CN105522287B - The laser processing of slit - Google Patents
The laser processing of slit Download PDFInfo
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- CN105522287B CN105522287B CN201410829062.3A CN201410829062A CN105522287B CN 105522287 B CN105522287 B CN 105522287B CN 201410829062 A CN201410829062 A CN 201410829062A CN 105522287 B CN105522287 B CN 105522287B
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Abstract
The invention discloses a kind of laser processings of slit comprising following steps: S1: first sets of vias including multiple through-holes spaced apart is processed on workpiece to be added by the way of laser processing；S2: i-th of sets of vias including multiple through-holes spaced apart is processed on workpiece to be added by the way of laser processing, wherein multiple through-holes in i-th of sets of vias correspond respectively with multiple through-holes in (i-1)-th sets of vias, and each through-hole in i-th of sets of vias is connected with the respective through hole in (i-1)-th sets of vias；S3: repeating S2 step, until the through-hole adjacent with the through-hole of any one through-hole in any sets of vias is connected so that whole through-holes form a slit；Wherein, the total group number of processing is not less than 2 groups, and the through-hole is process on a surface of workpiece to be added along rectangular surrounding by laser.The edge for the slit that the laser processing of slit obtains through the invention is flat and smooth, not uneven.
Description
Technical field
The present invention relates to manufacture fields, more particularly, to a kind of laser processing of slit.
Background technique
There are mainly two types of the methods for processing slit on metal at present, and one is ultraviolet laser processing, another kind is to utilize
The mode of traditional machined slot, such as emery wheel cuts, numerically-controlled machine tool.It is wherein processed using ultraviolet laser, ultraviolet shortwave
The feature of length itself has superiority to the mechanical micro process of metal.It can be focused on the point of systems, because
This can carry out effective material processing on subtle component.But since this special wavelength and the laser of frequency are needed compared with shortwave
Long laser excitation, this increases unnecessary complexity to laser system.So plant capacity generally only has several watts, it is thick for material
Metal needs greater than 0.2mm repeat to process, and the galvanometer of height scan has certain precision, and reprocessabilty repeatedly will cause processing essence
The reduction of degree and the extension of process time.
By the way of traditional machined slot, machining accuracy is low, and under this cutting mode, blade/drill bit
Deng contacting workpieces processing in a manner of running at high speed, mechanical stress can be generated to workpiece, be easy to cause deformation of products, reduced whole
Mechanical strength.
Summary of the invention
It is an object of the invention to overcome the above problem, provide that a kind of process time is short, machining accuracy is high and is not susceptible to
The laser processing of the slit of blocking, also, the edge for the slit that the laser processing of slit obtains through the invention
It is flat and smooth, it is not uneven.
To achieve the goals above, the present invention provides a kind of laser processing of slit, this method includes following step
It is rapid:
S1: first including multiple through-holes spaced apart is processed on workpiece to be added by the way of laser processing and is led to
Hole group；
S2: i-th including multiple through-holes spaced apart is processed on workpiece to be added by the way of laser processing and is led to
Hole group, wherein multiple through-holes in i-th of sets of vias correspond respectively with multiple through-holes in (i-1)-th sets of vias, and i-th
Each through-hole in a sets of vias is connected with the respective through hole in (i-1)-th sets of vias；
S3: repeating S2 step, until the through-hole adjacent with the through-hole of any one through-hole in any sets of vias be connected with
Whole through-holes are made to form a slit；
Wherein, the total group number of processing is not less than 2 groups, and the through-hole is by laser along rectangular on a surface of workpiece to be added
Surrounding be process.
The laser processing of slit according to the present invention processes slit by using the mode of grouping drilling, not only
It solves the problems, such as susceptible to plugging in slit process.In addition the method for relatively existing ultraviolet laser processing slit, the present invention
Workpiece to be added thickness up to 1mm, process at one time, the time be greatly saved.Relatively existing machining is narrow simultaneously
The method of seam, laser processing of the invention are nearly free from mechanical impetus and pressure to machined part, and heat affected area is small, produce
Product are substantially without deformation, and process velocity is fast, manufactures without any mold.The machining accuracy of laser processing of the invention simultaneously
Height, and cut edge will not be carbonized, so particularly suitable for doing various accurate cuttings to tiny component.In particular, in the present invention
In, the through-hole is process on a surface of workpiece to be added along rectangular surrounding by laser, through-hole in this way
The edge of obtained slit is flat and smooth, and without uneven, particularly suitable electromagnetic wave passes through, and is particularly suitable for as a result, to logical
It interrogates equipment metal shell and carries out slit processing.
In addition, the laser processing of slit according to the present invention also has following additional technical feature:
Specifically, the pitch of holes between the adjacent through-hole in each sets of vias is greater than 50 μm.
Preferably, be all made of in the process of each sets of vias blowing device will dust that processing generates blow off it is described
Workpiece to be added.
Preferably, the blowing device is ion wind gun.
Preferably, the workpiece to be added with a thickness of 1mm or less.
Preferably, the width of the slit is 30 μm or less.
Preferably, the laser is infrared laser.
Preferably, the wavelength of the infrared laser is 1064nm.
Additional aspect and advantage of the invention will be set forth in part in the description, and will partially become from the following description
Obviously, or practice through the invention is recognized.
Detailed description of the invention
Above-mentioned and/or additional aspect of the invention and advantage will become from the description of the embodiment in conjunction with the following figures
Obviously and it is readily appreciated that, in which:
Fig. 1 is the flow chart according to the laser processing of the slit of the embodiment of the present invention；
Fig. 2 is the generating process schematic diagram according to the slit of the embodiment of the present invention.
Specific embodiment
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, and for explaining only the invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term " center ", "upper", "lower", "front", "rear", " left side ",
The orientation or positional relationship of the instructions such as " right side ", "vertical", "horizontal", "top", "bottom", "inner", "outside" is based on the figure
Orientation or positional relationship is merely for convenience of description of the present invention and simplification of the description, rather than the device of indication or suggestion meaning or
Element must have a particular orientation, be constructed and operated in a specific orientation, therefore be not considered as limiting the invention.This
Outside, term " first ", " second ", which are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance or imply, refers to
The quantity of bright indicated technical characteristic." first " is defined as a result, the feature of " second " can explicitly or implicitly include
One or more of the features.In the description of the present invention, unless otherwise indicated, the meaning of " plurality " is two or two with
On.
In the present invention, described " rectangular " to be defined as the parallelogram that all interior angles are right angle.It includes square
And rectangle.
In the present invention, various sizes of slit can be processed on workpiece to be added using the laser processing.Specifically
Ground, workpiece to be added are metalwork (material of the metalwork is preferably stainless steel, magnesium alloy or titanium alloy etc.), according to the present invention
Slit laser processing be suitable for infrared, visible light and ultraviolet process equipment, that is to say, that the laser processing side of slit
The laser used in method can be infrared laser, visible light lasers either ultraviolet laser.
As depicted in figs. 1 and 2, the laser processing of slit according to the present invention comprising following steps:
S1: first including multiple through-holes spaced apart is processed on workpiece to be added by the way of laser processing and is led to
Hole group, that is to say, that process first sets of vias on workpiece to be added with laser first, include more in first sets of vias
A through-hole spaced apart.
S2: i-th including multiple through-holes spaced apart is processed on workpiece to be added by the way of laser processing and is led to
Hole group, wherein multiple through-holes in i-th of sets of vias correspond respectively with multiple through-holes in (i-1)-th sets of vias, and i-th
Each through-hole in a sets of vias is connected with the respective through hole in (i-1)-th sets of vias.
S3: repeating S2 step, until the through-hole adjacent with the through-hole of any one through-hole in any sets of vias be connected with
Whole through-holes are made to form a slit, that is to say, that multiple through-holes conducting in any one sets of vias, any two sets of vias
In the conducting of multiple through-holes, in other words, whole through-holes in multiple sets of vias are connected to form a slit.
In addition, in the present invention, process total group number and be not less than 2 groups, that is to say, that at least process in the present invention 2 groups with
On sets of vias form the slit, that is, the i in S2 step is integer more than or equal to 2.Preferably, the total group number of processing is
3-30 group.
In the present invention, the through-hole is processed on a surface of workpiece to be added along rectangular surrounding by laser
At, that is to say, that the slit formed by means of the present invention is formed by a succession of square through hole, and other shapes are compared
The slit that through-hole (such as round) is formed, the edge for the slit that through-hole through the invention is formed be not uneven.In addition,
The length and width of square shaped of the present invention does not require particularly, those skilled in the art can according to slit to be formed
Width is specifically selected.
In the present invention, the width of the slit can be 100 μm or less, it is preferable that the width of the slit is 30 μm
Hereinafter, more preferably 8-15 μm.It should be noted that workpiece to be added has each other relative first surface and second surface, swash
The through-hole of the first surface of light direct irradiation is larger, and the aperture on second surface is smaller.In the present invention, the width of the slit
Refer to the width formed on a second surface.
In the present invention, the thickness of the workpiece to be added can be 1mm hereinafter, preferably 0.2-0.8mm, more preferably
0.5-0.8mm。
In the case where, according to the invention it is preferred to, the pitch of holes between adjacent through-hole in each sets of vias is greater than 50 μm,
More preferably 50-500 μm, further preferably 60-300 μm are still more preferably 70-150 μm.Thus it can avoid to every
It can be had an impact between group sets of vias two through-holes adjacent during being processed.
According to the present invention, (i.e. through-hole in i-th of sets of vias and of the pitch of holes between adjacent and mutual conduction through-hole
Pitch of holes in i-1 sets of vias between its respective through hole), as long as can guarantee mutually connection completely, for example, with
Two adjacent and mutual conduction through-holes come when illustrating, the pitch of holes between adjacent and mutual conduction through-hole be first process it is logical
1/4 to the 1/2 of the side length in the formation slit length direction in hole.
In the present invention, pitch of holes is the distance between the central point of through-hole.
In the case where, according to the invention it is preferred to, blowing device will be all made of in the process of each sets of vias to be processed
The dust of generation blows off workpiece to be added.The blowing device can be various blowing devices commonly used in the art.It is preferred that situation
Under, the blowing device is ion wind gun.Processing is produced by being all made of blowing device in the process of each sets of vias
Raw dust blows off workpiece to be added, and the processing effect of slit can be improved, and can process slit for processing one time.
In the present invention, as described above, the laser used in the laser processing of slit can be infrared laser, visible
Ray laser either ultraviolet laser.The condition of the laser processing is not particularly limited, as long as can be in the workpiece to be added
The upper slit for forming above-mentioned slit width can use the normal condition of this field.For example, processing conditions can be with are as follows: add
Work power is 20~150W, and process velocity is 20~3000m/s, and frequency is 1~80kHz.
In the present invention, the preferred infrared laser of the laser.1064nm can be selected in the wavelength of the infrared laser.
In order to further illustrate the present invention, below by processed on workpiece to be added in a manner of using laser processing including
When the 3rd sets of vias of three through-holes spaced apart, whole through-holes conducting in 3 sets of vias is right for forming a slit
The principle of the laser processing of slit is described in detail.It is to be appreciated that following description given is exemplary illustration,
It is not to concrete restriction of the invention.
Firstly, it is logical to process first including three through-holes spaced apart on workpiece to be added by the way of laser processing
Hole group, the through-hole in first through hole group is respectively first through hole, the second through-hole and third through-hole.
Then, it is logical that second including three through-holes spaced apart is processed on workpiece to be added by the way of laser processing
Hole group, three through-holes in the second sets of vias are respectively fourth hole, fifth hole and the 6th through-hole.Fourth hole is located at this time
Between first through hole and the second through-hole and fourth hole is connected with first through hole, and fifth hole is located at the second through-hole and third through-hole
Between and fifth hole be connected with the second through-hole, the 6th through-hole is connected with third through-hole.
Finally, it is logical to process the third including three through-holes spaced apart on workpiece to be added by the way of laser processing
Hole group, three through-holes in third through-hole group are respectively the 7th through-hole, the 8th through-hole and the 9th through-hole, and the 7th through-hole is distinguished at this time
It is connected with fourth hole and the second through-hole, the 8th through-hole is connected with fifth hole and third through-hole respectively, the 9th through-hole and the 6th
Through-hole conducting.That is, first through hole, the second through-hole, third through-hole, fourth hole, fifth hole, the 6th through-hole, the 7th
Through-hole, the 8th through-hole and the 9th through-hole are all turned on to form one article of slit.
