CN102344776A - Cutting fluid for cutting of scroll saw - Google Patents
Cutting fluid for cutting of scroll saw Download PDFInfo
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- CN102344776A CN102344776A CN2010102465950A CN201010246595A CN102344776A CN 102344776 A CN102344776 A CN 102344776A CN 2010102465950 A CN2010102465950 A CN 2010102465950A CN 201010246595 A CN201010246595 A CN 201010246595A CN 102344776 A CN102344776 A CN 102344776A
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- polyoxyethylene glycol
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Abstract
The invention discloses a cutting fluid for cutting of a scroll saw. The cutting fluid disclosed by the invention has the advantages of low cost and favorable dispersibility, suspension property, lubricity, cooling property and favorable stability, and thereby the cutting yield is improved. In addition, the cutting fluid disclosed by the invention is environment-friendly and is convenient to recover.
Description
Technical field
The present invention relates to a kind of cutting liquid, relate in particular to a kind of cutting liquid that is used for the scroll saw cutting.
Background technology
Along with developing rapidly of electronic industry, wafer is at unicircuit, solar cell, and industries such as LED illumination more and more are widely used, and the scroll saw cutting of wafer also more and more obtains paying attention to.For the material that is cut mainly with silicon, germanium, gallium arsenide, sapphire hard materials such as (aluminum oxide).
What used the earliest in the wafer process field is the cylindrical cutting technique.This cutting mode is cut material through the diamond wafers wheel grinding on the main shaft that is clamped in high speed rotating to reach the purpose of cutting.Along with the development of material preparation technology and the increasing of cutting diameter, outer circular knife poor rigidity, the unmanageable problem of edge of a knife oscillating quantity just seems particularly outstanding.Be to strengthen the rigidity of blade, cutter hub is done very thickly, makes that like this cutters seam is very wide, is cut material and wastes in a large number thereby make; Cutting quality is very poor, is difficult to cut out ultra thin wafer, so the cylindrical cutting is replaced by interior round cutting technique very soon.When interior circle cut, cutting blade drove high speed rotating by main shaft, simultaneously relative workpiece radial feed completion wafer cutting processing process.The advantage of interior circle cutting technique is: the section precision is high; The slicing machine cost is lower, is 1/3-1/4 of wire cutting machine price with the inside diameter slicer price of cut lengths; Every all science and technology radially adjust with slice thickness and adjust; The many specifications of short run add man-hour, have adjustability flexibly.Its shortcoming is: the wafer surface damage is big; The edge of a knife is wide, and material unaccounted-for (MUF) is big; Productivity is low; Therefore the circle cutting can not be satisfied present production demand far away on output and ability; The fast development of especially large-scale unicircuit and solar battery sheet; The wafer demand heightens, and people begin to consider to adopt cutting facility more efficiently, and scroll saw just arises at the historic moment.
The scroll saw cutting is wrapped in an elongated steel wire on the glass pulley exactly, and steel wire two is respectively by payingoff mechanism and take-up mechanism tension.Some tension control wheels are housed, in order to the rigidity of control steel wire between retractable cable mechanism and glass pulley.The forward and reverse rotation rhythmically of glass pulley high speed realizes the steel wire to-and-fro movement.Equipment is furnished with cutting mortar sprinkling system, by compression pump power is provided.The cutting mortar generally is made up of cutting liquid and silicon carbide abrasive.During cutting, cutting also is sprayed onto on the crystal bar edge of a knife and the wire, and the cutting feed mechanism evenly moves, and crystal bar is pressed to the reciprocating steel wire of high speed, cuts out one group of satisfactory high quality wafer.
All there is the weakness of redispersion ability in domestic and international existing cutting liquid, after long-time the placement, the deposition of silicon carbide can occur, and agglomeration takes place, and stirs once more, and silicon carbide is dispersed in the cutting liquid once more.Cost is high.
Summary of the invention
The invention provides a kind of cutting of scroll saw efficiently liquid, whole cutting liquid has extraordinary dispersion and suspension, has good oilness and cooling property, extraordinary stability, thus improved the good article rate of cutting, and this cuts, and liquid is moisture to reach 20%.
The cutting liquid that is used for the scroll saw cutting of the present invention, contain:
A) polyoxyethylene glycol component 50～90wt%
B) dispersion agent 0.1～15wt%
C) organic bases 0.1～15wt%
D) tensio-active agent 0.1～5wt%
E) metal corrosion inhibitor 0.1～6wt%
F) water 3～20wt%.
