CN105683318B - 使用环氧树脂组合物接合异质材料 - Google Patents

使用环氧树脂组合物接合异质材料 Download PDF

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Publication number
CN105683318B
CN105683318B CN201480060441.9A CN201480060441A CN105683318B CN 105683318 B CN105683318 B CN 105683318B CN 201480060441 A CN201480060441 A CN 201480060441A CN 105683318 B CN105683318 B CN 105683318B
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China
Prior art keywords
epoxy resin
sealing
capacitor
insulating bushing
capacitor box
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CN201480060441.9A
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Chinese (zh)
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CN105683318A (zh
Inventor
C·李
S·J·里格比
C·L·费勒斯
M·J·梅森
S·R·阿扎尔
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Eaton Intelligent Power Ltd
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Cooper Technologies Co
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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    • B32B15/18—Layered products comprising a layer of metal comprising iron or steel
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    • B32—LAYERED PRODUCTS
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    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/061—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of metal
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    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
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    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
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    • C08J5/124—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives using adhesives based on a macromolecular component
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10—Housing; Encapsulation
    • H01G2/103—Sealings, e.g. for lead-in wires; Covers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/004—Details
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    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B2037/1253—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives curable adhesive
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN201480060441.9A 2013-11-08 2014-11-05 使用环氧树脂组合物接合异质材料 Active CN105683318B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/075,350 US9490067B2 (en) 2013-11-08 2013-11-08 Joining dissimilar materials using an epoxy resin composition
US14/075,350 2013-11-08
PCT/US2014/063983 WO2015069676A1 (en) 2013-11-08 2014-11-05 Joining dissimilar materials using an epoxy resin composition

Publications (2)

Publication Number Publication Date
CN105683318A CN105683318A (zh) 2016-06-15
CN105683318B true CN105683318B (zh) 2019-03-22

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US (2) US9490067B2 (https=)
EP (1) EP3066170B1 (https=)
KR (1) KR102288169B1 (https=)
CN (1) CN105683318B (https=)
AR (1) AR098329A1 (https=)
AU (1) AU2014346929B2 (https=)
BR (1) BR112016008163B1 (https=)
WO (1) WO2015069676A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI3196489T6 (fi) * 2014-09-19 2024-08-15 Yamauchi Corporation Teollisuustela ja menetelmä sen valmistamiseksi
US10253956B2 (en) 2015-08-26 2019-04-09 Abl Ip Holding Llc LED luminaire with mounting structure for LED circuit board
CN108467686A (zh) * 2017-02-23 2018-08-31 海门市瑞泰纺织科技有限公司 在绝缘材料与金属组件之间形成固化密封的方法及应用
JP6912316B2 (ja) * 2017-08-01 2021-08-04 株式会社日立製作所 樹脂金属複合体の解体方法
US10251279B1 (en) 2018-01-04 2019-04-02 Abl Ip Holding Llc Printed circuit board mounting with tabs
US10818434B2 (en) * 2018-04-11 2020-10-27 Eaton Intelligent Power Limited Adaptor for a capacitor
CN115298780B (zh) * 2020-03-27 2025-08-01 日本贵弥功株式会社 电解电容器

