CN105690586A - Silicon rod slicing process - Google Patents
Silicon rod slicing process Download PDFInfo
- Publication number
- CN105690586A CN105690586A CN201610202149.7A CN201610202149A CN105690586A CN 105690586 A CN105690586 A CN 105690586A CN 201610202149 A CN201610202149 A CN 201610202149A CN 105690586 A CN105690586 A CN 105690586A
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- CN
- China
- Prior art keywords
- silicon rod
- cut
- distance
- mortar
- line
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M173/00—Lubricating compositions containing more than 10% water
- C10M173/02—Lubricating compositions containing more than 10% water not containing mineral or fatty oils
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
- C10M2207/02—Hydroxy compounds
- C10M2207/021—Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms
- C10M2207/022—Hydroxy compounds having hydroxy groups bound to acyclic or cycloaliphatic carbon atoms containing at least two hydroxy groups
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
- C10M2207/10—Carboxylix acids; Neutral salts thereof
- C10M2207/12—Carboxylix acids; Neutral salts thereof having carboxyl groups bound to acyclic or cycloaliphatic carbon atoms
- C10M2207/125—Carboxylix acids; Neutral salts thereof having carboxyl groups bound to acyclic or cycloaliphatic carbon atoms having hydrocarbon chains of eight up to twenty-nine carbon atoms, i.e. fatty acids
- C10M2207/127—Carboxylix acids; Neutral salts thereof having carboxyl groups bound to acyclic or cycloaliphatic carbon atoms having hydrocarbon chains of eight up to twenty-nine carbon atoms, i.e. fatty acids polycarboxylic
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
- C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
- C10M2209/107—Polyethers, i.e. containing di- or higher polyoxyalkylene groups of two or more specified different alkylene oxides covered by groups C10M2209/104 - C10M2209/106
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2217/00—Organic macromolecular compounds containing nitrogen as ingredients in lubricant compositions
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2223/00—Organic non-macromolecular compounds containing phosphorus as ingredients in lubricant compositions
- C10M2223/02—Organic non-macromolecular compounds containing phosphorus as ingredients in lubricant compositions having no phosphorus-to-carbon bonds
- C10M2223/04—Phosphate esters
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2030/00—Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
- C10N2030/06—Oiliness; Film-strength; Anti-wear; Resistance to extreme pressure
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2030/00—Specified physical or chemical properties which is improved by the additive characterising the lubricating composition, e.g. multifunctional additives
- C10N2030/12—Inhibition of corrosion, e.g. anti-rust agents or anti-corrosives
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Organic Chemistry (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention discloses a silicon rod slicing process with low usage amount of cutting wires. A slicing machine is adopted to slice a silicon rod; firstly, the cleaned silicon rod, a glass plate and a crystal support are bonded in sequence; then, the crystal support is fixed on the slicing machine; mortar is sprayed to the cutting wires by nozzles on two sides of the silicon rod, so that the cutting wires are fully coated with the mortar; a movement mode of the cutting wires is advancement by a distance A, retreating by a distance of B and advancement by the distance of A; and the mortar comprises the following components in percentage by weight: 5% of polyether alkanolamine comb polymer, 4.2% of ethylene oxide and propylene oxide reverse copolymerized polyether, 0.5% of fatty ethylene oxide and propylene oxide derivative low-foam surface active agent, 0.5% of sodium succinate salt, 80% of polyols and addition products thereof, 2.4% of water soluble low-foam phosphate and derivatives thereof, and the balance of water. The silicon rod slicing process has the following advantages: the cutting wires are used for cutting in a reciprocating manner; and meanwhile, the proper mortar is used for reducing the usage amount of the cutting wires, so that the production cost is reduced.
