CN105592674B - Emi filter - Google Patents
Emi filter Download PDFInfo
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- CN105592674B CN105592674B CN201410563685.0A CN201410563685A CN105592674B CN 105592674 B CN105592674 B CN 105592674B CN 201410563685 A CN201410563685 A CN 201410563685A CN 105592674 B CN105592674 B CN 105592674B
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- lid
- emi filter
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Abstract
EMI FILTER provided by the invention, inductor, the first capacitance, the second capacitance, input terminal and leading-out terminal including lid, at least two different frequencies being connected with each other, the interior electric current for being equipped with the electric current that can increase EMI FILTER of lid increase structure;At least two inductors, the second capacitance are divided into the both ends of lid portion inside;Input terminal, leading-out terminal are arranged in two outsides of lid respectively.Increase structure due to being equipped with electric current in lid, increase structure by electric current, so that the electric current for flowing through lid portion inside component is more than the electric current of the cover body structure of the prior art, the D.C. resistance of EMI FILTER is reduced with this, to reduce the power consumption of EMI FILTER;Simultaneously as the inductor for the different frequency being connected with each other equipped at least two, to inhibit different frequency bands, the setting structure of single inductor compared with the existing technology can effectively make bandwidth reach 100KHz 2GHz from 100KHz 1GHz.
Description
Technical field
The present invention relates to the technical field of filter more particularly to a kind of EMI FILTERs.
Background technology
Electromagnetic interference (EMI) filter is a kind of low-pass filter being made of inductance and capacitance, it can allow the having of low frequency
It is passed through with signal, and has inhibiting effect to High-frequency Interference.
Mainly the inductor by lid and set on lid portion inside, capacitance form EMI FILTER, wherein current
Cover body structure is mostly injection molding, then will not remake any processing, and such cover body structure, flows through lid portion inside in electric current
When component, larger D.C. resistance is will produce, EMI FILTER is not only caused to generate larger power consumption, and is easy to cause lid
Body heating fever, reduces the use reliability of EMI FILTER;Further more, mostly only due to current EMI FILTER
It is provided with single inductor, and single inductor is difficult to inhibit different frequency bands.
Therefore, it is necessary to provide a kind of technological means to solve drawbacks described above.
Invention content
It is an object of the invention to overcome the defect of the prior art, the EMI FILTER provided can solve existing
Have technology EMI FILTER structure be easy because will produce larger D.C. resistance when electric current flows through lid portion inside component, with
Cause causes EMI FILTER to lead to the problem of larger power consumption and the easy heating fever of lid, and solves existing skill
The EMI FILTER of art is difficult to inhibit the problem of different frequency bands.
The invention is realized in this way EMI FILTER, including:
Lid, with the first outside and relative to the second outside that first outside is arranged, the lid outside the lid
The inside second end at least with first end and relative to first end setting, and be additionally provided in the lid and can increase the electromagnetism
The electric current of the electric current of interference filter increases structure;
At least two inductors with different frequency, are set to the first end and each inductor is connected with each other;
First capacitance is touched set on the lid portion inside and at least two inductors;
Second capacitance set on the second end and is adjacent at least two inductors;
Input terminal is arranged in first outside and is connected at least two inductors;And
Leading-out terminal is arranged in second outside and is connected to second capacitance.
Specifically, it is the conductive metal layer being attached on the lid inner wall, at least two institutes that the electric current, which increases structure,
Inductor is stated to connect with the conductive metal layer by its internal coil being arranged.
Specifically, there are three the inductor is set.
Further, any inductor includes inductance core, and the inductance core is ellipsoidal structure.
Specifically, first capacitance is slice structure.
Specifically, second capacitance is feedthrough capacitor.
Further, the feedthrough capacitor is square structure.
Further, the outside of the feedthrough capacitor is equipped with the bandwidth inhibition that can inhibit the EMI FILTER bandwidth
Structure.
Preferably, it is the slicker solder layer that plating is set on the outside of the feedthrough capacitor that the bandwidth, which inhibits structure,.
Specifically, the lid includes upper cover and lower cover, and the both sides of the upper cover are equipped with grab, and the both sides of the lower cover are set
There are the card slot of clamping corresponding with the grab, the upper cover to be clamped with the card slot by the grab and connect with the lower cover
It closes.
The technique effect of EMI FILTER of the present invention is:Due to being equipped with electric current increase knot in the lid of the present invention
Structure increases structure by electric current, and the electric current for flowing through lid portion inside component is made to be more than the electric current of the cover body structure of the prior art, with
This reduces the D.C. resistance of EMI FILTER, to reduce the power consumption of EMI FILTER;Simultaneously as the present invention is set
It is equipped with the inductor of the different frequency of at least two interconnections, to inhibit different frequency bands, compared with the existing technology single
The setting structure of inductor effectively can make bandwidth reach 100KHz-2GHz from 100KHz-1GHz.
Description of the drawings
Fig. 1 is the schematic diagram of the EMI FILTER of the embodiment of the present invention;
Fig. 2 is the schematic diagram of another angle of the EMI FILTER of the embodiment of the present invention;
Fig. 3 be Fig. 2 in A-A to sectional view;
Fig. 4 is the exploded view of the EMI FILTER of the embodiment of the present invention.
Specific implementation mode
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
It please refers to Fig.1 to Fig.4, the most preferred embodiment of the EMI FILTER of the present invention is illustrated below.
The EMI FILTER 100 of the present embodiment includes the electricity of the different frequency of the interconnection of lid 10, at least two
Sensor 20, the first capacitance 30, the second capacitance 40, input terminal 50 and leading-out terminal 60, below to EMI FILTER 100
Each component is further described:
There is the first outside and the second outside relative to the first outside setting outside lid 10, at least have in lid 10
First end and second end relative to first end setting, and be additionally provided in lid 10 and can increase EMI FILTER 100
The electric current of electric current increases structure 11, in addition, the height of lid 10 is 4mm, and an installation cavity is equipped in the lid 10, the installation cavity
Installation space be 2.0-2.5mm;
At least two inductor 20 with different frequency is set to the first end of lid 10 and 20 phase of each inductor interconnects
It connects;
First capacitance 30 is set to 10 inside of lid and is touched at least two inductors 20;
Second capacitance 40 is set to the second end of lid 10 and is adjacent at least two inductors 20;
Input terminal 50 is arranged in the first outside of lid 10 and is connected at least two inductors 20;
Leading-out terminal 60 is arranged in second outside in the first outside relative to lid 10 and is connected to the second capacitance 40.
Increase structure 11 due to being equipped with electric current in the lid 10 of the present embodiment, increases structure 11 by electric current, make to flow through
The electric current of 10 internal part of lid is more than the electric current of the cover body structure of the prior art, and EMI FILTER 100 is reduced with this
D.C. resistance, to reduce the power consumption of EMI FILTER 100;Simultaneously as the present embodiment is provided at least two mutually
The inductor 20 of the different frequency of connection, to inhibit different frequency bands, the setting knot of single inductor compared with the existing technology
Structure effectively can make bandwidth reach 100KHz-2GHz from 100KHz-1GHz.
Referring to Fig. 3, specifically, it is the conductive metal layer being attached on 10 inner wall of lid that electric current, which increases structure 11, preferably
Ground, as long as being attached with conductive metal layer on 10 inner wall of at least one lid, you can make the electricity for flowing through 10 internal part of lid
Conductance lead to it is without hindrance, reduce EMI FILTER 100 D.C. resistance, increase the electricity of EMI FILTER 100 therefrom
Stream;In addition, at least two inductor 20 is connect by its internal coil being arranged with conductive metal layer so that arrive this at least two
A inductor 20 need not additionally be equipped with the coil being conductively connected, as long as the coil that at least two inductors, 20 inside is arranged
It is connect with conductive metal layer, in this, the fever of EMI FILTER 100 can be reduced to greatest extent.
Referring to Fig. 4, there are three the inductor 20 of the present embodiment sets, certainly, also can according to actual needs, be arranged three with
On.Wherein, any inductor 20 includes inductance core 21, and in order to make to the smaller of inductor 20 and more suitably pacify
Inside the installation cavity of lid 10, which is ellipsoidal structure, is highly 1.9mm.
