CN105491804A - Corrosion inhibitor for aluminum-based circuit board and method for fabricating aluminum-based circuit board by corrosion inhibitor - Google Patents
Corrosion inhibitor for aluminum-based circuit board and method for fabricating aluminum-based circuit board by corrosion inhibitor Download PDFInfo
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- CN105491804A CN105491804A CN201510847354.4A CN201510847354A CN105491804A CN 105491804 A CN105491804 A CN 105491804A CN 201510847354 A CN201510847354 A CN 201510847354A CN 105491804 A CN105491804 A CN 105491804A
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- weight portion
- circuit board
- substrate
- weight
- aluminum base
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
Abstract
The invention discloses a corrosion inhibitor of an aluminum-based circuit board. The corrosion inhibitor is prepared from the following raw materials in parts by weight: 2-8 parts of polypropylene glycol, 1-7 parts of o-hydroxybenzoic acid, 3-10 parts of polyethylene ethanol, 0.5-6 parts of dodecyl alkyl phosphate triethanolamine, 2-10 parts of polypropylene glycol, 0.5-6 parts of hydroxyl silicone oil, 0.2-1.6 parts of lauric acid, 1-6 parts of nitrilotriacetic acid, 0.2-1.8 parts of end-blocked fatty alcohol alkoxide, 0.2-1.8 parts of hydrated tribasic lead sulfate and 1-8 parts of a vinyl chloride-vinyl acetate copolymer. The corrosion inhibitor of the aluminum-based circuit board disclosed by the invention can effectively protect an aluminum substrate; the shortages of the prior art are avoided; and the production efficiency is improved.
Description
Technical field
The present invention relates to a kind of aluminum base circuit board erosion-control agent and use it to carry out the method for aluminum base circuit board making, belonging to circuit board manufacturing area.
Background technology
Printed circuit board (PCB) is widely used on various electronic applications, is a kind of indispensable electronic building brick.By the setting of circuit board, the function of grafting each electronic components is on circuit boards combined, is played overall efficiency.The print circuit plates making process of general standard; its relevant Making programme is too complicated; increase the inconvenience of making and expend man-hour, especially in order to protect aluminium base not need the part etched, covering the increase of described place with diaphragm and making man-hour; but practical operation is got off; even if there is diaphragm to protect aluminium base, still infiltrate etching solution at diaphragm periphery, after aluminium base is etched; also there is etched vestige in periphery, thus affects the function of circuit board.Moreover the aluminium after etching mostly remains in etching solution, if use identical etching solution to carry out circuit board etching, the consequence that cannot expect can be produced, very undesirable.
Summary of the invention
For the deficiency that prior art exists, technical problem to be solved by this invention is, provides a kind of aluminum base circuit board erosion-control agent and manufacture method thereof, simplifies circuit board making process, and protects aluminium base not corrode by etching solution.
For solving the problems of the technologies described above, the technical scheme that the present invention takes is, a kind of aluminum base circuit board erosion-control agent, be made up of the raw material of following parts by weight: polypropylene glycol is 2-8 weight portion, septichen is 1-7 weight portion, PVOH is 3-10 weight portion, dodecyl phosphide ester triethanolamine is 0.5-6 weight portion, poly-propyl alcohol is 2-10 weight portion, hydroxy silicon oil is 0.5-6 weight portion, laurate is 0.2-1.6 weight portion, nitrilotriacetic acid trisodium is 1-6 weight portion, end-block fatty alcohol alcoxyl substrate is 0.2-1.8 weight portion, hydration lead sulfate tribasic is 0.2-1.8 weight portion, vinyl chloride-vinyl acetate copolymer is 1-8 weight portion.
Optimize, above-mentioned aluminum base circuit board erosion-control agent, be made up of the raw material of following parts by weight: polypropylene glycol is 3-7 weight portion, septichen is 2-6 weight portion, PVOH is 5-8 weight portion, dodecyl phosphide ester triethanolamine is 1-4 weight portion, poly-propyl alcohol is 3-6 weight portion, hydroxy silicon oil is 1-3 weight portion, laurate is 0.5-1.2 weight portion, nitrilotriacetic acid trisodium is 2-4 weight portion, end-block fatty alcohol alcoxyl substrate is 0.6-1.2 weight portion, hydration lead sulfate tribasic is 0.6-1.2 weight portion, vinyl chloride-vinyl acetate copolymer is 3-6 weight portion.
Optimize, above-mentioned aluminum base circuit board erosion-control agent, is made up of the raw material of following parts by weight: polypropylene glycol is 5 weight portions, septichen is 4 weight portions, PVOH is 6 weight portions, dodecyl phosphide ester triethanolamine is 2 weight portions, poly-propyl alcohol is 4 weight portions, hydroxy silicon oil is 2 weight portions, laurate is 0.8 weight portion, nitrilotriacetic acid trisodium is 3 weight portions, end-block fatty alcohol alcoxyl substrate is 0.7 weight portion, hydration lead sulfate tribasic is 0.7 weight portion, vinyl chloride-vinyl acetate copolymer is 4 weight portions.
Use above-mentioned aluminum base circuit board erosion-control agent to carry out a method for aluminum base circuit board making, comprise the following steps:
(1) punch on previously prepared substrate, hole is through hole, and quantity is a plurality of;
(2) substrate that step (1) prepares is carried out grinding process, being polished down to surface roughness is 1.2;
(3) substrate surface is applied iodide as passivation by the basis of the substrate prepared in step (2);
(4) the fixed required circuitous pattern of ceiling substrate step (3) prepared;
(5) ink is coated on substrate by the mode of silk screen printing to be used for limiting required circuitous pattern;
(6) substrate that step (5) completes is put into etching solution to etch;
(7) while substrate is put into etching solution by step (6), in etching solution, the aluminum base circuit board erosion-control agent as described in claim 1-3 is added;
(8) substrate that step (7) prepares is taken out carry out subsequent job.
Optimize, the method that above-mentioned aluminum base circuit board makes, in step (7) a metallic, etching solution is carried out heat treated, be warming up to 210 DEG C, insulation 45min.
Optimize, the method that above-mentioned aluminum base circuit board makes, step (8) is put into aluminium protective agent after being taken out by substrate and is carried out cleaning and dipping, and cleaning temperature is 150 degree, and the cleaning and dipping time is 15min.
Optimize, the method that above-mentioned aluminum base circuit board makes, in step (1), punching quantity is 8.
Optimize, the method that above-mentioned aluminum base circuit board makes, step (2) iodide coating thickness is 0.7MM.
Aluminum base circuit board erosion-control agent of the present invention can available protecting aluminium base, solves the deficiencies in the prior art, improves production efficiency.And provide a kind of circuit board making process preventing etchant etching aluminum base plate, aluminum base circuit board erosion-control agent is added in etching solution, do not need to paste protecting glue on aluminium base, simplify circuit board making process, and protect aluminium base not corrode by etching solution.A kind of circuit board making process preventing etchant etching aluminum base plate is provided, by adding of aluminum base circuit board erosion-control agent, overall aluminium base manufacturing process is simplified, and circuit board making speed can be accelerated, contribute to the object of saving cost of manufacture.
embodiment
embodiment 1
The present invention is a kind of aluminum base circuit board erosion-control agent, is made up of the raw material of following parts by weight: polypropylene glycol is 2 weight portions, septichen is 1 weight portion, PVOH is 3 weight portions, dodecyl phosphide ester triethanolamine is 0.5 weight portion, poly-propyl alcohol is 2 weight portions, hydroxy silicon oil is 0.5 weight portion, laurate is 0.2 weight portion, nitrilotriacetic acid trisodium is 1 weight portion, end-block fatty alcohol alcoxyl substrate is 0.2 weight portion, hydration lead sulfate tribasic is 0.2 weight portion, vinyl chloride-vinyl acetate copolymer is 1 weight portion.
Use above-mentioned aluminum base circuit board erosion-control agent to carry out a method for aluminum base circuit board making, comprise the following steps:
(1) punch on previously prepared substrate, hole is through hole, and quantity is a plurality of;
(2) substrate that step (1) prepares is carried out grinding process, being polished down to surface roughness is 1.2;
(3) substrate surface is applied iodide as passivation by the basis of the substrate prepared in step (2);
(4) the fixed required circuitous pattern of ceiling substrate step (3) prepared;
(5) ink is coated on substrate by the mode of silk screen printing to be used for limiting required circuitous pattern;
(6) substrate that step (5) completes is put into etching solution to etch;
(7) while substrate is put into etching solution by step (6), in etching solution, the aluminum base circuit board erosion-control agent as described in claim 1-3 is added;
(8) substrate that step (7) prepares is taken out carry out subsequent job.
Optimize, the method that above-mentioned aluminum base circuit board makes, in step (7) a metallic, etching solution is carried out heat treated, be warming up to 210 DEG C, insulation 45min.
Optimize, the method that above-mentioned aluminum base circuit board makes, step (8) is put into aluminium protective agent after being taken out by substrate and is carried out cleaning and dipping, and cleaning temperature is 150 degree, and the cleaning and dipping time is 15min.
Optimize, the method that above-mentioned aluminum base circuit board makes, in step (1), punching quantity is 8.
Optimize, the method that above-mentioned aluminum base circuit board makes, step (2) iodide coating thickness is 0.7MM.
Aluminum base circuit board erosion-control agent of the present invention can available protecting aluminium base, solves the deficiencies in the prior art, improves production efficiency.And provide a kind of circuit board making process preventing etchant etching aluminum base plate, aluminum base circuit board erosion-control agent is added in etching solution, do not need to paste protecting glue on aluminium base, simplify circuit board making process, and protect aluminium base not corrode by etching solution.A kind of circuit board making process preventing etchant etching aluminum base plate is provided, by adding of aluminum base circuit board erosion-control agent, overall aluminium base manufacturing process is simplified, and circuit board making speed can be accelerated, contribute to the object of saving cost of manufacture.
embodiment 2
The difference of the present embodiment and embodiment 1 is a kind of aluminum base circuit board erosion-control agent, is made up of the raw material of following parts by weight: polypropylene glycol is 8 weight portions, septichen is 7 weight portions, PVOH is 10 weight portions, dodecyl phosphide ester triethanolamine is 6 weight portions, poly-propyl alcohol is 10 weight portions, hydroxy silicon oil is 6 weight portions, laurate is 1.6 weight portions, nitrilotriacetic acid trisodium is 6 weight portions, end-block fatty alcohol alcoxyl substrate is 1.8 weight portions, hydration lead sulfate tribasic is 1.8 weight portions, vinyl chloride-vinyl acetate copolymer is 8 weight portions.
embodiment 3
The difference of the present embodiment and embodiment 1,2 is aluminum base circuit board erosion-control agent, and polypropylene glycol is 5 weight portions, septichen is 4 weight portions, PVOH is 6 weight portions, dodecyl phosphide ester triethanolamine is 2 weight portions, poly-propyl alcohol is 4 weight portions, hydroxy silicon oil is 2 weight portions, laurate is 0.8 weight portion, nitrilotriacetic acid trisodium is 3 weight portions, end-block fatty alcohol alcoxyl substrate is 0.7 weight portion, hydration lead sulfate tribasic is 0.7 weight portion, vinyl chloride-vinyl acetate copolymer is 4 weight portions.
Embodiment 3 is the most preferred embodiment of the application.
Certainly, above-mentioned explanation is not limitation of the present invention, and the present invention is also not limited to above-mentioned citing; those skilled in the art; in essential scope of the present invention, the change made, remodeling, interpolation or replacement, all should belong to protection scope of the present invention.
Claims (8)
1. an aluminum base circuit board erosion-control agent, it is characterized in that: be made up of the raw material of following parts by weight: polypropylene glycol is 2-8 weight portion, septichen is 1-7 weight portion, PVOH is 3-10 weight portion, dodecyl phosphide ester triethanolamine is 0.5-6 weight portion, poly-propyl alcohol is 2-10 weight portion, hydroxy silicon oil is 0.5-6 weight portion, laurate is 0.2-1.6 weight portion, nitrilotriacetic acid trisodium is 1-6 weight portion, end-block fatty alcohol alcoxyl substrate is 0.2-1.8 weight portion, hydration lead sulfate tribasic is 0.2-1.8 weight portion, vinyl chloride-vinyl acetate copolymer is 1-8 weight portion.
2. aluminum base circuit board erosion-control agent according to claim 1, it is characterized in that: be made up of the raw material of following parts by weight: polypropylene glycol is 3-7 weight portion, septichen is 2-6 weight portion, PVOH is 5-8 weight portion, dodecyl phosphide ester triethanolamine is 1-4 weight portion, poly-propyl alcohol is 3-6 weight portion, hydroxy silicon oil is 1-3 weight portion, laurate is 0.5-1.2 weight portion, nitrilotriacetic acid trisodium is 2-4 weight portion, end-block fatty alcohol alcoxyl substrate is 0.6-1.2 weight portion, hydration lead sulfate tribasic is 0.6-1.2 weight portion, vinyl chloride-vinyl acetate copolymer is 3-6 weight portion.
3. aluminum base circuit board erosion-control agent according to claim 2, is characterized in that: be made up of the raw material of following parts by weight: polypropylene glycol is 5 weight portions, septichen is 4 weight portions, PVOH is 6 weight portions, dodecyl phosphide ester triethanolamine is 2 weight portions, poly-propyl alcohol is 4 weight portions, hydroxy silicon oil is 2 weight portions, laurate is 0.8 weight portion, nitrilotriacetic acid trisodium is 3 weight portions, end-block fatty alcohol alcoxyl substrate is 0.7 weight portion, hydration lead sulfate tribasic is 0.7 weight portion, vinyl chloride-vinyl acetate copolymer is 4 weight portions.
4. use the aluminum base circuit board erosion-control agent described in claim 1-3 to carry out a method for aluminum base circuit board making, it is characterized in that: comprise the following steps:
(1) punch on previously prepared substrate, hole is through hole, and quantity is a plurality of;
(2) substrate that step (1) prepares is carried out grinding process, being polished down to surface roughness is 1.2;
(3) substrate surface is applied iodide as passivation by the basis of the substrate prepared in step (2);
(4) the fixed required circuitous pattern of ceiling substrate step (3) prepared;
(5) ink is coated on substrate by the mode of silk screen printing to be used for limiting required circuitous pattern;
(6) substrate that step (5) completes is put into etching solution to etch;
(7) while substrate is put into etching solution by step (6), in etching solution, the aluminum base circuit board erosion-control agent as described in claim 1-3 is added;
(8) substrate that step (7) prepares is taken out carry out subsequent job.
5. the method for aluminum base circuit board making according to claim 4, is characterized in that: in step (7) a metallic described, etching solution is carried out heat treated, be warming up to 210 DEG C, insulation 45min.
6. the method for aluminum base circuit board making according to claim 5, is characterized in that: described step (8) is put into aluminium protective agent after being taken out by substrate and carried out cleaning and dipping, and cleaning temperature is 150 degree, and the cleaning and dipping time is 15min.
7. the method for aluminum base circuit board making according to claim 6, is characterized in that: in described step (1), punching quantity is 8.
8. the method for aluminum base circuit board making according to claim 7, is characterized in that: described step (2) iodide coating thickness is 0.7MM.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510847354.4A CN105491804B (en) | 2015-11-30 | 2015-11-30 | A kind of aluminum base circuit board erosion-control agent and the method using its progress aluminum base circuit board making |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510847354.4A CN105491804B (en) | 2015-11-30 | 2015-11-30 | A kind of aluminum base circuit board erosion-control agent and the method using its progress aluminum base circuit board making |
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| Publication Number | Publication Date |
|---|---|
| CN105491804A true CN105491804A (en) | 2016-04-13 |
| CN105491804B CN105491804B (en) | 2018-06-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510847354.4A Active CN105491804B (en) | 2015-11-30 | 2015-11-30 | A kind of aluminum base circuit board erosion-control agent and the method using its progress aluminum base circuit board making |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201499370U (en) * | 2009-04-16 | 2010-06-02 | 惠州国展电子有限公司 | Metal-based circuit board for etched metal heat dissipating surface |
| CN103687314A (en) * | 2013-12-07 | 2014-03-26 | 广东达进电子科技有限公司 | Novel manufacturing method of aluminum-substrate circuit board |
| CN104640361A (en) * | 2013-11-06 | 2015-05-20 | 周海梅 | Aluminum-based circuit board manufacturing method for preventing oil dropping caused by direct etching |
-
2015
- 2015-11-30 CN CN201510847354.4A patent/CN105491804B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201499370U (en) * | 2009-04-16 | 2010-06-02 | 惠州国展电子有限公司 | Metal-based circuit board for etched metal heat dissipating surface |
| CN104640361A (en) * | 2013-11-06 | 2015-05-20 | 周海梅 | Aluminum-based circuit board manufacturing method for preventing oil dropping caused by direct etching |
| CN103687314A (en) * | 2013-12-07 | 2014-03-26 | 广东达进电子科技有限公司 | Novel manufacturing method of aluminum-substrate circuit board |
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| Publication number | Publication date |
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| CN105491804B (en) | 2018-06-26 |
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