CN105575846A - Metal wet etching end point monitoring method and device thereof - Google Patents
Metal wet etching end point monitoring method and device thereof Download PDFInfo
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- CN105575846A CN105575846A CN201610145863.7A CN201610145863A CN105575846A CN 105575846 A CN105575846 A CN 105575846A CN 201610145863 A CN201610145863 A CN 201610145863A CN 105575846 A CN105575846 A CN 105575846A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
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Abstract
The invention provides a metal wet etching device comprising a glass substrate which is used for bearing a metal film to be etched; a first light signal transceiver which is used for vertically transmitting a penetrating light signal to the glass substrate and receiving a reflected light signal; and a second light signal transceiver which is used for receiving a light signal which is transmitted by the first light signal transceiver and penetrates through the glass substrate. The time point at which the second light signal transceiver receives the light signal is a time point at which etching of the metal film of the position irradiated by the light signal is completed. The problems in the prior art that the accurate end time point of etching of the metal film cannot be obtained due to the fact that the thickness of the film decreases in the etching process of the metal film and thus the light reflection angle changes in the process of applying the light signal transceivers to monitor the metal wet etching end point can be solved.
Description
[technical field]
The present invention relates to metal etch technical field, particularly a kind of method for supervising of metal Wet-type etching terminal and device thereof.
[background technology]
At present, prior art, when making liquid crystal panel, has the metal Wet-type etching operation that metal Wet-type etching machine etches metal.Metal Wet-type etching is that the substrate of surperficial metal-plated membrane (metal level) is placed in and fills with in the etching bath of acid solution, is not etched by the region that photoresistance is protected metal film, to obtain the pattern for photoresistance protection.Before the metal film of metal Wet-type etching machine to batch etches, first from the metal film of batch, choose one piece of exemplarily metal film, and obtain the detecting that model metal film carries out etching end point.Current industry is existing has two kinds of modes to carry out the detecting of etching end point, and one is implement sampling observation by staff, carries out judging and obtain the etching end point time of model metal film with visual type in conjunction with experience.One is can first by endpoint detecting machine (EPD, EndPointDetector) sensor obtains the etching end point time of model metal film, the etching end point time is defined as from the metal diaphragm contacts be carried on substrate for etching acid solution, to the sensor of endpoint detecting machine tests metal film printing opacity.The operation principle of endpoint detecting machine is for adopting light reflection/transmission principle, when substrate has metal film, because metal film cannot printing opacity, the light signal that the sensor of endpoint detecting machine is launched can by Metal film reflector, and endpoint detecting machine judges the etching end point not reaching metal film yet accordingly.And when the etching of metal membrane-coating acid solution that substrate carries is complete, then can printing opacity, the light signal of sensor injection can penetrate substrate and can not be reflected, and endpoint detecting machine judges the etching end point having reached metal film accordingly.After obtaining the aforementioned etching end point time, then batches of metal film is etched.But, after obtaining the aforementioned etching end point time, again batches of metal film is etched, but for avoiding the situation of etch-rate inequality, and kish film, therefore generally speaking after the aforementioned etching end point time, one section can be increased again and spend etching (overetching) time, this is actual total etching period, its be defined as actual total etching period=etching end point time+(etching end point time × mistake etching ratio), to avoid the situation of kish film.Such as: if the etching end point time 100sec of the model metal film recorded, and setting ratio be 42%, so, namely 142sec is fixed as to the total etching period of the reality of each block metal film.
The method for supervising of above-mentioned prior art still has shortcoming, the thickness of metal film can change at etching, the optical signal line angle of endpoint detecting machine directive metal film will be caused like this to change, and metal film also can change to the reflection angle of described light signal simultaneously.In the case, endpoint detecting machine just can not receive reflected light signal line, accurately obtains the time of metal film etching end point.
[summary of the invention]
The object of the present invention is to provide a kind of method for supervising and device thereof of metal Wet-type etching terminal, to solve in process that prior art uses optical signal transceiver to monitor metal Wet-type etching terminal, cause the reflection angle of light to change because of the less thick of metal film film in etching process, the problem of the time point of etching end point accurately cannot be obtained.
