CN105648513A - Heat pipe plating solution cooling system and working medium - Google Patents
Heat pipe plating solution cooling system and working medium Download PDFInfo
- Publication number
- CN105648513A CN105648513A CN201511034090.7A CN201511034090A CN105648513A CN 105648513 A CN105648513 A CN 105648513A CN 201511034090 A CN201511034090 A CN 201511034090A CN 105648513 A CN105648513 A CN 105648513A
- Authority
- CN
- China
- Prior art keywords
- heat pipe
- plating solution
- temperature
- treatment box
- solution cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/02—Heating or cooling
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/10—Liquid materials
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/003—Apparatus
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Metallurgy (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Combustion & Propulsion (AREA)
- Electrochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- General Engineering & Computer Science (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention relates to a heat pipe plating solution cooling system and a working medium. The heat pipe plating solution cooling system comprises a plating solution cooling treatment box, heat pipes, a refrigeration box and a refrigeration unit; and the heat pipes are installed between adjacent side walls of the refrigeration box and the plating solution cooling treatment box in a penetrating manner, condensation sections of the heat pipes are arranged in the refrigeration box at the upper portion, and evaporation sections of the heat pipes are arranged in the plating solution cooling treatment box at the lower portion. According to the heat pipe plating solution cooling system, the characters of instant pulverization and top-speed conduction of the heat pipes are used, the evaporation ends of the heat pipes are arranged in a plating solution to evaporate and extract the too-high heat in the plating solution through a working medium solution, the too-high heat is emitted from the condensation ends, and the condensation ends are arranged in a closed refrigerating system to cool evaporated hot air in a forced manner; and the system is automatically stopped when the temperature of the plating solution reaches the temperature needed by production, the system is automatically started when the temperature rises again, and therefore the aim of obtaining the constant temperature is achieved.
Description
Technical field
The invention belongs to energy-saving equipment field, especially one heat pipe plating solution cooling system and working media.
Background technology
Heat pipe is the heat transfer element that the one of the G.M.Grover invention of LosAlamos National Laboratory of the U.S. in 1963 is called " heat pipe ", it takes full advantage of the Rapid Thermal hereditary property of heat-conduction principle and refrigeration filling, being delivered to rapidly outside thermal source by the heat of thermal objects through heat pipe, its capacity of heat transmission exceedes the capacity of heat transmission of any known metal. It is widely used in the industry such as aerospace, military project before hot pipe technique, since being introduced into radiator manufacturing so that people change the mentality of designing of traditional heat sinks, breaks away from simple dependence high air quantity motor to obtain the single radiating mode of better radiating effect.
In Tinplate Production process, the temperature of tin plating electrolyte is along with the continuity produced, and temperature can be more and more higher, will affect production when the temperature of tin plating electrolyte is raised to a timing. At this moment it is necessary to plating solution is carried out cooling process, otherwise can only reduce the speed of production, bring great economic loss to enterprise. Its shortcoming is: bulky, pipeline length, floor space are big, and big water tower can not be arranged in Factory Building, natural heat dissipation efficiency low especially summer, and air saturation ratio is high, and air themperature is frequently above by radiator liquid temperature.
According to retrieval, it has been found that following relevant to the application patent documentation, specific disclosure is as follows:
The open a kind of electroplate liquid cooling device of patent documentation CN202265620U, including water inlet, outlet, air intake vent, air outlet, condensing tube and bending air flue, described condensing tube communicates with described water inlet and described outlet respectively, described bending air flue communicates with described air intake vent and described air outlet respectively, described bending air flue is positioned at inside described condensing tube, gas enters described bending air flue from described air intake vent, and leaves described bending air flue from described air outlet.
The open a kind of metal plating liquid temperature high-speed adjustment device of patent documentation CN203653673U, metal plating liquid is fixedly installed metal straight pipe logical in, described metal straight pipe adopts the setting closed up and down, and connect water inlet pipe at described metal straight pipe top, connection overflow pipe is set at described metal straight pipe upper portion side wall place.
