CN105491804B - A kind of aluminum base circuit board erosion-control agent and the method using its progress aluminum base circuit board making - Google Patents
A kind of aluminum base circuit board erosion-control agent and the method using its progress aluminum base circuit board making Download PDFInfo
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- CN105491804B CN105491804B CN201510847354.4A CN201510847354A CN105491804B CN 105491804 B CN105491804 B CN 105491804B CN 201510847354 A CN201510847354 A CN 201510847354A CN 105491804 B CN105491804 B CN 105491804B
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- circuit board
- base circuit
- aluminum base
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
Abstract
The invention discloses a kind of aluminum base circuit board erosion-control agents, are prepared from the following raw materials in parts by weight：Polypropylene glycol is 28 parts by weight, septichen is 17 parts by weight, polyethanol is 3 10 parts by weight, dodecyl phosphide ester triethanolamine is 0.5 6 parts by weight, poly- propyl alcohol is 2 10 parts by weight, hydroxy silicon oil is 0.5 6 parts by weight, lauric acid is 0.2 1.6 parts by weight, nitrilotriacetic acid trisodium is 16 parts by weight, end-block fatty alcohol alcoxyl substratess are 0.2 1.8 parts by weight, hydration lead sulfate tribasic is 0.2 1.8 parts by weight, vinyl chloride acetate ethylene copolymer is 18 parts by weight.The present invention aluminum base circuit board erosion-control agent can effective protection aluminum substrate, solve the deficiencies in the prior art, improve production efficiency.
Description
Technical field
The method of aluminum base circuit board making is carried out the present invention relates to a kind of aluminum base circuit board erosion-control agent and using it, is belonged to
Circuit board manufacturing area.
Background technology
Printed circuit board is widely used on various electronic fields, is a kind of indispensable electronic building brick.Pass through electricity
The setting of road plate combines the function of each electronic components of grafting on circuit boards, is able to play overall efficiency.One
As standard print circuit plates making process, relevant production process is excessively complicated, increase making inconvenience and expend work
When, the part of etching is not required to especially for protection aluminum substrate, covering the place with protective film increases making working hour, but practical operation
Get off, even if there is protective film to protect aluminum substrate, still penetrate into etching solution on protective film periphery so that after aluminum substrate etching, periphery
Also there is the trace being etched, thus influence the function of circuit board.Furthermore the aluminium after etching is mostly remained in etching solution, such as
Fruit carries out circuit board etching using identical etching solution, can generate unexpected consequence, very undesirable.
Invention content
In view of the deficienciess of the prior art, the technical problem to be solved by the invention is to provide a kind of aluminum base circuit boards
Erosion-control agent and its manufacturing method simplify circuit board making process, and aluminum substrate are protected not corroded by etching solution.
In order to solve the above technical problems, the technical solution adopted by the present invention is that, a kind of aluminum base circuit board erosion-control agent, by with
The raw material of lower parts by weight is made：Polypropylene glycol is 2-8 parts by weight, septichen is 1-7 parts by weight, polyethanol 3-
10 parts by weight, dodecyl phosphide ester triethanolamine are 0.5-6 parts by weight, poly- propyl alcohol is 2-10 parts by weight, hydroxy silicon oil is
0.5-6 parts by weight, lauric acid are 0.2-1.6 parts by weight, nitrilotriacetic acid trisodium is 1-6 parts by weight, end-block fatty alcohol alkane
Oxygroup object is 0.2-1.8 parts by weight, hydration lead sulfate tribasic is 0.2-1.8 parts by weight, vinyl chloride-vinyl acetate copolymer is
1-8 parts by weight.
Optimization, above-mentioned aluminum base circuit board erosion-control agent is prepared from the following raw materials in parts by weight：Polypropylene glycol is 3-7
Parts by weight, septichen are 2-6 parts by weight, polyethanol is 5-8 parts by weight, dodecyl phosphide ester triethanolamine is 1-4
Parts by weight, poly- propyl alcohol are 3-6 parts by weight, hydroxy silicon oil is 1-3 parts by weight, lauric acid is 0.5-1.2 parts by weight, nitrilotriacetic acid
Trisodium is 2-4 parts by weight, end-block fatty alcohol alcoxyl substratess are 0.6-1.2 parts by weight, hydration lead sulfate tribasic is 0.6-
1.2 parts by weight, vinyl chloride-vinyl acetate copolymer are 3-6 parts by weight.
