CN105451448A - Manufacturing method for circuit board, circuit board and drill pin - Google Patents
Manufacturing method for circuit board, circuit board and drill pin Download PDFInfo
- Publication number
- CN105451448A CN105451448A CN201510854171.5A CN201510854171A CN105451448A CN 105451448 A CN105451448 A CN 105451448A CN 201510854171 A CN201510854171 A CN 201510854171A CN 105451448 A CN105451448 A CN 105451448A
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- China
- Prior art keywords
- hydrophobic membrane
- hole
- drill point
- wall section
- manufacture method
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
Abstract
The invention relates to a manufacturing method for a circuit board, the circuit board and a drill pin. The manufacturing method specifically comprises the steps of drilling a through hole in a circuit base board by the drill pin coated with a hydrophobic membrane, wherein the inner wall of the through hole comprises a first inner wall part and a second inner wall part that are mutually connected; a hydrophobic membrane residual layer is formed by partial residue of the hydrophobic membrane in the first inner wall part; and performing metallic plating to form a conducive layer on the second inner wall part of the through hole. The diameter of the drill pin is not required to be +0.2mm larger than the diameter of the through hole in the above process, so that the occupied space of the drill pin the manufacturing process is saved, and intensive design for the circuit board can be further improved; and in addition, the service life of the drill pin can be ensured, and the production cost can be lowered.
Description
Technical field
The present invention relates to wiring board techniques field, be specifically related to a kind of manufacture method of wiring board, wiring board and drill point.
Background technology
At pcb board (PrintedCircuitBoard, printed substrate) manufacture process in, need to arrange through hole to realize the connection between each internal layer circuit, and through hole also needs through process such as heavy copper, plating, form conductive layer in through-holes, thus realize the connection between each sandwich circuit.But, the through hole of some pcb boards only needs part conducting, and the through hole after heavy copper, electroplating processes is whole conductings, so just there will be through hole end portion connectivity problem, thus turning back of signal can be caused, cause the phenomenons such as the reflection of Signal transmissions, scattering, delay, bring " distortion " problem to signal.
In order to avoid the generation of above-mentioned phenomenon, just need to carry out back drill process to through hole, so that the hole wall copper control deep drilling of through hole non-signal layer is gone.Tradition back drill technique generally includes following steps: first, utilize drill point to get out through hole 2 ' in circuit base plate 1 '; Then, metal level is plated on the inner walls of the via; Secondly, carry out back drill by adopting the diameter drill point larger compared with through hole and obtain back drill hole 3 ', its objective is and the metal level on the through-hole wall of non-signal layer is removed, and using residual metallic layer as conductive layer 4 ', the structure of the wiring board finally obtained as shown in Figure 1.
But, there is following defect in traditional back drill technique: (1) back drill drill point diameter is larger than through hole drill point diameter, generally back drill pin diameter >=through hole pin diameter+0.2mm, namely back drill technique can take the space of at least 0.2mm, thus can affect the intensive design of circuit; (2) first electroplate aft-loaded airfoil because back drill technique adopts, and plating obtains the hardness of hole wall metal and the large of Toughness Ratio drill point, thus the life-span minimizing of drill point and the functional lability of rig can be caused, finally affect the quality qualification rate of back drill.
Summary of the invention
Therefore, the technical problem to be solved in the present invention is to overcome the defect that back drill technique in prior art can affect the life-span of drill point and the quality qualification rate of back drill.
In order to solve the problem, the invention provides a kind of manufacture method of wiring board, comprising the following steps:
Utilize the drill point being coated with hydrophobic membrane to get out through hole in circuit base plate, the inwall of described through hole comprises interconnective first inner wall section and the second inner wall section;
Described hydrophobic membrane is at described first inner wall section residual formation hydrophobic membrane residual layer;
Carry out plating process, to form conductive layer in the second inner wall section of described through hole.
As preferably, the material of described hydrophobic membrane is grease, polytetrafluoroethylene, polypropylene or Kynoar.
As preferably, the thickness of described hydrophobic membrane is 10-50 μm.
As preferably, described hydrophobic membrane is coated on the outer wall of most advanced and sophisticated top of described drill point, height between the end face of described hydrophobic membrane near described drill point tip and described drill point tip is greater than the height of described second inner wall section, and the height of described hydrophobic membrane is greater than the height of described first inner wall section.
