CN105579409B - The method of cutting and chamfering strengthened glass - Google Patents
The method of cutting and chamfering strengthened glass Download PDFInfo
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- CN105579409B CN105579409B CN201480050338.6A CN201480050338A CN105579409B CN 105579409 B CN105579409 B CN 105579409B CN 201480050338 A CN201480050338 A CN 201480050338A CN 105579409 B CN105579409 B CN 105579409B
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- cutting
- cutting planes
- strengthened glass
- chamfering
- heat source
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/04—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass
- B24C1/045—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass for cutting
Abstract
The present invention relates to a kind of for cutting and the method for chamfering strengthened glass, more specifically, is related to by by water (H2O) with 100 to 800bar injection pressure injection together with the cutting particle of 120 to 600 mesh, and 1500mm/min or lower cutting speed are kept, the method for coming fly-cutting and chamfering strengthened glass.
Description
Technical field
The present invention relates to the methods of cutting and chamfering strengthened glass, more particularly, to cutting for touch screen panel
Strengthened glass has high-intensitive method, and the reinforcing cut by above-mentioned strengthened glass cutting method without damaging it again simultaneously
The chamfering method of the cutting planes of glass.
Background technique
Glassware technology in extensive range and industrial such as video and optical device for example monitor, camera, VTR,
It is treated in mobile phone etc., transporting equipment such as automobile, various vessel, building facility etc. as unitary member.Therefore, at present
There is glass and the use of various properties according to the manufacture of the characteristic of each industrial circle.
Among those, touch screen has most consumingly attracted the attention of the public as the critical component of video equipment.Touching
Touch the combination that screen is the display and input unit provided in the monitor of terminal, wherein when user by with its finger or
Auxiliary input tool such as stylus or stylus simply contact, writing words or picture etc. are come when inputting various data, touch screen
The coordinate value of contact point is identified to execute the control for the electronic device for being equipped with the touch screen.Such touch screen is to pass through list
To or two-way communication transmission or exchange information various digital devices critical component, the digital device for example mobile communication fill
It sets such as smart phone, computer, camera, certificate issuance machine, industrial equipment, and the degree of its importance is gradually
Increase and its use scope expands rapidly in every field.
Among the component for including in touch screen, the upper transparent protective film directly contacted with the finger of user mainly by
Plastics organic material such as polyester, acrylic resin etc. is made.Because such plastics organic material have low heat resistant and
Mechanical strength, the touch screen made of these materials due to it is continuous and it is duplicate use and contact can deform, scratch, rupture
Deng, thus, to the limited durability system of the touch screen.Therefore, for the existing transparent of the upper transparent protective film of touch screen
Plastics are just gradually replaced by the thin strengthened glass with excellent heat resistance, mechanical strength and hardness.In addition, because described thin
Strengthened glass also plays the part of the role of the transparency protected window of LCD or OLED monitor other than touch screen, application field just by
Flaring is big.
When cutting the strengthened glass, the big compression stress as present in its surface, it may occur however that uncontrolled
The damage of broken form, rather than be cut into scheduled shape, or even if the strengthened glass is cut into scheduled shape, but with
The compression stress deterioration in the corresponding wide region of the left and right range of about 20mm, thus may be decreased intensity around cutting line.Therefore,
Once the strengthened glass tempering, regardless of the composition of glass, it is difficult to be cut into desired size or shape.
In this respect, compared with conventional glass cutting method, needed in the method for cutting strengthened glass it is more accurate and
Stringent condition.The method introduced as this strengthened glass cutting method is as follows.
Firstly, there is mechanical cutting method comprising: the table by the way that diamond or carbide engraving wheel to be streaked to strengthened glass
Face, on a glass mechanical engraving check line;The glass plate is bent with the check line along engraving to form its cut edge
It is cut.In general, about 100 to 150 μm of depth of transverse direction can be formed in above-mentioned mechanical cutting method, in the glass plate
Crackle, wherein the crackle is generated by the cutting line of engraving wheel.Because the transversal crack reduces the intensity of the window substrate,
The cut portion of the window substrate should be removed by polishing.