Optimization, above-mentioned aluminum base circuit board erosion-control agent is prepared from the following raw materials in parts by weight：Polypropylene glycol is 5 weights
Amount part, septichen are 4 parts by weight, polyethanol is 6 parts by weight, dodecyl phosphide ester triethanolamine is 2 parts by weight, poly-
Propyl alcohol is 4 parts by weight, hydroxy silicon oil is 2 parts by weight, lauric acid is 0.8 parts by weight, nitrilotriacetic acid trisodium is 3 parts by weight, end
Base closing fatty alcohol alcoxyl substratess are 0.7 parts by weight, hydration lead sulfate tribasic is that 0.7 parts by weight, vinyl chloride-vinyl acetate are common
Polymers is 4 parts by weight.
A kind of method that aluminum base circuit board making is carried out using above-mentioned aluminum base circuit board erosion-control agent, is included the following steps：
（1）It is punched on previously prepared substrate, hole is through-hole, and quantity is a plurality of；
（2）By step（1）The substrate prepared carries out grinding process, and it is 1.2 to be polished down to surface roughness；
（3）In step（2）Substrate surface is coated into iodide as passivation on the basis of the substrate prepared；
（4）By step（3）The fixed required circuitous pattern of ceiling substrate prepared；
（5）Ink is coated on substrate for limiting required circuitous pattern by way of silk-screen printing；
（6）By step（5）The substrate of completion, which is put into etching solution, to be etched；
（7）In step（6）While substrate is put into etching solution, added in as described in claim 1-3 in etching solution
Aluminum base circuit board erosion-control agent；
（8）By step（7）The substrate prepared takes out carry out subsequent job.
Optimization, the method that above-mentioned aluminum base circuit board makes, in step（7）In, etching solution is heated, is heated up
To 210 DEG C, 45min is kept the temperature.
Optimization, the method that above-mentioned aluminum base circuit board makes, step（8）It is put into aluminium protective agent and carries out after substrate is taken out
Cleaning and dipping, cleaning temperature are 150 degree, and the cleaning and dipping time is 15min.
Optimization, the method that above-mentioned aluminum base circuit board makes, step（1）Middle punching quantity is 8.
Optimization, the method that above-mentioned aluminum base circuit board makes, step（2）Iodide coating thickness is 0.7MM.
The present invention aluminum base circuit board erosion-control agent can effective protection aluminum substrate, solve the deficiencies in the prior art, carry
High production efficiency.And a kind of circuit board making process for preventing etchant etching aluminum base plate is provided, by aluminum base circuit board
Erosion-control agent is added in etching solution, is not needed to patch Protection glue on aluminum substrate, is simplified circuit board making process, and protect aluminum substrate
It is not corroded by etching solution.A kind of circuit board making process for preventing etchant etching aluminum base plate is provided, is prevented by aluminum base circuit board
The addition of aggressive agent so that whole aluminum substrate manufacturing process simplifies, and can accelerate circuit board making rate, helps to save making
The purpose of cost.Specific embodiment
Embodiment 1
The present invention is a kind of aluminum base circuit board erosion-control agent, is prepared from the following raw materials in parts by weight：Polypropylene glycol is 2 weights
Measure part, septichen is 1 parts by weight, polyethanol is 3 parts by weight, dodecyl phosphide ester triethanolamine is 0.5 weight
Part, poly- propyl alcohol are 2 parts by weight, hydroxy silicon oil is 0.5 parts by weight, lauric acid is 0.2 parts by weight, nitrilotriacetic acid trisodium is 1 weight
Amount part, end-block fatty alcohol alcoxyl substratess are 0.2 parts by weight, hydration lead sulfate tribasic is 0.2 parts by weight, vinyl chloride-vinegar
Sour ethylene copolymer is 1 parts by weight.
A kind of method that aluminum base circuit board making is carried out using above-mentioned aluminum base circuit board erosion-control agent, is included the following steps：
（1）It is punched on previously prepared substrate, hole is through-hole, and quantity is a plurality of；
（2）By step（1）The substrate prepared carries out grinding process, and it is 1.2 to be polished down to surface roughness；
（3）In step（2）Substrate surface is coated into iodide as passivation on the basis of the substrate prepared；
（4）By step（3）The fixed required circuitous pattern of ceiling substrate prepared；
（5）Ink is coated on substrate for limiting required circuitous pattern by way of silk-screen printing；
（6）By step（5）The substrate of completion, which is put into etching solution, to be etched；
（7）In step（6）While substrate is put into etching solution, added in as described in claim 1-3 in etching solution
Aluminum base circuit board erosion-control agent；
（8）By step（7）The substrate prepared takes out carry out subsequent job.
Optimization, the method that above-mentioned aluminum base circuit board makes, in step（7）In, etching solution is heated, is heated up
To 210 DEG C, 45min is kept the temperature.
