CN105702598A - Method and device for judging whether wafers are lifted normally or not - Google Patents
Method and device for judging whether wafers are lifted normally or not Download PDFInfo
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- CN105702598A CN105702598A CN201610210232.9A CN201610210232A CN105702598A CN 105702598 A CN105702598 A CN 105702598A CN 201610210232 A CN201610210232 A CN 201610210232A CN 105702598 A CN105702598 A CN 105702598A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
Abstract
The invention discloses a method and device for judging whether wafers are lifted normally or not, and relates to the technical field of a semiconductor technology. Through adoption of the method and the device, whether the wafers are lifted normally or not can be judged; if the wafers are not lifted normally, a follow-up step of taking out the wafers by a manipulator is stopped; the wafers which are not lifted normally are adjusted; and therefore, the probability that the manipulator fails to take out the wafers, such as that the wafers are damaged for that the manipulator impacts the wafers, is reduced. The method for judging whether the wafers are lifted normally or not comprises following steps of when multiple ejector pins for supporting the wafers rise, measuring the resistance value between any two ejector pins in the multiple ejector pins; at least measuring one resistance value corresponding to each ejector pin; judging whether there are resistance values in all resistance values conforming to a preset abnormal condition; and if there are the resistance values conforming to the preset abnormal condition, confirming that the wafers are not lifted normally. The method and the device provided by the invention are mainly applied in the wafer take-out process after the semiconductor technology is finished.
Description
Technical field
The present invention relates to semiconductor process technique field, particularly relate to a kind of method and device thereof judging whether wafer normally rise。
Background technology
In IC chip manufacture process, need wafer is carried out various types of processing technique, such as include photoetching, etching, ion implanting, metal deposit, die package etc., as depicted in figs. 1 and 2, in a lot of techniques, need first to be positioned on the chuck 2 in semiconductor processing equipment reaction chamber by wafer 1, then wafer 1 is carried out technological operation。Chuck 2 is mainly used in wafer 1 is fixed, wafer 1 is arranged below multiple thimble 3, as shown in Figure 3, after technique terminates, chuck 2 discharges fixing for wafer 1, multiple thimbles 3 are held wafer 1 and are raised up to predeterminated position afterwards, and then mechanical hand moves to wafer 1 place and carries out taking sheet, then outside wafer 1 is delivered to chamber。
According to the difference of fixed form, chuck 2 can be divided into electrostatic chuck and mechanical chuck。As it is shown in figure 1, be embedded with chuck electrode inside electrostatic chuck, in technical process, chuck electrode is loaded DC voltage, producing the electrostatic force attracted each other between chuck electrode and wafer, thus being fixed on chuck 2 by wafer 1, chuck electrode electric discharge being discharged fixing for wafer 1；As in figure 2 it is shown, mechanical chuck surrounding is provided with pressure ring, pressure ring contacts with wafer 1 under cylinder draws, and is fixed on chuck 2 by mechanical pressure by wafer 1, is raised by the pressure ring of mechanical chuck 2 and discharges fixing for wafer 1。But, chuck 2 in the process of releasing wafer it is possible that problem, for instance, for electrostatic chuck, technique may be insufficient to chuck electrode electric discharge after terminating, and causes to form electric field by residual charge on wafer 1, it would still be possible to make wafer 1 be adsorbed on chuck 2, cause bonding die phenomenon, when now thimble 3 performs rise action, it is possible to wafer 1 can be caused to tilt, carry out taking sheet to wafer place if in this case being moved by mechanical hand, mechanical hand can clash into wafer 1, causes taking sheet failure；For mechanical chuck, owing to working continuously, the part that pressure ring contacts with wafer 1 is often polluted by process byproducts, when build-up of process by-products is more, after technique terminates, it is possible to the adhesion of wafer 1 and pressure ring can be caused, wafer 1 may be driven when being raised by pressure ring to tilt even to make wafer 1 to be sticked up by pressure ring, taking sheet if in this case being moved by mechanical hand to predetermined position, mechanical hand may clash into wafer 1 or take less than wafer 1, causes taking sheet failure。
Summary of the invention
In view of this, the embodiment of the present invention provides a kind of method and device thereof judging whether wafer normally rise, can interpolate that whether wafer normally rises, if wafer rises abnormal, stop follow-up mechanical hand and take sheet, and the abnormal wafer risen is adjusted, cause the mechanical hands such as wafer damage to take the probability that sheet is failed to reduce mechanical hand to clash into wafer。
For reaching above-mentioned purpose, present invention generally provides following technical scheme:
On the one hand, it is provided that a kind of method judging whether wafer normally rises, described bottom of wafer is conductor or quasiconductor, and described determination methods includes:
After the multiple thimbles supporting described wafer rise, measure the resistance value between any two thimble in the plurality of thimble, and a described resistance value at least measured by corresponding each thimble:
Judge whether whole described resistance value exists the resistance value meeting default abnormal condition；
If existing, then confirm that described wafer does not normally rise。
Specifically, described judge whether whole described resistance value exists the resistance value not meeting default abnormal condition particularly as follows:
Judge whether whole described resistance value exists infinitely-great resistance value；
Specifically, if described exist, then confirm described wafer not normally rise particularly as follows:
If there is infinitely-great resistance value, then confirm that described wafer does not normally rise。
Specifically, the above-mentioned method judging whether wafer normally rises, also include:
If whole described resistance values are finite value, then confirm that described wafer normally rises。
Specifically, in the plurality of thimble of described measurement resistance value between any two thimble particularly as follows:
Make in multiple thimbles to be measured first thimble ground connection in any two thimble, make in multiple thimbles to be measured second thimble in any two thimble connect power input；
Obtain the current value flow through between described first thimble and described second thimble, if the current value flow through between described first thimble and described second thimble is zero, then confirm that the resistance value between described first thimble and described second thimble is infinity。
Specifically, the above-mentioned method judging whether wafer normally rises, also include:
When confirming described wafer for normally not rising, outputting alarm information and stopping take sheet instruction。
On the other hand, it is provided that a kind of device judging whether wafer normally rises, described bottom of wafer is conductor or quasiconductor, and described judgment means includes:
Measurement module, after rising when the multiple thimbles supporting described wafer, measures the resistance value between any two thimble in the plurality of thimble, and a described resistance value is at least measured by corresponding each thimble；
Judge module, for judging whether there is, in whole described resistance value, the resistance value meeting default abnormal condition；
Confirming module, if judging that for judge module whole described resistance value exists the resistance value meeting default abnormal condition, then confirming that described wafer does not normally rise。
Described judge module, specifically for judging whether there is infinitely-great resistance value in whole described resistance value；
Described confirmation module, if judging there is infinitely-great resistance value specifically for judge module, then confirms that described wafer does not normally rise。
Described confirmation module, if being additionally operable to judge module to judge that whole described resistance value is finite value, then confirms that described wafer normally rises。
Specifically, described measurement module includes:
Loop access unit, for when measuring in the plurality of thimble the resistance value between any two thimble, make in multiple thimbles to be measured first thimble ground connection in any two thimble, make in multiple thimbles to be measured second thimble in any two thimble connect power input；
Electric current acquiring unit, for when measuring in the plurality of thimble the resistance value between any two thimble, obtaining the current value flow through between described first thimble and described second thimble；
Described judge module specifically for, when measuring in the plurality of thimble the resistance value between any two thimble, if the current value flow through between described first thimble and described second thimble is zero, then judge whether the resistance value between described first thimble and described second thimble is infinitely great。
Specifically, the above-mentioned device judging whether wafer normally rises, also include:
Alarm module, for when confirming described wafer for normally not rising, outputting alarm information and stopping take sheet instruction。
Method and the device thereof judging whether wafer normally rise provided by the invention, can be that infinity judges that wafer is normally do not rise by the resistance value between two thimbles, if loop can not be formed between the two thimble and wafer, illustrate that wafer does not all contact with the two thimble, namely wafer is not for normally to rise, according to judged result, now stop follow-up mechanical hand and take sheet, the abnormal wafer risen is adjusted, causes the mechanical hands such as wafer damage to take the probability that sheet is failed to reduce mechanical hand to clash into wafer。
Accompanying drawing explanation
Fig. 1 is structural representation during electrostatic chuck fixed wafer in prior art；
Fig. 2 is structural representation during mechanical chuck fixed wafer in prior art；
Fig. 3 is thimble structural representation during wafer from chuck pop-up in prior art；