However, above-mentioned mechanical cutting method has the shortcomings that need to replace expensive cutting wheel at any time, this leads to cost
Increase, and it is not easily accomplished accurate cutting.
Secondly, there is the non-contact cutting method using laser beam comprising: by the glass surface along projected route
Mobile laser beam expands the surface of strengthened glass by the check line carved on the edge of window substrate;It is described sharp by following closely
The cooler extension glass surface after light beam;With heat propagation along the laser beam advance route generate crackle with
Cut the window substrate.
However, having the shortcomings that need expensive laser equipment using the cutting method of laser beam.
Because the cutting planes of strengthened glass have sharp and out-of-flatness the cutting planes to external impact fragility, it should
Chamfering process is carried out on it.
The chamfering process is usually by rotation polishing wheel to grind come cutting described in grinding and cutting plane that is, chamfering
Partially carry out.When carrying out the chamfering process, the smoothness of the cut portion is improved, to increase to a certain extent
Intensity is added.However, passing through the conventional chamfering process, it is difficult to be provided with the window substrate of excellent in strength.
Meanwhile Korea patent registration No.0895830 discloses the side using plain cup wheel cutting flat panel display glass substrate
The method of edge.However, the method using plain cup wheel is mechanical chamfering method, and need to be repeated the planar of needs
The process of state, this leads to process time extension and increased costs.
In addition, have been incorporated into the chamfering method using laser beam recently, however, because the laser chamfering method use with
Fine size scabbles the plane being chamfered, and the plane being chamfered is also out-of-flatness, and is needed laser beam focus
In the process of the cutting planes.
Summary of the invention
Therefore, the purpose of the present invention is to provide strengthened glass cutting method, the strengthened glass can be cut rapidly and
There is no defect.
It is a further object to provide strengthened glass cutting methods, can accurately cut the strengthened glass.
Furthermore it is also an object that providing strengthened glass chamfering method, the cutting can be effectively removed
Hair check part on the cutting planes of strengthened glass, it is high-intensitive to reach.
Further, it is another object of the present invention to provide strengthened glass chamfering method, can effectively reinforce the cutting
The cutting planes of strengthened glass, it is high-intensitive to reach.
Above-mentioned purpose of the invention will be realized by following features:
(1) method for cutting strengthened glass, the method includes: by water (H2O it) being cut with 120 to 600 mesh sizes
Particle is cut together with 100 to 800bar injection pressure injection, to cut institute with 1500mm/min or lower cutting speed
State strengthened glass.
(2) according to the method for above-mentioned (1), wherein the cutting particle is in aluminium oxide, garnet and tungsten carbide
It is at least one.
(3) according to the method for above-mentioned (1), wherein before the cutting action, at least one of the strengthened glass
Protection resin film is formed on surface.
(4) according to the method for above-mentioned (1), wherein the strengthened glass has 600 to 700kgf/mm2Vickers hardness
(Vickers hardness)。
(5) chamfering method of strengthened glass, the method include: will have the heat source of 700 to 1700 DEG C of temperature and pass through
According to the cutting planes contact of the strengthened glass of the method for above-mentioned (1) cutting;With the movement speed movement with 5 to 300mm/sec
The heat source is with cutting planes described in chamfering.
(6) according to the method for above-mentioned (5), wherein the strengthened glass has 600 to 700kgf/mm2Vickers hardness.
(7) according to the method for above-mentioned (5), wherein the upper edge portion of the cutting planes and lower edge part pass through described in contact
Heat source and by oblique chamfering.
(8) according to the method for above-mentioned (7), wherein the chamfering is by making the rising wood of the heat source Yu the cutting planes
Divide and lower edge tap is touched and carried out.
