CN105538120A - Device for polishing SMT laser template - Google Patents
Device for polishing SMT laser template Download PDFInfo
- Publication number
- CN105538120A CN105538120A CN201610122207.5A CN201610122207A CN105538120A CN 105538120 A CN105538120 A CN 105538120A CN 201610122207 A CN201610122207 A CN 201610122207A CN 105538120 A CN105538120 A CN 105538120A
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- CN
- China
- Prior art keywords
- polishing
- liquid cartridge
- fluid
- base plate
- fluid apertures
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
Abstract
The invention discloses a device for polishing an SMT laser template. The device comprises a polishing box body, a box cover, a fiber sleeve, an upper liquid supply box and a lower liquid supply box. An opening part is formed in one face of the polishing box body. A hollow cavity is formed in the fiber sleeve. The upper liquid supply box is fixed to the upper end face of a top plate of the polishing box body. The lower liquid supply box is fixed to the lower end face of a bottom plate of the polishing box body. A plurality of upper liquid supply holes are formed in the bottom plate of the upper liquid supply box. A plurality of upper liquid passing holes corresponding to the upper liquid supply holes are formed in the top plate of the polishing box body. Upper liquid passing pipes are connected between the upper liquid passing holes and the upper liquid supply holes. A plurality of lower liquid supply holes are formed in a bottom plate of the lower liquid supply box. A plurality of lower liquid passing holes corresponding to the lower liquid supply holes are formed in the bottom plate of the polishing box body. Lower liquid passing pipes are connected between the lower liquid passing holes and the lower liquid supply holes. The consumption of polishing liquid can be effectively saved, and production cost is reduced.
Description
Technical field:
The present invention relates to the technical field of SMT laser template equipment, specifically relate to a kind of device for carrying out polishing to SMT laser template.
Background technology:
Surface mounting technology (SMT) is the mainstream technology of current Electronic products manufacturing.All need to use printing stencil before electronic component attachment flow process, the preparation method of printing stencil has method for chemially etching and laser cutting method.The template of laser cutting is commonly called SMT laser template, and it has positional precision high, but outer surface after cutting and hole wall exist the effect that certain burr and roughness can affect print solder paste.Because SMT laser template is general thinner, and its hole is also less, conventional removal burr the method for polishing, as mechanical grinding etc., all inapplicable.Existing chemical immersion method is generally adopted to the method that SMT laser template carries out polishing, in polishing process, only need inject polishing fluid in container, to the laser template carrying out polishing be needed to pour in polishing fluid again, polishing process is comparatively simple, but its defect existed is: in polishing process, need in container, to inject a large amount of polishing fluids to flood laser template, the use amount of polishing fluid is comparatively large, adds production cost.
Summary of the invention:
Object of the present invention is intended to solve prior art Problems existing, provides a kind of use amount effectively can saving polishing fluid, reduces the device for carrying out polishing to SMT laser template of production cost.
The present invention relates to a kind of device for carrying out polishing to SMT laser template, comprise polishing casing, case lid, fibre sleeving, upper liquid cartridge and lower liquid cartridge;
Described polishing casing comprises top board, base plate and three side plates, the one side of polishing casing has opening portion, described case lid is hinged on the lower end of described opening portion, described case lid comprises cover plate and is molded over the square grafting bar at an edge of described cover plate, the polishing casing on opening portion forms the square groove coordinated with described grafting bar;
Described fibre sleeving has a cavity, and fibre sleeving is fixed on the inwall of polishing casing, and the one end in the corresponding polishing box opening portion of fibre sleeving has corresponding opening;
Described upper liquid cartridge is fixed on the upper surface of the top board of polishing casing, described lower liquid cartridge is fixed on the lower surface of the base plate of polishing casing, the base plate of upper liquid cartridge form some upper for fluid apertures, the top board of described polishing casing forms the some and described upper upper liquid-through hole corresponding for fluid apertures, described upper liquid-through hole and upper confession are connected with upper fluid-through tube between fluid apertures, the lower ending opening of described upper fluid-through tube faces toward the upper end of fibre sleeving, the base plate of lower liquid cartridge form some lower to fluid apertures, the base plate of described polishing casing forms the some and described lower lower liquid-through hole corresponding for fluid apertures, described lower liquid-through hole and lower confession are connected with lower fluid-through tube between fluid apertures, the lower ending opening of described lower fluid-through tube faces toward the lower end of fibre sleeving, the open top of upper liquid cartridge, lower liquid cartridge is one is enclosed box body, and lower liquid cartridge offers lower inlet, described lower inlet is connected with lower feed tube, described lower feed tube is connected with compression pump.
