KR20210003610A - Electroplating device for foamed nickel alloy - Google Patents

Electroplating device for foamed nickel alloy Download PDF

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KR20210003610A
KR20210003610A KR1020190079625A KR20190079625A KR20210003610A KR 20210003610 A KR20210003610 A KR 20210003610A KR 1020190079625 A KR1020190079625 A KR 1020190079625A KR 20190079625 A KR20190079625 A KR 20190079625A KR 20210003610 A KR20210003610 A KR 20210003610A
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plating
electrode
base electrode
anode
nickel
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KR1020190079625A
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Korean (ko)
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오건택
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오건택
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating

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  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The present invention relates to an electroplating device for alloying foamed nickel. The present invention comprises a liquid storage tank, a plating solution circulation pump, a plating tank, and a power system. A foam base electrode is fixated at a center of the plating tank, and each of two anode electrodes is fixated on an edge of the plating tank. Plating solution inside the plating tank is configured to comprise 50-150 g/L of nickel sulfate. Each of the foam base electrode and the anode electrode is connected to an anode and a cathode of the power supply system through a wire. The foam base electrode and the two anode electrodes are placed at the same distance while being in parallel to each other. According to the present invention as described above, the device can supply proper solution to a surface of the electrode and can remove and reduce uneven local dispersion caused by generation of dispersion and polarization.

Description

발포 니켈 합금의 전기 도금장치 { Electroplating device for foamed nickel alloy }{Electroplating device for foamed nickel alloy}

본 발명은 발포 니켈 합금의 제조 분야에 관한 것으로, 특히 발포 니켈을 합금처리하기 위한 전기 도금장치에 관한 것이다.The present invention relates to the field of manufacturing a foamed nickel alloy, and more particularly, to an electroplating apparatus for alloying foamed nickel.

발포 니켈은 3차원 네트워크 구조를 가지며, 높은 다공성, 큰 비 표면적을 가지며, 양호한 전극 재료 및 촉매 담체이다. Foamed nickel has a three-dimensional network structure, high porosity, large specific surface area, and is a good electrode material and catalyst carrier.

업계에서는 전도성 폴리 우레탄 스폰지가 일반적으로 매트릭스로 사용되며 니켈 폼은 전기 도금으로 얻어지며 니켈은 매트릭스로 사용되며 그 위에 도금이되어 합금의 작업 영역을 증가시키고 합금이 보다 효율적으로 적용된다.In the industry, conductive polyurethane sponge is generally used as a matrix, nickel foam is obtained by electroplating, nickel is used as a matrix, and plated on it to increase the working area of the alloy, and the alloy is applied more efficiently.

현재, 니켈 폼 및 이를 기반으로 한 합금은 에너지, 화학, 항공 우주, 원자력 및 기타 분야에서 널리 사용되고 있다.Currently, nickel foam and alloys based on it are widely used in energy, chemistry, aerospace, nuclear and other fields.

그러나 종래 기술에 의한 발포니켈의 전기 도금 공정에서는, 기포의 발생 및 국부적인 확산 불균일의 영향으로 인해, 도금 층이 불균일하여 며, 발포 니켈 합금 제품의 품질 저하를 초래하고 있다.However, in the electroplating process of foamed nickel according to the prior art, the plating layer is non-uniform due to the generation of air bubbles and the influence of the local diffusion non-uniformity, resulting in deterioration of the quality of the foamed nickel alloy product.

본 발명은 상기와 같은 종래의 문제점을 해결하기 위하여 안출된 것으로, 본 발명은 균일한 도금 층이 형성될 수 있도록 하는 발포 니켈 합금의 전기 도금장치를 제공하고자 하는 것이다.The present invention has been conceived to solve the conventional problems as described above, and the present invention is to provide an electroplating apparatus of a foamed nickel alloy capable of forming a uniform plating layer.

즉, 본 발명은 확산의 영향을 경감시키고, 기포를 정확하게 방출하여 니켈 폼 및 니켈 폼 - 기반 합금 코팅을 보다 균일하게 할 수 있는 니켈 폼 및 니켈 폼 - 기반 합금 도금 장치를 제공하는 것이다.That is, the present invention is to provide a nickel foam and nickel foam-based alloy plating apparatus capable of reducing the effect of diffusion and accurately discharging air bubbles to make the nickel foam and nickel foam-based alloy coating more uniform.

