CN105472958B - Flat-shaped part adsorbent equipment - Google Patents
Flat-shaped part adsorbent equipment Download PDFInfo
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- CN105472958B CN105472958B CN201510617417.7A CN201510617417A CN105472958B CN 105472958 B CN105472958 B CN 105472958B CN 201510617417 A CN201510617417 A CN 201510617417A CN 105472958 B CN105472958 B CN 105472958B
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Abstract
Present invention offer is a kind of not to cause the structure of flat-shaped part adsorbent equipment entirety to become huge, just can form the flat-shaped part adsorbent equipment with the corresponding binding domain of the size of flat-shaped part by shirtsleeve operation.The flat-shaped part adsorbent equipment of the present invention has to be stacked with substrate plate 210,And the component counter plate 220 on reference position and sliding position can be arranged on,Substrate plate side adsorption hole 211 is equipped on substrate plate 210,Component counter plate side adsorption hole 221 is equipped on component counter plate 220,Component counter plate side adsorption hole 221 is by benchmark adsorption hole 221a and the addition adsorption hole 221b being located between benchmark adsorption hole,Additional adsorption hole 221c is formed,Benchmark adsorption hole 221a and substrate plate side adsorption hole 211 are to so as to forming benchmark binding domain when component counter plate 220 is located at reference position,When being located at sliding position,Such as,Additional adsorption hole 221b is with substrate plate side adsorption hole 211 to having and the different size of specific binding domain of benchmark binding domain to so as to be formed.
Description
Technical field
The present invention relates to a kind of flat-shaped part adsorbent equipments of negative-pressure adsorption flat-shaped part.
Background technology
In the past, it has been suggested that the various electronic components to covering circuit substrate (hereinafter referred to as substrate) and assembling on the substrate
The flat-shaped parts such as cover film (coverlay film) carry out certain processing or be delivered to the flat-shaped part next
During procedure, adsorbent equipment (hereinafter referred to as flat-shaped part adsorbent equipment) which is temporarily kept.
Such flat-shaped part adsorbent equipment causes as the flat-shaped part for adsorbing object and is formed with multiple absorption
Adsorption plate (plate) opposite contact in hole and by the flat-shaped part negative-pressure adsorption.In this case, attraction in order to prevent
Decline, it is important that be reduced as far as absorption leakage.In addition, " absorption leakage " refers to carrying out the absorption of flat-shaped part
During action, a part of adsorption hole in multiple adsorption holes becomes the state exposed from flat-shaped part.
In order to be reduced as far as absorption leakage, it is important that when making flat-shaped part with adsorption plate opposite face, in advance
The binding domain being set as in adsorption plate is almost identical size or the undersized than flat-shaped part with flat-shaped part.
Here, " binding domain " refers to be arranged in the adsorption hole on adsorption plate, can carry out to the planar portion as absorption object
The region of the absorption of part.In addition, the binding domain can be variously-shaped, here designated as rectangle.
Here, if the size of the flat-shaped part as absorption object is one kind, as long as being set as binding domain with being somebody's turn to do
The almost identical size of flat-shaped part or the undersized than the flat-shaped part, you can not generate absorption leakage and by the tablet
Shape component adsorbs, however, it is desirable to the situation for adsorbing the smaller flat-shaped part than binding domain is also existing.At this
In the case of kind, once the size of binding domain is fixed, the smaller flat-shaped part than binding domain cannot cover
Entire binding domain will generate absorption leakage.
So, it is possible not generate absorption leakage and by the binding domain of the ratio adsorption plate in flat-shaped part adsorbent equipment
The flat-shaped part adsorbent equipment of smaller flat-shaped part absorption was just in the past known (such as referenced patent document
One).
Figure 11 is the figure for showing to illustrate the flat-shaped part adsorbent equipment 900 described in patent document one.Figure 11 (a)
It is the oblique view for the structure for showing flat-shaped part adsorbent equipment 900, Figure 11 (b) is display flat-shaped part adsorbent equipment 900
Used in strip of sheet material (sheet) 910 top view.
(it is known as substrate in patent document one to inhale to the flat-shaped part adsorbent equipment 900 described in patent document one
Attached fixing device) structure illustrate before, strip of sheet material 910 is illustrated using Figure 11 (b) first, is made again afterwards
It is illustrated with Figure 11 (a) come the structure to flat-shaped part adsorbent equipment 900.
Strip of sheet material 910 is such as shown in Figure 11 (b), by a plurality of sheet material portion 910a, 910b, 910c ... form, it is each
Sheet material portion 910a, 910b, 910c ... in be formed with as adsorb object flat-shaped part (being appointed as substrate) size
Corresponding binding domain Qa, Qb, Qc ....
Flat-shaped part adsorbent equipment 900 such as shown in Figure 11 (a), has:Adsorption plate on substrate-placing platform 920
930;The bar code (bar code) 941 being printed upon on the substrate 940 as absorption object is read, output shows the substrate 940
Size sheet material selection signal barcode reader (bar-code reader) 950;And based on barcode reader
950 output sheet material selection signals, from be formed on strip of sheet material 910 a plurality of binding domain Qa, Qb, Qc ... in
Selection (is appointed as piece portion with the sheet material portion with the corresponding binding domain of size (being appointed as binding domain Qb) of substrate 940
Material 910b), and the sheet material portion 910b selected is configured into the configuration section 960 on adsorption plate 930.
In addition, for adsorption plate 930, multiple adsorption holes (not shown) are provided in the entire surface of the adsorption plate 930, are inhaled
The almost entire surface of attached plate 930 all becomes binding domain.In contrast, by 960 selected sheet material portion of sheet material mounting portion
Binding domain is than the binding domain smaller of adsorption plate 930.Also, there is sheet material mounting portion 960 strip of sheet material 910 to be erected at it
On roller (roller) 961, roller 962, rotation driving roller 961, rotation driving roller 962 driving portion 932 and control driving portion
963 control unit 964.
Flat-shaped part adsorbent equipment 900 according to described in patent document one, by being then based on display as absorption pair
The sheet material selection signal of the size of the substrate 940 of elephant has the sheet material with the corresponding binding domain Qb of size of the substrate 940
Portion 910b is configured on adsorption plate 930, thus can not generate because with the suction beyond the corresponding region of the size of substrate 940
Leakage is adsorbed caused by attached hole.
However, it is necessary in advance to each as suction in the flat-shaped part adsorbent equipment 900 described in patent document one
The size of the substrate of attached object is ready for the sheet material portion with the corresponding binding domain of size of substrate, also, is not only needed
It is provided as to have and configures the mechanism on adsorption plate with the sheet material portion of the corresponding binding domain of the size of substrate
Roller and drive the roller driving plate, while also need to set control driving portion control unit.Therefore, in patent document one
The flat-shaped part adsorbent equipment 900 of record, the structure there are adsorbent equipment entirety become huge problem.
Look-ahead technique document Prior Art
Patent document
One Japanese Unexamined Patent Publication 2004-322254 publications of patent document
The content of the invention
The present invention be based on case above and invent, and it is an object of the present invention to provide a kind of not so that flat-shaped part adsorbent equipment
Whole structure becomes huge, and the size phase of the flat-shaped part with being used as absorption object just can be formed by shirtsleeve operation
The flat-shaped part adsorbent equipment of corresponding binding domain.
[1] flat-shaped part adsorbent equipment of the invention is a kind of flat-shaped part absorption of negative-pressure adsorption flat-shaped part
Device, which is characterized in that have:Substrate plate is installed on the adsorbent equipment body to form negative pressure chamber;And component opposite
Plate, and the flat-shaped part opposite, and be stacked in the plane with the state of contiguity with the substrate plate, it can be compared with substrate plate
On sliding position after being set at reference position and being slided from the reference position, wherein, it is more on the substrate plate
A adsorption hole is set as substrate plate side adsorption hole, and on the component counter plate, multiple adsorption holes are as component counter plate
Side adsorption hole is set, and substrate plate side adsorption hole is arranged on predetermined configuration on the substrate plate, the component pair
Panel side adsorption hole is made of a plurality of benchmark adsorption holes and additional adsorption hole, and a plurality of benchmark adsorption hole is set
Be set to when the component counter plate is located at the reference position, with the whole adsorption hole in the adsorption hole of the substrate plate side or
Predetermined adsorption hole in the adsorption hole of the substrate plate side is opposite to the additional adsorption hole is in the predetermined of the component counter plate
It is arranged in region along between the adjacent benchmark adsorption hole of the glide direction of the component counter plate, when the component counter plate
During positioned at the reference position, by the benchmark adsorption hole and it is arranged on and the benchmark adsorption hole is the same as the base on position
Bottom plate side adsorption hole is opposite to so as to form benchmark binding domain on the component counter plate, when the component counter plate position
When the sliding position, by the benchmark adsorption hole and it is arranged on and the benchmark adsorption hole is the same as the substrate on position
Plate side adsorption hole is opposite to having and the different size of spy of benchmark binding domain so as to be formed on the component counter plate
Determine binding domain.
Flat-shaped part adsorbent equipment according to the present invention, when component counter plate is located at reference position and positioned at sliding position
When putting, can by the binding domain of adsorbable flat-shaped part formed on the basis of binding domain and have and the benchmark binding domain
Different size of specific binding domain.In this way, flat-shaped part adsorbent equipment according to the present invention, only changes compared with substrate plate
Component counter plate position, you can change the size of distributing area.Therefore, flat-shaped part adsorbent equipment entirety is not caused
Structure becomes huge, and it is corresponding just to form the size of the flat-shaped part with being used as absorption object by shirtsleeve operation
Binding domain.Specifically, can be formed than binding domain (benchmark possessed by the flat-shaped part adsorbent equipment script of the present invention
Binding domain) small binding domain (specific binding domain).In this way, even if in comparison with the flat-shaped part for being suitble to the present invention
The small tabular of the size of the flat-shaped part of the size of binding domain possessed by adsorbent equipment script (benchmark binding domain)
In the case that component is adsorbed, it can not also generate absorption leakage and adsorb the flat-shaped part of the small size.
