CN105592675B - Emi filter - Google Patents
Emi filter Download PDFInfo
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- CN105592675B CN105592675B CN201410568337.2A CN201410568337A CN105592675B CN 105592675 B CN105592675 B CN 105592675B CN 201410568337 A CN201410568337 A CN 201410568337A CN 105592675 B CN105592675 B CN 105592675B
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Abstract
EMI FILTER provided by the invention, including shell, magnetic bead, inductor, PCB capacitance components, the ends A terminal and the ends B terminal；PCB capacitance components include pcb board and uniformly distributed several capacitances on the outside of pcb board of center line around pcb board；The ends A terminal is equipped with the first cavity；The ends B terminal is equipped with the second cavity.Since the ends the A terminal of the present invention is equipped with the first cavity, the ends B terminal is equipped with the second cavity, make the lead set on enclosure that can lead to shell exterior by the first cavity, the second cavity, and keep the lead solderable outside the shell, cause lead the problem for loosening or being damaged occur when can avoid because of EMI FILTER forced vibration；Simultaneously as several capacitances in the present invention are to be uniformly arranged on the outside of pcb board, can avoid because sending a telegraph the problem of holding cracking when EMI FILTER forced vibration.
Description
Technical field
The present invention relates to the technical field of filter more particularly to a kind of EMI FILTERs.
Background technology
EMI FILTER (electromagnetic interface filter) is a kind of low-pass filter being made of inductance and capacitance, it can allow low
The useful signal of frequency passes through, and has inhibiting effect to High-frequency Interference.
EMI FILTER is mainly formed by shell and set on the inductor, capacitance, pcb board of enclosure, wherein
Current capacitance mostly uses greatly ceramic disks feedthrough capacitor, and the capacitance can be directly welded at enclosure, in this way, because disk is worn
Heart capacity area is big, thinner thickness, is easy to hold cracking because sending a telegraph when EMI FILTER forced vibration；Further more, due to universal
Inside the housing by the lead welding of EMI FILTER, in this way, being also easy because being caused when EMI FILTER forced vibration
Lead occurs loosening or be damaged.
Therefore, it is necessary to provide a kind of technological means to solve drawbacks described above.
Invention content
It is an object of the invention to overcome the defect of the prior art, EMI FILTER is provided, to solve the prior art
EMI FILTER structure be easy because sent a telegraph when EMI FILTER forced vibration hold cracking, loosening occurs in lead or by
The problem of damage.
The invention is realized in this way EMI FILTER, including：
Shell with inner cavity；
Set on the magnetic bead of the first end of the shell inner cavity；
Set on the inductor of the second end of the first end relative to the shell inner cavity；
PCB capacitance components set on the shell inner cavity and between the magnetic bead and the inductor, the PCB electricity
It includes pcb board and uniformly distributed several capacitances on the outside of the pcb board of center line around the pcb board to hold component,
And the PCB capacitance components are connect with the magnetic bead, the inductor respectively；
The first end of the ends A terminal on the first side of the shell, the ends A terminal passes through the magnetic bead and company
The PCB capacitance components are connected to, the second end of the first end relative to the ends A terminal exposes to the first side of the shell
Outside, and the ends A terminal is equipped with for being pierced by set on the lead of the enclosure so that the lead is solderable in institute
State the first cavity of shell exterior；And
The ends B terminal on the second side relative to the first side of the shell, the first end of the ends B terminal
Intert the second side into the shell and is connected to the inductor, the second end of the first end relative to the ends B terminal
The outside of the second side of the shell is exposed to, and the ends B terminal is equipped with for being worn set on the lead of the enclosure
Go out so that solderable the second cavity in the shell exterior of the lead.
Specifically, the second end of the ends A terminal is equipped with to prevent terminating in the A after the EMI FILTER stress
There is the first fixed part for rotating or being drawn out on the housing in end terminal；
The second end of the ends B terminal is equipped with the anti-ends B terminal after terminating in the EMI FILTER stress in institute
State the second fixed part that occurs rotating on shell or be drawn out.
Further, first fixed part is in the aircraft wing of the both sides of the second end of the ends A terminal protrusion；
Second fixed part is in the aircraft wing of the both sides of the second end of the ends B terminal protrusion.
Specifically, the pcb board is cylindrical structure.
Further, the capacitance is laminated structure.
Further, capacitance tool there are three or four.
Specifically, the second side of the shell is also convexly equipped with a column connecting pin, and the outside of the connecting pin, which is equipped with, to be connected
Screw thread is connect, and is arranged with the nut of gasket and matched connection on the connecting pin, the first end of the ends B terminal passes through institute
It states the cavity that connecting pin center opens up and is connected to the inductor.
Specifically, EMI FILTER further includes embedding in the fluid sealant of the shell inner cavity.
Further, the first internal thread being fixedly installed for the ends A terminal is equipped in the first side of the shell,
The first end of the ends A terminal is contacted with first internal thread；
The second internal thread being fixedly installed for the ends B terminal, the ends B end are equipped in second side of the shell
The first end of son is contacted with second internal thread.
Further, the fluid sealant includes AB glue and G500 glue, and the AB glue distinguishes the institute of enclosure described in embedding
It states at the position that the first end of the ends A terminal is contacted with first internal thread, in the first end and described second of the ends B terminal
At the position of thread contact, except the other parts of the part of the AB glue embedding in enclosure described in the G500 glue embedding.
The technique effect of EMI FILTER of the present invention is：Since the ends the A terminal of the present invention is equipped with the first cavity, B
It holds terminal to be equipped with the second cavity, makes the lead set on enclosure that can be led to outside shell by the first cavity, the second cavity
Portion, and keep the lead solderable outside the shell, compared with the existing technology in embodiment party by lead welding inside the housing
Formula causes lead the problem for loosening or being damaged occur when can avoid because of EMI FILTER forced vibration, improves electromagnetic interference filter
The reliability of wave device；Simultaneously as several capacitances in the present invention are to be uniformly arranged on the outside of pcb board, relative to existing
There is capacitance in technology to be directly welded at the embodiment of enclosure, can avoid because being sent a telegraph when EMI FILTER forced vibration
The problem of holding cracking.
Further, solid since the second end of the ends A terminal is equipped with the first fixed part, the second end of the ends B terminal is equipped with second
Determine portion, it, can be by first fixed part, the second fixed part and peace after EMI FILTER is by torsion or pulling force in this
The positioning fixed function for filling component, avoids the problem that rotating or being drawn out occur on the shell in the ends A terminal, the ends B terminal.
Description of the drawings
Fig. 1 is the schematic diagram of the EMI FILTER of the embodiment of the present invention；
Fig. 2 is the internal structure schematic diagram of the EMI FILTER of the embodiment of the present invention；
Fig. 3 is the schematic diagram of the shell of the EMI FILTER of the embodiment of the present invention；
Fig. 4 is the ends the A terminal of the EMI FILTER of the embodiment of the present invention or the schematic diagram of the ends B terminal；
Fig. 5 is the structural schematic diagram of the PCB capacitance components of the EMI FILTER of the embodiment of the present invention；
Fig. 6 is the structural representation of another embodiment of PCB capacitance components of the EMI FILTER of the embodiment of the present invention
Figure.
Specific implementation mode
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
It please refers to Fig.1 and Fig. 2, the embodiment of the EMI FILTER of the present invention is illustrated below.
The EMI FILTER 100 of the present embodiment, including shell 10, magnetic bead 20, inductor 30, PCB capacitance components 40,
The ends A terminal 50 and the ends B terminal 60, are below further described each component of EMI FILTER 100：
Shell 10 has inner cavity, and the shell 10 is cylindrical-shaped structure, upper casing and lower casing is could be provided as, in order to group
Dress；
Magnetic bead 20 is set to the first end of 10 inner cavity of shell, wherein magnetic bead 10 is exclusively used in inhibiting signal wire, the height on power cord
Frequency noise and spike interference, also have the ability for absorbing electrostatic pulse.Magnetic bead 10 has very high resistivity and magnetic conductivity, equivalent
It connects in resistance and inductance, but resistance value and inductance value all change with frequency.It has better High frequency filter than common inductance
Characteristic, presented in high frequency it is resistive, so higher impedance can be kept in comparatively wide frequency range, to improve frequency modulation filter
Wave effect；
Inductor 30 is set to the second end of the first end relative to 10 inner cavity of shell, wherein inductor 30 is can be electricity
The element that magnetic energy can be converted into and stored.Inductor 30 has certain inductance, it only hinders the variation of electric current.If electric
In the state that no electric current passes through, it will attempt that electric current is hindered to flow through it sensor 30 when circuit is connected；If inductor 30 exists
In the state of having electric current to pass through, it will attempt to maintain electric current constant when circuit disconnects；
PCB capacitance components 40 are set to 10 inner cavity of shell and between magnetic bead 20 and inductors 30, the PCB capacitance components 40
Including pcb board 41 and around uniformly distributed several capacitances 42 on the outside of pcb board 41 of the center line of pcb board 41, and PCB is electric
Hold component 40 to connect with magnetic bead 20, inductor 30 respectively；
The ends A terminal 50 is set on the first side of shell 10, is used as leading-out terminal, wherein the first end of the ends A terminal 50
Across magnetic bead 20 and PCB capacitance components 40 are connected to, the second end of the first end relative to the ends A terminal 50 exposes to shell 10
The outside of first side, and the ends A terminal 50 is equipped with and is pierced by for the lead inside shell 10 so that lead is solderable outside
The first cavity 51 outside shell 10；
The ends B terminal 60 is set on the second side relative to the first side of shell 10, is used as input terminal, wherein B
The first end of end terminal 60 interts the second side into shell 10 and is connected to inductor 30, and first relative to the ends B terminal 60
The second end at end exposes to the outside of the second side of shell 10, and the ends B terminal 60 was equipped with for drawing inside shell 10
Line is pierced by so that solderable the second cavity 61 outside shell 10 of lead.
Since the ends the A terminal 50 of the present embodiment is equipped with the first cavity 51, the ends B terminal 60 is equipped with the second cavity 61, make to set
Lead inside shell 10 can lead to outside shell 10 by the first cavity 51, the second cavity 61, and make the lead can
Be welded on outside shell 10, compared with the existing technology in lead is welded on the embodiment inside shell 10, can avoid because of electricity
Lead is caused the problem for loosening or being damaged occur when magnetic disturbance 100 forced vibration of filter, that improves EMI FILTER 100 can
By property；Simultaneously as several capacitances 42 in the present embodiment are to be uniformly arranged on the outside of pcb board 41, relative to existing
Capacitance is directly welded at the embodiment of enclosure in technology, can avoid because being caused when 100 forced vibration of EMI FILTER
The problem of capacitance 42 cracks.
Referring to Fig. 4, and Fig. 2, the second end of the ends the A terminal 50 of the present embodiment is combined to be equipped with to prevent terminating in electromagnetic interference
There is the first fixed part 52 for rotating or being drawn out on shell 10 in the ends A terminal 50 after 100 stress of filter；
The second end of the ends B terminal 60 is equipped with the anti-ends B terminal 60 after terminating in 100 stress of EMI FILTER on shell 10
There is the second fixed part 62 for rotating or being drawn out.
Wherein, since the second end of the ends A terminal 50 is equipped with the first fixed part 52, the second end of the ends B terminal 60 is equipped with second
Fixed part 62, can be solid by first fixed part 52, second after EMI FILTER 100 is by torsion or pulling force in this
The positioning fixed function for determining portion 62 and installing component, avoid the ends A terminal 50, the ends B terminal 60 occur rotating on shell 10 or
The problem of being drawn out.
Specifically, which is in the aircraft wing of the both sides of the second end of the ends A terminal 50 protrusion, to protect
Demonstrate,proving the ends A terminal 50 has preferable twisting resistance and stretching resistance, while also making direct labor's making easy to process；Second fixed part
The 62 aircraft wing to be protruded in the both sides of the second end of the ends B terminal 60, to ensure that the ends B terminal 60 has preferable twisting resistance
And stretching resistance, while also making direct labor's making easy to process.
Fig. 5 and Fig. 6 are please referred to, the pcb board 41 of the present embodiment is cylindrical structure, in order to the setting of capacitance 42.Preferably
Ground, capacitance 42 are laminated structure, that is, the capacitance 42 of the present embodiment is sheet capacitor, and sheet capacitor has that capacity is big, volume
The features such as small, easy chip type.And for the ease of materials, which is chip-type laminated ceramic dielectric capacitance, wherein chip
Multi-layer ceramic capacitor (MLCC), referred to as chip-type laminated capacitor (or being further referred to as chip capacitor), is by printed electricity
The ceramic dielectric diaphragm of pole (interior electrode) is superimposed together in a manner of misplacing, and ceramic chip is formed by disposable high temperature sintering,
Metal layer (external electrode) is sealed up at the both ends of chip again, to form the structure of a similar only stone, therefore is also monolithic capacitor
Device.And the main component of common ceramic dielectric is that MgTiO3, CaTiO3, SrTiO3 and TiO2 add suitable terres rares oxygen
Compound etc. is formulated, its main feature is that medium coefficient is larger, dielectric loss is low, temperature coefficient is small, environment temperature is applied widely
It is good with high frequency characteristics, it is used in more demanding occasion (I classes ceramic capacitor).
As the preferred embodiment of the present embodiment, the tool of capacitance 42 there are three or four, general job requirement can be reached completely.
Referring to Fig. 3, and combine Fig. 2, in order to make to be easily installed setting to EMI FILTER 100, the of shell 10
Two sides are also convexly equipped with a column connecting pin 11, and the outside of connecting pin 11 is equipped with connection screw thread, and connecting pin 11 is arranged with gasket
And the nut of matched connection, the first end of the ends B terminal 60 are connected to inductance across the cavity that 11 center of connecting pin opens up
Device 30.
Please refer to Fig. 2 and Fig. 3, the EMI FILTER 100 of the present embodiment further includes embedding in the close of 10 inner cavity of shell
Sealing 70, specifically, the present embodiment is using multiple vacuum encapsulation technology to 100 embedding fluid sealant 70 of EMI FILTER,
To ensure the leakproofness of EMI FILTER 100 and ensure inside EMI FILTER 100 without steam bubble, meanwhile, also make
EMI FILTER 100 can work normally at low pressure.
In addition, in order to further ensure having preferable Mechanical Reliability after 100 embedding of EMI FILTER, and make
Fixation between 10 internal element of the ends A terminal 50 and shell, 10 internal element of the ends B terminal 60 and shell is reliable, and the of shell 10
Be equipped with the first internal thread (not indicated in figure) for be fixedly installed for the ends A terminal 50 in one side, the first end of the ends A terminal 50 and
First internal thread contacts, and with the CONTACT WITH FRICTION between the first end and the first internal thread by the ends A terminal 50, improves the ends A terminal
50 positioning stationarity；The second internal thread 12 being fixedly installed for the ends B terminal 60, the ends B end are equipped in second side of shell 10
The first end of son 60 is contacted with the second internal thread 12, to pass through rubbing between the first end of the ends B terminal 60 and the second internal thread 12
Contact is wiped, the ends B terminal 60 is improved and positions stationarity.
Further, in order to preferably ensure inner sealing and the ends A terminal 50, the ends B of EMI FILTER 100
Terminal 60 frictionally secures, and preferably, fluid sealant 70 includes AB glue 71 and G500 glue 72, and AB glue 71 is distinguished inside embedding shell 10
At the position that the first end of the ends A terminal 50 is contacted with the first internal thread, the first end of the ends B terminal 60 contacts with the second internal thread 12
Position at, in 72 embedding shell of G500 glue, 10 inside except 71 embedding of AB glue part other parts.
Wherein, AB glue 71 is the nickname of two liquid mixed hardening glue, and a liquid is this glue, and a liquid is curing agent, and two liquid phases are mixed
It can harden, be not necessary to answer maturation firmly by temperature, so being one kind of cold(-)setting glue.
G500 glue 72 be a kind of one-component, heat cure universal epoxy glue and fluid sealant.It is that a kind of viscosity is low, is easy to
It pumps, the pasty masses of rub resistance, collapse resistance is good, and the room temperature preservation phase is long.It is good to cure rear surface brightness, elevated temperature strength is high,
With excellent heat-resisting, waterproof and dielectric properties.
The foregoing is merely preferred embodiments of the present invention, structure is not limited to the above-mentioned shape enumerated, it is all
All any modification, equivalent and improvement made by within the spirit and principles in the present invention etc. should be included in the protection of the present invention
Within the scope of.
Claims (8)
1. EMI FILTER, which is characterized in that including：
Shell with inner cavity；
Set on the magnetic bead of the first end of the shell inner cavity；
Set on the inductor of the second end of the first end relative to the shell inner cavity；
PCB capacitance components set on the shell inner cavity and between the magnetic bead and the inductor, the PCB capacitance groups
If part includes the pcb board of cylinder structure and uniformly distributed on the outside of the pcb board around the center line of the pcb board
Dry capacitance, and the PCB capacitance components are connect with the magnetic bead, the inductor respectively；
The first end of the ends A terminal on the first side of the shell, the ends A terminal passes through the magnetic bead and is connected to
The PCB capacitance components, the second end of the first end relative to the ends A terminal expose to the outer of the first side of the shell
Portion, and the ends A terminal is equipped with for being pierced by set on the lead of the enclosure so that the lead is solderable described outer
The first cavity outside shell；And
The first end of the ends B terminal on the second side relative to the first side of the shell, the ends B terminal is interspersed
Enter the second side of the shell and be connected to the inductor, the second end of the first end relative to the ends B terminal is exposed
Outside in the second side of the shell, and the ends B terminal be equipped with for set on the lead of the enclosure be pierced by with
Keep the lead solderable the shell exterior the second cavity；
The second end of the ends A terminal is equipped with to prevent that the ends A terminal is in institute after terminating in the EMI FILTER stress
State the first fixed part that occurs rotating on shell or be drawn out；
The second end of the ends B terminal is equipped with the anti-ends B terminal after terminating in the EMI FILTER stress described outer
Occurs the second fixed part for rotating or being drawn out on shell.
2. EMI FILTER as described in claim 1, it is characterised in that：First fixed part is in the ends A end
The aircraft wing of the both sides protrusion of the second end of son；
Second fixed part is in the aircraft wing of the both sides of the second end of the ends B terminal protrusion.
3. EMI FILTER as described in claim 1, it is characterised in that：The capacitance is laminated structure.
4. EMI FILTER as described in claim 1, it is characterised in that：Capacitance tool there are three or four.
5. EMI FILTER as described in claim 1, it is characterised in that：Second side of the shell is also convexly equipped with one
The outside of column connecting pin, the connecting pin is equipped with connection screw thread, and gasket and matched company are arranged on the connecting pin
The first end of the nut connect, the ends B terminal is connected to the inductor across the cavity that the connecting pin center opens up.
6. EMI FILTER as described in any one in claim 1-5, it is characterised in that：Further include embedding in the shell
The fluid sealant of inner cavity.
7. EMI FILTER as claimed in claim 6, it is characterised in that：In first side of the shell be equipped with for
First internal thread of the ends A terminal fixed setting, the first end of the ends A terminal are contacted with first internal thread；
The second internal thread being fixedly installed for the ends B terminal is equipped in second side of the shell, the ends B terminal
First end is contacted with second internal thread.
8. EMI FILTER as claimed in claim 7, it is characterised in that：The fluid sealant includes AB glue and G500 glue,
The position that the first end of the ends the A terminal of enclosure is contacted with first internal thread described in the AB glue difference embedding
Locate, at the position that the first end of the ends B terminal is contacted with second internal thread, enclosure described in the G500 glue embedding
In except the AB glue embedding part other parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410568337.2A CN105592675B (en) | 2014-10-22 | 2014-10-22 | Emi filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410568337.2A CN105592675B (en) | 2014-10-22 | 2014-10-22 | Emi filter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105592675A CN105592675A (en) | 2016-05-18 |
| CN105592675B true CN105592675B (en) | 2018-11-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410568337.2A Active CN105592675B (en) | 2014-10-22 | 2014-10-22 | Emi filter |
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| Country | Link |
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| CN (1) | CN105592675B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107093992B (en) * | 2017-05-23 | 2023-08-29 | 深圳振华富电子有限公司 | filter |
| CN107708398A (en) * | 2017-10-12 | 2018-02-16 | 四川中光防雷科技股份有限公司 | A kind of high reliability EMI filtration modules |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202275687U (en) * | 2011-09-21 | 2012-06-13 | 艾默生网络能源有限公司 | Difference and common module integrated inductor and electromagnetic interference (EMI) filter |
| CN202353456U (en) * | 2011-12-06 | 2012-07-25 | 上海埃德电子股份有限公司 | Electromagnetic interference filter with good shielding and overcurrent protection function |
| CN102710229A (en) * | 2012-05-18 | 2012-10-03 | 聚信科技有限公司 | Electromagnetic interference filter and manufacturing method |
| CN204206719U (en) * | 2014-10-22 | 2015-03-11 | 深圳振华富电子有限公司 | Electromagnetic interference filter |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7071797B2 (en) * | 2002-02-19 | 2006-07-04 | Conductus, Inc. | Method and apparatus for minimizing intermodulation with an asymmetric resonator |
| KR101208240B1 (en) * | 2012-09-26 | 2012-12-04 | 삼성전기주식회사 | Electro-magnetic interference filter, power supplying apparatus having the same, and display apparatus having the same |
-
2014
- 2014-10-22 CN CN201410568337.2A patent/CN105592675B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202275687U (en) * | 2011-09-21 | 2012-06-13 | 艾默生网络能源有限公司 | Difference and common module integrated inductor and electromagnetic interference (EMI) filter |
| CN202353456U (en) * | 2011-12-06 | 2012-07-25 | 上海埃德电子股份有限公司 | Electromagnetic interference filter with good shielding and overcurrent protection function |
| CN102710229A (en) * | 2012-05-18 | 2012-10-03 | 聚信科技有限公司 | Electromagnetic interference filter and manufacturing method |
| CN204206719U (en) * | 2014-10-22 | 2015-03-11 | 深圳振华富电子有限公司 | Electromagnetic interference filter |
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| CN105592675A (en) | 2016-05-18 |
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