CN105522287A - Laser processing method for narrow slit - Google Patents
Laser processing method for narrow slit Download PDFInfo
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- CN105522287A CN105522287A CN201410829062.3A CN201410829062A CN105522287A CN 105522287 A CN105522287 A CN 105522287A CN 201410829062 A CN201410829062 A CN 201410829062A CN 105522287 A CN105522287 A CN 105522287A
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Abstract
The invention discloses a laser processing method for a narrow slit. The laser processing method comprises the following steps: S1: adopting a laser processing mode to process out a first through hole group comprising a plurality of spaced through holes in a to-be-processed part; S2: adopting the laser processing mode to process out a i-th through hole group comprising a plurality of spaced through holes in the to-be-processed part, wherein the plurality of through holes in the i-th through hole group are respectively in one-to-one correspondence with the plurality of through holes in a (i-1-)-th through hole group, and each through hole in the i-th through hole set is communicated with the corresponding through hole in the (i-1-)-th through hole group; and S3: repeating the step S2 until any through hole in any through hole group is communicated with a through hole adjacent to the corresponding through hole, so that all through holes form a narrow slit, wherein the processing total group number is not smaller than 2, and the through holes are formed by processing along the square periphery in one surface of the to-be-processed part through laser. The side edge of the narrow slit obtained by the laser processing method for the narrow slit disclosed by the invention is flat and smooth without sags and crests.
Description
Technical field
The present invention relates to manufacture field, especially relate to a kind of laser processing of slit.
Background technology
The method of processing slit at present on metal mainly contains two kinds, and one is Ultra-Violet Laser processing, and another kind is the mode utilizing traditional machined slot, as emery wheel cutting, Digit Control Machine Tool etc.Wherein adopt Ultra-Violet Laser processing, the micro-process of the machinery of feature to metal of ultraviolet short wavelength itself has superiority.It can be focused onto on the point of systems, therefore can carry out effective materials processing on trickle parts.But the laser due to this special wavelength and frequency needs the laser excitation of shorter wavelength, and this increases unnecessary complexity to laser system.So plant capacity generally only has several watts, the metal needs for the thick 0.2mm of being greater than of material repeats processing, and the galvanometer of height scan has certain precision, and reprocessabilty repeatedly can cause the reduction of machining accuracy and the prolongation of process time.
Adopt the mode of traditional machined slot, machining accuracy is low, and under this cutting mode, blade/drill bit etc. contacts processing work in the mode run up, and can produce mechanical stress, easily cause deformation of products to workpiece, reduces overall mechanical strength.
Summary of the invention
The object of the invention is to overcome the problems referred to above, there is provided that a kind of process time is short, machining accuracy is high and the laser processing of the slit blocked not easily occurs, further, edge's flat smooth of the slit obtained by the laser processing of slit of the present invention is not uneven.
To achieve these goals, the invention provides a kind of laser processing of slit, the method comprises the steps:
S1: adopt the mode of Laser Processing to process first sets of vias comprising multiple isolated through hole on workpiece to be added;
S2: adopt the mode of Laser Processing to process i-th sets of vias comprising multiple isolated through hole on workpiece to be added, multiple through holes in multiple through hole wherein in i-th sets of vias and the i-th-1 sets of vias one_to_one corresponding respectively, and each through hole in i-th sets of vias and the respective through hole conducting in the i-th-1 sets of vias;
S3: repeat S2 step, until the through hole conducting adjacent with this through hole of any one through hole arbitrarily in sets of vias forms a slit to make whole through hole;
Wherein, processing total group number is not less than 2 groups, and described through hole is processed along square surrounding on a surface of workpiece to be added by laser.
According to the laser processing of slit of the present invention, by adopting the mode of grouping boring to process slit, not only solve susceptible to plugging problem in slit process.The method of relatively existing Ultra-Violet Laser processing slit in addition, the thickness of workpiece to be added of the present invention can reach 1mm, processes at one time, and has greatly saved the time.The method of relatively existing machined slot simultaneously, laser processing of the present invention produces mechanical impetus and pressure to machined part hardly, and heat affected area is little, and product is substantially without distortion, and process velocity is fast, without the need to any Making mold.Simultaneously the machining accuracy of laser processing of the present invention is high, and cut edge can not carbonization, so be particularly suitable for doing various precision cutting to tiny parts.Particularly, in the present invention, described through hole is processed along square surrounding on a surface of workpiece to be added by laser, edge's flat smooth of the slit obtained by such through hole, not uneven, be particularly suitable for electromagnetic wave to pass through, thus, be particularly suitable for carrying out slit processing to communication apparatus metal shell.
In addition, according to the laser processing of slit of the present invention, also there is following additional technical feature:
Particularly, the pitch of holes between the adjacent through hole in each sets of vias is greater than 50 μm.
Preferably, in the process of each sets of vias, all adopt blowing device to be blown off described workpiece to be added by the dust that processing produces.
Preferably, described blowing device is ion wind gun.
Preferably, the thickness of described workpiece to be added is below 1mm.
Preferably, the width of described slit is less than 30 μm.
Preferably, described laser is infrared laser.
Preferably, the wavelength of described infrared laser is 1064nm.
Additional aspect of the present invention and advantage will part provide in the following description, and part will become obvious from the following description, or be recognized by practice of the present invention.
Accompanying drawing explanation
Above-mentioned and/or additional aspect of the present invention and advantage will become obvious and easy understand from accompanying drawing below combining to the description of embodiment, wherein:
Fig. 1 is the flow chart of the laser processing of slit according to the embodiment of the present invention;
Fig. 2 is the generative process schematic diagram of the slit according to the embodiment of the present invention.
Detailed description of the invention
Be described below in detail embodiments of the invention, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has element that is identical or similar functions from start to finish.Being exemplary below by the embodiment be described with reference to the drawings, only for explaining the present invention, and can not limitation of the present invention being interpreted as.
In describing the invention, it will be appreciated that, orientation or the position relationship of the instruction such as term " " center ", " on ", D score, "front", "rear", "left", "right", " vertically ", " level ", " top ", " end ", " interior ", " outward " they be based on orientation shown in the drawings or position relationship; be only the present invention for convenience of description and simplified characterization; instead of instruction or imply the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore can not be interpreted as limitation of the present invention.In addition, term " first ", " second " only for describing object, and can not be interpreted as instruction or hint relative importance or imply the quantity indicating indicated technical characteristic.Thus, be limited with " first ", the feature of " second " can express or impliedly comprise one or more these features.In describing the invention, except as otherwise noted, the implication of " multiple " is two or more.
In the present invention, described " square " is defined as the parallelogram that all interior angles are right angle.It comprises square and rectangle.
In the present invention, this laser processing is adopted can to process the slit of different size on workpiece to be added.Particularly, workpiece to be added is metalwork (material of described metalwork is preferably stainless steel, magnesium alloy or titanium alloy etc.), infrared, visible ray and ultraviolet process equipment is applicable to according to the laser processing of slit of the present invention, that is, the laser adopted in the laser processing of slit can be infrared laser, visible light lasers or Ultra-Violet Laser.
As depicted in figs. 1 and 2, according to the laser processing of slit of the present invention, it comprises the steps:
S1: adopt the mode of Laser Processing to process first sets of vias comprising multiple isolated through hole on workpiece to be added, that is, first on workpiece to be added, process first sets of vias with laser, this first sets of vias comprises multiple isolated through hole.
S2: adopt the mode of Laser Processing to process i-th sets of vias comprising multiple isolated through hole on workpiece to be added, multiple through holes in multiple through hole wherein in i-th sets of vias and the i-th-1 sets of vias one_to_one corresponding respectively, and each through hole in i-th sets of vias and the respective through hole conducting in the i-th-1 sets of vias.
S3: repeat S2 step, until the through hole conducting adjacent with this through hole of any one through hole arbitrarily in sets of vias forms a slit to make whole through hole, that is, multiple through hole conductings in any one sets of vias, multiple through hole conductings in any two sets of vias, in other words, the whole through hole conductings in multiple sets of vias are to form a slit.
In addition, in the present invention, processing total group number is not less than 2 groups, and that is, the sets of vias of at least processing more than 2 groups in the present invention forms described slit, also, the i in S2 step be more than or equal to 2 integer.Preferably, processing total group number is 3-30 group.
In the present invention, described through hole is processed along square surrounding on a surface of workpiece to be added by laser, that is, the slit formed by method of the present invention formed by a succession of square through hole, compare the slit that other configured bore therethrough (such as circular) is formed, the edge of the slit formed by through hole of the present invention is not uneven.In addition, the not special requirement of the length of square shaped of the present invention and width, those skilled in the art specifically can select according to the width of the slit that will be formed.
In the present invention, the width of described slit can be less than 100 μm, and preferably, the width of described slit is less than 30 μm, is more preferably 8-15 μm.It should be noted that, workpiece to be added has each other relative first surface and second surface, and the through hole of the first surface of laser direct irradiation is comparatively large, and the aperture on second surface is less.In the present invention, the width of described slit refers to the width formed on a second surface.
In the present invention, the thickness of described workpiece to be added can be below 1mm, is preferably 0.2-0.8mm, is more preferably 0.5-0.8mm.
According to the present invention, in preferred situation, the pitch of holes between the adjacent through hole in each sets of vias is greater than 50 μm, is more preferably 50-500 μm, more preferably 60-300 μm, is further preferably 70-150 μm.Can avoid thus having an impact to often organizing between two through holes adjacent in process that sets of vias processes.
According to the present invention, adjacent and pitch of holes between the through hole of mutual conduction (pitch of holes in the through hole namely in i-th sets of vias and the i-th-1 sets of vias and between its respective through hole), as long as can ensure mutually to be communicated with completely, such as, with two adjacent and the through hole of mutual conduction illustrates time, adjacent and pitch of holes between the through hole of mutual conduction is 1/4 to 1/2 of the length of side in the formation slit length direction of the through hole first processed.
In the present invention, pitch of holes is the distance between the central point of through hole.
According to the present invention, in preferred situation, in the process of each sets of vias, blowing device is all adopted to be blown off workpiece to be added by the dust that processing produces.The various blowing devices that described blowing device can be commonly used for this area.In preferred situation, described blowing device is ion wind gun.By all adopting blowing device to be blown off workpiece to be added by the dust that processing produces in the process of each sets of vias, the processing effect of slit can be improved, process and slit can be processed for one time.
In the present invention, as mentioned above, the laser adopted in the laser processing of slit can be infrared laser, visible light lasers or Ultra-Violet Laser.The condition of described Laser Processing has no particular limits, as long as can form the slit of above-mentioned slit width on described workpiece to be added, can adopt the normal condition of this area.Such as, processing conditions can be: working power is 20 ~ 150W, and process velocity is 20 ~ 3000m/s, and frequency is 1 ~ 80kHz.
In the present invention, the preferred infrared laser of described laser.The wavelength selectable 1064nm of described infrared laser.
In order to further illustrate the present invention, below with when adopting the mode of Laser Processing to process the 3rd sets of vias comprising three isolated through holes on workpiece to be added, the whole through hole conductings in 3 sets of vias are described in detail to form the principle of a slit to the laser processing of slit.It is to be appreciated that following description is exemplary illustration, be not to concrete restriction of the present invention.
First, adopt the mode of Laser Processing on workpiece to be added, process the first sets of vias comprising three isolated through holes, the through hole in the first sets of vias is respectively the first through hole, the second through hole and third through-hole.
Then, adopt the mode of Laser Processing on workpiece to be added, process the second sets of vias comprising three isolated through holes, three through holes in the second sets of vias are respectively fourth hole, fifth hole and the 6th through hole.Now fourth hole is between the first through hole and the second through hole and fourth hole and the first through hole conducting, fifth hole between the second through hole and third through-hole and fifth hole and the second through hole conducting, the 6th through hole and third through-hole conducting.
Finally, adopt the mode of Laser Processing on workpiece to be added, process the third through-hole group comprising three isolated through holes, three through holes in third through-hole group are respectively the 7th through hole, the 8th through hole and the 9th through hole, now the 7th through hole respectively with fourth hole and the second through hole conducting, 8th through hole respectively with fifth hole and third through-hole conducting, the 9th through hole and the 6th through hole conducting.That is, the first through hole, the second through hole, third through-hole, fourth hole, fifth hole, the 6th through hole, the 7th through hole, the 8th through hole and the whole conducting of the 9th through hole are to form one article of slit.
According to the laser processing of slit of the present invention, by adopting the mode of grouping boring to process slit, not only solve susceptible to plugging problem in slit process.The method of relatively existing processing slit in addition, the thickness of workpiece to be added of the present invention can reach 1mm, processes at one time, and has greatly saved the time.The method of relatively existing machined slot simultaneously, laser processing of the present invention produces mechanical impetus and pressure to machined part hardly, and heat affected area is little, and product is substantially without distortion, and process velocity is fast, without the need to any Making mold.Simultaneously the machining accuracy of laser processing of the present invention is high, and cut edge can not carbonization, so be particularly suitable for doing various precision cutting to tiny parts.Particularly, in the present invention, the slit obtained by square through hole, edge's flat smooth of the slit obtained, does not have uneven, is particularly suitable for electromagnetic wave and passes through, and thus, is particularly suitable for carrying out slit processing to communication apparatus metal shell.
According to the present invention, in size, utilize laser processing of the present invention cutting thickness to machined part to reach 1mm, processing result is accurate, can the working width slit that is less than 15 μm, and cut surface impulse-free robustness is follow-up without the need to grinding process processing edge.And cutting noise is little, and material 15 ~ 30% can be saved.
Be described in further detail below by the laser processing of specific embodiment to crack of the present invention.
In following examples and comparative example, adjacent holes spacing refers to the through hole of one group of processing and next is organized in the through hole processed and is adjacent and pitch of holes between the through hole of conducting.
Embodiment 1
Infrared laser puncher (Chinese workers' laser model of producing is LSF20 laser-beam drilling machine, wavelength 1064nm) is adopted to be that the aluminium alloy (be purchased from Dongguan City port ancient sacrificial bronze ware and belong to Materials Co., Ltd) of 6063 carries out grouping Drilling operation slit in the thick and model of 0.5mm.Designing each through hole is square through-hole (length of side is 2 μm), institute's packet count 12 groups, single group pitch of holes 72 μm, adjacent holes spacing 6 μm, slit length 12mm.The power of laser boring is 10W, and speed is 50mm/s, and frequency is 20kHz.Obtain edge's flat smooth of slit, not uneven.The width of the slit obtained and process time are in table 1.
Embodiment 2
Infrared laser puncher (Chinese workers' laser model of producing is LSF20 laser-beam drilling machine, wavelength 1064nm) is adopted to be that the aluminium alloy (be purchased from Dongguan City port ancient sacrificial bronze ware and belong to Materials Co., Ltd) of 6063 carries out grouping Drilling operation slit in the thick and model of 0.5mm.Designing each through hole is square through-hole (length of side is 5 μm), institute's packet count 12 groups, single group pitch of holes 120 μm, adjacent holes spacing 10 μm, slit length 12mm.The power of laser boring is 20W, and speed is 50mm/s, and frequency is 20kHz.Obtain edge's flat smooth of slit, not uneven.The width of the slit obtained and process time are in table 1.
Embodiment 3
Infrared laser puncher (Chinese workers' laser model of producing is LSF20 laser-beam drilling machine, wavelength 1064nm) is adopted to be that the aluminium alloy (be purchased from Dongguan City port ancient sacrificial bronze ware and belong to Materials Co., Ltd) of 6063 carries out grouping Drilling operation slit in the thick and model of 0.5mm.Designing each through hole is square through-hole (length of side is 15 μm), institute's packet count 24 groups, single group pitch of holes 144 μm, adjacent holes spacing 6 μm, slit length 12mm.The power of laser boring is 10W, and speed is 50mm/s, and frequency is 20kHz.Obtain edge's flat smooth of slit, not uneven.The width of the slit obtained and process time are in table 1.
Embodiment 4
Infrared laser puncher (Chinese workers' laser model of producing is LSF20 laser-beam drilling machine, wavelength 1064nm) is adopted to be that the aluminium alloy (be purchased from Dongguan City port ancient sacrificial bronze ware and belong to Materials Co., Ltd) of 6063 carries out grouping Drilling operation slit in the thick and model of 1mm.Designing each through hole is square through-hole (length of side is 15 μm), 12 groups, single group pitch of holes 72 μm, adjacent holes spacing 6 μm, slit length 12mm.The power of laser boring is 20W, and speed is 50mm/s, and frequency is 20kHz.Obtain edge's flat smooth of slit, not uneven.The width of the slit obtained and process time are in table 1.
Comparative example 1
(model of Chinese workers' laser production is LSF20 laser-beam drilling machine to adopt infrared laser puncher, wavelength 1064nm) in the thick and model of 0.5mm be 6063 aluminium alloy (be purchased from Dongguan City port ancient sacrificial bronze ware and belong to Materials Co., Ltd) on carry out Drilling operation slit, do not divide into groups.The aperture of each through hole is 10 μm, adjacent holes spacing 6 μm, slit length 12mm.The power of laser boring is 20W, and speed is 50mm/s, and frequency is 20kHz, wavelength 1064nm.Blackout is burnt in the edge obtaining slit, and burr is more.In addition, the width of the slit obtained and process time are in table 1.
Comparative example 2
Ultraviolet laser drilling machine (the decent job science and technology model of producing is the Ultra-Violet Laser machine of JG12, wavelength 355nm) is adopted to be that the aluminium alloy (be purchased from Dongguan City port ancient sacrificial bronze ware and belong to Materials Co., Ltd) of 6063 carries out slit processing in the thick and model of 0.2mm.Slit width is 8 μm, slit length 12mm.The power of laser boring is 1.5W, and speed is 300mm/s, and frequency is 15kHz.Obtain edge's Glabrous thorn of slit.In addition, the width of the slit obtained and process time are in table 1.
Comparative example 3
CNC equipment (model of mechanical stiffness machinery is the CNC equipment of TC-510) is adopted to be that the aluminium alloy of 6063 carries out slit processing in the thick and model of 0.5mm.Tool bit diameter 0.3mm, processing rotating speed 2000r/min, processing walking speed 500mm/min, processing number of times 40 times.There is slight metallic residue crimping in the edge obtaining slit, and follow-up needs polishes, and removes crimping.In addition, the width of the slit obtained and process time are in table 1.
Comparative example 4
Carry out according to the method for embodiment 1, unlike, designing each through hole is manhole (aperture is 2 μm).The edge obtaining slit has uneven.The width of the slit obtained and process time are in table 1.
Table 1
| Sequence number | Slit width | Process time |
| Embodiment 1 | 12μm | 10s |
| Embodiment 2 | 15μm | 9s |
| Embodiment 3 | 12μm | 12s |
| Embodiment 4 | 12μm | 10s |
| Comparative example 1 | 15μm | 10min |
| Comparative example 2 | 10μm | 10min |
| Comparative example 3 | 0.4mm | 2min |
| Comparative example 4 | 12μm | 10s |
The slit that embodiment 1-4 processes is penetrating, and without clogging, only processing once can success.
Comparative example 1 is after machined 10min, and still clearly, and due to long-time reprocessabilty, edge burns seriously clogging.
Comparative example 2 is after machined 10min, and still clearly, and due to long-time reprocessabilty, entirety has gross distortion to clogging.
Comparative example 3 need be processed repeatedly can be successful, and too carefully cause cutter life very short due to cutter head, and processing dimension reaches 0.4mm, and precision is very low.
Although comparative example 4 is identical with embodiment 1 for process time, but the slit edges obtained is not smooth straight line, the slit width caused varies, and affects follow-up application.
In summary, according to the laser processing of the slit of the embodiment of the present invention, solve the susceptible to plugging problem of slit, and producing mechanical impetus and pressure hardly to machined part, product is substantially without distortion, and process velocity is fast, machining accuracy is high, and cut edge can not carbonize.
More than describe the preferred embodiment of the present invention in detail; but the present invention is not limited to the detail in above-mentioned embodiment, within the scope of technical conceive of the present invention; can carry out multiple simple variant to technical scheme of the present invention, these simple variant all belong to protection scope of the present invention.
It should be noted that in addition, each the concrete technical characteristic described in above-mentioned detailed description of the invention, in reconcilable situation, can be combined by any suitable mode.
In addition, also can be combined between various different embodiment of the present invention, as long as it is without prejudice to thought of the present invention, it should be considered as content disclosed in this invention equally.
Claims (9)
1. a laser processing for slit, is characterized in that, the method comprises the steps:
S1: adopt the mode of Laser Processing to process first sets of vias comprising multiple isolated through hole on workpiece to be added;
S2: adopt the mode of Laser Processing to process i-th sets of vias comprising multiple isolated through hole on workpiece to be added, multiple through holes in multiple through hole wherein in i-th sets of vias and the i-th-1 sets of vias one_to_one corresponding respectively, and each through hole in i-th sets of vias and the respective through hole conducting in the i-th-1 sets of vias;
S3: repeat S2 step, until the through hole conducting adjacent with this through hole of any one through hole arbitrarily in sets of vias forms a slit to make whole through hole;
Wherein, processing total group number is not less than 2 groups, and described through hole is processed along square surrounding on a surface of workpiece to be added by laser.
2. the laser processing of slit according to claim 1, wherein, the pitch of holes between the adjacent through hole in each sets of vias is greater than 50 μm.
3. the laser processing of slit according to claim 1, wherein, all adopts blowing device to be blown off described workpiece to be added by the dust that processing produces in the process of each sets of vias.
4. the laser processing of slit according to claim 3, wherein, described blowing device is ion wind gun.
5. the laser processing of slit according to claim 1, wherein, the thickness of described workpiece to be added is below 1mm.
6. the laser processing of slit according to claim 1, wherein, the width of described slit is less than 30 μm.
7. the laser processing of slit according to claim 1, wherein, described laser is infrared laser.
8. the laser processing of slit according to claim 7, wherein, the wavelength of described infrared laser is 1064nm.
9. according to the laser processing of the slit in claim 1-8 described in any one, wherein, described through hole is square through-hole.
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