CN107708398A - A kind of high reliability EMI filtration modules - Google Patents
A kind of high reliability EMI filtration modules Download PDFInfo
- Publication number
- CN107708398A CN107708398A CN201710944648.8A CN201710944648A CN107708398A CN 107708398 A CN107708398 A CN 107708398A CN 201710944648 A CN201710944648 A CN 201710944648A CN 107708398 A CN107708398 A CN 107708398A
- Authority
- CN
- China
- Prior art keywords
- shield shell
- high reliability
- filtration modules
- emi filtration
- inductance element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The present invention discloses a kind of high reliability EMI filtration modules, it is characterized in that, including shield shell, there is sealing cavity in the shield shell, the common mode inductance element of series connection and the capacity cell being connected in parallel on the common mode inductance element are provided with the sealing cavity, the capacity cell and the inductance element are arranged on pcb board, the pcb board fitting is fixed on the inner surface of the shield shell, and it is plugged with one group of contact pin extended to outside shield shell, the application provides a kind of high reliability EMI filtration modules, the harsh and unforgiving environments of aerospace systems can be met, with higher capability of resistance to radiation, and there is higher operation stability in the extreme environment of space flight.
Description
Technical field
The present invention relates to filtration module, and in particular to a kind of high reliability EMI filtration modules.
Background technology
With the development of space technology, space technology, various electronic equipments have been widely used for artificial satellite, universe flies
In the systems such as ship, carrier rocket.DC/DC power modules are the cores of avionics equipment power-supply system, for by system bus
Voltage conversion is voltage needed for subsystem work.And EMI (electromagnetic interference) filtration modules suppress as DC/DC power modules front end
The essential critical component of electromagnetic interference, it can effectively suppress Conduction Interference caused by DC/DC power modules.
Because all kinds of aerospace systems are needed in face of complicated and harsh working environment, the list that aerospace environment induces by it
Particle effect, total dose effect etc. can cause the in-orbit damage of Spacecraft Electronic component, performance degradation or even fail, and device removes
Need to resist outside the strong space radiation in spacecraft running, vibration and impact, high vacuum when still suffering from rocket launching,
High temperature and low temperature environment, and the characteristics of can not repair because aerospace electron component has, be non-exchange, therefore in the prior art
Common EMI filtration modules applied to ground environment do not possess aerospace is round-the-clock, in-orbit continual and steady ability to work,
It is in particular in：
The aerospace of high radiation can not be applied to, operating in spaceborne filtration module can be by earth zone electrochondria
The various radiation such as son, cosmic ray, space radiation can cause the different degrees of damage and failure of device；Existing EMI filtration modules
Radiating efficiency is low, temperature rise, due to aerospace environment near vacuum, can not carry out heat loss through convection, thus existing filtration module without
Method reliably radiates in the aerospace environment of high vacuum, causes its temperature rise too high, increases the crash rate of component, and reducing complete machine can
By property, so as to have a strong impact on its service life.
In summary, existing EMI filtration modules are due to lacking enough operation stabilities and can not be applied to space industry
Harsh and unforgiving environments.
The content of the invention
In view of this, the application provides a kind of high reliability EMI filtration modules, can meet the harsh ring of aerospace systems
Border, with higher capability of resistance to radiation and space flight extreme environment with higher operation stability.
To solve above technical problem, technical scheme provided by the invention is a kind of high reliability EMI filtration modules, including
Shield shell, there is sealing cavity in the shield shell, be provided with the sealing cavity common mode inductance element of series connection with
The capacity cell being connected in parallel on the common mode inductance element, the capacity cell and the inductance element are arranged on pcb board, institute
State pcb board fitting and be fixed on the inner surface of the shield shell, and be plugged with one group of contact pin extended to outside shield shell.
Preferably, the shield shell is shield shell made of kovar alloy, and the contact pin is made of kovar alloy
Contact pin, the glassy layer of sealed connection is provided between the contact pin and the shield shell.
Preferably, the glassy layer is specially glassy layer made of high-boron-silicon glass, and the glassy layer is infiltrated by high temperature
Fusion closely connects the shield shell and the contact pin.
Preferably, the shield shell includes cavity base, is provided with high temperature, vacuum environment and leads in the cavity base
Cross the cover plate of parallel seam welding connection.
Preferably, the outer surface of the cavity base and the cover plate is covered with tungsten screen layer.