(9) according to the method for above-mentioned (7), wherein the chamfering is by making the rising wood of the heat source Yu the cutting planes
Divide and lower edge tap is touched, then the heat source made to contact and carry out on direction in parallel with the cutting planes.
It (10) also include to be cut by rotation polishing wheel with described after contacting the heat source according to the method for above-mentioned (5)
Cutting plane contacts and grinds the cutting planes.
It (11) also include after contacting the heat source, the application of Xiang Suoshu cutting planes includes according to the method for above-mentioned (5)
The etching agent composite of hydrofluoric acid (HF).
The present invention in cutting strengthened glass using the spraying that carries out under given conditions, it is possible thereby to rapidly without
The strengthened glass is cut to defect, and in a manner of more accurate than conventional method and lower cost cuts the reinforcing glass
Glass.
In addition, according to the present invention, the chamfering is by the heat source and the cutting planes of the cutting strengthened glass in spy
It contacts and carries out under fixed condition, it is possible thereby to effectively remove the hair check part formed on the cutting planes, reach simultaneously
It is high-intensitive.
In addition, according to the present invention, the cutting planes by apply hydrofluoric acid (HF) or by polishing wheel grind it into
Row is reinforced, the intensity that thus strengthened glass more improves in the case where can have than no reinforcement process.
Detailed description of the invention
Above and other target of the invention, feature and other advantages will be more clear from following detailed description of the accompanying drawings
Understand to Chu, in the attached drawing:
Fig. 1 is the schematic diagram of the cutting planes of chamfering according to the present invention, wherein (a) is viewgraph of cross-section and (b) is to face
Figure;
Fig. 2 is the schematic diagram for describing chamfering method according to an embodiment of the present invention;With
Fig. 3 is the schematic diagram that another embodiment according to the present invention describes chamfering method.
Specific embodiment
Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the attached drawings.
The present invention provides the methods of cutting strengthened glass, which comprises by water (H2O) and with 120 to 600 mesh
The cutting particle of size is together with 100 to 800bar injection pressure injection, thus with 1500mm/min or lower cutting speed
Degree cuts the strengthened glass.
Spraying be widely used for cutting Conventional glass rather than the method for strengthened glass, and be considered as it is economical and
The accurately method of glass-cutting.
However, the spraying is applied to the strengthened glass for being difficult to cut, there are no precedents.Under the circumstances, originally
Inventor has found the specified conditions that can cut the spraying of strengthened glass, and completes method of the invention, the method
Energy is economical and accurately cuts strengthened glass.
The strengthened glass that cutting method of the invention can be applicable in is not particularly limited, but may include in a kind of preferred reality
Apply in mode have 10 μm to 200 μm, in another embodiment 40 μm to 200 μm and in yet another embodiment 120 μm extremely
The strengthened glass of 200 μm of Depth of hardening layer.
In another embodiment of the present invention, the strengthened glass that can be applicable in cutting method of the invention can have 600
To 700kgf/mm2, preferably 650 to 690kgf/mm2Vickers hardness.
In another embodiment of the present invention, can be applicable in cutting method of the invention strengthened glass can have 60 to
90GPa, preferably 65 to 85GPa Young's modulus.
According to the cutting method of the strengthened glass, by the water (H2O) with 100 to 800bar, preferably 200 to
The injection pressure injection of 700bar, and the strengthened glass is with 1500mm/min or lower, preferably 400 to 1000mm/min
Cutting speed cut.
If the injection pressure of water is less than 100bar or more than 800bar, the strengthened glass is not cut or may be broken
It splits.In addition, in the present invention, the cutting speed refers to injection water reinforcing described in the cutting wire cutting along strengthened glass
Movement speed when glass.
If cutting speed of the invention is more than 1500mm/min, the strengthened glass is not cut or may be ruptured, and
And the safety of cutting reduces, for example, the size of the part of strengthened glass rupture and excision increases.When cutting speed is low
When, productivity is only influenced, therefore, the lower limit of the cutting speed is not particularly limited.For example, it is contemplated that arriving productivity and cutting
Safety, the more preferable cutting speed is 400 to 1000mm/min.