It is in addition, each after component counter plate is set in reference position and is slided from the reference position compared with substrate plate
Can fix the position of substrate plate and adsorbent equipment body during a sliding position so that component counter plate slides, can also
In contrast, the position of component counter plate is fixed, and substrate plate is slided simultaneously with adsorbent equipment body.
[2] flat-shaped part adsorbent equipment of the invention also has positioning region, is located at respectively when the component counter plate
During the reference position and when the component counter plate is located at the sliding position, the component counter plate is located in institute
It states on reference position or the sliding position.
By having such positioning region, all parts counter plate side adsorption hole of component counter plate and substrate plate it is each
Substrate plate side adsorption hole is respectively properly to and the opposite relation of the two can be kept.In this way, carrying out absorption action
When, the opposite relation of all parts counter plate side adsorption hole of component counter plate and each substrate plate side adsorption hole of substrate plate
It will not be destroyed, appropriate absorption action can be carried out for a long time.
[3] in the flat-shaped part adsorbent equipment of the present invention, also have the feature that, the positioning region has:Base
Bottom plate side positioning hole is arranged to penetrate through the substrate plate;A plurality of component counter plate side positioning holes, is arranged on the portion
On part counter plate, when the component counter plate is located at the reference position or the sliding position, in the reference position and it is somebody's turn to do
On sliding position respectively with the substrate plate side positioning hole to;And pilot pin, can be inserted into the substrate plate side positioning hole and
With the substrate plate side positioning hole to the component counter plate side positioning hole.
It is had a structure in which by positioning region, the structure for enabling to positioning region is single.Also, for be used for into
Row positioning operation, as long as carry out only by pilot pin basement plate side positioning hole and with the substrate plate side positioning hole to portion
Practical positioning can be realized in shirtsleeve operation as part counter plate side positioning hole, single such operation of progress.
[4] in the flat-shaped part adsorbent equipment of the present invention, also have the feature that, the positioning region has:It drives
Dynamic device, for the component counter plate to be caused to carry out the slip;And control device, control the driving device, by by
The control device controls the driving device, and the component counter plate is located in the reference position or the slip position
It puts.
It is had a structure in which by positioning region, can automatically carry out the positioning of component counter plate.For example, operation
Member can be automatically set to predetermined sliding position or from predetermined by operating to select the select button of sliding position
Sliding position be set to reference position.In addition, as driving device, the driving dress with motor and driver can be enumerated
It puts.In addition, at positioning region as design, it is possible to use image processing techniques, based on to the tabular as absorption object
The image data that component is imaged and obtained identifies the size of the flat board member as absorption object, and based on this identification
As a result, it is controlled such that component counter plate automatically reaches predetermined position.
[5] the present invention flat-shaped part adsorbent equipment in, also have the feature that, exist be arranged on it is described adjacent
Benchmark adsorption hole between the additional adsorption hole area of n (n is more than 2 integer) is set along the glide direction
The addition adsorption hole of the n is being set the addition to n-th section by domain from the addition adsorption hole of first segment successively along glide direction
During adsorption hole, the sliding position can be set as the n stage from the first segment to described n-th section, by the n
The addition adsorption hole of the n is opposite with the substrate plate side adsorption hole of the substrate plate successively on each sliding position in stage
To so as to which the specific binding domain is formed different size on each sliding position in the n stage.
In this way, on component counter plate, beyond the benchmark binding domain formed when component counter plate is located at reference position,
The specific absorption that component counter plate is located at the n kinds being respectively formed during the sliding position in a plurality of stages (n stage) can be formed
Region.
[6] in the flat-shaped part adsorbent equipment of the present invention, also have the feature that, the benchmark adsorption hole and institute
Additional adsorption hole is stated on the component counter plate to be arranged in the benchmark binding domain and the specific binding domain
A part region in, with substrate plate side adsorption hole to the benchmark adsorption hole and the additional adsorption hole
Region beyond the number region more a part of than this is more.
In this way, in region by the part in the benchmark binding domain and the specific binding domain, with this
Region beyond the region of a part is compared, and sets the benchmark adsorption hole of the component counter plate of more numbers and additional adsorption hole,
So as in the region of a part in the benchmark binding domain and the specific binding domain, with this part of region with
Outer region is compared, and realizes more practical absorption.By setting as progress, for example, being very suitable for needing more practical
Absorption situation.
[7] in the flat-shaped part adsorbent equipment of the present invention, also have the feature that, the region of the part is
It is opposite with the end side of the one side of the flat-shaped part to region.
In this way, pass through a part region for it is opposite with the end side of the one side of flat-shaped part to region, example
Such as, it is suitable as when being removed from lining paper the film being strippingly adhered on lining paper for keeping the absorption of adsorbent thin film
Device.I.e., film attached from such lining paper on film remove when, it is important that effectively carry out the front end of film
It removes, it is therefore desirable to more effectively keep the absorption in the region to front end one side.So in this case, as long as
By the region of the part in benchmark binding domain or specific binding domain be arranged to the region of the front end of diaphragm to,
It just can effectively carry out the stripping of diaphragm.
[8] in the flat-shaped part adsorbent equipment of the present invention, also have the feature that, flat-shaped part is tabs
Part.
In this way, being sheet component by plate-shaped member, film, the flexibility (flexible) of various sizes can be adsorbed
Substrate etc..
[9] in the flat-shaped part adsorbent equipment of the present invention, also have the feature that, sheet component is thin to cover
Film.
In this way, it is cover film by sheet component, so as to be suitable as strippingly being adhered on lining paper
Film the adsorbent equipment of absorption cover film is kept when being removed from lining paper.
Description of the drawings
Fig. 1 is to show the figure for illustrating the flat-shaped part adsorbent equipment 10 that embodiment one is related to;
Fig. 2 is to show to illustrate the adsorption plate 200 for forming the flat-shaped part adsorbent equipment 10 that embodiment one is related to
Substrate plate 210 and component counter plate 220 ideograph;
Fig. 3 is formed when being and showing for illustrating that component counter plate 220 is located at reference position Pa on the component counter plate 220
Binding domain ideograph;
Fig. 4 is in the component counter plate 220 when showing for illustrating that component counter plate 220 is located at the first sliding position Pb
The ideograph of the binding domain of formation;
Fig. 5 is in the component counter plate 220 when showing for illustrating that component counter plate 220 is located at the second sliding position Pc
The ideograph of the binding domain of formation;
Fig. 6 is to show to illustrate the adsorption plate 200 for forming the flat-shaped part adsorbent equipment 20 that embodiment two is related to
Substrate plate 210 and component counter plate 220 ideograph;
Fig. 7 be display for illustrating that component counter plate 220 ' is located at reference position Pa when on the component counter plate 220 ' shape
Into binding domain ideograph;
Fig. 8 is in the component counter plate 220 ' when showing for illustrating that component counter plate 220 ' is located at the first sliding position Pb
The ideograph of the binding domain of upper formation;
Fig. 9 is in the component counter plate 220 ' when showing for illustrating that component counter plate 220 ' is located at the second sliding position Pc
The ideograph of the binding domain of upper formation;
Figure 10 is the figure for showing the mechanism for stripping portion 500 for illustrating film peeling apparatus;
Figure 11 is the figure for showing to illustrate the flat-shaped part adsorbent equipment 900 described in patent document one.
Specific embodiment
Embodiments of the present invention will be described below.
[embodiment one]
Fig. 1 is to show the figure for illustrating the flat-shaped part adsorbent equipment 10 that embodiment one is related to.Embodiment one
The flat-shaped part adsorbent equipment 10 that is related to as shown in Figure 1, form negative pressure chamber (not shown) in inside, including:It is opening on one side
The adsorbent equipment body 100 in face;It is arranged to cover the adsorption plate 200 in the opening face of adsorbent equipment body 100;And it is connected to
Adsorption tube (pipe) 300 between the negative pressure chamber of adsorbent equipment body 100 and negative pressure generation pump (pump) (not shown).
Adsorption plate 200 have be fixed on substrate plate 210 on adsorbent equipment body 100 and with as the flat of absorption object
The component counter plate 220 of plate-shaped member (not shown) opposite face.
Component counter plate 220 is stacked with substrate plate 210 with the state of contiguity in the plane, can be compared with substrate plate 210
On the x/y plane formed by x-axis and y-axis, slided within a predetermined range on the y-y ' directions (front and back) along y-axis
It is dynamic.Therefore, it is possible to be set in component counter plate 220 compared with the reference position (aftermentioned) of substrate plate 210 and from the benchmark
On position (being known as sliding position) after the slip of position.
In addition, in the flat-shaped part adsorbent equipment 10 being related in embodiment one, it is set in by component counter plate 220
Compared with substrate plate 210 reference position and from the reference position slide after sliding position on when, be by substrate plate 210 with
Adsorbent equipment body 100 is fixed, and component counter plate 220 is slided.This tablet being related to for aftermentioned embodiment two
Shape component adsorbent equipment is also same.
On substrate plate 210, multiple adsorption holes 211 (with reference to figure 2) are set with predetermined configuration, also, in component pair
On panel 220, multiple adsorption holes 221 are also by with predetermined configuration setting.It is but multiple on substrate plate 210 for being arranged on
Adsorption hole 211 and the multiple adsorption holes 221 being arranged on component counter plate 220, the configuration of respective adsorption hole some not
Together.It is described below for this point using Fig. 2.In addition, the adsorption hole 211 being arranged on substrate plate 210 is claimed sometimes
Make " substrate plate side adsorption hole 211 ", the adsorption hole 221 being arranged on component counter plate 220 is referred to as and " is adsorbed component counter plate side
Hole 221.