Technical scheme of the present invention is as follows:
A kind of metal Wet-type etching device, described metal Wet-type etching device comprises:
Glass substrate, for carrying metal film to be etched, described metal film covers described glass substrate;
First optical signal transceiver, also receives for vertically launching penetrability light signal to described glass substrate the light signal reflected; And
Second optical signal transceiver, for receiving the light signal through described glass substrate that described first optical signal transceiver is launched;
Wherein, described light signal can pass described glass substrate, described metal film has reflex to light signal, described first optical signal transceiver and described second optical signal transceiver are fixed on below and the top at the edge, corner of described glass substrate respectively accordingly, and the plane orthogonal of their line and described glass substrate, and passing the edge of described glass substrate, the time point that described second optical signal transceiver receives light signal is the time point that the described metal film being positioned at this light signal irradiation place has etched.
Preferably, described first optical signal transceiver and described second optical signal transceiver form an optical signal transceiver group, the number of described optical signal transceiver group is 4, and described first optical signal transceiver of optical signal transceiver group described in each and described second optical signal transceiver one_to_one corresponding.
Preferably, described metal Wet-type etching device also comprises:
Multiple nozzle, for spraying etching liquid to described metal film, the spray area of the described etching liquid of described nozzles spray covers and is greater than whole described glass substrate;
Multiple roller, for moving back and forth carrying described glass substrate thereon in the lateral direction;
Wherein, described nozzle is located at the top of described glass substrate, and be positioned at the below of described secondary signal transceiver, multiple described nozzle and multiple described roller up and down relative one_to_one corresponding are arranged, the direction at the edge, described corner of the described glass substrate that the direction of motion of described glass substrate is passed with the line of corresponding described second optical signal transceiver for described first optical signal transceiver.
Preferably, above the scope of each described second optical signal transceiver between adjacent two described nozzles.
Preferably, after etching starts, described roller drives described glass substrate to carry out the horizontal movement back and forth of left and right directions, and multiple described nozzle carries out the horizontal movement back and forth of fore-and-aft direction, the direction of motion of described glass substrate and the direction of motion of described nozzle perpendicular.
Preferably, static or when carrying out the horizontal movement back and forth of left and right directions at described glass substrate, the light signal that described first optical signal transceiver is launched is penetrated within the scope of the edge of described glass substrate, and the described etching liquid of described nozzle ejection covers described glass substrate.
A method for supervising for metal Wet-type etching terminal, be applied to above-mentioned metal Wet-type etching device, described method for supervising comprises the following steps:
When described metal film starts to etch, control described first optical signal transceiver and launch penetrability light signal to described glass substrate, and the time point launched of record is using as etching initial point, and keep emission state;
Carry out at described metal film in the process etched, control described second optical signal transceiver and monitor in real time and whether have light signal to penetrate out from described glass substrate;
If there is light signal to penetrate out from described glass substrate, then obtain each time point that all described second optical signal transceiver receive this light signal, using the described time point finally got as the etching end point of described metal film.
Preferably, using the described time point finally got as the etching end point of described metal film, also comprise afterwards:
Calculate described metal film total etching period used according to described etching initial point and described etching end point, described total etching period is the time difference length of described etching end point and described etching initial point.
Preferably, calculate total etching period that described metal film is used, also comprise afterwards:
Judge whether described total etching period is greater than default etching period threshold value;
If then judge the thickness abnormity of described metal Wet-type etching device and described metal film, and stop etching follow-up described metal film;
If not then described total etching period was preserved as the etching end point time of described metal film, and continue to etch follow-up described metal film.
Preferably, while stopping etching described metal film, also comprise:
The thickness of described metal Wet-type etching device and described metal film is detected, is greater than the reason of default etching period threshold value with the etching end point time finding out described metal film.
Beneficial effect of the present invention:
The method for supervising of a kind of metal Wet-type etching terminal of the present invention and device thereof, by fixing an optical signal transceiver the upper and lower at edge, glass substrate corner is each, and make their line and the plane orthogonal of glass substrate, and pass the edge of described glass substrate, the time point receiving light signal with top optical signal transceiver is the time point that the described metal film being positioned at this light signal irradiation place has etched, solve in prior art, in the process using optical signal transceiver to monitor metal Wet-type etching terminal, the reflection angle of light is caused to change because of the less thick of metal film film in etching process, and cause the problem of the time of etching end point accurately that cannot obtain metal film, and, device of the present invention is simple, method easily controls, cost is very cheap.
