying room 13, and the upper surface at the vacuum carrying room 13 of the inside region of inner track 62, is provided with the peristome 17 of safeguarding use.This peristome 17 has lid, is conventionally closed to the inside of vacuum carrying room 13 is remained to vacuum.When safeguarding, so that the mode of the substrate transferring structure 25 in vacuum carrying room 13 can be taken out from this peristome 17, peristome 17 is configured to Bi Gai substrate transferring mechanism 25 large.
It is distolateral directed along above-mentioned inner track 62 that above-mentioned moving body 61 is configured to one, and another is distolateral directed along above-mentioned outer side track 63.In this embodiment, as shown in Figures 1 and 5, moving body 61 possesses: the horizontal part 64 flatly extending towards foreign side from vacuum carrying room 13, the inner side foot 65 extending towards lower side towards the inner track 62 that is arranged at vacuum carrying room 13 from this horizontal part 64 and the outside foot 66 extending to the lower side towards the outer side track 63 that is arranged at the outside of process chamber 30 from horizontal part 64.
A plurality of wheel 67A are arranged at the lower end side of above-mentioned inner side foot 65 along the moving direction of cover body opening/closing mechanism 6, these wheels 67A is configured to by medial movement motor 68A and is driven.And a plurality of wheel 67B are arranged at the lower end side of above-mentioned outside foot 66 along above-mentioned moving direction, these wheels 67B is constituted as by outer side shifting motor 68B and is driven.As shown in Figure 6, in this embodiment, as wheel 67A and wheel 67B, be provided with 2 wheels.These medial movement motor 68A and outer side shifting motor 68B, controlled driving by the mode that the opened and closed positions of the lid separately 32 by chambers 30 moves along the periphery of vacuum carrying room 13 with cover body opening/closing mechanism 6 on one side on one side.In this embodiment, by wheel 67A, 67B and mobile motor 68A, 68B, above-mentioned moving body 61 is formed and is useful on the drive division moving along guide sections part.
And, this substrate board treatment 1 is arranged at this moving body 61 in order to the mode of the process above above-mentioned process chamber 30 of the movement with above-mentioned moving body 61, in order to install and remove lids 32 with respect to said vesse main body 31, and be provided with the lid maintaining body 7 that keeps lid 32 and make lid 32 liftings.This lid maintaining body 7 possesses maintaining part 70, and this maintaining part 70 moves along above-mentioned guide rail 6 on one side, Yi Bian enter into the space of the lower side of above-mentioned locking part 50, rises afterwards above-mentioned locking part 50 is up pushed away to lift lid 32 from lower side.This maintaining part 70 is formed by a pair of hook parts 71,71 that mutually relatively configure.Each vertical component of these hook parts 71,71, is configured to enter into the opened and closed positions in space of the lower side that locks part 50 and the hook parts of maintained portion 5 51,51 mode parallel and that be positioned at the outside of these hook parts 51,51 with respect to maintaining part 70.And each horizontal component 70a of hook parts 71,71 forms in the mode of mutually inwards stretching out.
These hook parts 71,71 are freely set up by forming jack mechanism 72,72 liftings of elevating mechanism.This jack mechanism 72 possesses: carve and be provided with the lifting shaft 73 of ridge and the screw portion main body 74 that is formed with the ridge screwing togather with this lifting shaft 73 at inner face, be connected with respectively the upper end of hook parts 71,71 in the lower end of lifting shaft 73.In figure, 75 is lift motor, and 76 is reductor, and 2 screw portion main bodys 74 utilize shaft joint 77 to be connected with lift motor 75 via common reductor 76.In figure, 78 is the supporting station of screw portion main body 74, lift motor 75 and reductor 76.In such jack mechanism 72, if make 74 rotations of screw portion main body by lift motor 75 via reductor 76, shaft joint 77, according to direction of rotation, lifting shaft 73 carries out lifting in the inside of screw portion main body 74 along not shown guide.In Fig. 5,78a, 64a are the peristomes that is formed at respectively supporting station 78, horizontal part 64.