By technique scheme, burnishing device of the present invention in use, first polished SMT laser template is inserted the cavity of fibre sleeving from the opening portion of polishing casing, after inserting described laser template, rotating case lid makes cover plate upwards rotate around the hinged place with polishing casing, until the square grafting bar on case lid inserts in the square groove of polishing casing, case lid is made to be covered by polishing casing opening like this, and the mating reaction of square cutting and square groove makes polishing bin enclosure, the polishing fluid in polishing casing is avoided to flow out, polishing fluid is added in the open top of then upward liquid supply box, polishing fluid enters in upper fluid-through tube from the confession fluid apertures of the base plate of upper liquid cartridge, the upper surface flowing to fibre sleeving again along the upper liquid-through hole of upper fluid-through tube and polishing casing is absorbed by fibre sleeving, the lower feed tube be connected with lower liquid cartridge is communicated with polishing fluid source, polishing fluid is pumped into the lower inlet of lower liquid cartridge by compression pump from lower feed tube, enter in lower liquid cartridge from lower inlet again, polishing fluid in lower liquid cartridge is by the lower lower surface flowing to fibre sleeving for fluid apertures again along lower fluid-through tube and lower liquid-through hole is absorbed by fibre sleeving, thus the whole fibre sleeving being adsorbed with polishing fluid is tightly coated on laser template, be drained on laser template by the polishing fluid in upper liquid cartridge and lower liquid cartridge, thus achieve the outer surface polishing of laser template.
By such scheme, the present invention, by the drainage of fibre sleeving, effectively can save the use amount of polishing fluid, reduces production cost.
One as such scheme is preferred, the described upper quantity for fluid apertures is five, wherein, four upper feed flow pore size distributions are on four angles of the base plate of upper liquid cartridge, a upper feed flow pore size distribution is at the middle part of the base plate of upper liquid cartridge, the base plate of upper liquid cartridge forms five grooves, described five upper feed flow pore size distributions are arranged on the bottom of described five grooves; The described lower quantity for fluid apertures is five, and wherein, four lower feed flow pore size distributions are on four angles of the base plate of lower liquid cartridge, and a lower feed flow pore size distribution is at the middle part of the base plate of lower liquid cartridge.By such scheme, five upper for supplying the position distribution mode of fluid apertures on upper liquid cartridge and lower liquid cartridge to drain on fibre sleeving by polishing fluid equably under fluid apertures and five, thus avoid the problem that fibre sleeving local is not adsorbed with polishing fluid occurring, advantages of good adsorption effect; Upper feed flow pore size distribution, on groove, can make polishing fluid like this because Action of Gravity Field flows out from in fluid apertures effectively.
One as such scheme is preferred, the sidewall of described upper liquid cartridge forms inlet, upper liquid outlet, the first inductor and the second inductor, described upper inlet is positioned at the top of upper liquid outlet, described first inductor arranges near upper inlet and is positioned at the below of upper inlet, and described second inductor arranges near upper liquid outlet and is positioned at the top of upper liquid outlet; Described lower liquid cartridge forms lower liquid outlet.By such scheme, upwards inlet and lower inlet inject polishing fluid, upper liquid outlet and lower liquid outlet are used for unnecessary polishing fluid to discharge, when the polishing fluid in upper liquid cartridge reach the highest liquid level time, first inductor sends alarm signal, stop injecting polishing fluid in upward liquid supply box, when the polishing fluid in upper liquid cartridge is in minimum liquid level, second inductor sends alarm signal, by injecting polishing fluid in upper inlet upward liquid supply box, thus the polishing fluid in upper liquid cartridge can be at every moment adsorbed on laser template by fibre sleeving carry out polishing operation.
One as such scheme is preferred, and described case lid is hinged on the sidewall of the base plate of polishing casing.
One as such scheme is preferred, and described fibre sleeving adopts paper pulp fiber to make.
One as such scheme is preferred, and the cover plate wall of described case lid is provided with sealing gasket.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to better understand technological means of the present invention, and can be implemented according to the content of description, coordinates accompanying drawing to be described in detail as follows below with preferred embodiment of the present invention.
Accompanying drawing illustrates:
The following drawings is only intended to schematically illustrate the present invention and explain, not delimit the scope of the invention.Wherein:
Fig. 1 is structural representation of the present invention;
Fig. 2 is the structural representation of the base plate of upper liquid cartridge in the present invention;
Fig. 3 is the structural representation in the present invention between polishing casing and case lid;
Fig. 4 is the structural representation of case lid in the present invention.
