CN105666310B - A kind of quartz wafer grinding control method based on waveform-matching approach - Google Patents
A kind of quartz wafer grinding control method based on waveform-matching approach Download PDFInfo
- Publication number
- CN105666310B CN105666310B CN201610045507.8A CN201610045507A CN105666310B CN 105666310 B CN105666310 B CN 105666310B CN 201610045507 A CN201610045507 A CN 201610045507A CN 105666310 B CN105666310 B CN 105666310B
- Authority
- CN
- China
- Prior art keywords
- frequency
- frequency measurement
- parameter
- waveform
- online
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R23/00—Arrangements for measuring frequencies; Arrangements for analysing frequency spectra
- G01R23/02—Arrangements for measuring frequency, e.g. pulse repetition rate; Arrangements for measuring period of current or voltage
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Numerical Control (AREA)
Abstract
The invention discloses a kind of quartz wafer grinding control methods based on waveform-matching approach, can stablize the frequency measured in real time from 5M to 70MHZ in quartz wafer process of lapping；This system can show the various states in wafer grinding production process and advise, quartz wafer grinding state is monitored in real time during online frequency measurement, if abnormal conditions occur shuts down grinder in real time, the generation of overclocking event is prevented, user can effectively improve production efficiency according to these states for touching screen display；It adds in " frequency hopping constraints policy " and thoroughly solves the problems, such as ALC systems " saltus step of frequency measurement value occurs in certain frequency ranges "；The defects of providing the diversified statistical parameter such as the real-time average frequency of wafer grinding, grinding rate and scattered error, scientific basis provided to replace abrasive sand and repair grinding disk, solving ALC systems " can not monitoring grinder state ".
Description
Technical field
The present invention relates to a kind of quartz wafer grinding control methods based on waveform-matching approach.
Background technology
Electronics and information industry is the pillar industries of the national economy, and quartz oscillator has pole in electronic information industry
Its consequence.China is the big producer of quartz crystal component, but the output value, product quality are compared with developed countries still
There is larger gap.Industry develops very rapidly in recent years, to the process equipment in quartz crystal component production process and online
The demand of high-precision measuring and controlling equipment is also being continuously increased.
In the step for wafer grinding is step essential in quartz crystal oscillator production process, and chip electric parameters testing is
Crucial observation and control technology, domestic many research institutions have all carried out research and probe to it.20th century the nineties, University Of Tianjin is just
Transmission method principle based on international standard measures the electrical parameter of quartz crystal.From 2002 to 2004 year, Beijing machine
Tool engineering institute measures influence of the distributed constant to measurement accuracy in the principle of quartz crystal electrical parameter and π networks to π network techniques
It is studied.College of Information Science and Engineering of Central South University proposed a kind of using Direct Digital Frequency Synthesizers in 2004
(DDS) quartz wafer electrical parameter computer measurement system is realized as the method for exciting signal source and based on this.It navigates in Beijing
Empty space flight university devised the quartz crystal Electric Power Measurement System that a kind of frequency is up to 200 MHz in 2006.It breathes out within 2009
Your shore polytechnical university designs quartz crystal parameter measurement system based on π Network Maximum Transmission measuring methods, is selected in design
Control module of the digital signal processor (DSP) as system with high-speed data processing capacity.In research and development of products field, state
Inside and outside quartz crystal electrical parameter Technology of Frequency Measurement by Using has a long way to go.250A, 250B series of network analyzer and favour of S＆A companies of the U.S.
The frequency measurement range of the E5100 series of network analyzers of general company is born in 20 KHz-400 KHz and 0.5 MHz-200 MHz
It carries resonant frequency measurement accuracy to reach within 2 ppm, represents the highest level in the world in quartz wafer static state frequency measurement field.It is domestic
In addition to the KH1200 testers of Hong Kong Kolinker companies, error and 250B are suitable, then are substituted without other similar products.
Mill is constantly slided relative to chip in wafer grinding production process, is not to exist always under detecting head
Chip, resonance signal are interruptions；In addition, the RF excited watt level needed for different frequency range chip is different；Therefore,
The resonant frequency parameter of chip is real-time and accurately tested in the dynamic process of grinding, chip in disk is accurately made to reach target frequency
Rate and overclocking production accident caused by overmastication cannot occur, it is desirable to which corresponding measurement and control instrument has " dynamic useful signal
Extraction " and " dynamic power feedback " function.Therefore, research contents mentioned above and commercial product can not meet online frequency measurement
Technology requirement.Domestic and international many wafer fabrication providers all use the online frequency monitoring instrument of TRANSAT companies of the U.S. at present
（ALC）Online monitoring method is carried out to chip frequency.Traditional ALC systems have the extraction of dynamic useful signal and dynamic power feeds back work(
Can, it can realize the function of online frequency measurement in wafer manufacture, this technology is at present by foreign countries' monopolization.But with quartz crystal oscillator
Industry technology makes rapid progress, and ALC systems occur more and more to ignore in production practices updating therewith
The problem of.
First, the resonant frequency of quartz crystal oscillator product is continuously improved, and highest frequency range has reached 50 MHz -60 MHz, very
Multiple enterprises can encounter during ALC is actually used such as " to be occurred the saltus step of frequency measurement value in certain frequency ranges " and can not effectively control
The defects of amount of grinding, seriously affects product quality and manufacturing schedule.This is because when accidentally measuring occur in ALC systems, frequency measurement
There is asking for frequency measurement value saltus step there is no the mechanism according to actual grinding situation removal " accidentally measured frequency " in noise circumstance in method
Topic also just becomes inevitable.
Secondly, the yield of crystal oscillator greatly improves, and the consumption of abrasive sand and abrasive disk is very huge, how to improve abrasive sand
Service efficiency with abrasive disk is the key that each manufacturer reduces production cost.From the angle of grinder management and control, corresponding observing and controlling
Equipment needs to have the ability of chip frequency distribution in statistics abrasive disk, to assess the processing quality of preceding working procedure and grinding system
State, as replace abrasive sand and repair grinding disk foundation.However, ALC systems, which only provide, " reaches grinding target frequency
The control strategy of stopping ", does not relate to the parameter monitorings such as grinding rate and frequency scattered error and corresponding control strategy, this is just
Cause it that can not be monitored to abrasive sand and abrasive disk surface state.