Fig. 4 is the structural representation of a kind of ejector pin mechanism in the embodiment of the present invention；
Fig. 5 is the structural representation of a kind of semiconductor processing equipment in the embodiment of the present invention；
Fig. 6 is a kind of flow chart judging method that whether wafer normally rise in the embodiment of the present invention；
Fig. 7 is the another kind of flow chart judging method that whether wafer normally rise in the embodiment of the present invention；
Fig. 8 is a kind of structured flowchart judging device that whether wafer normally rise in the embodiment of the present invention；
Fig. 9 is the structured flowchart of a kind of measurement module in the embodiment of the present invention；
Figure 10 is the another kind of structural representation judging device that whether wafer normally rise in the embodiment of the present invention；
Figure 11 is the another kind of structural representation judging device that whether wafer normally rise in the embodiment of the present invention。
Detailed description of the invention
Below in conjunction with drawings and Examples, the present invention is described in further detail。
The embodiment of the present invention provides a kind of method judging whether wafer normally rises, for ejector pin mechanism, as shown in Figure 4 and Figure 5, above-mentioned ejector pin mechanism includes thimble chassis 4 and multiple thimble 3, thimble 3 is fixedly connected on thimble chassis 4, thimble 3 is used for holding up wafer 1, wafer 1 is wafer that bottom is conductor or quasiconductor, in semiconductor fabrication process, most bottom of wafer is conductor or quasiconductor, the present embodiment is applicable to judge whether such wafer normally rises, and as shown in Figure 6, the above-mentioned method judging whether wafer normally rises includes:
Step 101, when support wafer 1 multiple thimbles 3 rise after, measure the resistance value between any two thimble 3 in multiple thimble, and a described resistance value at least measured by corresponding each thimble 3, described thimble 3 is made up of conductor material。
Step 102, judge whether whole described resistance value exists the resistance value meeting default abnormal condition。
It should be noted that default abnormal condition is resistance value is infinitely-great resistance。
If step 103 exists the resistance value meeting default abnormal condition, then confirm that wafer 1 does not normally rise。
If wafer 1 rises, each thimble 3 with wafer 1 base contact, when the resistance value judged between any two thimble 3 meets the resistance value of abnormal condition, then can illustrate that the two thimble 3 does not form loop with wafer 1, namely wafer 1 does not contact with all of thimble 3, it is judged that wafer 3 is not for normally to rise。
It should be noted that for the number of thimble in ejector pin mechanism and be not construed as limiting, as long as wafer can be supported, usual ejector pin mechanism has 3 to 6 thimbles, it is preferred that thimble quantity is 4。Ejector pin mechanism is generally arranged in the reaction chamber of semiconductor processing equipment, as it is shown in figure 5, be provided with chuck 2 and above-mentioned ejector pin mechanism in this reaction chamber。This semiconductor processing equipment can be plasma etching equipment etc., as long as need chuck 2 that wafer 1 is fixed, then carries out the semiconductor processing equipment of PROCESS FOR TREATMENT, can apply the scheme in the present embodiment。
The present embodiment judges the method whether wafer normally rises, it is that infinity judges that wafer is normally do not rise by the resistance value between two thimbles, if loop can not be formed between the two thimble and wafer, illustrate that wafer does not all contact with the two thimble, namely wafer is not for normally to rise, according to judged result, now stop follow-up mechanical hand and take sheet, the abnormal wafer risen is adjusted, causes the mechanical hands such as wafer damage to take the probability that sheet is failed to reduce mechanical hand to clash into wafer。
Specifically, above-mentioned judge whether whole described resistance value exists the resistance value not meeting default abnormal condition, if existing, then confirm that described wafer does not normally rise to include: judge whether whole described resistance value exists infinitely-great resistance value, if there is infinitely-great resistance value, then confirm that described wafer does not normally rise。
If wafer 1 is normal rise, the then base contact of each thimble 3 and wafer 1, in all thimbles 3, it is infinitely great simply by the presence of the resistance value between two thimbles 3, then illustrate that the two thimble 3 does not form loop with wafer 1, namely wafer 1 does not contact with all of thimble 3, it is judged that wafer 3 is not for normally to rise。
As it is shown in fig. 7, specifically, the above-mentioned method judging whether wafer normally rises can also include:
If the whole described resistance value of step 104 is finite value, then confirm that described wafer normally rises, if wafer 1 is normal rise, the then base contact of each thimble 3 and wafer 1, now, any two of which thimble 3 all forms loop with wafer 1, and namely the resistance value between any two thimble 3 is finite value。