Among the present invention, the molecular weight of polyoxyethylene glycol is 100～600 in the described polyoxyethylene glycol component.The mixture that described polyoxyethylene glycol component is made up of the polyoxyethylene glycol of a kind of molecular weight polyethylene glycol or various molecular weights.
Among the present invention, described dispersion agent is selected from one or more of homopolymer that one or more monomeric units in vinylformic acid, methylpropanoic acid acid, ethylacrylic acid, olefin sulfonic acid, styrene sulfonic acid, maleic anhydride, alkyl propenyloxy group sulfonic acid and/or the acrylamido sulfonic acid obtain or multipolymer.The molecular weight of described homopolymer or multipolymer is 400-5000.
Among the present invention, described organic bases is selected from one or more in Tetramethylammonium hydroxide, tetraethyl ammonium hydroxide, TPAOH, TBAH and/or the benzyltrimethylammonium hydroxide.
Among the present invention, described metal corrosion inhibitor is selected from one or more in phenols, carboxylic-acid, carboxylic acid esters and/or the anhydrides.Described phenols is selected from phenol, 1, one or more in 2-dihydroxyl phenol, para hydroxybenzene phenol and/or the pyrogallol; Described carboxylic-acid is selected from one or more in phenylformic acid, para-amino benzoic acid (PABA), phthalic acid (PA) and/or the gallic acid (GA); Described carboxylic acid esters is selected from one or more in methyl p-aminobenzoate, Methyl Benzene-o-dicarboxylate and/or the Tenox PG; Described anhydrides is selected from one or more in diacetyl oxide and/or the caproic anhydride.
Among the present invention, described tensio-active agent is selected from polymethyl siloxane, gather ethylsiloxane, gather propyl-siloxane, gather in butyl siloxanes, polymethy ethylsiloxane and/or the polydimethylsiloxane one or more.
Cutting liquid of the present invention also contains: spices, the content of said spices are 0.01～0.1wt%.Wherein, described spices is commercially available, is dissolvable in water among the PEG; Water is to be used for dissolving various additives.
Positively effect of the present invention is: with low cost, have good dispersiveness and suspension, and good oilness and cooling property, extraordinary stability, thus improved the good article rate of cutting; And cutting pendular ring of the present invention is protected, and is convenient to reclaim.
Embodiment
Preparation embodiment
Further specify the present invention with embodiment below, but the present invention is not limited.Among the following embodiment, per-cent is mass percent.
Table 1 has provided the prescription that is used for the scavenging solution embodiment 1～6 of thick film photolithography glue of the present invention, presses listed component and content thereof in the table 1, and various additives are configured to the aqueous solution.In true quantitative PEG, add dispersion agent, stirred 30 minutes; Then organic bases was being squeezed among the PEG with volume pump in 1 hour, constantly stirred, after all adding, continuing to stir 30 minutes; With tensio-active agent, metal corrosion inhibitor and spices (the refined essence spices YJ40541 of the company limited product that adds in Shanghai) add, and stir 30 minutes at last.Stirring velocity is at 130 rev/mins.
The table 1 cutting liquid that is used for the scroll saw cutting of the present invention prepares embodiment 1～6
Effect embodiment
After embodiment shown in the table 1 1～6 and market sold cutting liquid and be mixed with the cutting mortar, carry out stability and contrast, use therein cutting blade material is SiC.
The contrast of cutting liquid stability is sold in table 2 scroll saw cutting liquid of the present invention and market
| Embodiment 3 | 6cm | 5.2cm | 3.6cm | SiC is dispersed in the cutting liquid again |
| Embodiment 4 | 6.1cm | 5.4cm | 3.7cm | SiC is dispersed in the cutting liquid again |
| Embodiment 5 | 5.9cm | 5.4cm | 3.6cm | SiC is dispersed in the cutting liquid again |
| Embodiment 6 | 6.1cm | 5.4cm | 3.8cm | SiC is dispersed in the cutting liquid again |
| Market cutting liquid | 4.8cm | 2.8cm | 1.8cm | 1.8cm |
Can find out that from table 2 cutting liquor ratio of the present invention market sells cutting liquid and have better dispersiveness and redispersibility, and can use 100% to reclaim the configuration that SiC cuts mortar, greatly reduce cost.
Claims (10)
1. one kind is used for the cutting liquid that scroll saw cuts, and contains:
A) polyoxyethylene glycol component 50～90wt%,
B) dispersion agent 0.1～15wt%,
C) organic bases 0.1～15wt%,
D) tensio-active agent 0.1～5wt%,
E) metal corrosion inhibitor 0.1～6wt% and
F) water 3～20wt%.