[accompanying drawing explanation]
Fig. 1 is the cutaway view of the vertical direction of a kind of metal Wet-type etching device in the embodiment of the present invention;
To be a kind of metal Wet-type etching device in the embodiment of the present invention move towards schematic diagram starting light signal when etching metal film to Fig. 2;
Fig. 3 is that the light signal of a kind of metal Wet-type etching device when the middle part of metal film is possible to determine when the sample has been completely etched of the embodiment of the present invention moves towards schematic diagram;
Fig. 4 is that a kind of metal Wet-type etching device of the embodiment of the present invention is moved towards schematic diagram by light signal during etching completely at metal film;
Fig. 5 is that a kind of metal Wet-type etching device of prior art moves towards schematic diagram starting light signal when etching metal film;
Fig. 6 is that the light signal of a kind of metal Wet-type etching device when metal membrane-coating etches into less thick of prior art moves towards schematic diagram;
Fig. 7 is that the light signal of a kind of metal Wet-type etching device when the middle part of metal film is possible to determine when the sample has been completely etched of prior art moves towards schematic diagram;
Fig. 8 is the implementing procedure figure of the method for supervising of a kind of metal Wet-type etching terminal in the embodiment of the present invention.
[embodiment]
The explanation of following embodiment is graphic with reference to what add, can in order to the specific embodiment implemented in order to illustrate the present invention.The direction term that the present invention mentions, such as " on ", D score, "front", "rear", "left", "right", " interior ", " outward ", " side " etc., be only the direction with reference to annexed drawings.Therefore, the direction term of use is in order to illustrate and to understand the present invention, and is not used to limit the present invention.In the drawings, the unit of structural similarity represents with identical label.
Embodiment one
Please refer to Fig. 1 to Fig. 4, Fig. 1 is the cutaway view of the vertical direction of a kind of metal Wet-type etching device 10 of the present embodiment, Fig. 2 is that a kind of optical signal line 108 that metal Wet-type etching device 10 is starting when etching metal film 104 of the present embodiment moves towards schematic diagram, Fig. 3 is that the optical signal line 108 of a kind of metal Wet-type etching device 10 when the middle part of metal film 104 is possible to determine when the sample has been completely etched of the present embodiment moves towards schematic diagram, and Fig. 4 is that a kind of metal Wet-type etching device 10 of the present embodiment is moved towards schematic diagram by the optical signal line 108 during etching completely at metal film 104.
Can see from Fig. 1 to Fig. 4, a kind of metal Wet-type etching device 10 of the present embodiment, described metal Wet-type etching device 10 comprises:
Glass substrate 103, for carrying metal film 104 to be etched, described metal film 104 covers described glass substrate 103.
First optical signal transceiver 101, also receives for vertically launching penetrability optical signal line 108 to described glass substrate 103 optical signal line 108 reflected.And
Second optical signal transceiver 102, for receiving the optical signal line 108 through described glass substrate 103 that described first optical signal transceiver 101 is launched.
Wherein, described optical signal line 108 can pass described glass substrate 103, described metal film 104 pairs of optical signal lines 108 have reflex, described first optical signal transceiver 101 and described second optical signal transceiver 102 are fixed on below and the top at the edge, corner of described glass substrate 103 respectively accordingly, and the plane orthogonal of their line and described glass substrate 103, and pass the edge of described glass substrate 103, the time point that described second optical signal transceiver 102 receives optical signal line 108 is the time point that the described metal film 104 being positioned at this optical signal line 108 irradiation place has etched.
In the present embodiment, described first optical signal transceiver 101 and described second optical signal transceiver 102 form an optical signal transceiver group, the number of described optical signal transceiver group is 4, and described first optical signal transceiver 101 of optical signal transceiver group described in each and described second optical signal transceiver 102 one_to_one corresponding.