The laser processing of slit according to the present invention processes slit by using the mode of grouping drilling, not only
It solves the problems, such as susceptible to plugging in slit process.In addition the method for relatively existing processing slit, of the invention is to be processed
The thickness of part is processed at one time up to 1mm, and the time is greatly saved.The method of relatively existing machined slot simultaneously,
Laser processing of the invention is nearly free from mechanical impetus and pressure to machined part, and heat affected area is small, product substantially without
Deformation, and process velocity is fast, manufactures without any mold.The machining accuracy of laser processing of the invention simultaneously is high, and cuts
Cut edge edge will not be carbonized, so particularly suitable for doing various accurate cuttings to tiny component.In particular, in the present invention, passing through
The edge of the slit that square through hole obtains, obtained slit is flat and smooth, and without uneven, particularly suitable electromagnetic wave is logical
It crosses, is particularly suitable for carrying out slit processing to communication apparatus metal shell as a result,.
It according to the present invention, can using the cutting thickness of laser processing of the invention to machined part in terms of size
Up to 1mm, processing result is accurate, and slit of the width less than 15 μm can be processed, and cut surface impulse- free robustness is subsequent to process without grinding process
Edge.And cutting noise is small, and can save material 15~30%.
It is described in further detail below by laser processing of the specific embodiment to crack of the invention.
In following embodiment and comparative example, adjacent pitch of holes refers to the logical of the through-hole of one group of processing and next group of processing
Pitch of holes in hole between adjacent thereto and conducting through-hole.
Embodiment 1
Existed using infrared laser puncher (the model LSF20 laser-beam drilling machine of Chinese workers' laser production, wavelength 1064nm)
Drilling processing is grouped on the aluminium alloy (be purchased from Dongguan City port ancient sacrificial bronze ware and belong to Materials Co., Ltd) of 0.5mm thickness and model 6063
Slit.It designs each through-hole to be square through-hole (side length is 2 μm), 12 groups of institute's packet count, 72 μm of single group pitch of holes, between adjacent holes
Away from 6 μm, slit length 12mm.The power of laser boring is 10W, speed 50mm/s, frequency 20kHz.Obtain the side of slit
It is flat and smooth at edge, it is not uneven.The width of obtained slit and process time are shown in Table 1.
Embodiment 2
Existed using infrared laser puncher (the model LSF20 laser-beam drilling machine of Chinese workers' laser production, wavelength 1064nm)
Drilling processing is grouped on the aluminium alloy (be purchased from Dongguan City port ancient sacrificial bronze ware and belong to Materials Co., Ltd) of 0.5mm thickness and model 6063
Slit.It designs each through-hole to be square through-hole (side length is 5 μm), 12 groups of institute's packet count, 120 μm of single group pitch of holes, adjacent holes
10 μm of spacing, slit length 12mm.The power of laser boring is 20W, speed 50mm/s, frequency 20kHz.Obtain slit
Edge is flat and smooth, not uneven.The width of obtained slit and process time are shown in Table 1.
Embodiment 3
Existed using infrared laser puncher (the model LSF20 laser-beam drilling machine of Chinese workers' laser production, wavelength 1064nm)
Drilling processing is grouped on the aluminium alloy (be purchased from Dongguan City port ancient sacrificial bronze ware and belong to Materials Co., Ltd) of 0.5mm thickness and model 6063
Slit.It designs each through-hole to be square through-hole (side length is 15 μm), 24 groups of institute's packet count, 144 μm of single group pitch of holes, adjacent holes
6 μm of spacing, slit length 12mm.The power of laser boring is 10W, speed 50mm/s, frequency 20kHz.Obtain slit
Edge is flat and smooth, not uneven.The width of obtained slit and process time are shown in Table 1.
Embodiment 4
Existed using infrared laser puncher (the model LSF20 laser-beam drilling machine of Chinese workers' laser production, wavelength 1064nm)
It is narrow that drilling processing is grouped on the aluminium alloy (be purchased from Dongguan City port ancient sacrificial bronze ware and belong to Materials Co., Ltd) of 1mm thickness and model 6063
Seam.It designs each through-hole and is square through-hole (side length is 15 μm), 12 groups, 72 μm of single group pitch of holes, 6 μm of adjacent pitch of holes is narrow
Stitch length 12mm.The power of laser boring is 20W, speed 50mm/s, frequency 20kHz.The edge for obtaining slit is smooth
It is smooth, it is not uneven.The width of obtained slit and process time are shown in Table 1.
Comparative example 1
Existed using infrared laser puncher (the model LSF20 laser-beam drilling machine of Chinese workers' laser production, wavelength 1064nm)
It is narrow that drilling processing is carried out on the aluminium alloy (be purchased from Dongguan City port ancient sacrificial bronze ware and belong to Materials Co., Ltd) of 0.5mm thickness and model 6063
Seam, is not grouped.The aperture of each through-hole is 10 μm, 6 μm of adjacent pitch of holes, slit length 12mm.The power of laser boring is
20W, speed 50mm/s, frequency 20kHz, wavelength 1064nm.Nigrescence is burnt in the edge for obtaining slit, and burr is more.
In addition, the width of obtained slit and process time are shown in Table 1.
Comparative example 2
Existed using ultraviolet laser drilling machine (the ultraviolet laser machine of the model JG12 of decent job science and technology production, wavelength 355nm)
Slit processing is carried out on the aluminium alloy (be purchased from Dongguan City port ancient sacrificial bronze ware and belong to Materials Co., Ltd) of 0.2mm thickness and model 6063.It is narrow
Slit width degree is 8 μm, slit length 12mm.The power of laser boring is 1.5W, speed 300mm/s, frequency 15kHz.It obtains
The edge Glabrous of slit pierces.In addition, the width of obtained slit and process time are shown in Table 1.
Comparative example 3
Using CNC equipment (the CNC equipment of the model TC-510 of mechanical stiffness machinery) in 0.5mm thick and model 6063 aluminium
Slit processing is carried out on alloy.Tool bit diameter 0.3mm processes revolving speed 2000r/min, processes walking speed 500mm/min, processing times
40 times.There is slight metallic residue crimping in the edge for obtaining slit, subsequent to need to polish, and removes crimping.In addition, what is obtained is narrow
The width of seam and process time are shown in Table 1.
Comparative example 4
It carries out according to the method for embodiment 1, unlike, designing each through-hole is circular through hole (aperture is 2 μm).It obtains
The edge of slit has uneven.The width of obtained slit and process time are shown in Table 1.
Table 1
| Serial number | Slit width | Process time |
| Embodiment 1 | 12μm | 10s |
| Embodiment 2 | 15μm | 9s |
| Embodiment 3 | 12μm | 12s |
| Embodiment 4 | 12μm | 10s |
| Comparative example 1 | 15μm | 10min |
| Comparative example 2 | 10μm | 10min |
| Comparative example 3 | 0.4mm | 2min |
| Comparative example 4 | 12μm | 10s |
The slit that embodiment 1-4 is processed is penetrating, and no clogging, only processing can once succeed.
Comparative example 1 is after it machined 10min, and clogging is still it is obvious that and due to long-time reprocessabilty, edge
It burns serious.
Comparative example 2 is after it machined 10min, and clogging is still it is obvious that and due to long-time reprocessabilty, entirety
Have severely deformed.
Comparative example 3, which need to process, can repeatedly succeed, and since cutter head carefully causes cutter life very short very much, process ruler
Very little to reach 0.4mm, precision is very low.
Although 4 process time of comparative example is same as Example 1, but obtained slit edges are not smooth straight lines, are made
At slit width vary, influence subsequent application.
In summary, the laser processing of slit according to an embodiment of the present invention solves the problems, such as that slit is susceptible to plugging,
And it is nearly free from mechanical impetus and pressure to machined part, product is substantially without deformation, and process velocity is fast, and machining accuracy is high,
Cut edge will not carbonize.
The preferred embodiment of the present invention has been described above in detail, still, during present invention is not limited to the embodiments described above
Detail within the scope of the technical concept of the present invention can be with various simple variants of the technical solution of the present invention are made, this
A little simple variants all belong to the scope of protection of the present invention.
It is further to note that specific technical features described in the above specific embodiments, in not lance
In the case where shield, it can be combined in any appropriate way.
In addition, various embodiments of the present invention can be combined randomly, as long as it is without prejudice to originally
The thought of invention, it should also be regarded as the disclosure of the present invention.
Claims (6)
1. a kind of laser processing of slit, which is characterized in that this method comprises the following steps:
S1: first through-hole including multiple through-holes spaced apart is processed on workpiece to be added by the way of laser processing
Group；
S2: processing i-th of sets of vias including multiple through-holes spaced apart by the way of laser processing on workpiece to be added,
Wherein multiple through-holes in i-th of sets of vias correspond respectively with multiple through-holes in (i-1)-th sets of vias, and i-th logical
Each through-hole of Kong Zuzhong is connected with the respective through hole in (i-1)-th sets of vias；
S3: repeating S2 step, until the through-hole adjacent with the through-hole of any one through-hole in any sets of vias is connected so that complete
Portion's through-hole forms a slit；
Wherein, the total group number of processing is not less than 2 groups, and the through-hole is by laser along rectangular four on a surface of workpiece to be added
Week is process；The pitch of holes between adjacent through-hole in each sets of vias is greater than 50 μm；The width of the slit is 30 μm
Below；The workpiece to be added with a thickness of 0.5-0.8mm.
2. the laser processing of slit according to claim 1, wherein adopted in the process of each sets of vias
Dust that processing generates is blown off the workpiece to be added with blowing device.
3. the laser processing of slit according to claim 2, wherein the blowing device is ion wind gun.
4. the laser processing of slit according to claim 1, wherein the laser is infrared laser.
5. the laser processing of slit according to claim 4, wherein the wavelength of the infrared laser is 1064nm.
6. the laser processing of slit described in any one of -5 according to claim 1, wherein the through-hole is square
Through-hole.
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| CN1068766A (en) * | 1991-07-17 | 1993-02-10 | R·奥德马尔公司 | The method of cutting material and device |
| US6507002B1 (en) * | 1999-06-29 | 2003-01-14 | Canon Kabushiki Kaisha | Method for processing discharge nozzle of liquid jet recording head and method for manufacturing the same head |
| CN1470354A (en) * | 2002-07-24 | 2004-01-28 | 天津市激光技术研究所 | Method for cutting cross-cutting board by pulse laser |
| DE102005022354A1 (en) * | 2005-05-13 | 2006-11-23 | Hitachi Via Mechanics, Ltd., Ebina | Method of treating objects using laser radiation esp. for boring or shaping electronic circuit substrates |
| CN101279403A (en) * | 2007-04-06 | 2008-10-08 | 富士迈半导体精密工业（上海）有限公司 | Laser processing method |
| CN101890582A (en) * | 2010-06-30 | 2010-11-24 | 北京宏诚拓业科技发展有限公司 | Laser processing method for steel sieve tube slit |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1068766A (en) * | 1991-07-17 | 1993-02-10 | R·奥德马尔公司 | The method of cutting material and device |
| US6507002B1 (en) * | 1999-06-29 | 2003-01-14 | Canon Kabushiki Kaisha | Method for processing discharge nozzle of liquid jet recording head and method for manufacturing the same head |
| CN1470354A (en) * | 2002-07-24 | 2004-01-28 | 天津市激光技术研究所 | Method for cutting cross-cutting board by pulse laser |
| DE102005022354A1 (en) * | 2005-05-13 | 2006-11-23 | Hitachi Via Mechanics, Ltd., Ebina | Method of treating objects using laser radiation esp. for boring or shaping electronic circuit substrates |
| CN101279403A (en) * | 2007-04-06 | 2008-10-08 | 富士迈半导体精密工业（上海）有限公司 | Laser processing method |
| CN101890582A (en) * | 2010-06-30 | 2010-11-24 | 北京宏诚拓业科技发展有限公司 | Laser processing method for steel sieve tube slit |
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| CN105522287A (en) | 2016-04-27 |
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