상기한 바와 같은 목적을 달성하기 위한 본 발명의 특징에 따르면, 본 발명에 따른 도금 장치는 두 개의 애노드 전극 도금 탱크의 가장자리에 고정되는 순환 세척조, 도금 탱크와, 도금 조 폼 행렬 전극의 중앙에 고정되는 전원 공급 시스템, 펌프 및 저장조를 포함한다.According to the features of the present invention for achieving the above object, the plating apparatus according to the present invention includes a circulation cleaning bath fixed to the edges of the two anode electrode plating tanks, a plating tank, and a plating bath foam matrix fixed at the center of the electrode. Power supply systems, pumps and reservoirs.

세척조에 50-120 g / L의 황산 니켈이 함유되어 있다.The washing bath contains 50-120 g/L of nickel sulfate.

또한, 폼베이스 전극 및 애노드 전극은 와이어로 전원 시스템의 음극 및 양극에 각각 연결된다.In addition, the foam base electrode and the anode electrode are connected to the cathode and anode of the power system by wires, respectively.

그리고 폼베이스 전극과 2 개의 애노드 전극 (6)은 서로 평행하고 동일한 거리를 갖는다.And the foam base electrode and the two anode electrodes 6 are parallel to each other and have the same distance.

또한, 폼베이스 전극은 폴리 우레탄 스폰지베이스 전극이다.In addition, the foam base electrode is a polyurethane sponge base electrode.

그리고 도금 조 내의 도금액은 20-50g / L의 염화 니켈, 20-40g / L의 붕산 및 0.5-2g / L의 사카린을 추가로 함유한다.And the plating solution in the plating bath further contains 20-50 g/L of nickel chloride, 20-40 g/L of boric acid and 0.5-2 g/L of saccharin.

또한, 발포체베이스 전극은 발포 니켈 계 전극이다.In addition, the foam base electrode is a foamed nickel-based electrode.

그리고 도금 조 내의 도금액은 황산 코발트 5 ~ 10g / l, 몰리브덴 산 나트륨 5 ~ 10g / l, 구연산 나트륨 80 ~ 100g / l 및 암모니아수 10 ~ 20ml / l를 추가로 함유한다.And the plating solution in the plating bath further contains 5 to 10 g/l of cobalt sulfate, 5 to 10 g/l of sodium molybdate, 80 to 100 g/l of sodium citrate, and 10 to 20 ml/l of aqueous ammonia.

또한, 도금 조 내의 도금 용액의 pH는 9이다.In addition, the pH of the plating solution in the plating bath is 9.

한편, 도금액 순환 펌프는 액체 저류조 내의 도금액을 도금 조로 이송하고, 전기 도금 반응을 행한 후, 반응 후의 전기 도금액을 다시 액체 저류조로 반송함과 동시에 전기 도금 반응에 의해 생성된 가스를 배출한다. On the other hand, the plating solution circulation pump transfers the plating solution in the liquid storage tank to the plating bath, performs an electroplating reaction, and then returns the electroplating solution after the reaction to the liquid storage tank, and discharges gas generated by the electroplating reaction.

도금 탱크를 흐르는 도금 용액의 유량은 도금액 순환 펌프에 의해 조정될 수 있고, 시스템 전체의 도금 온도는 액체 저장 탱크의 온도를 제어함으로써 제어될 수 있다.The flow rate of the plating solution flowing through the plating tank can be adjusted by the plating liquid circulation pump, and the plating temperature of the entire system can be controlled by controlling the temperature of the liquid storage tank.

위에서 살핀 바와 같은 본 발명에 의한 발포 니켈 합금의 전기 도금장치에서는 다음과 같은 효과를 기대할 수 있다.In the electroplating apparatus of a foamed nickel alloy according to the present invention as salpinned above, the following effects can be expected.

즉, 본 발명에서는 전극 표면의 적절한 용액이 공급되고, 확산/분극 생성에 의해 불균일 로컬 확산이 제거/감소되는 효과가 있다.That is, in the present invention, there is an effect that an appropriate solution on the electrode surface is supplied, and non-uniform local diffusion is eliminated/reduced by generation of diffusion/polarization.