Like this, when cover body opening/closing mechanism 6 is during in above-mentioned opened and closed positions, the horizontal component 70a of lid maintaining body 7, at the down position of the lower side of the locking part 50 in maintained portion 5, and freely form by above-mentioned locking part 50 is up pushed away lift lifting between the lifting position of lid 32 from lower side.
In addition, cover body opening/closing mechanism 6 forms, if under the state in above-mentioned down position by lid maintaining body 7, surrounding by cover body opening/closing mechanism 6 along vacuum carrying room 13 moves, cover body opening/closing mechanism 6 does not move interferingly with the maintained portion 5 of process chamber 30, with respect to the opened and closed positions of chambers 30, the horizontal component 70a of lid maintaining body 7 is positioned at the lower side of the locking part 50 of maintained portion 5.
Thus, manage throughout in the opened and closed positions of chamber 30, if make lid maintaining body 7 increase, lock part 50 and be lifted by lid maintaining body 7, thereby open lid 32.In addition, cover body opening/closing mechanism 6 keeps in above-mentioned lifting position under the state of lid 32, and lid 32 moves in the mode of the top of the process chamber 30 through other.Therefore, above-mentioned lifting position is set as, the height that can not move with other the mode of the interference such as maintained portion 5 of process chamber 30 with the lid 32 that is lifted.
At the lid 32 being kept by lid maintaining body 7, by make lid maintaining body 7 decline in above-mentioned opened and closed positions, to block the mode of the peristome of container body 31, join in container body 31.And, till cover body opening/closing structure 6 drops to above-mentioned down position by lid maintaining body 7 further from this delivery position, restart afterwards mobile.
In addition,, when process chamber 30 is while being clipped on the structure between inner track 62 and outer side track 63, the size of process chamber 30 also can form in mutual different mode.In this case, by cover body opening/closing mechanism 6 during along vacuum carrying room 13 circumferential mobile, when lid maintaining body 7 is during in above-mentioned down position, this lid maintaining body 7 is not interfered with the maintained portion 5 of chambers 30, make cover body opening/closing mechanism 6 be positioned at the opened and closed positions of chambers 30, when being 7 rising of lid maintaining body, the mode being lifted with maintained portion 5, maintained portion 5 and the cover body opening/closing mechanism 6 of formation chambers 30.Structure if so, when lid maintaining body 7 is disposed to above-mentioned down position, by cover body opening/closing mechanism 6, do not interfere with the maintained portion 5 of all process chamber 30, cover body opening/closing mechanism 6 can be moved the periphery along vacuum carrying room 13, can carry out the switching of the lid 32 of all process chambers 30.
Above-mentioned lid reversing device 4 is configured to, the lid 32 that maintenance joins from above-mentioned lid maintaining body 7 also makes it reversion, for example, as shown in Fig. 1 and Fig. 8, possess and keep the framework 41 of lid 32 and the rotary driving part 42 that makes these framework 41 rotations along the rotating shaft of level.This rotary driving part 42 possesses CD-ROM drive motor 43, reductor 44 and bearing 45, and these are supported by supporting station 46.Above-mentioned framework 41 is configured to, and keeps the cover body opening/closing mechanism 6 of lid 32 to move to lid mounting position, when making lid 32 decline from this position, keeps this lid 32 around.
Further, in the above-described embodiment, the upper side position of lid reversing device 4 is the position of readiness of cover body opening/closing mechanism 6.And, in this embodiment, due to vacuum carrying room 13 is clipped in the middle, be provided with lid reversing device 4 with the opposed position of load lock 12, therefore between load lock 12 and lid reversing device 4, be respectively arranged with 2 process chambers 30 in the both sides of lid reversing device 4.Therefore, for the cheap property illustrating, using from lid reversing device 4 towards the direction of load lock 12, the direction of advance as cover body opening/closing mechanism 6 describes.