Specifically, in the multiple thimble of above-mentioned measurement, the resistance value between any two thimble 3 includes: make in multiple thimbles to be measured first thimble ground connection in any two thimble 3, makes in multiple thimbles to be measured second thimble in any two thimble 3 connect power input；Obtain the current value flow through between the first thimble and the second thimble, if the current value flow through between this first thimble and second thimble is zero, the resistance value then confirmed between the first thimble and the second thimble is infinity, namely illustrates not formed between the first thimble and the second thimble and wafer loop；If after the first thimble ground connection and the second thimble connect power input, wafer and the first thimble and the second thimble all contact, then form loop between the first thimble and the second thimble, and have electric current to flow through, then confirm that the resistance value between the first thimble and the second thimble is finite value。It is finite value or infinity is comparatively difficult to realize automatic decision resistance value by software, judges that whether current value is zero then fairly simple, therefore can by judging that whether current value is that zero to carry out reflected resistance value be finite value or infinitely great。
Step 105, when confirming wafer 1 for normally not rising, outputting alarm information and stopping take sheet instruction, warning information can pass through such as to be exported by display lamp or buzzer etc., stop taking sheet instruction to control semiconductor processing equipment and stop subsequent mechanical hands and take sheet action simultaneously, wait that operator solve the problem that wafer does not normally rise。
As shown in Figure 8, the embodiment of the present invention also provides for a kind of device judging whether wafer normally rises, this wafer is the bottom wafer for conductor or quasiconductor, this judgment means includes: measurement module 6, after rising when the multiple thimbles 3 supporting wafer 1, measure the resistance value between any two thimble 3 in multiple thimble 3, and a resistance value at least measured by corresponding each thimble 3；Judge module 7, for judging whether there is the resistance value meeting default abnormal condition in whole resistance value；Confirm module 8, if for judging whole described resistance value exists the resistance value meeting default abnormal condition, then confirming that wafer 1 does not normally rise。
Judge that method that whether wafer normally rise and principle can be same as the previously described embodiments, do not repeat them here。
The present embodiment judges the device whether wafer normally rises, can be that infinity judges that wafer is normally do not rise by the resistance value between two thimbles, if loop can not be formed between the two thimble and wafer, illustrate that wafer does not all contact with the two thimble, namely wafer is not for normally to rise, according to judged result, now stop follow-up mechanical hand and take sheet, the abnormal wafer risen is adjusted, causes the mechanical hands such as wafer damage to take the probability that sheet is failed to reduce mechanical hand to clash into wafer。
As shown in Figure 8, specifically, it is judged that module 7 specifically may include that and judges whether there is infinitely-great resistance value in whole described resistance value。If confirming, module 8 specifically may include that judge module is judged to there is infinitely-great resistance value, then confirm that described wafer does not normally rise。Confirm that module 8 specifically can also include: if judge module judges that whole described resistance value is finite value, then confirm that described wafer normally rises。
As shown in Figure 9, specifically, measurement module 6 may include that loop access unit 61, for when measuring in multiple thimbles 3 resistance value between any two thimble 3, make in multiple thimbles 3 to be measured first thimble ground connection in any two thimble 3, make in multiple thimbles 3 to be measured second thimble in any two thimble 3 connect power input；Electric current acquiring unit 62, for when measuring in multiple thimbles 3 resistance value between any two thimble 3, obtaining the current value flow through between the first thimble and the second thimble；Confirm module 8 specifically for, when measuring in multiple thimbles 3 resistance value between any two thimble 3, it is judged that if the current value flow through between the first thimble and the second thimble is zero, then confirm that the resistance value between the first thimble and the second thimble is infinity。
As shown in Figure 10, loop access unit 61 may include that multiple thimble link 5, figure illustrates 4 thimble links 5, thimble link 5 is used for connecting thimble, wherein, each thimble link 5 connects a thimble, and thimble link 5 includes a first thimble link 51 and a second thimble link 52, and the first thimble link 51 switchs K ground connection respectively through one；First resistance R1, the second thimble link 52 switchs K respectively through one and is connected to first end of the first resistance R1, and second end of the first resistance R1 is connected to power input Vcc；Above-mentioned electric current acquiring unit 62, is connected to the two ends of the first resistance R1, for obtaining the current value flowing through the first resistance R1；Above-mentioned judge module 7, is connected to electric current acquiring unit 62, for when the current value flowing through the first resistance R1 is zero, it is judged that whether resistance value exists infinite resistance value；Switch control module (not shown), is connected to each switch K, after rising when the thimble supporting described wafer, controls to be connected two switch K conductings with thimble link 5, controls the switch K cut-off not being connected with described thimble link 5。