Optimization, the method that above-mentioned aluminum base circuit board makes, step（8）It is put into aluminium protective agent and carries out after substrate is taken out
Cleaning and dipping, cleaning temperature are 150 degree, and the cleaning and dipping time is 15min.
Optimization, the method that above-mentioned aluminum base circuit board makes, step（1）Middle punching quantity is 8.
Optimization, the method that above-mentioned aluminum base circuit board makes, step（2）Iodide coating thickness is 0.7MM.
The present invention aluminum base circuit board erosion-control agent can effective protection aluminum substrate, solve the deficiencies in the prior art, carry
High production efficiency.And a kind of circuit board making process for preventing etchant etching aluminum base plate is provided, by aluminum base circuit board
Erosion-control agent is added in etching solution, is not needed to patch Protection glue on aluminum substrate, is simplified circuit board making process, and protect aluminum substrate
It is not corroded by etching solution.A kind of circuit board making process for preventing etchant etching aluminum base plate is provided, is prevented by aluminum base circuit board
The addition of aggressive agent so that whole aluminum substrate manufacturing process simplifies, and can accelerate circuit board making rate, helps to save making
The purpose of cost.
Embodiment 2
The present embodiment and embodiment 1 are difference lies in a kind of aluminum base circuit board erosion-control agent, by the original of following parts by weight
Material is made：Polypropylene glycol is 8 parts by weight, septichen is 7 parts by weight, polyethanol is 10 parts by weight, dodecyl phosphide
Ester triethanolamine is 6 parts by weight, poly- propyl alcohol is 10 parts by weight, hydroxy silicon oil is 6 parts by weight, lauric acid is 1.6 parts by weight, nitrilo
Triacetic acid trisodium is 6 parts by weight, end-block fatty alcohol alcoxyl substratess are 1.8 parts by weight, hydration lead sulfate tribasic is 1.8 weights
Measure part, vinyl chloride-vinyl acetate copolymer is 8 parts by weight.
Embodiment 3
Difference lies in aluminum base circuit board erosion-control agents with embodiment 1,2 for the present embodiment, and polypropylene glycol is 5 parts by weight, neighbour
Hydroxybenzoic acid is 4 parts by weight, polyethanol is 6 parts by weight, dodecyl phosphide ester triethanolamine is 2 parts by weight, poly- propyl alcohol is 4
Parts by weight, hydroxy silicon oil are 2 parts by weight, lauric acid is 0.8 parts by weight, nitrilotriacetic acid trisodium is 3 parts by weight, end-block fat
Fat alcohol alcoxyl substratess are 0.7 parts by weight, hydration lead sulfate tribasic is 0.7 parts by weight, vinyl chloride-vinyl acetate copolymer 4
Parts by weight.
Embodiment 3 is the most preferred embodiment of the application.
Certainly, it is limitation of the present invention that above description, which is not, and the present invention is also not limited to the example above, the art
Those of ordinary skill, in the essential scope of the present invention, the variations, modifications, additions or substitutions made should all belong to the present invention
Protection domain.
Claims (8)
1. a kind of aluminum base circuit board erosion-control agent, it is characterised in that：It is prepared from the following raw materials in parts by weight：Polypropylene glycol is 2-
8 parts by weight, septichen are 1-7 parts by weight, polyethanol is 3-10 parts by weight, dodecyl phosphide ester triethanolamine is
0.5-6 parts by weight, poly- propyl alcohol are 2-10 parts by weight, hydroxy silicon oil is 0.5-6 parts by weight, lauric acid is 0.2-1.6 parts by weight, nitrogen
River triacetic acid trisodium is 1-6 parts by weight, end-block fatty alcohol alcoxyl substratess are 0.2-1.8 parts by weight, the tribasic sulfuric acid of hydration
Lead is 0.2-1.8 parts by weight, vinyl chloride-vinyl acetate copolymer is 1-8 parts by weight.
2. aluminum base circuit board erosion-control agent according to claim 1, it is characterised in that：By the raw material system of following parts by weight
Into：Polypropylene glycol is 3-7 parts by weight, septichen is 2-6 parts by weight, polyethanol is 5-8 parts by weight, dodecyl phosphide
Ester triethanolamine is 1-4 parts by weight, poly- propyl alcohol is 3-6 parts by weight, hydroxy silicon oil is 1-3 parts by weight, lauric acid is 0.5-1.2 weights
Amount part, nitrilotriacetic acid trisodium are 2-4 parts by weight, end-block fatty alcohol alcoxyl substratess are 0.6-1.2 parts by weight, three salt of hydration
Base lead sulfate is 0.6-1.2 parts by weight, vinyl chloride-vinyl acetate copolymer is 3-6 parts by weight.