Preferably, the pcb board includes substrate made of aluminium nitride ceramics, and the substrate is fixed by welding in described
The inner surface of shield shell.
Preferably, some common mode inductance element symmetries are distributed on the pcb board, and some capacity cells are uniform
It is distributed in the inductance element both sides.
Preferably, the common mode inductance element, which comprises at least, magnetic core made of iron-base nanometer crystal alloy material, the magnetic
The Curie temperature of core is more than or equal to 570 DEG C.
Preferably, the capacity cell is specially multilayer type ceramic dielectric capacitor.
Preferably, heat conduction casting glue is filled with the sealing cavity in the shield shell.
Compared with prior art, its detailed description is as follows by the application：
The present invention discloses a kind of high reliability EMI filtration modules, including the shield shell with radiation-screening function, shields
Pcb board is provided with the sealing cavity that housing is formed, electronic component is equipped with pcb board, wherein, shield shell can be effective
Ground radiation-screening, and then the work that filtration module can be reliable and stable under aerospace radiation environment can be ensured；
On the inner surface of pcb board gluing, sealing cavity side, pcb board caused heat during can electronic component be worked
Passed by pcb board and shield shell, improve heat dissipation environment of the filtration module under the high vacuum condition of aerospace environment, shape
Into heat dissipation channel, radiating efficiency is improved, avoids temperature rise is too high from causing filtration module failure, and then ensure the steady of filtration module work
It is qualitative.
Brief description of the drawings
Fig. 1 is the filter circuit of a preferred embodiment of the present invention；
Fig. 2 is the structural representation of the present invention.
Embodiment
In order that those skilled in the art more fully understands technical scheme, it is below in conjunction with the accompanying drawings and specific real
Applying example, the present invention is described in further detail.
As shown in figure 1, a kind of preferred filter circuit of high reliability EMI filtration modules, including common mode inductance element L1 (1)
With common mode inductance element L2 (2), the common mode inductance L1 (1) includes inductance L1A, inductance L1B, the inductance L1A and inductance L1B
A magnetic core I (3) is shared, the common mode inductance L2 (2) includes inductance L2A, inductance L2B, and the inductance L2A and inductance L2B is total to
With a magnetic core II (4), electricity has been sequentially connected in series from the input anode of filter circuit to the output head anode direction of filter circuit
Feel L1A, inductance L2A, inductance has been sequentially connected in series from the input cathode of filter circuit to the negative pole of output end direction of filter circuit
L1B, inductance L2B.
Some capacity cells (5), capacity cell (5) bag are parallel between the positive pole and negative pole of the filter circuit
Include：
Capacity cell C1, be connected in parallel on the filter circuit input anode and the filter circuit input cathode it
Between, the one end of capacity cell C1 both ends respectively with inductance L1A and inductance L1B is connected；
The capacity cell C4 and capacity cell C5 being connected in series, are connected with inductance L1A and inductance the L1B other end, and with
Capacity cell C2 is in parallel；Wherein, capacity cell C4 and capacity cell C5 indirectly；
Capacity cell C2, both ends are connected in parallel on inductance L2A and inductance L2B one end；
Capacity cell C3, both ends are connected in parallel on inductance L2A and inductance the L2B other end, and are connected in parallel on the filter circuit
Between output head anode and the filter circuit negative pole of output end.
As shown in Fig. 2 a kind of high reliability EMI filtration modules, including shield shell (6), the shield shell (6) include
Cavity base (7) and cover plate (8), the cover plate (8) are connected to the cavity bottom under high temperature, vacuum environment by parallel seam welding
On seat (7), formed with sealing cavity between the cover plate (8) and the cavity base (7).The cover plate (8), cavity base
(7) it is made up of kovar alloy, and close connection is melted by parallel seam welding.
Cavity base (7) disclosed in the present application and cover plate (8) under high temperature, vacuum environment by using parallel seam welding technique
Sealing cap is carried out, makes to be welded to connect by thawing of generating heat between the contact surface of the upper surface of cover plate (8) and cavity base (7), has
Higher welding quality, vacuum environment advantageously ensure that the internal air-tightness and vacuum of shield shell (6).
