CN105527752A - Backlight module and display device thereof - Google Patents
Backlight module and display device thereof Download PDFInfo
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- CN105527752A CN105527752A CN201510992514.4A CN201510992514A CN105527752A CN 105527752 A CN105527752 A CN 105527752A CN 201510992514 A CN201510992514 A CN 201510992514A CN 105527752 A CN105527752 A CN 105527752A
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- partition wall
- backlight
- metal frame
- heat conduction
- backlight module
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133608—Direct backlight including particular frames or supporting means
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133628—Illuminating devices with cooling means
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Planar Illumination Modules (AREA)
Abstract
The invention provides a backlight module. The backlight module comprises a plurality of backlights, a rubber frame, an optical film and heat conduction partition walls located among the backlights. The heat conduction partition walls can conduct out the heat generated by a light source through the way of being in contact with a metal outer frame through a manner of penetrating through the rubber frame, or of being in direct contact with the bottom surface of the metal outer frame, or penetrating through the metal outer frame and the like. The heat conduction partition walls can be separately manufactured, or can be integrally manufactured with the rubber frame and an iron frame. According to the backlight module provided by the invention, through arranging the partition walls of the light source as a heat conduction structure, the heat emitted by the light source can be quickly conducted out, the temperature of the backlight module is reduced and the effect of the temperature of the backlight module on a display device is reduced.
Description
Technical field
The present invention relates to display field, particularly relate to a kind of backlight module and display device thereof of good heat dispersion performance.
Background technology
Liquid crystal display has frivolous, the energy-conservation advantage such as radiationless, is widely used in mobile communication, digital device.Liquid crystal display mostly is backlight liquid crystal display, comprises liquid crystal panel, backlight module and housing.Display panels itself is not luminous, needs the light source provided by backlight module normally to show image, therefore, and one of backlight module key component becoming liquid crystal indicator.
As shown in Figure 1, in prior art, backlight module is made up of parts such as light source 1 ', glue frame 2 ', metal frame 3 ', blooming pieces 4 '.When backlight module works, multiple light source is simultaneously luminous, and continues to produce heat.Be FPC with the parts of light source contacts in backlight module, be glue frame and blooming piece around light source, glue frame and blooming piece are High molecular polymer, heat is not easy derive and produce heat built-up at glue frame and blooming piece, during the luminescence simultaneously of multiple light source, middle multiple heat of light sources are especially not easy to derive.The thermal deformation that blooming piece is gathering heat rear film and can produce, causes occurring the defects such as optical stripe in display panel light emission side, affects display quality.The heat accumulating in display device inside in addition also can affect electricity, optical device in liquid crystal panel, thus affects display effect.In recent years, the LCD plate bulk that liquid crystal indicator especially moves consumer products is more and more less, more and more requires frivolous, in corresponding backlight module, each assembly is also compacter, remaining heat-dissipating space diminishes, the more difficult diffusion of heat that light source produces, and affects the display performance of display device.
Summary of the invention
In order to solve above-mentioned problem, the embodiment of the present invention provides a kind of backlight module, comprise optical diaphragm group, multiple backlight and housing, described optical diaphragm group, multiple backlight are arranged in described housing, described housing has at least one partition wall, and described multiple backlight is between described partition wall, and described partition wall is made up of Heat Conduction Material.
The present invention also provides a kind of display device, it is characterized in that, comprises backlight module as previously discussed.
The heat that light source gives out, by the partition wall of light source is set to conductive structure, can be derived by the present invention fast, reduces the temperature of backlight module, extends the luminescent lifetime of light source, improves the luminescence efficiency of light source, reduces backlight module temperature to the impact of display device.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the partial structurtes vertical view of the Lights section of backlight module in prior art;
Fig. 2 is the vertical view that metal frame establishes bossed backlight module;
Fig. 3 is the sectional view that metal frame establishes bossed backlight module;
Fig. 4 is the sectional view that heat conduction partition wall embeds bottom metal frame;
Fig. 5 is the heat conduction curtain wall structure schematic diagram with inner core;
Fig. 6 is the heat conduction curtain wall structure schematic diagram being provided with through hole;
Fig. 7 is that heat conduction partition wall runs through the sectional view contacted with external cooling layer bottom metal frame;
Fig. 8 is the vertical view that heat conduction partition wall embeds glue frame;
Fig. 9 is the sectional view that heat conduction partition wall embeds glue frame;
Figure 10 is the sectional view that heat conduction partition wall runs through glue frame and metal frame contact aside;
Figure 11 is the sectional view that heat conduction partition wall runs through glue frame and contacts with base with metal frame side simultaneously;
Figure 12 is the sectional view that heat conduction partition wall runs through glue frame and contacts with external cooling layer with metal frame side;
Figure 13 is the sectional view on heat conduction partition wall direct contacting metal frame base;
Figure 14 is the sectional view that heat conduction partition wall runs through glue frame and contacts with external cooling layer with metal frame side and metal frame base;
Figure 15 is that heat conduction partition wall is bonded in the structural representation on metal frame base by heat-conducting glue;
Figure 16 is that heat conduction partition wall is bonded in the sectional view on metal frame base by heat-conducting glue;
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described.Obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Set forth a lot of detail in the following description so that fully understand the present invention, but the present invention can also adopt other to be different from alternate manner described here to implement, those skilled in the art can when without prejudice to doing similar popularization when intension of the present invention, therefore the present invention is by the restriction of following public specific embodiment.
Embodiments provide a kind of backlight module, as shown in Figure 2 and Figure 3, Fig. 3 is the sectional view of dotted box portion in Fig. 2, and backlight module comprises multiple light source 1, metal frame 3, blooming piece 4, multiple heat conduction partition wall 5, multiple light source 1 and the spaced setting of multiple heat conduction partition walls 5.Wherein, heat conduction partition wall 5 is a part for metal frame 3, and the metal frame 3 with heat conduction wall part by arranging shrinkage pool (corresponding heat conduction partition wall) and one-shot forming in the mould of preparation process.In the present embodiment, the heat absorption that can be produced by light source when light source luminescent with light source spaced heat conduction partition wall also conducts to whole metal frame, realizes the thermal diffusion of light source, reduces light-source temperature during backlight module work, extend the luminescent lifetime of light source, improve the luminescence efficiency of light source; Also reduce the heat of light source generation on the other hand to the impact of blooming piece, prevent the thermal deformation of blooming piece from causing the decline of display quality.
Fig. 4 ~ Fig. 7 is the schematic cross-section of backlight module in another embodiment of the present invention.Fig. 4 a is the top cross-sectional view of the present embodiment backlight module, Fig. 4 b be A in Fig. 4 a ?A sectional view, Fig. 4 a be A ’ in Fig. 4 b ?A ' sectional view.Backlight module comprises multiple light source 1, metal frame 3, blooming piece 4, multiple heat conduction partition wall 5, multiple light source 1 and the spaced setting of multiple heat conduction partition walls 5, metal frame has base 3A and side 3B, heat conduction partition wall 5 is made up of graphite material, and heat conduction partition wall 5 one end embeds the base of metal frame, remainder is positioned among the interval of multiple light source.In this way, heat conduction partition wall is fixed in metal frame, become to be integrated with metal frame, the heat produced when making multiple light source (the multiple light sources especially) luminous can diffuse to rapidly in metal frame, reduces light-source temperature during backlight module work.Heat conduction partition wall also can adopt other Heat Conduction Materials, and as metal materials such as metallic coppers, the present invention is not construed as limiting this.