In the above-described embodiment, as shown in Figures 4 and 5, at each process chamber 30, be provided with and detect for making cover body opening/closing mechanism 6 stop at the position transducer of the stop position of opened and closed positions.In this embodiment, above-mentioned position transducer forms by light sensing, and for example, illuminating part is arranged at the outer surface of process chamber 30, and light accepting part is arranged at the position corresponding with above-mentioned illuminating part of the foreign side of outer side track 62.
For example, optical sensor is prepared the 1st optical sensor 81 and the 2nd optical sensor 82 in each chambers 30.When cover body opening/closing mechanism 6 is positioned at above-mentioned opened and closed positions, the 1st optical sensor 81 is arranged at the position of optical axis L of one distolateral (front side) blocking optical sensor 81 of moving body 61 of the direction of advance of cover body opening/closing mechanism 6.In addition, the 2nd optical sensor 82 be arranged at cover body opening/closing mechanism 6 direction of advance the 1st optical sensor 81 in face of side.In accompanying drawing, 81A, 82A are illuminating part, and 81B, 82B are light accepting part.These detection signals from optical sensor 81,82 are configured to, at control part 100 described later, be output, in control part 100 based on this detection signal, to mobile motor 68A, 68B output deceleration instruction, the halt instruction of cover body opening/closing mechanism 6.
At this substrate board treatment, be for example provided with the control part 100 being formed by electronic computer.This control part 100 possesses the data processing division consisting of program, memory, CPU, to said procedure, enroll order (each step), this enroll order from control part 100 to process chamber 30, the pipage control signal such as conveyer, cover body opening/closing mechanism 6, carry out the pre-arranged procedure, implement thus the processing example of substrate S as the reversion action of the on-off action of etch processes, lid 32, lid 32.This program is incorporated in the memory portions such as electronic computer memory media such as floppy disk, CD, hard disk, MO (photomagneto disk), is installed in control part 100.
In addition, in control part 100, instruction based on from operator, cover body opening/closing mechanism 6 is moved towards the process chamber 30 that is intended to open lid 32 from the position of readiness of the upper side of lid reversing device 4, to keep the cover body opening/closing mechanism 6 of lid 32 to move to above-mentioned position of readiness, cover body opening/closing mechanism 6 is loaded in the instruction of lid reversing device 4 and so on and exported to mobile motor 68A, 68B, lift motor 65.
Herein, in control part 100, though to utilizing the encoder of above-mentioned mobile motor 68A, 68B, can hold to some extent general stop position when cover body opening/closing mechanism 6 being stopped to the opened and closed positions of each lid 32 of process chamber 30, mobile motor 68A, 68B, but in this embodiment, the detected value of the optical sensor 8 based on above-mentioned, can stop at above-mentioned opened and closed positions accurately by cover body opening/closing mechanism 6.
For example, when cover body opening/closing mechanism 6 is positioned at above-mentioned position of readiness, the state of the ON that the optical axis of the optical axis of above-mentioned optical sensor 81,82 in the 1st optical sensor 81 and the 2nd optical sensor 82 is not interdicted, this ON signal is to control part 100 outputs.And, cover body opening/closing mechanism 6 is moving to from position of readiness while being intended to open and close the process chamber 30 of lid 32, first the optical axis of the 2nd optical sensor 82 is moved an above-mentioned distolateral blocking of body 61, thereby forms OFF state, therefore from the 2nd optical sensor 82 to control part 100 output OFF signals.In control part 100, based on this OFF signal, to mobile motor 68A, the 68B of cover body opening/closing mechanism 6, export deceleration instruction, thereby cover body opening/closing mechanism 6 underspeeds and moves lentamente thus.
And, if the optical axis of the 1st optical sensor 81 is moved an above-mentioned distolateral blocking of body 61 and forms OFF state, from the 1st optical sensor 81 to control part 100 output OFF signals.In control part 100, based on this OFF signal, to mobile motor 68A, the 68B of cover body opening/closing mechanism 6, export halt instruction, cover body opening/closing mechanism 6 is stopped.Thus, the above-mentioned opened and closed positions that cover body opening/closing mechanism 6 can correctly be managed chamber 30 throughout stops.