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2333354A (en) 1940-03-06 1943-11-02 Electric Transmission Ltd Electric fuse of cartridge type
US2922927A (en) * 1956-03-29 1960-01-26 Ohio Brass Co Electrical apparatus bushing
US2977414A (en) 1957-12-06 1961-03-28 Peter G S Mero Control system
US3140859A (en) 1961-01-17 1964-07-14 Internat Ultrasonics Inc Electroacoustic sandwich transducers
US3275358A (en) * 1963-03-14 1966-09-27 Gen Electric Glass-to-metal and glass-to-ceramic seals
GB1060528A (en) 1964-12-08 1967-03-01 Siemens Ag Process for the production of torsion-resistant metal-ceramic connections
US3368175A (en) 1966-04-08 1968-02-06 Gen Electric Voltage lead entrance for encapsulated electrical devices
GB1137928A (en) * 1966-10-03 1968-12-27 Smiths Industries Ltd Improvements in or relating to high-voltage bushing assemblies
US3505630A (en) 1968-01-29 1970-04-07 Micro Devices Corp Fuse construction
US3647405A (en) 1969-12-12 1972-03-07 Ray F Smith Garbage incinerator and method of operation
US3723930A (en) 1972-02-10 1973-03-27 Gen Electric Oil immersible current limiting fuse assembly
US4453197A (en) * 1981-10-22 1984-06-05 Mcgraw-Edison Company Dielectric fluid tank
SU1065458A1 (ru) 1982-07-19 1984-01-07 Ленинградский Ордена Октябрьской Революции И Ордена Трудового Красного Знамени Технологический Институт Им.Ленсовета Эпоксидна композици
US4595557A (en) 1985-04-11 1986-06-17 Emerson Electric Co. Method of increasing hermeticity of metal components of glass/metal and ceramic/metal seals
US4846163A (en) 1987-08-24 1989-07-11 Cooper Industries, Inc. Method of sealing capacitor bushings
JPH0625331B2 (ja) * 1988-03-18 1994-04-06 ソマール株式会社 バッテリーケース用接着剤組成物
US5161728A (en) 1988-11-29 1992-11-10 Li Chou H Ceramic-metal bonding
US5406448A (en) * 1992-06-17 1995-04-11 Cooper Power Systems, Inc. Capacitor hanger and attachment method
US5371650A (en) 1994-02-15 1994-12-06 Electronic Concepts, Inc. Hermetically sealed capacitor and method for making the same
US5766517A (en) * 1995-12-21 1998-06-16 Cooper Industries, Inc. Dielectric fluid for use in power distribution equipment
US5935372A (en) 1997-04-29 1999-08-10 Occidental Chemical Corporation Adhesive sealant for bonding metal parts to ceramics
US6627966B2 (en) 2000-11-29 2003-09-30 Samsung Electro-Mechanics Co., Ltd. Method and device for sealing ceramic package of saw filter
US6500795B2 (en) 2001-01-24 2002-12-31 Honeywell International Inc. Azeotrope-like composition of 1-chloro-1,3,3,3-tetrafluoropropane and hydrogen fluoride
US6585917B2 (en) * 2001-04-12 2003-07-01 Cooper Industries, Inc. Dielectric fluid
US20060194064A1 (en) * 2002-03-01 2006-08-31 Xiao Allison Y Underfill encapsulant for wafer packaging and method for its application
US20040251237A1 (en) 2003-06-13 2004-12-16 Meyer Jeffry R. Circuit breaker with bonded bushing insulators
RU2329257C2 (ru) 2003-07-01 2008-07-20 Оцука Кемикал Ко., Лтд. Электролит, электролитический состав и раствор, конденсатор, вторичный литиевый элемент и способ получения соли четвертичного аммония
CN100594089C (zh) * 2004-08-25 2010-03-17 松下电器产业株式会社 焊料组合物、利用焊接的连接方法和衬底的生产方法
EP1932648A1 (en) 2006-12-15 2008-06-18 Sika Technology AG Structural reinforcement material, insert, and reinforced cavity comprising same
US7857194B2 (en) 2007-05-01 2010-12-28 University Of Dayton Method of joining metals to ceramic matrix composites
EP2178094A4 (en) * 2007-08-02 2013-02-20 Hitachi Chemical Co Ltd SWITCHING CONNECTING MATERIAL AND CONNECTING STRUCTURE OF A SWITCHING ELEMENT AND CONNECTION METHOD OF A SWITCHING ELEMENT ON THE SWITCHING CONNECTING MATERIAL
US8082663B1 (en) 2007-11-12 2011-12-27 Sandia Corporation Method for hermetic electrical connections
WO2010095720A1 (ja) 2009-02-20 2010-08-26 日本碍子株式会社 セラミックス－金属接合体及びその製法
CN102459395B (zh) 2009-06-15 2015-01-28 味之素株式会社 树脂组合物和有机电解液电池
CN101916656A (zh) * 2010-07-15 2010-12-15 王海龙 一种电力电容器
CN102136367A (zh) * 2010-12-18 2011-07-27 桂林电力电容器有限责任公司 电力电容器电气引出端子

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US9490067B2 (en) 2016-11-08
AU2014346929B2 (en) 2017-08-03
BR112016008163A2 (https=) 2017-08-01
KR102288169B1 (ko) 2021-08-09
KR20160083870A (ko) 2016-07-12
CN105683318A (zh) 2016-06-15
WO2015069676A1 (en) 2015-05-14
US20150132581A1 (en) 2015-05-14
EP3066170B1 (en) 2019-09-18
EP3066170A1 (en) 2016-09-14
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US20170053742A1 (en) 2017-02-23
BR112016008163B1 (pt) 2022-05-17

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