Therefore, with reference to produce reality research and the exploration online Technology of Frequency Measurement by Using of quartz wafer, traditional ALC system architectures are broken away from,
For " frequency measurement value saltus step occurs in certain frequency ranges " in online frequency measurement and control method and " can not monitoring grinder state " this two
A problem innovatively proposes a kind of online frequency measurement and the control method of quartz wafer grinding, sets according to the proposed method
Meter is to work as with strong interference immunity, the online Frequency Measurement System of wafer grinding that stable, statistical parameter is various, control strategy opens
The active demand of preceding major crystal oscillator production firm of the country.The achievement of the present invention is to improving quartz wafer industry production efficiency and product
Quality plays an important roll, also significant to improving China's quartz crystal oscillator industry whole competitiveness.
Invention content
For above-mentioned technological deficiency, the present invention proposes a kind of quartz wafer grinding control side based on waveform-matching approach
Method.
In order to solve the above-mentioned technical problem, technical scheme is as follows：
A kind of quartz wafer grinding control method based on waveform-matching approach,
After system energization booting, peripheral hardware initial configuration is carried out, prompt system is initially powered up work after peripheral hardware initializes
Make；
System enters hardware check, and hardware check result is shown；Hardware check is not by then waiting for user to be examined
Self-test is re-started after repairing；Data initialization flow is then entered by hardware check；System enters and treats after data initialization
Machine state；
System in the standby state real-time inspection and control and set button operation, and according to control and setting button behaviour
Make, after making control action or reading arrange parameter, control action is made according to the parameter of setting；
The control and the operation of setting button include the operation into single frequency measurement flow, read controlling strategy parameter
The operation that operate, obtains online frequency measurement parameter, into repairing disk flow operations and enter the operation of online frequency measurement flow.
Further, the operation of single frequency measurement flow includes：
Single frequency measurement flow carries out resonant frequency test, single frequency measurement flow according to the setting of sweep parameters to quartz wafer
Processing to the AD sampled datas of system is obtained by waveform-matching approach, data smoothing processing and the analysis of maximizing method
Static resonance frequency, standard deviation, real-time peak height, resonance line width, the resonance times in the unit interval of chip, frequency measurement result are sent
It is shown.
Further, the control and the operation of setting button further include parameter setting operation, system real time monitoring user
Parameter setting operation state, once into parameter setting operation state, to sweep parameters, the Waveform Matching in system operation
Parameter, resonant frequency display parameters and resonant frequency constrained parameters are configured；Sweep parameters include frequency sweep time in the unit interval
Number, frequency sweep amplitude, sweep velocity, frequency sweep stepping；Waveform Matching parameter includes search width, peak value constrains；Resonant frequency is shown
Parameter includes frequency calibration；Resonant frequency constrained parameters include very poor setting.
Further, the operation for reading controlling strategy parameter includes：
System real time monitoring reads the state of the operation of controlling strategy parameter, once into the operation of controlling strategy parameter,
To in system operation online frequency measurement controlling strategy parameter, online frequency measurement statistical parameter, number of turns statistical parameter, repair disk parameter
It is configured；When online frequency measurement controlling strategy parameter includes target frequency arrival number, number is jumped out in frequency measurement extremely, exception is jumped out
Between, abnormal jump out that very poor setting, rate jumps out the upper limit, rate jumps out lower limit；Online frequency measurement statistical parameter includes frequency statistics, speed
Rate statistics, very poor statistics；Number of turns statistical parameter includes false triggering filtering time, filtering wave by prolonging time time, starts to count the number of turns；Repair disk
Parameter includes repairing the disk time, repaiies disk abnormal post-set time.
Further, include into repairing disk flow operations：System monitors the state for repairing disk flow operations in real time, once into
Disk flow operations are repaiied, when starting to repair disc gage, are terminated once repairing the timing of disk time, disk flow is repaiied in end, and system will be returned to standby shape
State, system record repair the disk time；Urgent pause is such as encountered during disk is repaiied, then system immediately repair by standby mode, system record
The disk time.
Further, include into the operation of online frequency measurement flow：System will start grinder and open abrasive sand switch；
Online processing of the frequency measurement flow to the AD sampled datas of system, by carrying out waveform-matching approach to AD sampled datas, data are put down
Sliding processing and maximizing method calculate the real-time resonant frequencies of quartz wafer, are calculated according to current statistical parameter average
Resonant frequency, grinding rate and very poor, the transmission of frequency measurement result are shown；
Stop in online frequency measurement flow if not done by artificial, system is by continuous monitor wafer real-time frequency, when average
Resonant frequency is more than that the target frequency that the number of grinding target frequency reaches in controlling strategy parameter reaches number, and system, which is shut down, grinds
Grinding machine simultaneously records grinding information.
Further, when abnormal if there is frequency measurement exception, rate exception, very poor exception, SD card in online frequency measurement flow
These abnormalities will jump out online frequency measurement flow, into standby mode, while record the reason of jumping out online frequency measurement flow.
Further, the peripheral hardware initial configuration includes buzzer initialization, indicator light initialization, grinder start and stop control
Port initialization processed, grinder lap signal detection port initialization, the port initialization of abrasive sand start-up and shut-down control, AD samplings are matched
It puts, the initialization of initialization of (a) serial ports, power down memory module, timer initializes and the initialization of DDS scan modules.
Further, the hardware check includes the self-test of power down memory module, the self-test of DDS scan modules, grinder connection
State self-test, abrasive sand switch connection status and lap signal connection status self-test.
Further, data initialization flow includes initialization control and setting button, is read according in power down memory module
Pathological system status indicator lamp in the data setting main interface taken；Initialization survey statistical information；It is read from power down memory module
Online frequency measurement parameter, static test parameter and controlling strategy parameter are taken, and is sent to touch screen and shows；It is read from power down memory module
Grinding initial frequency, grinding target frequency and frequency calibration is taken to issue touch screen and show.