그리고 이에 따라 본 발명에서는 본체와 혼합하면서 신속하게 되었기 때문에, 전극의 표면에 생성된 기포는 도금을 보다 균일하게 만들기 때문에 도금 조의 전극은 도금 조의 출입구로부터 일정 거리를 가지며, 전극을 통해 흐르는 도금액을보다 균일하게 할 수 있다.And accordingly, in the present invention, since it was quickly mixed with the body, the bubbles generated on the surface of the electrode make the plating more uniform, so that the electrode of the plating bath has a certain distance from the entrance of the plating bath, and the plating solution flowing through the electrode is more It can be made uniform.

도 1은 본 발명에 의한 발포 니켈 합금의 전기 도금장치이 구조를 도시한 개략도.1 is a schematic view showing the structure of an electroplating apparatus for a foamed nickel alloy according to the present invention.

이하에서는 첨부된 도면을 참조하여 본 발명의 구체적인 실시예에 의한 발포 니켈 합금의 전기 도금장치를 살펴보기로 한다.Hereinafter, an electroplating apparatus for a foamed nickel alloy according to a specific embodiment of the present invention will be described with reference to the accompanying drawings.

실시 예 1Example 1

본 발명에 의한 발포 니켈 합금의 전기 도금장치는, 도금 탱크(3)의 중간에 발포 기본 전극(5)이 고정되고, 2개의 애노드 전극(6)은 각각 도금 탱크(3)의 단부에 고정되며, 전극은 도금 조의 입구와 출구로부터 일정 거리에 있다.In the electroplating apparatus of a foamed nickel alloy according to the present invention, the foamed basic electrode 5 is fixed in the middle of the plating tank 3, and the two anode electrodes 6 are fixed to the ends of the plating tank 3, respectively. , The electrode is at a certain distance from the inlet and outlet of the plating bath.

그리고 폼베이스 전극(5) 및 애노드 전극(6)은 각각 와이어를 통해 전력 공급 시스템(4)의 음극 및 양극에 연결되고, 도금액은 도금액 순환 펌프(2)를 통해 도금 조(3)와 액체 저류조(1) 사이를 순환한다.In addition, the foam base electrode 5 and the anode electrode 6 are connected to the cathode and the anode of the power supply system 4 through wires, respectively, and the plating solution is supplied to the plating bath 3 and the liquid storage tank through the plating solution circulation pump 2. (1) Cycle through.

또한, 도금 순환 펌프(2)에는 유량 제어 장치가 있고, 저장조 (1)에는 온도 조절 장치가 있다.Further, the plating circulation pump 2 has a flow rate control device, and the storage tank 1 has a temperature control device.

폴리 우레탄 스폰지의 니켈 도금을 수행하기 위해 상기 장치를 적용하는 단계는 다음과 같다.The steps of applying the apparatus to perform nickel plating of the polyurethane sponge are as follows.

1. 폼(스폰지) 메트릭스의 준비단계1. Form (sponge) matrix preparation stage

2mm 두께의 폴리 우레탄 스폰지는 과망간산 칼륨 용액으로 거칠게 가공하고; 옥살산 세척을 수행하며; 염화 제1주석 용액으로 처리하고; 팔라듐 클로라이드 용액 활성화하며; 무전 해 도금과 같은 전처리 후에, 전도성 폴리 우레탄 스폰지 베이스 전극을 얻는다.Polyurethane sponge with a thickness of 2 mm is roughly processed with a solution of potassium permanganate; Performing an oxalic acid wash; Treated with a stannous chloride solution; Palladium chloride solution activated; After pretreatment such as electroless plating, a conductive polyurethane sponge base electrode is obtained.

2. 폴리 우레탄 스폰지베이스 전극을 음극으로 하고, 니켈 판을 양극으로 하여, 도 1에 도시된 도금 조를 구성한다.2. Using a polyurethane sponge base electrode as a cathode and a nickel plate as an anode, the plating bath shown in FIG. 1 is constructed.

이때, 도금액의 조성은 황산 니켈 100g/l, 염화 니켈 50g/l, 붕산 40g/l 및 사카린 2g/l 이다.At this time, the composition of the plating solution is 100 g/l of nickel sulfate, 50 g/l of nickel chloride, 40 g/l of boric acid, and 2 g/l of saccharin.

3, 액체 저장 탱크의 도금 용액을 40°내지 50°C로 가열하고, 펌프 순환을 시작하며, 장치 내의 도금액을 순환시키면서, 안정화 후 시스템을 구동시킨다.3, heating the plating solution in the liquid storage tank to 40° to 50°C, starting pump circulation, circulating the plating solution in the device, and driving the system after stabilization.