The cover plate (8), the outer surface of cavity base (7) are covered with tungsten screen layer (9), cover plate made of kovar alloy
(8), cavity base (7) has higher surface density, aluminium alloy cover plate of the radiation shielding capability equivalent to three times thickness, cavity bottom
Seat (7), not only increases capability of resistance to radiation, and substantially reduces cover plate (8), the thickness of cavity base (7), further improves
The radiating effect of shield shell (6), the tungsten screen layer (9) of its surface covering, the capability of resistance to radiation of shield shell can be strengthened.
Pcb board (10) is provided with the sealing cavity, the pcb board (10) is welded on the cavity base by soldering
(7) inner surface of bottom side, common mode inductance element L1 (1), common mode inductance element L2 (2) and the parallel connection of the series connection shown in Fig. 1
Capacity cell (5) welded and installed on pcb board (10), and the common mode inductance element L1 (1) and common mode inductance element L2 (2)
It is symmetrical, a pair are plugged with the pcb board (10) and extends to the contact pin (11) of shield shell (6) outside.Wherein：
The pcb board (10), which comprises at least, substrate made of aluminium nitride ceramics, and the substrate is welded and fixed by soldering
Inner surface in the cavity base (7).The thermal conductivity factor of aluminum nitride ceramic substrate is approximately equal to 320w/mk, the ring with routine
Oxygen glass cloth laminated board is compared, and has higher thermal conductivity factor, and substrate is directly welded at cavity base (7) by soldering tin material
On, heat caused by the common mode inductance element on pcb board (10) can be transferred to chamber by the substrate with compared with high heat conduction ability
On body base (7), and a path of low thermal resistance is formed by the metal heat-conducting performance of cavity base (7), effectively distributed heat
Go out.
Ceramic substrate has relatively low thermal coefficient of expansion while resistivity is high, dielectric constant is low, dielectric loss is low and resistance to
The characteristics such as high temperature, there is higher stability, make the filtration module of the application suitable for the rigors under aerospace environment.
The common mode inductance element L1 (1) or common mode inductance element L2 (2), which are comprised at least, iron-base nanometer crystal alloy material
Manufactured magnetic core, magnetic core made of iron-base nanometer crystal alloy material has up to 100000 initial permeability, therefore inserts damage
Consumption is high, compared to the inductance element turned under comparable size with respect to other magnetic cores, has up to 1.2T saturation induction strong
Degree, higher high magnetic permeability, more low-loss and good temperature stability, therefore can meet that aerospace filtration module is small-sized
Change, light-weighted feature, take less pcb board (10) installing space, can further reduce pcb board (10) size.
The Curie temperature of the magnetic core is more than or equal to 570 DEG C, suitable for complete -55 DEG C -+125 DEG C of warm area under aerospace environment
Use range.
In order to further improve circuit level and heat conduction and heat radiation performance, common mode inductance element L1 (1) and common mode inductance member
Part L2 (2) is symmetrically distributed on PCB, is made being distributed from the bottom surface of cavity base (7) for even heat, is avoided heat from concentrating
In certain side of pcb board (10), cause area of dissipation is small, in per area per time temperature rise it is too high can not effectively radiate ask
Topic.
The capacity cell (5) is specially multilayer type ceramic dielectric capacitor, have small volume, capacity is big, high frequency characteristics is good,
The characteristics of low ESR and low equivalent series inductance, the operating temperature range of the capacitance module is -55 DEG C to+125
DEG C, go for temperature environment harsh under aerospace environment.
The monosymmetric of the pcb board (10) is provided with contact pin (11), symmetrical dual inline type contact pin (11) installation
Mode can make EMI filtration modules have good common mode and differential mode rejection characteristic in wide frequency ranges (10kHz-30MHz).
The contact pin (11) is made up of kovar alloy, and contact pin (11) is through shield shell (6) and extend out to shield shell (6)
Outside, glassy layer (12) is provided between contact pin (11) and shield shell (6), the glassy layer (12) is specially high-boron-silicon glass
Manufactured glassy layer (12), the glassy layer (12) closely connect the shield shell (6) and described by high temperature infiltration fusion
Contact pin (11), it can be infiltrated and melted by high temperature because kovar alloy surface has oxide layer, between oxide layer and glassy layer (12)
Close to realize Leakless sealing, there is the advantages of air-tightness is good, sealing strength is high, reliability is high.