At semiconductor processing equipment, wafer is carried out in the process of technological operation, such as, in the process of plasma etching, control switch K and be cut-off state, technological operation will not be impacted by the thimble to ensure conductor material, when the technological operation of wafer terminates, after thimble rises, need to carry out mechanical hand when taking sheet, control two switch K conductings that thimble link 5 connects again, to measure current value between two thimbles that thimble link 5 connects, if this current value is zero, then judge that the resistance value between the two thimble is as infinitely great, namely illustrate not form loop between the two thimble and wafer, confirm that wafer is not for normally to rise；If this current value is not zero, the resistance value then illustrated between the two thimble is finite value, namely loop is formed between the two thimble and wafer, may determine that wafer is normal rise, certainly, in order to improve the accuracy of judgement, resistance value between more thimbles can also be judged, now control two other switch K cut-off that thimble link 5 connects, control two other switch K conducting that thimble link 5 connects, judge whether the resistance value between two thimbles that described thimble link 5 connects is infinitely great in the same way, by that analogy, resistance value between multiple thimbles is measured。As long as having the resistance value between thimble is infinity, then confirm that wafer is not for normally to rise。
As shown in figure 11, electric current acquiring unit 62 includes: operational amplifier U1, its first input end is connected to first end of the first resistance R1, its second input is connected to second end of the first resistance R1, its outfan is connected to its second input by the second resistance R2, and its second input is also by the 3rd resistance R3 ground connection；Voltage follower U2, its first input end is connected to the outfan of operational amplifier U1 by the 4th resistance R4, and its first input end is also by the 5th resistance R5 ground connection, and its second input is connected to its outfan, its outfan is also by the 6th resistance R6 ground connection, and its outfan is connected to judge module 7；Judge module 7 specifically for, when the output end voltage of voltage follower U2 is zero, it is judged that whether resistance value is infinitely great。
Wherein, operational amplifier U1 output end voltage, wherein Rx accesses the resistance value between two thimble links 5 of circuit, i.e. resistance value between two thimbles when being and switch K conducting, and voltage follower U2 is used for filtering so that operational amplifier U1 output end voltage V1 can be judged module 7 reception and identify, at formulaIn, parameter Rx is unknown number, and is the part in denominator, if Rx is infinitely great, then V1=0, if Rx is finite value, then V1 be non-null value, it is judged that whether module 7 can be zero resistance value judging between the two thimble according to V1 as infinity or finite value。
Specifically, above-mentioned switch K can be relay, it is to be understood that, above-mentioned switch K can also be other kinds of gate-controlled switch。
Specifically, the above-mentioned device judging whether wafer normally rises can also include: alarm module (not shown), and for when confirming wafer 1 for normally not rising, outputting alarm information and stopping take sheet instruction。
The above, it it is only presently preferred embodiments of the present invention, not the present invention is done any pro forma restriction, according to any simple modification, equivalent variations and modification that above example is made by the technical spirit of the present invention, all still falls within the scope of technical solution of the present invention。
Claims (10)
1. judging the method whether wafer normally rises, wherein, described bottom of wafer is conductor or quasiconductor, it is characterised in that described method includes:
After the multiple thimbles supporting described wafer rise, measure the resistance value between any two thimble in the plurality of thimble, and a described resistance value at least measured by corresponding each thimble；
Judge whether whole described resistance value exists the resistance value meeting default abnormal condition；
If existing, then confirm that described wafer does not normally rise。
2. the method judging whether wafer normally rises according to claim 1, it is characterised in that described judge that whether there is, in whole described resistance value, the resistance value not meeting default abnormal condition includes:
Judge whether whole described resistance value exists infinitely-great resistance value；