Detailed description of the invention:
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is described in further detail.Following examples for illustration of the present invention, but are not used for limiting the scope of the invention.
See Fig. 1, Fig. 3, Fig. 4, a kind of device for carrying out polishing to SMT laser template of the present invention, comprise polishing casing 1, case lid 2, fibre sleeving 3, upper liquid cartridge 4 and lower liquid cartridge 5, described polishing casing 1 comprises top board 11, base plate 12 and three side plates 13, the one side of polishing casing 1 has opening portion 14, described case lid 2 is hinged on the sidewall of base plate 12 of polishing casing 2, case lid 2 comprises cover plate 21 and is molded over the square grafting bar 22 at an edge of described cover plate, polishing casing 1 on opening portion 14 forms the square groove 15 coordinated with described grafting bar 22, described cover plate 21 wall is provided with sealing gasket (not shown).
See Fig. 1, described fibre sleeving 3 adopts paper pulp fiber to make, and fibre sleeving 3 has a cavity 31, and fibre sleeving 3 is fixed on the inwall of polishing casing 1, and the one end in fibre sleeving 3 corresponding polishing box opening portion 14 has corresponding opening.
See Fig. 1, described upper liquid cartridge 4 is fixed on the upper surface of top board 11 of polishing casing 1, described lower liquid cartridge 5 is fixed on the lower surface of base plate 12 of polishing casing 1, the base plate of upper liquid cartridge 4 form some upper for fluid apertures 41, the top board 11 of described polishing casing 1 forms the some and described upper upper liquid-through hole 111 corresponding for fluid apertures 41, described upper liquid-through hole 111 and upper confession are connected with upper fluid-through tube 6 between fluid apertures 41, the lower ending opening of described upper fluid-through tube 6 faces toward the upper end of fibre sleeving 3, the base plate of lower liquid cartridge 5 form some lower to fluid apertures 51, the base plate 12 of described polishing casing 1 forms the some and described lower lower liquid-through hole 121 corresponding for fluid apertures 51, described lower liquid-through hole 121 and lower confession are connected with lower fluid-through tube 7 between fluid apertures 51, the lower ending opening of described lower fluid-through tube 7 faces toward the lower end of fibre sleeving 3, the open top of upper liquid cartridge 4, lower liquid cartridge 5 is one is enclosed box body, and lower liquid cartridge 5 offers lower inlet 52, described lower inlet 52 is connected with lower feed tube 8, described lower feed tube 52 is connected with compression pump 9.
See Fig. 2, the described upper quantity for fluid apertures 41 is five, wherein, four upper fluid apertures 41 that supply are distributed on four angles of the base plate of liquid cartridge 4, a upper middle part being distributed in the base plate of liquid cartridge 4 for fluid apertures 41, the base plate of upper liquid cartridge 4 forms five grooves 42, described five upper bottoms being arranged on described five grooves 42 for fluid apertures 41 distribution; The described lower quantity for fluid apertures 51 is five, wherein, is distributed on four angles of the base plate of lower liquid cartridge 5 under four for fluid apertures 51, is distributed in the middle part of the base plate of lower liquid cartridge 5 under one for fluid apertures 51.
See Fig. 1, the sidewall of described upper liquid cartridge 4 forms inlet 43, upper liquid outlet 44, first inductor 10 and the second inductor 20, described upper inlet 43 is positioned at the top of upper liquid outlet 44, described first inductor 10 arranges near upper inlet 43 and is positioned at the below of upper inlet 43, and described second inductor 20 arranges near upper liquid outlet 44 and is positioned at the top of upper liquid outlet 44; Described lower liquid cartridge 5 forms lower liquid outlet 53.
Burnishing device of the present invention in use, first polished SMT laser template is inserted the cavity 31 of fibre sleeving 3 from the opening portion 14 of polishing casing 1, after inserting described laser template, rotating case lid 2 makes cover plate 21 upwards rotate around the hinged place with polishing casing 1, until the square grafting bar 22 on case lid 2 inserts in the square groove 15 of polishing casing 1, case lid 2 is made to be covered by polishing casing 1 opening like this, and square cutting 22 and the mating reaction of square groove 15 make polishing casing 1 close, and avoid the polishing fluid in polishing casing 1 to flow out, polishing fluid is added in the open top of then upward liquid supply box 4, polishing fluid enters in upper fluid-through tube 6 from the confession fluid apertures 41 of the base plate of upper liquid cartridge 4, the upper surface flowing to fibre sleeving 3 again along the upper liquid-through hole 111 of upper fluid-through tube 6 and polishing casing 1 is absorbed by fibre sleeving 3, the lower feed tube 8 be connected with lower liquid cartridge 5 is communicated with polishing fluid source, polishing fluid is pumped into the lower inlet 52 of lower liquid cartridge 5 by compression pump 9 from lower feed tube 8, enter in lower liquid cartridge 5 from lower inlet 52 again, polishing fluid in lower liquid cartridge 5 is by the lower lower surface flowing to fibre sleeving 3 for fluid apertures 51 again along lower fluid-through tube 7 and lower liquid-through hole 121 is absorbed by fibre sleeving 3, thus the whole fibre sleeving 3 being adsorbed with polishing fluid is tightly coated on laser template, be drained on laser template by the polishing fluid in upper liquid cartridge 4 and lower liquid cartridge 5, thus achieve the outer surface polishing of laser template.
