CN105666977A - 一种石墨烯涂布型掺杂方法 - Google Patents
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Abstract
本发明提供一种石墨烯涂布型掺杂方法,该方法包括以下步骤:步骤一,配制掺杂涂布液;步骤二,在目标基底表面涂布掺杂液;步骤三,将带有涂布液基底加热进行聚合固化处理,形成掺杂涂层;步骤四,用去离子水浸泡掺杂涂层并烘干;步骤五,在掺杂涂层上转移覆盖石墨烯,形成由目标基底、第一掺杂涂层、石墨烯依次组成的复合结构。进一步,还可在此复合结构上重复上述步骤一至步骤四可形成第二层掺杂涂层。本发明的有益效果是:采用涂布掺杂工艺,掺杂涂层厚度均匀可控,适合大面积“卷对卷”式生产;此外,掺杂涂层本身稳定,且位于石墨烯与目标基底之间,掺杂效果稳定持久。
Description
技术领域
本发明涉及石墨烯生产技术领域,尤其涉及一种石墨烯涂布型掺杂方法。
背景技术
石墨烯是近十年发现的新型二维碳纳米材料,具有优异的力、热、光、电等方面性能。其中,极高的透过率及超高的载流子迁移率,使其可作为全新的透明导电材料而备受工业界关注。
目前,对于二维连续的石墨烯薄膜产品,电学性能是其核心关键性能。现有较为成熟的化学气相沉积法(CVD)制备的石墨烯薄膜方阻较高,不能直接使用,必须对其进行掺杂以降低方阻。当前主流掺杂方法大多是以小分子为掺杂剂,例如乙二胺、硝酸、氯金酸等,通过物理吸附使其附着在石墨烯表面达到掺杂目的。然而,物理吸附的小分子掺杂剂与石墨烯作用力弱,易迁移和挥发,放置过程中导致石墨烯方阻持续增加,严重限制了石墨烯的实际应用。
发明内容
本发明目的在于为了克服上述背景技术的不足,提供一种涂布型掺杂方法,能够实现大面积均匀、稳定掺杂效果,并适合规模化生产。
本发明所涉及的一种石墨烯掺杂转移方法,该方法包括以下步骤:
步骤一,配制掺杂涂布液,其组成为:导电高分子前驱体、氧化剂、稳定剂及惰性溶剂;其中,所述导电高分子前驱体为苯胺、吡咯和噻吩及噻吩衍生物,氧化剂为三氯化铁或对甲苯磺酸铁(Fe(Tos)3),稳定剂为吡啶,惰性溶剂为乙醇、甲醇、异丙醇、正丁醇、乙二醇、乙二醇单甲醚、乙二醇单乙醚、乙二醇单丁醚中的一种或几种;
所述掺杂涂布液中导电高分子前驱体和氧化剂用量摩尔比范围为0.6~2.0;导电高分子前驱体和稳定剂用量摩尔比范围为1.6~2.2;惰性溶剂用量范围为80~95%wt;
步骤二,在目标基底001表面涂布掺杂液,涂布方式为滚涂、狭缝涂布或喷涂;
步骤三,将带有涂布液基底加热进行聚合固化处理,形成第一掺杂涂层002;所述聚合固化处理温度范围为50~120℃,时间为30~120min;
步骤四,在去离子水中浸泡掺杂涂层并烘干,其中,去离子水中浸泡时间为1-5min;
步骤五,将石墨烯003转移覆盖在第一掺杂涂层上,形成由目标基底001、第一掺杂涂层002、石墨烯003依次组成的复合结构。
进一步的,在所述由目标基底001、第一掺杂涂层002、石墨烯003依次组成的复合结构上重复上述步骤一至步骤四可形成第二层掺杂涂层004,得到目标基底001、第一掺杂涂层002、石墨烯003、第二层掺杂涂层004依次组成的复合结构,进一步提升掺杂效果,同时对石墨烯起到一定封装保护效果。
本发明的有益效果是:通过湿法涂布和氧化聚合方法在目标基底表面原位制备掺杂涂层,利用高分子非挥发,难迁移的特点提高掺杂稳定性;此外,湿法涂布能够准确控制涂布厚度,有利于提高掺杂均匀性;另外,湿法涂布可采用“卷对卷”工艺,非常适合规模化连续生产。
附图说明
图1为本发明的步骤流程图;
图2为本发明中所述单面掺杂的目标基底/第一掺杂涂层/石墨烯的复合结构示意图;
图3为本发明中所述双面掺杂的目标基底/第一掺杂涂层/石墨烯/第二层掺杂涂层的复合结构示意图;
附图中,各标号所代表的部件列表如下:
001为目标基底,002为第一掺杂涂层,003为石墨烯,004为第二掺杂涂层。
具体实施方式
下面结合附图和实施例对本发明进一步说明。所举实例只用于解释本发明,并非用于限定本发明的范围。
以下实施例的步骤流程如图1所示,目标基底/第一掺杂涂层/石墨烯的复合结构示意图如图2所示,目标基底/第一掺杂涂层/石墨烯/第二层掺杂涂层的复合结构示意图如图3所示。
实施例一
本实施例步骤如下:
步骤一,称取9.5gFeCl3·6H2O溶于60g无水乙醇和0.2g乙二醇,再加入吡啶1.4g,搅拌均匀后加入3,4-乙撑二氧噻吩单体5g,混合均匀后配成掺杂涂布液;
步骤二,采用滚涂法将掺杂涂布液涂布于目标基底001,湿膜厚度20μm;
步骤三,70℃下加热处理涂层50min;
步骤四,将加热处理后涂层浸于去离子水中1min,取出烘干得到第一掺杂涂层002;
步骤五,在第一掺杂涂层002上转移石墨烯003。
本实施例中,制备的石墨烯方阻均值为232±15欧方,140℃加热90min,并于室温下方阻30天后平均方阻为235±13欧方,掺杂效果均匀稳定。
实施例二
本实施例步骤如下:
步骤一,称取25g对甲苯磺酸铁溶于70g异丙醇、65g正丁醇和15g乙二醇单乙醚组成的混合溶剂,再加入吡啶1.6g,搅拌均匀后加入吡咯单体5g,混合均匀后配成掺杂涂布液;
步骤二,采用狭缝涂布将掺杂涂布液涂布于目标基底001,湿膜厚度15μm;
步骤三,50℃下加热处理120min;
步骤四,加热处理将干燥涂层浸于去离子水中5min,取出烘干得到第一掺杂涂层002;
步骤五,在第一掺杂涂层002上转移石墨烯003。
重复步骤一至步骤四,在石墨烯表面形成第二掺杂涂层004。
本实施例中,制备的石墨烯方阻均值为172±11欧方,140℃加热90min,并于室温下方阻30天后平均方阻为169±12欧方,掺杂效果均匀稳定。
实施例三
本实施例步骤如下:
步骤一,称取30g对甲苯磺酸铁溶于30g甲醇、100g正丁醇、5g乙二醇单甲醚和3g乙二醇单丁醚组成的混合溶剂,再加入吡啶0.6g,搅拌均匀后加入单体苯胺5g,混合均匀后配成掺杂涂布液;
步骤二,采用喷涂法将掺杂涂布液涂布于目标基底001,湿膜厚度25μm;
步骤三,100℃下加热处理30min;
步骤四,加热处理后将干燥涂层浸于去离子水中3min,取出烘干得到第一掺杂涂层002;
步骤五,在第一掺杂涂层002上转移石墨烯003。
本实施例中,制备的石墨烯方阻均值为277±16欧方,140℃加热90min,并于室温下方阻30天后平均方阻为281±15欧方,掺杂效果稳定。
实施例四
本实施例步骤如下:
步骤一,称取11gFeCl3·6H2O溶于80g无水乙醇,再加入吡啶1.1g,搅拌均匀后加入噻吩单体3.6g,混合均匀后配成掺杂涂布液;
步骤二,采用喷涂法将掺杂涂布液涂布于目标基底001,湿膜厚度35μm;
步骤三,55℃下加热处理涂层100min;
步骤四,将加热处理后涂层浸于去离子水中2min,取出烘干得到第一掺杂涂层002;
步骤五,在第一掺杂涂层002上转移石墨烯003。
本实施例中,制备的石墨烯方阻均值为273±23欧方,140℃加热90min,并于室温下方阻30天后平均方阻为275±24欧方,掺杂效果均匀稳定。
以上所述仅为本发明的较佳实施例,并不用以限制本发明,凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。
Claims (2)
1.一种石墨烯涂布型掺杂方法,其特征在于,该方法包括以下步骤:
步骤一,配制掺杂涂布液,其组成为:导电高分子前驱体、氧化剂、稳定剂及惰性溶剂;其中,所述导电高分子前驱体为苯胺、吡咯和噻吩及噻吩衍生物,氧化剂为三氯化铁或对甲苯磺酸铁(Fe(Tos)3),稳定剂为吡啶,惰性溶剂为乙醇、甲醇、异丙醇、正丁醇、乙二醇、乙二醇单甲醚、乙二醇单乙醚、乙二醇单丁醚中的一种或几种;
