CN105683318B - 使用环氧树脂组合物接合异质材料 - Google Patents
使用环氧树脂组合物接合异质材料 Download PDFInfo
- Publication number
- CN105683318B CN105683318B CN201480060441.9A CN201480060441A CN105683318B CN 105683318 B CN105683318 B CN 105683318B CN 201480060441 A CN201480060441 A CN 201480060441A CN 105683318 B CN105683318 B CN 105683318B
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- sealing
- capacitor
- composition epoxy
- insulating bushing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 88
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 88
- 239000000203 mixture Substances 0.000 title claims abstract description 74
- 239000000463 material Substances 0.000 title claims abstract description 36
- 239000003990 capacitor Substances 0.000 claims abstract description 94
- 239000002184 metal Substances 0.000 claims abstract description 49
- 229910052751 metal Inorganic materials 0.000 claims abstract description 49
- 238000007789 sealing Methods 0.000 claims abstract description 49
- 238000000034 method Methods 0.000 claims description 42
- 239000012530 fluid Substances 0.000 claims description 30
- 238000007711 solidification Methods 0.000 claims description 18
- 239000003795 chemical substances by application Substances 0.000 claims description 17
- 230000008023 solidification Effects 0.000 claims description 17
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 15
- 150000001491 aromatic compounds Chemical class 0.000 claims description 13
- 229920000642 polymer Polymers 0.000 claims description 12
- 239000000919 ceramic Substances 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 11
- 239000004843 novolac epoxy resin Substances 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 6
- 150000001412 amines Chemical class 0.000 claims description 4
- 230000006698 induction Effects 0.000 claims description 4
- 239000004848 polyfunctional curative Substances 0.000 claims description 4
- 150000003839 salts Chemical class 0.000 claims description 4
- 230000035939 shock Effects 0.000 claims description 4
- 239000007921 spray Substances 0.000 claims description 4
- -1 diaryl Methane Chemical compound 0.000 claims description 3
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims 4
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 claims 2
- 235000010290 biphenyl Nutrition 0.000 claims 2
- 239000004305 biphenyl Substances 0.000 claims 2
- ZIPLUEXSCPLCEI-UHFFFAOYSA-N cyanamide group Chemical group C(#N)[NH-] ZIPLUEXSCPLCEI-UHFFFAOYSA-N 0.000 claims 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Natural products C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 230000007613 environmental effect Effects 0.000 abstract 1
- 239000011810 insulating material Substances 0.000 description 15
- 238000001723 curing Methods 0.000 description 12
- 239000007769 metal material Substances 0.000 description 9
- 229910001220 stainless steel Inorganic materials 0.000 description 9
- 239000010935 stainless steel Substances 0.000 description 9
- 238000004804 winding Methods 0.000 description 9
- 230000008859 change Effects 0.000 description 8
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 7
- 239000003344 environmental pollutant Substances 0.000 description 6
