CN105529307A - Housing for encapsulating IGBT module - Google Patents
Housing for encapsulating IGBT module Download PDFInfo
- Publication number
- CN105529307A CN105529307A CN201410578740.3A CN201410578740A CN105529307A CN 105529307 A CN105529307 A CN 105529307A CN 201410578740 A CN201410578740 A CN 201410578740A CN 105529307 A CN105529307 A CN 105529307A
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- CN
- China
- Prior art keywords
- igbt module
- outlet
- guiding groove
- encapsulation shell
- module encapsulation
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention discloses a housing for encapsulating an IGBT module. The housing comprises a housing body, wherein the housing body defines an encapsulation space of the IGBT module; the housing body is provided with a top surface; a lead-out opening for leading out an auxiliary electrode of the IGBT is arranged on the top surface and comprises an inlet and an outlet; the inlet of the lead-out opening is connected with a guide groove; the lead-out opening is communicated with the encapsulation space through the guide groove; the guide groove is in a trumpet shape; and the internal diameter of the guide groove is gradually increased along the direction far away from the lead-out opening. According to the housing for encapsulating the IGBT module disclosed by the invention, through the arrangement of the guide groove, the auxiliary electrode when the IGBT module is encapsulated can be smoothly led out; adjustment by tweezers is avoided; a glue filling procedure does not need to increase; the production procedure is reduced; the work efficiency is improved; and good economic benefits are obtained.
Description
Technical field
The present invention relates to IGBT module encapsulation technology field, particularly relate to a kind of IGBT module encapsulation shell.
Background technology
In the packaging process of IGBT module, shell is installed and is served very important effect.Usually, when encapsulating, need the shell and base plate that coat silicon rubber to be installed together, for several half-bridge structure welded type IGBT module, 4 auxiliary electrodes are welded on DBC (DirectBondingCopper covers copper ceramic substrate).Need when mounting casing auxiliary electrode to be inserted accurately in the auxiliary electrode fairlead on shell.
But, in actual installation process, auxiliary electrode cannot enter in fairlead sometimes smoothly, but the edge in hole can be stuck in, now, need to adjust with the position of tweezers to auxiliary electrode, auxiliary electrode is entered in hole and completes installation, in the process of adjustment like this, auxiliary electrode, because of the easy flexural deformation of External Force Acting, also can reduce the efficiency of installment work simultaneously.
In addition, because IGBT inner space is narrow and small, adjustment is got up very inconvenient, meanwhile, in the process of adjustment, tweezers are easily stained with the silicon rubber at shell edge, so just likely produce in lower one Silica hydrogel perfusion operation and leak glue phenomenon, so one shell edge will be increased mend silicon rubber operation, thus both add production process, again reduce operating efficiency.
Therefore, for the problems referred to above, be necessary to propose further solution.
Summary of the invention
In view of this, the invention provides a kind of IGBT module encapsulation shell, to overcome in existing IGBT module encapsulation process, the problem that auxiliary electrode cannot be drawn smoothly.
To achieve these goals, the technical scheme that provides of the embodiment of the present invention is as follows:
A kind of IGBT module encapsulation shell, it comprises: outer cover body, described outer cover body limits the encapsulated space of IGBT module, described outer cover body has end face, described end face offers the outlet for drawing IGBT auxiliary electrode, described outlet has entrance and exit, the entrance of described outlet is connected with guiding groove, described outlet is connected with described encapsulated space by described guiding groove, described guiding groove is tubaeform, and the inside diameter of described guiding groove increases gradually along the direction away from outlet.
As the improvement of IGBT module encapsulation shell of the present invention, described guiding groove has four sides, and in described four sides, at least two sides are inclined-plane.
As the improvement of IGBT module encapsulation shell of the present invention, described two sides for inclined-plane are oppositely arranged, and angle is therebetween acute angle.
As the improvement of IGBT module encapsulation shell of the present invention, the side of described guiding groove is curved surface.
As the improvement of IGBT module encapsulation shell of the present invention, described curved surface is convex surface.
As the improvement of IGBT module encapsulation shell of the present invention, described curved surface is concave surface.