Back to the explanation to Fig. 1.Operator (operator) is formed on component counter plate 220 can be by component pair
The crawl section 225 that panel 220 captures.When component counter plate 220 is caused to slide, operator grasps crawl section 225 at one's side one
Side (front side) pulls out or (rear side) is pushed into inwardly.
Such operation is carried out by operator, enables to component counter plate 220 along in adsorbent equipment body 100
Guiding (guide) portion 110L, the guide part 110R of left and right are slided.Then, when causing component counter plate 220 on substrate plate 210
When being slided to the inside (rear side) of adsorbent equipment body 100, the component counter plate 220 is with being arranged on adsorbent equipment body 100
The wall portion 120 of rear end portion one side abut against, and cannot be further continued for sliding.In addition, by component counter plate 220 and it is arranged on absorption dress
The position of the component counter plate 220 when putting the contact of wall portion 120 of the rear end portion one side of body 100 is used as " reference position Pa ".
Also, for component counter plate 220, by from the above-mentioned reference position Pa component counter plates 220 forward
Square Slideslip can be set on the first sliding position Pb, second the two positions of sliding position Pc.I.e., component opposite
Plate 220 can be set at a plurality of stages comprising reference position Pa, and (position Pa, first are slided on the basis of in this case,
Dynamic position Pb and the second sliding position Pc) position on.Also, positioning region can be passed through in three phases respective positions
400 are positioned.
In addition, when although reference position Pa abuts against for the wall portion 120 of component counter plate 220 and adsorbent equipment body 100
The position of the component counter plate 220, but in aftermentioned each figure (such as Fig. 3 and Fig. 7 etc.), reference position Pa is shown as portion
The position of the front side end 226 of part counter plate 220.First sliding position Pb and the second sliding position Pc are also the same, aftermentioned
Each figure (such as Fig. 4, Fig. 5, Fig. 8 and Fig. 9 etc.) in, the first sliding position Pb and the second sliding position Pc are shown as component
The position of the front side end 226 of counter plate 220.
Positioning region 400 has:It is set to a substrate plate side positioning hole 210a (with reference to figure 2) of perforation substrate plate 210;
Being arranged on a plurality of (they being in such cases three) on component counter plate 220 component counter plate side positioning hole 220a,
220b、220c;And pluggable bottom plate side positioning hole 210a and with substrate plate side positioning hole 210a to component opposite
The pilot pin (pin) 410 in plate side positioning hole.
Substrate plate side positioning hole 210a (following short-hand notations are substrate location hole 210a) is arranged on close to substrate plate 210
Before side edge part left and right directions (along the direction of x-axis) on central portion.Also, component counter plate side positioning hole 220a,
220b, 220c are arranged on the central portion on the left and right directions (along the direction of x-axis) of the component counter plate 220 along y-axis.
220a, 220b, 220c are arranged to and three phases respective positions (reference position in component counter plate side positioning hole
Pa, the first sliding position Pb and the second sliding position Pc) it is corresponding.
Component counter plate side positioning hole 220a in these component counter plate side positioning holes 220a, 220b, 220c be used for into
Row component counter plate 220 is located at the positioning during Pa of reference position.Therefore, using component counter plate side positioning hole 220a as " base
Level is put with location hole 220a ".
In addition, the component counter plate side positioning hole 220b in these component counter plate side positioning holes 220a, 220b, 220c is used
Positioning when carrying out component counter plate 220 and being located at the first sliding position Pb.Therefore, by component counter plate side positioning hole 220b
As " the first sliding position location hole 220b ".
In addition, the component counter plate side positioning hole 220c in these component counter plate side positioning holes 220a, 220b, 220c is used
Positioning when carrying out component counter plate 220 and being located at the second sliding position Pc.Therefore, by component counter plate side positioning hole 220c
As " the second sliding position location hole 220c ".
When component counter plate 220 is arranged on reference position, reference position location hole 220a is with being arranged on substrate plate
Substrate location hole 210a on 210 to.In this case, by being inserted into pilot pin 410, the positioning from substrate location hole 210a
Pin 410 penetrates through the substrate location hole 210a of substrate plate 210 and is inserted into the reference position location hole of component counter plate 220
In.So as to which component counter plate 220 is positioned on the Pa of reference position.
When component counter plate 220 is arranged on the first sliding position Pb, the first sliding position location hole 220b is with setting
Put substrate location hole 210a on substrate plate 210 to.In this case, by being inserted into pilot pin from substrate location hole 210a
410, the substrate location hole 210a of the pilot pin 410 perforation substrate plate 210 and the first slip for being inserted into component counter plate 220
Position is in location hole 220b.So as to which component counter plate 220 is positioned on the first sliding position Pb.
When component counter plate 220 is arranged on the second sliding position Pc, the second sliding position location hole 220c is with setting
Put substrate location hole 210a on substrate plate 210 to.In this case, by being inserted into pilot pin from substrate location hole 210a
410, the substrate location hole 210a of the pilot pin 410 perforation substrate plate 210 and the second slip for being inserted into component counter plate 220
Position is in location hole 220c.So as to which component counter plate 220 is positioned on the second sliding position Pc.
Fig. 2 is to show to illustrate the adsorption plate 200 for forming the flat-shaped part adsorbent equipment 10 that embodiment one is related to
Substrate plate 210 and component counter plate 220 ideograph.Fig. 2 (a) is the top view of substrate plate 210, and Fig. 2 (b) is component opposite
The top view of plate 220.Also, Fig. 2 is due to being ideograph, is the figure after simplifying, quantity, the configuration of adsorption hole etc. and reality
Difference.
In substrate plate 210, as shown in Fig. 2 (a), substrate plate side adsorption hole 211 (also for substrate adsorb sometimes by short-hand notations
Hole 211) it is arranged to that there is predetermined width in the substrate plate 210.In the flat-shaped part absorption that embodiment one is related to
In device 10, it is set to along x-axis and y-axis with the configuration of matrix (matrix) shape in each predetermined interval d1 multiple.It will
The region A0 of the rectangle represented by the use of a pecked line in Fig. 2 (a) is as " the binding domain A0 " of substrate plate 210.In addition, substrate is adsorbed
Hole 211 along z-axis see when shape it is rounded.
In component counter plate 220, as shown in Fig. 2 (b), component counter plate side adsorption hole 221 is set to multiple.Component
Opposite adsorption hole 221 is similary with substrate adsorption hole 211, and shape when being seen along z-axis is rounded.
Component counter plate side adsorption hole 221 is made of multiple suction holes and additional adsorption hole.Multiple suction holes (are known as base
Quasi- adsorption hole 221a) it is arranged to when component counter plate 220 is located at reference position Pa compared with substrate plate 210, with each base
Bottom adsorption hole 211 to.Additional suction hole is arranged in benchmark adsorption hole 221a, in the fate of component counter plate 220
Domain (in Fig. 2 (b), is shown for the region C1 shown with dotted line near the center of component counter plate 220 and with two pecked lines
Region C2) in along between the adjacent benchmark adsorption hole of the glide direction (arrow y-y ' directions) of the component counter plate 220.
Also, in component counter plate 220, exist and adsorbed along the adjacent benchmark of glide direction (arrow y-y ' directions)
The region of the addition adsorption hole equipped with a plurality of (being appointed as two) is (for example, nearly equivalent to two in Fig. 2 (b) between hole
The region for the region C2 that pecked line represents).Using these two addition adsorption holes as additional adsorption hole 221b, additional adsorption hole
221c.In addition, additional adsorption hole 221b, additional adsorption hole 221c are also similary with substrate adsorption hole 211, shape when being seen along z-axis
Shape is rounded.
It, will be positioned at (the arrow of glide direction front side in these two addition adsorption hole 221b, additional adsorption hole 221c
Head y directions front side) addition adsorption hole as " first adds adsorption hole 221b ", this will be located at and first add adsorption hole 221b
Rear side addition adsorption hole as " second add adsorption hole 221c ".Also, in order to illustrate simplicity, benchmark is inhaled in figure
The substrate adsorption hole 211 of attached hole 221a and substrate plate 210 are equally represented with the circle of white hollow, and adsorption hole is added by first
221b is represented with the circle of grey, and the second addition adsorption hole 221c is represented with the circle of black.
In addition, " the first addition adsorption hole 221b " that is represented with grey is arranged to be arranged in and glide direction (y-y ' sides
To) on orthogonal imaginary line (along on the line of x-axis), " the second addition adsorption hole 221c " represented with black is also set to
It is arranged on the imaginary line orthogonal with glide direction (y-y ' directions) (along on the line of x-axis).Here, first adsorption hole is added
The imaginary line along x-axis of 221b arrangements is between the benchmark adsorption hole adjacent along glide direction, along glide direction
First segment imaginary line, the second imaginary line along x-axis for adding adsorption hole 221c arrangement is along glide direction
Between adjacent benchmark adsorption hole, along the imaginary line of the second segment of glide direction.
Therefore, each first adsorption hole 221b is added as along first between the adjacent benchmark adsorption hole of glide direction
The addition adsorption hole of section exists, and each second addition adsorption hole 221c is also the same, and the addition adsorption hole as second segment exists.