- 231100000719 pollutant Toxicity 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229910044991 metal oxide Inorganic materials 0.000 description 5
- 150000004706 metal oxides Chemical class 0.000 description 5
- 239000010959 steel Substances 0.000 description 5
- 229940106691 bisphenol a Drugs 0.000 description 4
- 229910010293 ceramic material Inorganic materials 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 239000001307 helium Substances 0.000 description 3
- 229910052734 helium Inorganic materials 0.000 description 3
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 230000004520 agglutination Effects 0.000 description 2
- 210000004556 brain Anatomy 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical group [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- PKQYSCBUFZOAPE-UHFFFAOYSA-N 1,2-dibenzyl-3-methylbenzene Chemical compound C=1C=CC=CC=1CC=1C(C)=CC=CC=1CC1=CC=CC=C1 PKQYSCBUFZOAPE-UHFFFAOYSA-N 0.000 description 1
- PQTAUFTUHHRKSS-UHFFFAOYSA-N 1-benzyl-2-methylbenzene Chemical compound CC1=CC=CC=C1CC1=CC=CC=C1 PQTAUFTUHHRKSS-UHFFFAOYSA-N 0.000 description 1
- BSZXAFXFTLXUFV-UHFFFAOYSA-N 1-phenylethylbenzene Chemical compound C=1C=CC=CC=1C(C)C1=CC=CC=C1 BSZXAFXFTLXUFV-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- XZMCDFZZKTWFGF-UHFFFAOYSA-N Cyanamide Chemical compound NC#N XZMCDFZZKTWFGF-UHFFFAOYSA-N 0.000 description 1
- 241001269238 Data Species 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000010411 cooking Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000009628 steelmaking Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/18—Layered products comprising a layer of metal comprising iron or steel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/061—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
- C08J5/124—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives using adhesives based on a macromolecular component
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
- C08J5/124—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives using adhesives based on a macromolecular component
- C08J5/128—Adhesives without diluent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/04—Epoxynovolacs
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/10—Housing; Encapsulation
- H01G2/103—Sealings, e.g. for lead-in wires; Covers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
- H01G9/10—Sealing, e.g. of lead-in wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B2037/1253—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives curable adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/02—2 layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/06—Coating on the layer surface on metal layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/72—Cured, e.g. vulcanised, cross-linked
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/536—Hardness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2310/00—Treatment by energy or chemical effects
- B32B2310/021—Treatment by energy or chemical effects using electrical effects
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
- B32B2315/02—Ceramics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