이때, 전류 밀도를 0.6A/cm2로 설정하여 도금을 시작한다.At this time, plating is started by setting the current density to 0.6A/cm2.

도금 시간은 40분이고, 도금이 끝나면 도금액을 다시 저장소에 되돌려 저장하여 도금공정을 종료한다.The plating time is 40 minutes, and after plating is completed, the plating solution is returned to the storage and stored to end the plating process.

실시 예 2Example 2

본 발명에 의한 발포 니켈 합금의 전기 도금장치는, 도금 탱크(3)의 중간에 발포 기본 전극(5)이 고정되고, 2개의 애노드 전극(6)은 각각 도금 탱크(3)의 에지 상에 고정되며, 전극은 도금 조의 입구와 출구로부터 일정 거리에 있다.In the electroplating apparatus of a foamed nickel alloy according to the present invention, the foamed basic electrode 5 is fixed in the middle of the plating tank 3, and the two anode electrodes 6 are fixed on the edge of the plating tank 3, respectively. And the electrode is at a certain distance from the inlet and outlet of the plating bath.

폼 베이스 전극(5) 및 애노드 전극(6)은 각각 와이어를 통해 전력 공급 시스템(4)의 음극 및 양극에 연결되고, 도금액은 도금액 순환 펌프(2)를 통해 도금 조(3)와 액체 저류조(1) 사이를 순환한다.The foam base electrode 5 and the anode electrode 6 are connected to the cathode and the anode of the power supply system 4 through wires, respectively, and the plating solution is supplied to the plating bath 3 and the liquid storage tank through the plating solution circulation pump 2. 1) Cycle between.

한편, 도금 순환 펌프(2)에는 유량 제어 장치가 있고, 저장조(1)에는 온도 조절 장치가 있다.On the other hand, the plating circulation pump 2 has a flow rate control device, and the storage tank 1 has a temperature control device.

상기 장치를 발포 니켈계 전기도금 NiMoCo 합금에 적용하는 경우, 수행 단계는 다음과 같다.When the device is applied to a foamed nickel-based electroplated NiMoCo alloy, the steps of performing are as follows.

1. 캐소드 전극으로는 발포 니켈 기판이 되고, 흑연 판은 양극이 되도록 장치를 구성한다.1. Configure the device so that the cathode electrode becomes a foamed nickel substrate and the graphite plate becomes an anode.

이때, 도금 조에의 도금액은 니켈 황산염 100g/L, 황산 코발트 8g/L, 나트륨 몰 리브 데이트 8g/L, 구연산 나트륨 80g/L 및 암모니아수 10ml/L를 포함하여 구성되고, 30% NaOH로 pH를 9로 조절한다.At this time, the plating solution in the plating bath contains 100 g/L of nickel sulfate, 8 g/L of cobalt sulfate, 8 g/L of sodium molybdate, 80 g/L of sodium citrate, and 10 ml/L of aqueous ammonia, and the pH is set to 9 with 30% NaOH. Adjust with

2. 이후, 순환 펌프를 시작하고, 장치 내의 도금액을 순환시키면서, 안정화 후 장치 구동을 시작한다. 2. Thereafter, the circulation pump is started, and the plating solution in the device is circulated, and the device is started after stabilization.

이때, 전류 밀도를 6A/cm2로 설정하여 도금을 시작한다.At this time, plating is started by setting the current density to 6A/cm2.

도금 시간은 1시간이며, 도금이 끝나면 모든 도금액을 다시 되돌려 저장소에 저장시키면, 전기 도금된 NiMoCo 합금이 생성된다.The plating time is 1 hour, and when all plating solutions are returned and stored in the storage after plating is completed, electroplated NiMoCo alloy is generated.

실시 예 3Example 3

도금 조 내의 도금 용액은 황산 니켈 50g/L, 니켈 클로라이드 20g/L, 붕산 30g/L 및 사카린 0.5g/L으로 구성될 수 있다.The plating solution in the plating bath may consist of 50 g/L of nickel sulfate, 20 g/L of nickel chloride, 30 g/L of boric acid, and 0.5 g/L of saccharin.

실시 예 4Example 4

도금 조 내의 도금 용액은 황산 니켈 80g/L, 니켈 클로라이드 30g/L, 붕산 20g/L 및 사카린 1g/L 으로 구성될 수 있다.The plating solution in the plating bath may consist of 80 g/L of nickel sulfate, 30 g/L of nickel chloride, 20 g/L of boric acid, and 1 g/L of saccharin.

실시 예 5Example 5

도금 조 내의 도금 용액은 황산 니켈을 포함하되, 니켈 황산염 120g/L, 황산 코발트 5g/L, 나트륨 몰 리브 데이트 5g/L, 구연산 나트륨 100g/L 및 암모니아수 15ml/L 로 구성될 수 있다.The plating solution in the plating bath contains nickel sulfate, but may consist of 120 g/L of nickel sulfate, 5 g/L of cobalt sulfate, 5 g/L of sodium molybdate, 100 g/L of sodium citrate, and 15 ml/L of aqueous ammonia.

실시 예 6Example 6

도금 조 내의 도금 용액은 황산 니켈을 포함하되, 니켈 황산염 150g/L, 황산 코발트 10g/L, 나트륨 몰 리브 데이트 10g/L, 구연산 나트륨 90g/L 및 암모니아수 20ml/L 로 구성될 수 있다.The plating solution in the plating bath contains nickel sulfate, and may consist of 150 g/L of nickel sulfate, 10 g/L of cobalt sulfate, 10 g/L of sodium molybdate, 90 g/L of sodium citrate, and 20 ml/L of aqueous ammonia.

본 발명의 권리는 위에서 설명된 실시예에 한정되지 않고 청구범위에 기재된 바에 의해 정의되며, 본 발명의 분야에서 통상의 지식을 가진 자가 청구범위에 기재된 권리범위 내에서 다양한 변형과 개작을 할 수 있다는 것은 자명하다.The rights of the present invention are not limited to the embodiments described above, but are defined by what is described in the claims, and that a person having ordinary knowledge in the field of the present invention can make various modifications and adaptations within the scope of the rights described in the claims. It is self-evident.

1 : 저장 탱크 2 : 플레이트 순환 펌프
3 : 도금 탱크 4 : 전력 시스템
5 : 발포베이스 전극 6 : 애노드 전극1: storage tank 2: plate circulation pump
3: plating tank 4: power system
5: foam base electrode 6: anode electrode

Claims (1)

액체 저장 탱크(1);
도금 액체 순환 펌프(2);
도금조(3); 및
전력 시스템(4)을 포함하여 구성되고:
폼 베이스 전극(5)은 도금조(3)의 중간에 고정되고;
2개의 애노드 전극(6)은 도금조(3)의 모서리 상에 각각 고정되며;
도금조 내의 도금 용액은 황산 니켈 50-120 g/L를 포함하여 구성되고:
폼 베이스 전극(5) 및 애노드 전극(6)은 각각 와이어를 통해 전력 공급 시스템(4)의 음극 및 양극에 연결되며:
폼 베이스 전극(5) 및 2개의 애노드 전극(6)은 서로 평행하고, 동일한 거리에 위치하고:
폼 베이스 전극(5)은 폴리 우레탄 스폰지 베이스 전극이며:
상기 도금 조 내의 도금 용액은
20 내지 50g/L의 염화 니켈, 20 내지 40g/L의 붕산 및 0.5 내지 2g/L의 사카린을 포함하여 구성됨을 특징으로 하는 발포 니켈 합금의 전기 도금장치.
A liquid storage tank 1;
Plating liquid circulation pump 2;
Plating bath 3; And
The power system 4 is comprised of:
The foam base electrode 5 is fixed in the middle of the plating bath 3;
The two anode electrodes 6 are each fixed on the edge of the plating bath 3;
The plating solution in the plating bath comprises 50-120 g/L of nickel sulfate:
The foam base electrode 5 and the anode electrode 6 are respectively connected to the cathode and anode of the power supply system 4 via wires:
Foam base electrode 5 and two anode electrodes 6 are parallel to each other and located at the same distance:
Foam base electrode (5) is a polyurethane sponge base electrode:
The plating solution in the plating bath
20 to 50 g/L of nickel chloride, 20 to 40 g/L of boric acid and 0.5 to 2 g/L of saccharin.
KR1020190079625A 2019-07-02 2019-07-02 Electroplating device for foamed nickel alloy KR20210003610A (en)

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