CN105568268A - Sponge substrate chemical nickeling device - Google Patents
Sponge substrate chemical nickeling device Download PDFInfo
- Publication number
- CN105568268A CN105568268A CN201510958604.1A CN201510958604A CN105568268A CN 105568268 A CN105568268 A CN 105568268A CN 201510958604 A CN201510958604 A CN 201510958604A CN 105568268 A CN105568268 A CN 105568268A
- Authority
- CN
- China
- Prior art keywords
- plating
- bath trough
- chemical
- plating solution
- reservoir
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1619—Apparatus for electroless plating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1644—Composition of the substrate porous substrates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1675—Process conditions
- C23C18/168—Control of temperature, e.g. temperature of bath, substrate
Abstract
The invention discloses a sponge substrate chemical nickeling device and belongs to the field of chemical plating devices. The chemical nickeling device is composed of a liquid storing tank and a plating liquid tank which is provided with a plating liquid tank inlet (5) and a plating liquid tank outlet (6), a sponge substrate (3) is fixed in the middle of the plating liquid tank (2), a plating liquid circulating pump (4) is connected between the liquid storing tank (1) and the liquid plating tank (2) through a plating liquid pipeline (8), and the chemical nickeling device is used for foam nickel production using polyurethane sponge as a substrate. Chemical plating liquid is enabled to be circulated between two devices, so that the problems of plating nonuniformity and low stability caused by the fact that a conventional chemical nickeling solution is nonuniform in local diffusion are solved. The chemical nickeling device is simple in process equipment and controllable in temperature.
Description
Technical field
The invention belongs to chemical plating appts scope, particularly a kind of sponge matrix chemical nickel plating device, is the nickel foam production equipment for taking polyurethane sponge as matrix specifically.
Background technology
Nickel foam has tridimensional network, and porosity is high, and specific surface area is large, can be used as the various fields such as filtration supports, chemical catalyst carrier, electromagnetic shielding material, electrolytic hydrogen production, battery.Usual in industry is matrix with polyurethane sponge, by oxidation reduction process nickel deposited on sponge in nickel salt solution, finally removes sponge and obtains nickel foam.Bubble due to sponge light weight, in plating process, can bubble be produced, make sponge swim in solution surface, cause local diffusion uneven, make electroless plating uneven, if can not be discharged in time also can affect plating microscopic uniformity.
Summary of the invention
The object of this invention is to provide a kind of sponge matrix chemical nickel plating device, it is characterized in that, this chemical nickel plating device is made up of reservoir and bath trough two portions, bath trough 2 arranges bath trough import 5, bath trough outlet 6, sponge matrix 3 is fixed on the centre of bath trough 2, plating solution recycle pump 4 is connected between reservoir 1 and bath trough 2 by plating solution pipeline 8, and chemical plating fluid 7 is circulated through plating solution pipeline 8 by plating solution recycle pump 4 between reservoir and bath trough.
Described sponge matrix is polyurethane sponge matrix; By the centre of elastic mounting at bath trough 2, distance bath trough imports and exports the distance all having 10-30cm,
Described chemical plating fluid is transported in bath trough 2 through plating solution pipeline 8 by plating solution recycle pump 4 from reservoir 1, carries out chemical nickel plating reaction, then gets back in reservoir 1, is taken out of by the gas that reaction produces simultaneously.
Described plating solution recycle pump regulates chemical plating fluid 7 to flow through the flow velocity of bath trough 2, is incubated, controls the temperature of whole system, make electroless plating reaction be in optimal reaction temperature always to reservoir.
Described chemical plating fluid is circulated through plating solution pipeline 8 by plating solution recycle pump 4 between reservoir and bath trough two portions, chemical plating fluid 7 enters in reservoir 1 after reacted and again mixes with main body plating solution, so the plating solution composition of sponge surface is always identical with main body plating solution, reduce the uneven partial concn caused of local diffusion uneven, make electroless plating more even.