The beneficial effects of the present invention are：It can stablize in quartz wafer process of lapping and measure from 5M to 70MHZ in real time
Frequency；This system can show the various states in wafer grinding production process and advise, real during online frequency measurement
When monitor quartz wafer grinding state, if abnormal conditions occur shuts down grinder in real time, prevent the generation of overclocking event, Yong Huke
These states according to screen display is touched effectively improve production efficiency；It adds in " frequency hopping constraints policy " and thoroughly solves ALC systems
The problem of " saltus step of frequency measurement value occurs in certain frequency ranges "；It is more to provide the real-time average frequency of wafer grinding, grinding rate and scattered error etc.
Sample statistical parameter provides scientific basis to replace abrasive sand and repair grinding disk, and solving ALC systems " can not monitor grinding
The defects of machine state ".
Description of the drawings
Fig. 1 grinds online Frequency Measurement System framework map for quartz wafer；
Fig. 2 is human-computer interaction interface main interface design；
Fig. 3 is human-computer interaction interface Administrator interface；
Fig. 4 is human-computer interaction interface static test interface；
Fig. 5 is human-computer interaction interface control strategy interface；
Fig. 6 is human-computer interaction interface parameter setting interface；
Fig. 7 is the harmonic wave of quartz wafer；
Fig. 8 is system general flow chart；
Fig. 9 is peripheral hardware initialization flowchart；
Figure 10 is System self-test flow chart；
Figure 11 is data initialization flow chart；
Figure 12 is single frequency measurement flow chart；
Figure 13 is online frequency measurement flow chart；
Figure 14 is harmonic wave searching method schematic diagram；
Figure 15 is harmonic wave searching method flow chart；
Figure 16 is waveform-matching approach flow chart；
Figure 17 is data smoothing process chart；
Figure 18 is maximizing method flow diagram.
Specific embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described further.
Frequency measurement proposed by the present invention and control method grind online Frequency Measurement System for quartz wafer, and online Frequency Measurement System is used
In obtaining the information such as chip resonant frequency value, grinding rate, scattered error in quartz wafer process of lapping in real time, while according to actually grinding
Mill situation shuts down grinder.
Quartz wafer grinds online Frequency Measurement System：
It is as shown in Figure 1 that quartz wafer grinds online Frequency Measurement System.Online frequency measurement proposed by the present invention and control method are applicable in
In the Frequency Measurement System built based on the system architecture.The online Frequency Measurement System of quartz wafer is by MCU, DDS scan module, power amplification
Circuit module, π lattice networks module, operational amplifier circuit module, peak detection circuit module, filter circuit module, touch screen circuitry
Module and power module are formed.
Quartz wafer grinds online frequency measurement and control method, the controlling party including frequency measuring method and based on the assessment method
Method.
Specifically comprise the following steps：
As shown in Fig. 2 ~ Fig. 6, the interactive interface of online Frequency Measurement System is ground for quartz wafer, wafer grinding machine start and stop control
System switch, grinder lap signal detection device and abrasive sand start-up and shut-down control switch are connected to system, by π network interface circuit moulds
The counter electrode slot for outputting and inputting electrode and being connected to grinder upper millstone of block；System power supply interface is connected to 220V cities
Electricity, while ensure there is arrangement chip to be measured on grinder.
After system energization booting, as shown in figure 8, peripheral hardware initial configuration is first carried out, including buzzer initialization, indicator light
Initialization, the port initialization of grinder start-up and shut-down control, grinder lap signal detection port initialization, abrasive sand start-up and shut-down control end
At the beginning of mouth initialization, AD samplings configuration, initialization of (a) serial ports, the initialization of power down memory module, timer initialization and DDS scan modules
Beginningization；Buzzer call prompt system is initially powered up work after peripheral hardware initializes；
System enters hardware check program, and hardware check includes the self-test of power down memory module, the self-test of DDS scan modules, grinds
The self-test of grinding machine connection status, abrasive sand switch connection status and lap signal connection status self-test；Hardware check result is touching
Screen display；Hardware check re-starts self-test after not overhauled by then waiting for user；Number is then entered by hardware check
According to initialization flow, including " grinding ", " repairing disk ", " promptly suspend " and " administrator sets in initialization touch screen main interface
Put " button；" frequency measurement is abnormal ", " rate is abnormal " and " pole in the data setting main interface read in power down memory module
Difference is normal " system state indicator；Initialize surveys such as " average resonance frequencies ", " Mean Speed ", " very poor " and " historical data "
Measure statistical information；Online frequency measurement parameter, static test parameter and controlling strategy parameter are read, and be sent to from power down memory module
Touch screen is shown；Grinding initial frequency, grinding target frequency and frequency calibration, which are read, from power down memory module issues touch screen display
Show；System enters standby mode after data initialization；
System detects the operation on touch screen in real time in the standby state, if " starting into pressing behind static test interface
Button ", then system enter single frequency measurement flow；If entering control strategy interface backed off after random, controlling strategy parameter is read；If
Enter parameter setting interface backed off after random, then obtain online frequency measurement parameter；If pressing " repairing disk " button in main interface, enter
Repair disk flow；If pressing " grinding " button in main interface, system enters online frequency measurement flow；
Single frequency measurement flow carries out resonant frequency survey according to the setting of sweep parameters in static test interface to quartz wafer
Examination, only there are resonant frequency could be accurately obtained during chip under the input and output electrode of π network interface circuit modules；Single is surveyed
Frequency flow is related to the processing to AD sampled datas, passes through waveform-matching approach, data smoothing processing and maximizing method point
Analysis obtains static resonance frequency, standard deviation, real-time peak height, resonance line width, the resonance times in the unit interval of chip, frequency measurement knot
Fruit is sent to touch screen and is shown；
On system real time monitoring touch screen in Administrator interface " parameter setting " button state, press that " parameter is set
Put " button, into parameter setting interface, the interface in system operation sweep parameters, Waveform Matching parameter, resonance frequency
Rate display parameters and resonant frequency constrained parameters are configured；Sweep parameters include the unit interval in sweep, frequency sweep amplitude,
Sweep velocity, frequency sweep stepping；Waveform Matching parameter includes search width, peak value constrains；Resonant frequency display parameters include frequency
Calibration；Resonant frequency constrained parameters include very poor setting；
System monitors the state of " control strategy " button in Administrator interface on touch screen in real time, presses " control plan
