CN105611729A - Printed circuit board - Google Patents
Printed circuit board Download PDFInfo
- Publication number
- CN105611729A CN105611729A CN201610135729.9A CN201610135729A CN105611729A CN 105611729 A CN105611729 A CN 105611729A CN 201610135729 A CN201610135729 A CN 201610135729A CN 105611729 A CN105611729 A CN 105611729A
- Authority
- CN
- China
- Prior art keywords
- fpc
- hole
- printed circuit
- pcb
- convex closure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention discloses a printed circuit board (PCB). The printed circuit board comprises a PCB mother board and is characterized in that a flexible printed circuit (FPC) daughter board is arranged on the PCB mother board, the FPC daughter board and the PCB mother board are in contact with corresponding contact circuits through conductive bulges so that a conductive path is formed between the FPC daughter board and the PCB mother board, a hard thin sheet is fixedly arranged on the back surface of the side where the conductive bulges are located, the protruding heights of the conductive bulges are 30-300 micrometers, and the diameters of the conductive bulges are phi 50-800 micrometers. In the PCB, the FPC daughter board and the PCB mother board can be conveniently and rapidly disassembled repeatedly, the PCB is suitable for mass production, and the production cost and the subsequent maintenance cost are favorably reduced; and moreover, the wiring area of the PCB can be fully utilized, the light and thin design is promoted, and the PCB conforms to a scientific trend.
Description
Technical field
The invention belongs to printed circuit board (PCB) technical field, be specifically related to a kind of printed circuit board.
Background technology
Modern society, information-based industry development is rapid, and that electronic product presents is lightening, miniaturization, many meritsThe development trend of energyization, and printed circuit board (PCB) is an important electronic unit in electronic product,It is not only the supporter of electronic devices and components, but also is the supplier of electronic devices and components electrical connection, therefore,The package area of PCB has become the key that electronic product must be considered in design and manufacture processPoint.
Mounting in production of PCB surface device, be generally that PCB surface covered to copper layer for arranging circuitAnd element, in this process, the space availability ratio of PCB is low, the function element Limited Number holding,Cannot meet miniaturization and the lightening demand of sophisticated functions electronic product. For this problem, conventional artProposed a kind of method, its flexible electric circuit board (FPC) that superposes on pcb board, then incites somebody to action by jockeyAdjacent two-tier circuit plate conducting. Wherein, the connection of jockey design mainly contains and is welded to connect and connectorConnect.
Although be welded to connect the different board layer of conducting effectively, be unfavorable for the dismounting dimension of productRepair and part exchanging, greatly increased the later period maintenance cost of corresponding electronic products. Connector connection mainly containsWire connects and is connected with elastic sheet connector. Connect for wire, its technology difficulty is larger, production and processing speedPartially slow, be not suitable in enormous quantities producing fast, and the existence that connects wire can occupy a large amount of circuit spaces,And be not easy to later period maintenance dismounting. Connect for elastic sheet connector, specifically, it is by adopting shell fragmentConnector connects the circuit board of two stacks, although this method can meet quick production and processingRequirement, but shortcoming is obvious equally: 1. connector add the wiring area that has taken more PCB, and increaseAdd circuit board thickness, be unfavorable for the lightening design of product; 2. the price of connector is conventionally comparatively expensive,Increase the manufacturing cost of electronic product.
Therefore, be necessary to propose a kind of novel circuit board connection design and overcome the existing skill of traditional designArt defect, to adapt to the lightening development trend of current electronic product.
Summary of the invention
The object of the invention is to the defect for prior art, a kind of new printed circuit board is provided, itsRepeated removal rapidly, is applicable to producing in enormous quantities, and can makes full use of the wiring area of pcb board.
In order to achieve the above object, the present invention is by the following technical solutions:
A kind of printed circuit board, comprises PCB motherboard, it is characterized in that: on described PCB motherboard, be provided withFPC daughter board, described FPC daughter board and described PCB motherboard are by conduction convex closure and the corresponding phase that contacts circuitMutual connection touches, and realizes the two circuit of described FPC daughter board and described PCB motherboard and is connected.
Further, the back side of described conduction convex closure place face is fixed with hard sheet.
Further, the height of projection of described conduction convex closure is 30～300 μ m, the diameter of described conduction convex closureFor φ 50～φ 800 μ m.