In the present embodiment, described metal Wet-type etching device 10 also comprises:
Multiple nozzle 105, for spraying etching liquid 106 to described metal film 104, the spray area of the described etching liquid 106 that described nozzle 105 sprays covers and is greater than whole described glass substrate 103.
Multiple roller 107, for moving back and forth carrying described glass substrate 103 thereon in the lateral direction.
Wherein, described nozzle 105 is located at the top of described glass substrate 103, and be positioned at the below of described secondary signal transceiver, multiple described nozzle 105 is arranged with the relative one_to_one corresponding of multiple described roller about 107, the direction at the edge, described corner of the described glass substrate 103 that the direction of motion of described glass substrate 103 is passed with the line of corresponding described second optical signal transceiver 102 for described first optical signal transceiver 101.
In the present embodiment, above the scope of each described second optical signal transceiver 102 between adjacent two described nozzles 105.
In the present embodiment, after etching starts, described roller 107 drives described glass substrate 103 to carry out the horizontal movement back and forth of left and right directions, multiple described nozzles 105 carry out the horizontal movement back and forth of fore-and-aft direction, the direction of motion of described glass substrate 103 and the direction of motion of described nozzle 105 perpendicular.
In the present embodiment, static or when carrying out the horizontal movement back and forth of left and right directions at described glass substrate 103, the optical signal line 108 that described first optical signal transceiver 101 is launched is penetrated within the scope of the edge of described glass substrate 103, and the described etching liquid 106 that described nozzle 105 sprays covers described glass substrate 103.
The principal character of a kind of metal Wet-type etching device 10 of the present embodiment is, first optical signal transceiver 101 and the second optical signal transceiver 102 are fixed on respectively accordingly below and the top at the edge, corner of glass substrate 103, and the plane orthogonal of their line and glass substrate 103, by the impact of metal film 104 varied in thickness, can etching end point time of Obtaining Accurate metal film 104.
Please refer to Fig. 5 to Fig. 7, Fig. 5 is that the optical signal line 202 that a kind of metal etch device is starting when etching metal film 104 of prior art moves towards schematic diagram, Fig. 6 is that the optical signal line 202 of a kind of metal etch device when metal film 104 is etched to less thick of prior art moves towards schematic diagram, and Fig. 7 is that the optical signal line 202 of a kind of metal etch device when the middle part of metal film 104 is possible to determine when the sample has been completely etched of prior art moves towards schematic diagram.
As seen from Figure 5, a kind of metal etch device of prior art is oppositely disposed in above the side of glass substrate 203 by two optical signal transceiver 201, when starting to etch metal film 204, the optical signal line 202 that one of them optical signal transceiver 201 is launched to the metal film 204 be carried on glass substrate 203, can reflex on another optical signal transceiver 201 through metal film 204.As seen from Figure 6, when metal film 204 less thick to a certain extent time, the optical signal line 202 that one of them optical signal transceiver 201 is launched to the metal film 204 be carried on glass substrate 203, can not reflex on another optical signal transceiver 201 through metal film 204.As seen from Figure 7, when the mid portion of metal film 204 is now completely etched away prior to peripheral portion, the optical signal line 202 that one of them optical signal transceiver 201 is launched to the metal film 204 be carried on glass substrate 203, just directly penetrate glass substrate 203, and no longer reflect on another optical signal transceiver 201.Visible, this metal etch device of prior art, the reflection angle size of optical signal line 202 can be subject to the impact of metal film 204 thickness, causes us can not get the etching end point time of metal film 204 exactly.
A kind of metal Wet-type etching device 10 of the present invention, by fixing the second optical signal transceiver 102 and the first optical signal transceiver 101 respectively at the upper and lower at edge, glass substrate 103 corner, and make their line and the plane orthogonal of glass substrate 103, and pass the edge of described glass substrate 103, the time point receiving optical signal line 108 with the second optical signal transceiver 102 is the time point that the described metal film 104 being positioned at this optical signal line 108 irradiation place has etched, solve in prior art, in the process using optical signal transceiver to monitor metal Wet-type etching terminal, the reflection angle of light is caused to change because of the less thick of metal film 104 film in etching process, and cause the problem of the time of etching end point accurately that cannot obtain metal film 104, and device of the present invention is simple, method easily controls, cost is very cheap.