3. aluminum base circuit board erosion-control agent according to claim 2, it is characterised in that：By the raw material system of following parts by weight
Into：Polypropylene glycol is 5 parts by weight, septichen is 4 parts by weight, polyethanol is 6 parts by weight, three second of dodecyl phosphide ester
Hydramine is 2 parts by weight, poly- propyl alcohol is 4 parts by weight, hydroxy silicon oil is 2 parts by weight, lauric acid is 0.8 parts by weight, nitrilotriacetic acid
Trisodium is 3 parts by weight, end-block fatty alcohol alcoxyl substratess be 0.7 parts by weight, hydration lead sulfate tribasic be 0.7 parts by weight,
Vinyl chloride-vinyl acetate copolymer is 4 parts by weight.
4. a kind of method that aluminum base circuit board erosion-control agent using described in claim 1-3 carries out aluminum base circuit board making,
It is characterized in that：Include the following steps：
（1）It is punched on previously prepared substrate, hole is through-hole, and quantity is a plurality of；
（2）By step（1）The substrate prepared carries out grinding process, and it is 1.2 μm to be polished down to surface roughness；
（3）In step（2）Substrate surface is coated into iodide as passivation on the basis of the substrate prepared；
（4）By step（3）The fixed required circuitous pattern of ceiling substrate prepared；
（5）Ink is coated on substrate for limiting required circuitous pattern by way of silk-screen printing；
（6）By step（5）The substrate of completion, which is put into etching solution, to be etched；
（7）In step（6）While substrate is put into etching solution, the aluminium as described in claim 1-3 is added in etching solution
Base circuit board erosion-control agent；
（8）By step（7）The substrate prepared takes out carry out subsequent job.
5. the method that aluminum base circuit board according to claim 4 makes, it is characterised in that：It is described in step（7）In, it will lose
It carves liquid to be heated, is warming up to 210 DEG C, keep the temperature 45min.
6. the method that aluminum base circuit board according to claim 5 makes, it is characterised in that：The step（8）Substrate is taken
It is put into after going out in aluminium protective agent and carries out cleaning and dipping, cleaning temperature is 150 degree, and the cleaning and dipping time is 15min.
7. the method that aluminum base circuit board according to claim 6 makes, it is characterised in that：The step（1）Middle punching number
Measure is 8.
8. the method that aluminum base circuit board according to claim 7 makes, it is characterised in that：The step（2）Iodide apply
Thickness is covered for 0.7MM.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510847354.4A CN105491804B (en) | 2015-11-30 | 2015-11-30 | A kind of aluminum base circuit board erosion-control agent and the method using its progress aluminum base circuit board making |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510847354.4A CN105491804B (en) | 2015-11-30 | 2015-11-30 | A kind of aluminum base circuit board erosion-control agent and the method using its progress aluminum base circuit board making |
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| Publication Number | Publication Date |
|---|---|
| CN105491804A CN105491804A (en) | 2016-04-13 |
| CN105491804B true CN105491804B (en) | 2018-06-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510847354.4A Active CN105491804B (en) | 2015-11-30 | 2015-11-30 | A kind of aluminum base circuit board erosion-control agent and the method using its progress aluminum base circuit board making |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201499370U (en) * | 2009-04-16 | 2010-06-02 | 惠州国展电子有限公司 | Metal-based circuit board for etched metal heat dissipating surface |
| CN103687314A (en) * | 2013-12-07 | 2014-03-26 | 广东达进电子科技有限公司 | Novel manufacturing method of aluminum-substrate circuit board |
| CN104640361A (en) * | 2013-11-06 | 2015-05-20 | 周海梅 | Aluminum-based circuit board manufacturing method for preventing oil dropping caused by direct etching |
-
2015
- 2015-11-30 CN CN201510847354.4A patent/CN105491804B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201499370U (en) * | 2009-04-16 | 2010-06-02 | 惠州国展电子有限公司 | Metal-based circuit board for etched metal heat dissipating surface |
| CN104640361A (en) * | 2013-11-06 | 2015-05-20 | 周海梅 | Aluminum-based circuit board manufacturing method for preventing oil dropping caused by direct etching |
| CN103687314A (en) * | 2013-12-07 | 2014-03-26 | 广东达进电子科技有限公司 | Novel manufacturing method of aluminum-substrate circuit board |
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| Publication number | Publication date |
|---|---|
| CN105491804A (en) | 2016-04-13 |
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