- B32B2315/08—Glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/16—Capacitors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/12—Ceramic
- C09J2400/123—Ceramic in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/14—Glass
- C09J2400/143—Glass in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/22—Presence of unspecified polymer
- C09J2400/226—Presence of unspecified polymer in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31518—Next to glass or quartz
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31522—Next to metal
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
公开了用于接合异质材料的环氧树脂组合物。确定的环氧树脂组合物可用于密封电容器的金属和非金属组件。具体而言,可将环氧树脂组合物施涂于非金属电容器衬套与金属箱盖和金属端帽之间的接合处上。当环氧树脂组合物固化时,它可提供可经得起电容器经受的应力和环境条件的密封。
Description
技术领域
本文所述实施方案一般性地涉及使用环氧树脂组合物接合异质材料,例如金属和非金属材料。
背景
接合异质材料,例如金属和非金属材料通常呈现多种技术挑战。不仅是对许多类型的常规接合方法具有抗性的异质材料,甚至形成的结合处可能不能经得起实质性应力或严苛环境条件。这些挑战对室外放置的电设备而言是特别如此,然而,严苛环境因素如高温也可存在于室内环境中。例如,在电容器箱的情况下,需要将非金属电容器衬套与金属端帽和金属箱盖接合。电容器衬套用于几个功能。衬套的主要功能是将可以为数千伏特电势的电引线与电容器箱的金属体以及相互分离。电容器衬套还用于将电容器内部的内容物与外部环境分离。需要保护内部电容器组件以防与外部环境接触,因为被湿气或粉尘污染可使电介质电容器流体降解并导致电容器失效。另外,电容器衬套将电容器内部的电介质流体密封并防止它逃逸到环境中。
目前,存在可用于接合这些金属和非金属表面的几种不同路线。一个实例为焊接。焊接电容器衬套通常涉及复杂的程序,其中将两个厚银基上漆膜涂层以谨慎控制的方法施涂于电容器衬套上。将油漆涂层干燥,然后将电容器衬套在谨慎控制的条件下在高温下烧制。在烧制方法以后,可将电容器衬套焊接在金属组件上。焊接方法可能是复杂、费力且昂贵的。
接合金属和非金属表面的备选路线是使用机械组件和紧固件。然而,机械紧固要求其它组件,这增加了电容器箱的费用和复杂性,且机械紧固件可能提供对一些应用而言不足的接合强度,并且在电容器的寿命中,当它暴露于严苛环境条件时在机械应力下损失密封完整性。
因此,需要接合用于制造电容器箱的异质材料如金属和非金属组件的改进方法。具体而言,需要接合金属和非金属组件的改进技术,其是较便宜且较简单的方法并且产生在电容器的寿命期间更可靠的密封性能的较强接合。
概述
一般而言,在一个方面中,本公开内容涉及环氧树脂组合物用于接合异质材料的新应用。具体而言,在一个实施方案中,本公开内容涉及在绝缘材料与金属组件之间形成固化密封的方法。示例方法包括将环氧树脂组合物施涂于绝缘材料和金属组件中的一个或两个的一部分上。将绝缘材料和金属组件接合使得环氧树脂组合物在绝缘材料与金属组件之间形成密封。然后将密封固化以形成固化密封。绝缘材料可包含玻璃、陶瓷、环氧树脂、上釉材料或其它聚合物中的一种或多种。环氧树脂组合物可包含酚醛环氧树脂、双酚A环氧树脂或其组合和固化剂。在电容器的实例中,当密封固化且电容器完全装配时,固化密封可暴露于置于电容器内的一种或多种芳族化合物。
在另一方面中,本公开内容可一般性地涉及包含接合2种异质材料的环氧树脂组合物的设备。具体而言,设备可包含绝缘材料、金属组件和在绝缘材料与金属组件之间的固化密封。固化密封可包含含有酚醛环氧树脂、双酚A环氧树脂或其组合和固化剂的环氧树脂组合物。绝缘材料可包含玻璃、陶瓷、环氧树脂、上釉材料或其它聚合物中的一种或多种。在电容器的实例中,将环氧树脂组合物固化以在由绝缘材料制成的电容器衬套与金属盖和金属端帽之间形成固化密封。当装配电容器时,固化密封可暴露于置于电容器内的一种或多种芳族化合物。
在又一方面中,本公开内容可涉及在绝缘材料与金属组件之间形成固化密封的方法。示例方法包括将组合物的第一部分施涂于绝缘材料上并将组合物的第二部分施涂于金属组件上。将绝缘材料和金属组件接合,使得组合物的第一部分和第二部分结合并在绝缘材料与金属组件之间形成环氧树脂组合物。然后将环氧树脂组合物固化以形成固化密封。绝缘材料可包含玻璃、陶瓷、环氧树脂、上釉材料或其它聚合物中的一种或多种。环氧树脂组合物可包含酚醛环氧树脂、双酚A环氧树脂或其组合和固化剂。在电容器的实例中,当环氧树脂组合物固化且电容器完全装配时,固化密封可暴露于置于电容器内的一种或多种芳族化合物。
这些和其它方面、目的、特征和实施方案从以下描述和所附权利要求书中获悉。
附图简述
图仅阐述使用环氧树脂组合物接合异质材料的示例实施方案,因此不认为限制它的范围。图中所示元件和特征未必按比例绘制,而是强调清楚地阐述示例实施方案的原理。另外,某些尺寸或位置可夸大以帮助视觉上传达这类原理。在图中,参考数字表示类似或相应的,但未必是相同的元件。
图1显示根据某些示例实施方案,部分切掉的电容器的透视图。
图2显示根据某些示例实施方案,部分切掉的电容器衬套的透视图。
图3显示根据某些示例实施方案,电容器衬套、箱顶部、金属外壳、端帽和O形环的分解图。
图4显示根据某些示例实施方案装配电容器的示例方法。
图5为根据某些示例实施方案,粘合陶瓷材料和金属材料的粘合剂的代表。
图6为根据某些示例实施方案,金属表面的代表。左边的阐述显示在除去污染物以前金属表面的层的化学组成。右边的阐述表示在除去污染物以后金属表面的层的化学相互作用。
图7显示在暴露于芳族电介质流体以前和以后,根据某些示例实施方案的固化密封的硬度评估。
示例实施方案详述
本文讨论的示例实施方案涉及用于接合异质材料的体系、设备和方法。本文所述一个示例实施方案涉及使用环氧树脂组合物将电容器的金属和非金属组件接合。然而,所述环氧树脂组合物的新应用还可应用于需要接合异质材料的其它类型的装置。例如,所述环氧树脂组合物还可用于接合在其它电组件如保险丝、接电装置、调节器和变压器中发现的异质材料。因此,所述环氧树脂组合物的新应用不限于本文提供的电容器实例。
术语―结合处”和―固化密封”在本文中互换使用,且一个术语应当不理解为排除另一个,而是,术语应赋予它们最宽泛的合理解释。如本文所用术语―绝缘材料”为包括大量非金属材料的一类非金属材料,但应当理解某些非金属材料不是有效的绝缘体。
现在参考电容器箱的示例,图1显示外壳20中包含一个或多个电容器绕组10的电容器19。外壳20用电介质流体填充。来自电容器绕组10的螺旋接头(tap)17和18一起与未显示的引线连接,通过电容器衬套40和端帽42。螺旋接头17和18在一些电容器构造方法中可以删除,并且电引线可直接与电容器绕组10连接。图1的示例电容器19可遵循如例如theInternational Electrotechnical Commission(IEC)或the Institute of Electricaland Electronics Engineers(IEEE)所述的一个或多个标准,例如IEC 60871-1:2005,第12部分–Sealing Test和/或IEEE 18:2012,第7.2.3部分–Leak Test中的要求。
