CN104096974A - Laser cutting equipment - Google Patents
Laser cutting equipment Download PDFInfo
- Publication number
- CN104096974A CN104096974A CN201310118434.7A CN201310118434A CN104096974A CN 104096974 A CN104096974 A CN 104096974A CN 201310118434 A CN201310118434 A CN 201310118434A CN 104096974 A CN104096974 A CN 104096974A
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- CN
- China
- Prior art keywords
- laser
- cutting
- cut
- angle
- laser head
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses laser cutting equipment which comprises at least one laser head for cutting, wherein included angles between at least one laser transmitting line of the laser head for cutting and cutting surfaces of objects to be cut are non-perpendicular, and the included angles are randomly adjusted. The included angles between the laser transmitting lines and the cutting surfaces of the objects to be cut are non-perpendicular, so that an opening formed by cutting on a plate by the laser cutting equipment has a certain taper; in addition, the included angles between the laser transmitting lines and the cutting surfaces of the objects to be cut are randomly adjusted and the taper of the opening in the plate also can be changed by adjusting angle parameters, so that plane products with different opening tapers can be manufactured.
Description
Technical field
The present invention relates to a kind of laser cutting device, be specifically related to a kind of laser cutting device of plane template opening, belong to laser cutting field.
Background technology
Laser has that precision is high, speed is fast, cost performance is high, use cost is low and automaticity advantages of higher, especially in the processing of sheet metal, have that heat affected area is little, automated programming cutting, in the processing modes such as more traditional line cutting, grinding tool punching press, there is larger advantage.Particularly experiencing continuous wave laser technology, nanosecond laser technology, picosecond laser technology, the femtosecond laser technology occurring until now, the Precision Machining application of laser is more and more extensive.
In traditional sheet material process, laser incident direction is generally vertical with plate face, and adopts the pattern of single laser head, and the sheet material opening so cutting out is that upper and lower surface size is basically identical, as shown in Figure 1, and opening size a ≈ b.But along with laser application is more and more wider, this kind of cooked mode can not meet the demand of market product completely.For example: the mask plate of using for OLED (OLED) evaporation, it requires the opening on sheet material to have certain tapering, the inwall place direction and the plate face place direction that are opening are non-perpendicular structure, so can meet the uniformity of OLED pixel evaporation.Therefore, industry is needed a kind of new sheet material opening processing technology badly, to meet the demand of diversified produce market.
Summary of the invention
In view of this, the invention provides a kind of laser cutting device, be intended to meet and can on plate face, cut out the requirement of tapering opening.A kind of laser cutting device provided by the invention, its technical scheme is as follows:
Described laser cutting device comprises at least one laser head for cutting, and described for the laser head cutting, to have Laser emission route and the angle between the cut surface of cut object of one at least be non-perpendicular relation, and angle is adjustable arbitrarily.Laser head is used for cutting processing by Emission Lasers, based on this, because the angle between Laser emission route and the cut surface of cut object is non-perpendicular relation, there is certain tapering in the opening cutting out by laser cutting device on sheet material, and because the angle between Laser emission route and the cut surface of cut object is adjustable arbitrarily, the tapering of sheet material upper shed also can change by the adjustment of angle parameter.
As angle parameter between Laser emission route and the cut surface of cut object, limit, described Laser emission route and the angle adjusting range between the cut surface of cut object for the laser head that cuts is 20 °～70 °.
Further, described Laser emission route and the angle adjusting range between the cut surface of cut object for the laser head that cuts is 30 °～60 °.
Further, described Laser emission route and the angle adjusting range between the cut surface of cut object for the laser head that cuts is 40 °～50 °.
As preferred a kind of mode, described Laser emission route and the angle adjusting range between the cut surface of cut object for the laser head that cuts is 45 °.
Laser cutting device provided by the present invention can comprise two or more laser heads for cutting, and the angle between the Laser emission route of whole described laser heads and the cut surface of cut object is all identical.The all inwalls of the opening place direction cutting out thus equates with the angle between the direction of cut surface place.
Angle based between Laser emission route and the cut surface of cut object is adjustable arbitrarily, the described laser cutting device that comprises two or more laser heads, the angle on it between Laser emission route of the described laser head of part and cut object cutting face is different.
The architectural feature of the above laser cutting device is basic structure of the present invention, and the aspect that it is additional and advantage in the following description part provide, and part will become obviously from the following description, or recognize by practice of the present invention.