所述掺杂涂布液中导电高分子前驱体和氧化剂用量摩尔比范围为0.6~2.0;导电高分子前驱体和稳定剂用量摩尔比范围为1.6~2.2;惰性溶剂用量范围为80~95%wt;
步骤二,在目标基底(001)表面涂布掺杂液,涂布方式为滚涂、狭缝涂布或喷涂;
步骤三,将带有涂布液基底加热进行聚合固化处理,形成第一掺杂涂层(002);所述聚合固化处理温度范围为50~120℃,时间为30~120min;
步骤四,在去离子水中浸泡掺杂涂层并烘干,其中,去离子水中浸泡时间为1-5min;
步骤五,将石墨烯(003)转移覆盖在第一掺杂涂层上,形成由目标基底(001)、第一掺杂涂层(002)、石墨烯(003)依次组成的复合结构。
2.根据权利要求1所述的一种石墨烯涂布型掺杂方法,其特征在于,在所述由目标基底(001)、第一掺杂涂层(002)、石墨烯(003)依次组成的复合结构上重复上述步骤一至步骤四可形成第二层掺杂涂层(004),得到目标基底(001)、第一掺杂涂层(002)、石墨烯(003)、第二层掺杂涂层(004)依次组成的复合结构。
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CN108101027A (zh) * | 2017-12-29 | 2018-06-01 | 重庆墨希科技有限公司 | 大面积cvd石墨烯掺杂转移方法 |
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CN108075041A (zh) * | 2016-11-18 | 2018-05-25 | 昆山工研院新型平板显示技术中心有限公司 | 一种柔性复合电极,其制备方法及应用 |
CN108305705A (zh) * | 2017-12-15 | 2018-07-20 | 无锡格菲电子薄膜科技有限公司 | 石墨烯复合薄膜及其制备方法和应用 |
CN108101027A (zh) * | 2017-12-29 | 2018-06-01 | 重庆墨希科技有限公司 | 大面积cvd石墨烯掺杂转移方法 |
CN108198746A (zh) * | 2017-12-29 | 2018-06-22 | 重庆墨希科技有限公司 | Cvd石墨烯复合型掺杂结构及其制备方法 |
CN108101027B (zh) * | 2017-12-29 | 2020-01-31 | 重庆墨希科技有限公司 | 大面积cvd石墨烯掺杂转移方法 |
CN108198746B (zh) * | 2017-12-29 | 2020-06-19 | 重庆墨希科技有限公司 | Cvd石墨烯复合型掺杂结构及其制备方法 |
CN108648853A (zh) * | 2018-03-30 | 2018-10-12 | 重庆墨希科技有限公司 | 石墨烯附着增强的复合导电结构及其制备方法 |
CN108648853B (zh) * | 2018-03-30 | 2020-01-31 | 重庆墨希科技有限公司 | 石墨烯附着增强的复合导电结构及其制备方法 |
CN108760425A (zh) * | 2018-05-30 | 2018-11-06 | 重庆第二师范学院 | 一种氧化石墨烯基前处理装置及其在食品检测中的应用 |
CN109607523A (zh) * | 2019-01-04 | 2019-04-12 | 无锡第六元素电子薄膜科技有限公司 | 一种高温稳定掺杂的无损石墨烯复合薄膜及其制备方法 |
CN109607523B (zh) * | 2019-01-04 | 2022-09-13 | 常州第六元素半导体有限公司 | 一种高温稳定掺杂的无损石墨烯复合薄膜及其制备方法 |
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