Beneficial effect of the present invention: the plating solution major part in this chemical nickel plating device is present in reservoir is 10-20 times of amount of liquid in bath trough, can be controlled the temperature of whole system plating solution by the temperature controlling plating solution in reservoir.In bath trough, sponge matrix distance bath trough imports and exports the distance all having 10-30cm, and the plating solution flowing through sponge matrix can be made more even.Therefore the present invention can make sponge be immersed in plating solution, and discharges bubble in time, reduces the uneven impact on electroless plating of local diffusion simultaneously, obtains the uniform nickel foam of coating.
Accompanying drawing explanation
Fig. 1 is a kind of sponge matrix chemical nickel plating device overall schematic.
Fig. 2 is bath trough schematic cross-section.
In figure: 1-reservoir, 2-bath trough, 3-sponge matrix, 4-plating solution recycle pump, the import of 5-bath trough, the outlet of 6-bath trough, 7-chemical plating fluid, 8-plating solution pipeline.
Embodiment
The invention provides a kind of sponge matrix chemical nickel plating device, below in conjunction with the drawings and specific embodiments, the present invention will be further described.
In the sponge matrix chemical nickel plating device overall schematic shown in Fig. 1, this chemical nickel plating device is made up of reservoir and bath trough two portions, bath trough 2 arranges bath trough import 5, bath trough outlet 6, sponge matrix 3 is fixed on the centre of bath trough 2, plating solution recycle pump 4 is connected between reservoir 1 and bath trough 2 by plating solution pipeline 8, and chemical plating fluid 7 is circulated through plating solution pipeline 8 by plating solution recycle pump 4 between reservoir and bath trough.Wherein, sponge matrix 3 is polyurethane sponge matrix; By the centre of elastic mounting at bath trough 2, the import and export of distance bath trough all has the distance (as shown in Figure 2) of 10-30cm,
Described chemical plating fluid is transported in bath trough 2 through plating solution pipeline 8 by plating solution recycle pump 4 from reservoir 1, carries out chemical nickel plating reaction, then gets back in reservoir 1, is taken out of by the gas that reaction produces simultaneously.
Applying this chemical nickel plating device, to carry out the step of sponge matrix chemical nickel plating as follows:
(1) sponge matrix preparation: by polyurethane sponge thick for 2mm after the serial preprocessor such as potassium permanganate solution alligatoring, oxalic acid washing, stannous chloride solution sensitization, palladium chloride solution activation, obtain the sponge matrix with catalytic performance;
(2) sponge matrix is fixed in bath trough 2, by Fig. 1 assembled device, chemical plating fluid 7 in reservoir 1 is heated to 40 DEG C-50 DEG C, start plating solution recycle pump 4, chemical plating fluid 7 is circulated between reservoir 1 and bath trough 2 through plating solution pipeline 8, carry out chemical nickel plating, in nickel process, chemical plating fluid 7 is regulated to flow through the flow velocity of bath trough 2 by plating solution recycle pump 4, reservoir is incubated, control the temperature of whole system, make electroless plating reaction be in optimal reaction temperature always.Be put back in reservoir 1 by whole chemical plating fluid after electroless plating terminates, chemical nickel plating terminates.Now, whole chemical plating fluid after electroless plating terminates mixes again with the main body plating solution in reservoir 1, in reservoir, main body plating solution is 10-20 times of the chemical plating fluid scale of construction in bath trough, so the plating solution composition of sponge surface is always identical with main body plating solution, reduce the uneven impact on electroless plating of local diffusion, make electroless plating more even.
Claims (5)
1. a sponge matrix chemical nickel plating device, it is characterized in that, this chemical nickel plating device is made up of reservoir and bath trough two portions, bath trough (2) arranges bath trough import (5), bath trough outlet (6), sponge matrix (3) is fixed on the centre of bath trough (2), plating solution recycle pump (4) is connected to reservoir by plating solution pipeline (8), and (between 1 and bath trough (2), chemical plating fluid (7) is circulated through plating solution pipeline (8) by plating solution recycle pump (4) between reservoir and bath trough.
2. a kind of sponge matrix chemical nickel plating device according to claim 1, it is characterized in that, described sponge matrix is polyurethane sponge matrix; By the centre of elastic mounting in bath trough (2), distance bath trough imports and exports the distance all having 10-30cm.