Preferably, first capacitance 30 of the present embodiment is slice structure, that is, first capacitance 30 is sheet capacitor, and piece
Formula capacitance has the characteristics that big, small, the easy chip type of capacity.And for the ease of materials, which is chip-type laminated
Ceramic dielectric capacitance, wherein chip-type laminated ceramic capacitor (MLCC), the chip-type laminated capacitor of abbreviation (or be further referred to as
Chip capacitor), it is to be superimposed together in a manner of misplacing by the ceramic dielectric diaphragm of printed electrode (interior electrode), by disposable
High temperature sintering forms ceramic chip, then seals up metal layer (external electrode) at the both ends of chip, to form one similar to only stone
Structure, therefore also it is monolithic capacitor.And the main component of common ceramic dielectric be MgTiO3, CaTiO3, SrTiO3 and
TiO2 adds suitable rare-earth oxide etc. and is formulated, its main feature is that medium coefficient is larger, dielectric loss is low, temperature system
Number is small, environment temperature is applied widely and high frequency characteristics is good, is used in more demanding occasion (I classes ceramic capacitor).
Referring again to Fig. 4, the second capacitance 40 is feedthrough capacitor, and to be one kind be mainly used in metal decking feedthrough capacitor
On, it is mainly used for the filtering device for inhibiting high-frequency harmonic to interference such as signal, power cords.
In order to make the smaller of feedthrough capacitor and more suitably be mounted on inside the installation cavity of lid 10, feedthrough capacitor
For square structure, that is, feedthrough capacitor has a square casing, and the height of the square casing is 2.2mm.
Have plenty of again, the outside of feedthrough capacitor is equipped with the bandwidth inhibition structure that can inhibit 100 bandwidth of EMI FILTER
41, and inhibit structure 41 by the bandwidth, so that bandwidth is inhibited required range, ensures the height of EMI FILTER 100 with this
Frequency and wideband performance, and can further ensure that bandwidth reaches 100KHz-2GHz.Preferably, it is plating that the bandwidth, which inhibits structure 41,
Slicker solder layer on the outside of feedthrough capacitor, specifically, the plating of slicker solder layer is set to the rectangular shell worn except the electrode of feedthrough capacitor
Other surfaces except two surfaces of body.
Please continue to refer to Fig. 4, it is installed on lid 10 for the ease of each internal part of EMI FILTER 100, this
The lid 10 of embodiment includes upper cover 12 and lower cover 13, and the both sides of upper cover 12 are equipped with grab 120, and the both sides of lower cover 13 are equipped with and card
Hook 12 corresponds to the card slot 13 of clamping, and upper cover 12 is clamped with card slot 130 by grab 120 and is engaged with lower cover 13, specifically, pacifying
When dress, as long as each internal part is installed on lower cover 13, after complete, then the card that makes the grab 120 of upper cover 12 be stuck in lower cover 13
Slot 130, you can make internal part capping protection, significantly facilitate the installation of installation personnel.
In addition, EMI FILTER 100 further includes the ground connection Five-gold-sheet having inside lid 10, by the ground connection five
Gold plaque 70 enables each internal part inside lid 10 to be grounded, jeopardizes use because of electrification to avoid internal part
The personal safety of person.
The foregoing is merely preferred embodiments of the present invention, structure is not limited to the above-mentioned shape enumerated, it is all
All any modification, equivalent and improvement made by within the spirit and principles in the present invention etc. should be included in the protection of the present invention
Within the scope of.
Claims (9)
1. EMI FILTER, which is characterized in that including:
Lid, with the first outside and relative to the second outside that first outside is arranged outside the lid, in the lid extremely
Second end with first end and relative to first end setting less, and be additionally provided in the lid and can increase the electromagnetic interference
The electric current of the electric current of filter increases structure, and it is the conductive metal being attached on the lid inner wall that the electric current, which increases structure,
Layer;
At least two inductors with different frequency, are set to the first end and each inductor is connected with each other, and at least
Two inductors are connect by its internal coil being arranged with the conductive metal layer;
First capacitance is touched set on the lid portion inside and at least two inductors;
Second capacitance set on the second end and is adjacent at least two inductors;
Input terminal is arranged in first outside and is connected at least two inductors;And
Leading-out terminal is arranged in second outside and is connected to second capacitance.
2. EMI FILTER as described in claim 1, it is characterised in that:There are three the inductor is set.
3. EMI FILTER as claimed in claim 2, it is characterised in that:Any inductor includes inductance magnetic
The heart, and the inductance core is ellipsoidal structure.