Description
Technical field
The present invention relates to a kind of silicon rod slicing technique。
Background technology
Silicon rod cutting is an important step in silicon wafer production technique, special line of cut is needed when cutting, because to avoid broken string when cutting as far as possible, usually line of cut is once by also cutting silicon rod, frequent broken string can cause the phenomenons such as cutting deformation silicon wafer variable thickness, damage, therefore line of cut cannot re-use after having cut silicon rod and belong to expendable consumed product, line of cut make consumption still very big, cause the wasting of resources。
Summary of the invention
The technical problem to be solved is: provide the silicon rod slicing technique that a kind of line of cut makes consumption few。
For solving above-mentioned technical problem, the technical solution used in the present invention is: a kind of silicon rod slicing technique, adopt microtome that silicon rod is cut into slices, it is specially first by cleaned silicon rod, glass plate and crystal holder stick together successively, then crystal holder is fixed on microtome, first start motor driven roller to rotate together with line of cut, line of cut is carried out spray furnace by the nozzle of silicon rod both sides, make line of cut fills mortar, the motion mode of line of cut is advance A distance, retreat B distance, readvance A distance, retreat B distance, the like, crystal holder drives silicon rod to move down and make line of cut cutting silicon rod until silicon rod is completely cut-off, wherein A > B, the weight percent composition of mortar is polyether chain alkanolamine comb-shaped polymer 5%, oxirane and the reverse copolyether 4.2% of expoxy propane, aliphatic oxirane and propylene oxide derivatives low foaming surfactant 0.5%, succinic acid sodium salt 0.5%, polyhydric alcohol and addition product 80% thereof, the low bubble phosphate ester of water solublity and derivant 2.4% thereof, all the other are water。
The invention has the beneficial effects as follows: utilize line of cut to come and go cutting, use suitable mortar to reduce the consumption that makes of line of cut simultaneously, reduce production cost。
Detailed description of the invention
Silicon rod slicing technique of the present invention, adopt microtome that silicon rod is cut into slices, it is specially first by cleaned silicon rod, glass plate and crystal holder stick together successively, then crystal holder is fixed on microtome, first start motor driven roller to rotate together with line of cut, line of cut is carried out spray furnace by the nozzle of silicon rod both sides, make line of cut fills mortar, crystal holder drives silicon rod to move down and make line of cut cutting silicon rod until silicon rod is completely cut-off, the motion mode of line of cut is advance A distance, retreat B distance, readvance A distance, retreat B distance, the like, wherein A > B, the mode cutting silicon rod utilizing line of cut to come and go and to advance, the utilization rate of line of cut is made to reach under ensureing the continuous situation of line of cut maximum, the weight percent composition of mortar is polyether chain alkanolamine comb-shaped polymer 5%, oxirane and the reverse copolyether 4.2% of expoxy propane, aliphatic oxirane and propylene oxide derivatives low foaming surfactant 0.5%, succinic acid sodium salt 0.5%, polyhydric alcohol and addition product 80% thereof, the low bubble phosphate ester of water solublity and derivant 2.4% thereof, all the other are water。This mortar has the greasy property of excellence, dispersibility and appropriate wettability, it is possible to eliminates the stress phenomena between line of cut and silicon rod in cutting process, improves silicon wafer ratio defective product;Mortar also has and extremely strong carries performance, suspendability;Good heat dissipation effect;For aqueous, environmental protective product;Good rustless property, anti-rancid performance, product stability is good, long service life;Without ionic soil, effectively eliminate the pollution of metal ion especially iron ion;Efficiently solve the deposition problems again of cutting powder, it is to avoid the chemical bonding adsorption phenomena of silicon face, it is simple to the cleaning of silicon wafer and following process。After using above-mentioned mortar so that silicon rod is easier to cut, in conjunction with the cutting mode of reciprocation type, comparing with original, line of cut can save half, is substantially reduced production cost。
Claims (1)