3. a kind of sponge matrix chemical nickel plating device according to claim 1, it is characterized in that, described chemical plating fluid is transported in bath trough (2) through plating solution pipeline (8) by plating solution recycle pump (4) from reservoir (1), carry out chemical nickel plating reaction, then get back in reservoir (1), the gas that reaction produces is taken out of simultaneously.
4. a kind of sponge matrix chemical nickel plating device according to claim 1, it is characterized in that, described plating solution recycle pump regulates chemical plating fluid (7) to flow through the flow velocity of bath trough (2), reservoir is incubated, control the temperature of whole system, make electroless plating reaction be in optimal reaction temperature always.
5. a kind of sponge matrix chemical nickel plating device according to claim 1, it is characterized in that, described chemical plating fluid is circulated through plating solution pipeline (8) by plating solution recycle pump (4) between reservoir and bath trough two portions, chemical plating fluid (7) mixes with main body plating solution again reacted rear the entering in time in reservoir (1) of sponge surface, so the plating solution composition of sponge surface is always identical with main body plating solution, reduce the uneven partial concn caused of local diffusion uneven, make electroless plating more even.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510958604.1A CN105568268A (en) | 2015-12-18 | 2015-12-18 | Sponge substrate chemical nickeling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510958604.1A CN105568268A (en) | 2015-12-18 | 2015-12-18 | Sponge substrate chemical nickeling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105568268A true CN105568268A (en) | 2016-05-11 |
Family
ID=55878874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510958604.1A Pending CN105568268A (en) | 2015-12-18 | 2015-12-18 | Sponge substrate chemical nickeling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105568268A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114164420A (en) * | 2021-12-07 | 2022-03-11 | 上达电子（深圳）股份有限公司 | Tin melting tank structure and use method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1249541A (en) * | 1999-08-27 | 2000-04-05 | 钟发平 | Surficially roughened foam nickel and its preparing process |
| CN1361311A (en) * | 2000-12-28 | 2002-07-31 | 长沙力元新材料股份有限公司 | Foamed nickel material with superhigh binding force and its prepn |
| CN201258360Y (en) * | 2008-09-23 | 2009-06-17 | 江西蓝天学院 | Forced flow electroless plating apparatus |
| CN201437554U (en) * | 2009-06-17 | 2010-04-14 | 成都康洁表面技术有限公司 | Single-head steel bottle chemical outside-bath plating circulation system |
| JP2012062506A (en) * | 2010-09-15 | 2012-03-29 | Institute Of National Colleges Of Technology Japan | Electroless plating method of porous material |
| CN104357811A (en) * | 2014-12-01 | 2015-02-18 | 中核(天津)科技发展有限公司 | Device for chemical plating |
| CN205295458U (en) * | 2015-12-18 | 2016-06-08 | 有研粉末新材料（北京）有限公司 | Be used for nickel -plated chemical nickel plating device of sponge base member |
-
2015
- 2015-12-18 CN CN201510958604.1A patent/CN105568268A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1249541A (en) * | 1999-08-27 | 2000-04-05 | 钟发平 | Surficially roughened foam nickel and its preparing process |
| CN1361311A (en) * | 2000-12-28 | 2002-07-31 | 长沙力元新材料股份有限公司 | Foamed nickel material with superhigh binding force and its prepn |
| CN201258360Y (en) * | 2008-09-23 | 2009-06-17 | 江西蓝天学院 | Forced flow electroless plating apparatus |
| CN201437554U (en) * | 2009-06-17 | 2010-04-14 | 成都康洁表面技术有限公司 | Single-head steel bottle chemical outside-bath plating circulation system |
| JP2012062506A (en) * | 2010-09-15 | 2012-03-29 | Institute Of National Colleges Of Technology Japan | Electroless plating method of porous material |
| CN104357811A (en) * | 2014-12-01 | 2015-02-18 | 中核(天津)科技发展有限公司 | Device for chemical plating |
| CN205295458U (en) * | 2015-12-18 | 2016-06-08 | 有研粉末新材料（北京）有限公司 | Be used for nickel -plated chemical nickel plating device of sponge base member |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114164420A (en) * | 2021-12-07 | 2022-03-11 | 上达电子（深圳）股份有限公司 | Tin melting tank structure and use method thereof |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160511 |
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| RJ01 | Rejection of invention patent application after publication |