In sum, the present invention, by the drainage of fibre sleeving, effectively can save the use amount of polishing fluid, reduces production cost.
Device for carrying out polishing to SMT laser template provided by the present invention; be only the specific embodiment of the present invention; but protection scope of the present invention is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the present invention discloses; change can be expected easily or replace, all should be encompassed within scope.Therefore, protection scope of the present invention should be as the criterion with the protection domain of described claim.
Claims (6)
1., for carrying out a device for polishing to SMT laser template, it is characterized in that:
Comprise polishing casing (1), case lid (2), fibre sleeving (3), upper liquid cartridge (4) and lower liquid cartridge (5);
Described polishing casing (1) comprises top board (11), base plate (12) and three side plates (13), the one side of polishing casing (1) has opening portion (14), described case lid (2) is hinged on the lower end of described opening portion (14), described case lid (2) comprises cover plate (21) and is molded over the square grafting bar (22) at an edge of described cover plate, the polishing casing (1) on opening portion (14) forms the square groove (15) coordinated with described grafting bar (22);
Described fibre sleeving (3) has a cavity (31), fibre sleeving (3) is fixed on the inwall of polishing casing (1), and one end of fibre sleeving (3) corresponding polishing box opening portion (14) has corresponding opening;
Described upper liquid cartridge (4) is fixed on the upper surface of top board (11) of polishing casing (1), described lower liquid cartridge (5) is fixed on the lower surface of base plate (12) of polishing casing (1), the base plate of upper liquid cartridge (4) form some upper for fluid apertures (41), the top board (1) of described polishing casing (1) forms the some and described upper upper liquid-through hole (111) corresponding for fluid apertures (41), described upper liquid-through hole and upper confession are connected with upper fluid-through tube (6) between fluid apertures (41), the lower ending opening of described upper fluid-through tube faces toward the upper end of fibre sleeving (3), the base plate of lower liquid cartridge (5) form some lower to fluid apertures (51), the base plate (12) of described polishing casing (1) forms the some and described lower lower liquid-through hole (121) corresponding for fluid apertures (51), described lower liquid-through hole and lower confession are connected with lower fluid-through tube (7) between fluid apertures (51), the lower ending opening of described lower fluid-through tube faces toward the lower end of fibre sleeving (3), the open top of upper liquid cartridge (4), lower liquid cartridge (5) is one is enclosed box body, lower liquid cartridge (5) offers lower inlet (52), described lower inlet is connected with lower feed tube (8), described lower feed tube is connected with compression pump (9).
2. the device for carrying out polishing to SMT laser template according to claim 1, it is characterized in that: the described upper quantity for fluid apertures (41) is five, wherein, four upper fluid apertures (41) that supply are distributed on four angles of the base plate of liquid cartridge (4), a upper middle part being distributed in the base plate of liquid cartridge (4) for fluid apertures (41), the base plate of upper liquid cartridge (4) forms five grooves (42), described five upper bottoms being arranged on described five grooves (42) for fluid apertures (41) distribution; The described lower quantity for fluid apertures (51) is five, wherein, be distributed on four angles of the base plate of lower liquid cartridge (5) for fluid apertures (51) under four, under one, be distributed in the middle part of the base plate of lower liquid cartridge (5) for fluid apertures (51).
3. the device for carrying out polishing to SMT laser template according to claim 1 and 2, it is characterized in that: the sidewall of described upper liquid cartridge (4) forms inlet (43), upper liquid outlet (44), first inductor (10) and the second inductor (20), described upper inlet (43) is positioned at the top of upper liquid outlet (44), described first inductor (10) arranges near upper inlet (43) and is positioned at the below of inlet (43), described second inductor (20) arranges near upper liquid outlet (44) and is positioned at the top of upper liquid outlet (44), described lower liquid cartridge (5) forms lower liquid outlet (53).