电容器绕组10通常包含一对间隔的金属箔电极和中间聚丙烯膜层,使得聚丙烯膜层对在整个绕组中在箔电极层之间找到,如本领域中熟知的。将螺旋接头17和18插入电容器绕组10中以与电极层相邻地布置以用作电极的电连接。如上文提及的,电容器的备选实施方案可用与电引线连接的延长金属层电极构造,这消除了关于分开的螺旋接头的需要。将螺旋接头17和18与端帽42处的外部电连接连接的电引线(未显示)对电容器19的外壳20电绝缘。外壳20和箱盖44通常由耐久性金属材料如不锈钢制造,然而,也可使用其它耐久性非金属材料。端帽42通常由一种或多种金属材料制造。例如,在一个实施方案中,端帽42可用镀锡的黄铜制成。
电容器绕组10还通常浸入电介质流体如单苄基甲苯、二苯基乙烷和二苄基甲苯中的一种或多种的混合物中。电介质流体通常包含可对某些材料具有腐蚀性影响的一种或多种芳族流体。通常,作为装配电容器19的一部分,将水蒸气从电介质流体和电容器绕组10的组件中除去。
为保持电容器19和电介质流体不含水和其它杂质,必须将电容器19密封。电容器密封必须能够经得起在环境下的恒定暴露,包括长期暴露于日光、极端温度变化和暴露于元素。一般而言,电容器密封必须经得起电线杆的顶部或变压站中存在的条件,其经受在整个世界发现的多种类型的地理条件和气象条件。通常预期电容器密封能够持续大约30年的有用寿命。
密封电容器19是困难的,因为电容器衬套40通常包含陶瓷、环氧树脂或其它绝缘材料。绝缘材料不容易与金属部件如金属外壳20和端帽42连接。如图2和3中所示,电容器衬套40必须在两个位置密封:衬套40的顶端48,在那里它与端帽42接触,和衬套40的下端50,在那里它通过开口52与箱盖44连接。在某些实施方案中,O形环46为可包括在端帽42与衬套40之间的任选组件。O形环46可适应金属端帽42与非金属衬套40之间的膨胀和收缩系数差以降低或消除材料之间的应力。
先前在本领域中认为聚合物如环氧树脂不能实现通常预期具有30年的寿命的电容器所需足够强度的密封。例如,这类聚合物可能不能经得起电容器通常经受的应力和气候条件。此外,认为聚合物不能经得起在电容器内电介质流体的芳族组分下的长期暴露。
根据本公开内容,确定某些环氧树脂组合物出乎意料地提供密封电容器所需的性能特性。特别是,发现包含固化剂和酚醛环氧树脂、双酚A环氧树脂或两种环氧树脂的组合的环氧树脂组合物在连接电容器的金属和非金属组件时提供具有出乎意料的有利特性的密封。环氧树脂组合物的固化剂可以为硬化剂、催化剂或者硬化剂和催化剂的组合。示例硬化剂包括但不限于含胺硬化剂如氨腈和双氰胺。具有上述组分并提供具有有利特性的密封的市售环氧树脂组合物的实例包括Loctite E-214HP环氧树脂、Masterbond Sup 10HT环氧树脂、Permabond ES569环氧树脂和Permabond ES550环氧树脂。
图4阐述在制造密封电容器中使用一种所述环氧树脂组合物的示例方法400。参考示例方法400,在步骤405中,可将图3所示电容器19的组件清洗以除去任何污染物。尽管不是每个实施方案中要求的,从环氧树脂组合物施涂于其上的表面上除去杂质可改进密封的性能。用于从金属和非金属表面上除去污染物的方法和清洁器是本领域技术人员熟知的。然而,应当容易理解如果例如在制造阶段开始时组件上不存在污染物,则步骤405不是必须的。
在示例方法400的步骤410中,将环氧树脂组合物,例如一种本文所述组合物施涂于衬套40的顶端48和下端50。在步骤415中,将O形环46和端帽42置于衬套40的顶端48上。如先前所述,某些实施方案可不包括O形环46。在步骤420中,将衬套40插入箱盖44中的开口52中。对于某些电容器如图1-3中所示电容器19,在步骤425中重复步骤405-420以将第二衬套插入箱盖44中的第二开口52中。在备选实施方案中,电容器可具有多于2个衬套,要求重复步骤405-420多于一次。在又一备选实施方案中,电容器可具有仅单个衬套,使得不需要重复步骤405-420。
当将一对衬套插入箱盖44中时,在步骤430中,将环氧树脂组合物固化。尽管固化步骤可通过多种方法实现,一种典型的方法是通过将环氧树脂组合物加热至预定温度。加热环氧树脂组合物可通过多种方法,包括对流加热、红外加热、感应加热和通过辐射加热进行。当使用热固化时,固化步骤通常需要将环氧树脂组合物加热至80℃至160℃的温度。某些环氧树脂组合物要求将组合物保持在80℃至160℃下约30分钟至约120分钟。在其它实施方案中,需要甚至更长的加热时间固化。
在步骤435中,将电容器的内部组件如电容器绕组10、螺旋接头(tap)17和18以及引线(未显示)放入外壳20内。在步骤440中,将引线与端帽42连接。最后,在步骤445中,将具有附着的衬套40的箱盖44对外壳20密封。尽管示例方法400中未阐述,本领域技术人员理解通常在将具有附着的衬套40的箱盖44对外壳20密封以后,将电介质流体通过开口或填充阀加入电容器中。
方法400仅为根据本公开内容制造电容器的方法的一个实例。本领域技术人员认识到可省略或修改示例方法400中的某些步骤而不偏离本公开内容的范围。例如,关于步骤410和415,可改变它们使得代替地将环氧树脂组合物施涂于端帽42的内表面和箱盖44中的开口52的内边缘上。在又一实施方案中,可改变步骤410和415使得将环氧树脂组合物施涂于衬套40的顶端48和下端50以及端帽42的内表面和箱盖44中的开口52的内边缘上。在又一实施方案中,可改变步骤410-420和445,使得首先将箱盖44附着在外壳20上,其后是步骤410-420。
在又一实施方案中,环氧树脂组合物可以为两部分体系,其中作为施涂和将环氧树脂组合物固化的方法的一部分,将组合物的两个部分结合。作为两部分体系的一个实例,环氧树脂组合物可包含含有环氧树脂的第一部分和含有固化剂的第二部分。可恰在将组合物施涂于衬套40和/或端帽42的内表面和开口52的内边缘上以前将两部分体系的第一部分和第二部分结合。
在又一备选实施方案中,可在衬套40与端帽42和箱盖44中的开口52的边缘接触时将两部分体系结合。例如,可将两部分体系的第一部分施涂于衬套40的顶端48和下端50。可将两部分体系的第二部分施涂于端帽42的内表面和箱盖44中的开口52的内边缘上。当衬套40与端帽42的内表面和开口52的内边缘接触时,将两部分体系的第一部分和第二部分结合并固化。第一部分可以为环氧树脂且第二部分可以为固化剂。作为选择,第一部分可以为固化剂且第二部分可以为环氧树脂。示例方法400的这些和其它变化方案是本领域技术人员理解的。
下表提供测试在电容器应用中的潜在用途的各种市售环氧树脂组合物的实例的试验数据。如下表所示,仅某些试验环氧树脂组合物显示出用于电容器应用中所需的性能。表1显示测试的各种环氧树脂组合物在75℃至90℃的高温(HT)和25℃的室温(RT)下的搭接剪切强度,以psi表示。在表1中不存在数据的情况下,未进行试验。
表1
如表1所示,试样编号5、8、13和14提供在进行试验的温度下最好的搭接剪切强度。在试样编号5、8、13和14中发现的共同特征包括含胺硬化剂和包含酚醛环氧树脂或双酚A环氧树脂的环氧树脂。