Further, on described FPC daughter board, be laid with the first connection line, the lower surface of described FPC daughter boardBe provided with join domain, described conduction convex closure is constructed in described join domain, described the first connection line and instituteStating conduction convex closure conduction connects; On described PCB motherboard, be laid with the second connection line, described the second connecting lineIn road, be provided with the described contact circuit corresponding with described conduction convex closure; The lower surface of described FPC daughter board and described inPCB motherboard upper surface is mounted with, and described conduction convex closure and described contact circuit is in contact with one another, so that instituteThe two forms conductive path to state FPC daughter board and described PCB motherboard.
Further, the tool that the upper surface of the lower surface of described FPC daughter board and described PCB motherboard is mounted withBody mode comprises: in the described join domain of described FPC daughter board, be provided with and run through the first logical of described FPC daughter boardHole, described PCB motherboard is provided with the second through hole that runs through described PCB motherboard, described the second through hole with described inThe first through hole is corresponding one by one; Described printed circuit board also includes locating dowel, and the two ends of described locating dowel respectivelyPass and be fixed in described the first through hole and described the second through hole, with by the lower surface of described FPC daughter board andThe upper surface of described PCB motherboard is mounted with.
Further, described hard sheet is provided with the third through-hole that runs through described hard sheet, and the described the 3rdThrough hole and described the first through hole, described the second through hole are corresponding one by one, and described locating dowel is also passed and is fixed on instituteState in third through-hole.
Further, the two ends of described locating dowel are passed respectively and are fixed on described the first through hole and described secondIn through hole and described locating dowel is passed and the concrete mode that is fixed in described third through-hole comprises: described locationOne end of post through described first through hole of described FPC daughter board and the described third through-hole of described hard sheet alsoBe welded and fixed; The other end of described locating dowel be provided with external screw thread and through described PCB motherboard described theTwo through holes, then use nut to coordinate and screw with described external screw thread, with by described locating dowel and describedTwo through holes are fixed.
Further, the concrete mode that the back side of described conduction convex closure place face is fixed with hard sheet comprises:Use gum that the back side of described conduction convex closure place face and described hard sheet are pasted and fixed, wherein,The material of described hard sheet is stainless steel, aluminium alloy, titanium alloy, polyimides, epoxy resin or poly-fourPVF.
Further, the concrete mode that the back side of described conduction convex closure place face is fixed with hard sheet comprises:Gum containing base material is pasted to the back side of being fixed on described conduction convex closure place face, thereby at described conduction convex closureThe fixing hard sheet that forms in the back side of place face, wherein, the material of described base material is polyimides, epoxyResin or polytetrafluoroethylene (PTFE).
Further, described conduction convex closure by electro-plating method or mechanical stamping method to make.
Compared with prior art, useful technique effect of the present invention is as follows:
The invention provides a kind of novel printed circuit board, it is by conducting electricity between convex closure and contact circuitBe in contact with one another, realize the two conduction of FPC daughter board and PCB motherboard and be connected to form conductive path, therefore:On the one hand, the present invention can carry out repeated removal easily and quickly to FPC daughter board and PCB motherboard, is applicable toProduce in enormous quantities, be conducive to reduce production cost, be more conducive to reduce the maintenance cost in product later stage;On the other hand, the present invention need be by extraneous jockey, and in other words, it does not additionally take pcb boardAssembling space, makes the wiring area of pcb board be able to utilize more fully, is conducive to the light of electronic productThinning design, meets scientific and technological trend trend.
Brief description of the drawings
Fig. 1 is the overall structure schematic diagram of printed circuit board of the present invention;
Fig. 2 unhitches FPC daughter board and the dividing of PCB motherboard coupling part of printed circuit board of the present inventionStructure schematic diagram (wherein locating dowel is divided into two sections).
Description of reference numerals:
1-FPC daughter board; 11-the first connection line; 12-conducts electricity convex closure; 13-the first through hole; 2-PCB motherboard; 21-The second connection line; 211-contact circuit; 22-the second through hole; 3-locating dowel; 31-external screw thread; 4-hard is thinSheet; 41-third through-hole; 5-gum; 6-nut.
Detailed description of the invention
In order to understand fully object of the present invention, feature and effect, implement with concrete below with reference to accompanying drawingExample is described further the technique effect of design of the present invention, concrete structure and generation.