4. the device for carrying out polishing to SMT laser template according to claim 1, is characterized in that: described case lid (2) is hinged on the sidewall of base plate (12) of polishing casing (1).
5. the device for carrying out polishing to SMT laser template according to claim 1, is characterized in that: described fibre sleeving (3) adopts paper pulp fiber to make.
6. the device for carrying out polishing to SMT laser template according to claim 1, is characterized in that: cover plate (21) wall of described case lid (2) is provided with sealing gasket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610122207.5A CN105538120B (en) | 2016-03-03 | 2016-03-03 | A kind of device for being polished to SMT laser templates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610122207.5A CN105538120B (en) | 2016-03-03 | 2016-03-03 | A kind of device for being polished to SMT laser templates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105538120A true CN105538120A (en) | 2016-05-04 |
| CN105538120B CN105538120B (en) | 2017-12-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610122207.5A Expired - Fee Related CN105538120B (en) | 2016-03-03 | 2016-03-03 | A kind of device for being polished to SMT laser templates |
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| Country | Link |
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| CN (1) | CN105538120B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021135452A1 (en) * | 2019-12-31 | 2021-07-08 | 天津大学 | Sub-aperture center liquid supply optical surface series machining technology and tool |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62140755A (en) * | 1985-12-13 | 1987-06-24 | Nec Corp | Polishing method for optical connector |
| JPH01164546A (en) * | 1987-12-21 | 1989-06-28 | Hitachi Zosen Corp | Grinding work |
| JP2004009227A (en) * | 2002-06-07 | 2004-01-15 | Furukawa Electric Co Ltd:The | Method for manufacturing aluminum pipe, and electrophotographic photosensitive drum |
| JP2008238302A (en) * | 2007-03-26 | 2008-10-09 | Mrc Composite Products Co Ltd | Manufacturing method of fiber reinforcing plastic pipe body and polishing device of raw pipe |
| CN101733708A (en) * | 2009-11-26 | 2010-06-16 | 深圳光韵达光电科技股份有限公司 | Method for processing pore wall of SMT laser template |
| CN204159492U (en) * | 2014-09-01 | 2015-02-18 | 深圳光韵达光电科技股份有限公司 | A kind of nano-solution equipment for spraying for SMT laser template |
| CN205520884U (en) * | 2016-03-03 | 2016-08-31 | 浙江乔兴建设集团湖州智能科技有限公司 | A device for being directed at SMT laser template is polished |
-
2016
- 2016-03-03 CN CN201610122207.5A patent/CN105538120B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62140755A (en) * | 1985-12-13 | 1987-06-24 | Nec Corp | Polishing method for optical connector |
| JPH01164546A (en) * | 1987-12-21 | 1989-06-28 | Hitachi Zosen Corp | Grinding work |
| JP2004009227A (en) * | 2002-06-07 | 2004-01-15 | Furukawa Electric Co Ltd:The | Method for manufacturing aluminum pipe, and electrophotographic photosensitive drum |
| JP2008238302A (en) * | 2007-03-26 | 2008-10-09 | Mrc Composite Products Co Ltd | Manufacturing method of fiber reinforcing plastic pipe body and polishing device of raw pipe |
| CN101733708A (en) * | 2009-11-26 | 2010-06-16 | 深圳光韵达光电科技股份有限公司 | Method for processing pore wall of SMT laser template |
| CN204159492U (en) * | 2014-09-01 | 2015-02-18 | 深圳光韵达光电科技股份有限公司 | A kind of nano-solution equipment for spraying for SMT laser template |
| CN205520884U (en) * | 2016-03-03 | 2016-08-31 | 浙江乔兴建设集团湖州智能科技有限公司 | A device for being directed at SMT laser template is polished |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021135452A1 (en) * | 2019-12-31 | 2021-07-08 | 天津大学 | Sub-aperture center liquid supply optical surface series machining technology and tool |
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| Publication number | Publication date |
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| CN105538120B (en) | 2017-12-19 |
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| CB03 | Change of inventor or designer information |
Inventor after: Ouyang Changjian Inventor before: Ye Weiran |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20171120 Address after: Chen Jiang Street Wuyi village in Guangdong province Huizhou City area building 516000 Zhongkai high tech Zone Applicant after: Huizhou Meite Lun Technology Co. Ltd. Address before: Yang Shu Lu Wuxing District 313000 Zhejiang city of Huzhou province No. 18 Applicant before: ZHEJIANG QIAOXING CONSTRUCTION GROUP HUZHOU INTELLIGENT TECHNOLOGY CO., LTD. |
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Granted publication date: 20171219 Termination date: 20210303 |