Exist if described, then confirm that described wafer does not normally rise and include:
If there is infinitely-great resistance value, then confirm that described wafer does not normally rise。
3. the method judging whether wafer normally rises according to claim 2, it is characterised in that described judge whether whole described resistance value exists infinitely-great resistance value after, described method also includes:
If whole described resistance values are finite value, then confirm that described wafer normally rises。
4. the method judging whether wafer normally rises according to claim 2, it is characterised in that resistance value between any two thimble in the plurality of thimble of described measurement particularly as follows:
Make in multiple thimbles to be measured first thimble ground connection in any two thimble, make in multiple thimbles to be measured second thimble in any two thimble connect power input；
Obtain the current value flow through between described first thimble and described second thimble, if the current value flow through between described first thimble and described second thimble is zero, then confirm that the resistance value between described first thimble and described second thimble is infinity。
5. the method judging whether wafer normally rises according to claim 1, it is characterised in that exist if described, then, after confirming that described wafer does not normally rise, also include:
When confirming that described wafer does not normally rise, outputting alarm information and stopping take sheet instruction。
6. judge that the device whether wafer normally rises, described bottom of wafer are conductor or quasiconductor, it is characterised in that described judgment means includes:
Measurement module, after rising when the multiple thimbles supporting described wafer, measures the resistance value between any two thimble in the plurality of thimble, and a described resistance value is at least measured by corresponding each thimble；
Judge module, for judging whether there is, in whole described resistance value, the resistance value meeting default abnormal condition；
Confirming module, if judging that for judge module whole described resistance value exists the resistance value meeting default abnormal condition, then confirming that described wafer does not normally rise。
7. the device judging whether wafer normally rises according to claim 6, it is characterised in that
Described judge module, specifically for judging whether there is infinitely-great resistance value in whole described resistance value；
Described confirmation module, if judging there is infinitely-great resistance value specifically for judge module, then confirms that described wafer does not normally rise。
8. the device judging whether wafer normally rises according to claim 7, it is characterised in that
Described confirmation module, if being additionally operable to judge module to judge that whole described resistance value is finite value, then confirms that described wafer normally rises。
9. the device judging whether wafer normally rises according to claim 8, it is characterised in that described measurement module includes:
Loop access unit, for when measuring in the plurality of thimble the resistance value between any two thimble, make in multiple thimbles to be measured first thimble ground connection in any two thimble, make in multiple thimbles to be measured second thimble in any two thimble connect power input；
Electric current acquiring unit, for when measuring in the plurality of thimble the resistance value between any two thimble, obtaining the current value flow through between described first thimble and described second thimble；
Described confirmation module specifically for, when measuring in the plurality of thimble the resistance value between any two thimble, if the current value flow through between described first thimble and described second thimble is zero, then confirm that the resistance value between described first thimble and described second thimble is infinity。
10. the device judging whether wafer normally rises according to claim 9, it is characterised in that also include:
Alarm module, for when confirming that described wafer does not normally rise, outputting alarm information and stopping take sheet instruction。
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| CN112063979A (en) * | 2019-06-11 | 2020-12-11 | 北京北方华创微电子装备有限公司 | Semiconductor processing device and related magnetron sputtering device |
| WO2020248868A1 (en) * | 2019-06-11 | 2020-12-17 | 北京北方华创微电子装备有限公司 | Semiconductor processing device and magnetron sputtering device |
| KR20210110688A (en) * | 2019-06-11 | 2021-09-08 | 베이징 나우라 마이크로일렉트로닉스 이큅먼트 씨오., 엘티디. | Semiconductor processing equipment and magnetron sputtering equipment |
| CN112063979B (en) * | 2019-06-11 | 2023-12-22 | 北京北方华创微电子装备有限公司 | Semiconductor processing device and related magnetron sputtering device |
| KR102636473B1 (en) * | 2019-06-11 | 2024-02-14 | 베이징 나우라 마이크로일렉트로닉스 이큅먼트 씨오., 엘티디. | Semiconductor processing equipment and magnetron sputtering equipment |
| CN112635382A (en) * | 2020-12-14 | 2021-04-09 | 华虹半导体(无锡)有限公司 | Fixing device for back thinning wafer |
| CN112635382B (en) * | 2020-12-14 | 2022-12-27 | 华虹半导体(无锡)有限公司 | Fixing device for back thinning wafer |
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| CN105702598B (en) | 2018-09-18 |
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