CN105527752B - A kind of backlight module and its display device - Google Patents
A kind of backlight module and its display device Download PDFInfo
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- CN105527752B CN105527752B CN201510992514.4A CN201510992514A CN105527752B CN 105527752 B CN105527752 B CN 105527752B CN 201510992514 A CN201510992514 A CN 201510992514A CN 105527752 B CN105527752 B CN 105527752B
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- partition wall
- metal frame
- backlight
- thermally conductive
- backlight module
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133608—Direct backlight including particular frames or supporting means
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133628—Illuminating devices with cooling means
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Planar Illumination Modules (AREA)
Abstract
The present invention provides a kind of backlight module, including multiple backlights, glue frame, optical diaphragm and the thermally conductive partition wall between backlight.The thermally conductive partition wall can contact metal outer frame by way of through glue frame, or directly contact metal outer frame bottom surface, or the heat derives for issuing light source through modes such as metal outer frames.The thermally conductive partition wall can be fabricated separately or be integrally formed with glue frame, iron frame.The present invention can quickly be exported the heat that light source gives out by setting conductive structure for the partition wall of light source, reduce the temperature of backlight module, reduce influence of the backlight module temperature to display device.
Description
Technical field
The present invention relates to the backlight modules and its display device of display field more particularly to a kind of good heat dispersion performance.
Background technique
Liquid crystal display has many advantages, such as that frivolous, energy conservation is radiationless, is widely used in mobile communication, in digital device.Liquid
Crystal display is mostly backlight liquid crystal display, including liquid crystal display panel, backlight module and shell.Liquid crystal display panel itself is not sent out
Light, needs the light source provided by backlight module normally to show image, and therefore, backlight module becomes the pass of liquid crystal display device
One of key asembly.
As shown in Figure 1, backlight module is by components such as light source 1 ', glue frame 2 ', metal frame 3 ', optical diaphragms 4 ' in the prior art
It constitutes.In backlight module work, multiple light sources shine simultaneously, and continue to generate heat.In backlight module with light source contacts
Component is FPC, is glue frame and optical diaphragm around light source, glue frame and optical diaphragm are High molecular polymer, and heat is not easy
It exports and generates heat localization in glue frame and optical diaphragm, when multiple light sources shine simultaneously, intermediate multiple light sources heat is especially not
It is easy export.The thermal deformation that optical diaphragm can be generated in accumulation heat rear film, leads to optics occur in display panel light emission side
The defects of striped, influences to show quality.In addition the heat accumulated in inside display device also will affect electricity in liquid crystal display panel,
Optical device, to influence display effect.In recent years, liquid crystal display device especially moves the liquid crystal display panel of consumer products
Volume is smaller and smaller, increasingly requires frivolous, and each component is also more compact in corresponding backlight module, and remaining heat-dissipating space becomes
The more difficult diffusion of heat small, that light source generates, influences the display performance of display device.
Summary of the invention
Mentioned above in order to solve the problems, such as, the embodiment of the present invention provides a kind of backlight module, including optical diaphragm group, more
A backlight and outline border, the optical diaphragm group, multiple backlights are located in the outline border, and the outline border has at least one
Partition wall, between the partition wall, the partition wall is made of the multiple backlight Heat Conduction Material.
The present invention also provides a kind of display devices, which is characterized in that including backlight module as described above.