As preferably, also comprise: utilizing before the drill point being coated with hydrophobic membrane gets out the step of through hole in circuit base plate, described drill point forms hydrophobic membrane.
As preferably, the described concrete steps forming hydrophobic membrane on described drill point comprise:
As preferably, hydrophobic material is applied or is immersed on the outer wall of described drill point;
As preferably, described hydrophobic material is solidificated on the outer wall of described drill point, to form described hydrophobic membrane.
As preferably, described in carry out plating process, comprise with the concrete steps forming conductive layer in the second inner wall section of described through hole:
Carry out first time plating process, to form initial metal layer in the second inner wall section of described through hole;
Carry out the process of second time plating, to form base metal layer in described initial metal layer, described initial metal layer and described base metal layer form described conductive layer.
As preferably, the thickness of described initial metal layer is 1-10 μm, and the thickness of described base metal layer is 30-50 μm.
As preferably, also comprise: carry out plating process described, to form the step of conductive layer in the second inner wall section of described through hole after, remove described hydrophobic membrane residual layer.
The invention provides a kind of wiring board, adopt the manufacture method described in above-mentioned any one to obtain.
The invention provides a kind of wiring board, comprise circuit base plate, described circuit base plate is provided with through hole, the side inwall of described through hole is provided with conductive layer.
The invention provides a kind of drill point, comprise drill point body, described drill point body has tip, also comprise be coated on described drill point body away from the hydrophobic membrane on the outer wall at tip.
As preferably, the material of described hydrophobic membrane is grease, polytetrafluoroethylene, polypropylene or Kynoar.
As preferably, the thickness of described hydrophobic membrane is 10-50 μm.
The technical scheme of the embodiment of the present invention, tool has the following advantages:
The manufacture method of the wiring board that the embodiment of the present invention provides, the drill point being coated with hydrophobic membrane is first utilized to get out through hole in circuit base plate, the inwall of described through hole comprises interconnective first inner wall section and the second inner wall section, produce friction due to the hydrophobic membrane on drill point in boring procedure with between the first inner wall section of through hole, thus form hydrophobic membrane residual layer in the first inner wall section; Then plating process is carried out, hydrophobic grouping (such as alkyl, ester group, nitro etc.) in this process in hydrophobic membrane residual layer produces repulsive force to liquid medicine, thus stop liquid medicine to be combined with the first inner wall section covered by hydrophobic membrane residual layer, the first inner wall section is made to plate metal, and in the second inner wall section, plate metal, form conductive layer.
Said process, do not need as the back drill technique of the prior art first genus of overgild on the inner walls of the via just like that, naturally do not need to use drill point to remove metal throughhole portions inwall being electroplated formation, thus, drill point is when designing, do not need the diameter design of drill point to be greater than through-hole diameter+0.2mm, save taking up room of drill point in manufacturing process, and then increase the intensive designed capacity of wiring board.
Further, owing to not needing to use drill point to remove metal throughhole portions inwall being electroplated formation, the useful life of drill point can be ensured, and reduce production cost.
Accompanying drawing explanation
In order to be illustrated more clearly in the specific embodiment of the invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation utilizing existing method to make the wiring board obtained;
The structural representation of the drill point adopted in the manufacture method of the wiring board that Fig. 2 provides for a kind of embodiment of the present invention;
Fig. 3 is for utilizing the view of the holes drilled through in circuit base plate of the drill point shown in Fig. 2;
Fig. 4 for taking out the structural representation of the circuit base plate after drill point from the structure shown in Fig. 3;
Fig. 5 is for carrying out the structural representation of circuit base plate after plating process to the circuit base plate shown in Fig. 4;
The structural representation of the wiring board that the manufacture method that Fig. 6 is the wiring board utilizing a kind of embodiment of the present invention and provide prepares.
Description of reference numerals:
1 '-circuit base plate; 2 '-through hole; 3 '-back drill hole;
4 '-conductive layer; 1-drill point; 2-hydrophobic membrane;
3-through hole; 4-hydrophobic membrane residual layer; 5-conductive layer;
6-circuit base plate.
Embodiment
Be clearly and completely described technical scheme of the present invention below in conjunction with accompanying drawing, obviously, described embodiment is the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.In addition, if below in the described different execution mode of the present invention involved technical characteristic do not form conflict each other and just can be combined with each other.