The mode heat transfer effect that above-mentioned patent documentation is taked is poor, it is impossible to from the basic problem solving quick heat exchange
Summary of the invention
It is an object of the invention to overcome the deficiencies in the prior art part, it is provided that the heat pipe plating solution cooling system that a kind of novel structure, heat exchange efficiency are high.
The technical scheme that the present invention realizes purpose is as follows:
A kind of heat pipe plating solution cooling system, including crossing treatment box of lowering the temperature night, heat pipe, refrigeration case and refrigeration unit, cross the treatment box left and right sides that lowers the temperature night to be formed respectively with crossing import at night and crossing outlet at night, cross and lower the temperature treatment box night and refrigeration case is made up of sealed thermal insulating material, crossing the treatment box top that lowers the temperature night, refrigeration case is installed, in refrigeration case, refrigeration unit is installed in side, at refrigeration case with cross to run through between the sidewall that treatment box of lowering the temperature night is adjacent and be provided with heat pipe, it it is the condensation segment of heat pipe in the refrigeration case of top, the evaporator section for heat pipe in treatment box of lowering the temperature night is crossed in bottom, work medium for heat pipe is loaded in the hollow cavity of heat pipe.
And, substep cold air comb in refrigeration case.
A kind of work medium for heat pipe, component and weight percent content are as follows:
The invention have the benefit that
Heat pipe plating solution cooling system provided by the invention utilizes heat pipe moment to be atomized; the characteristic of very fast conduction; being put by the evaporation ends of heat pipe in what plating solution and proposed by the evaporation of metric system liquid by the excessive temperature in plating solution, dispel the heat from condensation end, condensation end is put in the refrigeration system that what is airtight; the hot-air evaporated is cooled down by force; when bath temperature reaches to produce temperature required, system autostop, when temperature raises again; Auto Power On, to reach the purpose of constant temperature.
Accompanying drawing explanation
Fig. 1 is existing down cycles water cooling system;
Fig. 2 is the cooling system of the application.
Detailed description of the invention
Below in conjunction with accompanying drawing and by specific embodiment, the invention will be further described, and following example are illustrative, are not determinate, it is impossible to limit protection scope of the present invention with this.
A kind of heat pipe plating solution cooling system, including crossing treatment box 7 of lowering the temperature night, heat pipe 4, refrigeration case 2 and refrigeration unit 1, cross the treatment box left and right sides that lowers the temperature night be formed respectively with crossing import at night 8 11 and cross and export 10 night, cross and lower the temperature treatment box night and refrigeration case is made up of sealed thermal insulating material, crossing the treatment box top that lowers the temperature night, refrigeration case is installed, in refrigeration case, refrigeration unit is installed in side, at refrigeration case with cross to run through between the adjacent sidewall for the treatment of box of lowering the temperature night (5 and 6) and be provided with heat pipe, it is the condensation segment 4-1 of heat pipe in the refrigeration case of top, the evaporator section 4-2 for heat pipe in treatment box of lowering the temperature night is crossed in bottom, work medium for heat pipe 9 (being also work liquid) is loaded in the hollow cavity of heat pipe.
In order to increase the refrigeration of refrigeration case, substep cold air comb 3 in refrigeration case, by increasing capacitance it is possible to increase the area of giving vent to anger of cold air, improves refrigerating efficiency.
The range of temperature of work medium for heat pipe of working in the application is :-70-250 DEG C, be activated at 80 DEG C
Composition and the weight percent content of the working media that the present invention mentions are as follows:
Described heat pipe is copper pipe, and length of tube is 1000-8000 millimeter, and pipe external diameter is 10-500 millimeter, and thickness of pipe wall is 2-5 millimeter. Inner chamber passes the 8-10% that reserves are heat pipe inner chamber volume of working media.
Claims (3)
1. a heat pipe plating solution cooling system, it is characterized in that: include crossing treatment box of lowering the temperature night, heat pipe, refrigeration case and refrigeration unit, cross the treatment box left and right sides that lowers the temperature night to be formed respectively with crossing import at night and crossing outlet at night, cross and lower the temperature treatment box night and refrigeration case is made up of sealed thermal insulating material, crossing the treatment box top that lowers the temperature night, refrigeration case is installed, in refrigeration case, refrigeration unit is installed in side, at refrigeration case with cross to run through between the sidewall that treatment box of lowering the temperature night is adjacent and be provided with heat pipe, it it is the condensation segment of heat pipe in the refrigeration case of top, the evaporator section for heat pipe in treatment box of lowering the temperature night is crossed in bottom, work medium for heat pipe is loaded in the hollow cavity of heat pipe.
2. heat pipe plating solution cooling system according to claim 1, it is characterised in that: substep cold air comb in refrigeration case.
3. a work medium for heat pipe, it is characterised in that: component and weight percent content are as follows:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511034090.7A CN105648513B (en) | 2015-12-31 | 2015-12-31 | Heat pipe plating solution cooling system and working media |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511034090.7A CN105648513B (en) | 2015-12-31 | 2015-12-31 | Heat pipe plating solution cooling system and working media |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105648513A true CN105648513A (en) | 2016-06-08 |
| CN105648513B CN105648513B (en) | 2018-08-07 |
Family
ID=56491143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511034090.7A Active CN105648513B (en) | 2015-12-31 | 2015-12-31 | Heat pipe plating solution cooling system and working media |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105648513B (en) |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2301107A1 (en) * | 1975-02-14 | 1976-09-10 | Sovel Vehicules Electr Indls | Heat pipe containing a freon - has fins and fits on filler cap to cool electrolyte of electric battery |
| JPH07318672A (en) * | 1992-03-26 | 1995-12-08 | Yoshito Tanaka | Electrolytic low temperature fusion reactor |
| CN2762046Y (en) * | 2004-07-30 | 2006-03-01 | 龚文浩 | Thermopipe self circulation heat collector |
| CN101285660A (en) * | 2007-04-09 | 2008-10-15 | 李建民 | Single-phase heat drive heat-transfer element and its working medium loading method |
| CN101625207A (en) * | 2009-07-27 | 2010-01-13 | 北京鹤华安吉电子技术研究所 | Liquid-cooled heat exchanger based on spiral structure |
| CN202064016U (en) * | 2011-04-03 | 2011-12-07 | 赤峰中色库博红烨锌业有限公司 | Heat exchanger of copper electrodeposition tank |
| CN202347122U (en) * | 2011-11-15 | 2012-07-25 | 大连经济技术开发区大山表面处理有限公司 | Temperature control device for copper pipe chrome plating liquid of electroplating crystallizer |
| CN202730278U (en) * | 2012-07-17 | 2013-02-13 | 武汉立胜超滤科技发展有限公司 | Cold and hot integrated machine for electrophoretic machining |
| CN103000922A (en) * | 2012-12-10 | 2013-03-27 | 青海百能汇通新能源科技有限公司 | Electrolyte storage tank integrated with heat exchange function and control method thereof |
| CN103512412A (en) * | 2013-09-30 | 2014-01-15 | 西安交通大学 | U-shaped heat pipe heat exchange elements and U-shaped heat pipe heat exchanger integrated with electrostatic dust collector |
| CN204872261U (en) * | 2015-07-16 | 2015-12-16 | 江西本一科技有限公司 | Electrolyte storage tank |
| CN205295525U (en) * | 2015-12-31 | 2016-06-08 | 天津君议台科技发展有限公司 | Heat pipe plating bath cooling system |
-
2015
- 2015-12-31 CN CN201511034090.7A patent/CN105648513B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2301107A1 (en) * | 1975-02-14 | 1976-09-10 | Sovel Vehicules Electr Indls | Heat pipe containing a freon - has fins and fits on filler cap to cool electrolyte of electric battery |
| JPH07318672A (en) * | 1992-03-26 | 1995-12-08 | Yoshito Tanaka | Electrolytic low temperature fusion reactor |
| CN2762046Y (en) * | 2004-07-30 | 2006-03-01 | 龚文浩 | Thermopipe self circulation heat collector |
| CN101285660A (en) * | 2007-04-09 | 2008-10-15 | 李建民 | Single-phase heat drive heat-transfer element and its working medium loading method |
| CN101625207A (en) * | 2009-07-27 | 2010-01-13 | 北京鹤华安吉电子技术研究所 | Liquid-cooled heat exchanger based on spiral structure |
| CN202064016U (en) * | 2011-04-03 | 2011-12-07 | 赤峰中色库博红烨锌业有限公司 | Heat exchanger of copper electrodeposition tank |
| CN202347122U (en) * | 2011-11-15 | 2012-07-25 | 大连经济技术开发区大山表面处理有限公司 | Temperature control device for copper pipe chrome plating liquid of electroplating crystallizer |
| CN202730278U (en) * | 2012-07-17 | 2013-02-13 | 武汉立胜超滤科技发展有限公司 | Cold and hot integrated machine for electrophoretic machining |
| CN103000922A (en) * | 2012-12-10 | 2013-03-27 | 青海百能汇通新能源科技有限公司 | Electrolyte storage tank integrated with heat exchange function and control method thereof |
| CN103512412A (en) * | 2013-09-30 | 2014-01-15 | 西安交通大学 | U-shaped heat pipe heat exchange elements and U-shaped heat pipe heat exchanger integrated with electrostatic dust collector |
| CN204872261U (en) * | 2015-07-16 | 2015-12-16 | 江西本一科技有限公司 | Electrolyte storage tank |
| CN205295525U (en) * | 2015-12-31 | 2016-06-08 | 天津君议台科技发展有限公司 | Heat pipe plating bath cooling system |
Non-Patent Citations (2)
| Title |
|---|
| 胡进光: "硬铬槽液冷却系统的设计", 《电镀与涂饰》 * |
| 蒋伟刚: "电镀溶液冷却系统的设计", 《材料保护》 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105648513B (en) | 2018-08-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207098018U (en) | A kind of battery bag immersion type evaporation-cooled device | |
| CN205295525U (en) | Heat pipe plating bath cooling system | |
| CN105648513A (en) | Heat pipe plating solution cooling system and working medium | |
| CN203442971U (en) | Dehumidification type cooling fresh air handling unit with automatic backheating and temperature rise | |
| CN206037503U (en) | Fridge condenser | |
| CN104390297A (en) | Electronic air conditioner | |
| CN206019036U (en) | A kind of separate heat pipe device for solar water heater high-temperature control | |
| CN203837562U (en) | Heat pipe type cooling tower water-saving device | |
| CN204202098U (en) | Air draft new air heat-exchange system | |
| CN203596242U (en) | Efficient cooling transformer | |
| CN203653416U (en) | Kiln cooling device | |
| CN207203778U (en) | Process tower tail gas condensation device in a kind of production of polyester | |
| CN204902077U (en) | Second grade refrigeration heat transfer system | |
| CN204787536U (en) | Aluminum alloy evaporating pipe that freezing equipment used | |
| CN204313540U (en) | A kind of tube bank of evaporative condenser | |
| CN105698303A (en) | Cooling system for aging room | |
| CN206207829U (en) | Quick-frozen ice chest | |
| CN110657536A (en) | Heat pipe heat exchange system suitable for computer lab | |
| CN203442978U (en) | Heat pipe type self-temperature-return dehumidification type cooling fresh air unit | |
| CN204880922U (en) | Multi -functional energy -conserving refrigerator of refrigeration hot water heat preservation | |
| CN204514131U (en) | A kind of high-performance heat exchanger | |
| CN213193745U (en) | Ultra-low temperature tank | |
| CN220681374U (en) | Adhesive tape shaping and cooling device | |
| CN203310281U (en) | Evaporative cooler | |
| CN106052205A (en) | Heat exchanger and refrigerating equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 300384 1-C-1213, 15 banyan Road, Huayuan Industrial Park, Tianjin Applicant after: Tianjin Jun discussion of Taiwan Science and technology development Limited by Share Ltd Address before: 300384 1-C-902, 15 banyan Road, Huayuan Industrial Park, Nankai District, Tianjin Applicant before: TIANJIN JUNYITAI TECHNOLOGY DEVELOPMENT CO., LTD. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |