CN105401205A - Foamed nickel and foamed nickel-based alloy plating device - Google Patents
Foamed nickel and foamed nickel-based alloy plating device Download PDFInfo
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- CN105401205A CN105401205A CN201510834841.7A CN201510834841A CN105401205A CN 105401205 A CN105401205 A CN 105401205A CN 201510834841 A CN201510834841 A CN 201510834841A CN 105401205 A CN105401205 A CN 105401205A
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- plating
- foam
- based alloy
- nickel
- tank
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention provides a foamed nickel and foamed nickel-based alloy plating device, which comprises a plating tank, a solution storage tank, a plating solution circulation pump and a power system, wherein a foam matrix electrode is fixed in the middle of the plating tank; two anode electrodes are respectively fixed on the edges of the plating tank; plating solution is circulated between the plating tank and the solution storage tank by the plating solution circulation pump to complete plating in the plating tank; and the plating solution in the plating tank contains 50-120g/L of nickel sulfate. Compared with the traditional plating device, the foamed nickel and foamed nickel-based alloy plating device has the advantages that the polarization caused by the diffusion effect can be reduced; the uneven influence of local diffusion is eliminated; bubbles can be discharged in time, so that a plating layer is even; a process apparatus is simple; and the operation is convenient.
Description
Technical field
The present invention relates to nickel foam and the Ni-based alloy production field of foam, be specifically related to a kind of nickel foam and the Ni-based alloy plating device of foam.
Background technology
Nickel foam has tridimensional network, and porosity is high, and specific surface area is large, is good electrode materials and support of the catalyst.In industry usually with conductive polyurethane sponge for matrix, obtain nickel foam by plating, take nickel foam as matrix, thereon plating alloy, heavy alloyed active area can be carried, make alloy more efficient in the application.Current nickel foam and be widely used in the fields such as the energy, chemical industry, space flight, nuclear power with its alloy being matrix.In electroplating process, due to the generation of bubble and the uneven impact of local diffusion, uneven coating usually can be made even, affect the effect of nickel foam and the Ni-based alloy product of foam.
Summary of the invention
The object of the present invention is to provide a kind of nickel foam and the Ni-based alloy plating device of foam, the impact of diffusion can be reduced, discharge bubble in time, make nickel foam and foam nickel alloy plating layer more even.
Electroplanting device of the present invention comprises reservoir, plating solution recycle pump, plating tank and power-supply system, wherein at the middle fixed foam base electrode of plating tank, fixes two pieces of anode electrodes at the edge of plating tank respectively; Plating solution in described plating tank contains single nickel salt 50-120g/L.
Further, described foam base plate electrode is connected with positive pole with the negative pole of power-supply system respectively by wire with anode electrode.
Further, described foam base plate electrode is parallel relatively with two pieces of anode electrodes 6, and apart from equal.
Further, described foam base plate electrode is polyurethane sponge base electrode.
Further, the plating solution in described plating tank is also containing nickelous chloride 20-50g/L, boric acid 20-40g/L, asccharin 0.5-2g/L.
Further, described foam base plate electrode is nickel foam base electrode.
Further, the plating solution in described plating tank is also containing rose vitriol 5-10g/L, Sodium orthomolybdate 5-10g/L, Trisodium Citrate 80-100g/L, ammoniacal liquor 10-20ml/L.
Further, the plating solution pH=9 in described plating tank.
Electroplate liquid in reservoir is transported in plating tank by plating solution recycle pump, carries out electroplating reaction, then is transmitted back in reservoir by reacted electroplate liquid, is taken out of by the gas that electroplating reaction produces simultaneously.Plating solution can be regulated to flow through the flow velocity of plating tank by plating solution recycle pump pump, and by can control the bath temperature of whole system to the control of reservoir temperature.
Beneficial effect of the present invention: electroplanting device of the present invention, owing to can in time the solution of electrode surface be mixed with bulk solution, reduce the polarization that diffusion produces, eliminate the impact that local diffusion is uneven, in time the bubble that electrode surface produces can be taken away simultaneously, make plating more even.In plating tank, electrode distance plating tank is imported and exported all certain distance, and the plating solution flowing through electrode can be made more even.
Accompanying drawing explanation
Fig. 1 is a kind of nickel foam of the present invention and foam Ni-based alloy plating device schematic diagram.
In figure, 1-reservoir, 2-plating solution recycle pump, 3-plating tank, 4-power-supply system, 5-foam base plate electrode, 6-anode electrode.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in more detail.
Embodiment 1
A kind of nickel foam and the Ni-based alloy plating device (as shown in Figure 1) of foam, foam base plate electrode 5 is fixed on the centre of plating tank 3, two pieces of anode electrodes 6 are separately fixed at the edge of plating tank 3, electrode distance plating tank is imported and exported all certain distance, foam base plate electrode 5 is connected with positive pole respectively by the negative pole of wire with power-supply system 4 with anode electrode 6, and electroplate liquid is circulated between plating tank 3 and reservoir 1 by plating solution recycle pump 2.There is current velocity controller in plating solution recycle pump 2, in reservoir 1, have temperature-control device.