Embodiment 1
Fig. 2 to Fig. 6 shows the detailed process of the manufacture method of the wiring board that a kind of embodiment of the present invention provides.The manufacture method of wiring board is elaborated below in conjunction with Fig. 2 to Fig. 6.
A manufacture method for wiring board, specifically comprises:
S1: the outer wall position above the tip of drill point 1 forms hydrophobic membrane 2, as shown in Figure 2;
S2: utilize the drill point 1 being coated with hydrophobic membrane 2 holes drilled through in circuit base plate 6 shown in Fig. 2, as shown in Figure 3, the inwall of the described through hole 3 got out comprises interconnective first inner wall section and the second inner wall section, described hydrophobic membrane 2 remains in described first inner wall section and forms hydrophobic membrane residual layer 4, as shown in Figure 4; Hydrophobic membrane 2 refers to the film material containing hydrophobic grouping, and therefore hydrophobic membrane 2 has good hydrophobic function;
S3: carry out plating process, to form conductive layer 5 in the second inner wall section of described through hole 3, as shown in Figure 5;
S4: remove hydrophobic membrane residual layer 4 and form wiring board, as shown in Figure 6.
In above-mentioned manufacture method, owing to producing friction between the hydrophobic membrane 2 on drill point in boring procedure 1 and the first inner wall section of through hole 3, thus form hydrophobic membrane residual layer 4 in the first inner wall section; Then plating process is carried out, hydrophobic grouping (such as alkyl, ester group, nitro etc.) in this process in hydrophobic membrane residual layer 4 produces repulsive force to liquid medicine, thus stop liquid medicine to be combined with the first inner wall section covered by hydrophobic membrane residual layer 4, the first inner wall section is made to plate metal, and in the second inner wall section, plate metal, form conductive layer 5.
Said process, do not need as the back drill technique of the prior art first genus of overgild on the inner walls of the via just like that, naturally do not need to use drill point to remove metal through hole 3 internal partial wall being electroplated formation, thus, drill point is when designing, do not need the diameter design of drill point to be greater than through-hole diameter+0.2mm, save taking up room of drill point in manufacturing process, and then increase the intensive designed capacity of wiring board.
Said process, owing to not needing to use drill point to remove metal through hole 3 internal partial wall being electroplated formation, can ensure the useful life of drill point, and reduce production cost.
As preferred embodiment, in S1 step, the material of described hydrophobic membrane 2 is the conventional hydrophobic material in this area, such as: any one in grease, polytetrafluoroethylene, polypropylene or Kynoar.
As preferred embodiment, in S1 step, the formation method of hydrophobic membrane 2 specifically comprises: first apply on the outer wall of drill point 1 or any one hydrophobic material above-mentioned on dipping, be then cured and dry thus form hydrophobic membrane 2, its concrete technological parameter can with reference to prior art; Described hydrophobic membrane 2 can also adopt other known generation type in prior art, does not repeat them here.
Certainly, above-mentioned S1 step can be omitted, now, only need to adopt the drill point 1 being coated with hydrophobic membrane 2 of finished product to carry out processing.
In order to obtain the hydrophobic membrane residual layer 4 of adequate thickness, preferably, the thickness of the described hydrophobic membrane 2 formed in S1 step, or the thickness of the hydrophobic membrane 2 of the drill point 1 used in S2 step when omitting S1 step is 10-50 μm, such as: 10 μm, 20 μm, 50 μm etc., the thickness of described hydrophobic membrane 2 can be selected according to the actual requirements in above-mentioned scope.
As preferred embodiment, adopt drill point 1 diameter to be 0.1-0.8mm, such as: 0.1mm, 0.5mm, 0.8mm etc., described drill point 1 diameter can be selected according to the size of follow-up formation through hole.
As preferred embodiment, the described hydrophobic membrane 2 formed in S1 step, or the hydrophobic membrane 2 of the drill point 1 used in S2 step when omitting S1 step, be coated on the outer wall of most advanced and sophisticated top of described drill point 1, the height of described hydrophobic membrane 2 is greater than the height of the first inner wall section of described through hole 3, described hydrophobic membrane 2 is greater than the height of the second inner wall section of described through hole 3 near the height between the end face and described drill point 1 tip at described drill point 1 tip, thus is convenient to the hydrophobic membrane residual layer 4 obtaining adequate thickness in subsequent step.