显示最有利的特性的试样的其它试验数据显示于表2(下面)和图7中。为评估芳族电介质流体与固化密封的相容性,在包含芳族电介质流体Edisol VI—市售电介质流体的实例设备中由试样5和8形成固化密封。将设备加热至75℃,保持2星期。表2显示在加热时间以前(A)和以后(B)设备中的芳族电介质流体的某些性能的测量。
表2
特别是,表2中的数据显示由试样5和8形成的固化密封良好地执行,因为它们不对可用于电容器中的电介质流体具有不利影响。例如,对比加热时间以前(A)和2星期加热时间以后(B)的试样,显示存在电介质流体的性能相对小的变化。表2中的数据显示,固化密封不会实质性影响电介质流体的电性能,例如击穿电压(使用ASTM D1816测试)、损耗因数(使用ASTM D924测试)或电流漏泄。测量电流漏泄的技术通常是本领域技术人员已知的。表2中的数据还显示,在对比加热时间以前(A)和2星期加热时间以后(B)收集的数据时,测量的表面张力、酸度或电介质流体的可见外观没有实质性变化。标记为规格的行中的数字是关于各属性的典型目标值。
还评估芳族流体对由试样5、13和14形成的固化密封的硬度的影响。图7显示在75℃下暴露于芳族电介质流体120天中关于试样5、13和14的硬度试验数据。特别是,图7显示芳族电介质流体甚至在暴露于芳族电介质流体120天以后对由试样5、13和14形成的固化密封的硬度不具有不利影响。
还使试样5、13和14经受其它试验以确保它们会经得起电容器经受的严苛环境条件。试样经历的其它试验包括热冲击试验、盐喷雾试验、UV试验、冷凝试验和氦泄漏试验。
热冲击试验使用来自表1的试样5在包含具有附着的衬套的电器箱盖的装置上进行。热冲击试验涉及将装置加热至110℃,然后将装置快速移动到保持在-50℃的温度下的室中整夜。然后将装置在室中在室温下加热并经受负载试验。在对比经受温度变化的试样与未经受温度变化的试样的试验结果时,不存在负载试验下装置性能的统计差异。
将来自表1的试样5、13和14施涂于一片不锈钢上并经受根据ASTM B117的盐喷雾试验2000小时。在暴露于盐喷雾2000小时以后检查试样,并显示没有分层的证据、没有从小片中漏电的证据且固化密封的铅笔硬度没有变化。
还将来自表1的试样5、13和14施涂于一片不锈钢上并经受根据ASTM D4587的紫外线暴露2000小时。在暴露于紫外线2000小时以后对试样的检查显示颜色的变化,但试样的铅笔硬度没有变化。
还将来自表1的试样5、13和14施涂于一片不锈钢上并经受根据ASTM D4586-99的冷凝试验2000小时。在暴露于冷凝2000小时以后对试样的检查没有显示分层的证据,并且试样的铅笔硬度没有变化。
最后,将用来自表1的环氧树脂试样5、13和14的固化密封制成的示例电容器装置经受氦泄漏试验。氦泄漏试验证明用各试样保持气密密封。
现在参考图5,显示将陶瓷材料501与不锈钢509结合的粘合剂505的代表。图5中所示的代表提供关于粘合剂505,例如本文所述环氧树脂组合物可如何用于接合异质材料如陶瓷材料501和金属材料如不锈钢509的一般性阐述。如图5所述,陶瓷材料501通常具有环氧树脂组合物施涂于其上的外部釉料层503。在结合处的相对面上,金属材料509通常具有由金属材料暴露于通常存在于大气中的湿气而导致的外部氧化层507。如图5中的一般化所示,本文所述环氧树脂组合物可用于接合多种异质材料且不限于关于图1-4所述的电容器实例。如上文所解释的,本文所述环氧树脂组合物可用于接合经受应力和严苛环境条件的多种异质材料,例如保险丝、接电装置、调节器和变压器。
图6更详细地提供关于结合处的金属材料部分的示例阐述。特别是,图6更详细地显示可在图5的氧化层507中找到的层。在金属层的底部为本体不锈钢609。本体不锈钢层609主要包含金属分子。移向钢的外层,下一层是隔离层611。隔离层611为本体不锈钢609与金属氧化物层613之间的界面。金属氧化物层613主要包含金属氧化物分子。由钢继续向外移动,下一层是氢氧化物和湿气层615。在图6的右手侧上,层615更详细地显示为具有独特氢氧化物层和独特水化水层。最后,图6的层617表示可存在于金属材料的最外层上的油和污染物。优选,在施涂环氧树脂组合物以前将油和污染物除去以使环氧基与氢氧化物结构部分的相互作用最大化。本领域技术人员应当理解图6的阐述为一个实例,且经受不同环境条件的不同于钢的金属材料或者钢可具有与图6所述那些不同的氧化层。
在与图5所示实例中的钢509相对的结合处侧上,粘合剂505(环氧树脂)与非金属材料如陶瓷501结合。在图5所示实例中,陶瓷501具有通常包含金属氧化物的外部釉料层503。类似于如关于图6所述在环氧树脂与金属层之间发生的结合,环氧树脂与存在于釉料层503中的金属氧化物相互作用以形成化学键。然而,在备选实施方案中,粘合剂505可与具有由其它材料制成的釉料层或者不具有任何釉料层的陶瓷结合。尽管以上实施例提及陶瓷501作为非金属材料,其它示例实施方案可使用其它非金属材料作为绝缘体,例如由环氧树脂制成的衬套。
本文所述环氧树脂组合物能够在电容器的异质组件之间提供可经得起电容器经受的严苛环境条件的密封。尽管本文提供了电容器的实例,还施涂所述环氧树脂组合物以接合其它类型的设备中的异质材料。
尽管参考示例实施方案做出了本文所述实施方案,本领域技术人员应当理解各个改进方案也在本公开内容的范围和精神内。本领域技术人员应当理解本文所述示例实施方案不限于任何具体讨论的应用且本文所述实施方案为说明性且不是限制性的。从关于示例实施方案的描述中,本文显示的元件的等价物会浮现在本领域技术人员的脑海中,且使用本公开内容构造其它实施方案的方法会浮现在技术从业者的脑海中。因此,此处不限于示例实施方案的范围。
Claims (22)
1.在电容器箱的绝缘衬套与金属箱盖之间形成固化密封的方法,其包括步骤:
a.将环氧树脂组合物施涂于绝缘衬套和金属箱盖中的一个或两个的一部分上;
b.使绝缘衬套与金属箱盖接触,使得环氧树脂组合物形成绝缘衬套与金属箱盖之间的密封;和
c.将密封固化以形成固化密封;
d.将金属箱盖与密封的绝缘衬套附着到电容器箱的外壳,电容器箱包含含有一种或多种芳族化合物的流体,
其中绝缘衬套基本包含玻璃、陶瓷、聚合物或上釉材料;
其中环氧树脂组合物包含:酚醛环氧树脂、双酚A环氧树脂或其组合;和固化剂;且
其中当电容器箱完全装配时,固化密封暴露于包含一种或多种芳族化合物的流体。
2.根据权利要求1的方法,其中固化剂为含胺硬化剂。
3.根据权利要求1的方法,其中固化剂为氨腈或双氰胺。
4.根据权利要求1的方法,其中将密封固化包括将密封加热至足以将环氧树脂组合物固化的温度。
5.根据权利要求1的方法,其中将密封固化包括将密封加热至80℃至160℃。
6.根据权利要求1的方法,其中将密封固化包括将密封加热至80℃至160℃并将密封在80℃至160℃下保持30分钟至120分钟。
7.根据权利要求1的方法,其中将密封固化包括感应加热。
8.根据权利要求1的方法,其中将密封固化包括感应加热1至10分钟。
9.根据权利要求1的方法,其中环氧树脂组合物包含至少50%聚合物含量的聚合物含量。
10.根据权利要求1的方法,其进一步包括在步骤b以后,将压力施加在密封上的步骤。
11.根据权利要求1的方法,其中一种或多种芳族化合物选自二芳基乙烷、二芳基甲烷、三芳基甲烷、三芳基乙烷、联苯、单芳族化合物和萘。
12.根据权利要求1的方法,其中密封可经得起100℃至-50℃的热冲击。
13.根据权利要求1的方法,其中密封在暴露于盐喷雾、紫外线和100%相对湿度中的一个或多个2000小时以后抗破裂。
14.根据权利要求1的方法,其中密封的硬度在包含一种或多种芳族化合物的流体中120天以后降低小于2%。