It is able to can be incited somebody to action with embedding heat conduction casting glue (13), heat conduction casting glue (13) in cavity inside shield shell (6)
In the heat transfer of common mode inductance element and capacity cell (5) to other metallic walls of shield shell (6), due to heat conduction casting glue
(13) there is at least 0.6W/mK thermal conductivity factor, much larger than the thermal conductivity factor 0.03W/mK of air, therefore can be further
The heat dispersion of the filtration module of the application is improved, improves the use reliability of the filtration module of the application.
It the above is only the preferred embodiment of the present invention, it is noted that above-mentioned preferred embodiment is not construed as pair
The limitation of the present invention, protection scope of the present invention should be defined by claim limited range.For the art
For those of ordinary skill, without departing from the spirit and scope of the present invention, some improvements and modifications can also be made, these change
Enter and retouch and also should be regarded as protection scope of the present invention.
Claims (10)
1. a kind of high reliability EMI filtration modules, it is characterised in that including shield shell, there is sealing in the shield shell
Cavity, the common mode inductance element and the electric capacity being connected in parallel on common mode inductance element member of series connection are provided with the sealing cavity
Part, the capacity cell and the inductance element are arranged on pcb board, and the pcb board fitting is fixed on the shield shell
Inner surface, and it is plugged with one group of contact pin extended to outside shield shell.
2. a kind of high reliability EMI filtration modules according to claim 1, it is characterised in that the shield shell is can
Shield shell made of alloy is cut down, the contact pin is contact pin made of kovar alloy, between the contact pin and the shield shell
It is provided with the glassy layer of sealed connection.
3. a kind of high reliability EMI filtration modules according to claim 2, it is characterised in that the glassy layer is specially
Glassy layer made of high-boron-silicon glass, the glassy layer by high temperature infiltration fusion closely connect the shield shell and it is described insert
Pin.
A kind of 4. high reliability EMI filtration modules according to claim any one of 1-3, it is characterised in that the shielding
Housing includes cavity base, and the cover plate connected under high temperature, vacuum environment by parallel seam welding is provided with the cavity base.
5. a kind of high reliability EMI filtration modules according to claim 4, it is characterised in that the cavity base and institute
The outer surface of cover plate is stated covered with tungsten screen layer.
6. a kind of high reliability EMI filtration modules according to claim 1, it is characterised in that the pcb board comprises at least
There is substrate made of aluminium nitride ceramics, the substrate is fixed by welding in the inner surface of the shield shell.
A kind of 7. high reliability EMI filtration modules according to claim 1, it is characterised in that some common mode inductances
Element symmetry is distributed on the pcb board, and some capacity cells are evenly distributed on the inductance element both sides.
A kind of 8. high reliability EMI filtration modules according to claim 7, it is characterised in that the common mode inductance element
Including at least there is magnetic core made of iron-base nanometer crystal alloy material, the Curie temperature of the magnetic core is more than or equal to 570 DEG C.
9. a kind of high reliability EMI filtration modules according to claim 1, it is characterised in that the capacity cell is specific
For multilayer type ceramic dielectric capacitor.
10. a kind of high reliability EMI filtration modules according to claim 1, it is characterised in that in the shield shell
Heat conduction casting glue is filled with sealing cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710944648.8A CN107708398A (en) | 2017-10-12 | 2017-10-12 | A kind of high reliability EMI filtration modules |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710944648.8A CN107708398A (en) | 2017-10-12 | 2017-10-12 | A kind of high reliability EMI filtration modules |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107708398A true CN107708398A (en) | 2018-02-16 |
Family
ID=61183620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710944648.8A Pending CN107708398A (en) | 2017-10-12 | 2017-10-12 | A kind of high reliability EMI filtration modules |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107708398A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110729945A (en) * | 2018-06-28 | 2020-01-24 | 长城汽车股份有限公司 | Direct current input module and motor controller |
| CN112119680A (en) * | 2018-05-16 | 2020-12-22 | 3M创新有限公司 | Shielding band for electromagnetic wave |
| CN112967938A (en) * | 2020-12-29 | 2021-06-15 | 中国电子科技集团公司第四十七研究所 | Aerospace-level integrated circuit total dose shielding method and anti-radiation reinforcement effect verification method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202269122U (en) * | 2011-10-28 | 2012-06-06 | 天水七四九电子有限公司 | Anti-interference double-cavity parallel soldering and sealing metal shell mixed assembly structure |
| CN103618516A (en) * | 2013-11-14 | 2014-03-05 | 深圳振华富电子有限公司 | Emi filter |
| CN204290902U (en) * | 2014-11-20 | 2015-04-22 | 重庆大及电子科技有限公司 | Integral filter |
| CN105006336A (en) * | 2015-07-13 | 2015-10-28 | 深圳市创利电子有限公司 | Common-mode choking coil, filtering circuit and anti-electromagnetic interference power source filter |
| CN105162431A (en) * | 2015-09-06 | 2015-12-16 | 北京长峰微电科技有限公司 | Broadband surface-mounted EMI filter for suppressing electromagnetic interference |
| CN105592675A (en) * | 2014-10-22 | 2016-05-18 | 深圳振华富电子有限公司 | Electromagnetic interference filter |
-
2017
- 2017-10-12 CN CN201710944648.8A patent/CN107708398A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202269122U (en) * | 2011-10-28 | 2012-06-06 | 天水七四九电子有限公司 | Anti-interference double-cavity parallel soldering and sealing metal shell mixed assembly structure |
| CN103618516A (en) * | 2013-11-14 | 2014-03-05 | 深圳振华富电子有限公司 | Emi filter |
| CN105592675A (en) * | 2014-10-22 | 2016-05-18 | 深圳振华富电子有限公司 | Electromagnetic interference filter |
| CN204290902U (en) * | 2014-11-20 | 2015-04-22 | 重庆大及电子科技有限公司 | Integral filter |
| CN105006336A (en) * | 2015-07-13 | 2015-10-28 | 深圳市创利电子有限公司 | Common-mode choking coil, filtering circuit and anti-electromagnetic interference power source filter |
| CN105162431A (en) * | 2015-09-06 | 2015-12-16 | 北京长峰微电科技有限公司 | Broadband surface-mounted EMI filter for suppressing electromagnetic interference |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112119680A (en) * | 2018-05-16 | 2020-12-22 | 3M创新有限公司 | Shielding band for electromagnetic wave |
| CN110729945A (en) * | 2018-06-28 | 2020-01-24 | 长城汽车股份有限公司 | Direct current input module and motor controller |
| CN112967938A (en) * | 2020-12-29 | 2021-06-15 | 中国电子科技集团公司第四十七研究所 | Aerospace-level integrated circuit total dose shielding method and anti-radiation reinforcement effect verification method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107708398A (en) | A kind of high reliability EMI filtration modules | |
| ES2314135T3 (en) | COOLING AND INTEGRATED POWER ARCHITECTURE. | |
| CN210668609U (en) | Independent heat abstractor to battery electrode | |
| US20200161259A1 (en) | High-frequency module | |
| CN104242048B (en) | Packaging structure of conduction-cooled stack semiconductor laser | |
| GB2471186A (en) | Avionics chassis | |
| WO1999025165A2 (en) | Modular and multifunctional structure | |
| JPH0752899A (en) | Cooler of satellite | |
| US8903047B1 (en) | High voltage circuit with arc protection | |
| CN202454549U (en) | Heat dissipation structure of ceramic packaging power component based on aluminum base silicon carbide | |
| WO2013065316A1 (en) | Power converter | |
| JP2012160543A (en) | Power storage device | |
| CN206947320U (en) | A kind of electronic device package shell | |
| CN206294066U (en) | A kind of filtering system for suppressing power module common-mode noise | |
| CN103010487B (en) | Heat control device and heat control method of pico-satellite in isothermal design | |
| JP2004363568A (en) | Module with built-in circuit element | |
| US20190035961A1 (en) | High-conductivity and high-voltage solar photovoltaic glass panel | |
| CN108521001B (en) | L-band micro-discharge inhibition star high-power circulator | |
| CN216413231U (en) | Heat radiation structure of phased array antenna, phased array antenna and satellite platform | |
| CN107635387B (en) | Electromagnetic interference prevention power regulating circuit integrated module and assembling method | |
| CN111064344A (en) | Power module with bottom metal heat dissipation substrate | |
| CN214477818U (en) | Dielectric ceramic assembly and dielectric ceramic communication electronic component | |
| CN207052593U (en) | A kind of hermetically sealed encapsulating structure of super high power component | |
| WO2018085680A1 (en) | A compact system for coupling rf power directly into rf linacs | |
| CN110429945B (en) | Power amplifier antenna adjuster and airborne terminal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180216 |
|
| RJ01 | Rejection of invention patent application after publication |