In such substrate board treatment 1, under normal conditions, make cover body opening/closing mechanism 6 at the position of readiness of the upper side of lid reversing device 4 under holding state, substrate S is carried out to above-mentioned etch processes.And, when the safeguarding of lid 32, process chamber 30, when open lid 32, lid maintaining body 7 is positioned under the state of down position, cover body opening/closing mechanism 6 is moved towards the process chamber 30 that forms object from position of readiness.Now, in the situation that position of readiness and form between the process chamber 30 of above-mentioned object and have other process chamber 30, the horizontal component 70a of lid maintaining body 7 advances by the lower side of the locking part 50 of the maintained portion 5 of this process chamber 30.
And, in above-mentioned method, cover body opening/closing mechanism 6 is stopped in the opened and closed positions that forms the process chamber 30 of above-mentioned object, (with reference to Fig. 7 (a)).In this opened and closed positions, as mentioned above, the horizontal component 70a of the lid maintaining body 7 of cover body opening/closing mechanism 6, is positioned at the lower side of locking part 50 of the maintained portion 5 of the process chamber 30 that forms above-mentioned object.Then,, as shown in Fig. 7 (b), by making lid maintaining body 7 increase, up to push away the mode that locks part 50 at horizontal component 70a, from this process chamber 30, lift lid 32.
Like this, at cover body opening/closing mechanism 6, keep under the state of lid 32, cover body opening/closing mechanism 6 moves towards above-mentioned lid reversing device 4.Then, as shown in Fig. 8 (a), in the lid mounting position of the upper side of this lid reversing device 4, stop, thereby decline at framework 41 handing-over lids 32 from this mounting position.And, lid maintaining body 7 further drops to down position, make the horizontal component 70a of lid maintaining body 7 be positioned at the lower side of locking part 50 of the maintained portion 5 of lid 32, then make cover body opening/closing mechanism 6 move to not the position of interfering with the reversion action of lid 32.
In addition, as shown in Fig. 8 (b), in lid reversing device 4, by framework 41, keeping, under the state of lid 32, by rotary driving part 42, making this framework 41 around horizontal rotational shaft, making lid 32 reversions.The inside of lid 32 is provided with gas supply part 35 etc., by lid 32 reversions, under this gas supply part 35 state upward, safeguards.
In addition, can, lid maintaining body 7 is positioned under the state of lifting position, cover body opening/closing mechanism 6 be moved towards the process chamber 30 that forms object from position of readiness.In this case, in face of the opened and closed positions of process chamber 30 that forms object, make after lid maintaining body 7 drops to down position, cover body opening/closing mechanism 6 to be moved to opened and closed positions.
In the above-described embodiment, in the mode that cover body opening/closing mechanism 6 is moved along the periphery of vacuum carrying room 13, arrange, and by being arranged at the lid maintaining body 7 of this cover body opening/closing mechanism 6, in the mode that the lid of a plurality of process chambers 30 32 is lifted respectively, form.And, because by this lid maintaining body 7, the mode with the upper area of the mobile process chamber 30 of the arrangement along process chamber 30 forms, therefore the horizontal space of process chamber 30 while not needing the mounting or dismounting of lid 32.Therefore maximization that can restraining device, the increase of restraint measure area (floor space).
In addition, owing to can utilizing the lid 32 of all process chambers 30 of common cover body opening/closing mechanism 6 mounting or dismounting, therefore compare with the structure that the switching mechanism of lid 32 is set at each process chamber 30, can realize the miniaturization of process chamber 30, maximization that can restraining device, suppresses the increase of floor space.