Embodiment 1
The present embodiment discloses a kind of printed circuit board, consults Fig. 1～2, includes FPC daughter board 1 and PCBMotherboard 2, FPC daughter board 1 is arranged on PCB motherboard 2, and FPC daughter board 1 is provided with conduction convex closure 12,PCB motherboard 2 is provided with and conducts electricity contact circuit 211 corresponding to convex closure 12, conduction convex closure 12 and corresponding connecingTouch circuit 211 and be in contact with one another, be connected to realize the two circuit of FPC daughter board 1 and described PCB motherboard 2.For the disclosed printed circuit board of the present embodiment, be described below more specifically:
As shown in Fig. 1～2, on FPC daughter board 1, be laid with the first connection line 11 (comprising element), wherein,The first connection line 11 is laid by conventional process, and element is undertaken by conventional welding mannerLay. After first laying of connection line 11 and the welding of element complete, all need to carry out electric performance test,To guarantee the circuit communication on FPC daughter board 1. The lower surface of FPC daughter board 1 is provided with join domain, this connectionIn region, having constructed 12,4 conduction convex closure 12 all with the first connection lines 11 of 4 conduction convex closures leadsElectrical connection; On PCB motherboard 2, be laid with the second connection line 21 (comprising element), second according to actual demandIn connection line 21, be provided with and 4 of FPC daughter board 1 conduction convex closures 12 contact circuit 211 one to one,Wherein, the second connection line 21 is also to lay by conventional process, and element is also by routineWelding manner lay. After second laying of connection line 21 and the welding of element complete, equal equallyNeed to carry out electric performance test, to guarantee the circuit communication on PCB motherboard 2. Certainly conduction convex closure 12,Quantity include but not limited to the present embodiment and 4 shown in the drawings, at the join domain of FPC daughter board 1The laying situation of area and the first connection line 11 all meets under the prerequisite of conduction convex closure 12 layouts, according to realityBorder demand, conduction convex closure 12 can also be made as other quantity, and therefore, it is of the present invention etc. that these situations all belong toEffect protection domain.
As shown in Fig. 1～2, in the join domain of FPC daughter board 1, be provided with and run through 4 of FPC daughter board 1One through hole 13, PCB motherboard 2 is provided with that to run through 22,4 second of 4 second through holes of PCB motherboard 2 logicalHole 22 is corresponding one by one respectively with 4 the first through holes 13, to ensure that the conduction convex closure 12 on FPC daughter board 1 canWith with PCB motherboard 2 on corresponding contact circuit 211 accurately dock. Correspondingly, the disclosed seal of the present embodimentCircuit board processed also includes the two ends of 3,4 locating dowels 3 of 4 locating dowels and passes respectively one by one and be fixed on 4In 13 and 4 the second through holes 22 of individual the first through hole, with by the lower surface of FPC daughter board 1 and PCB motherboard 2Upper surface be accurately mounted with, make 4 of FPC daughter board 1 conduction convex closures 12 and PCB motherboard 2Contact circuit 211 is in contact with one another respectively, so that FPC daughter board 1 and PCB motherboard 2 the two formation conductive path.Wherein, 4 the first through holes 13 distribute symmetrically, and corresponding, 4 the second through holes 22 also divide symmetricallyCloth, such arranging can ensure that the active force that each locating dowel 3 applies can be evenly distributed on FPC daughter board 1Join domain in (comprising region corresponding to the join domain with FPC daughter board 1 on PCB motherboard), makeGap between PCB motherboard and FPC daughter board 1 is more even, is more conducive to the conductive stud on FPC daughter board 1Bag 12 fully contacts with corresponding contact circuit 211 on PCB motherboard 2.
Wherein, through the research of inventor's many experiments, determine: the height of projection of (1) conduction convex closure 12 is selectedBe 30～300 μ m, due to the flatness of FPC daughter board 1 and/or PCB motherboard 2 (while especially selecting soft board)Relatively be difficult to control, therefore too small height of projection easily cause conducting electricity convex closure 12 cannot with the corresponding electricity that contactsRoad 211 forms good contact, and excessive height of projection is easily by FPC daughter board 1 and/or PCB motherboard 2(while especially selecting soft board) jack-up, thereby cause conducting electricity, convex closure 12 also cannot be with correspondence in regional areaContact circuit 211 forms good contact, easily causes and opens circuit; (2) diameter of conduction convex closure 12 is chosen as φ50～φ, 800 μ m, too small diameter easily cause conducting electricity convex closure 12 cannot with corresponding contact circuit 211 shapesBecome fully contact, and excessive diameter can take the wiring space of connection line in a large number, easily to other yuanPart causes interference.
