CN204629218U - A kind of back lighting device - Google Patents
A kind of back lighting device Download PDFInfo
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- CN204629218U CN204629218U CN201420844219.5U CN201420844219U CN204629218U CN 204629218 U CN204629218 U CN 204629218U CN 201420844219 U CN201420844219 U CN 201420844219U CN 204629218 U CN204629218 U CN 204629218U
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- dissipation channel
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- back lighting
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Abstract
The utility model discloses a kind of back lighting device, this back lighting device comprises: reflector plate, the glue frame contacted with described reflector plate, the light guide plate be contained in described glue frame, wherein, the one side that described glue frame contacts with described reflector plate is described glue frame first surface, and the one side that described glue frame deviates from described reflector plate is described glue frame second; Described glue frame comprises at least one groove for fixing light-emitting component, described glue frame also comprises heat dissipation channel, described heat dissipation channel is arranged at least one face in the first surface of described glue frame and second, and described heat dissipation channel is positioned at described recessed circumferential position.The utility model is by the heat dissipation channel of through glue frame in glue frame, make to form cross-ventilation in heat dissipation channel, accelerate thermal energy exchange, improve radiating efficiency, heat dissipation channel and glue frame one-body molded, do not affect back lighting device thickness, there is the advantage that technique is simple, with low cost, be convenient to back lighting device slimming.
Description
Technical field
The utility model relates to display field, particularly relates to a kind of back lighting device for display.
Background technology
Backlight module is positioned at below display panels, display panels is passive light-emitting component, itself is not luminous, but provide light source by the light emitting source being arranged in backlight module below it, backlight module and display panels are combined and are constituted LCD MODULE, and the illumination effect of backlight module will directly have influence on the display effect of LCD MODULE.
Owing to having multiple light emitting source in backlight module, when light emitting source is luminous, can heat radiation be produced, in the prior art, usually adopt fin to dispel the heat to the light emitting source in backlight module.Shown in figure 1 (a), be the schematic diagram of the backlight module that prior art provides, as shown in the figure, the fin 11 of extrusion pressing type is provided with in backlight module, fin 11 directly contacts with light emitting source 12, and when light emitting source 12 is luminous, fin 11 absorptive thermal radiation is also dispelled the heat.Shown in figure 1 (b), be the schematic diagram of the another backlight module that prior art provides, as shown in the figure, this backlight module shell be pasted with fin 21, fin 21 absorptive thermal radiation is with heat radiation.
The defect of prior art is, fin or be embedded in backlight module, or be attached on the shell of backlight module, add the thickness of backlight module, be unfavorable for the slimming of backlight module, radiating efficiency is low, in addition, also need when manufacturing backlight module to increase the operation attaching fin, manufacturing cost is higher.
Utility model content
The utility model provides a kind of back lighting device, to solve the problem that in prior art, back lighting device thickness is comparatively large, radiating efficiency is low, manufacturing cost is high.
The utility model provides a kind of back lighting device, this back lighting device comprises: reflector plate, the glue frame contacted with described reflector plate, the light guide plate be contained in described glue frame, wherein, the one side that described glue frame contacts with described reflector plate is described glue frame first surface, and the one side that described glue frame deviates from described reflector plate is described glue frame second;
Described glue frame comprises at least one groove for fixing light-emitting component, described glue frame also comprises heat dissipation channel, described heat dissipation channel is arranged at least one face in the first surface of described glue frame and second, and described heat dissipation channel is positioned at described recessed circumferential position.
The back lighting device that the utility model provides, arranges heat dissipation channel in glue frame, heat dissipation channel and glue frame one-body molded, shaping in glue frame mould, do not need new designing mould, do not increase back lighting device thickness simultaneously, there is the advantage that technique is simple, with low cost, be convenient to back lighting device slimming.In addition the left surface of the through glue frame of heat dissipation channel of the present utility model and right flank, and run through the first surface of glue frame and second, make to form cross-ventilation in groove, accelerate thermal energy exchange, improve radiating efficiency, and do not need to attach thermal paste or fin in glue frame, decrease and attach operation, reduce manufacturing cost.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, introduce doing one to the accompanying drawing used required in embodiment or description of the prior art simply below, apparently, accompanying drawing in the following describes is embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
The schematic diagram of the backlight module that Fig. 1 (a) provides for prior art;
The schematic diagram of the another backlight module that Fig. 1 (b) provides for prior art;
Fig. 2 (a) is the structure chart of a kind of back lighting device that the utility model one embodiment provides;
Fig. 2 (b) is the glue frame schematic diagram that the utility model one embodiment provides;
Fig. 2 (c) is the glue frame schematic diagram that the utility model one embodiment provides;
Fig. 3 (a) is the schematic diagram of the heat dissipation channel that the another embodiment of the utility model provides;
Fig. 3 (b) is the schematic diagram of the heat dissipation channel that the another embodiment of the utility model provides;
Fig. 3 (c) is the schematic diagram of the heat dissipation channel that the another embodiment of the utility model provides;
Fig. 3 (d) is the schematic diagram of the heat dissipation channel that the another embodiment of the utility model provides;
Fig. 3 (e) is the schematic diagram of the heat dissipation channel that the another embodiment of the utility model provides;
Fig. 4 (a) is the utility model schematic diagram of heat dissipation channel of providing of an embodiment again;
Fig. 4 (b) is the utility model schematic diagram of heat dissipation channel of providing of an embodiment again;
Fig. 4 (c) is the utility model schematic diagram of heat dissipation channel of providing of an embodiment again;
Fig. 4 (d) is the utility model schematic diagram with the heat dissipation channel of thermal vias of providing of an embodiment again;
Fig. 4 (e) is the utility model schematic diagram of heat dissipation channel of providing of an embodiment again;
Fig. 4 (f) is the utility model schematic diagram of heat dissipation channel of providing of an embodiment again;
Fig. 5 (a) is the section shape schematic diagram of the heat dissipation channel that another embodiment of the utility model provides;
Fig. 5 (b) is the section interior wall construction schematic diagram of the heat dissipation channel that another embodiment of the utility model provides
Fig. 5 (c) is the schematic diagram of the inside wall film layer of the heat dissipation channel that another embodiment of the utility model provides.