2. cutting liquid according to claim 1, the molecular weight of polyoxyethylene glycol is 100～600 in the described polyoxyethylene glycol component.
3. cutting liquid according to claim 2, the mixture that described polyoxyethylene glycol component is made up of the polyoxyethylene glycol of a kind of molecular weight polyethylene glycol or various molecular weights.
4. cutting liquid according to claim 1, described dispersion agent are selected from one or more of homopolymer that one or more monomeric units in vinylformic acid, methylpropanoic acid acid, ethylacrylic acid, olefin sulfonic acid, styrene sulfonic acid, maleic anhydride, alkyl propenyloxy group sulfonic acid and/or the acrylamido sulfonic acid obtain or multipolymer.
5. cutting liquid according to claim 4, the molecular weight of described homopolymer or multipolymer is 400-5000.
6. cutting liquid according to claim 1, described organic bases is selected from one or more in Tetramethylammonium hydroxide, tetraethyl ammonium hydroxide, TPAOH, TBAH and/or the benzyltrimethylammonium hydroxide.
7. cutting liquid according to claim 6, described metal corrosion inhibitor is selected from one or more in phenols, carboxylic-acid, carboxylic acid esters and/or the anhydrides.
8. cutting liquid according to claim 7, described phenols is selected from phenol, 1, one or more in 2-dihydroxyl phenol, para hydroxybenzene phenol and/or the pyrogallol; Described carboxylic-acid is selected from one or more in phenylformic acid, para-amino benzoic acid (PABA), phthalic acid (PA) and/or the gallic acid (GA); Described carboxylic acid esters is selected from one or more in methyl p-aminobenzoate, Methyl Benzene-o-dicarboxylate and/or the Tenox PG; Described anhydrides is selected from one or more in diacetyl oxide and/or the caproic anhydride.
9. cutting liquid according to claim 1, described tensio-active agent is selected from polymethyl siloxane, gather ethylsiloxane, gather propyl-siloxane, gather in butyl siloxanes, polymethy ethylsiloxane and/or the polydimethylsiloxane one or more.
10. cutting liquid according to claim 1, also contain: spices, the content of said spices are 0.01～0.1wt%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102465950A CN102344776A (en) | 2010-08-06 | 2010-08-06 | Cutting fluid for cutting of scroll saw |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102465950A CN102344776A (en) | 2010-08-06 | 2010-08-06 | Cutting fluid for cutting of scroll saw |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102344776A true CN102344776A (en) | 2012-02-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102465950A Pending CN102344776A (en) | 2010-08-06 | 2010-08-06 | Cutting fluid for cutting of scroll saw |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102784977A (en) * | 2012-07-31 | 2012-11-21 | 江南大学 | Silicon crystal line cutting fluid |
| CN102925270A (en) * | 2012-09-07 | 2013-02-13 | 江苏正泰医药化工有限公司 | Cutting fluid |
| CN105690586A (en) * | 2016-03-31 | 2016-06-22 | 苏州晶樱光电科技有限公司 | Silicon rod slicing process |
| CN110722623A (en) * | 2018-07-16 | 2020-01-24 | 上海自旭光电科技有限公司 | Cutting protection structure |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1618936A (en) * | 2004-09-30 | 2005-05-25 | 刘玉岭 | Wire cutting liquid of semiconductor material |
| CN101560430A (en) * | 2009-05-27 | 2009-10-21 | 中南大学 | Fully synthetic cutting fluid |
-
2010
- 2010-08-06 CN CN2010102465950A patent/CN102344776A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1618936A (en) * | 2004-09-30 | 2005-05-25 | 刘玉岭 | Wire cutting liquid of semiconductor material |
| CN101560430A (en) * | 2009-05-27 | 2009-10-21 | 中南大学 | Fully synthetic cutting fluid |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102784977A (en) * | 2012-07-31 | 2012-11-21 | 江南大学 | Silicon crystal line cutting fluid |
| CN102925270A (en) * | 2012-09-07 | 2013-02-13 | 江苏正泰医药化工有限公司 | Cutting fluid |
| CN105690586A (en) * | 2016-03-31 | 2016-06-22 | 苏州晶樱光电科技有限公司 | Silicon rod slicing process |
| CN110722623A (en) * | 2018-07-16 | 2020-01-24 | 上海自旭光电科技有限公司 | Cutting protection structure |
| CN110722623B (en) * | 2018-07-16 | 2021-07-27 | 拓旷(上海)光电科技有限公司 | Cutting protection structure |
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Application publication date: 20120208 |