In addition, the cutting method of strengthened glass according to the present invention, by the cutting particle and water (H2O it) sprays together.
The cutting particle plays the role of cutting the strengthened glass together with water.Particle is cut used in the present invention
It may include the cutting particle having a size of 120 to 600 mesh.If the size of the cutting particle has increase and cuts less than 120 mesh
The problem of damaging portion size and strengthened glass rupture.When its size is more than 600 mesh, the cone of the cutting planes can be can increase
Angle, and may be accumulated from the error of the generations such as subsequent chamfering process, reinforcement process, defect is caused in final product.
Any conventional material used in the related art can be used in the cutting particle, does not limit particularly it
System, for example, may include aluminium oxide, garnet, tungsten carbide etc..These can make individually or with its two or more combination
With.
The method that the cutting particle is sprayed together with water may include that for example, and water and the cutting particle store respectively
In separated space, it is described cutting particle outlet be arranged in water spray route in method, wherein when with high jet pressure
When power sprays water, the cutting particle due in the cutting particle outlet negative pressure that generates by outlet discharge with
Water sprays together;Water and the cutting particle are pre-mixed and the mixture are ejected into the method etc. in strengthened glass.Just
Inhibit the cutting KPT Scatter, increases ablation energy density, reduces the cone angle cut damage part and reduce the cutting planes
For, more preferably using the later approach having the above advantages.
It as needed, can be at least one surface of the strengthened glass before carrying out cutting action of the invention
Resin film is protected in upper formation.By forming the protection resin film, the fragment due to generating during cutting action can be prevented
Deng the damage to glass surface.
In this aspect of the invention, the strengthened glass in the present invention for cutting can have is pre-formed in one surface
The electrode laminate for touch panel.For productivity doubles, preferably before being cut into unit window cover substrate, in mother
It is cut on hardened glass substrate and is pre-formed multiple electrode laminates for touch panel at the position for making unit window cover substrate, so
After carry out cutting action, rather than the electrode laminate for touch panel is individually formed on the unit window cover substrate.Cause
This, if the electrode laminate for being used for touch panel is pre-formed on hardened glass substrate to be cut, preferably in institute
It states and forms protection resin film in strengthened glass, to prevent the damage before the cutting action to the electrode.
Any usual resin films for being used for guard electrode in the related art can be used in the protection resin film, do not have to it
There is special limitation.For example, additive can be applied to a surface of polymer film, then bonded with the strengthened glass,
Or hardening resin composition can be applied to a surface of the strengthened glass, then solidify.
When bonding the protection resin film and the strengthened glass, it can remove and be located at before the cutting action
Protection resin film at part (cutting line) to be cut, or the cutting action can be carried out without removing it.
As needed, the process for forming the protection resin film and removing it can carry out after the cutting action.Example
Such as, the process for forming the protection resin film and removing it can carry out after hot chamfering process.
As described above, there is significantly reduced intensity because having carried out the strengthened glass of the cutting action, and having
There are hair checks on the cutting planes of sizing cut edge, so needing chamfering process.
Therefore, the present invention provides the chamfering method of strengthened glass, the method can cutting method of the invention it
After continue.
The strengthened glass that chamfering method of the invention can be applicable in is not particularly limited, but may include a kind of preferred
There are 10 μm to 200 μm, in another embodiment 40 μm to 200 μm and 120 μm in yet another embodiment in embodiment
To the strengthened glass of 200 μm of Depth of hardening layer.
In another embodiment of the present invention, the strengthened glass that can be applicable in chamfering method of the invention can have 600
To 700kgf/mm2, preferably 650 to 690kgf/mm2Vickers hardness.
In another embodiment of the present invention, can be applicable in chamfering method of the invention strengthened glass can have 60 to
90GPa, preferably 65 to 85GPa Young's modulus.