So as to when component counter plate 220 slides into each sliding position (the first sliding position Pb and the second sliding position
When Pc), add adsorption hole 221b as existing for the addition adsorption hole of first segment each first and inhaled as the additional of second segment
Each second addition adsorption hole 221c slides same slippage respectively existing for attached hole.Also, in each each sliding position
On (the first sliding position Pb and the second sliding position Pc), add and inhale as existing for the addition adsorption hole of first segment each first
Attached hole 221b and as existing for the addition adsorption hole of second segment each second add adsorption hole 221c successively with substrate plate 210
Substrate adsorption hole 211 to.
Specifically, when component counter plate 220 reaches the first sliding position Pb, the addition adsorption hole as first segment exists
Each first add the substrate adsorption hole 211 of adsorption hole 221b and substrate plate 210 respectively to when component counter plate 220 arrives
During up to the second sliding position Pc, adsorption hole 221c and substrate plate are added as existing for the addition adsorption hole of second segment each second
210 substrate adsorption hole 211 respectively to.
In addition, the region C1 being represented by dashed line in Fig. 2 (b) is with component counter plate 220 is located at the first sliding position Pb
When the binding domain Ab that is formed in component counter plate 220 (with reference to figure 4) corresponding region.With two pecked line tables in Fig. 2 (b)
The absorption that the region C2 shown is formed when being with component counter plate 220 is located at the second sliding position Pc in component counter plate 220
Region Ac corresponding regions (with reference to figure 5).These binding domains Ab, Ac are described below.
Benchmark adsorption hole 221a and each substrate adsorption hole 211 are similary, along x-axis and y-axis at predetermined intervals d1 by shape
Into.And it is arranged on two additional adsorption holes between benchmark adsorption hole 221a adjacent in glide direction (arrow y-y ' directions)
(the first addition adsorption hole 221b and the second addition adsorption hole 221c) is arranged on the cunning of the adjacent benchmark adsorption hole 221a
On position of the interval d1 deciles (being at this moment trisection) per spaced at intervals d2 on dynamic direction.
Also, 221 (the base of adsorption hole of the diameter and component counter plate 220 for the substrate adsorption hole 211 of substrate plate 210
Quasi- adsorption hole 221a, first add adsorption hole 221b and second add adsorption hole 221c) diameter for, component counter plate 220
Adsorption hole 221 (benchmark adsorption hole 221a, first addition adsorption hole 221b and second addition adsorption hole 221c) diameter compare base
The diameter smaller of the substrate adsorption hole 211 of bottom plate 210.
By by the diameter of the diameter of the substrate adsorption hole 211 of substrate plate 210 and the adsorption hole 221 of component counter plate 220
So setting, when cause the adsorption hole 221 of component counter plate 220 with the substrate adsorption hole 211 of substrate plate 210 it is opposite to so as into
Row absorption act when, even if the center of the adsorption hole 221 of component counter plate 220 compared with substrate adsorption hole 211 center how much
Some deviate, it is also possible that being not likely to produce absorption leakage.
For having the substrate plate 210 of this spline structure and component counter plate 220, when component counter plate 220 is compared with substrate
When plate 210 is located at reference position Pa and when component counter plate 220 is located at sliding position (the first slip compared with substrate plate 210
Position Pb and the second sliding position Pc) when, with the substrate adsorption hole 211 of substrate plate 210 to component counter plate 220 absorption
Hole 221 is different.
I.e., when component counter plate 220 is located at reference position Pa compared with substrate plate 210, inhaled with the substrate of substrate plate 210
Attached hole 211 to component counter plate 220 adsorption hole 221 on the basis of adsorption hole 221a.And when component counter plate 220 compared with
When substrate plate 210 is located at the first sliding position Pb, with the substrate adsorption hole 211 of substrate plate 210 to component counter plate 220
Adsorption hole 221 adds adsorption hole 221b for first.And slide position when component counter plate 220 is located at second compared with substrate plate 210
When putting Pc, with the substrate adsorption hole 211 of substrate plate 210 to the adsorption hole 221 of component counter plate 220 add and adsorb for second
Hole 221c.
In this way, when component counter plate 220 is located at reference position Pa compared with substrate plate 210, positioned at the first sliding position
During Pb, positioned at the second sliding position Pc when, with the substrate adsorption hole 211 of substrate plate 210 to component counter plate 220 absorption
Hole 221 is different.Therefore, when component counter plate 220 is located at reference position Pa, the first sliding position Pb, compared with substrate plate 210
The binding domain formed during two sliding position Pc on respective position is just respectively provided with different sizes.
Fig. 3 is formed when being and showing for illustrating that component counter plate 220 is located at reference position Pa on the component counter plate 220
Binding domain ideograph.
As shown in figure 3, when component counter plate 220 is located at reference position Pa compared with substrate plate 210, component counter plate
220 each benchmark adsorption hole 221a (being represented with the circle of white hollow) and each substrate adsorption hole 211 of substrate plate 210
(being represented by dashed line) to.
Therefore, each benchmark adsorption hole 221a of each substrate adsorption hole 211 of substrate plate 210 and component counter plate 220
For breakthrough status.So the binding domain formed on component counter plate 220 is the rectangle represented in Fig. 3 with a pecked line
Region Aa, the region Aa (being known as binding domain Aa) of the rectangle have the size identical with the binding domain A0 in substrate plate 210.
Further, since the suction that binding domain Aa is formed when being located at reference position Pa for component counter plate 220 on the component counter plate 220
Attached region, therefore also it is labeled as " benchmark binding domain Aa " sometimes.
In addition, in the case where component counter plate 220 is located at reference position Pa compared with substrate plate 210, reference position is used
The substrate location hole 210a of location hole 220a and substrate plate 210 to.In this case, by by pilot pin 410 (with reference to figure 1)
It is inserted into from the substrate location hole 210a of substrate plate 210, the substrate location hole 210a and quilt of the pilot pin 410 perforation substrate plate 210
The reference position of component counter plate 220 is inserted into in location hole 220a.
So as to which component counter plate 220 is correctly positioned on compared with substrate plate 210 on the Pa of reference position, benchmark absorption
Hole 221a (being represented with the circle of white hollow), inhaled with the benchmark adsorption hole 221a with the substrate of substrate plate 210 existing for position
Attached hole 211 is mutually correctly to and the opposite relation of the two can be kept.
Under such state, by being adsorbed on the basis of the component counter plate 220 of flat-shaped part adsorbent equipment 10 is configured
Region Aa with and the almost identical sizes of benchmark binding domain Aa or size it is slightly larger flat-shaped part (for example, cover film) it is right
Face, to adsorb the flat-shaped part, so as to not generate from adsorption plate 200 (substrate plate 210 and component counter plate 220)
The absorption leakage of each adsorption hole, which is effectively adsorbed.
Fig. 4 is in the component counter plate 220 when showing for illustrating that component counter plate 220 is located at the first sliding position Pb
The ideograph of the binding domain of formation.
As shown in figure 4, when component counter plate 220 is located at the first sliding position Pb compared with substrate plate 210, component is located at
Each benchmark adsorption hole 221a on counter plate 220 is located at from each substrate adsorption hole 211 being located on substrate plate 210 (with void
Line represents) on the position deviateed, and be used as existing for the addition adsorption hole of first segment first to add adsorption hole 221b and (use grey
Circle represents) exist in each substrate adsorption hole 211 of the substrate plate 210 and first addition adsorption hole 221b with position
Substrate adsorption hole 211 to.
Therefore, first adsorption hole 221b (being represented with the circle of grey) and the same positions of the first addition adsorption hole 221b are added
It is breakthrough status to put existing substrate adsorption hole 211.So binding domain at this time is the square represented in Fig. 4 with a pecked line
The region Ab of shape, the region Ab (being known as binding domain Ab) of the rectangle is than binding domain A0 (the component opposites in substrate plate 210
Benchmark binding domain Aa in plate 220) small region.In addition, in order to which binding domain Ab and benchmark binding domain Aa are distinguished,
Sometimes also it is labeled as " specific binding domain Ab ".
In addition, in the case where component counter plate 220 is located at the first sliding position Pb compared with substrate plate 210, first slides
Dynamic position with the substrate location hole 210a of location hole 220b and substrate plate 210 to.Under such state, by by pilot pin
410 (with reference to figures 1) are inserted into from the substrate location hole 210a of substrate plate 210, and the substrate of the pilot pin 410 perforation substrate plate 210 is determined
Position hole 210a is simultaneously inserted into the first sliding position location hole 220b of component counter plate 220.
So as to which component counter plate 220 is correctly positioned on compared with substrate plate 210 on the first sliding position Pb, each
First adds adsorption hole 221b (being represented with the circle of grey) and first addition adsorption hole 221b with substrate plate existing for position
210 substrate adsorption hole 211 is mutually correctly to and the opposite relation of the two can be kept.
Under such state, by the way that the component counter plate 220 of flat-shaped part adsorbent equipment 10 is configured to specific absorption
Region Ab with and the almost identical sizes of specific binding domain Ab or size it is slightly larger flat-shaped part (for example, cover film) it is right
Face, to adsorb the flat-shaped part, so as to not generate from adsorption plate 200 (substrate plate 210 and component counter plate 220)
The absorption leakage of each adsorption hole, which is effectively adsorbed.
Fig. 5 is in the component counter plate 220 when showing for illustrating that component counter plate 220 is located at the second sliding position Pc
The ideograph of the binding domain of formation.
As shown in figure 5, when component counter plate 220 is located at the second sliding position Pc compared with substrate plate 210, portion is arranged on
The addition adsorption holes of each benchmark adsorption hole 221a on part counter plate 220 and first 221b is located at from being arranged on substrate plate 210
The position deviateed of each substrate adsorption hole 211 (being represented by dashed line) on, and as existing for the addition adsorption hole of second segment the
Two add adsorption hole 221c (being represented with the circle of black) with it is in each substrate adsorption hole 211 of substrate plate 210 and this second
Additional adsorption hole 221c with substrate adsorption hole 211 existing for position to.