Further, because cover body opening/closing mechanism 6 is arranged at the upper side of process chamber 30, therefore comparing, the structure that cover body opening/closing mechanism is set with surrounding at process chamber 30 can realize miniaturization.In addition owing to respect to a plurality of process chambers 30, common cover body opening/closing mechanism 6 being set, therefore be also favourable to manufacturing cost.Further, the maintenance area that need to not guarantee lid 32 at each process chamber 30, owing to guaranteeing common maintenance area at a plurality of process chambers 30, therefore maximization that also can restraining device from this viewpoint.
Further, in the situation that cover body opening/closing mechanism 6 being configured to type shape, one of cover body opening/closing mechanism 6 distolaterally moves along inner track 62, and another is distolateral moves along outer side track 63.Therefore, because load is dispersed, therefore can move by lid maintaining body 7 lid 32 being lifted with stable state.As mentioned above, because process chamber 30 is suitable large-scale, lid 32 is also the weight of 10000kg left and right, therefore move with the state of scatteredload, advantage is very large.
Further, cover body opening/closing mechanism 6 arranges respectively with process chamber 30, can, about inner track 62, outer side track 63, after coincideing, arrange with the structure of process chamber 30, vacuum carrying room 13.Therefore, can coordinate with substrate board treatment in the past and arrange, value be high.
Further, cover body opening/closing mechanism 6 along the periphery freedom of movement of vacuum carrying room 13 be set up, be usually located at the standby region different from process chamber 30.Therefore, even if this cover body opening/closing mechanism 6 is set, near the gate valve GV between process chamber 30 and vacuum carrying room 13, there is not barrier yet, do not hinder maintenance.In addition, by inner track 62 being arranged near the periphery of vacuum carrying room 13, the space that can guarantee to form at the top plate portion of vacuum carrying room 13 above-mentioned peristome 17.Therefore, also have the following advantages: where necessary, the substrate transferring mechanism 25 of vacuum carrying room 13 is taken out from this peristome 17, can safeguard.
In this embodiment, though inner track 62 can be set directly on the top board of vacuum carrying room 13, also can inner track 62 be set in support plate inner side, this support plate be arranged on the top board of vacuum carrying room 13.In such structure, have and can manufacture inner track 62 in other region, be then arranged at the advantage of vacuum carrying room 13 and so on.In addition, the pillar of supporting inner track 62 also can be set on the top board of vacuum carrying room 13, inner track 62 is set on pillar.
Then,, in conjunction with Fig. 9～Figure 11, other execution mode of the present invention is described.The difference of this execution mode and above-mentioned execution mode is: the inner track 91 that forms inner side guide member is arranged between process chamber 30 and vacuum carrying room 13, and then inner track 91 and outer side track 92 are arranged to the all-round of vacuum carrying room 13.By inner track 91 and outer side track 92 are arranged to the all-round of vacuum carrying room 13, for example, by the top of load lock 12 being set as possessing the lid of the maintained portion same with the maintained portion 5 of process chamber 30, the switching of the lid of load lock 12 also can be undertaken by cover body opening/closing mechanism 6.
The upper side of the gate valve GV of above-mentioned inner track 91 between process chamber 30 and vacuum carrying room 13 is set to concentric circles with respect to vacuum carrying room 13 center.And by being arranged at the pillar 93 in the region that does not have gate valve GV, the mode supporting for inner track 91 forms.And outer side track 92, in process chamber 30 and contrary side vacuum carrying room 13, is concentric circles with respect to vacuum carrying room 13 center, is set up with the state being supported by pillar 94.
Example shown in Figure 10, be configured to inner track 91 and outer side track 92 are arranged to the position lower than the upper surface of process chamber 30, example shown in Figure 11, is configured to inner track 91 and outer side track 92 is arranged to the position higher than the upper surface of process chamber 30.Structure about other is identical with above-mentioned execution mode.