As preferred embodiment, described plating process, comprises to form conductive layer 5 concrete steps in the second inner wall section of described through hole 3: carry out first time plating process, to form initial metal layer on the exposed inwall of described through hole 3; Carry out the process of second time plating, to form base metal layer in described initial metal layer, described initial metal layer and described base metal layer form described conductive layer 5.
Wherein, acting as of first time plating process plates the thin metal of one deck in the second inner wall section of described through hole 3, is beneficial to subsequent process and plates metal (namely playing the effect of bottoming) smoothly.The effect of second time plating process thickeies initial metal layer, makes the shown conductive layer 5 finally obtained have semi-glossy, ductility, pull resistance.The thickness of described initial metal layer and described base metal layer can be selected according to the actual requirements, and preferably, the thickness of described initial metal layer is 1-10 μm, and the thickness of described base metal layer is 30-50 μm.
The technique of first time plating process and the process of second time plating can be plating or chemical plating etc., and institute's plating can be copper or gold etc.Wherein, plating utilizes coated metal or other insoluble materials to do anode, utilizes workpiece to be plated to do negative electrode, utilizes and cook electroplate liquid containing the cationic solution of coated metal, make the cation of coated metal be reduced formation coating at surface of the work to be plated.Chemical plating refers under the condition not having impressed current, the slaine that utilization is in same solution and reducing agent carry out the principle of autocatalyzed oxidation reduction reaction on the matrix surface with catalytic activity, form a kind of process for treating surface with the metal of certain thickness and function at matrix surface.
Specific embodiment and the technological parameter of first time plating process and the process of second time plating can with reference to prior aries.For electroless copper, generally adopt the copper sulphate of 2.5 ~ 5g/L as main salt, adopt formaldehyde or hypophosphites as reducing agent, first time, copper-plated heavy copper speed was 1.0-2.5 μm/h, and first time, copper-plated heavy copper speed was 6-9 μm/h.Specific embodiment does not repeat them here.
As preferred embodiment, S4 step, the concrete grammar namely removing described hydrophobic membrane residual layer 4 can adopt the methods such as thermal decomposition, and concrete technology parameter is relevant to the material that described hydrophobic membrane residual layer 4 adopts.Those skilled in the art according to instruction of the present invention, can select with reference to prior art method and the technological parameter of removing described hydrophobic membrane residual layer 4.
Certainly, when described hydrophobic membrane residual layer 4 can not impact the performance of formed wiring board, also can retain described hydrophobic membrane residual layer 4, also, omit above-mentioned S4 step.
Embodiment 2
As shown in Figure 6, the present embodiment provides a kind of wiring board, comprises circuit base plate, is arranged in the through hole 3 of described circuit base plate and is positioned at the conductive layer 5 on the inwall of described through hole 3 side.
It should be noted that, this kind of wiring board can adopt any one execution mode recorded in embodiment 1 to be prepared from, and other preparation methods also can be adopted to be prepared from.When adopting any one execution mode recorded in embodiment 1 to be prepared from, it possesses the various advantages recorded in embodiment 1.
Embodiment 3
As shown in Figure 2, the present embodiment provides a kind of drill point, comprises drill point body, and described drill point body has tip, also comprise be coated on described drill point body away from the hydrophobic membrane 2 on the outer wall at tip.
As preferred embodiment, the material of described hydrophobic membrane 2 is grease, polytetrafluoroethylene, polypropylene or Kynoar.
As preferred embodiment, the thickness of described hydrophobic membrane 2 is 10-50 μm, such as: 10 μm, 20 μm, 50 μm etc., the thickness of described hydrophobic membrane 2 can be selected according to the actual requirements in above-mentioned scope.
As preferred embodiment, described drill point 1 diameter is 0.1-0.8mm, and such as: 0.1mm, 0.5mm, 0.8mm etc., described drill point 1 diameter can be selected according to the size of follow-up formation through hole.
Above-mentioned drill point 1 may be used for, in the manufacture method of the wiring board recorded in embodiment 1, also may be used in the manufacture method of other similar plate body.
Obviously, above-described embodiment is only for clearly example being described, and the restriction not to execution mode.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all execution modes.And thus the apparent change of extending out or variation be still among the protection range of the invention.