As shown in Fig. 1～2, (in the present embodiment, it is FPC daughter board 1 to conduction convex closure 12 place facesLower surface) the back side be also fixed with hard sheet 4, with the join domain that effectively improves FPC daughter board 1 notBendable folding endurance, prevent from conducting electricity convex closure 12 in the time that reality is used (as FPC daughter board 1 bends, rocks etc.) withThe contact circuit 211 of PCB motherboard 2 departs from, thereby occurs open circuit conditions. Wherein, hard sheet 4Be provided with run through hard sheet 4 41 and 4 the first through holes 13 of 41,4 third through-holes of 4 third through-holes,4 the second through holes 22 are corresponding one by one respectively, and 4 locating dowels 3 are also passed respectively and are fixed on 4 threewaysIn hole 41.
As mentioned before, the two ends of 4 locating dowels 3 are passed respectively one by one and are fixed on 4 the first through holes 13In 4 the second through holes 22, and 4 locating dowels 3 are also passed respectively and are fixed on 4 third through-holes 41In. In the present embodiment, as shown in Fig. 1～2, its concrete mode is: one end of 4 locating dowels 3 one by oneThrough 4 the first through holes 13 of FPC daughter board 1 and 4 third through-holes 41 of hard sheet 4 and weldConnect fixingly, the other end of 4 locating dowels 3 is equipped with external screw thread 31 and respectively through 4 of PCB motherboard 2The second through hole 22, then uses nut 6 (totally 4) to coordinate and screw with external screw thread 31, with by 4Locating dowel 3 is individually fixed in 4 the second through holes 22, makes FPC daughter board 1 and the PCB motherboard 2 canAccurately be mounted with. Certainly, can directly utilize hardware fastening (as bolt, double-screw bolt or screw etc.)As locating dowel 3. In addition, the quantity of locating dowel 3 includes but not limited to the present embodiment and 4 shown in the drawings,Accordingly, the quantity of the first through hole 13, the second through hole 22, third through-hole 41 comprises but is also not limited to 4,Ensureing conduction convex closure 12 and contact circuit 211 is able to good contact so that FPC daughter board 1 and PCB motherboard 2Form under the prerequisite of conductive path, locating dowel 3, the first through hole 13, the second through hole 22, third through-hole 41 are alsoCan be made as other quantity (but the through hole on each plate must distribute symmetrically), therefore, these situationsAll belong to equivalent protection scope of the present invention.
Specifically select as one, use gum 5 will conduct electricity convex closure 12 place faces (in the present embodiment, itsFor the lower surface of FPC daughter board 1) the back side and hard sheet 4 paste fixingly, make FPC daughter board 1The fixing upper hard sheet 4 of upper surface. Wherein, the material of hard sheet 4 is selected stainless steel, aluminium alloy, titaniumAlloy, polyimides, epoxy resin or polytetrafluoroethylene (PTFE).
Specifically select as another kind, by containing the gum 5 of base material (such as add one deck macromolecule in gum 5Material film) paste and be fixed on conduction convex closure 12 place faces (in the present embodiment, it is FPC daughter board 1Lower surface) the back side, make that the upper surface of FPC daughter board 1 is fixing forms a hard sheet 4, thereby makeJoin domain has more excellent connective stability. Wherein, the material of base material is selected polyimides, epoxy treeFat or polytetrafluoroethylene (PTFE).
In addition, conduction convex closure 12 is constructed in the join domain of FPC daughter board 1 by electro-plating method, usedElectro-plating method is selected conventional process. Or, conduction convex closure 12 can also by mechanical stamping method withMake, still, because the impulsive force of mechanical stamping is very large, therefore using mechanical stamping method to construct conductionIn the process of convex closure 12, need to be at serigraphy one deck ink for the upper surface of FPC daughter board 1, with by punching pressPit fill and lead up, simultaneously can also impact power form buffering.
