CN105555056A - Circuit board dip soldering process - Google Patents
Circuit board dip soldering process Download PDFInfo
- Publication number
- CN105555056A CN105555056A CN201511003523.2A CN201511003523A CN105555056A CN 105555056 A CN105555056 A CN 105555056A CN 201511003523 A CN201511003523 A CN 201511003523A CN 105555056 A CN105555056 A CN 105555056A
- Authority
- CN
- China
- Prior art keywords
- wiring board
- tin
- solder
- scaling powder
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
Abstract
The invention discloses a circuit board dip soldering process, characterized by comprising the following steps: (1) preparation work: adjusting temperature of a solder pot properly and starting an exhaust fan; (2) soaking with soldering flux: soaking a circuit board in the soldering flux for about 1s and then lifting up; (3) soldering: dipping the circuit board in the solder pot for soldering, wherein soldering time is not more than 3s; and (4) inspection: inspecting soldering effect for solder skips, cold solder joint and short circuit and checking whether welding spots are bright and smooth; reworking if any unqualified phenomenon exists.
Description
Technical field
The present invention relates to a kind of soldering process, particularly relate to a kind of wiring board solder dip process.
Background technology
In the assembling production process of electronic product, usually need electronic component to be arranged on after on pcb board (printed circuit board (PCB)), then by welding, electronic component is fixed on pcb board.Welding method conventional at present mainly contains immersed solder, wave-soldering, Reflow Soldering etc., for the pcb board adopting through-hole mounting, or based on immersed solder.Immersed solder is exactly by the pcb board of good for plug-in mounting electronic component wicking in the tin stove of fusing, once completes the method for numerous solder joint welding.
Summary of the invention
The object of this invention is to provide a kind of medicinal liquor, in order to treat or to alleviate the various diseases caused of suffering from a deficiency of the kidney.
A kind of wiring board solder dip process, comprises the steps:
(1) preparation: mix up tin furnace temperature, opens ventilating fan;
(2) scaling powder is soaked: wiring board is put into scaling powder and soaks about 1s, mention;
(3) upper tin: wiring board is immersed tin on tin stove, the upper tin time is no more than 3s;
(4) check: inspections in, whether tin has solder skip, rosin joint, short circuit phenomenon, whether solder joint is bright, smoothly, undesirablely does over again.
Further, described tin furnace temperature presses 250-270 DEG C of controls winter, presses 240-260 DEG C of control summer.
Further, when wiring board takes out from scaling powder or tin stove, wiring board and horizontal plane be angle be 20-30 °.
Further, first sponge being immersed in scaling powder and soak into, after taking-up, wiring board being put on sponge, with defeating.
Further, in tin coating procedure, according to the situation of Xi Shui, the impurity on its surface should be scraped off every a period of time.
Embodiment
Understand below technical scheme of the present invention to make those skilled in the art that the invention will be further described better:
Embodiment one:
A kind of wiring board solder dip process, comprises the steps:
(1) preparation: mix up tin furnace temperature, described tin furnace temperature presses 250-270 DEG C of controls winter, presses 240-260 DEG C of control summer, and opens ventilating fan;
(2) scaling powder is soaked: wiring board is put into scaling powder and soaks about 1s, mention;
(3) upper tin: wiring board is immersed tin on tin stove, the upper tin time is no more than 3s;
(4) check: inspections in, whether tin has solder skip, rosin joint, short circuit phenomenon, whether solder joint is bright, smoothly, undesirablely does over again.
Further, when wiring board takes out from scaling powder or tin stove, wiring board and horizontal plane be angle be 20-30 °.
In the present embodiment, in tin coating procedure, according to the situation of Xi Shui, the impurity on its surface should be scraped off every a period of time.
For the efficiency of the solder dip process that checking the present invention proposes, acquire three groups of data, as follows:
Wherein qualified standard is: wiring board is without solder skip, rosin joint, short circuit phenomenon, and solder joint is bright, level and smooth.
Embodiment two:
A kind of wiring board solder dip process, comprises the steps:
(1) preparation: mix up tin furnace temperature, described tin furnace temperature presses 250-270 DEG C of controls winter, presses 240-260 DEG C of control summer, and opens ventilating fan;
(2) scaling powder is soaked: first immersed in scaling powder by sponge and soak into, after taking-up, be put in by wiring board on sponge, with defeating, the time of contact of wiring board and sponge is about 1s;
(3) upper tin: wiring board is immersed tin on tin stove, the upper tin time is no more than 3s;
(4) check: inspections in, whether tin has solder skip, rosin joint, short circuit phenomenon, whether solder joint is bright, smoothly, undesirablely does over again.
Further, when wiring board takes out from scaling powder or tin stove, wiring board and horizontal plane be angle be 20-30 °.
Further, in tin coating procedure, according to the situation of Xi Shui, the impurity on its surface should be scraped off every a period of time.
For the efficiency of the solder dip process that checking the present invention proposes, acquire three groups of data, as follows:
Wherein qualified standard is: wiring board is without solder skip, rosin joint, short circuit phenomenon, and solder joint is bright, level and smooth.
According to the data in form, in three groups, what first-time qualification rate was the highest reaches 97.78%, and average first-time qualification rate is 97.34%; After doing over again, secondary qualification rate all more than 99.6%, all higher than industry level.