Chamfering method of the invention can be by will have cutting for the heat source of 700 to 1700 DEG C of temperature and the strengthened glass
Cutting plane is contacted and is carried out.
According to the specified conditions of cutting action, the strengthened glass can be in the state of cutting planes or the property of strengthened glass
There is significant difference in matter.Under the circumstances, the inventors discovered that by making heat source and cutting planes in specified conditions
The chamfering method of lower contact, to restore the reinforcing reduced by the cutting action after above-mentioned cutting method of the invention
The intensity of glass removes cutting planes described in hair check and effective chamfering, and completes the present invention.
If the heat source with temperature range according to the present invention contacts the cutting planes, because the glass has
The characteristic of low heat transfer coefficient generates thermal stress around the cutting planes, and thus cuts away from the portion contacted with the heat source
Divide the part up to predetermined depth.Chamfering method according to the present invention, can will be by the significantly reduced elongation of the cutting planes
It is significantly increased 0.4% or more.In addition, chamfering method according to the present invention, falls with the machinery as described in prior art patent
Angle method is compared using the non-contact method of laser beam, available more smooth chamfering surface and when the chamfering substantially reduced
Between.
In chamfering method of the invention, if the temperature of heat source is lower than 700 DEG C, the cutting planes may not be fallen
Angle, and when its temperature is more than 1700 DEG C, strengthened glass can become to melt.
In addition, the heat source of the contact cutting planes can be along the part to chamfering in chamfering method of the invention
It is mobile with 5 to 300mm/sec movement speed.If the movement speed of the heat source is less than 5mm/sec, can occur for example to damage
The problem of evil protective layer, chamfer amount increase or strengthened glass melts, and when its movement speed is more than 300mm/sec, it is described
The plane at angle may be coarse, and the shape of the chamfering can be with out-of-flatness.
In chamfering method of the invention, it can be used as the material that heat source uses and be not particularly limited, as long as it can be
Heat transfer is without deforming the strengthened glass in above-mentioned temperature range.It is, for example, possible to use ceramic materials etc., but are not limited to
This.
In addition, chamfering method of the invention can also include the pressure or the strengthened glass or heat for controlling the heat source
The position in source is to realize the additional means of stable chamfer quality.
Chamfering method of the invention is the upper edge portion of cutting planes described in oblique chamfering and the method for lower edge part.Fig. 1
It is the schematic diagram of the cutting planes of chamfering according to the present invention, wherein (a) is viewgraph of cross-section, and is (b) front view.
In the upper edge portion of the cutting planes described in oblique chamfering as illustrated in fig. 1 and the method for lower edge part, connect
The specific order or quantity of touching heat source or its oblique angle are not particularly limited, as long as the final shape of the upper and lower edge point
It is oblique formation.
More specifically, for example, in one embodiment of the invention, can be put down by the heat source and the cutting
The upper and lower edge tap in face is touched to carry out the chamfering of the cutting planes.It, can be by making as schematic illustration in Fig. 2
1. 2. the heat source contacts to form inclined-plane with the upper edge portion of the cutting planes with lower edge part.
It in another embodiment of the present invention, can be by making the upper and lower edge of the heat source Yu the cutting planes
Then tap touching contacts the heat source on direction in parallel to carry out the chamfering with the cutting planes.When to
When the ratio of the strengthened glass removed by the chamfering method is big, present embodiment can be expeditiously utilized.Fig. 2 is schematically
Describe chamfering method according to the present embodiment.With reference to Fig. 2, the heat source described first contacts the upper edge portion of the cutting planes
The inclined-plane of predetermined portions 1. is arrived with oblique formed.Then, the heat source contacts the lower edge part of the cutting planes with oblique shape
At arrive the inclined-plane of predetermined portions 2..Then, it is flat to contact the cutting on the direction parallel with the cutting planes for the heat source
Face, to remove the strengthened glass to the part needed 3., it is hereby achieved that final cross section shape as illustrated in Figure 3.