Detailed description of the invention
For making the purpose of this utility model, technical scheme and advantage clearly, hereinafter with reference to the accompanying drawing in the utility model embodiment, clearly and completely the technical solution of the utility model is described by embodiment, obviously, described embodiment is the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
In the utility model embodiment, adhesive frame structure is designed, increase heat dissipation channel, to improve the radiating efficiency of the light-emitting component of display floater.
Shown in figure 2 (a), for the structure chart of a kind of back lighting device that the utility model one embodiment provides, this back lighting device comprises: reflector plate 110, the glue frame 120 contacted with reflector plate 110, the light guide plate 130 be contained in glue frame 120, wherein, the one side that glue frame 120 contacts with reflector plate 110 is glue frame 120 first surface 121, and the one side that glue frame 120 deviates from reflector plate 110 is glue frame 120 second (not shown); Glue frame 120 comprises at least one groove 122 for fixing light-emitting component, glue frame 120 also comprises heat dissipation channel 123, heat dissipation channel 123 is arranged at least one face in the first surface 121 of glue frame 120 and second, and heat dissipation channel 123 is positioned at groove 122 peripheral position place.
Known display panels itself can not be luminous, but provide light by the light-emitting component being arranged in the backlight module below display panels, be the well-off brightness of display floater and the light source be evenly distributed by blooming pieces such as reflector plate 110 and light guide plates 130, the light modulation of display panels by producing light-emitting component, liquid crystal display could normal show image.Light-emitting component and the back lighting device of liquid crystal display are separate, and multiple light-emitting element package is in back lighting device, and the light that backlight module sends directly affects the visual effect of display panels.In the present embodiment, light-emitting component can be light emitting diode (LED).
In the present embodiment, as shown in Fig. 2 (a), back lighting device comprises glue frame 120, glue frame 120 comprises multiple groove 122, this groove 122 is for accommodating light-emitting component, and its function is fixing multiple light-emitting component, and glue frame 120 has first surface 121 and second, glue frame 120 first surface 121 refers to the one side that glue frame 120 contacts with reflector plate 110, and glue frame 120 second face refers to that glue frame 120 deviates from a (not shown) of reflector plate 110, reflector plate 110, reflector plate 110 contacts with the first surface 121 of glue frame 120, when light-emitting component emits beam, reflector plate 110 receiving unit light also reflects this light, light is propagated along the direction towards display panels, and the function of reflector plate 110 is the efficiency of light improving light-emitting component, light guide plate 130, light guide plate 130 is contained in glue frame 120 and light guide plate 130 and reflector plate 110 are oppositely arranged, light guide plate 130 be generally high reverse--bias and not extinction material and there is multiple diffusion point, light guide plate 130 receives the light that reflector plate 110 reflects, and it is inner that this light is imported light guide plate 130, when light is mapped to diffusion point, light spreads toward all angles, then light is penetrated by light guide plate 130 front, utilize various density, diffusion point not of uniform size can make light guide plate 130 uniformly light-emitting, the function of light guide plate 130 is the dispersal direction guiding light, light is fully used and is uniformly distributed.
In order to ensure the display effect of display panels; usually need in backlight module to arrange multiple light-emitting component; light-emitting component when luminescence usually can because of the temperature of light-emitting component self outside emission of thermal radiation; therefore heat radiation may make heater element ambient air temperature raise; thus the temperature of light-emitting component may be made to raise; cause light-emitting component fault, the aging quickening of heat abstractor, unit temp are uneven, light-emitting component reduces service life.In order to improve the performance of back lighting device, the present embodiment forms heat dissipation channel 123 on glue frame 120, this heat dissipation channel 123 is arranged at least one face in the first surface 121 of glue frame 120 and second, and be connected with outside air, and the heat radiation produced during light-emitting component luminescence and hot-air can be derived by heat dissipation channel 123, again because light-emitting component is arranged in the groove 122 of glue frame 120, therefore heat dissipation channel 123 is specifically positioned at the peripheral position place of groove 122, now, when the light-emitting component adstante febre in groove 122, heat radiation around light-emitting component is derived by the heat dissipation channel 123 of groove 122 periphery, and hot-air and outside air are exchanged, accelerate heat radiation, heat radiation can not be caused to be gathered in around light-emitting component, compared with the back lighting device of prior art, the present embodiment is integrally formed heat dissipation channel 123 when forming glue frame 120, can not only be direct, rapidly the heat radiation that the light-emitting component in groove 122 produces is derived, hot-air in groove 122 and outside air are exchanged, further improve existing back lighting device heat dissipation problem, improve the radiating efficiency of back lighting device.
Shown in figure 2 (b), it is the glue frame schematic diagram that the utility model one embodiment provides.As shown in the figure, multiple light-emitting component (not shown) is secured in the groove 122 of glue frame 120, light-emitting component can be arranged in order in order, therefore glue frame 120 has the groove 122 of multiple hollow out be arranged in order, glue frame 120 is also for accommodating light guide plate 130, the groove 122 fixing light-emitting component in concrete glue frame 120 has breach near the direction of light guide plate 130, and the peripheral position of the groove 122 therefore in glue frame 120 specifically comprises the left field of groove 122, the right side area of groove 122, the lower area of groove 122.Heat radiation around light-emitting component is specifically conducted plastic emitting frame 120 inside and the hot-air around light-emitting component and outside air is exchanged by known heat dissipation channel 123, because light-emitting component is arranged in groove 122, therefore heat dissipation channel 123 is positioned at groove 122 peripheral position place, preferably, heat dissipation channel 123 is specifically formed in the optional position of the left side of groove 122, right side or bottom.
The peripheral position place fixing the groove 122 of light-emitting component in glue frame 120 is provided with heat dissipation channel 123, so the heat radiation of light-emitting component generation and the hot-air of periphery can import in heat dissipation channel 123, if heat dissipation channel 123 is only positioned at the peripheral position place of a certain groove 122 and is not separately communicated with, so the heat radiation of light-emitting component is still gathered in groove 122 peripheral position, the air themperature of light-emitting component periphery raises along with thermal-radiating increase, hot-air can not directly export to outside back lighting device, and then groove 122 peripheral position hot-air cannot exchange with outside air.Problem is derived in the heat radiation of distributing to actually improve light-emitting component, the heat dissipation channel 123 of groove 122 peripheral position of light-emitting component needs the outside extending to glue frame 120, be in communication with the outside, heat radiation now around multiple light-emitting component is conducted and is derived glue frame 120 in through heat dissipation channel 123, and hot-air around light-emitting component and outside air realize convection current, exchanged by heat dissipation channel 123 and the outside air outside glue frame 120, derive to realize heat radiation around light-emitting component, the effect that temperature reduces fast, improve radiating efficiency, therefore preferably, the left surface 124 of the through glue frame 120 of heat dissipation channel 123 and right flank 125, the first surface 121 of glue frame 120 and at least one face of second is arranged at this heat dissipation channel 123, wherein, the left surface 124 of glue frame 120 is positioned at the left side of groove 122, the right flank 125 of glue frame 120 is positioned at the right side of groove 122.
At this, shown in figure 2 (c), it is the glue frame schematic diagram that the utility model one embodiment provides.If arrange left surface 124 and the right flank 125 of the not through glue frame 120 of heat dissipation channel 123, known glue frame 120 second groove 122 neighboring areas are not capped, then in order to light-emitting component heat radiation is derived, the heat dissipation channel 123 running through glue frame 120 first surface 121 and second can be set at the peripheral position of groove 122 as Suo Shi Fig. 2 (c), the heat radiation of light-emitting component periphery and hot-air by the heat dissipation channel 123 of groove 122 periphery directly and outside air exchange, accelerate heat radiation, at this, the heat dissipation channel 123 of any one groove 122 periphery can be separate or be interconnected.Therefore, preferably, heat dissipation channel 123 runs through the first surface 121 of glue frame 120 and second.
In addition, in order to the heat-radiation heat-dissipating efficiency of raising light-emitting component more optimized, preferably, heat dissipation channel 123 can also the left surface 124 of through glue frame 120 and right flank 125, and heat dissipation channel 123 runs through the first surface 121 of glue frame 120 and second.By the heat dissipation channel 123 which is formed at glue frame 120, the heat radiation of light-emitting component and the hot-air of surrounding can by the through heat dissipation channel 123 of groove 122 peripheral position of its correspondence and outside air convection current and exchanges, to realize accelerating heat radiation, it is outside that the heat dissipation channel 123 simultaneously also run through by groove 122 periphery exports to glue frame 120, hot-air and outside air directly exchange, to realize accelerating heat radiation, therefore radiating effect is relatively more excellent.
The back lighting device that the utility model embodiment provides, heat dissipation channel 123 is set in glue frame 120, heat dissipation channel 123 is one-body molded with glue frame 120, in glue frame 120 die for molding, do not need new designing mould, do not affect back lighting device thickness, there is the advantage that technique is simple, with low cost, be convenient to back lighting device slimming.In addition the back lighting device that the utility model provides arranges multiple groove 122 in glue frame 120, fixes a light-emitting component, make between light-emitting component separate in each groove 122.In addition, the through multiple groove 122 of heat dissipation channel 123 of the utility model embodiment also extends to left surface 124 and the right flank 125 of glue frame 120, make to form cross-ventilation in groove 122, accelerate thermal energy exchange, improve radiating efficiency, do not need to attach thermal paste or fin in glue frame 120, decrease and attach operation, reduce manufacturing cost.
Shown in figure 3 (a), it is the schematic diagram of the heat dissipation channel that the another embodiment of the utility model provides.The left surface 124 of the through glue frame 120 of this heat dissipation channel 123 and right flank 125, concrete, heat dissipation channel 123 is formed in left side and the right positions of any one groove 122, and through left surface 124 and the right flank 125 extending to glue frame 120, the heat dissipation channel 123 that the left side of any one groove 122 and right positions are formed is through, the hot-air of the heat radiation that any one light-emitting component distributes and surrounding respectively to left side and right side flow, can realize heat radiation derivation, cross-ventilation thus.In this heat dissipation channel 123, the heat radiation that adjacent light emitting element distributes causes light-emitting component ambient air temperature to raise, heat radiation and hot-air import left side and the right side of groove 122 respectively, the left side of any groove 122 is all connected with outside air with right side, so under through heat dissipation channel 123 and cross-ventilated effect, hot-air and outside air convection current in through heat dissipation channel 123, and then heat dissipation channel 123 is derived in heat radiation, realize heat radiation.
Shown in figure 3 (b), it is the schematic diagram of the heat dissipation channel that the another embodiment of the utility model provides.The left surface 124 of the through glue frame 120 of this heat dissipation channel 123 and right flank 125, concrete, heat dissipation channel 123 is formed in the lower position of groove 122 and through left surface 124 and the right flank 125 extending to glue frame 120, the lower position of any one groove 122 forms heat dissipation channel 123, fluted 122 heat dissipation channel 123 connect and extend to outside glue frame 120, when light-emitting component is luminous, the heat radiation that light-emitting component distributes makes light-emitting component ambient air temperature raise, heat radiation and hot-air import the lower position of groove 122, and hot-air and outside air convection current is made in through heat dissipation channel 123, this heat dissipation channel 123 makes heat radiation directly derive from the lower position of groove 122, realize heat radiation.
Shown in figure 3 (c), it is the schematic diagram of the heat dissipation channel that the another embodiment of the utility model provides.The left surface 124 of the through glue frame 120 of this heat dissipation channel 123 and right flank 125, concrete, heat dissipation channel 123 is formed in the left side of groove 122 and right positions and through left surface 124 and the right flank 125 extending to glue frame 120, is also formed in the lower position of groove 122 and through left surface 124 and the right flank 125 extending to glue frame 120 simultaneously.After light-emitting component produces heat radiation, heat radiation around light-emitting component and thermal air current lead to the left side of groove 122 periphery, right side and lower position, it is inner that hot-air exchanges with outside air on the left of groove 122, in the heat dissipation channel 123 of right side and lower position, heat radiation derives glue frame 120 by heat dissipation channel 123, simultaneously hot-air in the heat dissipation channel 123 of groove 122 lower position to outside air convection current and heat radiation also corresponding derivation glue frame 120, realize heat radiation.
Shown in figure 3 (d), it is the schematic diagram of the heat dissipation channel that the another embodiment of the utility model provides.This heat dissipation channel 123 is formed in the lower position of groove 122, also be formed in left side and the right positions of groove 122, on the left of groove 122 and the heat dissipation channel 123 of right positions through but do not extend to glue frame 120 both sides, the heat dissipation channel 123 of groove 122 lower position is through but do not extend to glue frame 120 both sides, subsequently in established heat dissipation channel 123, by near glue frame 120 left surface 124 and the thermovent being positioned at groove 122 lower position be positioned at glue frame and be connected and the through left surface 124 extending to glue frame 120 near the thermovent on the left of the groove 122 in left side, and by heat dissipation channel 123, be positioned at the thermovent of glue frame near groove 122 lower position on right side and be connected with the thermovent be positioned on the right side of groove 122 and the through right flank 125 extending to glue frame 120 near glue frame 120 right flank 125, now, the thermovent extending to glue frame 120 left surface 124 is through with the thermovent extending to glue frame 120 right flank 125.Preferably, the thermovent extending to glue frame 120 left surface 124 is connected through with the thermovent extending to glue frame 120 right flank 125 with the heat dissipation channel 123 of groove 122 lower position, thus, heat radiation around light-emitting component respectively on the left of groove 122, that glue frame 120 is derived in right side and lower position circulation is inner, outside air imports and the convection current of glue frame 120 hot inside air from the through heat dissipation channel 123 to glue frame 120 left and right sides of groove 122 lower position, realizes heat radiation.Preferably, the thermovent extending to glue frame 120 left surface 124 is connected through with on the left of groove 122 with the heat dissipation channel 123 of right positions with the thermovent extending to glue frame 120 right flank 125, thus, heat radiation around light-emitting component respectively on the left of groove 122, that glue frame 120 is derived in right side and lower position circulation is inner, outside air imports also and hot-air convection with the through heat dissipation channel 123 to glue frame 120 left and right sides of right positions on the left of groove 122, realizes heat radiation.
Shown in figure 3 (e), it is the schematic diagram of the heat dissipation channel that the another embodiment of the utility model provides.This heat dissipation channel 123 is formed in the lower position of groove 122, is also formed in left side and the right positions of groove 122; Wherein, in heat dissipation channel 123, near glue frame 120 left surface 124 and the thermovent being positioned at groove 122 lower position be connected with the thermovent be positioned on the left of groove 122 and the through left surface 124 extending to glue frame 120, and in heat dissipation channel 123, near glue frame 120 right flank 125 and the thermovent being positioned at groove 122 lower position be connected with the thermovent be positioned on the right side of groove 122 and the through right flank 125 extending to glue frame 120; Further, the heat dissipation channel 123 being formed in the lower position of groove 122 is connected with the heat dissipation channel 123 of the left side being formed in groove 122, right positions.At this, after outside air imports in heat dissipation channel 123 by the thermovent of glue frame 120 left surface 124 and right flank 125, the hot-air that can be produced with light-emitting component respectively by the heat dissipation channel 123 be connected with lower position on the right side of the heat dissipation channel 123 that is connected with lower position on the left of groove 122 lower position heat dissipation channel 123, groove 122, groove 122 carries out convection current, while the light-emitting component heat radiation that sends also can derive glue frame 120 by heat dissipation channel 123.
The heat dissipation channel 123 that what the utility model embodiment provided be arranged in glue frame 120, by through glue frame 120 left surface 124 and right flank 125, the heat radiation of light-emitting component periphery is derived by heat dissipation channel 123, and the hot-air of light-emitting component periphery realizes convection current by heat dissipation channel 123 and exchanges with outside air, accelerates the radiating efficiency of light-emitting component.
Shown in figure 4 (a), it is the utility model schematic diagram of heat dissipation channel of providing of an embodiment again.This heat dissipation channel 123 be formed in groove 122 lower position but and non-through left surface 124 and the right flank 125 extending to glue frame 120, now, hot-air in heat dissipation channel 123 can not be gathered in glue frame 120 inside with outside air convection current, heat radiation, in order to make hot-air can with outside air rapid convective, based on the structure that glue frame 120 second face is not capped, in not through heat dissipation channel 123, form the thermal vias 126 running through glue frame 120 first surface 121 and second.When forming thermal vias 126 in heat dissipation channel 123, thermal vias 126 can realize the convection current of hot-air and outside air, heat radiation derives glue frame 120 by thermal vias 126, when so hot-air flows in the heat dissipation channel 123 of groove 122 lower position, can derive and exchange with outside air from any one thermal vias 126 in groove 122 lower position heat dissipation channel 123 and realize convection current, derive heat radiation.In detail in this figure, the heat dissipation channel 123 of groove 122 lower position of any one light-emitting component also can be separate, be not connected with other groove 122 lower position heat dissipation channels 123, in the heat dissipation channel 123 of now any one groove 122 lower position, be provided with at least one thermal vias 126.
Fig. 4 (a) is depicted as heat dissipation channel 123 and is formed in groove 122 lower position and the structure forming thermal vias 126 in heat dissipation channel 123, at this as shown in Fig. 4 (b), for the utility model schematic diagram of heat dissipation channel of providing of an embodiment again, heat dissipation channel 123 can also be formed in left side and the right positions of groove 122 as mentioned above, the thermal vias 126 running through glue frame 120 first surface 121 and second is also formed in heat dissipation channel 123, be arranged on the left of any one groove 122 and form at least one thermal vias 126 with the heat dissipation channel 123 of right positions, heat radiation can be realized derive, glue frame 120 inner air and outer air exchanges, accelerate heat radiation.As shown in Fig. 4 (c), for the utility model schematic diagram of heat dissipation channel of providing of an embodiment again, the lower position of groove 122 is formed at this heat dissipation channel 123, and be also formed in left side and the right positions of groove 122, also form the thermal vias 126 running through glue frame 120 first surface 121 and second in heat dissipation channel 123, the peripheral position of any one light-emitting component all at least comprises a thermal vias 126.
Shown in figure 4 (d), it is the utility model schematic diagram with the heat dissipation channel of thermal vias of providing of an embodiment again.Any one heat dissipation channel 123 shown in Fig. 3 (a)-3 (e) extends to thermovent outside glue frame 120 and outside air exchanges by through, reaches to accelerate heat radiation, derive thermal-radiating effect.If increase at least one thermal vias 126 in the heat dissipation channel 123 shown in Fig. 3 (a)-3 (e) respectively, then correspondingly improve radiating efficiency, therefore the thermal vias 126 running through glue frame 120 first surface 121 and second is preferably also formed in heat dissipation channel 123, the quantity of thermal vias 126 can set according to different user situation, for the heat dissipation channel 123 shown in Fig. 3 (e), increase thermal vias 126 to heat dissipation channel 123, the heat dissipation channel 123 of formation is as shown in Fig. 4 (d).At this, preferably at least one thermal vias 126 is respectively set in the heat dissipation channel 123 of the left side of groove 122, right side and lower position, so heat dissipation channel 123 is by the thermovent of glue frame 120 left surface 124 and the thermovent of right flank 125 with outside air exchanges, the heat radiation of light-emitting component is derived, and also passes through hot-air convection that the thermovent of the thermal vias 126 of glue frame 120 second and light-emitting component produce simultaneously, heat radiation derives.
In Fig. 3 (e), thermal vias 126 is increased as Fig. 4 (d) is depicted as, dispelled the heat by the thermovent of thermal vias 126 glue frame 120 second, at this because glue frame 120 first surface 121 contacts with reflector plate 110, but the first surface 121 of the incomplete rubber cover frame 120 of reflector plate 110, therefore as shown in Fig. 4 (e), for the utility model schematic diagram of heat dissipation channel of providing of an embodiment again, can also form a heat dissipation channel 123 (radiating groove 127) by any one shown in Fig. 3 (a)-3 (e) heat dissipation channel 123 that is positioned at glue frame 120 first surface 121, this heat dissipation channel 123 to extend in glue frame 120 first surface 121 not by region that reflector plate 110 covers, thus realize the exchange with hot-air as air inlet, accelerate heat radiation to derive, heat radiation, at this, for the heat dissipation channel of shown in Fig. 3 (e) 123, radiating groove 127 is increased to heat dissipation channel 123, the heat dissipation channel 123 formed is as shown in Fig. 4 (e), preferably heat dissipation channel 123 is also formed in glue frame 120 first surface 121 and is positioned at groove 122 peripheral position, and through first surface 121 region extending to the glue frame 120 do not covered by reflector plate 110.
Composition graphs 4 (d) and the heat dissipation channel 123 described in Fig. 4 (e), as shown in Fig. 4 (f), for the utility model schematic diagram of heat dissipation channel of providing of an embodiment again, thermal vias 126 can be combined with radiating groove 127, preferably, heat dissipation channel 123 is also formed in glue frame 120 first surface 121 and is positioned at groove 122 peripheral position, and through first surface 121 region extending to the glue frame 120 do not covered by reflector plate 110, and in heat dissipation channel 123, also form the thermal vias 126 running through glue frame 120 first surface 121 and second.
The heat dissipation channel 123 that what the utility model embodiment provided be arranged in glue frame 120, not only through glue frame 120 left surface 124 and right flank 125, heat dissipation channel 123 also has the thermal vias 126 running through glue frame 120 first surface 121 and second simultaneously, so the heat radiation of light-emitting component periphery exports to the outside of glue frame 120 by heat dissipation channel 123, and export to second of glue frame 120, and the hot-air of light-emitting component periphery realizes convection current by heat dissipation channel 123 and exchanges with outside air, accelerates the radiating efficiency of light-emitting component.
Further, known thermal vias 126 is formed on the left of groove 122 and right positions, or thermal vias 126 is formed in groove 122 lower position, or thermal vias 126 is formed on the left of groove 122, right side and lower position, therefore for be formed on the left of groove 122 and right positions thermal vias 126 for, the area of this thermal vias 126 should be less than glue frame 120 area between adjacent two grooves 122, that is, reserve part glue frame 120 is answered between adjacent two light-emitting components, for the thermal vias 126 being formed in groove 122 lower position, the area of thermal vias 126 should be less than glue frame 120 area of groove 122 lower position, be conducive to ensureing the mechanical strength of glue frame and the stability of backlight module.
Further, known thermal vias 126 is positioned at groove 122 lower position, and thermal vias 126 is positioned on the left of groove 122 and position, position, so be less than the area of adjacent two grooves 122 based on being positioned on the left of groove 122 with the area of the thermal vias 126 on right side, the shape of thermal vias 126 can be arranged arbitrarily under the restriction of thermal vias 126 area, can be at least circular in this thermal vias 126 shape, or it is oval, or it is square, or rhombus, or hexagon, shown in figure 4 (d), the shape of thermal vias 126 is set to circle.
Further, known heat dissipation channel 123 is formed at least one face of the first surface 121 of glue frame 120 and second, at this, when heat dissipation channel 123 is formed in the first surface 121 of glue frame 120 or second, then the degree of depth of heat dissipation channel 123 can be set to heat dissipation channel 123 thickness being less than arbitrarily thickness between glue frame 120 first surface 121 and second, but rupture to prevent glue frame 120 and affect glue frame 120 intensity, being no more than 1/3 of glue frame 120 thickness in this degree of depth preferably arranging heat dissipation channel 123.When heat dissipation channel 123 is formed in the first surface 121 of glue frame 120 and second, and the heat dissipation channel 123 being positioned at glue frame 120 first surface 121 is oppositely arranged at the same position height of glue frame 120 with the heat dissipation channel 123 being positioned at glue frame 120 second, so the degree of depth summation of two heat dissipation channels 123 can not exceed glue frame 120 thickness, in order to ensure glue frame 120 intensity, preferably, the degree of depth summation of two heat dissipation channels 123 should be less than 1/3rd thickness of glue frame 120.When heat dissipation channel 123 is formed in the first surface 121 of glue frame 120 and second, and the heat dissipation channel 123 being arranged in glue frame 120 first surface 121 staggers in the position of glue frame 120 completely with the heat dissipation channel 123 being positioned at glue frame 120 second, so preferably, the degree of depth of any one heat dissipation channel 123 should be less than 1/3rd thickness of glue frame 120, with reference to the multiple heat dissipation channels 123 shown in figure 3 (a)-4 (f), its degree of depth is set to 1/3rd thickness being less than glue frame 120.
Further, for any one heat dissipation channel 123, the advantage that the fluting shape of heat dissipation channel 123 should have to be increased swept area, accelerate heat radiation, therefore as shown in Fig. 5 (a), be the section shape schematic diagram of the heat dissipation channel that another embodiment of the utility model provides, the section shape of heat dissipation channel 123 is set to semicircle, at this, the section shape of heat dissipation channel 123 can also be set to square, U-shaped or V-arrangement, and wherein, the radiating effect of semicircular heat dissipation channel 123 is best.
For any materials, its surface treatment is different, the thermal emissivity rate of material also can be different, cause material heat loss through radiation ability also can be different, when multiple light-emitting component produces heat radiation, because the thermal conductivity factor of air is very little, air layer becomes contact resistance, when in heat dissipation channel 123, thermal contact resistance is larger, if heat dissipation channel 123 inwall is smooth inner wall, then under large thermal contact resistance, heat dissipation channel 123 radiating effect is poor.Because thermal contact resistance and contact area are inversely proportional to, then in order to carry out good heat radiation, the inner wall surface of heat dissipation channel 123 can be set to the surface with roughness, when heat dissipation channel 123 inwall has roughness, heat radiation contact area becomes large, heat dissipation channel 123 excellent in heat dissipation effect.Preferably, as shown in Fig. 5 (b), be the section interior wall construction schematic diagram of the heat dissipation channel that another embodiment of the utility model provides, the inner wall surface of heat dissipation channel 123 is high surface roughness or low surface roughness.
Known metal material has the electronics that can move freely, when metal material one end is heated, the vibration frequency of metal inside electronics increases, collide next electronics, heat imports to the other end of metal material from one end of metal material thus, and therefore metal material is conductor, can conduct fast heat, thus for the heat dissipation channel 123 that the present embodiment provides, metallic film can be attached at heat dissipation channel 123 inwall, dispel the heat to accelerate heat dissipation channel 123.In addition, one deck heat conducting material can also be applied in the inner wall surface of heat dissipation channel 123, dispel the heat to accelerate heat dissipation channel 123.Therefore, as shown in Fig. 5 (c), the schematic diagram of the inside wall film layer of the heat dissipation channel provided for another embodiment of the utility model, preferably, the inner wall surface of heat dissipation channel 123 has layer of metal rete 128 or the heat transfer coating of coating.
Note, above are only preferred embodiment of the present utility model and institute's application technology principle.Skilled person in the art will appreciate that the utility model is not limited to specific embodiment described here, various obvious change can be carried out for a person skilled in the art, readjust and substitute and protection domain of the present utility model can not be departed from.Therefore, although be described in further detail the utility model by above embodiment, but the utility model is not limited only to above embodiment, when not departing from the utility model design, can also comprise other Equivalent embodiments more, and scope of the present utility model is determined by appended right.
Claims (14)
1. a back lighting device, it is characterized in that, comprise: reflector plate, the glue frame contacted with described reflector plate, the light guide plate be contained in described glue frame, wherein, the one side that described glue frame contacts with described reflector plate is described glue frame first surface, and the one side that described glue frame deviates from described reflector plate is described glue frame second;
Described glue frame comprises at least one groove for fixing light-emitting component, described glue frame also comprises heat dissipation channel, described heat dissipation channel is arranged at least one face in the first surface of described glue frame and second, and described heat dissipation channel is positioned at described recessed circumferential position.
2. back lighting device according to claim 1, is characterized in that, described heat dissipation channel is formed in the optional position of the left side of described groove, right side or bottom.
3. back lighting device according to claim 2, is characterized in that, the left surface of the through described glue frame of described heat dissipation channel and right flank; Or described heat dissipation channel runs through the first surface of described glue frame and second; Or the left surface of the through described glue frame of described heat dissipation channel and right flank, also run through the first surface of described glue frame and second simultaneously; Wherein, the left surface of described glue frame is positioned at the left side of described groove, and the right flank of described glue frame is positioned at the right side of described groove.
4. back lighting device according to claim 3, is characterized in that, described heat dissipation channel is formed in the left side of described groove and right positions and through left surface and the right flank extending to described glue frame; Or described heat dissipation channel is formed in the lower position of described groove and through left surface and the right flank extending to described glue frame; Or described heat dissipation channel is formed in the left side of described groove and right positions and through left surface and the right flank extending to described glue frame, be also formed in the lower position of described groove and through left surface and the right flank extending to described glue frame simultaneously.
5. back lighting device according to claim 3, is characterized in that, described heat dissipation channel is formed in the lower position of described groove, is also formed in left side and the right positions of described groove;
Wherein, in described heat dissipation channel, near described glue frame left surface and the thermovent being positioned at described groove lower position be connected with the thermovent be positioned on the left of described groove and the through left surface extending to described glue frame, and in described heat dissipation channel, near described glue frame right flank and the thermovent being positioned at described groove lower position be connected with the thermovent be positioned on the right side of described groove and the through right flank extending to described glue frame.
6. back lighting device according to claim 5, is characterized in that, the heat dissipation channel being formed in the lower position of described groove be formed in the left side of described groove, the heat dissipation channel of right positions is connected.
7. back lighting device according to claim 3, is characterized in that, described heat dissipation channel is formed in the lower position of described groove, also forms the thermal vias running through described glue frame first surface and second in described heat dissipation channel; Or described heat dissipation channel is also formed in left side and the right positions of described groove, in described heat dissipation channel, also form the thermal vias running through described glue frame first surface and second; Or described heat dissipation channel is formed in the lower position of described groove, and be also formed in left side and the right positions of described groove, in described heat dissipation channel, also form the thermal vias running through described glue frame first surface and second.
8. the back lighting device according to any one of claim 1-7, is characterized in that, also forms the thermal vias running through described glue frame first surface and second in described heat dissipation channel; Or described heat dissipation channel is also formed in described glue frame first surface and is positioned at described recessed circumferential position, and the through first surface region extending to the described glue frame do not covered by described reflector plate; Or, described heat dissipation channel is also formed in described glue frame first surface and is positioned at described recessed circumferential position, and the through first surface region extending to the described glue frame do not covered by described reflector plate, and in described heat dissipation channel, also form the thermal vias running through described glue frame first surface and second.
9. back lighting device according to claim 8, is characterized in that, the area of described thermal vias is less than the glue frame area between adjacent two described grooves.
10. back lighting device according to claim 8, is characterized in that, the shape of described thermal vias at least comprises: circular, oval, square, rhombus, hexagon.
11. back lighting devices according to any one of claim 1-7, it is characterized in that, the degree of depth of described heat dissipation channel is less than 1/3rd thickness of described glue frame.
12. back lighting devices according to any one of claim 1-7, it is characterized in that, the section shape of described heat dissipation channel at least comprises: semicircle, square, U-shaped or V-arrangement.
13. back lighting devices according to any one of claim 1-7, it is characterized in that, the inner wall surface of described heat dissipation channel is high surface roughness or low surface roughness.
14. back lighting devices according to any one of claim 1-7, it is characterized in that, the inner wall surface of described heat dissipation channel has layer of metal rete or the heat transfer coating of coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420844219.5U CN204629218U (en) | 2014-12-25 | 2014-12-25 | A kind of back lighting device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420844219.5U CN204629218U (en) | 2014-12-25 | 2014-12-25 | A kind of back lighting device |
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| CN204629218U true CN204629218U (en) | 2015-09-09 |
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| CN201420844219.5U Active CN204629218U (en) | 2014-12-25 | 2014-12-25 | A kind of back lighting device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104534359A (en) * | 2014-12-25 | 2015-04-22 | 武汉天马微电子有限公司 | Backlight device |
| WO2017118035A1 (en) * | 2016-01-05 | 2017-07-13 | 京东方科技集团股份有限公司 | Light guide component, backlight module and display apparatus |
| CN111708226A (en) * | 2020-06-30 | 2020-09-25 | 厦门天马微电子有限公司 | Backlight module and display device |
-
2014
- 2014-12-25 CN CN201420844219.5U patent/CN204629218U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104534359A (en) * | 2014-12-25 | 2015-04-22 | 武汉天马微电子有限公司 | Backlight device |
| WO2017118035A1 (en) * | 2016-01-05 | 2017-07-13 | 京东方科技集团股份有限公司 | Light guide component, backlight module and display apparatus |
| US10473978B2 (en) | 2016-01-05 | 2019-11-12 | Boe Technology Group Co., Ltd. | Light guide assembly, backlight module, display device |
| CN111708226A (en) * | 2020-06-30 | 2020-09-25 | 厦门天马微电子有限公司 | Backlight module and display device |
| CN111708226B (en) * | 2020-06-30 | 2022-06-03 | 厦门天马微电子有限公司 | Backlight module and display device |
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