Claims (12)
1. a manufacture method for wiring board, is characterized in that, comprises the following steps:
The drill point (1) that utilization is coated with hydrophobic membrane (2) gets out through hole (3) in circuit base plate (6), and the inwall of described through hole (3) comprises interconnective first inner wall section and the second inner wall section;
Described hydrophobic membrane (2) is in described first inner wall section residual formation hydrophobic membrane residual layer (4);
Carry out plating process, to form conductive layer (5) in the second inner wall section of described through hole (3).
2. manufacture method according to claim 1, is characterized in that, the material of described hydrophobic membrane (2) is grease, polytetrafluoroethylene, polypropylene or Kynoar.
3. manufacture method according to claim 1, is characterized in that, the thickness of described hydrophobic membrane (2) is 10-50 μm.
4. manufacture method according to claim 1, it is characterized in that, described hydrophobic membrane (2) is coated on the outer wall of most advanced and sophisticated top of described drill point (1), described hydrophobic membrane (2) is greater than the height of described second inner wall section near the height between the end face and described drill point (1) tip at described drill point (1) tip, and the height of described hydrophobic membrane (2) is greater than the height of described first inner wall section.
5. manufacture method according to any one of claim 1 to 4, is characterized in that, described in carry out plating process, comprise with the concrete steps forming conductive layer (5) in the second inner wall section of described through hole (3):
Carry out first time plating process, to form initial metal layer in the second inner wall section of described through hole (3);
Carry out the process of second time plating, to form base metal layer in described initial metal layer, described initial metal layer and described base metal layer form described conductive layer (5).
6. manufacture method according to claim 5, is characterized in that, the thickness of described initial metal layer is 1-10 μm, and the thickness of described base metal layer is 30-50 μm.
7. manufacture method according to any one of claim 1 to 6, it is characterized in that, also comprise: carry out plating process described, to form the step of conductive layer (5) in the second inner wall section of described through hole (3) after, remove described hydrophobic membrane residual layer (4).
8. a wiring board, is characterized in that, adopts the manufacture method according to any one of claim 1-7 to obtain.
9. a wiring board, is characterized in that, comprises circuit base plate (6), described circuit base plate (6) is provided with through hole (3), the side inwall of described through hole (3) is provided with conductive layer (5).
10. a drill point, comprises drill point body, and described drill point body has tip, it is characterized in that, also comprise be coated on described drill point body away from the hydrophobic membrane (2) on the outer wall at tip.
11. drill points according to claim 10, is characterized in that, the material of described hydrophobic membrane (2) is grease, polytetrafluoroethylene, polypropylene or Kynoar.
12. drill points according to claim 10 or 11, it is characterized in that, the thickness of described hydrophobic membrane (2) is 10-50 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510854171.5A CN105451448B (en) | 2015-11-30 | 2015-11-30 | Production method, wiring board and the drill point of wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510854171.5A CN105451448B (en) | 2015-11-30 | 2015-11-30 | Production method, wiring board and the drill point of wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105451448A true CN105451448A (en) | 2016-03-30 |
| CN105451448B CN105451448B (en) | 2018-06-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510854171.5A Active CN105451448B (en) | 2015-11-30 | 2015-11-30 | Production method, wiring board and the drill point of wiring board |
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| Country | Link |
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| CN (1) | CN105451448B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101133478A (en) * | 2005-03-04 | 2008-02-27 | 三米拉-惜爱公司 | Simultaneous and selective partitioning of via structures using plating resist |
| US7337537B1 (en) * | 2003-09-22 | 2008-03-04 | Alcatel Lucent | Method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board |
| US20140190733A1 (en) * | 2011-12-31 | 2014-07-10 | Peking University Founder Group Co., Ltd. | Printed circuit board and fabricating method thereof |
-
2015
- 2015-11-30 CN CN201510854171.5A patent/CN105451448B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7337537B1 (en) * | 2003-09-22 | 2008-03-04 | Alcatel Lucent | Method for forming a back-drilled plated through hole in a printed circuit board and the resulting printed circuit board |
| CN101133478A (en) * | 2005-03-04 | 2008-02-27 | 三米拉-惜爱公司 | Simultaneous and selective partitioning of via structures using plating resist |
| US20140190733A1 (en) * | 2011-12-31 | 2014-07-10 | Peking University Founder Group Co., Ltd. | Printed circuit board and fabricating method thereof |
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| Publication number | Publication date |
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| CN105451448B (en) | 2018-06-26 |
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Effective date of registration: 20220622 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 9 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: CHONGQING FOUNDER HI-TECH ELECTRONIC Inc. |
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