As the improvement of IGBT module encapsulation shell of the present invention, described end face offers outlet described in four groups, described arbitrary group comprises two outlets, and described four groups of outlets are distributed in the corner at described outer cover body top.
Compared with prior art, the invention has the beneficial effects as follows: IGBT module encapsulation shell of the present invention is by arranging guiding groove, and when IGBT module is encapsulated, auxiliary electrode is drawn smoothly.Avoid and use tweezers to adjust, also need not increase benefit glue process, not only decrease production process, and improve operating efficiency, achieve good economic benefit.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, the accompanying drawing that the following describes is only some embodiments recorded in the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the floor map of IGBT module encapsulation shell one embodiment of the present invention;
Fig. 2 is the enlarged drawing of dotted portion in Fig. 1;
Fig. 3 is the section enlarged diagram at outlet place in Fig. 2;
Fig. 4 is the section enlarged diagram at outlet place in an embodiment;
Fig. 5 is the section enlarged diagram at outlet place in another embodiment.
Embodiment
The present invention discloses a kind of IGBT module encapsulation shell, it comprises: outer cover body, described outer cover body limits the encapsulated space of IGBT module, described outer cover body offers the outlet for drawing IGBT auxiliary electrode, described outlet is connected with described encapsulated space by guiding groove, described guiding groove is tubaeform, and the inside diameter of described guiding groove increases gradually along the direction away from outlet.
Preferably, described guiding groove has four sides, and in described four sides, at least two sides are inclined-plane.
Preferably, described two sides for inclined-plane are oppositely arranged, and angle is therebetween acute angle.
Preferably, the side of described guiding groove is curved surface.
Preferably, described curved surface is convex surface.
Preferably, described curved surface is concave surface.
Preferably, described outer cover body has end face, described end face offers outlet described in four groups, and described arbitrary group comprises two outlets, and described four groups of outlets are distributed in the corner at described outer cover body top.
Technical scheme in the present invention is understood better in order to make those skilled in the art person, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, should belong to the scope of protection of the invention.
IGBT module encapsulation shell of the present invention is by arranging guiding groove, and when IGBT module is encapsulated, auxiliary electrode is drawn smoothly, improves the efficiency of IGBT module encapsulation.
As Figure 1-3, IGBT module encapsulation shell 100 of the present invention comprises: outer cover body 10, and described outer cover body 10 inside limits the encapsulated space of IGBT module, and IGBT module is positioned at this encapsulated space, and outer cover body plays a protective role to it.
IGBT module has IGBT auxiliary electrode, correspondingly, outlet 11, the IGBT auxiliary electrode described outer cover body 10 offered for drawing IGBT auxiliary electrode can stretch out from this outlet, is connected with external circuit.Described outlet 11 has entrance and exit, the entrance of described outlet 11 is connected with a guiding groove 12, and be connected with described encapsulated space by guiding groove 12, this guiding groove 12 is tubaeform, and the inside diameter of described guiding groove increases gradually along the direction away from outlet.Thus, before IGBT auxiliary electrode enters into outlet 11, first it enter into guiding groove 12, side due to guiding groove 12 has certain gradient, when the end of IGBT auxiliary electrode contacts with the side with constant slope, the guiding function power acted on IGBT auxiliary electrode can produce along inclined-plane and towards the component in outlet direction, thus guides IGBT auxiliary electrode to enter into outlet smoothly.
As a kind of execution mode, guiding groove 12 has the structure of similar truncated rectangular pyramids.Particularly, described guiding groove 12 has four sides, and in described four sides, at least two sides are inclined-plane.Preferably, described two sides for inclined-plane are oppositely arranged, and angle is therebetween acute angle, and two other inclined-plane is parallel to each other.
As shown in Figure 4,5, alternately, the side of guiding groove 12 is curved surface.When this curved surface is convex surface, guiding groove 12 is roughly in one " bottleneck " structure.When this curved surface is concave surface, guiding groove 12 is comparatively steep with the curved surface of outlet 11 connection, is stuck in this junction to prevent IGBT auxiliary electrode.