Therefore, second adsorption hole 221c (being represented with the circle of black) and the same positions of the second addition adsorption hole 221c are added
It is breakthrough status to put existing substrate adsorption hole 211.So binding domain at this time is the square represented in Fig. 5 with a pecked line
The region Ac of shape, the region Ac (being known as binding domain Ac) of the rectangle is than the specific binding domain Ab in component counter plate 220
(with reference to figure 4) smaller region.In addition, in order to which binding domain Ac is also distinguished with benchmark binding domain Aa, also mark sometimes
For " specific binding domain Ac ".
In addition, in the case where component counter plate 220 is located at the second sliding position Pc compared with substrate plate 210, second slides
Dynamic position with the substrate location hole 210a of location hole 220c and substrate plate 210 to.Under such state, by by pilot pin
410 (with reference to figures 1) are inserted into from the substrate location hole 210a of substrate plate 210, and the substrate of the pilot pin 410 perforation substrate plate 210 is determined
Position hole 210a is simultaneously inserted into the second sliding position location hole 220c of component counter plate 220.
So as to which component counter plate 220 is correctly positioned on compared with substrate plate 210 on the second sliding position Pc, each
Second adds adsorption hole 221c (being represented with the circle of black) and second addition adsorption hole 221c with substrate plate existing for position
210 substrate adsorption hole 211 is mutually correctly to and the opposite relation of the two can be kept.
Under such state, by the way that the component counter plate 220 of flat-shaped part adsorbent equipment 10 is configured to specific absorption
Region Ac with and the almost identical sizes of specific binding domain Ac or size it is slightly larger flat-shaped part (for example, cover film) it is right
Face, to adsorb the flat-shaped part, so as to not generate from adsorption plate 200 (substrate plate 210 and component counter plate 220)
The absorption leakage of each adsorption hole, which is effectively adsorbed.
As described above, a flat-shaped part adsorbent equipment 10 being related to according to embodiment so that adsorption plate 200 by
It substrate plate 210 and is formed compared with the 210 slidable component counter plate 220 of substrate plate, simply into being about to component counter plate
220 be set in compared with substrate plate 210 it is arbitrary in reference position Pa or the first sliding position Pb or the second sliding position Pc
It is a kind of, it becomes possible to form binding domain of different sizes.
I.e., in the case where component counter plate 220 is set in reference position Pa, the suction with substrate plate 210 can be formed
Binding domain (benchmark Probability Area Aa) identical attached region A0.And component counter plate 220 is being set in the first sliding position
In the case of Pb, the specific binding domain Ab smaller than the binding domain A0 of substrate plate 210 can be formed, component counter plate
In the case that 220 are set in the second sliding position Pc, specific binding domain Ac more smaller than specific binding domain Ab can be formed.
In this way, even if in comparison with being suitable for carrying out adsorption zone possessed by 10 script of flat-shaped part adsorbent equipment that mode one is related to
The flat-shaped part that the size of the flat-shaped part of the size in domain (being at this moment the binding domain A0 of substrate plate 210) is small is adsorbed
In the case of, it can not also generate absorption leakage and adsorb the flat-shaped part of the small size.
Also, in the flat-shaped part adsorbent equipment 10 being related in embodiment one, equipped with being set by component counter plate 220
When determining and so that it is slided into any one in reference position Pa, the first sliding position Pb, the second sliding position Pc, for carrying out
The positioning region 400 of the positioning of the component counter plate 220.
When component counter plate 220 is located at reference position Pa, due to substrate location hole 210a and the component pair of substrate plate 210
The reference position of panel 220 is with location hole 220a to therefore positioning region 400 can correctly position component counter plate 220
In reference position Pa.
Also, when component counter plate 220 is located at the first sliding position Pb, due to the substrate location hole of substrate plate 210
First sliding position of 210a and component counter plate 220 is with location hole 220b to therefore positioning region 400 can be by component opposite
Plate 220 is properly positioned the first sliding position Pb.
Also, when component counter plate 220 is located at the second sliding position Pc, due to the substrate location hole of substrate plate 210
Second sliding position of 210a and component counter plate 220 is with location hole 220c to therefore positioning region 400 can be by component opposite
Plate 220 is properly positioned the second sliding position Pc.
Therefore, in any one in forming binding domain Aa, Ab, Ac, can respective binding domain Aa, Ab,
Kept in Ac mutually to adsorption hole between opposite relation.In this way, when carrying out absorption action, component counter plate 220
The opposite relation of each adsorption hole 221 and each substrate adsorption hole 211 of substrate plate 210 will not be destroyed, can be for a long time
Ground carries out appropriate absorption action.
[embodiment two]
In the flat-shaped part adsorbent equipment 10 being related in above-mentioned embodiment one, the adsorption hole of component counter plate 220
221 (benchmark adsorption hole 221a, first add adsorption hole 221b and second and add adsorption hole 221c) shapes on component counter plate 220
Into binding domain Aa, Ab, Ac in, inhaled with each substrate of substrate plate 210 being present in each binding domain Aa, Ab, Ac
Attached hole 211 to ground respectively to being arranged on component counter plate 220.But the adsorption hole 221 of component counter plate 220 can also
It is widened compared with each substrate adsorption hole 211 for the substrate plate 210 being present in each binding domain Aa, Ab, Ac with interval
State be arranged on component counter plate 220.
In this case, can be in each binding domain Aa, Ab, Ac being formed on component counter plate 220,
Compared with the substrate plate being present in benchmark binding domain Aa in the binding domain (such as binding domain Aa on the basis of specifying)
The adsorption hole 221 of component counter plate 220 is widened interval setting, alternatively, it is also possible to only exist by 210 each substrate adsorption hole 211
In the region beyond a part of region (aftermentioned) in benchmark binding domain Aa, the adsorption hole 221 of component counter plate 220 is drawn
Large-spacing is set.
In the flat-shaped part adsorbent equipment 20 being related in embodiment two, for only in each binding domain Aa, Ab, Ac
In a part of region (aftermentioned) beyond region in, the adsorption hole 221 of component counter plate 220 is widened into spaced situation
It illustrates.
For the flat-shaped part adsorbent equipment 20 that embodiment two is related to, basic surface structure is related to embodiment one
And flat-shaped part adsorbent equipment 10 it is identical (with reference to figure 1).In the flat-shaped part adsorbent equipment 20 that embodiment two is related to
In, (benchmark adsorption hole 221a, first add adsorption hole 221b and second and add adsorption hole the adsorption hole 221 of component counter plate 220
Configuration mode 221c) is different from the flat-shaped part adsorbent equipment 10 that embodiment one is related to.In addition, for illustrating to implement
In each figure for the flat-shaped part adsorbent equipment 20 that mode two is related to, pair flat-shaped part being related to embodiment one absorption fills
It puts 10 identical inscapes and pays identical symbol.
Fig. 6 is to show to illustrate the adsorption plate 200 for forming the flat-shaped part adsorbent equipment 20 that embodiment two is related to
Substrate plate 210 and component counter plate 220 ideograph.Fig. 6 (a) is the top view of substrate plate 210, and Fig. 6 (b) is component opposite
The top view of plate 220.
Further, since substrate plate 210 and embodiment in the flat-shaped part adsorbent equipment 20 that embodiment two is related to
The structure of the substrate plate 210 of the one flat-shaped part adsorbent equipment 10 being related to is identical, therefore omits its description.And for reality
Apply the component counter plate 220 in the flat-shaped part adsorbent equipment 20 that mode two is related to, (the benchmark adsorption hole of adsorption hole 221
221a, the first addition adsorption hole 221b and the second addition adsorption hole 221c) the tablet that is related to of configuration mode and embodiment one
Shape component adsorbent equipment 10 is different.In addition, the component opposite in the flat-shaped part adsorbent equipment 20 that embodiment two is related to
Plate 220 is illustrated labeled as " component counter plate 220 ' ".
In addition, for the flat-shaped part adsorbent equipment 20 that embodiment two is related to, put down what embodiment one was related to
Component counter plate 220 in plate-shaped member adsorbent equipment 10 is as component counter plate 220 '.Therefore, as long as so that embodiment one
Component counter plate 220 in the flat-shaped part adsorbent equipment 10 being related to can be loaded and unloaded freely compared with substrate plate 210, only by component
Counter plate 220 replaces with component counter plate 220 ', it becomes possible to realize the flat-shaped part adsorbent equipment 20 that embodiment two is related to
Structure.
Component counter plate 220 ' is such as shown in Fig. 6 (b), the adsorption hole of the component counter plate 220 ' (benchmark adsorption hole 221a, the
One, which adds adsorption hole 221b and second, adds adsorption hole 221c) the region S0 of a part in the component counter plate 220 ' (for
The region of the left end side of Fig. 6 (b)) in, it is arranged to corresponding respectively with the substrate adsorption hole 211 of substrate plate 210, and at this
Point region S0 beyond region in, be arranged to be spaced compared with substrate plate 210 and widened.In addition, following will be " a part of
Region S0 " is known as " subregion S0 ".
Fig. 7 be display for illustrating that component counter plate 220 ' is located at reference position Pa when on the component counter plate 220 ' shape
Into binding domain ideograph.In this case, pilot pin 410, portion are inserted into location hole 220a by reference position
Part counter plate 220 ' is positioned in reference position Pa.
As shown in fig. 7, when component counter plate 220 ' is located at reference position Pa, it is arranged on each on component counter plate 220 '
A benchmark adsorption hole 221a with it is being arranged in each substrate adsorption hole 211 (being represented by dashed line) on substrate plate 210 and each
Benchmark adsorption hole 221a with substrate adsorption hole 211 existing for position to.