1. silicon rod slicing technique, it is characterized in that: adopt microtome that silicon rod is cut into slices, it is specially first by cleaned silicon rod, glass plate and crystal holder stick together successively, then crystal holder is fixed on microtome, first start motor driven roller to rotate together with line of cut, line of cut is carried out spray furnace by the nozzle of silicon rod both sides, make line of cut fills mortar, the motion mode of line of cut is advance A distance, retreat B distance, readvance A distance, retreat B distance, the like, crystal holder drives silicon rod to move down and make line of cut cutting silicon rod until silicon rod is completely cut-off, wherein A > B, the weight percent composition of mortar is polyether chain alkanolamine comb-shaped polymer 5%, oxirane and the reverse copolyether 4.2% of expoxy propane, aliphatic oxirane and propylene oxide derivatives low foaming surfactant 0.5%, succinic acid sodium salt 0.5%, polyhydric alcohol and addition product 80% thereof, the low bubble phosphate ester of water solublity and derivant 2.4% thereof, all the other are water。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610202149.7A CN105690586A (en) | 2016-03-31 | 2016-03-31 | Silicon rod slicing process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610202149.7A CN105690586A (en) | 2016-03-31 | 2016-03-31 | Silicon rod slicing process |
Publications (1)
Publication Number | Publication Date |
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CN105690586A true CN105690586A (en) | 2016-06-22 |
Family
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Family Applications (1)
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CN201610202149.7A Pending CN105690586A (en) | 2016-03-31 | 2016-03-31 | Silicon rod slicing process |
Country Status (1)
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CN (1) | CN105690586A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107379294A (en) * | 2017-07-20 | 2017-11-24 | 阜宁协鑫光伏科技有限公司 | The method of diamond wire recycling cutting silicon chip |
CN108357003A (en) * | 2018-05-11 | 2018-08-03 | 青岛高测科技股份有限公司 | A kind of cutting head and the two line excavation machines comprising the head |
CN108568914A (en) * | 2018-05-03 | 2018-09-25 | 浙江海顺新能源有限公司 | A kind of solar silicon wafers processing cutting method |
CN112428463A (en) * | 2020-11-19 | 2021-03-02 | 上海中欣晶圆半导体科技有限公司 | Method for line breakage and line restoration in crystal bar line cutting machining process |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2002060777A (en) * | 2000-08-22 | 2002-02-26 | Ishii Hyoki Corp | Aqueous slurry for wire saw |
JP2006096951A (en) * | 2004-09-30 | 2006-04-13 | Kyodo Yushi Co Ltd | Water-soluble machining oil, slurry, and machining method |
CN101664970A (en) * | 2009-09-03 | 2010-03-10 | 无锡尚品太阳能电力科技有限公司 | Monocrystal silicon-rod butting technique |
CN102344776A (en) * | 2010-08-06 | 2012-02-08 | 安集微电子(上海)有限公司 | Cutting fluid for cutting of scroll saw |
CN103242944A (en) * | 2013-04-23 | 2013-08-14 | 上海晔宗光伏科技有限公司 | Multifunctional water-based environment-friendly recyclable crystal silicon precision cutting liquid |
CN103991140A (en) * | 2014-04-28 | 2014-08-20 | 阳光硅谷电子科技有限公司 | Diamond wire-electrode cutting technology for silicon rod |
CN104191533A (en) * | 2014-09-04 | 2014-12-10 | 无锡尚品太阳能电力科技有限公司 | Silicon wafer reciprocating cutting technology |
-
2016
- 2016-03-31 CN CN201610202149.7A patent/CN105690586A/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002060777A (en) * | 2000-08-22 | 2002-02-26 | Ishii Hyoki Corp | Aqueous slurry for wire saw |
JP2006096951A (en) * | 2004-09-30 | 2006-04-13 | Kyodo Yushi Co Ltd | Water-soluble machining oil, slurry, and machining method |
CN101664970A (en) * | 2009-09-03 | 2010-03-10 | 无锡尚品太阳能电力科技有限公司 | Monocrystal silicon-rod butting technique |
CN102344776A (en) * | 2010-08-06 | 2012-02-08 | 安集微电子(上海)有限公司 | Cutting fluid for cutting of scroll saw |
CN103242944A (en) * | 2013-04-23 | 2013-08-14 | 上海晔宗光伏科技有限公司 | Multifunctional water-based environment-friendly recyclable crystal silicon precision cutting liquid |
CN103991140A (en) * | 2014-04-28 | 2014-08-20 | 阳光硅谷电子科技有限公司 | Diamond wire-electrode cutting technology for silicon rod |
CN104191533A (en) * | 2014-09-04 | 2014-12-10 | 无锡尚品太阳能电力科技有限公司 | Silicon wafer reciprocating cutting technology |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107379294A (en) * | 2017-07-20 | 2017-11-24 | 阜宁协鑫光伏科技有限公司 | The method of diamond wire recycling cutting silicon chip |
CN108568914A (en) * | 2018-05-03 | 2018-09-25 | 浙江海顺新能源有限公司 | A kind of solar silicon wafers processing cutting method |
CN108357003A (en) * | 2018-05-11 | 2018-08-03 | 青岛高测科技股份有限公司 | A kind of cutting head and the two line excavation machines comprising the head |
CN112428463A (en) * | 2020-11-19 | 2021-03-02 | 上海中欣晶圆半导体科技有限公司 | Method for line breakage and line restoration in crystal bar line cutting machining process |
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Application publication date: 20160622 |