In these examples, because cover body opening/closing mechanism 6 moves the periphery along vacuum carrying room 13 on inner track 91 and outer side track 92, therefore identical with above-mentioned execution mode, maximization that can restraining device, suppresses the increase of floor space.In addition, inner track 91 is by being arranged at the upper side of gate valve GV, and the surrounding that can be arranged at vacuum carrying room 13 is all.Therefore, cover body opening/closing mechanism 6 can be in the surrounding of vacuum carrying room 13 around movement, therefore be easy to mobile control.
In addition, with above-mentioned execution mode in the same manner, owing to cover body opening/closing mechanism 6 being configured to a type shape, therefore can be under the state of scatteredload, so that the stable state of lid 32 moves, inner track 91, outer side track 92, cover body opening/closing mechanism 6, can be in substrate board treatment setting in the past.Further, because inner track 91 is arranged at the outside of vacuum carrying room 13, therefore can form above-mentioned peristome 17 at the top plate portion of vacuum carrying room 13, be convenient to safeguard.
Above, inner track also can be configured to, and by being arranged under the state that the pillar of the surrounding of vacuum carrying room 13 is supported, is arranged at the top board of vacuum carrying room 13.In addition, in the situation that the weight that process chamber 30 is small-sized grade, lid 32 is lightweight, cover body opening/closing mechanism 6 is not limited to a type shape, be configured to from vacuum carrying room 13 sides or with the either party of the contrary side of vacuum carrying room 13 and extend to process chamber 30, also can be configured to only by one-sided supporting.In this case, guide member be arranged at vacuum carrying room 13 sides or with the either party of the contrary side of vacuum carrying room 13.
The mode that also a plurality of cover body opening/closing mechanisms 6 can be moved with the guide member along common in addition, arranges.Further, the plan view shape of vacuum carrying room 13 is not limited to regular polygon shape, is not limited to the situation that a plurality of process chambers are configured to mutually identical shape.In addition, the number of the process chamber 30 being connected with vacuum carrying room 13, can be plural any number, and the lid reversing device 4 of lid 32 may not be set.Further, in the situation that lid reversing device 4 is set, can suitably select the process chamber 30 of surrounding and the arrangement of lid reversing device 4 of vacuum carrying room 13.Further, for the drive division that moving body is moved along guide member, can be also the slide block moving along guide member by motor.Further, the elevating mechanism of lifting lid maintaining body 7 can be configured to, and in the upper end of hook parts 71a, 71a, movable body is set, and is formed with the lifting shaft rotation of ridge, thereby makes above-mentioned movable body increase along lifting shaft at this movable body.
In addition, the maintained portion 5 that is arranged at lid 32 is the structure that supplies lid maintaining body 7 liftings and lift maintained portion 5, and the shape of maintained portion 5 is not limited to this, also can be arranged at the side of lid 32.In addition, lid 32 may not arrange maintained portion 5, also can magnet be set in the lower end of lid maintaining body 7, by this magnet sorption, keeps lid to lift.
Claims (6)
1. a substrate board treatment, is characterized in that, possesses:
Vacuum carrying room, it is provided with substrate transferring mechanism, and is maintained vacuum environment;
Preparatory vacuum chamber, it is connected with the side of this vacuum carrying room;
For the treatment of a plurality of process chambers of substrate, they,, to be connected with the side of described vacuum carrying room and to be mutually disposed at circumferentially in circumferentially separated mode with described preparatory vacuum chamber, and arrange lid on each container body;
Guide member, it is set to the circumferential extension along described vacuum carrying room;
Moving body, it is directed along this guide member;
Lid maintaining body, it is arranged at this moving body to pass through the mode of the top of described process chamber by the movement of this moving body, keeps lid and makes this lid lifting, so that with respect to described container body mounting or dismounting lid;
Drive division, it is for making described moving body move along described guide member.
2. substrate board treatment according to claim 1, is characterized in that,
Below being provided with in horizontal expansion, being included in, be formed with the maintained portion of the locking part in space on described lid,
On described lid maintaining body, be provided with maintaining part, Yi Bian this maintaining part moves and enters the described space that locks the lower side of part along described guide member on one side, rise afterwards and from lower side, described locking part pushed away to lift lid.