The present invention can quickly be exported the heat that light source gives out by setting conductive structure for the partition wall of light source, drop
The temperature of low backlight module extends the luminescent lifetime of light source, improves the luminous efficiency of light source, reduces backlight module temperature to display
The influence of device.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the local structure top view of the light source part of backlight module in the prior art；
Fig. 2 is the top view for the backlight module that metal frame is equipped with protrusion；
Fig. 3 is the sectional view for the backlight module that metal frame is equipped with protrusion；
Fig. 4 a-4b is the sectional view that thermally conductive partition wall is embedded in metal frame bottom；
Fig. 5 is the thermally conductive curtain wall structure schematic diagram with inner core；
Fig. 6 is the thermally conductive curtain wall structure schematic diagram for being provided with through-hole；
Fig. 7 is the sectional view that thermally conductive partition wall runs through that metal frame bottom is contacted with external cooling layer；
Fig. 8 is the top view that thermally conductive partition wall is embedded in glue frame；
Fig. 9 is the sectional view that thermally conductive partition wall is embedded in glue frame；
Figure 10 is the sectional view that thermally conductive partition wall runs through glue frame and metal frame contact aside；
Figure 11 is the sectional view that thermally conductive partition wall is contacted with metal frame side with bottom edge simultaneously through glue frame；
Figure 12 is the sectional view that thermally conductive partition wall runs through that glue frame is contacted with metal frame side with external cooling layer；
Figure 13 is the sectional view that thermally conductive partition wall directly contacts metal frame bottom edge；
Figure 14 is that thermally conductive partition wall is cut through glue frame with what metal frame side and metal frame bottom edge were contacted with external cooling layer
Face figure；
Figure 15 is the structural schematic diagram that thermally conductive partition wall is bonded in metal frame bottom edge by heat-conducting glue；
Figure 16 is the sectional view that thermally conductive partition wall is bonded in metal frame bottom edge by heat-conducting glue；
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description.Obviously, described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
In the following description, numerous specific details are set forth in order to facilitate a full understanding of the present invention, but the present invention can be with
Implemented using other than the one described here other way, those skilled in the art can be without prejudice to intension of the present invention
In the case of do similar popularization, therefore the present invention is not limited by the specific embodiments disclosed below.
The embodiment of the invention provides a kind of backlight modules, and as shown in Figure 2 and Figure 3, Fig. 3 is dotted box portion in Fig. 2
Sectional view, backlight module include multiple light sources 1, metal frame 3, optical diaphragm 4, multiple thermally conductive partition walls 5, multiple light sources 1 with it is multiple
Thermally conductive partition wall 5 is spaced apart from each other setting.Wherein, thermally conductive partition wall 5 is a part of metal frame 3, the metal with thermally conductive wall part
One-pass molding and setting shrinkage pool in the mold in preparation process (corresponding thermally conductive partition wall) of frame 3.In the present embodiment, with light
The spaced thermally conductive partition wall in source by the heat absorption of light source generation and can be conducted to entire metal frame in light source luminescent, real
The thermal diffusion of existing light source reduces light-source temperature when backlight module work, extends the luminescent lifetime of light source, improves shining for light source
Efficiency；On the other hand also reduce influence of the heat of light source generation to optical diaphragm, prevent the thermal deformation of optical diaphragm from causing to show
Show the decline of quality.
Fig. 4 a~Fig. 7 is the schematic cross-section of backlight module in another embodiment of the present invention.Fig. 4 a is the present embodiment backlight
The top cross-sectional view of mould group, Fig. 4 b are the Section A-A figure in Fig. 4 a, and Fig. 4 a is the A '-A ' sectional view in Fig. 4 b.Backlight module
Including multiple light sources 1, metal frame 3, optical diaphragm 4, multiple thermally conductive partition walls 5, multiple light sources 1 and multiple thermally conductive partition walls 5 are each other
Every setting, metal frame has bottom edge 3A and side 3B, and thermally conductive partition wall 5 is made of graphite material, and 5 one end of thermally conductive partition wall insertion gold
Belong to the bottom edge of frame, rest part is located among the interval of multiple light sources.In this way, thermally conductive partition wall is fixed on metal frame
In, it is integrally formed with metal frame, the heat that multiple light sources (especially intermediate multiple light sources) are generated when shining is fast
Speed diffuses in metal frame, reduces light-source temperature when backlight module work.Other Heat Conduction Materials can also be used in thermally conductive partition wall, such as
The metal materials such as metallic copper, this is not limited by the present invention.
As shown in Figure 4 b, the contact position of thermally conductive partition wall insertion metal frame, in addition viscose 6 is to be auxiliarily fixed.Thermally conductive partition wall 5 has
There is inner core 7, inner core 7 has intensity more higher than the rest part of thermally conductive partition wall 5, and setting inner core can make the whole of thermally conductive partition wall
Body intensity is higher, prevents in the technical process such as molding, insertion, the breakage of thermally conductive partition wall.In other embodiment party of the present embodiment
In formula, thermally conductive partition wall is located at the part 5A ' surface irregularity among multiple light sources interval, and the body surface area of the part 5A ' is greater than
The projected area on its surface, as shown in figure 5, so that thermally conductive partition wall absorb heat area it is bigger, it is thermally conductive faster, improve
The heat transfer efficiency of thermally conductive partition wall.The 5A ' of thermally conductive partition wall partially may be set to be other sides for increasing endotherm area in the present invention
Formula, as shown in fig. 6, in 5A ' part setting through-hole 8 is to increase body surface area.In addition also shape of threads can be set by the surface 5A ',
Or thermally conductive partition wall is made using thermally conductive porous material, which is not limited by the present invention, as long as making body surface area greater than its throwing
The design of shadow area, all falls in the scope of protection of the present invention.
In the present embodiment, thermally conductive partition wall is embedded in metal frame again after being fabricated separately, and is also possible to thermally conductive partition wall and gold
Belong to frame to be integrally formed.In thermally conductive partition wall and the integrally formed technique of metal frame, in advance by the mould of thermally conductive partition wall and production metal frame
Tool is placed on scheduled position and fixes, and then fills metal to its gap, demoulds after molding, obtains being integrated with the gold of thermally conductive partition wall
Belong to frame.
It is illustrated in figure 7 the another embodiment of the present embodiment, thermally conductive partition wall 5 runs through the bottom edge 3A of metal frame.In gold
Belong to outer frame side and be provided with a heat dissipating layer 9, heat dissipating layer 9 is made of graphite material, and heat dissipating layer 9 and metal frame, thermally conductive partition wall 5 are through gold
One end 5B for belonging to frame bottom edge is directly contacted, and the heat derives that thermally conductive partition wall can be absorbed are into heat dissipating layer 9, and graphite thermal layer
9 is larger with the contact area of metal frame, can more rapidly and evenly export heat, reduce temperature.It can also be used in heat dissipating layer 9
His Heat Conduction Material, such as metallic copper metal material, this is not limited by the present invention.
Thermally conductive partition wall can also be fixed in addition to being embedded in metal frame bottom edge by being embedded in glue frame in the present invention.Of the invention another
In one embodiment, as shown in Fig. 8~Figure 13, backlight module includes multiple light sources 1, glue frame 2, metal frame 3, optical diaphragm 4, multiple
Thermally conductive partition wall 5, multiple light sources 1 and multiple thermally conductive partition walls 5 are spaced apart from each other setting, and thermally conductive partition wall 5 is made of graphite material.Glue frame 2
Positioned at the inside of 3 side of metal frame, the inner surface of 3 side of side appearance face contact metal frame of glue frame 2, the bottom surface contact of glue frame
The upper surface on 3 bottom edge of metal frame.As shown in figure 8, rest part is between multiple light sources in thermally conductive partition wall one end insertion glue frame
Among, Fig. 9 is section B-B figure in Fig. 8, and Fig. 8 is the B '-B ' sectional view in Fig. 9.Among insertion glue frame, thermally conductive partition wall
It is fixed, the heat generated when multiple light sources shine can be absorbed in the part 5A that thermally conductive partition wall is located among the interval of multiple light sources
Amount prevents the decline of the heat accumulation for reducing other component and its caused display quality.
In the present embodiment, thermally conductive partition wall 5 is embedded in glue frame 2 again after being fabricated separately, and is also possible to thermally conductive partition wall and glue
Frame 2 is integrally formed.In thermally conductive partition wall and the integrally formed technique of glue frame 2, in advance by the mold of thermally conductive partition wall 5 and production glue frame 2
It is placed on scheduled position to fix, then glue frame material is filled to its gap, is demoulded after molding, obtain being integrated with thermally conductive partition wall 5
Glue frame 2.
In another embodiment of the present embodiment, as shown in Figure 10, thermally conductive partition wall insertion glue frame part 5B runs through glue frame
It is contacted with metal frame side 3B, to exported the heat that thermally conductive partition wall absorbs outward to metal frame.Thermally conductive partition wall and metal frame
Contact can constantly export heat outward, reduce the operating temperature of mould group, improve display quality.
Further, the part 5B of thermally conductive partition wall insertion glue frame can be further divided into two parts 51B, 52B, and thermally conductive partition wall passes through
51B, 52B run through glue frame 2 simultaneously, contact respectively with the bottom edge 3A of metal frame and side 3B, as shown in figure 11, to further increase
Contact area between big thermally conductive partition wall and metal frame, improves heat transfer efficiency.In the present embodiment, thermally conductive partition wall is embedded in glue frame
Part 5B can be further divided into more parts and contact through glue frame with metal frame, not be limited in such a way that the present embodiment is shown.
Further, thermally conductive partition wall 5 runs through the side 3B of glue frame 2 and metal frame simultaneously, as shown in figure 12.On the outside of metal frame
It is provided with a heat dissipating layer 9, heat dissipating layer 9 is made of graphite material, and heat dissipating layer 9 is contacted with metal frame, thermally conductive partition wall 5, thermally conductive partition wall
The heat derives that can be absorbed are into heat dissipating layer 9, and graphite thermal layer 9 and the contact area of metal frame are larger, can be more
It rapidly and evenly exports heat, reduce temperature.Other Heat Conduction Materials, such as metallic copper metal material can also be used in heat dissipating layer 9,
This is not limited by the present invention.
Figure 13 and Figure 14 is the structural schematic diagram of further embodiment of this invention.It is with the distinctive points of previous embodiment, this
Thermally conductive partition wall is directly contacted with the bottom edge of metal frame with side simultaneously in embodiment.Figure 13 is a kind of embodiment party of the present embodiment
Formula, backlight module include multiple light sources 1, glue frame 2, metal frame 3, optical diaphragm 4, multiple thermally conductive partition walls 5, multiple light sources 1 and more
A thermally conductive partition wall 5 is spaced apart from each other setting, and thermally conductive partition wall 5 is made of graphite material.Thermally conductive partition wall one end 5B run through simultaneously glue frame with
Metal frame side 3B contact, the bottom of the 5A among multiple light sources interval directly contacts the bottom edge 3A of metal frame 3.This is implemented
In mode, the bottom surface of thermally conductive partition wall is plane, is in close contact with metal frame bottom, to further increase thermally conductive partition wall and metal
The contact area of frame improves heat transfer efficiency.
Figure 14 is the another embodiment of the present embodiment, and backlight module includes multiple light sources 1, glue frame 2, metal frame 3, light
The heat dissipating layer 9 outside diaphragm 4, multiple thermally conductive partition walls 5 and metal frame is learned, thermally conductive a part of 5B of partition wall runs through glue frame and metal frame
Side, other end 5C run through the bottom edge 3A of metal frame, and rest part 5A is located among multiple light sources interval.Tool outside metal frame
There is heat dissipating layer 9, heat dissipating layer 9 is directly contacted with 5B, 5C outer end face of metal frame 3 and thermally conductive partition wall.Thermally conductive partition wall can be inhaled
The heats of receipts passes through the side of metal frame and bottom edge simultaneously and conducts into heat dissipating layer 9, increase thermally conductive partition wall and metal frame and
The contact area of external cooling layer 9, further improves heat transfer efficiency.
The fixed form of thermally conductive partition wall can also be in such a way that gluing be fixed, as shown in Figure 15 and Figure 16 in the present invention
For another embodiment of the present invention structural schematic diagram, Figure 16 is the C-C sectional view in Figure 15, and backlight module includes multiple light sources 1, glue
Frame 2, metal frame 3, multiple thermally conductive partition walls 5 and heat-conducting glue 10, multiple thermally conductive partition walls 5 are located among the interval of multiple light sources, lead
Hot partition wall 5 coheres fixation by the bottom edge of heat-conducting glue 10 and metal frame 3.The heat that multiple light sources generate when shining is by multiple thermally conductive
Metal frame is diffused to by heat-conducting glue after partition wall absorption.In the present embodiment, while thermally conductive partition wall is with metal frame bottom edge gluing,
Side embeddable or through glue frame and metal frame.
In the present invention for thermally conductive partition wall and metal frame connection type and connecting portion without limitation, as long as by thermally conductive
Partition wall extends to the bottom edge or side of contact metal frame, or the bottom edge and side of metal frame are connected to by intermediate thermal conductivity medium,
So that the structure-integrated connection type of thermally conductive partition wall and metal frame, within the scope of description of the invention.
Various pieces are described in a progressive manner in this specification, and what each some importance illustrated is and other parts
Difference, same and similar part may refer to each other between various pieces.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention
It is not intended to be limited to embodiment illustrated herein, and is to fit to consistent with the principles and novel features disclosed in this article
Widest scope.
Claims (16)
1. a kind of backlight module, including optical diaphragm group, multiple backlights and outline border, the optical diaphragm group, multiple backlights
Source is located in the outline border, and the outline border has at least one partition wall, and the multiple backlight is described between the partition wall
Partition wall is made of Heat Conduction Material, wherein the outline border includes metal frame and glue frame, and the metal frame includes bottom edge and side, institute
It states glue frame to be located on the inside of the metal frame, the partition wall includes first part and the first part between backlight
Connection, and run through the glue frame, and extend to the second part of the metal frame side, connect with the second part, and pass through
The glue frame is worn, and extends to the Part III on the metal frame bottom edge；
The first part, the Part III are contacted with the bottom edge of the metal frame, the second part and the metal frame
Contact aside.