Therefore, each benchmark adsorption hole 221a and each benchmark adsorption hole 221a are the same as substrate adsorption hole 211 existing for position
For breakthrough status.So the binding domain being formed on component counter plate 220 ' is the rectangle represented in Fig. 7 with a pecked line
The flat-shaped part adsorbent equipment 10 that region Aa, the region Aa (benchmark binding domain Aa) of the rectangle are such as related in embodiment one
As middle explanation, there is the size identical with the binding domain A0 in substrate plate 210.
Here, in the region Sa (in Fig. 6 (b) of the part positioned at the right end side of benchmark binding domain Aa shown in Fig. 7
Region corresponding with subregion S0) in, the benchmark adsorption hole 221a of component counter plate 220 ' be arranged to and be present in this one
Each substrate adsorption hole 211 of substrate plate 210 in partial region Sa (hereinafter referred to as subregion Sa) corresponds to respectively.Cause
This, is when component counter plate 220 ' is located at reference position Pa, in the Sa of the subregion, each benchmark of component counter plate 220 '
Each substrate adsorption hole 211 of adsorption hole 221a and substrate plate 210 respectively to.
And in the region beyond the subregion Sa of benchmark binding domain Aa, each benchmark of component counter plate 220 ' is inhaled
Attached hole 221a, which is arranged to be spaced compared with the substrate adsorption hole 211 of substrate plate 210, to be widened.Therefore, when component counter plate
220 ' be located at reference position Pa when, in the region beyond the Sa of the subregion, the benchmark adsorption hole of component counter plate 220 '
221a only with it is in each substrate adsorption hole 211 of substrate plate 210, with the same positions of benchmark adsorption hole 221a of component counter plate 220 '
Put existing substrate adsorption hole 211 to.
Fig. 8 is in the component counter plate 220 ' when showing for illustrating that component counter plate 220 ' is located at the first sliding position Pb
The ideograph of the binding domain of upper formation.In this case, the first sliding position location hole is inserted by pilot pin 410
220b, component counter plate 220 ' are positioned in the first sliding position Pb.
As shown in figure 8, when component counter plate 220 ' is located at the first sliding position Pb, it is arranged on component counter plate 220 '
Each first addition adsorption hole 221b and be arranged in each substrate adsorption hole 211 (being represented by dashed line) on substrate plate 210
, with each benchmark adsorption hole 221a with existing for position first add adsorption hole 221b to.
Therefore, each first adsorption hole 221b and each first addition adsorption hole 221b are added with base existing for position
Bottom adsorption hole 211 is breakthrough status.So the binding domain being formed on component counter plate 220 ' is with a pecked line in Fig. 8
The region Ab of the rectangle of expression, the region Ab (specific binding domain Ab) of the rectangle is than benchmark binding domain Aa shown in Fig. 7
Small region.
Here, in region Sb (the hereinafter referred to as portions of the part positioned at the right end side of benchmark binding domain Ab shown in Fig. 8
Subregion Sb) in, the first addition adsorption hole 221b of component counter plate 220 ' is arranged to and is present in the Sb of the subregion
Each substrate adsorption hole 211 of substrate plate 210 correspond to respectively.Therefore, when component counter plate 220 ' is located at the first sliding position
During Pb, in the Sb of the subregion, each the first of component counter plate 220 ' adds each of adsorption hole 221b and substrate plate 210
Substrate adsorption hole 211 respectively to.
And in the region beyond the subregion Sb of benchmark binding domain Ab, the first of component counter plate 220 ' adds suction
Attached hole 221b, which is arranged to be spaced compared with the substrate adsorption hole 211 of substrate plate 210, to be widened.Therefore, when component counter plate
220 ' be located at the first sliding position Pb when, in the region beyond the Sa of the subregion, component counter plate 220 ' first add
Adsorption hole 221b is only added in each substrate adsorption hole 211 of substrate plate 210 and component counter plate 220 ' first and adsorbed
Hole 221b with substrate adsorption hole 211 existing for position to.
Fig. 9 is in the component counter plate 220 ' when showing for illustrating that component counter plate 220 ' is located at the second sliding position Pc
The ideograph of the binding domain of upper formation.In this case, the second sliding position location hole is inserted by pilot pin 410
220c, component counter plate 220 ' are positioned in the second sliding position Pc.
As shown in figure 9, when component counter plate 220 ' is located at the second sliding position Pc, it is arranged on component counter plate 220 '
Each second addition adsorption hole 221c and be arranged in each substrate adsorption hole 211 (being represented by dashed line) on substrate plate 210
, with each second add adsorption hole 221c with substrate adsorption hole 211 existing for position to.
Therefore, each second adsorption hole 221c and each second addition adsorption hole 221c are added with base existing for position
Bottom adsorption hole 211 is breakthrough status.So the binding domain being formed on component counter plate 220 ' is with a pecked line in Fig. 9
The region Ac of the rectangle of expression, the region Ac (specific binding domain Ac) of the rectangle is than specific binding domain Ab shown in Fig. 8
Smaller region.
Here, in region Sc (the hereinafter referred to as portions of the part positioned at the right end side of specific binding domain Ac shown in Fig. 9
Subregion Sc) in, the second addition adsorption hole 221c of component counter plate 220 ' is arranged to and is present in the Sc of the subregion
Each substrate adsorption hole 211 of substrate plate 210 correspond to respectively.Therefore, when component counter plate 220 ' is located at the second sliding position
During Pc, in the Sc of the subregion, the second of component counter plate 220 ' adds each substrate of adsorption hole 221c and substrate plate 210
Adsorption hole 211 respectively to.
And in the region beyond the subregion Sc of specific binding domain Ac, the second of component counter plate 220 ' adds suction
Attached hole 221c, which is arranged to be spaced compared with the substrate adsorption hole 211 of substrate plate 210, to be widened.Therefore, when component counter plate
220 ' be located at the second sliding position Pc when, in the region beyond the Sa of the subregion, component counter plate 220 ' second add
Adsorption hole 221c is only added in each substrate adsorption hole 211 of substrate plate 210 and component counter plate 220 ' second and adsorbed
Hole 221c with substrate adsorption hole 211 existing for position to.
In this way, in the flat-shaped part adsorbent equipment 20 being related in embodiment two, the benchmark absorption of component counter plate 220
Hole 221a, the first addition adsorption hole 221b and the second addition adsorption hole 221c are each in respective binding domain Aa, Ab, Ac
In region beyond subregion Sa, Sb, Sc, the whole with each substrate adsorption hole 211 of substrate plate 210 is not set to
It is corresponding, and be set to be spaced compared with each adsorption hole 211 in substrate plate 210 and be widened.
In other words, in various pieces region Sa, Sb, Sc, compared with the region beyond the subregion Sa, Sb, Sc, portion
The benchmark adsorption hole 221a of part counter plate 220, the first addition adsorption hole 221b and the second addition adsorption hole 221c are configured to
It is enough more to high-density with each substrate adsorption hole 211 of substrate plate 210 to.Setting in this way, binding domain Aa,
In various pieces region Sa, Sb, Sc in Ab, Ac, compared with the region beyond the various pieces region Sa, Sb, Sc, Neng Goushi
Now more practical absorption.
For such flat-shaped part adsorbent equipment (the flat-shaped part adsorbent equipment 20 that embodiment two is related to), example
Such as, the film of the cover film being strippingly adhered on lining paper etc. (referred to as attaching lining paper film) removed from lining paper
In " the mechanism for stripping portion of the stripping off device of film ", the adsorbent equipment that absorption when film is removed keeps film is suitable as.
Figure 10 is the figure for showing the mechanism for stripping portion 500 for illustrating film peeling apparatus.The stripping of the stripping off device of film
It is as shown in Figure 10 from mechanism part 500, including:Stripping portion 510 has and the film Wc strippingly adhered on lining paper Wm (is claimed
For subsidiary lining paper film Wc) in lining paper Wm the horizontal plane 511 that is supported of lower surface and with 511 θ at an acute angle of the horizontal plane
The inclined surface 512 of (such as θ=45 degree);Pedestal portion 520, stripping portion 510 are installed in front end side;Roller 530, change pass through stripping
The direct of travel for the lining paper Wm that portion 510 turns back;And flat-shaped part adsorbent equipment 20, as the top quilt in stripping portion 510
It is arranged along the adsorbent equipment that z-axis can move up and down on arrow z-z ' directions.In addition, for flat-shaped part adsorbent equipment
20, in order to enable component counter plate 220 and subsidiary lining paper film Wc opposites, the component counter plate 220 are arranged to downwards.
Also, on the front end (horizontal plane 511 and the connecting portion of inclined surface 512) of stripping portion 510, it is formed with lining paper folding
Return portion 513.In addition, than the lining paper return portion 513 closer to front (arrow x ' directions) one side of the direct of travel of lining paper Wm,
Due to be film Wc after lining paper Wm is peeled, only lining paper Wm is advancing.
Also, pedestal portion 520 can with stripping portion 510 simultaneously along x-axis on arrow x-x ' directions back and forth movement.Also,
Subsidiary lining paper film Wc is as shown in Figure 10 in some dotted line frames, along orthogonal with direct of travel (arrow x ' directions)
Pre-incision lines (precut line) L is pre-cut with retaining the state of lining paper Wm, diaphragm Wc1 as preliminary dimension,
Wc2 ... it is adhered on lining paper Wm.Also, each diaphragm Wc1, Wc2 are dimensioned to adsorb with flat-shaped part
The benchmark binding domain Aa of component counter plate 220 in device 20 corresponding sizes (with reference to figure 7).
In addition, Fig. 7 is due to being ideograph, the substrate adsorption hole 211 being arranged on substrate plate 210 and component is arranged on
(first, which adds adsorption hole 221b and second, adds adsorption hole 22 by benchmark adsorption hole 221a and additional adsorption hole on counter plate 220
Quantity, configuration and actual difference 1c).
The stripping of the film in the mechanism for stripping portion 500 with this spline structure carries out as follows.First so that will remove at this time
Diaphragm (being set as diaphragm Wc1) front end e1 reach stripping portion 510 return portion 513.Under this state, tablet
The component counter plate 220 of shape component adsorbent equipment 20 is to inhale the diaphragm Wc1 with the state that diaphragm Wc1 is in contact
It is attached.At this moment, each benchmark adsorption hole 221a of component counter plate 220 compared with substrate plate 210 substrate adsorption hole 211 such as Fig. 7
As shown it is opposite to.
In addition, the subregion Sa in the benchmark binding domain Aa of component counter plate 220 is the front end with diaphragm Wc1
E1 one sides it is opposite to state.I.e., subregion Sa on the length direction of subregion Sa along the front end of diaphragm Wc1
Pre-incision lines L in portion e1 is opposite with diaphragm Wc1 to (with reference in some dotted line frames in figure 10).
Under this state, the same of the tractive force to arrow x ' directions (left direction in Figure 10) is being applied to lining paper Wm
When so that pedestal portion 520 is mobile to arrow x directions (right direction in Figure 10).Thus, it is possible to by diaphragm Wc1 from lining paper Wm
On strip down.In peeling action as progress, it is important that effectively carry out the stripping of the front end e1 of diaphragm Wc1
From it is desirable for this purpose that being the absorption for more effectively keeping the region to front end e1 one sides.
In this case, component counter plate 220 is as shown in fig. 7, more by existing in the Sa of subregion
Adsorbable adsorption hole can effectively keep the absorption to front end e1, and this makes it possible to effectively into being about to diaphragm Wc1
The action removed from lining paper Wm.
In addition, as described above, Fig. 7 shows that the region beyond the Sa of subregion is only sparse due to being ideograph
Ground is there are adsorbable adsorption hole (benchmark adsorption hole 221a), and in fact, the region beyond the Sa of subregion also is provided with
The adsorption hole of sufficient attraction can be applied during stripping film piece Wc1 to diaphragm Wc1.
In the flat-shaped part adsorbent equipment 20 being related in embodiment two, to benchmark binding domain Aa as shown in Figure 7
The peeling action of progress is illustrated, but according to diaphragm Wc1, Wc2 ... size, for example, it is also possible to carry out Fig. 8 or
The peeling action shown in Fig. 9 carried out by specific binding domain Ab, Ac.
In addition, the present invention is not limited to above-mentioned embodiments, can implement without departing from the spirit and scope of the invention
Various modifications.Such as, it is possible to implement the deformation shown in following.
(1) in the respective embodiments described above, in order to simplify attached drawing and explanation, instantiate between adjacent benchmark adsorption hole
The situation of two additional adsorption holes (first, which adds adsorption hole 221b and second, adds adsorption hole 221c) is set, but is not limited only to
This, can also set the addition adsorption hole of n (n is more than 2 integer) between adjacent benchmark adsorption hole.In such case
Under, sliding position may be set to n stage.I.e., by n additional adsorption hole along glide direction successively from the addition of first segment
When adsorption hole is set to n-th section of addition adsorption hole, sliding position can be set as the n stage from first segment to n-th section, lead to
It crosses and causes the n additional adsorption hole substrate plate side adsorption hole with aforementioned substrates plate successively on each sliding position in n stage
It is opposite to binding domain is enabled to be formed as different sizes on each sliding position in n stage.
(2) in the respective embodiments described above, the region of additional adsorption hole is set to be not limited only to above-mentioned each embodiment institute
The region (for example, region C1, C2 in Fig. 2 (b)) shown can set in the region for setting additional adsorption hole as needed
It is fixed.In this way, the binding domain formed in component counter plate 220 is just not only three areas shown in above-mentioned each embodiment
Domain (benchmark binding domain Aa and specific binding domain Ab, Ac), but can be set as that there is different size of region, meanwhile,
The shape of binding domain is also not only rectangle, can also form variously-shaped binding domain.
In addition, like this in order to form various binding domains, it, can be by that will chase after in a component counter plate 220
Add the number of adsorption hole and the configuration of additional adsorption hole be set as it is various realize, but by preparing plural species in advance
The configuration of number and additional adsorption hole to additional adsorption hole has carried out the component counter plate 220 of various settings, and makes
It obtains component counter plate 220 can freely to load and unload compared with substrate plate 210, as long as so that as needed, component counter plate is replaced
220, it becomes possible to realize the setting of a greater variety of binding domains.In such manner, it is possible to the planar portion by more kinds of size and shapes
Part is as absorption object.
(3) in the respective embodiments described above, the positioning region 400 of component counter plate 220 is with being arranged on substrate plate 210
Substrate location hole 210a, component counter plate side positioning hole 220a, 220b, 220c being arranged on component counter plate 220 and fixed
The structure of position pin 410, but it is not limited only to this, or other structures.
For example, here illustration omitted or be set as positioning region 400 have be used for so that component counter plate 220 is slided
Dynamic driving device and the control device for controlling the driving device, are driven driving device by using control device, from
And component counter plate 220 is located in reference position or foregoing sliding position.In addition, as driving device, for example, can enumerate
Driving device with motor (motor) and driver (actuator).
It is had a structure in which by positioning region 400, can automatically carry out the positioning of component counter plate 220.Example
Such as, operator is by operating to select the select button of sliding position, can be automatically set to predetermined sliding position or
Reference position is set to from predetermined sliding position.
Also, (have in such positioning region 400 for so that driving device and the control of the slip of component counter plate 220
The positioning region of the control device of the driving device) in, can to as absorption object flat-shaped part image, based on by
This size of image data obtained identification as the flat board member of absorption object, and based on this recognition result, control driving
Device is so as to automatically so that component counter plate reaches predetermined position.
(4) in the respective embodiments described above so that the glide direction of component counter plate 220 is past for that can make to a direction
Movement is returned, but can also be set as at grade respectively to orthogonal both direction (along the direction of y-axis and the side of x-axis
To) make back and forth movement.In this case, as long as also being set on the direction along x-axis between adjacent benchmark adsorption hole
More than one additional adsorption hole.By setting as progress, binding domain can be set as it is more kinds of, and can
Using the flat-shaped part of more kinds of size and shapes as absorption object.Furthermore it is also possible to so that component counter plate 220 is in base
The state being in contact on bottom plate 210 with the surface with the substrate plate 210 rotates.
(5) in the respective embodiments described above, instantiate to work as and component counter plate 220 is set in base compared with substrate plate 210
Level put Pa and from the reference position Pa slip after each sliding position when, substrate plate 210 and adsorbent equipment body 100 are consolidated
It is fixed so that the situation that component counter plate 220 slides, but can also in contrast fix the position of component counter plate 220, and
So that substrate plate 210 slides simultaneously with adsorbent equipment body 100.
(6) in the respective embodiments described above, instantiate the substrate adsorption hole 211 of substrate plate 210 in the direction along x-axis and
Along on the direction of y-axis, be the situation of rectangular configuration, but be not limited only to this, do not have to be set as it is rectangular must
Will, it can also be set as arbitrarily configuring in substrate plate 210.Also, in substrate plate 210, for example, it can be a certain portions
The region divided sets highdensity substrate adsorption hole compared with the region beyond a part of region.
(7) in the respective embodiments described above, adsorption hole (benchmark adsorption hole 221a, first of component counter plate 220 are illustrated
Additional adsorption hole 221b and second adds adsorption hole 221c) diameter than the substrate adsorption hole 211 of substrate plate 210 small feelings
Condition, but can also be set as identical with the diameter of the substrate adsorption hole 211 of substrate plate 210.
(8) in the respective embodiments described above, by the substrate adsorption hole 211 of substrate plate 210 and the benchmark of component counter plate 220
Adsorption hole 221a, first add adsorption hole 221b and second add shapes of the adsorption hole 221c when being seen along z-axis set in order to
Circle, but be not limited only to be circular, for example, it is also possible to be set as that quadrangle, triangle, star etc. are variously-shaped.Also, also may be used
The benchmark adsorption hole 221a of the substrate adsorption hole 211 of substrate plate 210 and component counter plate 220, first are added adsorption hole
The additions of 221b and second adsorption hole 221c is set as different shapes, further, it is also possible that the substrate absorption of substrate plate 210
Hole, the benchmark adsorption hole 221a of component counter plate 220, first add adsorption hole 221b and second and add adsorption hole 221c difference
For different shapes.
(9) in the respective embodiments described above, illustrate and flat-shaped part is set as film, particularly the feelings of cover film
Condition, but this is not limited only to, as long as the component that can be adsorbed by the flat-shaped part adsorbent equipment of the present invention, example
Such as or circuit substrate, metallic plate.
(10) the use example as flat-shaped part adsorbent equipment of the invention instantiates the stripping off device (ginseng of film
Examine Figure 10), but this is not limited only to, flat-shaped part of the invention absorption dress can be widely used for flat-shaped part
The device (for example, exposure device) of certain process is carried out in the state of being adsorbed.