Application said apparatus carries out polyurethane sponge electronickelling, and step is as follows:
1, sponge matrix preparation: by polyurethane sponge thick for 2mm after the pre-treatment such as potassium permanganate solution alligatoring, oxalic acid washing, stannous chloride solution sensitization, palladium chloride solution activation, electroless plating, obtain the polyurethane sponge base electrode with electroconductibility;
2, be anode using polyurethane sponge base electrode as negative electrode, nickel plate, be fixed in plating tank of the present invention, by Fig. 1 assembled device, solution composition is: single nickel salt 100g/L, nickelous chloride 50g/L, boric acid 40g/L, asccharin 2g/L;
3, plating solution in reservoir is heated to 40 DEG C-50 DEG C, starts recycle pump, plating solution is circulated in systems in which, start power-supply system after stable, setting current density is 0.6A/cm
2, start plating, electroplating time is 40min, and plating terminates rear powered-down, and be put back in reservoir by whole plating solution, electronickelling terminates.
Embodiment 2
A kind of nickel foam and the Ni-based alloy plating device (as shown in Figure 1) of foam, foam base plate electrode 5 is fixed on the centre of plating tank 3, two pieces of anode electrodes 6 are separately fixed at the edge of plating tank 3, electrode distance plating tank is imported and exported all certain distance, foam base plate electrode 5 is connected with positive pole respectively by the negative pole of wire with power-supply system 4 with anode electrode 6, and electroplate liquid is circulated between plating tank 3 and reservoir 1 by plating solution recycle pump 2.There is current velocity controller in plating solution recycle pump 2, in reservoir 1, have temperature-control device.
Application said apparatus carries out the Ni-based electroplated Ni MoCo alloy of foam, and step is as follows:
1, be anode using nickel foam substrate electrode as negative electrode, graphite cake, be fixed in plating tank of the present invention, by Fig. 1 assembled device, solution composition is: single nickel salt 100g/L, rose vitriol 8g/L, Sodium orthomolybdate 8g/L, Trisodium Citrate 80g/L, ammoniacal liquor 10ml/L, adjusts pH=9 with 30%NaOH;
2, start recycle pump, plating solution is circulated in systems in which, start power-supply system after stable, setting current density is 6A/cm
2, start plating, electroplating time is 1h, and plating terminates rear powered-down, and be put back in reservoir by whole plating solution, electroplated Ni MoCo alloy terminates.
Embodiment 3
Repeat embodiment 1, the plating solution just in plating tank contains single nickel salt 50g/L, nickelous chloride 20g/L, boric acid 30g/L, asccharin 0.5g/L.
Embodiment 4
Repeat embodiment 1, the plating solution just in plating tank contains single nickel salt 80g/L, nickelous chloride 30g/L, boric acid 20g/L, asccharin 1g/L.
Embodiment 5
Repeat embodiment 2, the plating solution just in plating tank contains single nickel salt, single nickel salt 120g/L, rose vitriol 5g/L, Sodium orthomolybdate 5g/L, Trisodium Citrate 100g/L, ammoniacal liquor 15ml/L.
Embodiment 6
Repeat embodiment 2, the plating solution just in plating tank contains single nickel salt, single nickel salt 150g/L, rose vitriol 10g/L, Sodium orthomolybdate 10g/L, Trisodium Citrate 90g/L, ammoniacal liquor 20ml/L.
Claims (8)
1. a nickel foam and the Ni-based alloy plating device of foam, it is characterized in that described device comprises reservoir (1), plating solution recycle pump (2), plating tank (3) and power-supply system (4), wherein the middle fixed foam base electrode (5) of plating tank (3), fix two pieces of anode electrodes (6) respectively at the edge of plating tank (3); Plating solution in described plating tank contains single nickel salt 50-120g/L.
2. a kind of nickel foam and the Ni-based alloy plating device of foam according to claim 1, it is characterized in that, described foam base plate electrode (5) is connected with positive pole respectively by the negative pole of wire with power-supply system (4) with anode electrode (6).
3. a kind of nickel foam and the Ni-based alloy plating device of foam according to claim 1, it is characterized in that, described foam base plate electrode (5) is parallel relatively with two pieces of anode electrodes (6), and apart from equal.
4. a kind of nickel foam and the Ni-based alloy plating device of foam according to claim 1, it is characterized in that, described foam base plate electrode (5) is polyurethane sponge base electrode.
5. a kind of nickel foam and the Ni-based alloy plating device of foam according to claim 1, is characterized in that, the plating solution in described plating tank is also containing nickelous chloride 20-50g/L, boric acid 20-40g/L, asccharin 0.5-2g/L.
6. a kind of nickel foam and the Ni-based alloy plating device of foam according to claim 1, it is characterized in that, described foam base plate electrode is nickel foam base electrode.
7. a kind of nickel foam and the Ni-based alloy plating device of foam according to claim 6, is characterized in that, the plating solution in described plating tank is also containing rose vitriol 5-10g/L, Sodium orthomolybdate 5-10g/L, Trisodium Citrate 80-100g/L, ammoniacal liquor 10-20ml/L.
8. a kind of nickel foam and the Ni-based alloy plating device of foam according to claim 7, is characterized in that, the plating solution pH=9 in described plating tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510834841.7A CN105401205A (en) | 2015-11-26 | 2015-11-26 | Foamed nickel and foamed nickel-based alloy plating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510834841.7A CN105401205A (en) | 2015-11-26 | 2015-11-26 | Foamed nickel and foamed nickel-based alloy plating device |
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| CN105401205A true CN105401205A (en) | 2016-03-16 |
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| CN201510834841.7A Pending CN105401205A (en) | 2015-11-26 | 2015-11-26 | Foamed nickel and foamed nickel-based alloy plating device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106629869A (en) * | 2016-11-22 | 2017-05-10 | 四川理工学院 | Co2O3 nanosheet and preparation method thereof |
| CN107119274A (en) * | 2017-05-04 | 2017-09-01 | 爱蓝天高新技术材料(大连)有限公司 | The electroplating technology and its equipment of a kind of ni-based foam silver |
| CN115992350A (en) * | 2021-10-19 | 2023-04-21 | 北京玻璃研究院有限公司 | Preparation method and device of compact and uniform gold-plated quartz optical fiber |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1614099A (en) * | 2004-09-21 | 2005-05-11 | 菏泽天宇科技开发有限责任公司 | Preparation of alloy foaming nickel |
| CN202214438U (en) * | 2011-06-07 | 2012-05-09 | 广东工业大学 | Loading device for preparing load-type photocatalytic material |
| CN102492966A (en) * | 2011-12-22 | 2012-06-13 | 菏泽天宇科技开发有限责任公司 | Foam nickel with ultra-low surface density and high aperture ratio and manufacturing method thereof |
| CN204474786U (en) * | 2015-01-19 | 2015-07-15 | 河南理工大学 | A kind of circulation of elecrolyte piping system for electrodeposition technology |
| CN204608194U (en) * | 2015-04-08 | 2015-09-02 | 天津九重开金属制品有限公司 | A kind of electroplanting device |
| CN205295509U (en) * | 2015-11-26 | 2016-06-08 | 有研粉末新材料（北京）有限公司 | Foam nickel and foam nickel base alloys electroplate device |
-
2015
- 2015-11-26 CN CN201510834841.7A patent/CN105401205A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1614099A (en) * | 2004-09-21 | 2005-05-11 | 菏泽天宇科技开发有限责任公司 | Preparation of alloy foaming nickel |
| CN202214438U (en) * | 2011-06-07 | 2012-05-09 | 广东工业大学 | Loading device for preparing load-type photocatalytic material |
| CN102492966A (en) * | 2011-12-22 | 2012-06-13 | 菏泽天宇科技开发有限责任公司 | Foam nickel with ultra-low surface density and high aperture ratio and manufacturing method thereof |
| CN204474786U (en) * | 2015-01-19 | 2015-07-15 | 河南理工大学 | A kind of circulation of elecrolyte piping system for electrodeposition technology |
| CN204608194U (en) * | 2015-04-08 | 2015-09-02 | 天津九重开金属制品有限公司 | A kind of electroplanting device |
| CN205295509U (en) * | 2015-11-26 | 2016-06-08 | 有研粉末新材料（北京）有限公司 | Foam nickel and foam nickel base alloys electroplate device |
Non-Patent Citations (2)
| Title |
|---|
| 李文珍: ""Ni-Co、Ni-Co-Mn电极的制备及其析氧性能研究"", 《中国优秀硕士学位论文全文数据库 工程科技I辑》 * |
| 王永仕: ""聚氨酯泡沫基体化学镀镍钼工艺研究"", 《中国优秀硕士学位论文全文数据库 工程科技I辑》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106629869A (en) * | 2016-11-22 | 2017-05-10 | 四川理工学院 | Co2O3 nanosheet and preparation method thereof |
| CN107119274A (en) * | 2017-05-04 | 2017-09-01 | 爱蓝天高新技术材料(大连)有限公司 | The electroplating technology and its equipment of a kind of ni-based foam silver |
| CN107119274B (en) * | 2017-05-04 | 2019-03-05 | 爱蓝天高新技术材料(大连)有限公司 | A kind of electroplating technology of ni-based foam silver |
| CN115992350A (en) * | 2021-10-19 | 2023-04-21 | 北京玻璃研究院有限公司 | Preparation method and device of compact and uniform gold-plated quartz optical fiber |
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Application publication date: 20160316 |
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