In addition, in the present embodiment, the sequence of the chamfering can change, that is to say, that can by with institute in Fig. 2
The order in a different order of diagram carries out the chamfering.For example, the chamfering can by sequence 2., 1. and 3. or 3., 2. and
1. sequence carry out, but not limited to this.
If, can be with cutting planes described in further progress by cutting planes described in heat source chamfering described in completing
The reinforcement process on surface.
The reinforcement process may include that the cutting planes are ground by polishing wheel, or by the inclusion of hydrofluoric acid (HF)
Etching agent composite etches the cutting planes.
Firstly, the method by polishing wheel grinding and cutting plane is performed in the following way: completing by described
After heat source forms the inclined-plane, rotation polishing wheel contacts the cutting planes more entirely to grind the cutting planes.As a result,
Grinding is in hair check etc. present on the surface of the cutting planes to reinforce the cutting planes.
The wheel made of abrasive particle such as ceria can be used in the polishing wheel.Just give full expression to adding for cross section
It is potent answer for, the preferably described abrasive particle have 5 μm or smaller size.Because the size reduction of abrasive particle causes to grind
Degree with precise polishing increases, so the smaller the better.Therefore, although the lower limit of the size is not particularly limited, in view of adding
Between working hour, about 0.01 μm of size of abrasive particle can be used.
Next, performed in the following way using the method for cutting planes described in the etchant etching comprising hydrofluoric acid:
The etchant comprising hydrofluoric acid is applied to the cutting planes to etch the surface portion of the cutting planes.If logical
It crosses the etching agent composite comprising hydrofluoric acid and etches the cutting planes, then by being etched in the surfaces of the cutting planes
Upper formation embossing pattern is to strengthen the cutting planes.
The etchant comprising hydrofluoric acid is hydrofluoric acid solution, and can also include, for example, needing in addition to hydrofluoric acid
Acid constituents, such as hydrochloric acid, nitric acid or sulfuric acid etc., as glass etching component be in related fields it is known.
It is not particularly limited by the time of cutting planes described in the etchant etching comprising hydrofluoric acid, but just increased
Add the intensity of the strengthened glass but for the cutting planes do not have overetch, the etching can be with for example, extremely at 30 seconds
It is carried out in the range of 10 minutes.
The temperature of the etchant comprising hydrofluoric acid is not particularly limited during etching, but the etching is preferably,
For example, being carried out in the range of 20 to 50 DEG C.If the temperature of the etchant comprising hydrofluoric acid is less than 20 DEG C, when processing
Between can increase and undercut can occur.When its temperature is more than 50 DEG C, process time is reduced, but etching carries out not
Uniformly.
The etchant comprising hydrofluoric acid can be by any method known in related fields, such as to the cutting
Plane sprays the etchant, the cutting planes immerse to the etchant is medium to be applied to the cutting planes.
Hereinafter, proposing preferred embodiment the present invention is more specifically described.However, provide following embodiment only for
Illustrate the present invention, and those skilled in the art will be apparent from understanding, various changes within the scope and spirit of this invention and repairs
It is possible for changing.Such change and modification should be included in appended claims.
Embodiment
Embodiment 1 to 10 and comparative example 1 to 11
Strengthened glass (depth of strengthening layer: 20 to 25 μm, Vickers hardness: 649kgf/mm2, Young's modulus:
After forming protection resin film on surface 71.5GPa), cut by spraying water jet under conditions of showing in the following Table 1
The strengthened glass.Then, observe whether the strengthened glass is cut, result is shown in the following Table 1.
[table 1]
Reference table 1, in the embodiment 1 to 10 of injection pressure and cutting speed within the scope of the present invention, the reinforcing glass
Glass can be cut, but in the comparative example 1 to 11 except preferred scope of the invention, the strengthened glass cannot be cut or
It is ruptured during cutting.