Embodiment two
The method for supervising of a kind of metal Wet-type etching terminal of the present embodiment, is applied to a kind of metal Wet-type etching device 10 described in embodiment one.
Please refer to Fig. 8, Fig. 8 is the implementing procedure figure of the method for supervising of a kind of metal Wet-type etching terminal in the embodiment of the present invention.As seen from Figure 8, the method for supervising of a kind of metal Wet-type etching terminal of the present embodiment, comprises following step:
Step S101: when described metal film 104 starts to etch, controls described first optical signal transceiver 101 to described glass substrate 103 Vertical Launch penetrability optical signal line 108, and record launch time point using as etching initial point, and keep emission state.
Whether step S102: carry out in the process etched at described metal film 104, controlling the monitoring in real time of described second optical signal transceiver 102 has optical signal line 108 to penetrate out from described glass substrate 103.
Whether step S103: if do not have optical signal line 108 to penetrate out from described glass substrate 103, then continuing to control the monitoring in real time of described second optical signal transceiver 102 has optical signal line 108 to penetrate out from described glass substrate 103.
Step S104: if there is optical signal line 108 to penetrate out from described glass substrate 103, then obtain each time point that all described second optical signal transceiver 102 receive this optical signal line 108, the etching end point using the described time point finally got as described metal film 104.
Step S105: calculate described metal film 104 total etching period used according to described etching initial point and described etching end point, described total etching period is the time difference length of described etching end point and described etching initial point.
Step S106: judge whether described total etching period is greater than default etching period threshold value.
Step S107: if not then described total etching period was preserved as the etching end point time of described metal film 104, and continue to etch follow-up described metal film 104.
Step S108: if then judge the thickness abnormity of described metal Wet-type etching device 10 and described metal film 104, and stop etching follow-up described metal film 104.
Step S109: the thickness of described metal Wet-type etching device 10 and described metal film 104 is detected, is greater than the reason of default etching period threshold value with the etching end point time finding out described metal film 104.
The method for supervising of a kind of metal Wet-type etching terminal of the present invention, by fixing the second optical signal transceiver 102 and the first optical signal transceiver 101 respectively at the upper and lower at edge, glass substrate 103 corner, and make their line and the plane orthogonal of glass substrate 103, and pass the edge of described glass substrate 103, the time point receiving optical signal line 108 with the second optical signal transceiver 102 is the time point that the described metal film 104 being positioned at this optical signal line 108 irradiation place has etched, solve in prior art, in the process using optical signal transceiver to monitor metal Wet-type etching terminal, the reflection angle of light is caused to change because of the less thick of metal film 104 film in etching process, and cause the problem of the time of etching end point accurately that cannot obtain metal film 104, and device of the present invention is simple, method easily controls, cost is very cheap.
In sum; although the present invention discloses as above with preferred embodiment; but above preferred embodiment is also not used to limit the present invention; those of ordinary skill in the art; without departing from the spirit and scope of the present invention; all can do various change and retouching, the scope that therefore protection scope of the present invention defines with claim is as the criterion.
Claims (10)
1. a metal Wet-type etching device, is characterized in that, described metal Wet-type etching device comprises:
Glass substrate, for carrying metal film to be etched, described metal film covers described glass substrate;
First optical signal transceiver, also receives for vertically launching penetrability light signal to described glass substrate the light signal reflected; And
Second optical signal transceiver, for receiving the light signal through described glass substrate that described first optical signal transceiver is launched;
Wherein, described light signal can pass described glass substrate, described metal film has reflex to light signal, described first optical signal transceiver and described second optical signal transceiver are fixed on below and the top at the edge, corner of described glass substrate respectively accordingly, and the plane orthogonal of their line and described glass substrate, and passing the edge of described glass substrate, the time point that described second optical signal transceiver receives light signal is the time point that the described metal film being positioned at this light signal irradiation place has etched.
2. metal Wet-type etching device according to claim 1, it is characterized in that, described first optical signal transceiver and described second optical signal transceiver form an optical signal transceiver group, the number of described optical signal transceiver group is 4, and described first optical signal transceiver of optical signal transceiver group described in each and described second optical signal transceiver one_to_one corresponding.
