CN105563328A - Grinding and polishing system and grinding and polishing method based on femtosecond laser robot - Google Patents
Grinding and polishing system and grinding and polishing method based on femtosecond laser robot Download PDFInfo
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- CN105563328A CN105563328A CN201610098342.0A CN201610098342A CN105563328A CN 105563328 A CN105563328 A CN 105563328A CN 201610098342 A CN201610098342 A CN 201610098342A CN 105563328 A CN105563328 A CN 105563328A
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- femtosecond laser
- robot
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- grinding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/0053—Control means for lapping machines or devices detecting loss or breakage of a workpiece during lapping
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Manipulator (AREA)
Abstract
The invention discloses a grinding and polishing system and grinding and polishing method based on a femtosecond laser robot. The grinding and polishing system comprises a robot, a femtosecond laser transmitting module, a three-dimensional topography measuring device, a fixing device for mounting a workpiece, a nondestructive detecting device, an X-ray receiving end and a controller, wherein the three-dimensional topography measuring device generates a complete three-dimensional model on the surface of a machined workpiece, and transmits data of the three-dimensional model to the controller; the robot is used for controlling the femtosecond laser transmitting module to move freely, so that transmitted femtosecond laser irradiates projections and uneven parts on the surface of a material to be machined to burn the projections and the uneven parts; the nondestructive detecting device and the X-ray receiving end are matched with each other to monitor possible cracks in situ in a machining process; because femtosecond laser time is quite short and the range is small, thermal stress damage on workpieces is avoided, the machined workpieces are monitored in real time and ground and polished dynamically, polishing precision is improved, and by features of high flexibility and high repeatability of the robot, a free curved surface can be polished precisely.
Description
Technical field
Patent of the present invention belongs to material surface polishing processing field, is specifically related to a kind of based on femtosecond laser robot polishing system and grinding and polishing method.
Background technology
The contact grinding and polishing technology such as emery wheel and abrasive band that the grinding and polishing process of current maturation is mainly traditional.Conventional art cannot reach requirement for the grinding and polishing fine finishining of free form surface or general closed planar in precision, cannot eliminate the crack defect of microcosmic, and polishing overlong time.Technique is time-consuming, costly and homogeneity of product is poor, severe patient hinders the development of productivity.Robot is a kind of Mechatronic Systems with high flexibility, high repeatable accuracy.Start the grinding and polishing process for part in the industry.But robot polishing system is substantially also at grinding and polishing instrument such as use traditional emery wheel and abrasive band etc. now, cooling fluid also must be used to cool workpiece and machining tool prevent due to the excessive thermal stress damage workpiece of overheated generation in polishing processing.The polishing tool of a new generation is being studied to solve appeal problem by less research institute.And the grinding and polishing apparatus of present stage cannot accomplish the monitoring in process, work piece being carried out to real-time online mostly, cause the mistake occurred in processing just can only be found after machining, but then caused very large economic loss.
At present, CN204123252U " grinding and polishing device ", CN104608043A " a kind of Scroll-tupe is seamless polisher lapper ", the patent such as CN104084866A " a kind of belt-sanding burnishing device ", CN203738559U " a kind of grinding and polishing device " has been had about grinding and polishing.These patents are all carry out improving or being directly installed on robot arm by traditional grinding and polishing apparatus from frame for movement for the raising method of quality of finish and efficiency.Although these methods all have certain positive role to the raising quality of grinding and polishing and the efficiency of grinding and polishing, it is completely novel that these patents all do not propose one, and unprecedented polishing processing method increases substantially grinding and polishing quality.
Summary of the invention
The invention provides a kind of brand-new grinding and polishing process technology and equipment, overcome workpiece in traditional grinding and polishing process technology due to the overheated stress rupture that brings and cannot to just in grinding and polishing process workpiece carry out the problem of Real-Time Monitoring, its concrete technical scheme is:
A kind of based on femtosecond laser robot polishing system, comprise the robot of multifreedom motion, the femtosecond laser transmitter module be connected with robot free end, apparatus for measuring three-dimensional profile, the fixture of installation workpiece, the cannot-harm-detection device, X-ray receiving terminal and controller.
As improvement, in described fixture, clamping device is the professional clamping device of scroll chuck, vice, universal fixturing or custom-made, and described machine people is the robot of open loop single armed industrial robot or portal frame form.
As improvement, described apparatus for measuring three-dimensional profile is the three-dimensional measuring apparatus of the three-dimensional measuring apparatus of interference microscope principle, the three-dimensional measuring apparatus using focus detection principle or use laser light scattering principle.
As improvement, described the cannot-harm-detection device is ultrasonic nondestructive testing device.
As improvement, described processing work can be plane, positive curved surface or negative curved surface.
A kind of utilization carries out grinding and polishing method based on femtosecond laser robot polishing system to workpiece, it is characterized in that comprising the following steps:
Step one, workpiece to be processed to be fixed by clamping device in fixture, use apparatus for measuring three-dimensional profile to generate the complete threedimensional model in workpiece to be machined surface, and three-dimensional modeling data is passed to controller;
The robot controlling femtosecond laser transmitter module of step 2, recycling multifreedom motion moves freely, and the femtosecond laser that femtosecond laser transmitter module is launched irradiates the projection of material surface to be processed and uneven position;
Step 3, utilize the cannot-harm-detection device and X-ray receiving terminal to coordinate to carry out in-situ monitoring to the crackle that may occur in process, Real-time Monitoring Data is passed to controller, controller obtains accurate three-dimensional data through contrast, then drive femtosecond laser transmitter module to move freely by controller control, and accurately control femtosecond laser irradiation time and irradiation position realize the precision polishing technique of material surface.
Described workpiece to be machined material can be stainless steel, titanium alloy, aluminium alloy, engineering plastics or natural crystal.
Operation principle of the present invention is: during work, will the workpiece of grinding and polishing be needed fixing on the securing means.Apparatus for measuring three-dimensional profile is utilized to carry out real-time topography measurement to workpiece.Generate the threedimensional model of workpiece, import in controller computer.The femtosecond laser transmitter module be fixed on robot free end arm launches femtosecond laser, according to the air spots and the position, protruding part that are calculated required removing by the formula in controller computer, the high flexibility of robot arm is utilized to need arbitrarily polished surface position by laser alignment workpiece.Utilize femtosecond laser pulse width very short to such an extent as to heat energy has little time the region that is diffused into beyond laser spot, the heat energy of deposition is limited at the characteristic of the shallow region of metal surface, makes metal under superenergy through molten state direct gasification.Even material in absorb photons because the electron temperature that generates causes it finally to become the plasmoid of high density, superthermal, high pressure far away after the energy produced higher than gasification temperature.Laser and the metal interaction time very short, the structural edge be lasered almost is not damaged and processing district is inner just terminates owing to having little time to absorb heat processing, therefore can not produce excessive thermal stress damage workpiece.Need the metal surface of polishing all to repeat this process at other, just can reach the object of meticulous polished metal surface.And in process, use in-situ monitoring technology to carry out real time on-line monitoring to the work piece in processing, feed back processing situation to control system and operator in time, whether control system and operator can be correct according to in-situ monitoring feedack determination process operation.
The invention has the beneficial effects as follows:
1, owing to employing Multi-freedom-degreemanipulator manipulator arm, this device can process the free form surface with complex curvatures distribution that other common grinding and polishing equipment can not be processed.
2, carry out grinding and polishing means owing to employing femtosecond laser, this device can avoid the workpiece that may occur in other common grinding and polishing equipment process and process equipment superheating phenomenon, therefore workpiece and process equipment can not be subject to the harm of thermal stress in process.
3, carry out grinding and polishing means owing to employing femtosecond laser, this device has the machining accuracy apparently higher than other common grinding and polishing apparatus.
Accompanying drawing explanation
Fig. 1 is the overall schematic of patent of the present invention;
Fig. 2 is the schematic diagram using patent of the present invention workpiece to be processed to be carried out to surperficial grinding and polishing;
Fig. 3 is the schematic diagram using patent of the present invention to process negative surface piece.
1 robot, 2 femtosecond laser transmitter modules, 3 apparatus for measuring three-dimensional profile, 4 fixtures, 5 the cannot-harm-detection devices, 6X ray receipt end, 7 bases, 8 workpiece, 9 negative surface piece.
Detailed description of the invention
Below in conjunction with accompanying drawing, patent of the present invention is described further
As shown in the figure, a kind of based on femtosecond laser robot polishing system, the femtosecond laser transmitter module 2, apparatus for measuring three-dimensional profile 3, the fixture 4 of installing workpiece, the cannot-harm-detection device 5, X-ray receiving terminal 6 and the controller that comprise the robot 1 of multifreedom motion, are connected with robot free end.
Described robot 1, for mobile femtosecond laser transmitter module 2, makes it position alignment pieces needing carry out grinding and polishing.Shown in accompanying drawing is industrial machine arm, but as required, also can select the carrier of the various ways such as portal frame.
Described femtosecond laser transmitter module 2 is for launching femtosecond laser.
Described apparatus for measuring three-dimensional profile 3 is for the formation of the complete three-dimensional model on workpiece to be processed surface, and it can be the three-dimensional measuring apparatus of the three-dimensional measuring apparatus of interference microscope principle, the three-dimensional measuring apparatus using focus detection principle or use laser light scattering principle.
The fixture 4 of described installation workpiece is for fixing workpiece to be processed.In fixture 4 shown in figure, clamping device is cantilever beam form, but in a particular application, can change its form according to actual needs.
Described processing work can be plane, positive curved surface or negative curved surface.
This figure for convenience of explanation, select X-ray the cannot-harm-detection device and do in-situ monitoring device by described the cannot-harm-detection device 5.
Described X-ray receiving terminal 6 to be launched by the X-ray emitting head of the cannot-harm-detection device 5 for receiving and to have passed through the X-ray of workpiece to be machined.
Described base 7 is the fixture 4 supporting described X-ray receiving terminal 6 and fixing workpiece to be machined.
A kind of utilization carries out grinding and polishing method based on femtosecond laser robot polishing system to workpiece, it is characterized in that comprising the following steps:
Step one, workpiece to be processed to be fixed by clamping device in fixture 4, use apparatus for measuring three-dimensional profile 3 to generate the complete threedimensional model in workpiece to be machined surface, and three-dimensional modeling data is passed to controller;
The robot 1 of step 2, recycling multifreedom motion controls femtosecond laser transmitter module 2 and moves freely, and the femtosecond laser that femtosecond laser transmitter module 2 is launched irradiates the projection of material surface to be processed and uneven position;
Step 3, utilize the cannot-harm-detection device 5 and X-ray receiving terminal 6 to coordinate to carry out in-situ monitoring to the crackle that may occur in process, Real-time Monitoring Data is passed to controller, controller obtains accurate three-dimensional data through contrast, then drive femtosecond laser transmitter module 2 to move freely by controller control 1, and accurately control femtosecond laser irradiation time and irradiation position realize the precision polishing technique of material surface.
Described workpiece to be machined material can be stainless steel, titanium alloy, aluminium alloy, engineering plastics or natural crystal.
Embodiment 1
As shown be the schematic diagram utilizing patent of the present invention to process the aviation common metal material work piece 8 be fixed in fixture 4.Because patent of the present invention adopts apparatus for measuring three-dimensional profile 3 to generate workpiece 8 full surface model to be processed, and automatically calculated the position coordinates needing to carry out grinding and polishing by controller computer, so the precision of polishing processing is better than the artificial processing method utilizing range estimation to determine Working position.Traditional polishing processing uses the grinding and polishing such as abrasive band or emery wheel instrument, has the range of work excessive, and machining accuracy such as to come and go at the shortcoming.And patent of the present invention uses femtosecond laser to make material direct gasification even ionize to reach processing object, just have the advantage that machining damage is little and machining accuracy is high.The time completing processing due to femtosecond laser is very short, after causing machining, material around processing district does not absorb how many heats and is in " cold " state, the impact that substantially can not be subject to processing, therefore can obtain processing the carrot-free processing district of the smooth of the edge, this is the reason using patent of the present invention to have machining damage this advantage little.And simultaneously, because femtosecond laser energy presents Gaussian Profile, in processing, the absorption of energy and effect are limited in the volume very little with focus center, and processing yardstick can reach micron order to sub-submicron order, the machining accuracy height very of this that is patent of the present invention.If do not use patent of the present invention to carry out polishing processing to material, then use traditional polishing processing means, the precision after processing can decline greatly.And the part on side, area to be machined also can receive the impact of processing, produce the change of distortion or internal crystal framework owing to being heated.As what be mentioned before, the multivariant robot 1 of patent of the present invention controls the motion of femtosecond laser transmitter module 2, has the feature of high flexibility.Have in complex-curved work pieces process, robot 1 arm of high flexibility can make generating laser aim at the position needing arbitrarily processing.And if use traditional grinding and polishing apparatus, then need mobile after one piece of region grinding and polishing or rotate workpiece to be processed, taking time and effort.And the in-situ monitoring system that the cannot-harm-detection device 5 ray emission head and X-ray receiving terminal 6 ray receipt end form can realize the real time on-line monitoring to processing work, feed back processing situation to control system and operator in time, whether control system and operator can be correct according to in-situ monitoring feedack determination process operation.
Embodiment 2
As shown in drawings for using negative surface piece 9 schematic diagram on patent fixer for machining 4 of the present invention.Because patent of the present invention uses femtosecond laser to irradiate as manufacturing process, energy has Gaussian distribution feature.Cause the absorption of energy in processing and effect to be limited in the volume very little with focus center, the yardstick of processing can reach micron order to sub-submicron order.This characteristic makes the workpiece using patent of the present invention processing to have negative surface be very easy to.Tradition grinding and polishing technology, when processing negative surface, often needs the less processing unit (plant) of match ratio work surface curvature to ensure the laminating of workpiece to be processed and processing unit (plant).If curved surface more complicated, then need the grinding and polishing equipment preparing many different curvature.And patent of the present invention is owing to employing femtosecond laser, when processing negative surface, difficulty of processing does not have great difference with the positive curved surface of processing, only needs to utilize robot 1 arm femtosecond laser transmitter module 2 to be aimed at the position of needs processing.So, there is the workpiece on negative surface if do not use patent of the present invention to process and use traditional grinding and polishing method, free form surface for different curvature needs different grinding and polishing emery wheels to process, and processing cost will improve greatly and difficulty of processing also will improve greatly.
Claims (7)
1. based on a femtosecond laser robot polishing system, the femtosecond laser transmitter module (2), apparatus for measuring three-dimensional profile (3), the fixture (4) of installing workpiece, the cannot-harm-detection device (5), X-ray receiving terminal (6) and the controller that comprise the robot (1) of multifreedom motion, are connected with robot free end.
2. a kind of based on femtosecond laser robot polishing system as claimed in claim 1, it is characterized in that: the upper clamping device of described fixture (4) is the professional clamping device of scroll chuck, vice, universal fixturing or custom-made, the robot that described robot (1) is open loop single armed industrial robot or portal frame form.
3. a kind of based on femtosecond laser robot polishing system as claimed in claim 1, it is characterized in that: the three-dimensional measuring apparatus of the three-dimensional measuring apparatus that described apparatus for measuring three-dimensional profile (3) is interference microscope principle, the three-dimensional measuring apparatus using focus detection principle or use laser light scattering principle.
4. a kind of based on femtosecond laser robot polishing system as claimed in claim 1, it is characterized in that: described the cannot-harm-detection device (5) is ultrasonic nondestructive testing device.
5. a kind of based on femtosecond laser robot polishing system as claimed in claim 1, it is characterized in that: described processing work can be plane, positive curved surface or negative curved surface.
6. utilize described in claim 1, based on femtosecond laser robot polishing system, a grinding and polishing method carried out to workpiece, it is characterized in that comprising the following steps:
Step one, workpiece to be processed to be fixed by the upper clamping device of fixture (4), use apparatus for measuring three-dimensional profile (3) to generate the complete threedimensional model in workpiece to be machined surface, and three-dimensional modeling data is passed to controller;
The robot (1) of step 2, recycling multifreedom motion controls femtosecond laser transmitter module (2) and moves freely, and the femtosecond laser that femtosecond laser transmitter module (2) is launched irradiates the projection of material surface to be processed and uneven position;
Step 3, utilize the cannot-harm-detection device (5) and X-ray receiving terminal (6) to coordinate to carry out in-situ monitoring to the crackle that may occur in process, Real-time Monitoring Data is passed to controller, controller obtains accurate three-dimensional data through contrast, then drive femtosecond laser transmitter module (2) to move freely by controller control (1), and accurately control femtosecond laser irradiation time and irradiation position realize the precision polishing technique of material surface.
7. a kind of based on femtosecond laser robot grinding and polishing method as claimed in claim 6, it is characterized in that: described workpiece to be machined material can be stainless steel, titanium alloy, aluminium alloy, engineering plastics or natural crystal.
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| CN201610098342.0A CN105563328A (en) | 2016-02-23 | 2016-02-23 | Grinding and polishing system and grinding and polishing method based on femtosecond laser robot |
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| CN201610098342.0A CN105563328A (en) | 2016-02-23 | 2016-02-23 | Grinding and polishing system and grinding and polishing method based on femtosecond laser robot |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107253100A (en) * | 2017-08-02 | 2017-10-17 | 武汉大学 | The system and method that a kind of utilization magnetic field and laser are ground to wafer |
| CN107424921A (en) * | 2017-08-02 | 2017-12-01 | 武汉大学 | A kind of wafer chemical grinding system and method |
| CN107452607A (en) * | 2017-08-02 | 2017-12-08 | 武汉大学 | A kind of wafer laser grinding system and method |
| CN107661982A (en) * | 2016-07-29 | 2018-02-06 | 上海微电子装备（集团）股份有限公司 | Metal 3D printing system and Method of printing |
| CN110125734A (en) * | 2019-06-11 | 2019-08-16 | 广东工业大学 | A kind of mechanical arm assisted electrolysis matter plasma burnishing device and polishing method |
| CN110146204A (en) * | 2019-05-16 | 2019-08-20 | 广东镭奔激光科技有限公司 | A kind of intelligent residual stress x-ray measuring device and its measurement method |
| CN110375901A (en) * | 2019-07-05 | 2019-10-25 | 东莞材料基因高等理工研究院 | X-ray stress detector and measurement method, storage medium for complex surface |
| CN110695534A (en) * | 2019-11-01 | 2020-01-17 | 北京航空航天大学 | Laser processing method for efficient high-precision grinding and polishing complex die |
| CN112372142A (en) * | 2020-11-03 | 2021-02-19 | 河北工业大学 | Femtosecond laser cleaning method for 3D printing metal surface |
| CN112440203A (en) * | 2019-09-03 | 2021-03-05 | 芯恩（青岛）集成电路有限公司 | Wafer grinding system and wafer grinding method |
| CN114371184A (en) * | 2022-01-14 | 2022-04-19 | 北京工业大学 | Method for representing microstructure evolution of IGBT chip bonding region |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110375901A (en) * | 2019-07-05 | 2019-10-25 | 东莞材料基因高等理工研究院 | X-ray stress detector and measurement method, storage medium for complex surface |
| CN110375901B (en) * | 2019-07-05 | 2022-01-25 | 东莞材料基因高等理工研究院 | X-ray stress measuring instrument and method for complex surface and storage medium |
| CN112440203A (en) * | 2019-09-03 | 2021-03-05 | 芯恩（青岛）集成电路有限公司 | Wafer grinding system and wafer grinding method |
| CN112440203B (en) * | 2019-09-03 | 2022-04-05 | 芯恩（青岛）集成电路有限公司 | Wafer grinding system and wafer grinding method |
| CN110695534A (en) * | 2019-11-01 | 2020-01-17 | 北京航空航天大学 | Laser processing method for efficient high-precision grinding and polishing complex die |
| CN112372142A (en) * | 2020-11-03 | 2021-02-19 | 河北工业大学 | Femtosecond laser cleaning method for 3D printing metal surface |
| CN114371184A (en) * | 2022-01-14 | 2022-04-19 | 北京工业大学 | Method for representing microstructure evolution of IGBT chip bonding region |
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Application publication date: 20160511 |