Symbol description
10th, 20 ... flat-shaped part adsorbent equipments;100 ... adsorbent equipment bodies;200 ... adsorption plates;210 ... substrate plates;
210a ... substrate plate side positionings hole (substrate location hole);211 ... substrate plate side adsorption holes (substrate adsorption hole);220 ... components pair
Panel;220a, 220b, 220c ... component counter plate side positioning hole;221 ... component counter plate side adsorption holes;221a ... benchmark are inhaled
Attached hole;221b ... first adds adsorption hole (the addition adsorption hole of first segment);221c ... second adds adsorption hole, and (second segment chases after
Add adsorption hole);225 ... crawl sections;400 ... positioning regions;410 ... pilot pins;The mechanism for stripping of the stripping off device of 500 ... films
Portion;510 ... stripping portions;A0 ... is formed in the binding domain on substrate plate 210;Aa ... is formed in the suction on component counter plate 220
Attached region (benchmark Probability Area);Ab, Ac ... are formed in the binding domain (specific binding domain) on component counter plate 220;
Pa ... reference positions;The first sliding positions of Pb ...;The second sliding positions of Pc ...;S0, Sa, Sb, Sc ... a part of region (part
Region);Wc ... films (subsidiary lining paper film);Wm ... lining papers.
Claims (15)
1. a kind of flat-shaped part adsorbent equipment of negative-pressure adsorption flat-shaped part, which is characterized in that have:
Substrate plate is installed on the adsorbent equipment body to form negative pressure chamber;And
Component counter plate, and the flat-shaped part opposite, and be stacked in the plane with the state of contiguity with the substrate plate, it can
On sliding position after being set at reference position compared with substrate plate and being slided from the reference position,
Wherein, on the substrate plate, multiple adsorption holes are set as substrate plate side adsorption hole, in the component counter plate
On, multiple adsorption holes are set as component counter plate side adsorption hole,
Substrate plate side adsorption hole is arranged on predetermined configuration on the substrate plate,
The component counter plate side adsorption hole is made of a plurality of benchmark adsorption holes and additional adsorption hole,
A plurality of benchmark adsorption hole is arranged to when the component counter plate is located at the reference position, with the base
The predetermined adsorption hole in whole adsorption holes or substrate plate side adsorption hole in the adsorption hole of bottom plate side it is opposite to,
The additional adsorption hole is arranged on the slip along the component counter plate in the presumptive area of the component counter plate
Between the adjacent benchmark adsorption hole in direction,
When the component counter plate is located at the reference position, by the benchmark adsorption hole and be arranged on and the benchmark inhale
Attached hole is opposite to so as to form benchmark adsorption zone on the component counter plate with the substrate plate side adsorption hole on position
Domain,
When the component counter plate is located at the sliding position, by the benchmark adsorption hole and be arranged on and the benchmark inhale
Attached hole is opposite to having and the base so as to be formed on the component counter plate with the substrate plate side adsorption hole on position
The quasi- different size of specific binding domain of binding domain,
N is set along the glide direction in the presence of the additional adsorption hole being arranged between the adjacent benchmark adsorption hole
The region of a (n be more than 2 integer), by the addition adsorption hole of the n along glide direction successively from the addition of first segment
When adsorption hole is set to n-th section of addition adsorption hole, the sliding position can be set as from the first segment to described n-th section
N stage, by the addition adsorption holes of the n on each sliding position in the n stage successively with the substrate
The substrate plate side adsorption hole of plate is opposite to so as to the specific binding domain quilt on each sliding position in the n stage
Be formed as different size.
2. flat-shaped part adsorbent equipment according to claim 1, which is characterized in that also have:
Positioning region, respectively when the component counter plate is located at the reference position and when the component counter plate is located at institute
When stating sliding position, the component counter plate is located on the reference position or the sliding position.
3. flat-shaped part adsorbent equipment according to claim 2, it is characterised in that:
Wherein, the positioning region has:
Substrate plate side positioning hole is arranged to penetrate through the substrate plate;
A plurality of component counter plate side positioning holes, is arranged on the component counter plate, when the component counter plate is located at
When the reference position or the sliding position, on the reference position and the sliding position respectively with the substrate plate side positioning
Hole to;And
Pilot pin, can be inserted into the substrate plate side positioning hole and with the substrate plate side positioning hole to the component counter plate side
Location hole.
4. flat-shaped part adsorbent equipment according to claim 2, it is characterised in that:
Wherein, the positioning region has:
Driving device, for the component counter plate to be caused to carry out the slip;And
Control device controls the driving device,
By controlling the driving device by the control device, by the component counter plate be located in the reference position or
On the sliding position.
5. flat-shaped part adsorbent equipment according to claim 1, it is characterised in that:
Wherein, the benchmark adsorption hole and the additional adsorption hole are arranged to inhale in the benchmark on the component counter plate
In attached region and the region of the part in the specific binding domain, with substrate plate side adsorption hole to the benchmark
Region beyond the number of adsorption hole and the additional adsorption hole region more a part of than this is more.
6. flat-shaped part adsorbent equipment according to claim 5, it is characterised in that:
Wherein, the region of the part for it is opposite with the end side of the one side of the flat-shaped part to region.
7. flat-shaped part adsorbent equipment according to claim 1, it is characterised in that:
Wherein, the flat-shaped part is sheet component.
8. flat-shaped part adsorbent equipment according to claim 7, it is characterised in that:
Wherein, the sheet component is cover film.
9. a kind of flat-shaped part adsorbent equipment of negative-pressure adsorption flat-shaped part, which is characterized in that have:
Substrate plate is installed on the adsorbent equipment body to form negative pressure chamber;And
Component counter plate, and the flat-shaped part opposite, and be stacked in the plane with the state of contiguity with the substrate plate, it can
On sliding position after being set at reference position compared with substrate plate and being slided from the reference position,
Wherein, on the substrate plate, multiple adsorption holes are set as substrate plate side adsorption hole, in the component counter plate
On, multiple adsorption holes are set as component counter plate side adsorption hole,
Substrate plate side adsorption hole is arranged on predetermined configuration on the substrate plate,
The component counter plate side adsorption hole is made of a plurality of benchmark adsorption holes and additional adsorption hole,
A plurality of benchmark adsorption hole is arranged to when the component counter plate is located at the reference position, with the base
The predetermined adsorption hole in whole adsorption holes or substrate plate side adsorption hole in the adsorption hole of bottom plate side it is opposite to,
The additional adsorption hole is arranged on the slip along the component counter plate in the presumptive area of the component counter plate
Between the adjacent benchmark adsorption hole in direction,
When the component counter plate is located at the reference position, by the benchmark adsorption hole and be arranged on and the benchmark inhale
Attached hole is opposite to so as to form benchmark adsorption zone on the component counter plate with the substrate plate side adsorption hole on position
Domain,
When the component counter plate is located at the sliding position, by the benchmark adsorption hole and be arranged on and the benchmark inhale
Attached hole is opposite to having and the base so as to be formed on the component counter plate with the substrate plate side adsorption hole on position
The quasi- different size of specific binding domain of binding domain,
The benchmark adsorption hole and the additional adsorption hole are arranged on the component counter plate in the benchmark adsorption zone
In domain and the region of the part in the specific binding domain, with substrate plate side adsorption hole to the benchmark adsorb
Region beyond the number of hole and the additional adsorption hole region more a part of than this is more.
10. flat-shaped part adsorbent equipment according to claim 9, which is characterized in that also have:
Positioning region, respectively when the component counter plate is located at the reference position and when the component counter plate is located at institute
When stating sliding position, the component counter plate is located on the reference position or the sliding position.
11. flat-shaped part adsorbent equipment according to claim 10, it is characterised in that:
Wherein, the positioning region has:
Substrate plate side positioning hole is arranged to penetrate through the substrate plate;
A plurality of component counter plate side positioning holes, is arranged on the component counter plate, when the component counter plate is located at
When the reference position or the sliding position, on the reference position and the sliding position respectively with the substrate plate side positioning
Hole to;And
Pilot pin, can be inserted into the substrate plate side positioning hole and with the substrate plate side positioning hole to the component counter plate side
Location hole.
12. flat-shaped part adsorbent equipment according to claim 10, it is characterised in that:
Wherein, the positioning region has:
Driving device, for the component counter plate to be caused to carry out the slip;And
Control device controls the driving device,
By controlling the driving device by the control device, by the component counter plate be located in the reference position or
On the sliding position.
13. flat-shaped part adsorbent equipment according to claim 9, it is characterised in that:
Wherein, the region of the part for it is opposite with the end side of the one side of the flat-shaped part to region.
14. flat-shaped part adsorbent equipment according to claim 9, it is characterised in that:
Wherein, the flat-shaped part is sheet component.
15. flat-shaped part adsorbent equipment according to claim 14, it is characterised in that:
Wherein, the sheet component is cover film.
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JP2014201448A JP5732583B1 (en) | 2014-09-30 | 2014-09-30 | Flat member suction device |
JP2014-201448 | 2014-09-30 |
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CN105472958B true CN105472958B (en) | 2018-05-22 |
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CN105722328A (en) * | 2016-04-06 | 2016-06-29 | 捷讯精密橡胶(苏州)有限公司 | Automatic laminating machine for improving mylar film and rubber dome process yield |
JP2019016700A (en) * | 2017-07-07 | 2019-01-31 | Towa株式会社 | Holding member, method for manufacturing holding member, holding device, conveyance device, and device for manufacturing electronic component |
CN113453534B (en) * | 2021-07-01 | 2022-01-28 | 哈尔滨学院 | Mounting equipment for flexible electronic device |
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JP2004322254A (en) * | 2003-04-24 | 2004-11-18 | Fuji Photo Film Co Ltd | Base board sucking-fixing device |
JP2007201275A (en) * | 2006-01-27 | 2007-08-09 | Fuji Mach Mfg Co Ltd | Substrate sucking/transferring device |
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KR20160038766A (en) | 2016-04-07 |
CN105472958A (en) | 2016-04-06 |
KR101653930B1 (en) | 2016-09-02 |
JP2016068217A (en) | 2016-05-09 |
JP5732583B1 (en) | 2015-06-10 |
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