3. substrate board treatment according to claim 1 and 2, is characterized in that,
Described guide member possesses:
Inner side guide member, it is arranged on described vacuum carrying room or is arranged between described vacuum carrying room and process chamber;
Guided outside parts, it is arranged on respect to described process chamber and a side contrary with described vacuum carrying room.
4. substrate board treatment according to claim 1 and 2, is characterized in that,
The plan view shape of described vacuum carrying room forms polygon,
In the middle of the side of described vacuum carrying room, except the foreign side's side at described vacuum carrying room is for guaranteeing other sides the side of maintenance area, connect respectively described preparatory vacuum chamber and process chamber.
5. substrate board treatment according to claim 4, is characterized in that,
In described maintenance area, be provided with and keep the lid coming from described lid maintaining body handing-over the lid reversing device that makes this lid reversion.
6. substrate board treatment according to claim 4, is characterized in that,
Described vacuum carrying room has six sides, in described side, connects a described preparatory vacuum chamber and four process chambers.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010-130153 | 2010-06-07 | ||
| JP2010130153 | 2010-06-07 | ||
| JP2010133091A JP5488227B2 (en) | 2010-06-07 | 2010-06-10 | Substrate processing equipment |
| JP2010-133091 | 2010-06-10 |
Publications (2)
| Publication Number | Publication Date |
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| CN102270565A CN102270565A (en) | 2011-12-07 |
| CN102270565B true CN102270565B (en) | 2014-03-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110158579.0A Expired - Fee Related CN102270565B (en) | 2010-06-07 | 2011-06-07 | Substrate processing device |
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| KR101905289B1 (en) * | 2014-03-28 | 2018-10-05 | 가부시키가이샤 스크린 홀딩스 | Substrate processing device and substrate processing method |
| DE102018103949A1 (en) | 2018-02-21 | 2019-08-22 | Christof-Herbert Diener | Low-pressure plasma chamber, low-pressure plasma system and method for producing a low-pressure plasma chamber |
| CN110299301B (en) * | 2018-03-23 | 2021-11-16 | 北京北方华创微电子装备有限公司 | Uncapping mechanism for multi-cavity transmission device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW480592B (en) * | 1999-12-22 | 2002-03-21 | Tokyo Electron Ltd | Vacuum processing apparatus for semiconductor process |
| CN1608318A (en) * | 2001-12-25 | 2005-04-20 | 东京毅力科创株式会社 | Processed body carrying device, and processing system with carrying device |
| CN2795158Y (en) * | 2002-04-12 | 2006-07-12 | 东京毅力科创株式会社 | Port structure in semiconductor processing device |
| CN101048327A (en) * | 2004-10-25 | 2007-10-03 | 东京毅力科创株式会社 | Carrying system, substrate treating device, and carrying method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP4784599B2 (en) * | 2007-12-28 | 2011-10-05 | 東京エレクトロン株式会社 | Vacuum processing apparatus, vacuum processing method, and storage medium |
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2011
- 2011-06-02 KR KR1020110053341A patent/KR101258350B1/en not_active IP Right Cessation
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW480592B (en) * | 1999-12-22 | 2002-03-21 | Tokyo Electron Ltd | Vacuum processing apparatus for semiconductor process |
| CN1608318A (en) * | 2001-12-25 | 2005-04-20 | 东京毅力科创株式会社 | Processed body carrying device, and processing system with carrying device |
| CN2795158Y (en) * | 2002-04-12 | 2006-07-12 | 东京毅力科创株式会社 | Port structure in semiconductor processing device |
| CN101048327A (en) * | 2004-10-25 | 2007-10-03 | 东京毅力科创株式会社 | Carrying system, substrate treating device, and carrying method |
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| CN102270565A (en) | 2011-12-07 |
| KR101258350B1 (en) | 2013-04-30 |
| KR20110134283A (en) | 2011-12-14 |
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