Accompanying drawing explanation
Above-mentioned and/or additional aspect of the present invention and advantage will become from the following description of the accompanying drawings of embodiments and obviously and easily understand, wherein:
Fig. 1 is the schematic diagram that conventional panels is carried out Laser Processing;
Fig. 2 is an embodiment of the present invention schematic diagram;
Fig. 3 is the another kind of embodiment schematic diagram of the present invention;
Fig. 4 is for adopting the schematic diagram of the large opening surface of flat panel products of the present invention's cutting;
Fig. 5 is for adopting the schematic diagram of the little opening surface of flat panel products of the present invention's cutting.
Wherein, in Fig. 1,11 is laser head, and 12 is dull and stereotyped, and 13 is the opening on flat board, the size that a is upper surface open, and b is the size of lower surface opening;
In Fig. 2,21 is laser head, and 22 is template, and 23 is the opening in template, and α is the Laser emission route of laser head 21 and the angle between template 22, and c is template 22 upper surface open sizes, and d is template 22 lower surface opening sizes;
In Fig. 3,30 is the laser head of an increase, and β is the Laser emission route of laser head 30 and the angle between template 22.
The specific embodiment
Describe embodiments of the invention below in detail, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has the element of identical or similar functions from start to finish.Below by the embodiment being described with reference to the drawings, be exemplary, only for explaining the present invention, and can not be interpreted as limitation of the present invention.
In description of the invention, it will be appreciated that, term " on ", orientation or the position relationship of the indication such as D score, " end ", " top ", 'fornt', 'back', " interior ", " outward ", " left side ", " right side " be based on orientation shown in the drawings or position relationship, only the present invention for convenience of description and simplified characterization, rather than indicate or imply that the device of indication or element must have specific orientation, with specific orientation, construct and operation, therefore can not be interpreted as limitation of the present invention.
In description of the invention, it should be noted that, unless otherwise clearly defined and limited, term " connection ", " connection ", " being connected ", " connection " should be interpreted broadly, and for example, can be to be fixedly connected with, connecting integratedly, can be also to removably connect; It can be the connection of two element internals; Can be to be directly connected, also can indirectly be connected by intermediary, for the ordinary skill in the art, can concrete condition understand above-mentioned term concrete meaning in the present invention.
Design of the present invention is as follows, in existing conventional panels process, laser incident direction is generally vertical with plate face, and adopt the pattern of single laser head, the sheet material opening so cutting out is that upper and lower surface size is basically identical, and this kind of cooked mode can not meet the demand of market product completely.Laser cutting device provided by the present invention can cut the planar products of preparing the opening with certain taper, and a plurality of laser head can improve the working (machining) efficiency of planar products.
Planar products in the present invention can be understood as the sheet material that is provided with certain openings on plate face, i.e. template.
Describe below with reference to accompanying drawings laser cutting device of the present invention, Fig. 1 is the schematic diagram that conventional panels is carried out Laser Processing; Fig. 2 is an embodiment of the present invention schematic diagram; Fig. 3 is the another kind of embodiment schematic diagram of the present invention; Fig. 4 is for adopting the schematic diagram of the large opening surface of flat panel products of the present invention's cutting; Fig. 5 is for adopting the schematic diagram of the little opening surface of flat panel products of the present invention's cutting.
Further be explained as follows, as the first embodiment of the present invention, embodiment illustrated in fig. 2 is schematic cross-section perpendicular to template 22 upper surfaces, in the present embodiment, laser cutting device comprises a laser head 21, laser head 21 is when work, and the angle between its Laser emission route and the upper surface of template 22 is α, and template 22 is processed to form opening 23 by laser head 21.As shown in Figure 2, the inwall place direction of described formation opening and template 22 upper surfaces are non-perpendicular relation, are reflected on size relationship to be: the upper surface size c> opening lower surface size d of template 22 openings.
Further formed opening is described as follows: as shown in Figure 4, Figure 5, it corresponds respectively to template 22 from the open state of upper surface and lower surface observation, can be observed the interior wall construction of opening 23 from Fig. 4.
In the present invention, angle between Laser emission route and the cut surface of cut object is non-perpendicular relation, and angle is adjustable arbitrarily, as another embodiment of the present invention, it is that α adjustable range has been done following restriction for the angle between Laser emission route and the upper surface of template 22: 20 °≤α≤70 °.