Slightly " button sets interface into controlling strategy parameter, which joins the online frequency measurement control strategy in system operation
Several, online frequency measurement statistical parameter, number of turns statistical parameter are repaiied disk parameter and are configured；Online frequency measurement controlling strategy parameter includes mesh
Mark frequency reaches number, number is jumped out in frequency measurement extremely, exception jumps out the time, exception jumps out very poor setting, rate jumps out the upper limit, speed
Rate jumps out lower limit；Online frequency measurement statistical parameter includes frequency statistics, counting rate, very poor statistics；Number of turns statistical parameter includes missing
Triggering filtering time, the filtering wave by prolonging time time starts to count the number of turns；Disk parameter is repaiied to include repairing the disk time, repair disk abnormal post-set time；
System monitors the state of touch screen in real time, if touch screen presses " repairing disk " button, system, which will enter, repaiies disk flow, presses
Under repair " urgent pause " button in disk interface or repair the disk time to end all is repaiied disk flow, system will be returned to standby shape
State, system record repair the disk time；
After in chip arrangement to the grinding carrier between lower millstone on grinder, setting grinding initial frequency, grinding mesh
Mark frequency and frequency calibration；" grinding " button is pressed in touch screen, system will enter online frequency measurement flow；System, which will start, grinds
Machine simultaneously opens abrasive sand switch；Online frequency measurement flow is related to the processing to AD sampled datas, by being carried out to AD sampled datas
Waveform-matching approach, data smoothing processing and maximizing method calculate the real-time resonant frequencies of quartz wafer, according to current
Statistical parameter calculate average resonance frequencies, grinding rate and very poor, frequency measurement result is sent to touch screen and is shown；
If " stopping " button is not pressed in online frequency measurement flow, system by continuous monitor wafer real-time frequency, when
" average resonance frequencies " reach " target frequency reaches number " of controlling strategy parameter more than the number of " grinding target frequency ", are
System shuts down grinder and records grinding information；
If there is frequency measurement is abnormal, rate is abnormal, very poor exception, these abnormal abnormal shapes of SD card in online frequency measurement flow
State will jump out online frequency measurement flow, and into standby mode, while record jumps out online frequency measurement flow reason；
In online frequency measurement flow, when " grinding rate " " rate jumps out lower limit " less than controlling strategy parameter, system will
Prompting needs replacing abrasive sand；When " scattered error " " jumping out very poor setting extremely " more than controlling strategy parameter, system will be prompted to
It needs to repair abrasive disk；In process of lapping, user can press " stopping " button and terminate online frequency measurement flow at any time, and system will update
" grinder start and stop " LED status, and return to standby mode and record milling time, chip current frequency information；
In above-mentioned steps, " waveform-matching approach " in single frequency measurement flow and online frequency measurement flow refers to harmonic wave matching
Matched waveform is intercepted simultaneously, " data smoothing processing " refers to be carried out closing on smoothing processing method to the waveform of interception, " maximizing
Method " refers to the corresponding resonant frequency of maximum of points for finding interception waveform, while the peak-to-peak value of harmonic wave is required to be more than " peak value
Constraint "；
In above-mentioned steps, " waveform-matching approach ", " data smoothing processing " and " maximizing are passed through in online frequency measurement flow
After method ", the real-time resonant frequencies and the difference of " average resonance frequencies " that are acquired with regard to this are also necessarily less than very poor constraints；Meet
The mode for using storehouse is stored in real-time resonant frequencies storage array by the real-time resonant frequencies of condition, takes real-time resonant frequencies array
The average value of data is " average resonance frequencies "；
In above-mentioned steps, when " average resonance frequencies " are more than the 3/4 of swept frequency range, then swept frequency range elapses forward 1/2, this
Sample is achieved that the real time monitoring of online frequency measurement process.
Quartz wafer harmonic wave：
Quartz wafer harmonic wave is as shown in Figure 7.When the resonant frequency of quartz wafer is in DDS swept frequency ranges, and
The power of input chip reaches the starting of oscillation requirement of chip, and quartz wafer will generate harmonic wave as depicted.
Quartz wafer grinds the main flow chart of online Frequency Measurement System：
The main flow chart that quartz wafer grinds online Frequency Measurement System is as shown in Figure 8.System energization booting after, first to peripheral hardware into
Row initial configuration；Buzzer call prompt system is initially powered up work after peripheral hardware initializes；Hardware device is carried out again certainly
Inspection, self-test is by then entering data initialization flow, not by re-starting self-test after then waiting for user maintenance；Data initialization
After enter standby mode；The button state of system real time monitoring touch screen at this time, if pressing " grinding in touch screen main interface
Mill " button then into online frequency measurement flow, if pressing " repairing disk " button in touch screen main interface, enters and repaiies grinding process,
If pressing " parameter setting " button in Administrator interface, into parameter setting flow, if pressing management member setting circle
" control strategy " button in face, then into control strategy setting procedure, if pressing the START button in static test interface,
Then enter single frequency measurement flow, otherwise system is constantly in standby mode.Single frequency measurement flow and online frequency measurement flow can all incite somebody to action
Frequency measurement result is sent to touch screen and is shown, single frequency measurement flow be sent to touch screen statistical information include real-time frequency,
Standard deviation, real-time peak height, resonance line width harmony are shaken count value；The statistical information that online frequency measurement flow is sent to touch screen includes working as
The resonant frequency of preceding chip, very poor, grinding rate, the number of turns.
Peripheral hardware initializes flow：
Peripheral hardware initialization flow is as shown in Figure 9.Peripheral hardware initialization flow includes the grouping of interrupt nesting vector pattern, delay
Initialization, buzzer initialize, indicator light initializes, AD samples initialization, initialization of (a) serial ports, power down memory module initialize,
Timer initialization, DAC initialization, the initialization of DDS scan modules, the initialization of grinder control port, abrasive sand switch control
Port initialization and the detection port initialization of grinder lap information.
System self-test flow chart
System self-test flow chart is as shown in Figure 10, and System self-test includes touch screen self-test, the self-test of power down memory module, DDS
Scan module self-test, the self-test of grinder connection status, the self-test of abrasive sand equipment connection status and grinder number of turns detection device are certainly
Inspection, self-detection result will be shown on the touchscreen, if all devices self-test passes through, into next flow, if there is equipment self-inspection
Do not pass through, then show on the touchscreen relevant device self-test not by prompt message, wait for related technical personnel maintenance after weight
New self-test.
