CN105690586A

CN105690586A - Silicon rod slicing process

Info

Publication number: CN105690586A
Application number: CN201610202149.7A
Authority: CN
Inventors: 张力峰; 田利中; 白青松; 邹文龙; 梁会宁
Original assignee: SUZHOU JINGYING PHOTOELECTRIC TECHNOLOGY CO LTD
Current assignee: SUZHOU JINGYING PHOTOELECTRIC TECHNOLOGY CO LTD
Priority date: 2016-03-31
Filing date: 2016-03-31
Publication date: 2016-06-22

Abstract

The invention discloses a silicon rod slicing process with low usage amount of cutting wires. A slicing machine is adopted to slice a silicon rod; firstly, the cleaned silicon rod, a glass plate and a crystal support are bonded in sequence; then, the crystal support is fixed on the slicing machine; mortar is sprayed to the cutting wires by nozzles on two sides of the silicon rod, so that the cutting wires are fully coated with the mortar; a movement mode of the cutting wires is advancement by a distance A, retreating by a distance of B and advancement by the distance of A; and the mortar comprises the following components in percentage by weight: 5% of polyether alkanolamine comb polymer, 4.2% of ethylene oxide and propylene oxide reverse copolymerized polyether, 0.5% of fatty ethylene oxide and propylene oxide derivative low-foam surface active agent, 0.5% of sodium succinate salt, 80% of polyols and addition products thereof, 2.4% of water soluble low-foam phosphate and derivatives thereof, and the balance of water. The silicon rod slicing process has the following advantages: the cutting wires are used for cutting in a reciprocating manner; and meanwhile, the proper mortar is used for reducing the usage amount of the cutting wires, so that the production cost is reduced.

Description

Silicon rod slicing technique

Technical field

The present invention relates to a kind of silicon rod slicing technique。

Background technology

Silicon rod cutting is an important step in silicon wafer production technique, special line of cut is needed when cutting, because to avoid broken string when cutting as far as possible, usually line of cut is once by also cutting silicon rod, frequent broken string can cause the phenomenons such as cutting deformation silicon wafer variable thickness, damage, therefore line of cut cannot re-use after having cut silicon rod and belong to expendable consumed product, line of cut make consumption still very big, cause the wasting of resources。

Summary of the invention

The technical problem to be solved is: provide the silicon rod slicing technique that a kind of line of cut makes consumption few。

For solving above-mentioned technical problem, the technical solution used in the present invention is: a kind of silicon rod slicing technique, adopt microtome that silicon rod is cut into slices, it is specially first by cleaned silicon rod, glass plate and crystal holder stick together successively, then crystal holder is fixed on microtome, first start motor driven roller to rotate together with line of cut, line of cut is carried out spray furnace by the nozzle of silicon rod both sides, make line of cut fills mortar, the motion mode of line of cut is advance A distance, retreat B distance, readvance A distance, retreat B distance, the like, crystal holder drives silicon rod to move down and make line of cut cutting silicon rod until silicon rod is completely cut-off, wherein A > B, the weight percent composition of mortar is polyether chain alkanolamine comb-shaped polymer 5%, oxirane and the reverse copolyether 4.2% of expoxy propane, aliphatic oxirane and propylene oxide derivatives low foaming surfactant 0.5%, succinic acid sodium salt 0.5%, polyhydric alcohol and addition product 80% thereof, the low bubble phosphate ester of water solublity and derivant 2.4% thereof, all the other are water。

The invention has the beneficial effects as follows: utilize line of cut to come and go cutting, use suitable mortar to reduce the consumption that makes of line of cut simultaneously, reduce production cost。

Detailed description of the invention

Silicon rod slicing technique of the present invention, adopt microtome that silicon rod is cut into slices, it is specially first by cleaned silicon rod, glass plate and crystal holder stick together successively, then crystal holder is fixed on microtome, first start motor driven roller to rotate together with line of cut, line of cut is carried out spray furnace by the nozzle of silicon rod both sides, make line of cut fills mortar, crystal holder drives silicon rod to move down and make line of cut cutting silicon rod until silicon rod is completely cut-off, the motion mode of line of cut is advance A distance, retreat B distance, readvance A distance, retreat B distance, the like, wherein A > B, the mode cutting silicon rod utilizing line of cut to come and go and to advance, the utilization rate of line of cut is made to reach under ensureing the continuous situation of line of cut maximum, the weight percent composition of mortar is polyether chain alkanolamine comb-shaped polymer 5%, oxirane and the reverse copolyether 4.2% of expoxy propane, aliphatic oxirane and propylene oxide derivatives low foaming surfactant 0.5%, succinic acid sodium salt 0.5%, polyhydric alcohol and addition product 80% thereof, the low bubble phosphate ester of water solublity and derivant 2.4% thereof, all the other are water。This mortar has the greasy property of excellence, dispersibility and appropriate wettability, it is possible to eliminates the stress phenomena between line of cut and silicon rod in cutting process, improves silicon wafer ratio defective product；Mortar also has and extremely strong carries performance, suspendability；Good heat dissipation effect；For aqueous, environmental protective product；Good rustless property, anti-rancid performance, product stability is good, long service life；Without ionic soil, effectively eliminate the pollution of metal ion especially iron ion；Efficiently solve the deposition problems again of cutting powder, it is to avoid the chemical bonding adsorption phenomena of silicon face, it is simple to the cleaning of silicon wafer and following process。After using above-mentioned mortar so that silicon rod is easier to cut, in conjunction with the cutting mode of reciprocation type, comparing with original, line of cut can save half, is substantially reduced production cost。

Claims

1. silicon rod slicing technique, it is characterized in that: adopt microtome that silicon rod is cut into slices, it is specially first by cleaned silicon rod, glass plate and crystal holder stick together successively, then crystal holder is fixed on microtome, first start motor driven roller to rotate together with line of cut, line of cut is carried out spray furnace by the nozzle of silicon rod both sides, make line of cut fills mortar, the motion mode of line of cut is advance A distance, retreat B distance, readvance A distance, retreat B distance, the like, crystal holder drives silicon rod to move down and make line of cut cutting silicon rod until silicon rod is completely cut-off, wherein A > B, the weight percent composition of mortar is polyether chain alkanolamine comb-shaped polymer 5%, oxirane and the reverse copolyether 4.2% of expoxy propane, aliphatic oxirane and propylene oxide derivatives low foaming surfactant 0.5%, succinic acid sodium salt 0.5%, polyhydric alcohol and addition product 80% thereof, the low bubble phosphate ester of water solublity and derivant 2.4% thereof, all the other are water。