Be further defined to: 30 °≤α≤60 °, be further: 40 °≤α≤50 °, as a preferred embodiment of the present invention, the angle between Laser emission route and the upper surface of template 22 is that α is 45 °.
Another embodiment of the present invention is on the basis of the above the first embodiment, to have done following change: the laser head for template cutting is increased to two by one, as shown in Figure 3, angle between the Laser emission route of laser head 21 and laser head 31 and template 22 upper surfaces is respectively α, β, and the adjustable range of angle α, β is identical with the adjustable range of α in the first embodiment.In the present embodiment, laser cutting device can have following two kinds of designs: the Laser emission route of the angle α=laser head 31 between the Laser emission route of laser head 21 and template 22 upper surfaces and the angle β between template 22 upper surfaces, or the Laser emission route of the angle α ≠ laser head 31 between the Laser emission route of laser head 21 and template 22 upper surfaces and the angle β between template 22 upper surfaces.
Further, in the present embodiment, the working method of two laser heads can be for cut an opening simultaneously, as shown in Figure 3, can also cut respectively two different openings, in real process, working mode selection can be determined by factors such as the size of template surface opening and tightness degree, for example: when at opening size, large or two aperture pitch are larger, laser head affects less each other, now can adopt two laser heads to cut respectively the mode of two different openings.
The number of the laser head of the laser cutting device that certainly the present invention says can also be 3,4 etc., and its basic setup mode and the above 2 laser head are basically identical.
In addition, as several implementations of the present invention, adjusting laser head has following several with the angle of plate face: a, holding plate face are constant, the Laser emission route of adjustment laser head; The Laser emission route of b, maintenance laser head is constant, adjusts plate face; C, the Laser emission route of simultaneously adjusting laser head and plate face.And while adjusting the Laser emission route of laser head, can be the angle (as shown in the figure) of adjusting laser head, can be also that the rotation by lens angle realizes (not shown).
General portion in industry, to the thickness requirement of template, generally in 50um left and right, therefore the physical dimension shown in figure can not represent the physical dimension of actual product, in the present invention, the size of showing of accompanying drawing can not be as limiting foundation of the present invention.In addition, although the specific embodiment of the present invention is described in detail with reference to a plurality of illustrative examples of the present invention, but it must be understood that, those skilled in the art can design multiple other improvement and embodiment, and these improve and within embodiment will drop on spirit and scope.Particularly, within the scope of aforementioned open, accompanying drawing and claim, can aspect the layout of parts and/or subordinate composite configuration, make rational modification and improvement, and can not depart from spirit of the present invention.Except modification and the improvement of parts and/or layout aspect, its scope is limited by claims and equivalent thereof.
Claims (7)
1. a laser cutting device, it comprises at least one laser head for cutting, it is characterized in that: described for the laser head cutting, to have Laser emission route and the angle between the cut surface of cut object of one at least be non-perpendicular relation, and described angle is adjustable arbitrarily.
2. a kind of laser cutting device according to claim 1, is characterized in that, described Laser emission route and the angle adjusting range between the cut surface of cut object for the laser head that cuts is 20 °～70 °.
3. a kind of laser cutting device according to claim 2, is characterized in that, described Laser emission route and the angle adjusting range between the cut surface of cut object for the laser head that cuts is 30 °～60 °.
4. a kind of laser cutting device according to claim 3, is characterized in that, described Laser emission route and the angle adjusting range between the cut surface of cut object for the laser head that cuts is 40 °～50 °.
5. a kind of laser cutting device according to claim 4, is characterized in that, described Laser emission route and the angle adjusting range between the cut surface of cut object for the laser head that cuts is 45 °.
6. a kind of laser cutting device according to claim 1, it is characterized in that, described laser cutting device comprises two or more laser heads for cutting, and all described all identical with the angle between the cut surface of cut object for the Laser emission route of laser head cutting.
7. a kind of laser cutting device according to claim 1, it is characterized in that, described laser cutting device comprises two or more laser heads for cutting, and described Laser emission route and the angle between the cut surface of cut object for the laser head that cuts of part is different.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310118434.7A CN104096974A (en) | 2013-04-08 | 2013-04-08 | Laser cutting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310118434.7A CN104096974A (en) | 2013-04-08 | 2013-04-08 | Laser cutting equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104096974A true CN104096974A (en) | 2014-10-15 |
Family
ID=51665726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310118434.7A Pending CN104096974A (en) | 2013-04-08 | 2013-04-08 | Laser cutting equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104096974A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018019746A1 (en) * | 2016-07-25 | 2018-02-01 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Method for generating transverse protrustions or recesses on a cut edge of a plate-shaped workpiece and associated computer program product |
| CN107900537A (en) * | 2017-11-16 | 2018-04-13 | 惠州市契贝科技有限公司 | Processing method, plate and the diced system of conical through-hole |
| CN110722274A (en) * | 2019-10-31 | 2020-01-24 | 台州知通科技有限公司 | Laser cutting equipment |
Citations (9)
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|---|---|---|---|---|
| JPH0557470A (en) * | 1991-08-31 | 1993-03-09 | Fanuc Ltd | Laser beam processing method and device |
| US6420677B1 (en) * | 2000-12-20 | 2002-07-16 | Chromalloy Gas Turbine Corporation | Laser machining cooling holes in gas turbine components |
| CN1675022A (en) * | 2002-07-12 | 2005-09-28 | 日立造船株式会社 | Method and device for removal of thin-film |
| CN201239859Y (en) * | 2008-06-26 | 2009-05-20 | 北京大恒激光设备有限公司 | Cutting angle adjustable laser cutting device and laser cutting machine equipped therewith |
| CN101778693A (en) * | 2007-08-15 | 2010-07-14 | 卡特彼勒公司 | Laser machining method utilizing variable inclination angle |
| CN102123818A (en) * | 2008-06-28 | 2011-07-13 | 通快机床两合公司 | Method for eccentrically orienting a laser cutting beam in relation to a nozzle axis and for cutting at an angle, corresponding laser machining head and laser machining tool |
| KR20110088212A (en) * | 2010-01-28 | 2011-08-03 | 삼성모바일디스플레이주식회사 | Manufacturing method of mask for depositing thin film on substrate |
| CN102470487A (en) * | 2009-08-17 | 2012-05-23 | 西门子公司 | Method for producing an asymmetric diffuser using different laser positions |
| CN203254064U (en) * | 2013-04-08 | 2013-10-30 | 昆山允升吉光电科技有限公司 | Laser cutting device |
-
2013
- 2013-04-08 CN CN201310118434.7A patent/CN104096974A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0557470A (en) * | 1991-08-31 | 1993-03-09 | Fanuc Ltd | Laser beam processing method and device |
| US6420677B1 (en) * | 2000-12-20 | 2002-07-16 | Chromalloy Gas Turbine Corporation | Laser machining cooling holes in gas turbine components |
| CN1675022A (en) * | 2002-07-12 | 2005-09-28 | 日立造船株式会社 | Method and device for removal of thin-film |
| CN101778693A (en) * | 2007-08-15 | 2010-07-14 | 卡特彼勒公司 | Laser machining method utilizing variable inclination angle |
| CN201239859Y (en) * | 2008-06-26 | 2009-05-20 | 北京大恒激光设备有限公司 | Cutting angle adjustable laser cutting device and laser cutting machine equipped therewith |
| CN102123818A (en) * | 2008-06-28 | 2011-07-13 | 通快机床两合公司 | Method for eccentrically orienting a laser cutting beam in relation to a nozzle axis and for cutting at an angle, corresponding laser machining head and laser machining tool |
| CN102470487A (en) * | 2009-08-17 | 2012-05-23 | 西门子公司 | Method for producing an asymmetric diffuser using different laser positions |
| KR20110088212A (en) * | 2010-01-28 | 2011-08-03 | 삼성모바일디스플레이주식회사 | Manufacturing method of mask for depositing thin film on substrate |
| CN203254064U (en) * | 2013-04-08 | 2013-10-30 | 昆山允升吉光电科技有限公司 | Laser cutting device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018019746A1 (en) * | 2016-07-25 | 2018-02-01 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Method for generating transverse protrustions or recesses on a cut edge of a plate-shaped workpiece and associated computer program product |
| CN107900537A (en) * | 2017-11-16 | 2018-04-13 | 惠州市契贝科技有限公司 | Processing method, plate and the diced system of conical through-hole |
| CN110722274A (en) * | 2019-10-31 | 2020-01-24 | 台州知通科技有限公司 | Laser cutting equipment |
| CN110722274B (en) * | 2019-10-31 | 2021-07-16 | 台州知通科技有限公司 | Laser cutting equipment |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20141015 |