Data initialization flow journey figure
Data initialization flow journey figure is as shown in figure 11.Data initialization flow includes reading system status information and send
It shown to touch screen, read initial frequency, target frequency and frequency calibration during the online frequency measurement of chip and be sent to touch screen
Display reads single frequency measurement and online frequency measurement parameter and is sent to touch screen and shows, reads controlling strategy parameter and be sent to tactile
It touches screen display and reads power down storage device storage address.
Single frequency measurement flow chart
Single frequency measurement flow chart is as shown in figure 12, and in single frequency measurement flowchart process, sweep parameters will not be according to chip frequency
Change and change, sweep parameters can only be by modifying manually.Single frequency measurement mainly carries out quartz-crystal before starting to grind
Piece static frequency measures, and ensureing quartz wafer, initial frequency setting is correct before the milling.In single frequency measurement flow, first determine whether
Whether the data amount check of AD samplings reaches default value, if not reaching default value, waits for the data of AD samplings
Number reaches default value, if reaching default value, into resonant frequency searching method；Resonant frequency searching method
It is that AD sampled datas are handled by " waveform-matching approach ", " data smoothing processing " and " maximizing method ", obtains resonance frequency
The relevant statistical information of rate, as whether harmonic wave searches for step successfully, where the peak-to-peak value of harmonic wave, harmonic wave cutting edge of a knife or a sword value
Into information such as point, resonance line width, resonance times；After the processing of resonant frequency searching method, need whether to judge resonant frequency
It searches for successfully, if search is unsuccessful, illustrates data when this collected data is not quartz crystal oscillator resonance, then under waiting for
Primary data processing if searched for successfully, judges whether peak-to-peak value is more than setting value, if conditions are not met, illustrating that this is adopted
The data when data collected are not quartz crystal oscillator resonance then wait for data processing next time, if it is satisfied, will be calculated
The information such as resonant frequency value, standard deviation, resonance line width, resonance times be sent to touch screen and show.
Online frequency measurement flow chart
Online frequency measurement flow chart is as shown in figure 13.In online frequency measurement flow, sweep parameters can be with the change of chip frequency
And change.In quartz wafer process of lapping, the frequency of chip can increase with process of lapping, at this moment DDS swept frequency ranges, sweep
The parameters such as frequency amplitude just need to change, and online frequency measurement flow can be achieved with the dynamic modification to sweep parameters.Online frequency measurement flow
In, the sweep parameters that are first revised as sweep parameters in online frequency measurement；It subsequently determines whether AD gathered datas number reaches to set
Definite value if do not reached, continues waiting for reaching setting value until AD gathered data numbers, if reached, carries out resonance frequency
Rate searching method；By resonance searching method processing after, need to judge whether resonant frequency searches for success, if can not search for
Work(illustrates data when this collected data is not quartz crystal oscillator resonance, then waits for data processing next time, if searched
Suo Chenggong, then judge whether peak-to-peak value is more than setting value, if conditions are not met, illustrating that this collected data is not quartz crystal oscillator
Data during resonance then wait for data processing next time, if it is satisfied, then judging whether current frequency meets bandwidth constraints item
Part, if conditions are not met, data processing next time is then waited for, if it is satisfied, then calculating resonance average frequency and relevant statistics
Amount, such as scattered error, grinding rate information；The statistic information being calculated with the constraints set is compared, is such as dissipated
Whether difference meets scattered error constraints, and whether grinding rate is more than the constraints of setting, and the resonance times in the unit interval are
The no constraints for being more than setting, whether the number that resonance average frequency reaches target frequency is less than setting value, if meeting this
Resonance average frequency value and associated statistical information are then sent to touch and shown by a little constraintss, otherwise an only item
Part is unsatisfactory for requiring, then stops online frequency measurement flow, stops grinder, into single frequency measurement flow；If online frequency measurement simultaneously
" stopping " button is pressed in the process, will also stop grinder, into standby mode.
Single frequency measurement flow and online frequency measurement flow are directed to the processing to AD sampled datas, by AD sampled datas
Processing obtain quartz wafer resonant frequency.It can be calculated in real time by carrying out resonant frequency searching method to AD sampled datas
The resonant frequency of quartz wafer.Resonant frequency searching method includes waveform-matching approach, data smoothing processing method and asks most to be worth
Method.
Waveform-matching approach is as shown in Figure 14 ~ 16.According to the wave character of harmonic wave, according to time sequencing on waveform
8 points is taken to carry out amplitude com parison, wherein the spacing between 1,2,3,4,5,6,7 point is a search width, 7,8 points of spacing is 3
A search width, if the 4th point is maximum value, the 7th point is minimum value, and 1,2,3 points of value is sequentially increased, 5,6 two points of value according to
Secondary reduction is then matched waveform for the waveform, this section of waveform interception is out done to the processing of point of proximity data smoothing.
Point of proximity data smoothing process chart is as shown in figure 17.Since harmonic wave is there are some burr signals, pass through
Burr signal can be filtered out after the processing of point of proximity data smoothing.The processing of point of proximity data smoothing is to each on the harmonic wave of interception
The value of point takes the average value of adjacent three point value.
Maximizing method flow diagram is as shown in figure 18.It is maximum to seek the harmonic wave after data smoothing for maximizing method
Position where being worth, the position where maximum value is the position where resonant frequency, is then asked according to the initial frequency of frequency sweep
Go out real-time resonant frequencies.
Using MODBUS communication protocols, which uses query response mechanism, energy for communication between touch screen and MCU
Realize the reliable and stable transmission of data.The interface of MCU real time monitoring touch screens redirects state, whether " grinding " button is pressed, tightly
Whether anxious pause button press, grinds initial frequency and the information such as whether target frequency, frequency measurement parameter are changed.
Parameter setting flow simultaneity factor can monitor some setting informations on touch screen, including single frequency measurement parameter,
Line frequency measurement parameter, is configured sweep parameters in system operation according to these arrange parameters.
The above is only the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
Member, without departing from the inventive concept of the premise, can also make several improvements and modifications, these improvements and modifications also should be regarded as
In the scope of the present invention.
