CN105636739B - 用于激光释放的激光扫描系统 - Google Patents

用于激光释放的激光扫描系统 Download PDF

Info

Publication number
CN105636739B
CN105636739B CN201480055829.XA CN201480055829A CN105636739B CN 105636739 B CN105636739 B CN 105636739B CN 201480055829 A CN201480055829 A CN 201480055829A CN 105636739 B CN105636739 B CN 105636739B
Authority
CN
China
Prior art keywords
laser beam
substrate
laser
incidence
scanning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201480055829.XA
Other languages
English (en)
Chinese (zh)
Other versions
CN105636739A (zh
Inventor
D·C·米尔恩
P·T·路姆斯比
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
M Solv Ltd
Original Assignee
M Solv Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by M Solv Ltd filed Critical M Solv Ltd
Publication of CN105636739A publication Critical patent/CN105636739A/zh
Application granted granted Critical
Publication of CN105636739B publication Critical patent/CN105636739B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/101—Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/30—Polarising elements
    • G02B5/3025—Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state
    • G02B5/3066—Polarisers, i.e. arrangements capable of producing a definite output polarisation state from an unpolarised input state involving the reflection of light at a particular angle of incidence, e.g. Brewster's angle
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/201—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by an oblique exposure; characterised by the use of plural sources; characterised by the rotation of the optical device; characterised by a relative movement of the optical device, the light source, the sensitive system or the mask
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • H01S3/101—Lasers provided with means to change the location from which, or the direction in which, laser radiation is emitted
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Laser Beam Processing (AREA)
  • Recrystallisation Techniques (AREA)
  • Lasers (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
CN201480055829.XA 2013-10-08 2014-05-09 用于激光释放的激光扫描系统 Expired - Fee Related CN105636739B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1317773.8 2013-10-08
GB1317773.8A GB2519088B (en) 2013-10-08 2013-10-08 Laser scanning system for laser release
PCT/GB2014/051423 WO2015052475A1 (en) 2013-10-08 2014-05-09 Laser scanning system for laser release

Publications (2)

Publication Number Publication Date
CN105636739A CN105636739A (zh) 2016-06-01
CN105636739B true CN105636739B (zh) 2017-05-24

Family

ID=49630355

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480055829.XA Expired - Fee Related CN105636739B (zh) 2013-10-08 2014-05-09 用于激光释放的激光扫描系统

Country Status (8)

Country Link
US (1) US9804384B2 (https=)
EP (1) EP3055097B1 (https=)
JP (1) JP6388931B2 (https=)
KR (1) KR20160067168A (https=)
CN (1) CN105636739B (https=)
GB (1) GB2519088B (https=)
TW (1) TWI614077B (https=)
WO (1) WO2015052475A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3172762B1 (en) * 2014-07-22 2021-04-21 Brewer Science, Inc. Temporary substrate bonding method using a polyimide release layer and substrate stack including said polyimide release layer
CN106654814A (zh) * 2017-03-09 2017-05-10 中国科学院合肥物质科学研究院 可用于晶化和剥离的两用准分子激光系统
EP3682470A1 (de) * 2017-09-12 2020-07-22 EV Group E. Thallner GmbH Vorrichtung und verfahren zum trennen eines temporär gebondeten substratstapels
KR102148013B1 (ko) * 2018-07-24 2020-08-25 (주) 큐알에스 레이어 분리장치
WO2021082516A1 (zh) * 2019-10-29 2021-05-06 成都辰显光电有限公司 发光二极管芯片、生长基板、发光二极管芯片转移装置
CN115609138A (zh) * 2021-07-13 2023-01-17 广东聚华印刷显示技术有限公司 激光剥离方法、激光设备以及激光剥离系统
DE102023205564A1 (de) * 2023-06-14 2024-12-19 Carl Zeiss Smt Gmbh Verfahren zur Erzeugung einer Temperierhohlstruktur in einem Substrat mit Hilfe eines Bearbeitungslichtstrahls

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4694139A (en) * 1984-12-03 1987-09-15 Messer Griesheim Gmbh Guidance device for a laser beam for three-dimensional machining of workpieces
US5436867A (en) * 1993-03-08 1995-07-25 Northrop Grumman Corporation Holographic random access memory
JPH08132267A (ja) * 1994-11-02 1996-05-28 Toshiba Corp レ−ザ光走査装置
US6294407B1 (en) * 1998-05-06 2001-09-25 Virtual Integration, Inc. Microelectronic packages including thin film decal and dielectric adhesive layer having conductive vias therein, and methods of fabricating the same
DE10193737B4 (de) * 2000-08-29 2009-07-30 Mitsubishi Denki K.K. Laserbearbeitungsvorrichtung
JP5057619B2 (ja) * 2001-08-01 2012-10-24 株式会社半導体エネルギー研究所 半導体装置の作製方法
TWI221102B (en) * 2002-08-30 2004-09-21 Sumitomo Heavy Industries Laser material processing method and processing device
JP4335613B2 (ja) * 2003-08-28 2009-09-30 Ｔｄｋ株式会社 ホログラフィック記録方法及び装置
US7923306B2 (en) * 2004-06-18 2011-04-12 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots
TWI253065B (en) * 2004-06-30 2006-04-11 Lite On It Corp Angle multiplexing holographic storage device
TWI375498B (en) 2007-11-21 2012-10-21 Ind Tech Res Inst High perfromance laser-assisted transferring system and transfer component
WO2009072398A1 (ja) * 2007-12-07 2009-06-11 Konica Minolta Opto, Inc. 走査光学系、光走査装置及び画像形成装置
JP4386137B2 (ja) * 2008-02-29 2009-12-16 トヨタ自動車株式会社 レーザ加工装置及びレーザ加工方法
JP2010025713A (ja) * 2008-07-18 2010-02-04 Hitachi High-Technologies Corp 欠陥検査方法及び欠陥検査装置
CN101879657B (zh) 2009-05-08 2016-06-29 东莞市中镓半导体科技有限公司 固体激光剥离设备和剥离方法
US8871609B2 (en) * 2009-06-30 2014-10-28 Taiwan Semiconductor Manufacturing Company, Ltd. Thin wafer handling structure and method
DE102009057566A1 (de) 2009-12-09 2011-06-16 Osram Opto Semiconductors Gmbh Vorrichtung für ein Laserabhebeverfahren und Laserabhebeverfahren
JP5856824B2 (ja) * 2011-11-28 2016-02-10 オリンパス株式会社 光走査装置および走査型顕微鏡装置
CN103235489B (zh) * 2013-05-15 2015-01-07 中国科学院光电技术研究所 可变周期多光束干涉光刻的方法

Also Published As

Publication number Publication date
JP6388931B2 (ja) 2018-09-12
EP3055097A1 (en) 2016-08-17
TW201513959A (zh) 2015-04-16
WO2015052475A1 (en) 2015-04-16
TWI614077B (zh) 2018-02-11
GB2519088B (en) 2015-09-16
KR20160067168A (ko) 2016-06-13
JP2016539806A (ja) 2016-12-22
GB2519088A (en) 2015-04-15
US9804384B2 (en) 2017-10-31
EP3055097B1 (en) 2020-01-01
GB201317773D0 (en) 2013-11-20
US20160246050A1 (en) 2016-08-25
CN105636739A (zh) 2016-06-01

Similar Documents

Publication Publication Date Title
CN105636739B (zh) 用于激光释放的激光扫描系统
CN104043900B (zh) 通过线束改进的热处理
CN115319278B (zh) 基于二维声光偏转器的晶圆激光解键合的系统及方法
JP2011502788A5 (https=)
KR102662458B1 (ko) 레이저 가공 장치
CN105710530B (zh) 脉冲宽度控制器
JP2003524892A5 (https=)
US9390926B2 (en) Process sheet resistance uniformity improvement using multiple melt laser exposures
CN102267010B (zh) 偏振方位角调整装置以及激光加工装置
KR20160061884A (ko) 결함 어닐링 및 도펀트 활성화를 위한 고효율 라인-형성 광학 시스템 및 방법
JP2016539806A5 (https=)
JP2003255552A (ja) レーザ照射装置並びに走査レーザ光を用いた露光方法及び走査レーザ光を用いたカラーフィルタの製造方法
CN111133639B (zh) 光纤激光装置和用于加工工件的方法
JP2006184747A (ja) 偏光光照射装置
KR102557669B1 (ko) 이중 파장 어닐링 방법 및 장치
KR20210131510A (ko) 라인 빔 형성 장치
TW201234129A (en) Exposure apparatus
US8455791B2 (en) Laser processing method, laser processing device and cable harness production method
RU2368477C2 (ru) Устройство многопозиционной лазерной обработки
TW202507426A (zh) 種子雷射系統
JP2006237489A (ja) レーザ照射装置及びレーザ照射方法
JP2004145208A (ja) 表示用基板の処理装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20170524

Termination date: 20210509

CF01 Termination of patent right due to non-payment of annual fee