Mode above only by illustrating describes some one exemplary embodiment of the present invention, undoubtedly, for those of ordinary skill in the art, when without departing from the spirit and scope of the present invention, can revise described embodiment by various different mode.Therefore, foregoing description is illustrative in itself, should not be construed as the restriction to the claims in the present invention protection range.
Claims (5)
1. a wiring board solder dip process, is characterized in that, comprises the steps:
(1) preparation: mix up tin furnace temperature, opens ventilating fan;
(2) scaling powder is soaked: wiring board is put into scaling powder and soaks about 1s, mention;
(3) upper tin: wiring board is immersed tin on tin stove, the upper tin time is no more than 3s;
(4) check: inspections in, whether tin has solder skip, rosin joint, short circuit phenomenon, whether solder joint is bright, smoothly, undesirablely does over again.
2. a kind of wiring board solder dip process according to claim 1, is characterized in that, described tin furnace temperature presses 250-270 DEG C of controls winter, presses 240-260 DEG C of control summer.
3. a kind of wiring board solder dip process according to claim 1, is characterized in that, when wiring board takes out from scaling powder or tin stove, wiring board and horizontal plane be angle be 20-30 °.
4. a kind of wiring board solder dip process according to claim 1, is characterized in that, described immersion scaling powder step is: first immersed in scaling powder by sponge and soak into, and after taking-up, is put in by wiring board on sponge, with defeating.
5. a kind of wiring board solder dip process according to claim 1, is characterized in that, in tin coating procedure, according to the situation of Xi Shui, should scrape off the impurity on its surface every a period of time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511003523.2A CN105555056A (en) | 2015-12-26 | 2015-12-26 | Circuit board dip soldering process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511003523.2A CN105555056A (en) | 2015-12-26 | 2015-12-26 | Circuit board dip soldering process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105555056A true CN105555056A (en) | 2016-05-04 |
Family
ID=55833911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511003523.2A Pending CN105555056A (en) | 2015-12-26 | 2015-12-26 | Circuit board dip soldering process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105555056A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106852018A (en) * | 2017-01-13 | 2017-06-13 | 昆山福烨电子有限公司 | A kind of immersed solder method of printed circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102122786A (en) * | 2010-12-15 | 2011-07-13 | 实盈电子(东莞)有限公司 | Soldering and mounting method of electric connector |
| CN202052674U (en) * | 2011-04-25 | 2011-11-30 | 山东康洋电源有限公司 | Soldering flux dip-coating device of charger circuit board |
| CN202461744U (en) * | 2012-01-11 | 2012-10-03 | 深圳市广晟德科技发展有限公司 | Dip-soldering type automatic soldering machine |
-
2015
- 2015-12-26 CN CN201511003523.2A patent/CN105555056A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102122786A (en) * | 2010-12-15 | 2011-07-13 | 实盈电子(东莞)有限公司 | Soldering and mounting method of electric connector |
| CN202052674U (en) * | 2011-04-25 | 2011-11-30 | 山东康洋电源有限公司 | Soldering flux dip-coating device of charger circuit board |
| CN202461744U (en) * | 2012-01-11 | 2012-10-03 | 深圳市广晟德科技发展有限公司 | Dip-soldering type automatic soldering machine |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106852018A (en) * | 2017-01-13 | 2017-06-13 | 昆山福烨电子有限公司 | A kind of immersed solder method of printed circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103096631B (en) | A kind of PCB processing method and pcb board | |
| CN102387671B (en) | Manufacturing method for single face windowing hole plugging of tin spayed plate | |
| WO2006032006A3 (en) | Dual additive soldering | |
| CN101982288B (en) | Organic copper solderability preservative having selective film forming function and use method thereof | |
| CN103111773A (en) | Scaling powder for lead-free solder paste | |
| CN104439751A (en) | Novel low-melting-point lead-free solder | |
| JP2015135906A (en) | Printed wiring board and information processing apparatus | |
| CN107877031A (en) | A kind of lead-free low-temperature solder and preparation method thereof | |
| CN111654981A (en) | SMT reflow soldering process of PCBA flexible circuit board | |
| CN105555056A (en) | Circuit board dip soldering process | |
| CN101784165B (en) | Treatment method of corrosion-resistant weldable coating layer of printed circuit board | |
| CN107617832A (en) | Anti- fried soldering tin cream scaling powder and preparation method thereof | |
| JPH04143094A (en) | Flux for soldering | |
| US8263177B2 (en) | Organic polymer coating for protection against creep corrosion | |
| JP2008306029A (en) | Reflow soldering method for printed circuit board using conductive paint | |
| CN205105452U (en) | Printed circuit board PCB based on organic protection film OSP technology | |
| JP2015205293A (en) | Solder paste, method for manufacturing electronic device, and electronic device | |
| CN107150186A (en) | A kind of antioxygen infiltration solder(ing) paste and preparation method thereof | |
| CN201256490Y (en) | Heat tolerant tray for printed circuit board wave peak and reflow soldering | |
| CN106658991A (en) | Mounting process for camera chip element | |
| Guéné | Solderability and reliability evolution of no clean solder fluxes for selective soldering | |
| CN106231813A (en) | A kind of one side the most empty method of backflow of dual platen | |
| CN108526758A (en) | Solder(ing) paste scaling powder and preparation method thereof | |
| CN204818358U (en) | Device of simulation backward flow brazier holds container | |
| CN110977250A (en) | Soldering flux and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160504 |
|
| RJ01 | Rejection of invention patent application after publication |