Claims (8)
1. a kind of quartz wafer grinding control method based on waveform-matching approach, which is characterized in that
After system energization booting, peripheral hardware initial configuration is carried out, after peripheral hardware initializes, prompt system is initially powered up work；
System enters hardware check, and hardware check result is shown；After hardware check is not by then waiting for user to be overhauled
Re-start self-test；By then entering data initialization flow after hardware check；System enters standby after data initialization
State；
System in the standby state real-time inspection and control and set button operation, and according to control and setting button operation,
After making control action or reading arrange parameter, control action is made according to the parameter of setting；
The control and the operation of setting button include parameter setting operation, system real time monitoring customer parameter setting operation shape
State, once into parameter setting operation state, to sweep parameters, Waveform Matching parameter, the resonant frequency in system operation
Display parameters and resonant frequency constrained parameters are configured；Sweep parameters include sweep in the unit interval, frequency sweep amplitude, sweep
Frequency speed, frequency sweep stepping；Waveform Matching parameter includes search width, peak value constrains；Resonant frequency display parameters include frequency school
It is accurate；Resonant frequency constrained parameters include very poor setting；
The control and the operation of setting button further include the operation into single frequency measurement flow, the behaviour for reading controlling strategy parameter
The operation make, read online frequency measurement parameter, into repairing disk flow operations and enter the operation of online frequency measurement flow；
The operation of single frequency measurement flow includes：
Single frequency measurement flow carries out resonant frequency test according to the setting of sweep parameters to quartz wafer, and single frequency measurement flow is to being
The processing of the AD sampled datas of system obtains chip by waveform-matching approach, data smoothing processing and the analysis of maximizing method
Static resonance frequency, standard deviation, real-time peak height, resonance line width, the resonance times in the unit interval, frequency measurement result send carry out
Display.
2. a kind of quartz wafer grinding control method based on waveform-matching approach according to claim 1, feature exist
In the operation for reading controlling strategy parameter includes：
System real time monitoring reads the state of the operation of controlling strategy parameter, once into the operation of controlling strategy parameter, to being
System operational process in online frequency measurement controlling strategy parameter, online frequency measurement statistical parameter, number of turns statistical parameter, repair disk parameter progress
Setting；Online frequency measurement controlling strategy parameter includes target frequency arrival number, number is jumped out in frequency measurement extremely, exception jumps out the time,
Exception jump out it is very poor setting, rate jumps out the upper limit, rate jumps out lower limit；Online frequency measurement statistical parameter includes frequency statistics, rate
Statistics, very poor statistics；Number of turns statistical parameter includes false triggering filtering time, filtering wave by prolonging time time, starts to count the number of turns；Repair disk ginseng
Number includes repairing the disk time, repaiies disk abnormal post-set time.
3. a kind of quartz wafer grinding control method based on waveform-matching approach according to claim 1, feature exist
In including into disk flow operations are repaiied：System monitors the state for repairing disk flow operations in real time, once into disk flow operations are repaiied,
When starting to repair disc gage, terminate once repairing the timing of disk time, disk flow is repaiied in end, and system will be returned to standby mode, and system record is repaiied
The disk time；Urgent pause is such as encountered during disk is repaiied, then standby mode, system record repair the disk time to system immediately.
4. a kind of quartz wafer grinding control method based on waveform-matching approach according to claim 1, feature exist
In the operation into online frequency measurement flow includes：System will start grinder and open abrasive sand switch；Online frequency measurement flow pair
The processing of the AD sampled datas of system, by carrying out waveform-matching approach, data smoothing processing to AD sampled datas and asking maximum
Value method calculates the real-time resonant frequencies of quartz wafer, and average resonance frequencies, grinding are calculated according to current statistical parameter
Rate and very poor, the transmission of frequency measurement result are shown；
Stop in online frequency measurement flow if not done by artificial, continuous monitor wafer real-time frequency is worked as average resonance by system
Frequency is more than the 3/4 of swept frequency range, then swept frequency range elapses forward 1/2, realizes the real time monitoring of online frequency measurement process.
5. a kind of quartz wafer grinding control method based on waveform-matching approach according to claim 4, feature exist
In, when in online frequency measurement flow if there is frequency measurement is abnormal, rate is abnormal, very poor exception, these abnormal abnormalities of SD card, will
Online frequency measurement flow is jumped out, into standby mode, while records the reason of jumping out online frequency measurement flow.
6. a kind of quartz wafer grinding control method based on waveform-matching approach according to claim 1, feature exist
In, the peripheral hardware initial configuration include buzzer initialization, indicator light initialization, the port initialization of grinder start-up and shut-down control,
Grinder lap signal detection port initialization, the port initialization of abrasive sand start-up and shut-down control, AD samplings initialization, serial ports are initial
Change, the initialization of power down memory module, timer initializes and the initialization of DDS scan modules.
7. a kind of quartz wafer grinding control method based on waveform-matching approach according to claim 6, feature exist
In the hardware check includes the self-test of power down memory module, the self-test of DDS scan modules, the self-test of grinder connection status, abrasive sand
Switch connection status and lap signal connection status self-test.