In the present embodiment, as shown in Fig. 1～2, conduction convex closure 12 is arranged on FPC daughter board 1, and with211, the contact circuit of conduction convex closure 12 correspondences is arranged on PCB motherboard 2. But, ensureing FPCIn the situation that the flatness of daughter board 1 and PCB motherboard 2 all can well be controlled, conversely, conduction convex closure 12Be arranged on PCB motherboard 2, and the contact circuit 211 corresponding with conduction convex closure 12 is arranged on FPC daughter board 1Upper, can make equally conductive stud bag 12 contact circuit 211 and can obtain good contact with corresponding, thereby makeObtain FPC daughter board 1 and PCB motherboard 2 the two formation conductive path. Therefore, this situation is also of the present inventionEquivalent protection scope.
The invention provides a kind of printed circuit board, its FPC daughter board and PCB motherboard can be easily and quicklyCarry out repeated removal, be applicable to producing in enormous quantities, be conducive to reduce production costs, be more conducive to reduce and keep in repair intoThis; And this printed circuit board does not additionally take the assembling space of pcb board, be conducive to the light of electronic productThinning design, in addition, this printed circuit board manufacture craft is simple, low processing cost, reliability is high. ChangeYan Zhi, the present invention has very high use value in printed circuit board (PCB) technical field.
More than describe preferred embodiment of the present invention in detail, should be appreciated that the ordinary skill of this areaPersonnel just can design according to the present invention make many modifications and variations without creative work. Therefore, allIn the art technical staff according to the present invention design on prior art basis by logic analysis, reasoning orPerson is according to the available technical scheme of limited experiment, all should be by the determined guarantor of these claimsProtect among scope.
Claims (10)
1. a printed circuit board, comprises PCB motherboard, it is characterized in that: on described PCB motherboard, pacifyFPC daughter board is housed, and described FPC daughter board and described PCB motherboard are by conduction convex closure and corresponding contact wireBeing in contact with one another of road, realizes the two circuit of described FPC daughter board and described PCB motherboard and is connected.
2. printed circuit board according to claim 1, is characterized in that: described conduction convex closure place faceThe back side be fixed with hard sheet.
3. printed circuit board according to claim 1 and 2, is characterized in that: described conduction convex closureHeight of projection is 30～300 μ m, and the diameter of described conduction convex closure is φ 50～φ 800 μ m.
4. printed circuit board according to claim 1 and 2, is characterized in that: on described FPC daughter boardBe laid with the first connection line, the lower surface of described FPC daughter board is provided with join domain, described conduction convex closure structureBuild in described join domain, described the first connection line is connected with described conduction convex closure conduction; Described PCBOn motherboard, be laid with the second connection line, in described the second connection line, be provided with corresponding with described conduction convex closureDescribed contact circuit; The lower surface of described FPC daughter board and described PCB motherboard upper surface are mounted with, and make instituteState conduction convex closure and described contact circuit and be in contact with one another so that described FPC daughter board and described PCB motherboard the twoForm conductive path.
5. printed circuit board according to claim 4, is characterized in that: the following table of described FPC daughter boardThe concrete mode that the upper surface of face and described PCB motherboard is mounted with comprises: the described company of described FPC daughter boardConnect and in region, be provided with the first through hole that runs through described FPC daughter board, described in described PCB motherboard is provided with and runs throughThe second through hole of PCB motherboard, described the second through hole is corresponding one by one with described the first through hole; Described printed circuitPlate also includes locating dowel, the two ends of described locating dowel pass respectively and be fixed on described the first through hole and described inIn the second through hole, so that the upper surface of the lower surface of described FPC daughter board and described PCB motherboard is mounted with.
6. printed circuit board according to claim 5, is characterized in that: described hard sheet is provided withRun through the third through-hole of described hard sheet, described third through-hole and described the first through hole, described the second through holeCorresponding one by one, described locating dowel is also passed and is fixed in described third through-hole.
7. printed circuit board according to claim 6, is characterized in that, the two ends of described locating dowel are dividedChuan Guo and not be fixed in described the first through hole and described the second through hole and described locating dowel is passed and is fixed on instituteThe concrete mode of stating in third through-hole comprises: one end of described locating dowel is through described the of described FPC daughter boardThe described third through-hole of one through hole and described hard sheet is also welded and fixed; The other end of described locating dowelBe provided with external screw thread described the second through hole through described PCB motherboard, then use nut and described external screw threadCoordinate and screw, so that described locating dowel and described the second through hole are fixed.