15.根据权利要求1的方法,其中固化密封为气密的。
16.包含绝缘衬套、金属箱盖、附着在金属箱盖上的外壳和在绝缘衬套与金属箱盖之间的固化密封的电容器箱;其中外壳包含含有一种或多种芳族化合物的流体;其中固化密封包含环氧树脂组合物;
其中绝缘衬套基本包含玻璃、陶瓷、聚合物或上釉材料;
其中环氧树脂组合物包含:酚醛环氧树脂、双酚A环氧树脂或其组合;和固化剂;且
其中当电容器箱完全装配时,固化密封暴露于包含一种或多种芳族化合物的流体。
17.根据权利要求16的电容器箱,其中固化剂为含胺硬化剂。
18.根据权利要求16的电容器箱,其中环氧树脂组合物包含至少50%聚合物含量的聚合物含量。
19.根据权利要求16的电容器箱,其中一种或多种芳族化合物选自二芳基乙烷、二芳基甲烷、三芳基甲烷、三芳基乙烷、联苯、单芳族化合物和萘。
20.根据权利要求16的电容器箱,其中环氧树脂组合物通过将环氧树脂组合物加热至80℃至160℃并将环氧树脂组合物保持在80℃至160℃下30分钟至120分钟,或者通过感应加热1至10分钟而固化。
21.根据权利要求16的电容器箱,其中固化密封为气密的。
22.在电容器箱的绝缘衬套与金属箱盖之间形成固化密封的方法,其包括步骤:
a.将组合物的第一部分施涂于绝缘衬套并将组合物的第二部分施涂于金属箱盖上;
b.使绝缘衬套与金属箱盖接触使得组合物的第一部分和第二部分结合并在绝缘衬套与金属箱盖之间形成环氧树脂组合物;和
c.将环氧树脂组合物固化以形成固化密封;
d.将金属箱盖与密封的绝缘衬套附着到电容器箱的外壳,电容器箱包含含有一种或多种芳族化合物的流体,
其中绝缘衬套基本包含玻璃、陶瓷、聚合物或上釉材料;
其中环氧树脂组合物包含:酚醛环氧树脂、双酚A环氧树脂或其组合;和固化剂;且
其中当电容器箱完全装配时,固化密封暴露于包含一种或多种芳族化合物的流体。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/075,350 US9490067B2 (en) | 2013-11-08 | 2013-11-08 | Joining dissimilar materials using an epoxy resin composition |
US14/075,350 | 2013-11-08 | ||
PCT/US2014/063983 WO2015069676A1 (en) | 2013-11-08 | 2014-11-05 | Joining dissimilar materials using an epoxy resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105683318A CN105683318A (zh) | 2016-06-15 |
CN105683318B true CN105683318B (zh) | 2019-03-22 |
Family
ID=53042008
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201480060441.9A Active CN105683318B (zh) | 2013-11-08 | 2014-11-05 | 使用环氧树脂组合物接合异质材料 |
Country Status (8)
Country | Link |
---|---|
US (2) | US9490067B2 (zh) |
EP (1) | EP3066170B1 (zh) |
KR (1) | KR102288169B1 (zh) |
CN (1) | CN105683318B (zh) |
AR (1) | AR098329A1 (zh) |
AU (1) | AU2014346929B2 (zh) |
BR (1) | BR112016008163B1 (zh) |
WO (1) | WO2015069676A1 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FI3196489T6 (fi) * | 2014-09-19 | 2024-08-15 | Yamauchi Corporation | Teollisuustela ja menetelmä sen valmistamiseksi |
US10253956B2 (en) | 2015-08-26 | 2019-04-09 | Abl Ip Holding Llc | LED luminaire with mounting structure for LED circuit board |
CN108467686A (zh) * | 2017-02-23 | 2018-08-31 | 海门市瑞泰纺织科技有限公司 | 在绝缘材料与金属组件之间形成固化密封的方法及应用 |
JP6912316B2 (ja) * | 2017-08-01 | 2021-08-04 | 株式会社日立製作所 | 樹脂金属複合体の解体方法 |
US10251279B1 (en) | 2018-01-04 | 2019-04-02 | Abl Ip Holding Llc | Printed circuit board mounting with tabs |
US10818434B2 (en) * | 2018-04-11 | 2020-10-27 | Eaton Intelligent Power Limited | Adaptor for a capacitor |
KR20220158683A (ko) * | 2020-03-27 | 2022-12-01 | 닛뽄 케미콘 가부시끼가이샤 | 전해 콘덴서 |
Family Cites Families (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2333354A (en) | 1940-03-06 | 1943-11-02 | Electric Transmission Ltd | Electric fuse of cartridge type |
US2922927A (en) * | 1956-03-29 | 1960-01-26 | Ohio Brass Co | Electrical apparatus bushing |
US2977414A (en) | 1957-12-06 | 1961-03-28 | Peter G S Mero | Control system |
US3140859A (en) | 1961-01-17 | 1964-07-14 | Internat Ultrasonics Inc | Electroacoustic sandwich transducers |
US3275358A (en) * | 1963-03-14 | 1966-09-27 | Gen Electric | Glass-to-metal and glass-to-ceramic seals |
GB1060528A (en) | 1964-12-08 | 1967-03-01 | Siemens Ag | Process for the production of torsion-resistant metal-ceramic connections |
US3368175A (en) | 1966-04-08 | 1968-02-06 | Gen Electric | Voltage lead entrance for encapsulated electrical devices |
GB1137928A (en) * | 1966-10-03 | 1968-12-27 | Smiths Industries Ltd | Improvements in or relating to high-voltage bushing assemblies |
US3505630A (en) | 1968-01-29 | 1970-04-07 | Micro Devices Corp | Fuse construction |
US3647405A (en) | 1969-12-12 | 1972-03-07 | Ray F Smith | Garbage incinerator and method of operation |
US3723930A (en) | 1972-02-10 | 1973-03-27 | Gen Electric | Oil immersible current limiting fuse assembly |
US4453197A (en) * | 1981-10-22 | 1984-06-05 | Mcgraw-Edison Company | Dielectric fluid tank |
SU1065458A1 (ru) | 1982-07-19 | 1984-01-07 | Ленинградский Ордена Октябрьской Революции И Ордена Трудового Красного Знамени Технологический Институт Им.Ленсовета | Эпоксидна композици |
US4595557A (en) | 1985-04-11 | 1986-06-17 | Emerson Electric Co. | Method of increasing hermeticity of metal components of glass/metal and ceramic/metal seals |
US4846163A (en) | 1987-08-24 | 1989-07-11 | Cooper Industries, Inc. | Method of sealing capacitor bushings |
JPH0625331B2 (ja) * | 1988-03-18 | 1994-04-06 | ソマール株式会社 | バッテリーケース用接着剤組成物 |
US5161728A (en) | 1988-11-29 | 1992-11-10 | Li Chou H | Ceramic-metal bonding |
US5406448A (en) * | 1992-06-17 | 1995-04-11 | Cooper Power Systems, Inc. | Capacitor hanger and attachment method |
US5371650A (en) | 1994-02-15 | 1994-12-06 | Electronic Concepts, Inc. | Hermetically sealed capacitor and method for making the same |
US5766517A (en) * | 1995-12-21 | 1998-06-16 | Cooper Industries, Inc. | Dielectric fluid for use in power distribution equipment |
US5935372A (en) | 1997-04-29 | 1999-08-10 | Occidental Chemical Corporation | Adhesive sealant for bonding metal parts to ceramics |
US6627966B2 (en) | 2000-11-29 | 2003-09-30 | Samsung Electro-Mechanics Co., Ltd. | Method and device for sealing ceramic package of saw filter |
US6500795B2 (en) | 2001-01-24 | 2002-12-31 | Honeywell International Inc. | Azeotrope-like composition of 1-chloro-1,3,3,3-tetrafluoropropane and hydrogen fluoride |
US6585917B2 (en) * | 2001-04-12 | 2003-07-01 | Cooper Industries, Inc. | Dielectric fluid |
US20060194064A1 (en) * | 2002-03-01 | 2006-08-31 | Xiao Allison Y | Underfill encapsulant for wafer packaging and method for its application |
US20040251237A1 (en) | 2003-06-13 | 2004-12-16 | Meyer Jeffry R. | Circuit breaker with bonded bushing insulators |
JP3950464B2 (ja) | 2003-07-01 | 2007-08-01 | 大塚化学株式会社 | 第4級アンモニウム塩および電解質並びに電気化学デバイス |
CN100594089C (zh) * | 2004-08-25 | 2010-03-17 | 松下电器产业株式会社 | 焊料组合物、利用焊接的连接方法和衬底的生产方法 |
EP1932648A1 (en) | 2006-12-15 | 2008-06-18 | Sika Technology AG | Structural reinforcement material, insert, and reinforced cavity comprising same |
US7857194B2 (en) | 2007-05-01 | 2010-12-28 | University Of Dayton | Method of joining metals to ceramic matrix composites |
CN101689410B (zh) * | 2007-08-02 | 2013-10-16 | 日立化成株式会社 | 电路连接材料、使用它的电路构件的连接结构及电路构件的连接方法 |
US8082663B1 (en) | 2007-11-12 | 2011-12-27 | Sandia Corporation | Method for hermetic electrical connections |
CN102325739B (zh) | 2009-02-20 | 2013-12-04 | 日本碍子株式会社 | 陶瓷-金属接合体及其制法 |
WO2010147070A1 (ja) | 2009-06-15 | 2010-12-23 | 味の素株式会社 | 樹脂組成物及び有機電解液電池 |
CN101916656A (zh) * | 2010-07-15 | 2010-12-15 | 王海龙 | 一种电力电容器 |
CN102136367A (zh) * | 2010-12-18 | 2011-07-27 | 桂林电力电容器有限责任公司 | 电力电容器电气引出端子 |
-
2013
- 2013-11-08 US US14/075,350 patent/US9490067B2/en active Active
-
2014
- 2014-11-05 EP EP14860517.3A patent/EP3066170B1/en active Active
- 2014-11-05 CN CN201480060441.9A patent/CN105683318B/zh active Active
- 2014-11-05 KR KR1020167011955A patent/KR102288169B1/ko active IP Right Grant
- 2014-11-05 AU AU2014346929A patent/AU2014346929B2/en active Active
- 2014-11-05 WO PCT/US2014/063983 patent/WO2015069676A1/en active Application Filing
- 2014-11-05 BR BR112016008163-3A patent/BR112016008163B1/pt active IP Right Grant
- 2014-11-06 AR ARP140104177A patent/AR098329A1/es unknown
-
2016
- 2016-11-04 US US15/343,468 patent/US9761374B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR102288169B1 (ko) | 2021-08-09 |
WO2015069676A1 (en) | 2015-05-14 |
EP3066170B1 (en) | 2019-09-18 |
US9490067B2 (en) | 2016-11-08 |
US20170053742A1 (en) | 2017-02-23 |
EP3066170A4 (en) | 2017-06-28 |
BR112016008163A2 (zh) | 2017-08-01 |
US20150132581A1 (en) | 2015-05-14 |
EP3066170A1 (en) | 2016-09-14 |
AU2014346929A1 (en) | 2016-04-21 |
AR098329A1 (es) | 2016-05-26 |
CN105683318A (zh) | 2016-06-15 |
KR20160083870A (ko) | 2016-07-12 |
US9761374B2 (en) | 2017-09-12 |
AU2014346929B2 (en) | 2017-08-03 |
BR112016008163B1 (pt) | 2022-05-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN105683318B (zh) | 使用环氧树脂组合物接合异质材料 | |
US3721948A (en) | Terminal assembly | |
US4319074A (en) | Void-free electrical conductor for power cables and process for making same | |
US9660374B2 (en) | Sealed electrical connector for magnetic bearings | |
KR20200059284A (ko) | 전기 절연 코팅을 구비한 개스킷 | |
CN107768118A (zh) | 电容式变压器瓷伞裙套管 | |
CN109074948A (zh) | Hv设备和制造此类设备的方法 | |
US3388211A (en) | Sealing bushing and wall member for electrical apparatus and method of assembling same | |
CN101986520A (zh) | 制冷电机引出线密封方法 | |
JP2016521431A5 (ja) | 電気ブッシング適用 | |
JP5592515B2 (ja) | フッ素樹脂コーティング構造体およびその製造方法 | |
JP2014093176A (ja) | オートマチックトランスミッション用コネクタ | |
CN104734392B (zh) | 一种耐氨电机及其制备方法 | |
CN207021129U (zh) | 一种瓷套式变压器套管 | |
EP0481624B1 (en) | A sealing composition and a mineral insulated electric cable termination employing such composition | |
CN2189372Y (zh) | 密闭式隔爆型电加热器 | |
Euvrard et al. | Advances in High Voltage Outdoor Dry Type Cable Terminations: An Easy to Install Cable Termination Design that Combines Capacitive Graded Stress Control with a Robust Self-Supporting Termination Body | |
KR200459329Y1 (ko) | 고절연 고압 저항 | |
RU59315U1 (ru) | Нагревостойкий обмоточный провод | |
CN108467686A (zh) | 在绝缘材料与金属组件之间形成固化密封的方法及应用 | |
CN204066784U (zh) | 耐水型电磁线 | |
Volberg | Junction boxes for photovoltaic modules—qualification and tests. | |
Krüsi et al. | New paper-free insulation technology for dry high-voltage condenser bushings | |
Waldon | Evaluation of electrical insulation exposed to amorphous metal transformer core annealing temperature | |
Warburton | Construction of fuel quality sensors for high performance aircraft |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20190530 Address after: Dublin, Ireland Patentee after: Eaton Intelligent Power Co.,Ltd. Address before: American Texas Patentee before: Cooper Technologies Co. |
|
TR01 | Transfer of patent right |