As shown in Figure 4 b, heat conduction partition wall embeds the contact position of metal frame, adds that viscose 6 is with auxiliary fixing.Heat conduction partition wall 5 has inner core 7, and inner core 7 has the intensity higher than the remainder of heat conduction partition wall 5, arranges inner core and the bulk strength of heat conduction partition wall can be made higher, prevents in the technological processs such as shaping, embedding, the breakage of heat conduction partition wall.In other embodiments of the present embodiment, heat conduction partition wall is positioned at the part 5A ' surface irregularity among multiple light source interval, the body surface area of 5A ' part is greater than the projected area on its surface, as shown in Figure 5, thus make the area of heat conduction partition wall absorption heat larger, heat conduction is faster, improves the heat transfer efficiency of heat conduction partition wall.In the present invention, the 5A ' part of heat conduction partition wall also can be set to the mode that other increase endotherm area, as shown in Figure 6, arranges through hole 8 to increase body surface area in 5A ' part.Also 5A ' surface can be set to shape of threads in addition, or adopt the porosint of heat conduction to make heat conduction partition wall, the present invention does not limit this, as long as make body surface area be greater than the design of its projected area, all in scope.
In the present embodiment, heat conduction partition wall embeds in metal frame after can making separately again, also can be that heat conduction partition wall and metal frame are one-body molded.In heat conduction partition wall and the integrated technique of metal frame, in advance heat conduction partition wall is placed on preposition with the mould making metal frame and fixes, then by metal filled to its gap, the shaping rear demoulding, obtains the metal frame being integrated with heat conduction partition wall.
Be illustrated in figure 7 the another kind of embodiment of the present embodiment, heat conduction partition wall 5 runs through the base 3A of metal frame.A heat dissipating layer 9 is had in metal frame arranged outside, heat dissipating layer 9 is made up of graphite material, one end 5B that heat dissipating layer 9 and metal frame, heat conduction partition wall 5 run through metal frame base directly contacts, the heat that heat conduction partition wall can be absorbed exports in heat dissipating layer 9, and graphite radiating layer 9 is comparatively large with the contact area of metal frame, heat can be derived more rapidly equably, reduce temperature.Heat dissipating layer 9 also can adopt other Heat Conduction Materials, and as metal materials such as metallic coppers, the present invention is not construed as limiting this.
In the present invention, heat conduction partition wall is except embedding metal frame base, also fixes by embedding glue frame.In an alternative embodiment of the invention, as shown in Fig. 8 ~ Figure 13, backlight module comprises multiple light source 1, glue frame 2, metal frame 3, blooming piece 4, multiple heat conduction partition wall 5, and multiple light source 1 and the spaced setting of multiple heat conduction partition walls 5, heat conduction partition wall 5 is made up of graphite material.Glue frame 2 is positioned at the inner side of metal frame 3 side, the inside surface of side exterior surface metal frame 3 side of glue frame 2, the upper surface on contacting metal frame 3 base, bottom surface of glue frame.As shown in Figure 8, heat conduction partition wall one end embeds in glue frame, and remainder is positioned among the interval of multiple light source, Fig. 9 be in Fig. 8 B ?B sectional view, Fig. 8 be B ’ in Fig. 9 ?B ' sectional view.By embedding among glue frame, heat conduction partition wall is fixed, the heat produced when the part 5A among the interval that heat conduction partition wall is positioned at multiple light source can absorb multiple light source luminescent, the heat accumulation preventing from reducing miscellaneous part and the decline of display quality caused thereof.
In the present embodiment, heat conduction partition wall 5 embeds after can making separately in glue frame 2 again, also can be that heat conduction partition wall and glue frame 2 are one-body molded.In heat conduction partition wall and the integrated technique of glue frame 2, in advance heat conduction partition wall 5 is placed on preposition with the mould making glue frame 2 and fixes, then glue frame material is filled to its gap, the shaping rear demoulding, obtains the glue frame 2 being integrated with heat conduction partition wall 5.
In another embodiment of the present embodiment, as shown in Figure 10, heat conduction partition wall embedding glue frame part 5B runs through glue frame and contacts with metal frame side 3B, thus the heat that heat conduction partition wall absorbs outwards is exported to metal frame.Heat conduction partition wall contacts with metal frame outwards can derive heat constantly, reduces the working temperature of module, improves display quality.
Further, the part 5B that heat conduction partition wall embeds glue frame can be further divided into two part 51B, 52B, heat conduction partition wall runs through glue frame 2 by 51B, 52B simultaneously, contact with side 3B with the base 3A of metal frame respectively, as shown in figure 11, thus the contact area increased further between heat conduction partition wall and metal frame, improve heat transfer efficiency.In the present embodiment, the part 5B of heat conduction partition wall embedding glue frame can be further divided into more part to be run through glue frame and contacts with metal frame, is not limited in the mode shown in the present embodiment.
Further, heat conduction partition wall 5 runs through the side 3B of glue frame 2 and metal frame simultaneously, as shown in figure 12.A heat dissipating layer 9 is had in metal frame arranged outside, heat dissipating layer 9 is made up of graphite material, heat dissipating layer 9 contacts with metal frame, heat conduction partition wall 5, the heat that heat conduction partition wall can be absorbed exports in heat dissipating layer 9, and graphite radiating layer 9 is comparatively large with the contact area of metal frame, heat can be derived more rapidly equably, reduce temperature.Heat dissipating layer 9 also can adopt other Heat Conduction Materials, and as metal materials such as metallic coppers, the present invention is not construed as limiting this.
Figure 13 and Figure 14 is the structural representation of further embodiment of this invention.Be with the distinctive points of previous embodiment, in the present embodiment, heat conduction partition wall directly contacts with side with the base of metal frame simultaneously.Figure 13 is an embodiment of the present embodiment, and backlight module comprises multiple light source 1, glue frame 2, metal frame 3, blooming piece 4, multiple heat conduction partition wall 5, and multiple light source 1 and the spaced setting of multiple heat conduction partition walls 5, heat conduction partition wall 5 is made up of graphite material.Heat conduction partition wall one end 5B runs through glue frame simultaneously and contacts with metal frame side 3B, is positioned at the base 3A of the direct contacting metal frame 3 in bottom of the 5A among multiple light source interval.In this embodiment, the bottom surface of heat conduction partition wall is plane, with close contact bottom metal frame, thus increases the contact area of heat conduction partition wall and metal frame further, improves heat transfer efficiency.
Figure 14 is the another kind of embodiment of the present embodiment, backlight module comprises the heat dissipating layer 9 of multiple light source 1, glue frame 2, metal frame 3, blooming piece 4, multiple heat conduction partition wall 5 and metal frame outside, heat conduction partition wall part 5B runs through glue frame and metal frame side, other end 5C runs through the base 3A of metal frame, and remainder 5B is positioned among multiple light source interval.Metal frame outside has heat dissipating layer 9, and heat dissipating layer 9 directly contacts with 5B, 5C outer face of metal frame 3 and heat conduction partition wall.The heat that heat conduction partition wall can be absorbed is conducted in heat dissipating layer 9 by the side of metal frame and base simultaneously, increases the contact area of heat conduction partition wall and metal frame and external cooling layer 9, further increases heat transfer efficiency.
In the present invention, the fixed form of heat conduction partition wall can also adopt gluing fixing mode, as Figure 15 with Figure 16 shows that another embodiment of the present invention structural representation, Figure 16 be C in Figure 15 ?C sectional view, backlight module comprises multiple light source 1, glue frame 2, metal frame 3, multiple heat conduction partition wall 5 and heat-conducting glue 10, multiple heat conduction partition wall 5 is positioned among the interval of multiple light source, and heat conduction partition wall 5 coheres fixing by heat-conducting glue 10 and the base of metal frame 3.The heat produced during multiple light source luminescent diffuses to metal frame by heat-conducting glue after being absorbed by multiple heat conduction partition wall.In the present embodiment, heat conduction partition wall and metal frame base gluing while, also can embed or run through the side of glue frame and metal frame.
In the present invention, the connected mode of heat conduction partition wall and metal frame and connecting portion are not limited, as long as heat conduction partition wall to be extended to base or the side of contacting metal frame, or base and the side of metal frame is connected to by intermediate thermal conductivity medium, make the structure-integrated connected mode of heat conduction partition wall and metal frame, all within the scope of description of the invention.
In this instructions, various piece adopts the mode of going forward one by one to describe, and what each some importance illustrated is the difference with other parts, between various piece identical similar portion mutually see.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the present invention.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein can without departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention can not be restricted to embodiment illustrated herein, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (20)
1. a backlight module, comprises optical diaphragm group, multiple backlight and housing, described optical diaphragm group, multiple backlight are arranged in described housing, described housing has at least one partition wall, and described multiple backlight is between described partition wall, and described partition wall is made up of Heat Conduction Material.
2. backlight module as claimed in claim 1, it is characterized in that, described housing comprises metal frame, and described partition wall is the projection of the inside surface of described metal frame, and described multiple backlight is between described projection.
3. backlight module as claimed in claim 1, it is characterized in that, described housing comprises metal frame, and described partition wall embeds in described metal frame at least partially, and remainder is between described multiple backlight.
4. backlight module as claimed in claim 1, it is characterized in that, described housing comprises metal frame, and described partition wall runs through in described metal frame at least partially, and remainder is between described multiple backlight.
5. backlight module as claimed in claim 1, it is characterized in that, described housing comprises metal frame and glue frame, and described glue frame is positioned at inside said metal frame, and described partition wall embeds described glue frame at least partially, and remainder is arranged in described backlight gap.
6. backlight module as claimed in claim 1, it is characterized in that, described housing comprises metal frame and glue frame, and described glue frame is positioned at inside said metal frame, described partition wall runs through described glue frame at least partially and contacts with described metal frame, and remainder is arranged in described backlight gap.
7. backlight module as claimed in claim 1, it is characterized in that, described housing comprises metal frame and glue frame, and described glue frame is positioned at inside said metal frame, described partition wall runs through described glue frame and described metal frame at least partially, and remainder is arranged in described backlight gap.
8. the backlight module as described in any one of claim 3 ~ 7, is characterized in that, metal frame described in the part contact that described partition wall is arranged in described backlight gap.
9. the backlight module as described in any one of claim 4 or 7, it is characterized in that, described metal frame outer setting has outer heat conductive layers, and the part that described partition wall runs through described metal frame contacts with described outer heat conductive layers.
10. backlight module as claimed in claim 9, it is characterized in that, the Heat Conduction Material of described outer heat conductive layers is graphite.
11. backlight modules described as claimed in claim 1, is characterized in that, described partition wall and described housing one-body molded.
12. backlight modules as described in any one of claim 3 ~ 7, it is characterized in that, the Heat Conduction Material of described partition wall is graphite.
13. backlight modules as described in any one of claim 3 ~ 7, it is characterized in that, described partition wall has inner core, and described inner core is made up of Heat Conduction Material, and intensity is higher than described partition wall remainder.
14. backlight modules as described in any one of claim 3 ~ 7, is characterized in that, described partition wall adopts isostatic pressing method manufacture.
15. backlight modules as described in any one of claim 3 ~ 7, is characterized in that, the binding site that described partition wall embeds is provided with viscose.
16. backlight modules as claimed in claim 1, is characterized in that, the part body surface area that described partition wall is positioned at described backlight gap is greater than the projected area sum of its each surface in its corresponding place plane.
17. backlight modules as claimed in claim 16, it is characterized in that, the part that described partition wall is positioned at described backlight gap is made up of porous conductive material.
18. backlight modules as claimed in claim 16, it is characterized in that, the part that described partition wall is positioned at described backlight gap is provided with at least one through hole.
19. backlight modules as claimed in claim 16, it is characterized in that, the part surface that described partition wall is positioned at described backlight gap is uneven.
20. 1 kinds of display device, is characterized in that, comprise the backlight module as described in any one of claim 1 ?19.
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| CN201510992514.4A CN105527752B (en) | 2015-12-25 | 2015-12-25 | A kind of backlight module and its display device |
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| CN201510992514.4A CN105527752B (en) | 2015-12-25 | 2015-12-25 | A kind of backlight module and its display device |
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| CN114267780A (en) * | 2021-12-14 | 2022-04-01 | Tcl华星光电技术有限公司 | Display panel and manufacturing method thereof |
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