Embodiment 11 to 16 and comparative example 12 to 15
Strengthened glass (depth of strengthening layer: 20 to 25 μm, Vickers hardness: 649kgf/mm2, Young's modulus:
After forming protection resin film on surface 71.5GPa), cut by spraying water jet under conditions of showing in the following Table 2
The strengthened glass.Then, by contacting heat source with cutting planes under conditions of showing in the following Table 2, chamfering work is carried out
Sequence, and observe whether the strengthened glass is cut and measure elongation.Observed and measurement result is shown in the following Table 2
Show.Here, elongation is determined by the average value of 50 pieces or more of strengthened glass.
Elongation is the index that can evaluate the intensity of the strengthened glass, and is measured as follows: in the reinforcing
Two sseparated supporting arch are arranged in the opposite side of windowpane substrate lower central, and in the central upper portion by being located at window substrate
Arch up while apply load to the top of the substrate, measurement arch contact the window substrate point and the window substrate breakage
The distance between point (crosshead displacement), so that 1 calculates elongation according to the following formula.
[formula 1]
Elongation (%)=(6T δ)/s2
(wherein, T indicates the thickness (mm) of the window substrate, and δ indicates crosshead displacement (mm), s indicate the supporting arch it
Between distance (mm)).
[table 2]
Reference table 2, in the embodiment 11 to 16 that chamfering method according to the present invention carries out, whole strengthened glass all have
0.4% or higher high elongation rate.
However, inclined-plane is not formed in the strengthened glass in the comparative example 12 to 15 except condition of the invention, and
And its elongation is less than 0.4%.
Embodiment 17 to 21
Strengthened glass (depth of strengthening layer: 20 to 25 μm, Vickers hardness: 649kgf/mm2, Young's modulus:
After forming protection resin film on surface 71.5GPa), cut by spraying water jet under conditions of showing in the following Table 3
The strengthened glass.Then, it by contacting heat source with the cutting planes, is formed oblique
Face, the cutting planes reinforce it by polishing wheel grinding, then measure elongation.The strengthened glass measured is being ground
Elongation afterwards is shown in the following Table 3.Here, elongation is determined by the average value of 50 pieces or more of strengthened glass.
[table 3]
Reference table 3, it can be seen that if using described in the polishing wheel grinding of 5 μm of size or the formation of smaller abrasive particle
Cutting planes, elongation further increases in embodiment 17 to 21.However, compared with other embodiments, of the invention excellent
It selects in the embodiment 20 and 21 except range, elongation increases little.
Embodiment 22 to 33
Strengthened glass (depth of strengthening layer: 20 to 25 μm, Vickers hardness: 649kgf/mm2, Young's modulus:
After forming protection resin film on surface 71.5GPa), cut by spraying water jet under conditions of showing in the following Table 4
The strengthened glass.Then, it by contacting heat source with the cutting planes, is formed oblique
Face, the cutting planes are etched using hydrofluoric acid solution to reinforce it, and elongation is then measured.The strengthened glass measured
Elongation after the etching is shown in the following Table 4.Here, elongation is true by the average value of 50 pieces or more of strengthened glass
It is fixed.
[table 4]
Reference table 4, it can be seen that the cutting is flat when being reinforced by using the etchant etching comprising hydrofluoric acid
When face, elongation is further increased in embodiment 22 to 33.However, compared with other embodiments, in etching period and etching
In the embodiment 28 and 33 except preferred scope of the invention, elongation increases little agent temperature.In order to refer to, can see
Out, when etched between when being 10 minutes or be longer, overetch occurs.
Claims (5)
1. the method for chamfering strengthened glass, the method include: by the heat source with 700 to 1700 DEG C of temperature and with 600
To 700kgf/mm2Vickers hardness strengthened glass cutting planes contact;With the mobile institute of 5 to 300mm/sec movement speed
Heat source is stated with cutting planes described in chamfering;Using the thermal stress generated around the cutting planes in this method, cut described
The part of cutting planes contacted away from the cutting planes with the heat source reaches the part of predetermined depth.