4. EMI FILTER as described in claim 1, it is characterised in that:First capacitance is slice structure.
5. EMI FILTER as described in claim 1, it is characterised in that:Second capacitance is feedthrough capacitor.
6. EMI FILTER as claimed in claim 5, it is characterised in that:The feedthrough capacitor is square structure.
7. EMI FILTER as claimed in claim 5, it is characterised in that:The outside of the feedthrough capacitor is equipped with and can inhibit
The bandwidth of the EMI FILTER bandwidth inhibits structure.
8. EMI FILTER as claimed in claim 7, it is characterised in that:It is described in plating is set to that the bandwidth, which inhibits structure,
Slicker solder layer on the outside of feedthrough capacitor.
9. such as claim 1-8 any one of them EMI FILTERs, it is characterised in that:The lid include upper cover and under
The both sides of lid, the upper cover are equipped with grab, and the both sides of the lower cover are equipped with the card slot of clamping corresponding with the grab, the upper cover
It is clamped with the card slot by the grab and is engaged with the lower cover.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410563685.0A CN105592674B (en) | 2014-10-21 | 2014-10-21 | Emi filter |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201410563685.0A CN105592674B (en) | 2014-10-21 | 2014-10-21 | Emi filter |
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CN105592674A CN105592674A (en) | 2016-05-18 |
CN105592674B true CN105592674B (en) | 2018-08-28 |
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CN201410563685.0A Active CN105592674B (en) | 2014-10-21 | 2014-10-21 | Emi filter |
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Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107093992B (en) * | 2017-05-23 | 2023-08-29 | 深圳振华富电子有限公司 | filter |
CN108155888A (en) * | 2018-01-05 | 2018-06-12 | 北京航天微电科技有限公司 | A kind of LTCC heavy EMI filters for powered electromagnetic to be inhibited to interfere |
CN109935947B (en) * | 2019-03-14 | 2023-11-10 | 深圳振华富电子有限公司 | Tubular filter |
Citations (6)
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CN102037528A (en) * | 2008-03-20 | 2011-04-27 | 格瑞巴奇有限公司 | Shielded three-terminal flat-through EMI/energy dissipating filter |
CN201956893U (en) * | 2010-12-20 | 2011-08-31 | 西安开容电子技术有限责任公司 | Filter used at output terminal of frequency converter |
CN103187943A (en) * | 2011-12-28 | 2013-07-03 | 中微半导体设备(上海)有限公司 | Radio-frequency filter for electrostatic chuck |
CN103887956A (en) * | 2014-04-15 | 2014-06-25 | 上海西艾爱电子有限公司 | High-voltage and large-current harmonics filter for photovoltaic inverter system |
CN104092444A (en) * | 2014-07-31 | 2014-10-08 | 王少夫 | Chained low-pass filtering circuit |
CN204157216U (en) * | 2014-10-21 | 2015-02-11 | 深圳振华富电子有限公司 | Electromagnetic interference filter |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009014859B4 (en) * | 2009-03-30 | 2013-06-20 | Phoenix Contact Gmbh & Co. Kg | Filter, in particular for filtering electromagnetic interference |
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2014
- 2014-10-21 CN CN201410563685.0A patent/CN105592674B/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102037528A (en) * | 2008-03-20 | 2011-04-27 | 格瑞巴奇有限公司 | Shielded three-terminal flat-through EMI/energy dissipating filter |
CN201956893U (en) * | 2010-12-20 | 2011-08-31 | 西安开容电子技术有限责任公司 | Filter used at output terminal of frequency converter |
CN103187943A (en) * | 2011-12-28 | 2013-07-03 | 中微半导体设备(上海)有限公司 | Radio-frequency filter for electrostatic chuck |
CN103887956A (en) * | 2014-04-15 | 2014-06-25 | 上海西艾爱电子有限公司 | High-voltage and large-current harmonics filter for photovoltaic inverter system |
CN104092444A (en) * | 2014-07-31 | 2014-10-08 | 王少夫 | Chained low-pass filtering circuit |
CN204157216U (en) * | 2014-10-21 | 2015-02-11 | 深圳振华富电子有限公司 | Electromagnetic interference filter |
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