Further, the quantity of outlet 11 is multiple, particularly, described outer cover body 10 has end face, described end face offers outlet described in four groups, described arbitrary group comprises two outlets, and described four groups of outlets are distributed in the corner at described outer cover body top.Correspondingly, be all provided with guiding groove 12 below each outlet, the shape of guiding groove 12 can adopt structure in execution mode described above.
In sum, IGBT module encapsulation shell of the present invention is by arranging guiding groove, and when IGBT module is encapsulated, auxiliary electrode is drawn smoothly.Avoid and use tweezers to adjust, also need not increase benefit glue process, not only decrease production process, and improve operating efficiency, achieve good economic benefit.
To those skilled in the art, obviously the invention is not restricted to the details of above-mentioned one exemplary embodiment, and when not deviating from spirit of the present invention or essential characteristic, the present invention can be realized in other specific forms.Therefore, no matter from which point, all should embodiment be regarded as exemplary, and be nonrestrictive, scope of the present invention is limited by claims instead of above-mentioned explanation, and all changes be therefore intended in the implication of the equivalency by dropping on claim and scope are included in the present invention.Any Reference numeral in claim should be considered as the claim involved by limiting.
In addition, be to be understood that, although this specification is described according to execution mode, but not each execution mode only comprises an independently technical scheme, this narrating mode of specification is only for clarity sake, those skilled in the art should by specification integrally, and the technical scheme in each embodiment also through suitable conjunction, can form other execution modes that it will be appreciated by those skilled in the art that.
Claims (7)
1. an IGBT module encapsulation shell, it is characterized in that, described IGBT module encapsulation shell comprises: outer cover body, described outer cover body limits the encapsulated space of IGBT module, described outer cover body has end face, described end face offers the outlet for drawing IGBT auxiliary electrode, described outlet has entrance and exit, the entrance of described outlet is connected with guiding groove, described outlet is connected with described encapsulated space by described guiding groove, described guiding groove is tubaeform, the inside diameter of described guiding groove increases gradually along the direction away from outlet.
2. IGBT module encapsulation shell according to claim 1, is characterized in that, described guiding groove has four sides, and in described four sides, at least two sides are inclined-plane.
3. IGBT module encapsulation shell according to claim 2, is characterized in that, described two sides for inclined-plane are oppositely arranged, and angle is therebetween acute angle.
4. IGBT module encapsulation shell according to claim 1, is characterized in that, the side of described guiding groove is curved surface.
5. IGBT module encapsulation shell according to claim 4, is characterized in that, described curved surface is convex surface.
6. IGBT module encapsulation shell according to claim 4, is characterized in that, described curved surface is concave surface.
7. IGBT module encapsulation shell according to claim 1, is characterized in that, described end face offers outlet described in four groups, and described arbitrary group comprises two outlets, and described four groups of outlets are distributed in the corner at described outer cover body top.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410578740.3A CN105529307A (en) | 2014-10-24 | 2014-10-24 | Housing for encapsulating IGBT module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410578740.3A CN105529307A (en) | 2014-10-24 | 2014-10-24 | Housing for encapsulating IGBT module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105529307A true CN105529307A (en) | 2016-04-27 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410578740.3A Pending CN105529307A (en) | 2014-10-24 | 2014-10-24 | Housing for encapsulating IGBT module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105529307A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102889194A (en) * | 2011-07-19 | 2013-01-23 | 株式会社丰田自动织机 | Structure for fixing electric part for motor-driven compressor |
| CN103210489A (en) * | 2010-11-16 | 2013-07-17 | 富士电机株式会社 | Semiconductor device |
| CN103733333A (en) * | 2011-09-28 | 2014-04-16 | 富士电机株式会社 | Semiconductor device and method for producing semiconductor device |
-
2014
- 2014-10-24 CN CN201410578740.3A patent/CN105529307A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103210489A (en) * | 2010-11-16 | 2013-07-17 | 富士电机株式会社 | Semiconductor device |
| CN102889194A (en) * | 2011-07-19 | 2013-01-23 | 株式会社丰田自动织机 | Structure for fixing electric part for motor-driven compressor |
| CN103733333A (en) * | 2011-09-28 | 2014-04-16 | 富士电机株式会社 | Semiconductor device and method for producing semiconductor device |
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| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160427 |