2. backlight module as described in claim 1, which is characterized in that the first part of the partition wall is close to the metal frame bottom
The one end on side is embedded in the bottom edge of the metal frame, the rest part of the first part of the partition wall be located at the multiple backlight it
Between.
3. backlight module as described in claim 1, which is characterized in that the first part of the partition wall is close to the metal frame bottom
The one end on side run through the metal frame bottom edge, the rest part of the first part of the partition wall be located at the multiple backlight it
Between.
4. backlight module as described in claim 1, which is characterized in that the second part of the partition wall runs through the glue frame and institute
State the side of metal frame.
5. such as the described in any item backlight modules of claim 3 or 4, which is characterized in that be provided with outside outside the metal frame
Heat-conducting layer, and the partition wall is contacted through the part of the metal frame with the outer heat conductive layers.
6. backlight module as claimed in claim 5, which is characterized in that the Heat Conduction Material of the outer heat conductive layers is graphite.
7. backlight module as described in claim 1, which is characterized in that the partition wall and the glue frame are integrally formed.
8. such as the described in any item backlight modules of claim 2~4, which is characterized in that the Heat Conduction Material of the partition wall is graphite.
9. such as the described in any item backlight modules of claim 2~4, which is characterized in that the partition wall has inner core, the inner core
It is made of Heat Conduction Material, and intensity is higher than the partition wall rest part.
10. such as the described in any item backlight modules of claim 2~4, which is characterized in that the partition wall uses isostatic pressing side
Method manufacture.
11. such as the described in any item backlight modules of claim 2~4, which is characterized in that the binding site of the partition wall insertion is set
It is equipped with viscose.
12. backlight module as described in claim 1, which is characterized in that the partition wall is located at the part in the backlight gap
Body surface area is greater than its each surface in the sum of the projected area of plane where its correspondence.
13. backlight module as claimed in claim 12, which is characterized in that the partition wall is located at the part in the backlight gap
It is made of porous conductive material.
14. backlight module as claimed in claim 12, which is characterized in that the partition wall is located at the part in the backlight gap
It is provided at least one through-hole.
15. backlight module as claimed in claim 12, which is characterized in that the partition wall is located at the part in the backlight gap
Surface irregularity.
16. a kind of display device, which is characterized in that including such as described in any item backlight modules of claim 1-15.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510992514.4A CN105527752B (en) | 2015-12-25 | 2015-12-25 | A kind of backlight module and its display device |
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| CN107436507A (en) * | 2016-05-25 | 2017-12-05 | 鸿富锦精密工业（深圳）有限公司 | Backlight module and apply its display device |
| CN106163230B (en) * | 2016-07-20 | 2018-05-29 | 广东欧珀移动通信有限公司 | Display screen module and mobile terminal |
| CN106488648A (en) * | 2016-09-26 | 2017-03-08 | 广东小天才科技有限公司 | A kind of circuit board cooling structure and electronic equipment |
| CN109212829A (en) * | 2018-07-27 | 2019-01-15 | 江苏如高第三代半导体产业研究院有限公司 | A kind of two-dimensional quadrature polarization structure of enhanced region delustring |
| CN114267780A (en) * | 2021-12-14 | 2022-04-01 | Tcl华星光电技术有限公司 | Display panel and manufacturing method thereof |
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| CN101566748A (en) * | 2008-04-22 | 2009-10-28 | 鸿富锦精密工业（深圳）有限公司 | Radiating module and backlight module adopting same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5491219B2 (en) * | 2010-01-28 | 2014-05-14 | パナソニック株式会社 | Light source device, backlight unit, and liquid crystal display device |
| CN104238184B (en) * | 2013-06-14 | 2018-02-09 | 群创光电股份有限公司 | Back light unit and the display device comprising the back light unit |
| CN104267538A (en) * | 2014-09-28 | 2015-01-07 | 中航华东光电有限公司 | Efficient cooling LED backlight device |
| CN204631410U (en) * | 2015-06-08 | 2015-09-09 | 芜湖华宇彩晶科技有限公司 | A kind of LCDs cooling device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101566748A (en) * | 2008-04-22 | 2009-10-28 | 鸿富锦精密工业（深圳）有限公司 | Radiating module and backlight module adopting same |
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