3. metal Wet-type etching device according to claim 2, is characterized in that, described metal Wet-type etching device also comprises:
Multiple nozzle, for spraying etching liquid to described metal film, the spray area of the described etching liquid of described nozzles spray covers and is greater than whole described glass substrate;
Multiple roller, for moving back and forth carrying described glass substrate thereon in the lateral direction;
Wherein, described nozzle is located at the top of described glass substrate, and be positioned at the below of described secondary signal transceiver, multiple described nozzle and multiple described roller up and down relative one_to_one corresponding are arranged, the direction at the edge, described corner of the described glass substrate that the direction of motion of described glass substrate is passed with the line of corresponding described second optical signal transceiver for described first optical signal transceiver.
4. metal Wet-type etching device according to claim 3, is characterized in that, above the scope of each described second optical signal transceiver between adjacent two described nozzles.
5. metal Wet-type etching device according to claim 4, it is characterized in that, after etching starts, described roller drives described glass substrate to carry out the horizontal movement back and forth of left and right directions, multiple described nozzle carries out the horizontal movement back and forth of fore-and-aft direction, the direction of motion of described glass substrate and the direction of motion of described nozzle perpendicular.
6. metal Wet-type etching device according to claim 5, it is characterized in that, static or when carrying out the horizontal movement back and forth of left and right directions at described glass substrate, the light signal that described first optical signal transceiver is launched is penetrated within the scope of the edge of described glass substrate, and the described etching liquid of described nozzle ejection covers described glass substrate.
7. a method for supervising for metal Wet-type etching terminal, is characterized in that, be applied to the metal Wet-type etching device described in any one in claim 1-6, described method for supervising comprises the following steps:
When described metal film starts to etch, control described first optical signal transceiver and launch penetrability light signal to described glass substrate, and the time point launched of record is using as etching initial point, and keep emission state;
Carry out at described metal film in the process etched, control described second optical signal transceiver and monitor in real time and whether have light signal to penetrate out from described glass substrate;
If there is light signal to penetrate out from described glass substrate, then obtain each time point that all described second optical signal transceiver receive this light signal, using the described time point finally got as the etching end point of described metal film.
8. method for supervising according to claim 7, is characterized in that, using the described time point finally got as the etching end point of described metal film, also comprises afterwards:
Calculate described metal film total etching period used according to described etching initial point and described etching end point, described total etching period is the time difference length of described etching end point and described etching initial point.
9. method for supervising according to claim 8, is characterized in that, calculates total etching period that described metal film is used, also comprises afterwards:
Judge whether described total etching period is greater than default etching period threshold value;
If then judge the thickness abnormity of described metal Wet-type etching device and described metal film, and stop etching follow-up described metal film;
If not then described total etching period was preserved as the etching end point time of described metal film, and continue to etch follow-up described metal film.
10. method for supervising according to claim 9, is characterized in that, while stopping etching described metal film, also comprises:
The thickness of described metal Wet-type etching device and described metal film is detected, is greater than the reason of default etching period threshold value with the etching end point time finding out described metal film.
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108220962A (en) * | 2017-12-29 | 2018-06-29 | 深圳市华星光电技术有限公司 | Control the device and method of wet etching terminal |
| CN108917598A (en) * | 2018-06-28 | 2018-11-30 | 武汉华星光电技术有限公司 | A kind of wet equipment and its sensing device |
| CN109659262A (en) * | 2018-12-21 | 2019-04-19 | 深圳市华星光电技术有限公司 | Etch monitor and etching monitoring method |
| CN109659249A (en) * | 2018-12-21 | 2019-04-19 | 深圳市华星光电技术有限公司 | Etching end point monitoring device and etching end point monitoring method |
| TWI659258B (en) * | 2018-05-23 | 2019-05-11 | 亞智科技股份有限公司 | Etching time detection method and system thereof |
| CN110085536A (en) * | 2019-04-08 | 2019-08-02 | 深圳市华星光电技术有限公司 | A kind of monitoring method and its device of etching metal layer rate |
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