8. a kind of quartz wafer grinding control method based on waveform-matching approach according to claim 7, feature exist
In data initialization flow includes initialization control and setting button, and master is set according to the data read in power down memory module
Pathological system status indicator lamp in interface；Initialization survey statistical information；From power down memory module read online frequency measurement parameter,
Static test parameter and controlling strategy parameter, and send display；Grinding initial frequency, grinding target are read from power down memory module
Frequency and frequency calibration send display.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810500285.3A CN108705442B (en) | 2016-01-22 | 2016-01-22 | Based on the matched quartz wafer grinding control method of waveform optimization |
| CN201610045507.8A CN105666310B (en) | 2016-01-22 | 2016-01-22 | A kind of quartz wafer grinding control method based on waveform-matching approach |
| CN201810502299.9A CN108710025B (en) | 2016-01-22 | 2016-01-22 | Quartz wafer grinding control and frequency measurement method based on waveform matching |
| CN201810502283.8A CN108655945B (en) | 2016-01-22 | 2016-01-22 | A kind of quartz wafer grinding control system based on Waveform Matching |
| CN201810502284.2A CN108614153B (en) | 2016-01-22 | 2016-01-22 | Quartz wafer grinding control method based on waveform matching |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610045507.8A CN105666310B (en) | 2016-01-22 | 2016-01-22 | A kind of quartz wafer grinding control method based on waveform-matching approach |
Related Child Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810502283.8A Division CN108655945B (en) | 2016-01-22 | 2016-01-22 | A kind of quartz wafer grinding control system based on Waveform Matching |
| CN201810502284.2A Division CN108614153B (en) | 2016-01-22 | 2016-01-22 | Quartz wafer grinding control method based on waveform matching |
| CN201810502299.9A Division CN108710025B (en) | 2016-01-22 | 2016-01-22 | Quartz wafer grinding control and frequency measurement method based on waveform matching |
| CN201810500285.3A Division CN108705442B (en) | 2016-01-22 | 2016-01-22 | Based on the matched quartz wafer grinding control method of waveform optimization |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105666310A CN105666310A (en) | 2016-06-15 |
| CN105666310B true CN105666310B (en) | 2018-07-06 |
Family
ID=56302240
Family Applications (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610045507.8A Active CN105666310B (en) | 2016-01-22 | 2016-01-22 | A kind of quartz wafer grinding control method based on waveform-matching approach |
| CN201810502284.2A Active CN108614153B (en) | 2016-01-22 | 2016-01-22 | Quartz wafer grinding control method based on waveform matching |
| CN201810502299.9A Active CN108710025B (en) | 2016-01-22 | 2016-01-22 | Quartz wafer grinding control and frequency measurement method based on waveform matching |
| CN201810502283.8A Active CN108655945B (en) | 2016-01-22 | 2016-01-22 | A kind of quartz wafer grinding control system based on Waveform Matching |
| CN201810500285.3A Active CN108705442B (en) | 2016-01-22 | 2016-01-22 | Based on the matched quartz wafer grinding control method of waveform optimization |
Family Applications After (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810502284.2A Active CN108614153B (en) | 2016-01-22 | 2016-01-22 | Quartz wafer grinding control method based on waveform matching |
| CN201810502299.9A Active CN108710025B (en) | 2016-01-22 | 2016-01-22 | Quartz wafer grinding control and frequency measurement method based on waveform matching |
| CN201810502283.8A Active CN108655945B (en) | 2016-01-22 | 2016-01-22 | A kind of quartz wafer grinding control system based on Waveform Matching |
| CN201810500285.3A Active CN108705442B (en) | 2016-01-22 | 2016-01-22 | Based on the matched quartz wafer grinding control method of waveform optimization |
Country Status (1)
| Country | Link |
|---|---|
| CN (5) | CN105666310B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106644053B (en) * | 2016-12-23 | 2019-06-07 | 浙江大学台州研究院 | Quartz wafer grinds the automatic search method of online frequency measurement |
| CN110221124B (en) * | 2016-12-23 | 2021-02-26 | 浙江大学台州研究院 | Measurement and control method for online grinding of quartz wafer based on frequency sweep data mechanism |
| CN107877355B (en) * | 2017-12-19 | 2023-08-11 | 浙江大学台州研究院 | High-reliability grinding machine shutdown control device and method thereof |
| CN109495117B (en) * | 2018-12-18 | 2021-08-24 | 北京品驰医疗设备有限公司 | Wireless energy transmission frequency calibration method and device |
| CN109940506B (en) * | 2019-03-27 | 2020-02-28 | 浙江大学台州研究院 | Quartz wafer resonant frequency and dispersion statistical method based on wafer discrimination |
| CN110076646A (en) * | 2019-06-04 | 2019-08-02 | 马鞍山荣泰科技有限公司 | A kind of quartz wafer grinding frequency measuring device |
| CN110187175B (en) * | 2019-07-08 | 2024-06-18 | 浙江大学台州研究院 | Online frequency measurement system for quartz wafer polishing and grinding |
| CN111693770B (en) * | 2020-06-05 | 2023-02-03 | 中国人民解放军63921部队 | Uplink frequency scanning method for measurement and control station/measurement ship |
| WO2023220931A1 (en) * | 2022-05-17 | 2023-11-23 | Applied Materials, Inc. | Analysis of multi-run cyclic processing procedures |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5136817A (en) * | 1990-02-28 | 1992-08-11 | Nihon Dempa Kogyo Co., Ltd. | Automatic lapping apparatus for piezoelectric materials |
| JP2002190628A (en) * | 2000-12-22 | 2002-07-05 | Daishinku Corp | System and method for polishing piezoelectric |
| JP2004328122A (en) * | 2003-04-22 | 2004-11-18 | Atokku:Kk | Crystal oscillator and its manufacturing method |
| CN102723924A (en) * | 2011-03-28 | 2012-10-10 | 精工电子有限公司 | Polishing method, manufacturing method of piezoelectric vibrating piece, piezoelectric vibrator, oscillator, electronic apparatus and radio-controlled timepiece |
| CN103056114A (en) * | 2013-02-01 | 2013-04-24 | 浙江大学台州研究院 | Quartz crystal wafer thickness sorting machine and method |
| CN103128451A (en) * | 2013-02-28 | 2013-06-05 | 莆田学院 | Method and equipment for utilizing ultrafast lasers for frequency modulation of quartz crystals |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1167730A (en) * | 1959-09-18 | 1969-10-22 | Gen Electric & English Elect | Improvements in or relating to apparatus for giving an indication of the frequency of an oscillatory signal |