2. according to the method described in claim 1, wherein the upper edge portion of the cutting planes and lower edge part pass through contact institute
State heat source and by oblique chamfering.
3. according to the method described in claim 2, wherein the chamfering is by making the upper limb of the heat source Yu the cutting planes
Then part and the touching of lower edge tap make the heat source contact and carry out on direction in parallel with the cutting planes.
4. according to the method described in claim 1, its also include after contacting the heat source, by make to rotate polishing wheel with it is described
Cutting planes contact and grind the cutting planes.
5. the application of Xiang Suoshu cutting planes includes according to the method described in claim 1, it also includes after contacting the heat source
The etching agent composite of hydrofluoric acid.
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
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KR20130157566 | 2013-12-17 | ||
KR10-2013-0157566 | 2013-12-17 | ||
KR10-2014-0027121 | 2014-03-07 | ||
KR1020140027121A KR101454451B1 (en) | 2013-12-17 | 2014-03-07 | Method of cutting and chamfering strengthened glass |
PCT/KR2014/010528 WO2015093727A1 (en) | 2013-12-17 | 2014-11-04 | Method for cutting and chamfering tempered glass |
Publications (2)
Publication Number | Publication Date |
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CN105579409A CN105579409A (en) | 2016-05-11 |
CN105579409B true CN105579409B (en) | 2019-04-26 |
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CN201480050338.6A Active CN105579409B (en) | 2013-12-17 | 2014-11-04 | The method of cutting and chamfering strengthened glass |
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KR (1) | KR101454451B1 (en) |
CN (1) | CN105579409B (en) |
TW (1) | TWI649280B (en) |
WO (1) | WO2015093727A1 (en) |
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WO2017208995A1 (en) * | 2016-05-31 | 2017-12-07 | 旭硝子株式会社 | Cover glass and display device |
KR20190105114A (en) * | 2017-01-31 | 2019-09-11 | 코닝 인코포레이티드 | Methods for Reducing Glass Sheet Edge Particles |
RU2731559C1 (en) * | 2020-08-09 | 2020-09-04 | Андрей Алексеевич Спиридонов | Method of hydroabrasive cutting of materials |
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US4703591A (en) * | 1985-04-15 | 1987-11-03 | Libbey-Owens-Ford Co. | Ultra-high pressure abrasive jet cutting of glass |
US4702042A (en) * | 1984-09-27 | 1987-10-27 | Libbey-Owens-Ford Co. | Cutting strengthened glass |
JP3719904B2 (en) * | 2000-04-13 | 2005-11-24 | シャープ株式会社 | Method for chamfering glass substrate of liquid crystal display device and heater used in the method |
JP5113462B2 (en) * | 2007-09-12 | 2013-01-09 | 三星ダイヤモンド工業株式会社 | Method for chamfering a brittle material substrate |
KR101145904B1 (en) * | 2008-10-02 | 2012-05-15 | 이유진 | Glass cutting method that use water jet cutting machine |
WO2010130464A1 (en) * | 2009-05-14 | 2010-11-18 | Picodrill Sa | A method of smoothing and/or bevelling an edge of a substrate |
JP5541449B2 (en) * | 2010-03-02 | 2014-07-09 | 日本電気硝子株式会社 | Thin glass or processing method of glass laminate including thin glass |
KR20120079204A (en) * | 2011-01-04 | 2012-07-12 | 공석태 | Glass |
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2014
- 2014-03-07 KR KR1020140027121A patent/KR101454451B1/en active IP Right Grant
- 2014-11-04 WO PCT/KR2014/010528 patent/WO2015093727A1/en active Application Filing
- 2014-11-04 CN CN201480050338.6A patent/CN105579409B/en active Active
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KR101454451B1 (en) | 2014-10-23 |
TWI649280B (en) | 2019-02-01 |
WO2015093727A1 (en) | 2015-06-25 |
TW201529498A (en) | 2015-08-01 |
CN105579409A (en) | 2016-05-11 |
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