8. printed circuit board according to claim 2, is characterized in that, described conduction convex closure place faceThe back side concrete mode that is fixed with hard sheet comprise: use gum by the back of the body of described conduction convex closure place faceFace and described hard sheet are pasted fixing, and wherein, the material of described hard sheet is that stainless steel, aluminium closeGold, titanium alloy, polyimides, epoxy resin or polytetrafluoroethylene (PTFE).
9. printed circuit board according to claim 2, is characterized in that, described conduction convex closure place faceThe back side concrete mode that is fixed with hard sheet comprise: the gum containing base material is pasted and is fixed on described conductionThe back side of convex closure place face, thereby at the fixing hard sheet that forms in the back side of described conduction convex closure place face,Wherein, the material of described base material is polyimides, epoxy resin or polytetrafluoroethylene (PTFE).
10. printed circuit board according to claim 1 and 2, is characterized in that: described conduction convex closureBy electro-plating method or mechanical stamping method to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610135729.9A CN105611729A (en) | 2016-03-10 | 2016-03-10 | Printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610135729.9A CN105611729A (en) | 2016-03-10 | 2016-03-10 | Printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105611729A true CN105611729A (en) | 2016-05-25 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610135729.9A Pending CN105611729A (en) | 2016-03-10 | 2016-03-10 | Printed circuit board |
Country Status (1)
| Country | Link |
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| CN (1) | CN105611729A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109688702A (en) * | 2018-12-21 | 2019-04-26 | 欣旺达电子股份有限公司 | Pcb board connection component |
| TWI771461B (en) * | 2018-02-19 | 2022-07-21 | 南韓商三星電機股份有限公司 | Printed circuit board |
| WO2022261970A1 (en) * | 2021-06-18 | 2022-12-22 | 庆鼎精密电子（淮安）有限公司 | Circuit board assembly and manufacturing method therefor |
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| JPH11112148A (en) * | 1997-09-30 | 1999-04-23 | Elna Co Ltd | Multilayered printed wiring board |
| CN1294484A (en) * | 1999-10-27 | 2001-05-09 | 华硕电脑股份有限公司 | Printed circuit board structure |
| US20080036063A1 (en) * | 2006-08-08 | 2008-02-14 | Samsung Electronics Co., Ltd. | Semiconductor package having flexible lead connection plate for electrically connecting base and chip |
| US20080230264A1 (en) * | 2007-03-19 | 2008-09-25 | Mutual-Tek Industries Co., Ltd. | Interconnection structure and method thereof |
| CN102749518A (en) * | 2011-04-22 | 2012-10-24 | 财团法人交大思源基金会 | Resistance measuring structure of bump contact and packaging substrate comprising same |
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2016
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11112148A (en) * | 1997-09-30 | 1999-04-23 | Elna Co Ltd | Multilayered printed wiring board |
| CN1294484A (en) * | 1999-10-27 | 2001-05-09 | 华硕电脑股份有限公司 | Printed circuit board structure |
| US20080036063A1 (en) * | 2006-08-08 | 2008-02-14 | Samsung Electronics Co., Ltd. | Semiconductor package having flexible lead connection plate for electrically connecting base and chip |
| US20080230264A1 (en) * | 2007-03-19 | 2008-09-25 | Mutual-Tek Industries Co., Ltd. | Interconnection structure and method thereof |
| CN102749518A (en) * | 2011-04-22 | 2012-10-24 | 财团法人交大思源基金会 | Resistance measuring structure of bump contact and packaging substrate comprising same |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI771461B (en) * | 2018-02-19 | 2022-07-21 | 南韓商三星電機股份有限公司 | Printed circuit board |
| CN109688702A (en) * | 2018-12-21 | 2019-04-26 | 欣旺达电子股份有限公司 | Pcb board connection component |
| WO2022261970A1 (en) * | 2021-06-18 | 2022-12-22 | 庆鼎精密电子（淮安）有限公司 | Circuit board assembly and manufacturing method therefor |
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Application publication date: 20160525 |