| JP2949241B2 (en) * | 1990-06-29 | 1999-09-13 | 日本電波工業株式会社 | Polishing control device for piezoelectric material |
| JP2001246559A (en) * | 2000-03-02 | 2001-09-11 | Inst Of Physical & Chemical Res | Quartz element plate machining device, and on-machine measurement and control method for resonance frequency of quartz element plate |
| CN1192238C (en) * | 2000-11-29 | 2005-03-09 | 友讯科技股份有限公司 | Tester for measuring frequency of quartz oscillator |
| CN1938944B (en) * | 2004-03-30 | 2010-09-15 | 西铁城控股株式会社 | Quartz oscillator manufacturing method |
| CN102339744A (en) * | 2010-07-23 | 2012-02-01 | 苏州普锐晶科技有限公司 | Polishing method of ultra-high-frequency wafer |
| JP2012121130A (en) * | 2010-11-18 | 2012-06-28 | Nagatsu Precision Mold Co Ltd | Polishing device |
| CN202330603U (en) * | 2011-12-12 | 2012-07-11 | 王慧斌 | Process optimization test platform for quartz crystal device |
| US9201156B2 (en) * | 2012-03-29 | 2015-12-01 | Chevron U.S.A. Inc. | System and method for measurement incorporating a crystal resonator |
| CN103001627B (en) * | 2012-11-22 | 2015-12-09 | 北京信息科技大学 | Quartz-crystal resonance frequency fine adjustment control system |
| CN103063292B (en) * | 2012-12-10 | 2015-12-02 | 中国飞机强度研究所 | A kind of piezoelectric crystal plate resonant frequency measurement method |
| CN104215326B (en) * | 2013-06-03 | 2016-08-17 | 西北核技术研究所 | Luminous power measurement method of parameters based on crystal resonator and device |
| CN203390714U (en) * | 2013-06-28 | 2014-01-15 | 苏州奇盟晶体材料制品有限公司 | Wafer grinding device |
| KR101389532B1 (en) * | 2013-12-19 | 2014-04-25 | 주식회사 케이씨텍 | Device of measuring wafer metal layer thickness in chemical mechanical polishing apparatus and method thereof |
| CN103698639B (en) * | 2013-12-27 | 2016-06-22 | 广东大普通信技术有限公司 | Crystal oscillator waveform parameter automatic measurement system and method |
| CN204008918U (en) * | 2014-08-06 | 2014-12-10 | 廊坊中电熊猫晶体科技有限公司 | The room temperature frequencies test macro of temperature compensated crystal oscillator |
-
2016
- 2016-01-22 CN CN201610045507.8A patent/CN105666310B/en active Active
- 2016-01-22 CN CN201810502284.2A patent/CN108614153B/en active Active
- 2016-01-22 CN CN201810502299.9A patent/CN108710025B/en active Active
- 2016-01-22 CN CN201810502283.8A patent/CN108655945B/en active Active
- 2016-01-22 CN CN201810500285.3A patent/CN108705442B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5136817A (en) * | 1990-02-28 | 1992-08-11 | Nihon Dempa Kogyo Co., Ltd. | Automatic lapping apparatus for piezoelectric materials |
| JP2002190628A (en) * | 2000-12-22 | 2002-07-05 | Daishinku Corp | System and method for polishing piezoelectric |
| JP2004328122A (en) * | 2003-04-22 | 2004-11-18 | Atokku:Kk | Crystal oscillator and its manufacturing method |
| CN102723924A (en) * | 2011-03-28 | 2012-10-10 | 精工电子有限公司 | Polishing method, manufacturing method of piezoelectric vibrating piece, piezoelectric vibrator, oscillator, electronic apparatus and radio-controlled timepiece |
| CN103056114A (en) * | 2013-02-01 | 2013-04-24 | 浙江大学台州研究院 | Quartz crystal wafer thickness sorting machine and method |
| CN103128451A (en) * | 2013-02-28 | 2013-06-05 | 莆田学院 | Method and equipment for utilizing ultrafast lasers for frequency modulation of quartz crystals |
Non-Patent Citations (1)
| Title |
|---|
| 基于DSP石英晶片研磨的自动测控系统;谢琐华 等;《中南工业大学学报》;20030228;第34卷(第1期);第92-94页 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108614153B (en) | 2020-07-07 |
| CN108705442A (en) | 2018-10-26 |
| CN108655945A (en) | 2018-10-16 |
| CN108705442B (en) | 2019-10-18 |
| CN108710025B (en) | 2020-06-09 |
| CN105666310A (en) | 2016-06-15 |
| CN108614153A (en) | 2018-10-02 |
| CN108710025A (en) | 2018-10-26 |
| CN108655945B (en) | 2019-10-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105666310B (en) | A kind of quartz wafer grinding control method based on waveform-matching approach | |
| CN105588980B (en) | A kind of method that quartz wafer based on waveform-matching approach grinds online frequency measurement | |
| CN106644053B (en) | Quartz wafer grinds the automatic search method of online frequency measurement | |
| CN106771580B (en) | The investigating method of quartz wafer on-line grinding based on inertial navigation mechanism | |
| CN105911499B (en) | Ultrasonic wave shelf depreciation metering system and method under site environment | |
| CN105866540A (en) | Online frequency measurement system for quartz wafer grinding | |
| WO2020181759A1 (en) | Intelligent prediction system for predicting device failure and potential defective product on miniature transformer production line | |
| CN201749316U (en) | Intelligent electric energy meter clock multi-function quick tester | |
| CN104111347A (en) | Raster encoder low-speed precision detection apparatus | |
| CN203178431U (en) | Full-automatic testing system for circuit boards | |
| CN104344862B (en) | The detection method of FCM10A type fuel consumption meters | |
| CN102721865A (en) | Method and system for measuring accuracy of crystal oscillators | |
| CN102721878A (en) | Intelligentized automatic checkout device of quartz crystal oscillator instrument | |
| CN109406117A (en) | A kind of multichannel remote oscillation signal monitor system and monitoring method based on improved RBFNN algorithm | |
| CN102980536A (en) | Brake pad steel backing planeness detecting system and method thereof | |
| CN107741376A (en) | A kind of piezo-electric resonance type PM2.5 monitoring systems | |
| CN102279280B (en) | Method and device for measuring rotational speed and friction power consumption of centrifugal machine | |
| CN201965669U (en) | Equipment detecting instrument | |
| CN103197611B (en) | The resources of production management system of auxiliary wireless senser | |
| CN208013003U (en) | A kind of piezo-electric resonance type PM2.5 monitorings system | |
| CN210376590U (en) | Multichannel IC-card automatic switch-over type intelligent detection circuit board frock | |
| CN110987129A (en) | Ultrasonic intelligent water meter fault self-checking and processing system and method | |
| CN205719132U (en) | A kind of Novel ultrasonic low water meter | |
| CN113899942A (en) | Portable distribution network integrated intelligent live-line tester and testing method thereof | |
| CN114236455B (en) | Error calculation device and method for electric energy meter verification for processing missing pulse |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |